Electron beam evaporation coating apparatus and evaporation coating method

Abstract

The application belongs to the technical field of evaporation equipment, and particularly relates to an electron beam evaporation mechanism, an electron beam evaporation coating equipment and method with the evaporation mechanism, wherein the electron beam evaporation mechanism comprises a symmetrical assembly base arranged at the bottom, a fixing structure of the whole electron beam evaporation mechanism is arranged on the assembly base, and two cooling water pipe interfaces are arranged at the rear of the mechanism; a crucible is arranged at the central part of the mechanism, evaporation coating materials are arranged in the crucible, and an electron gun motor is connected with an electron gun target gun head to evaporate the evaporation coating materials. The application improves the evaporation process efficiency and prolongs the service life of the equipment.

Description

Technical Field

[0001] This invention belongs to the technical field of electron beam evaporation deposition equipment. Specifically, it relates to an electron beam evaporation deposition equipment and a evaporation deposition method. Background Technology

[0002] Electron beam evaporation is a type of physical vapor deposition. Unlike traditional evaporation methods, electron beam evaporation utilizes an electromagnetic field to precisely bombard the coating material in a crucible with high-energy electrons, causing it to melt and vaporize, and then deposit it onto a substrate.

[0003] Electron beam heating evaporation can achieve extremely high energy densities, up to 10⁹ W / cm². 2 The heating temperature can reach 3000~

[0004] At 6000℃, refractory metals or compounds can be evaporated. Placing the material to be evaporated in a water-cooled crucible avoids crucible material contamination, allowing for the preparation of high-purity thin films. Furthermore, due to the small heating area of ​​the evaporated material, heat radiation loss is reduced, resulting in high thermal efficiency. Compared to electron beam evaporation, electron beam heating evaporation can provide higher heat to the material to be evaporated, thus achieving a faster evaporation rate. Precise electron beam positioning avoids crucible material evaporation and contamination. Existing electron beam heating evaporation equipment mainly includes a chamber, vacuum system, electron gun (and focusing or deflection) system, crucible, cooling water system, and the substrate material to be evaporated. However, there is still room for optimization in the film deposition process using current electron beam evaporation coating equipment. Summary of the Invention

[0005] To address the problems existing in the current technology, the present invention provides an electron beam evaporation coating equipment and an evaporation coating method.

[0006] The complete technical solution of this invention includes:

[0007] An electron beam evaporation mechanism includes an assembly base located at the bottom and symmetrically arranged, a fixing structure for the entire electron beam evaporation mechanism is installed on the assembly base, and two cooling water pipe interfaces are provided at the rear of the mechanism; a crucible is provided in the central part of the mechanism, and an evaporation coating material is placed in the crucible; an electron gun motor is connected to the electron gun target head to evaporate the evaporation coating material.

[0008] Furthermore, the fixing structure is used to provide fixed support for the entire mechanism.

[0009] Furthermore, the cooling water pipe interface is used for the inlet and outlet of cooling water.

[0010] The electron beam evaporation coating equipment with the electron beam evaporation mechanism comprises an electron beam coating process chamber with a slope, a workpiece disc system is arranged at the upper middle part of the chamber, the workpiece disc system enables the workpiece disc to rotate uniformly according to the setting, an electron beam evaporation mechanism is arranged below the workpiece disc system, an ion source system is embedded on the chamber wall, the ion source system is a system for providing workpiece pre-cleaning and etching process, and a vacuum pumping system is arranged at the back side of the chamber.

[0011] Further, the electron beam coating process chamber is a boat-shaped structure.

[0012] The method for carrying out electron beam evaporation coating by using the equipment specifically comprises the following steps:

[0013] (1) loading the workpiece disc carrying the workpiece on the workpiece table, loading the evaporation material titanium into the crucible of the electron gun evaporation source, closing the door of the boat-shaped coating process chamber, pumping the vacuum degree of the boat-shaped coating process chamber to 8.0E-7 torr, starting the ion source, and performing the process for 10 minutes to pre-clean the surface of the workpiece;

[0014] (2) after the ion source cleaning process is completed, setting the coating parameters of the electron gun evaporation source:

[0015] Table 2 electron beam evaporation coating process parameters

[0016]

[0017] (3) starting the workpiece disc rotation at 7 revolutions per minute, pumping the vacuum degree of the boat-shaped coating process chamber to 8.0E-7 torr, starting the electron gun after the vacuum is stable for 3 minutes, pre-melting the material titanium by the electron gun, opening the electron gun shutter when the solid is completely melted into liquid, starting the coating according to the evaporation rate, and monitoring the process by the crystal control probe, and stopping the process when the coating thickness reaches , closing the electron gun shutter, stopping the workpiece disc rotation, and stopping the electron gun.

[0018] The present application has the following advantages over the prior art:

[0019] 1. The electron beam evaporation mechanism is optimally designed, the crucible volume for evaporation material is large, more evaporation materials can be contained, and the continuous evaporation process is suitable.

[0020] 2. The assembly base + fixed structure is adopted, the structural stability is improved, the evaporation process efficiency is improved, and the electron beam evaporation mechanism is optimized. DETAILED DESCRIPTION

[0021] Figure 1 It is a structural schematic view of the electron beam evaporation mechanism. ​

[0022] Figure 2 This is a schematic diagram of the overall structure of the electron beam evaporation coating equipment of the present invention.

[0023] In the figure, 1-assembly base, 2-fixed structure, 3-cooling water plate, 4-cooling water pipe interface, 5-crucible, 6-electron gun motor, 7-electron gun target head, 8-electron beam coating process chamber, 9-process chamber door, 10-workpiece disk system, 11-ion source, 12-sloping surface. Detailed Implementation

[0024] The present invention will now be described in detail with reference to embodiments and accompanying drawings. However, it should be understood that the embodiments and drawings are for illustrative purposes only and do not constitute any limitation on the scope of protection of the present invention. All reasonable modifications and combinations included within the inventive spirit of the present invention fall within the scope of protection of the present invention.

[0025] This invention discloses an electron beam evaporation coating equipment and an evaporation coating method. The equipment includes an electron beam evaporation mechanism, a vacuum system, a cooling system, a power supply system, an electron beam coating process chamber, a semi-embedded ion source system, a workpiece disk rotation system, and a process gas system.

[0026] The electron beam evaporation mechanism is a system that provides vapor-state ions of the coating material. For example... Figure 1 As shown, the mechanism includes an assembly base 1 located at the bottom and symmetrically arranged. A fixing structure 2 for the entire electron beam evaporation mechanism is mounted on the assembly base to provide fixed support. Two cooling water pipe interfaces 4 are located at the rear of the mechanism for the inlet and outlet of cooling water, respectively. A crucible 5 is located in the central part of the mechanism, containing evaporation coating material. An electron gun motor 6 is connected to an electron gun target head 7 to evaporate the coating material.

[0027] The structure of the electron beam evaporation coating equipment with the above-mentioned electron beam evaporation mechanism is as follows: Figure 2 As shown, the chamber includes an electron beam coating process chamber 8 with an inclined surface 12. This chamber 8 has a boat-shaped structure, and the ion source is mounted on the inclined surface. The electron beam coating process chamber has a front-opening door structure, with a coating process chamber door 9 at the front. A workpiece disk system 10 is located in the upper center of the chamber. This system allows the workpiece disk to rotate uniformly according to a set procedure, ensuring good uniformity in ion source cleaning of the workpiece and in the ion source etching process or electron beam evaporation coating. An electron beam evaporation mechanism is located below the workpiece disk system 10. An ion source system 11 is embedded in the inclined wall of the chamber, providing pre-cleaning and etching services for the workpiece. A vacuum system is installed on the back side of the chamber.

[0028] In this invention, the design principle of the inclined plane 12 is based on the radius of 2 / 3 of the radius from the center of the ion source to the center of the workpiece disk, and the design of the installation position of the ion source.

[0029] On the other hand, since this invention changes the traditional rectangular chamber into a boat-shaped coating process chamber with a sloping surface, the support stability of the chamber is different from that of the traditional chamber. Therefore, in terms of the design of the size and angle of the sloping surface, it is necessary to comprehensively consider the size and weight of the overall chamber and ion source, the angle and distance between the ion source and the workpiece disk, and the weight of each component to ensure the support stability of the chamber during the coating process and extend the service life of the equipment.

[0030] Among the parameters mentioned above, since the ray emitted from the center reaches a point at 2 / 3 of the radius from the center of the workpiece disk 10, the angle between the inclined plane and the ground, as well as the distance between the ion source and the workpiece disk, are fixed values. Specifically: the angle between the inclined plane and the bottom surface is 120°; the measured distance between the center point of the ion source surface and the point at 2 / 3 of the radius from the center of the workpiece disk is 225mm; and the angle between the straight line from the center point of the ion source surface to the point at 2 / 3 of the radius from the center of the workpiece disk and the horizontal direction of the workpiece disk is 30°. Furthermore, the ion source is installed on the inclined plane at a distance of 160mm from the starting point of the bottom edge of the inclined plane to the center of the inclined plane.

[0031] Under the above constraints, for different parameters of the chamber, the height ratios of the top, bottom, and side surfaces of the chamber, the weight of the ion source, and the overall weight of the chamber were designed during the actual coating process. The support stability of the chamber during each coating process was recorded, and the recorded big data was analyzed to select reasonable process parameters. After analysis, the following determination method was selected:

[0032]

[0033] In the formula, L1 is the side length of the top surface of the chamber, L2 is the side length of the bottom surface of the chamber, H is the height of the chamber, W1 is the weight of the ion source, W2 is the weight of the chamber, and k is a coefficient with a value ranging from 9 to 11, preferably 9.72.

[0034] Based on the above principles and the actual space conditions of the workshop, the design is carried out with the following dimensions: upper L1 is 690mm, lower L2 is 535mm, chamber height H is 450mm, ion source weight W1 is 40KG, and chamber weight W2 is 540KG.

[0035] The workpiece disk rotation system makes the workpiece disk rotate uniformly according to the setting, so that the ion source cleaning workpiece, ion source etching process or electron beam evaporation coating uniformity is good. The power supply system provides the power supply system used by the equipment. The semi-embedded ion source system provides the workpiece pre-cleaning and etching process system. The process gas system provides the process gas system.

[0036] When the electron beam evaporation mechanism is used for coating in the ship type electron beam coating process chamber, the ion source pre-cleaning process removes impurities and surface oxides on the workpiece surface, the workpiece surface is pure, promotes the better bonding force of the electron beam evaporation material with the surface, and relative to the ion source arranged in the chamber, reduces the outgassing source of the electron beam coating process chamber, can obtain a more pure compound film layer, and the quality and stability of the workpiece film layer prepared by different equipment are less different, that is, the consistency is good.

[0037] The ship type coating process chamber is used, the ion source is semi-embeddedly installed on the inclined surface of the ship type coating process chamber. The electron beam evaporation source is located at the bottom in the ship type coating process chamber, and the workpiece disk is located at the top in the ship type coating process chamber. The crystal oscillator probe is installed on the side wall of the chamber near the workpiece disk. The method for carrying out electron beam evaporation by using the equipment described in the application specifically includes the following steps:

[0038] (1) Load the workpiece disk carrying the workpiece on the workpiece table, load the evaporation material titanium into the crucible of the electron gun evaporation source, and close the door of the ship type coating process chamber. The vacuum degree of the ship type coating process chamber is extracted to 8.0E-7torr, the ion source is started, and the process is performed for 10 minutes to pre-clean the surface of the workpiece.

[0039] (2) After the ion source cleaning process is completed, the coating parameters of the electron gun evaporation source are set according to Table 2:

[0040] Table 2 Electron beam evaporation coating process parameters

[0041]

[0042]

[0043] (3) Start the workpiece disk rotation at 7 revolutions per minute, extract the vacuum degree of the ship type coating process chamber to 8.0E-7torr, and after the vacuum is stable for 3 minutes, start the electron gun. The electron gun pre-melts the material titanium, and when the solid is completely melted into liquid, the electron gun shutter is opened, and the coating is started according to the evaporation rate. When the coating thickness reaches

[0044] ​Preferably, the electron beam evaporation coating equipment of the present application can be a single piece evaporation coating equipment, which comprises the boat-shaped electron beam coating process chamber, the workpiece disc rotating system, the electron beam evaporation mechanism, the vacuum pumping system, the power supply system, the semi-embedded ion source system, the process gas system, etc. The single piece evaporation coating equipment is a compact electron beam evaporation mechanism, which has a small footprint, is easy to operate and maintain, and is suitable for trial production of small batches of workpieces.

[0045] The structure of the boat-shaped electron beam coating process chamber is used for the type of the electron beam evaporation mechanism, which includes a single piece boat-shaped electron beam evaporation mechanism, a single piece / multi-piece boat-shaped electron beam evaporation mechanism with a sample introduction chamber, and a multi-cavity boat-shaped electron beam evaporation mechanism.

[0046] Preferably, the electron beam evaporation coating equipment of the present application can also be a single piece or multi-piece evaporation equipment with a sample introduction chamber, which comprises the boat-shaped electron beam coating process chamber, the workpiece disc rotating system, the electron beam evaporation mechanism, the vacuum pumping system, the power supply system, the semi-embedded ion source system, the process gas system, etc. In addition, the single piece or multi-piece evaporation equipment with a sample introduction chamber also comprises a sample introduction chamber transfer system, which includes a transfer robot for loading workpieces (from the sample introduction chamber to the electron beam coating process chamber) and unloading workpieces (from the electron beam coating process chamber to the sample introduction chamber), and a high vacuum isolation valve between the sample introduction chamber and the electron beam coating process chamber. The sample introduction chamber transfer system is divided into a single piece sample introduction chamber transfer system and a multi-piece sample introduction chamber transfer system. In the single piece sample introduction chamber, workpieces can be directly placed on the transfer robot. In the multi-piece sample introduction chamber, a multi-piece workpiece device is provided, and workpieces are placed on the multi-piece workpiece device. The robot takes and delivers workpieces on the multi-piece device from the sample introduction chamber to the electron beam coating process chamber or from the electron beam coating process chamber to the sample introduction chamber.

[0047] The vacuum pumping system is structured as follows: the sample introduction chamber and the boat-shaped electron beam coating process chamber have independent vacuums, the sample introduction chamber is provided with a low vacuum pumping system, and the boat-shaped electron beam coating process chamber is provided with a low vacuum and high vacuum pumping system. The pumping systems of the sample introduction chamber and the boat-shaped electron beam coating process chamber are collectively referred to as the vacuum pumping system.

[0048] The single piece or multi-piece evaporation equipment with a sample introduction chamber described above, which is designed with a sample introduction chamber transfer system, can load and unload workpieces in the sample introduction chamber, so that the boat-shaped electron beam coating process chamber can be kept at a relative vacuum. The time for the sample introduction chamber to be pumped to a low vacuum is relatively short, generally about 30 minutes from atmospheric pressure to low vacuum and process high vacuum. After the completion of a batch of coating processes, the vacuum degree in the electron beam coating process chamber is P D, the vacuum degree in the sample chamber is the second vacuum degree P2. At this time, the high vacuum isolation valve between the process chamber and the sample chamber is opened, and the workpiece is transferred. The workpiece after coating is transferred from the electron beam coating process chamber to the sample chamber multi-piece device, and the next workpiece to be coated is transferred to the main chamber. After the transfer is completed, the high vacuum isolation valve is closed. During this process, gas exchange occurs between the process chamber and the sample chamber, and the vacuum degree in the electron beam coating process chamber decreases to a low vacuum degree P3 between P D and P2. Before performing the coating process of the next workpiece, the high vacuum P D required by the process is restored from the current low vacuum P3 to a time of 3-5 minutes or less. In a specific magnetron sputtering process, the optional parameters are P D 5E-6 Torr, P2 is 4E-2 Torr, and P3 is 5E-4 Torr.

[0049] Through the above overall design method and coating method, time can be saved, and production efficiency is high. And the compound film layer coated by different equipment has good quality purity and consistency, and small deviation.

[0050] Preferably, the electron beam evaporation coating equipment of the present application can also be a multi-chamber process chamber evaporation coating equipment, including a multi-piece sample chamber system, the sample chamber system is a front opening door structure, designed with a multi-piece workpiece clamp, capable of loading multiple workpieces at a time, and equipped with a vacuum pumping system. A transfer chamber system is provided, which is an upper opening cover structure, designed with a robot, which is responsible for transferring workpieces between the sample chamber and the ship-shaped electron beam coating process chamber, and is equipped with a vacuum pumping system. The ship-shaped electron beam coating process chamber is equipped with an electron beam evaporation mechanism, a workpiece disc system, an ion source system, a vacuum pumping system, a heating system, a process gas system, and a power supply system. The equipment can complete batch coating under relative vacuum, has high production efficiency, and has relatively better coating quality stability. The sample chamber and each ship-shaped electron beam coating process chamber and the transfer chamber are isolated by high vacuum isolation valves, and can realize independent vacuum. It can simultaneously satisfy different electron beam evaporation coating processes, and the processes performed in different ship-shaped electron beam coating process chambers do not interfere with each other, and can also be combined for use in the same process.

[0051] In addition, since the present application has multiple coating process chambers, multiple different coating processes can be performed. Since the multiple coating process chambers share one sample chamber and transfer chamber, and the time required from low vacuum to high vacuum and the coating process is different, in order to efficiently complete the multi-process vacuum coating process and reduce the idle time and waiting time of each link, the coating process of the multi-chamber is controlled. Specifically, it includes:

[0052] Firstly, the film coating time of different film coating processes is pre-calibrated. In the actual film coating process, the film coating material can be an oxide material or a metal material, or a combination of the two. Since different types of film coating materials have different evaporation and deposition rates, in order to obtain more uniform and accurate film coating time estimation, the present application calibrates different film coating materials before the reaction. The specific method is to select sample workpieces, record the evaporation source to workpiece distance, evaporation power, gas flow, workpiece quantity, workpiece disc rotation speed and other data. After film coating is completed, the film coating thickness of the sample and the film coating uniformity of the sample surface are measured, and the workpieces that do not meet the requirements of uniformity are removed. The remaining workpieces are analyzed to determine whether there is a linear relationship between each parameter and the film coating thickness. For parameters that have a non-linear relationship, fixed parameter values are used during film coating. For parameters that have a linear relationship, the linear relationship between the film coating thickness and the parameters is recorded and stored in the control system as a preset setting, which can be selected during the actual film coating process. After final determination, the evaporation power, film coating time and film coating thickness are selected to have a corresponding linear relationship.

[0053] Subsequently, the sample feeding and sample chamber vacuum pumping time is set as t1, the transfer chamber transfer and vacuum pumping time is set as t2, and the required film coating time is calculated according to the film coating thickness requirement of each film coating process chamber and the previous method. At the same time, the film coating time of each chamber is added to the corresponding sample feeding and vacuum pumping, sample feeding time (from the sample feeding chamber to the film coating process chamber) transfer and vacuum pumping, sample feeding time (from the film coating process chamber to the sample feeding chamber) transfer and vacuum pumping, sample feeding and vacuum pumping time as a whole process cycle. The process cycle times of each film coating process chamber are compared, and a reasonable process sequence is selected.

[0054] The above application is only some embodiments of the present application. Those skilled in the art can make several variations and improvements without departing from the inventive concept of the present application, which are within the scope of protection of the present application.

Claims

1. An electron beam evaporation coating apparatus with an electron beam evaporation mechanism, characterized in that The electron beam evaporation mechanism includes a bottom and symmetrically arranged assembly base, a fixing structure of the whole electron beam evaporation mechanism is installed on the assembly base, two cooling water pipe interfaces are arranged at the rear of the mechanism; a crucible is arranged at the central part of the mechanism, the evaporation and plating film material is placed in the crucible, an electron gun motor is connected with an electron gun target gun head, and the evaporation and plating film material is evaporated; The electron beam evaporation and plating film equipment includes an electron beam plating film process chamber with a slope, an ion source system is embeddedly installed on the chamber wall of the electron beam plating film process chamber, and the ion source system is a system for providing a workpiece pre-cleaning and etching process; The installation position of the ion source is designed according to that the ion source center emits a ray to the 2 / 3 of the radius of the workpiece disc center; The angle between the slope and the bottom surface is 120°, the distance between the center point of the ion source surface and the 2 / 3 of the radius of the workpiece disc center is 225mm, the angle between the straight line between the two points and the horizontal direction of the workpiece disc is 30°, and the installation position of the ion source on the slope is that the distance from the starting point of the bottom slope to the center of the slope is 160mm.

2. The electron beam evaporation apparatus with an electron beam evaporation mechanism according to claim 1, characterized in that The fixing structure is used for fixing and supporting the whole mechanism.

3. The electron beam evaporation apparatus with an electron beam evaporation mechanism according to claim 1, characterized in that The cooling water pipe interface is used for the access and outflow of cooling water.

4. Method for electron beam evaporation coating using the apparatus according to any one of claims 1 to 3, characterized in that Specifically includes the following steps: (1) loading the workpiece disc carrying the workpiece on the workpiece table, loading the evaporation material titanium into the crucible of the electron gun evaporation source, closing the door of the boat-shaped process chamber, pumping the vacuum degree of the boat-shaped process chamber to 8.0E-7torr, starting the ion source, performing the process for 10 minutes, and pre-cleaning the workpiece surface; (2) after the ion source cleaning process is completed, the plating film parameters of the electron gun evaporation source are set: (3) starting the workpiece disc rotation at 7 revolutions per minute, pumping the vacuum degree of the boat-shaped process chamber to 8.0E-7torr, starting the electron gun after the vacuum is stable for 3 minutes, pre-melting the material titanium, opening the electron gun baffle when the solid is completely melted into liquid, starting the plating film according to the evaporation rate of 2 Å / S, monitoring the process by the crystal control probe, and stopping the process when the plating film thickness reaches 3KÅ, closing the electron gun baffle, closing the workpiece disc rotation, and closing the electron gun.

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