A device and method for tacking FOG

Abstract

The application relates to a FOG bonding machine and a bonding method, which comprises a movable workbench and a plurality of bonding units. The movable workbench is used for carrying and moving a workpiece. The plurality of bonding units are arranged on a bonding support capable of guiding the bonding units in the X direction. Each bonding unit comprises a pressing head and a buffer placing rack capable of providing buffers below the corresponding pressing head. The X-direction gap between the plurality of bonding units is adjustable and fixed, and the mutual gap between the buffers is also adjustable and fixed. When the bonding units are used for bonding, the plurality of pressing heads are used for bonding a plurality of FOG areas to be bonded on the workpiece, and the ACF gap between the FOG areas to be bonded is not bonded. The probability that the pressing surface of the pressing head is not parallel to the workbench surface when the pressing head is heated due to the excessively large pressing surface of the pressing head is reduced, the pressing surface of the pressing head is ensured to be parallel to the workbench surface, the bonding stability of the products to be bonded is improved, the product qualification rate is improved, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of FOG bonding, in particular to a pressing device and a pressing method of a FOG bonding machine. BACKGROUND

[0002] FOG (FPC on Glass) production technology is a processing mode for realizing mechanical connection and electrical conduction of liquid crystal glass and flexible circuit board through ACF (Anisotropic Conductive Film) adhesion and hot pressing under certain temperature, pressure and time. At present, the production technology is widely applied to the production of touch screens and liquid crystal display screens. Main processes of the FOG manufacturing process include ACF attachment, pre-pressing and pressing, etc. The pressing process refers to main bonding of the pre-bonded LCM product under high temperature and pressure, so as to realize electrical connection of the FPC and the LCD glass through deformation of the ACF conductive particles and rupture of the insulating layer; meanwhile, the ACF glue can be polymerized and hardened at high temperature to connect the two different materials together to provide sufficient mechanical connection strength. The pressing device of the existing FOG bonding machine has the problems that the pressing head pressing surface is too large, the pressing head is prone to being not parallel to the workbench surface, the combination stability of the pressed products is poor, and the product qualification rate is low; or the pressing head presses the multiple to-be-pressed areas of the workpiece one by one, and the production efficiency is low.

[0003] The utility model patent No. CN201620415760.3 discloses a kind of anti-fracture FOG hot press pressing device, including machine body, the upper side of the machine body is equipped with first support column and second support column, the side of second support column close to first support column is equipped with movable block, the side of movable block away from second support column is equipped with transmission wheel, first support column is equipped with driving device, the driving end of driving device is driven connection with transmission wheel, one end of movable block is equipped with movable rod, the lower side of movable rod is equipped with pressing head, the lower side of pressing head is equipped with processing platform, processing platform is installed on machine body, processing platform is equipped with infrared sensor and heating device, pressing head is equipped with pressure sensor, machine body is equipped with controller. The device is simple to operate, avoids LCD edge being pressed to pressing head, prevents FPC from being broken, improves the reliability and yield of product, realizes the way of intelligent processing LCD and other materials.In related prior art, when LCD raw material is on processing platform, driving device starts to start, so that pressing head extrudes LCD, at this time, heating device works, the pressing surface of the pressing head is large, and the pressing head is prone to being not parallel to the workbench surface, resulting in poor combination stability between the pressed products and low product qualification rate.

[0004] Chinese patent application CN105620001A discloses an integrated FOG pre-pressing machine including a base with a bottom plate on it. The bottom plate is divided into a front end and a rear end. A pre-pressing mechanism and an FPC feeding mechanism are mounted on the front end and rear end. The pre-pressing mechanism includes a pre-pressing head mechanism and a main pressing head mechanism arranged along a first straight line. There are at least two main pressing head mechanisms, with the pre-pressing head mechanism located between the main pressing head mechanisms. The pre-pressing mechanism also includes a lead screw guide rail pair arranged along a second straight line parallel to the first straight line direction. The lead screw guide rail pair is positioned in front of the pre-pressing head mechanism and the main pressing head mechanism, and a number of main pressing platforms corresponding to the main pressing head mechanism are mounted on the lead screw guide rail pair. This invention greatly improves production efficiency and reduces floor space. In related prior art, the pressing head presses multiple areas of the workpiece one by one, resulting in low production efficiency.

[0005] In response to the aforementioned technical issues, the pressing process of the FOG bonding machine is prone to problems such as non-parallelism with the worktable, resulting in poor bonding stability between the pressed products and low product qualification rate; or the pressing head presses multiple areas of the workpiece one by one, resulting in low production efficiency. This application provides a pressing device and pressing method for the FOG bonding machine. Summary of the Invention

[0006] In order to overcome the technical problems in the FOG bonding machine's self-pressing process, such as the easy occurrence of non-parallelism between the press head and the worktable, resulting in poor bonding stability and low product qualification rate between the pressed products; or the low production efficiency caused by pressing multiple areas of the workpiece one by one by the press head, this application provides a self-pressing device and self-pressing method for an FOG bonding machine.

[0007] In the first aspect, this application provides a pressure device for a FOG bonding machine, which adopts the following technical solution:

[0008] A pressure device for a FOG bonding machine, comprising:

[0009] A movable worktable is used to carry and move workpieces, and the worktable is mounted on the mounting base through a workpiece drive mechanism;

[0010] Multiple pressure units are slidably mounted on a pressure support. The pressure support can guide the multiple pressure units in an X-direction manner. Each pressure unit includes a pressure head assembly and a buffer placement rack. The pressure head assembly includes a pressure head, and the buffer placement rack can provide a buffer below the pressure head.

[0011] The worktable can move the workpiece to the workpiece pressing position of the pressing bracket, so that the multiple FOG pressing areas of the workpiece are aligned with the corresponding pressing heads and buffers of the multiple pressing units.

[0012] The X-direction gap between the multiple pressing units is adjustable and fixed, so that the gap between the pressing heads and the gap between the buffer are adjustable and fixed, and the pressing heads can press the FOG pressing area on the workpiece without pressing the ACF gap between the FOG pressing areas.

[0013] By adopting the above technical solution, the multiple pressing units form a pressing mechanism. During pressing, the pressing heads on the pressing units only press the FOG pressing area on the workpiece, without pressing the ACF gap between the FOG pressing areas. This reduces the probability that the pressing surface of the pressing head is not parallel to the workbench surface when the pressing head is heated, ensures that the pressing surface of the pressing head is parallel to the workbench surface, and further increases the bonding stability between the products being pressed and improves the product yield.

[0014] Optionally, the workpiece driving mechanism includes a first X-direction guide rail arranged on the mounting seat, a Y-direction guide rail arranged on the first X-direction guide rail, a first rotating shaft arranged on the Y-direction guide rail, and a first driving motor arranged on the Y-direction guide rail. The workbench is arranged on the first rotating shaft.

[0015] By adopting the above technical solution, the workpiece driving mechanism can drive the workpiece on the workbench to move in the X-direction and the Y-direction. When the workpiece moves under the pressing head, the rotating shaft of the workpiece driving mechanism can rotate and adjust the relative position of the workpiece and the pressing head, so that the FOG pressing area on the workpiece can be aligned with the pressing head.

[0016] Optionally, the pressing head assembly further includes a heater arranged on the pressing head, a heat insulation plate arranged on the heater, and a heat sink arranged on the heat insulation plate.

[0017] By adopting the above technical solution, the heat insulation plate and the heat sink reduce the heat transfer from the heater to the pressing head driving mechanism.

[0018] Optionally, the heater has an opening, and the pressing head is embedded in the opening to increase the contact area of the pressing head and the heater.

[0019] By adopting the above technical solution, the contact area of the pressing head and the heater is increased, and the heating speed of the pressing head is further improved.

[0020] Optionally, the pressing unit further includes a pressing head driving mechanism arranged on the pressing head assembly. The pressing head driving mechanism includes a gas cylinder, an extension rod arranged on the gas cylinder, a third X-direction guide rail connecting plate arranged on the extension rod, a second driving motor arranged on the third X-direction guide rail connecting plate, a limiting rod arranged on the second driving motor, and a Z-direction guide rail arranged on one side of the gas cylinder.

[0021] By adopting the technical scheme, the power required when the pressure head assembly is pressed down is provided, and the pressure head body can move in the X direction on the pressure head support, i.e., the gap between the pressure heads fixed on the pressure head body can be adjusted.

[0022] Optionally, the pressure head support is provided with a second X-direction guide rail, a third X-direction guide rail and a limiting groove, the second X-direction guide rail is connected with the Z-direction guide rail, the third X-direction guide rail is connected with the third X-direction guide rail connecting plate, and the limiting groove is sleeved with the telescopic rod and the limiting rod.

[0023] By adopting the technical scheme, the telescopic rod and the limiting rod can limit the movement of the pressure head body in the Y direction.

[0024] Optionally, the buffer piece placing rack comprises two side plates, a plurality of connecting rods connected with the side plates, a mounting strip connected with one side of the side plates and a plurality of connecting blocks connected with the mounting strip, one side of the connecting block is connected with the pressure head support, the other side of the connecting block is sleeved with a second rotating shaft, and the second rotating shaft and one connecting rod form a clamping combination capable of being axially rotated, for clamping a straightened section of the buffer piece.

[0025] By adopting the technical scheme, the buffer piece is placed at one end of the buffer piece placing rack, the buffer piece is straightened, and the clamping combination clamps a part of the straightened section of the buffer piece, so that the straightened section of the buffer piece under the pressure head always maintains a stretched state.

[0026] Optionally, the workbench is provided with a first zone adsorption gas path, a second zone adsorption gas path, a third zone adsorption gas path, a first zone adsorption gas hole opened on the first zone adsorption gas path, a second zone adsorption gas hole opened on the second zone adsorption gas path and a third zone adsorption gas hole opened on the third zone adsorption gas path, so as to adsorb workpieces of different sizes.

[0027] By adopting the technical scheme, the adsorption gas paths and the adsorption gas holes in different zones cooperate with each other, and can adsorb products of different sizes.

[0028] Optionally, the pressure head supports are multiple, the pressure head support is provided with a visual detection positioner below the buffer piece placing rack, for detecting the position of the workpiece on the workbench, so that the workbench corrects the workpiece, the pressure head support is combined with a scale, and the pressure head body is provided with a measuring claw corresponding to the scale.

[0029] By adopting the technical scheme, one local pressing support is one station, and multiple local pressing supports constitute a multiple-station local pressing device, thereby improving production efficiency. The visual detection positioner can detect the specific position of the workpiece on the workbench, so that the workpiece driving mechanism adjusts the relative position of the workpiece and the pressing head. The scale and the measuring claw can display the spacing between the local pressing units.

[0030] In a second aspect, the application provides a FOG local pressing method, which adopts the following technical scheme:

[0031] A FOG local pressing method, which adopts the local pressing device of the FOG bonding machine according to any one of the preceding aspects, and the method comprises the following steps:

[0032] S1, providing a workpiece on a movable workbench, the workpiece having multiple FOG areas to be pressed adjacent to each other, and ACF gaps being formed between the FOG areas to be pressed;

[0033] S2, adjusting and fixing the X-direction spacing of multiple local pressing units that are slidably arranged on the local pressing supports, so that the pressing heads of the individual local pressing units form pressing head gaps corresponding to the ACF gaps; the local pressing units are further provided with buffer members with adjustable mutual spacing below the corresponding pressing heads;

[0034] S3, moving the workbench to a workpiece local pressing position of the local pressing supports, wherein the multiple FOG areas to be pressed of one workpiece of the workbench are aligned below the corresponding pressing heads and buffer members of the multiple local pressing units;

[0035] S4, performing local pressing and pressing by the pressing heads, the pressing heads press the corresponding FOG areas to be pressed of the workpiece through the corresponding buffer members, without pressing the ACF gaps.

[0036] By adopting the technical scheme, when performing local pressing and pressing, the pressing heads of the local pressing units only press the FOG areas to be pressed on the workpiece, the area of the pressing surface of the pressing head is reduced, the probability that the pressing surface of the pressing head is not parallel to the surface of the workbench when the pressing head is heated is reduced, the bonding stability between the products being pressed is increased, and the product qualification rate is improved.

[0037] In summary, the technical scheme of the embodiments of the application has at least one of the following beneficial technical effects:

[0038] 1. When performing local pressing and pressing, the pressing heads on the local pressing units only press the FOG areas to be pressed on the workpiece, without pressing the ACF gaps between the FOG areas to be pressed, the probability that the pressing surface of the pressing head is not parallel to the surface of the workbench when the pressing head is heated is reduced due to the large size of the pressing surface of the pressing head, the parallelism between the pressing surface of the pressing head and the surface of the workbench is ensured, the bonding stability between the products being pressed is increased, and the product qualification rate is improved.

[0039] 2. Each single body can independently carry out the pressing work, or multiple single bodies can work simultaneously, which can meet the pressing needs of products with different FOG pressing areas and improve the production efficiency.

[0040] 3. Multiple single bodies constitute a multi-station pressing device, which improves the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 FIG. 1 is a perspective view of a pressing device of a FOG bonder according to the present application;

[0042] Figure 2 FIG. 2 is a perspective view of a single body of the pressing device mounted on a pressing support according to the present application;

[0043] Figure 3 FIG. 3 is a perspective view of a pressing head assembly and a pressing head driving mechanism according to the present application;

[0044] Figure 4 FIG. 4 is a perspective view of a buffer placing rack according to the present application;

[0045] Figure 5 FIG. 5 is a perspective view of a workbench according to the present application.

[0046] FIG. 1 is a perspective view of a pressing device of a FOG bonder according to the present application; DETAILED DESCRIPTION

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of this application and with an understanding of the inventive concept of this application are all within the scope of protection of this application.

[0048] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0049] To better understand the technical solution of this application, the following will describe in more detail the FOG bonding machine's pressure device and FOG pressure method, but this is not intended to limit the scope of protection of this application.

[0050] Reference Figure 1 This application discloses a pressing device for a FOG bonding machine, including a movable worktable 10 and multiple pressing units 20. The movable worktable 10 is used to carry and move workpieces, and the worktable 10 is mounted on a mounting base 40 via a workpiece driving mechanism 30. The multiple pressing units 20 are slidably mounted on a pressing support 50, and the pressing units 20 are arranged linearly. Preferably, the number of pressing units is four. The pressing support 50 is mounted on the mounting base 40, and the pressing support 50 can guide the multiple pressing units 20 in an X-ray direction. Each pressing unit 20 includes a pressing head assembly 21 and a buffer placement rack 22. The pressing head assembly 21 includes a pressing head 211, and the buffer placement rack 22 can provide a buffer 100 below the pressing head 211. The buffer placement racks 22 of the multiple pressure units 20 can be the same buffer placement rack 22, and multiple buffers 100 can be placed on each buffer placement rack 22, with the number of buffers 100 being the same as the number of pressure units 20.

[0051] Wherein, the workbench 10 can move the workpiece to the workpiece local pressing position of the local pressing support 50, so that the FOG to be pressed area of the workpiece is aligned below the corresponding pressing head 211 and buffer piece 100 of the local pressing unit 20. The buffer piece 100 has a certain elastic property. When local pressing, the pressing head 211 does not directly contact the workpiece, but presses the workpiece through the buffer piece 100, avoiding damage to the workpiece during pressing. At the same time, the X-direction gap between the local pressing units 20 is adjustable and fixed, so that the gap between the pressing heads 211 and the gap between the buffer piece 100 are adjustable and fixed. The pressing head 211 can not press the workpiece in the ACF gap between the FOG to be pressed area, which can reduce the area of the pressing head pressing surface, reduce the probability of the pressing head pressing surface not parallel to the workbench 10 surface when the pressing head 211 is heated, ensure the parallelism of the pressing head pressing surface and the workbench 10 surface, and further increase the bonding stability between the products to be pressed, thereby improving the product yield.

[0052] The workpiece driving mechanism 30 includes a first X-direction guide rail 31 arranged on the mounting seat 40, a Y-direction guide rail 32 arranged on the first X-direction guide rail 31, a first rotating shaft 33 arranged on the Y-direction guide rail 32, and a first driving motor 34 arranged on the Y-direction guide rail 32. The workbench 10 is arranged on the first rotating shaft 33.

[0053] Referring to Figure 2 , the local pressing support 50 is provided with a second X-direction guide rail 51, a third X-direction guide rail 52, and a limiting groove 53. The limiting groove 53 is an X-direction through long groove, and the number of the limiting groove 53 is two and in the same vertical direction. The second X-direction guide rail 51 is connected with the Z-direction guide rail 236, the third X-direction guide rail 52 is connected with the third X-direction guide rail connecting plate 233, and the limiting groove 53 is sleeved with the telescopic rod 232 and the limiting rod 235. The third X-direction guide rail 52 is two guide rails arranged on both sides of the limiting groove 53 sleeving the telescopic rod 232. The local pressing support 50 is a plurality of, and each local pressing support 50 is provided with two visual detection positioners on both sides below the buffer piece placing rack 22, which are used to detect the position of the workpiece on the workbench 10, so that the workbench 10 can correct the workpiece. Preferably, the visual detection positioner is a CCD camera. The local pressing support 50 is combined with a scale 54, and the local pressing unit 20 is provided with a measuring claw 24 corresponding to the scale 54 to display the distance between the local pressing units 20.

[0054] Referring to Figure 3The pressure head assembly 21 further comprises a heater 212 arranged on the pressure head 211, an insulating plate 213 arranged on the heater 212, and a heat sink 214 arranged on the insulating plate 213. The insulating plate 213 is provided in two pieces to increase the heat insulation effect. The heater 212 has an opening, and the pressure head 211 is embedded in the opening to increase the contact area between the pressure head 211 and the heater 212, thereby increasing the heating speed of the pressure head 211.

[0055] The pressure head driving mechanism 23 is arranged on the pressure head assembly 21 and comprises a pneumatic cylinder 231, a telescopic rod 232 arranged on the pneumatic cylinder 231, a third X-direction guide rail connecting plate 233 arranged on the telescopic rod 232, a second driving motor 234 arranged on the third X-direction guide rail connecting plate 233, a limiting rod 235 arranged on the second driving motor 234, and a Z-direction guide rail 236 arranged on one side of the pneumatic cylinder 231. One end of the pneumatic cylinder 231 is connected to the telescopic rod 232, and the other end is connected to the pressure head assembly 21.

[0056] Referring to Figure 4 The buffer placing rack 22 comprises two side plates 221, a plurality of connecting rods 222 connecting the side plates 221, a mounting strip 223 connected to one side of the side plates 221, and a plurality of connecting blocks 224 connected to the mounting strip 223. The side plates 221 are in a "Z" shape, and the buffer is placed on the side with a higher horizontal direction of the side plates 221. The connecting rods 222 are rotatably connected to the side plates 221. The mounting strip 223 is connected to the upper surfaces of the connecting blocks 224. One side of the connecting blocks 224 is connected to the main pressure support 50, and the other side of the connecting blocks 224 is sleeved with a second rotating shaft 225. The second rotating shaft 225 and one connecting rod 222 form a clamping combination that can be axially turned, which is used to clamp the straight section of the buffer 100.

[0057] Referring to Figure 5 The workbench 10 has a first zone adsorption gas path 11, a second zone adsorption gas path 12, a third zone adsorption gas path 13, a first zone adsorption gas hole 14 opened on the first zone adsorption gas path 11, a second zone adsorption gas hole 15 opened on the second zone adsorption gas path 12, and a third zone adsorption gas hole 16 opened on the third zone adsorption gas path 13, to adsorb workpieces of different sizes. The adsorption gas paths of each zone are not connected, the adsorption gas holes of each zone are connected to independent gas pipes, and the adsorption gas paths and adsorption gas holes of different zones cooperate with each other to adsorb products of different sizes.

[0058] The implementation principle of the pressing device of the FOG bonding machine is as follows: the buffer piece 100 is placed on the buffer piece placing rack 22, and the buffer piece 100 is straightened, so that the clamping combination on the buffer piece placing rack 22 clamps a part of the straightened section of the buffer piece 100. The initial position of the workbench 10 is located in the workpiece taking and placing area away from the pressing support 50, after the workpiece is placed on the workbench 10, the workpiece driving mechanism 30 drives the workbench 10 to move, and the workbench 10 moves the workpiece to the workpiece pressing area below the pressing unit 20. Two visual detection positioners capture the position of the workpiece, the workpiece driving mechanism 30 drives the workbench 10 to correct the position of the workpiece, at the same time, the X-direction gap of the plurality of pressing units 20 which can slide on the pressing support 50 is adjusted and fixed, so that the gap between the pressing heads 211 of the pressing units 20 corresponds to the ACF gap, and it is ensured that the plurality of FOG pressing areas of the workpiece to be pressed are aligned below the corresponding pressing heads 211 of the plurality of pressing units 20 and the buffer piece 100. The heater 212 heats the pressing head 211, and the pressing head driving mechanism 23 drives the pressing head 211 to press the FOG pressing area of the workpiece downward. After the pressing is completed, the pressing head driving mechanism 23 drives the pressing head 211 to move upward, and the workpiece driving mechanism 30 drives the workbench 10 to move again, and the workbench 10 moves out of the workpiece.

[0059] Reference Figure 1 The application also provides a FOG pressing method based on the pressing device of the FOG bonding machine according to any one of the above technical solutions, which comprises the following steps: S1, providing a workpiece on a movable workbench 10, the workpiece having a plurality of FOG pressing areas to be pressed adjacent to each other, and an ACF gap being formed between the FOG pressing areas to be pressed; S2, adjusting and fixing the X-direction gap of a plurality of pressing units 20 which can slide on a pressing support 50, so that the gap between the pressing heads 211 of the individual pressing units 20 corresponds to the ACF gap; the pressing unit 20 also provides a buffer piece 100 with an adjustable mutual gap below the corresponding pressing head 211; S3, moving the workbench 10 to the workpiece pressing position of the pressing support 50, wherein the plurality of FOG pressing areas to be pressed of the workpiece moved by the workbench 10 are aligned below the corresponding pressing heads 211 of the plurality of pressing units 20 and the buffer piece 100; S4, pressing and pressing the workpiece by the pressing heads 211, and the pressing heads 211 press the corresponding FOG pressing areas to be pressed of the workpiece through the corresponding buffer piece 100, without pressing and pressing the ACF gap.

[0060] The implementation principle of the FOG self-pressing method of the embodiment is as follows: the workbench 10 moves a workpiece to a workpiece self-pressing area under the self-pressing units 20, the X-direction gaps of the self-pressing units 20 are adjusted and fixed, so that the gaps between the pressing heads 211 of the self-pressing units 20 correspond to the ACF gaps, and it is ensured that the plurality of FOG areas to be pressed of the workpiece are aligned below the corresponding pressing heads 211 of the self-pressing units 20 and the buffer piece 100, the pressing heads 211 press and bond the FOG areas to be pressed, and the ACF gaps are not pressed and bonded.

[0061] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application, so: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A pressure device for a FOG bonding machine, characterized in that, include: A movable worktable (10) is used to carry and move workpieces. The worktable (10) is mounted on the mounting base (40) through a workpiece drive mechanism (30). Multiple pressure units (20) are slidably disposed on a pressure support (50). The pressure support (50) can guide the multiple pressure units (20) in an X direction. Each pressure unit (20) includes a pressure head assembly (21) and a buffer placement rack (22). The pressure head assembly includes a pressure head (211), and the buffer placement rack (22) can provide a buffer below the pressure head (211). The worktable (10) can move the workpiece to the workpiece pressing position of the pressing bracket (50), so that the multiple FOG pressing areas of the workpiece are aligned below the corresponding pressing heads (211) and buffers of the multiple pressing units (20); Among them, the X-direction gap between the multiple pressure units (20) is adjustable and fixed, so that the gap between the pressure heads (211) and the gap between the buffer components is adjustable and fixed, and the pressure head (211) can press the workpiece in the ACF gap between the FOG pressing area without pressing. The buffer placement rack (22) includes two side plates (221), several connecting rods (222) connecting the side plates (221), a mounting strip (223) connecting one side of the side plates (221), and several connecting blocks (224) connecting the mounting strip (223). One side of the connecting block (224) is connected to the pressure bracket (50), and the other side of the connecting block (224) is fitted with a second rotating shaft (225). The second rotating shaft (225) and a connecting rod (222) form an axially rotatable clamping combination for clamping the straightened section of the buffer.

2. The pressure device of the FOG bonding machine according to claim 1, characterized in that, The workpiece driving mechanism (30) includes a first X-axis guide rail (31) disposed on the mounting base (40), a Y-axis guide rail (32) disposed on the first X-axis guide rail (31), a first rotating shaft (33) disposed on the Y-axis guide rail (32), and a first drive motor (34) disposed on the Y-axis guide rail (32). The worktable (10) is disposed on the first rotating shaft (33).

3. The pressure device of the FOG bonding machine according to claim 1, characterized in that, The pressure head assembly (21) further includes a heater (212) disposed on the pressure head (211), a heat insulation plate (213) disposed on the heater (212), and a heat sink (214) disposed on the heat insulation plate (213).

4. The pressure device of the FOG bonding machine according to claim 3, characterized in that, The heater (212) has an opening, and the pressure head (211) is embedded in the opening to increase the contact area between the pressure head (211) and the heater (212).

5. The pressure device of the FOG bonding machine according to claim 1, characterized in that, The pressure unit (20) further includes a pressure head drive mechanism (23), which is disposed on the pressure head assembly (21). The pressure head drive mechanism (23) includes a cylinder (231), a telescopic rod (232) disposed on the cylinder (231), a third X-axis guide rail connecting plate (233) disposed on the telescopic rod (232), a second drive motor (234) disposed on the third X-axis guide rail connecting plate (233), a limiting rod (235) disposed on the second drive motor (234), and a Z-axis guide rail (236) disposed on one side of the cylinder (231).

6. The pressure device of the FOG bonding machine according to claim 5, characterized in that, The pressure bracket (50) is provided with a second X-axis guide rail (51), a third X-axis guide rail (52) and a limiting groove (53). The second X-axis guide rail (51) is connected to the Z-axis guide rail (236), the third X-axis guide rail (52) is connected to the third X-axis guide rail connecting plate (233), and the limiting groove (53) is fitted with the telescopic rod (232) and the limiting rod (235).

7. The pressure device of the FOG bonding machine according to claim 1, characterized in that, The workbench (10) has a first adsorption gas path (11), a second adsorption gas path (12), a third adsorption gas path (13), a first adsorption gas hole (14) on the first adsorption gas path (11), a second adsorption gas hole (15) on the second adsorption gas path (12), and a third adsorption gas hole (16) on the third adsorption gas path (13) for adsorbing workpieces of different sizes.

8. The pressure device of the FOG bonding machine according to claim 1, characterized in that, There are multiple pressure support brackets (50). A visual inspection locator (60) is provided on the pressure support bracket (50) and located under the buffer placement rack (22). It is used to detect the position of the workpiece on the worktable (10) so that the worktable (10) can correct the workpiece. A scale (54) is attached to the pressure support bracket (50). The pressure unit (20) is provided with a measuring jaw (24) corresponding to the scale (54).

9. A method for compressing FOG (fog-like organic matter), characterized in that, The FOG bonding machine using the bonding apparatus as described in any one of claims 1 to 8, the FOG bonding method comprising: S1. Provide a workpiece on a movable worktable (10), the workpiece having a plurality of adjacent FOG pressing areas, and an ACF gap being formed between the FOG pressing areas; S2. Adjust and fix the X-direction gap of multiple pressure units that can slide on the pressure support (50) so that a pressure head gap is formed between the pressure heads (211) of individual pressure units, corresponding to the ACF gap; the pressure unit also provides a buffer with adjustable mutual gap below the corresponding pressure head (211); S3. Move the worktable (10) to the workpiece pressing position of the pressing bracket (50), wherein the multiple FOG pressing areas of a workpiece moved by the worktable (10) are aligned below the corresponding pressing head (211) and buffer of the multiple pressing units. S4. The pressure head (211) is used to perform the pressing, and the pressure head (211) presses the corresponding FOG area to be pressed of the workpiece through the corresponding buffer, without pressing the ACF gap.

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