Antenna module and communication device

Abstract

This application provides an antenna module and a communication device. The antenna module includes a radiating element, a grounding element, and a feeding element. The feeding element is a transmission line structure formed on an insulating support. The feeding element includes a feeding transmission section and a grounding section, which are of unequal width to achieve current balance in the antenna module.

Description

Technical Field

[0001] This invention relates to the field of network communication technology, and in particular to an antenna module and a communication device. Background Technology

[0002] MIMO systems, or Multiple-Input Multiple-Output systems, can multiply communication capacity by using multiple transmit and receive antennas and undergoing specific data processing, thus meeting the ever-increasing demands of modern communication services. In communication equipment, multiple antenna elements are connected to the radio frequency (RF) chip on the motherboard via feed cables. These feed cables power the antenna elements, and their assembly and precise positioning not only clutter the internal space of the communication equipment but also require high precision, making it difficult to control the cost of the communication equipment.

[0003] Therefore, while ensuring antenna radiation performance, how to achieve a cable-free design to make the internal structure of communication equipment neat and reduce the assembly cost of antenna modules is a direction that the industry is constantly exploring. Summary of the Invention

[0004] This application provides an antenna module and a communication device that can achieve a cable-free design while ensuring antenna radiation performance, resulting in a neat internal structure and low cost advantage.

[0005] In a first aspect, this application provides an antenna module including a radiating element, a grounding element, and a feeding element. The radiating element and the grounding element are stacked. The feeding element is a transmission line structure formed on an insulating support. Along a first direction, the feeding element is located on the side of the radiating element away from the grounding element. The feeding element includes a feeding transmission section and a grounding section, which are insulated from each other. The width of the feeding transmission section includes a first width, and the width of the grounding section includes a second width. The first width is not equal to the second width. The width of the feeding transmission section refers to the dimension in the direction perpendicular to the extension path of the feeding transmission section, and the width of the grounding section refers to the dimension in the direction perpendicular to the extension path of the grounding section.

[0006] This application feeds the radiating element using a transmission line architecture mounted on an insulating support. By varying the widths of the grounding section and the feed transmission section, current balance in the antenna module can be achieved. The unequal width design of the feed transmission section and the grounding section of the feed unit has a decoupling effect, eliminating or reducing the coupling effect of the feed unit on the radiating element and improving the radiation performance of the antenna module. Specifically, the radiating element and the grounding element in the antenna module provided in this application constitute an asymmetrical architecture. An asymmetrical architecture refers to a structure where the radiating element and the grounding element have different structures. In the resonant state, the radiating element and the grounding element generate current imbalance; specifically, the current in the radiating element and the current in the grounding element have unequal amplitudes and different directions. This application solves the impedance mismatch problem caused by the current imbalance between the radiating element and the grounding element through the unequal width design of the feed transmission section and the grounding section, thus achieving overall current balance in the antenna module.

[0007] In one possible implementation, the electrical length of the feed transmission section is between 0.3λ and 0.7λ along its extension path, where λ is the wavelength of the electromagnetic wave in the resonant state of the radiating element. Specifically, the electrical length of the feed transmission section can be 0.5λ. By limiting the specific range (0.3λ-0.7λ) and specific value (0.5λ) of the electrical length of the feed transmission section, this solution ensures that the feed transmission section has a balun function, guaranteeing the repeatability and continuity of the antenna module impedance matching. The repeatability and continuity of impedance matching can be understood as the impedance matching at both ends of the feed transmission section being the same, thus eliminating the need to set up other matching circuits on the feed transmission section to adjust the matching impedance.

[0008] In one possible implementation, the extension paths of the feed transmission section and the grounding section form a double parallel line architecture. This can be understood as follows: the gap between the first feed terminal of the feed transmission section and the first ground terminal of the grounding section is the same as the gap between the second feed terminal of the feed transmission section and the first ground terminal of the grounding section. Furthermore, the gap between the first feed terminal and the grounding section remains unchanged along their extension paths. By designing the feed unit as a double parallel line architecture, the feed unit can generate equal-amplitude, opposite-current signals when the antenna module is operating. This ensures that the feed unit does not affect the resonance of the radiating element, guaranteeing that the antenna module is a vertically polarized antenna and thus achieving a better radiation pattern.

[0009] In one possible implementation, the total electrical length of the feed transmission section in the second direction is between 0.15λ and 0.35λ, where λ is the wavelength of the electromagnetic wave in the resonant state of the radiating unit, and the second direction is perpendicular to the first direction. In a specific embodiment, the total electrical length of the feed transmission section in the second direction is 0.25λ. By limiting the electrical length of the feed transmission section in the second direction, the induced current can be suppressed, decoupling between the feed unit and the radiating unit can be achieved, the coupling between the feed unit and the radiating unit can be reduced, and the radiation efficiency of the radiating unit can be improved.

[0010] In one possible implementation, the transmission lines of the power supply transmission section extending in the second direction are collinear. This solution provides a simple wiring scheme for the power supply transmission section, making it easier to control the electrical length of the power supply transmission section and resulting in a more significant effect on suppressing induced current.

[0011] In one possible implementation, the transmission line extending in the second direction of the feed transmission section includes at least two transmission line segments, which are connected by a transmission line extending in the first direction. The at least two transmission line segments can be parallel to each other. This solution provides a specific wiring scheme for the feed transmission section. This application allows for the setting of different forms of feed transmission sections according to the specific assembly environment and electromagnetic field environment of the antenna module. Different design schemes can be achieved by adjusting the specific transmission configuration on the insulation setting, which is simple and easy to implement.

[0012] In one possible implementation, the power supply transmission section and the grounding section are coplanar. That is, the power supply transmission section and the grounding section are located on the same plane, meaning the plane of the insulating support bearing the power supply transmission section and the grounding section is the same. For example, when the insulating support is a circuit board structure, the power supply transmission section and the grounding section are located on the same layer of the circuit board. This application does not consider the thickness of the power supply transmission section and the grounding section; their thicknesses can be different, but as long as the power supply transmission section and the grounding section are located on the same plane, they can be understood as coplanar. Coplanar design has lower manufacturing costs and makes it easier to control the positional relationship between the power supply transmission section and the grounding section.

[0013] In one possible implementation, the plane containing the power supply transmission section and the plane containing the grounding section are not coplanar. In a third direction, the power supply transmission section and the grounding section are positioned opposite each other (potentially facing each other). This third direction is perpendicular to both the second and first directions. This solution is also referred to as a non-planar transmission line architecture where the power supply transmission section and the grounding section constitute a non-planar transmission line architecture. For example, the power supply transmission section and the grounding section can be located on different layers of the circuit board. Compared to coplanar designs, the non-planar transmission architecture provided by this solution has the advantages of saving space and reducing board area. It can utilize the thickness of the circuit board substrate as insulation between the power supply transmission section and the grounding section, resulting in lower manufacturing costs.

[0014] In one possible implementation, in the resonant state, the current on the power supply transmission section and the current on the grounding section are of equal amplitude but opposite direction.

[0015] In one possible implementation, the power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal; and / or

[0016] The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal.

[0017] In one possible implementation, the power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. From the first power supply terminal to the second power supply terminal, a portion of the power supply transmission section extends with a constant width, while a portion extends with unequal widths; and / or

[0018] The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

[0019] In one possible implementation, the power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal.

[0020] The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

[0021] In one possible implementation, the grounding portion includes a first ground terminal and a second ground terminal, the first ground terminal being electrically connected to the grounding unit, and the second ground terminal being used to electrically connect to ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal.

[0022] The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to the radio frequency chip on the motherboard in the communication device. From the first power supply terminal to the first power supply terminal, part of the power supply transmission section extends with equal width, and part of the power supply transmission section extends with unequal width.

[0023] This application provides several combination schemes for the power supply transmission section and the grounding section. Designs with equal width for both the power supply transmission section and the grounding section can be combined with designs with unequal widths. In one specific embodiment, the unequal width design of the power supply transmission section can be a gradually changing width design, which is beneficial for impedance adjustment.

[0024] In one possible implementation, the antenna module includes a first board and a second board. The first board includes a first layer and a second layer stacked together. The radiating element is located on the first layer, and the grounding element is located on the second layer. The second board is the insulating support. The second board includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second board is located on one side of the first board. The first edge is connected to the first board. The feeding element is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

[0025] This solution utilizes a first and second board to house the antenna module, resulting in a simple manufacturing process, low production cost, and lightweight design, which is beneficial for the slim and compact design of communication equipment. The first and second boards can be printed circuit board (PCB) architectures, with the antenna module's feed and radiating elements arranged as transmission lines on the PCB. The antenna module does not include any feed cables, and the communication equipment itself also lacks feed cables, simplifying the internal structure. Furthermore, the position and shape of the transmission lines are fixed and designed before assembling the antenna module, eliminating any adverse effects on the antenna during assembly. The connection between the first and second boards enables low-loss board-level interconnection, resulting in low assembly cost and minimal loss for the antenna module itself.

[0026] In one possible implementation, the grounding part is electrically connected to the grounding unit through the connection between the first edge and the first plate. A connection structure is provided at the connection between the first plate and the second plate, which is used to realize the electrical connection between the power transmission part and the radiation unit. This application can simultaneously realize the electrical connection between the power supply unit and the radiation unit, as well as the electrical connection between the power supply unit and the grounding unit, through the assembly and connection process between the first plate and the second plate. This electrical connection method not only has the advantages of reliability but also low loss.

[0027] In one possible implementation, the first plate has a hole penetrating the first layer and the second layer, and the second plate includes a plug-in structure protruding from the first edge, with at least a portion of the plug-in structure located within the hole. The connection structure includes the hole and the plug-in structure, and further includes a conductive connection portion electrically connected between the radiating unit and the feeding transmission unit. This solution provides a specific design scheme for the connection structure, which, through the cooperation of the plug-in structure and the hole, facilitates assembly and easy implementation of electrical connection.

[0028] In one possible implementation, the hole is a through hole, comprising a first open end and a second open end. The insertion structure is inserted into the hole from the first open end, and the conductive connection portion is welded to the radiating element from one side of the second open end. By electrically connecting the feed transmission portion and the radiating element using welding on one side of the second open end, sufficient operating space is provided, resulting in lower assembly costs for the antenna module and ensuring a high welding yield.

[0029] In one possible implementation, the first layer is the top surface of the first plate, the second layer is the bottom surface of the first plate, the first opening is located on the bottom surface, and the second opening is located on the top surface. This solution, by placing the radiating element on the top surface of the first plate and the grounding element on the bottom surface of the first plate, makes the antenna module smaller and the communication device thinner.

[0030] In one possible implementation, the second edge of the second board is connected to the motherboard of the communication device, the grounding portion of the power supply unit is electrically connected to the ground plane on the motherboard, and the power supply transmission unit and the RF chip on the motherboard are electrically connected via a transmission line disposed on the motherboard. This solution defines the connection relationship between the second edge of the second board and the motherboard, eliminating the need for any external cables. Only circuit board traces (transmission line structure) within the motherboard are required to achieve grounding of the grounding portion and electrical connection between the power supply transmission unit and the RF chip.

[0031] In one possible implementation, a first main antenna is provided on the second board, and the radiating unit, the grounding unit and the feeding unit constitute a second main antenna. The resonant frequency of the first main antenna is a first frequency, and the resonant frequency of the second main antenna is a second frequency, which is higher than the first frequency.

[0032] In one possible implementation, the first frequency is 2.4 GHz and the second frequency is 5 GHz.

[0033] In one possible implementation, the antenna module includes multiple antenna elements, each antenna element including a first main antenna and a second main antenna. Each antenna element also includes a first decoupling structure and a second decoupling structure. The first decoupling structure is located on the second board. The antenna module also includes a third board, which is interleaved with the second board, with the second decoupling structure located on the third board. This application saves motherboard space and facilitates smaller antenna module design by bringing the two first main antennas closer together and mounting them on the same bracket. The first and second decoupling structures ensure radiation efficiency between the two first main antennas and improve isolation.

[0034] This application sets the distance between the two first main antennas between 0.2 wavelengths and 0.8 wavelengths, and combines a first decoupling structure and a second decoupling structure to improve the isolation between the two first main antennas. Since the distance between the two first main antennas is between 0.2 wavelengths and 0.8 wavelengths, if the first decoupling structure is not set in each antenna element, the two first main antennas will receive each other's signals in the resonant state, forming signal interference and resulting in poor isolation.

[0035] In one possible implementation, the ends of the second and third boards furthest from the first board are connected to the motherboard of the communication device. In a direction perpendicular to the ground plane of the motherboard, the maximum distance between the first decoupling structure and the ground plane is the cross-sectional height of the first decoupling structure, which ranges from 0.01 wavelength to 0.16 wavelengths. The distance between the first decoupling structure and the first main antenna is a first distance, and the distance between the first decoupling structure and the first main antenna of an adjacent antenna element is a second distance. Both the first and second distances are between 0.1 and 0.6 wavelengths. The second decoupling structure is used to reduce the coupling between the first main antenna and the first main antenna of an adjacent antenna element. The resonant frequency of the second decoupling structure is greater than or less than the first frequency.

[0036] This application achieves a smaller antenna size by setting a first decoupling structure, which is beneficial for the thinner design of communication equipment. It also solves the isolation problem between adjacent first main antennas. By controlling the cross-sectional height of the first decoupling structure, the distance between the first decoupling structure and the first main antenna, and the distance between the first decoupling structure and adjacent first main antennas, the isolation between adjacent first main antennas can be improved within a limited space while reducing the impact on the radiation efficiency of the first main antenna. This results in a simulation graph of the radiation efficiency of the first main antenna showing no obvious dips.

[0037] This application achieves decoupling between the first main antennas by adjusting the resonant frequency of the second decoupling structure so that its resonant frequency is not at the position of the first frequency, but slightly higher or lower. This improves isolation while reducing the impact on antenna radiation efficiency. Specifically, when the second decoupling structure resonates, it generates an efficiency dip in the electromagnetic waves at the resonant frequency of the second decoupling structure. For the first main antenna, the efficiency dip generated by the second decoupling structure can avoid the in-band frequency (i.e., the first frequency) of the first main antenna's resonance, thereby reducing the impact of the second decoupling structure on the radiation efficiency of the first main antenna.

[0038] In one possible implementation, the radiating element, the grounding element, and the feeding element constitute a horizontally arranged vertically polarized antenna.

[0039] Secondly, this application provides a communication device, including a radio frequency chip and an antenna module as described in any possible implementation of the first method, wherein the radio frequency chip is used to process electromagnetic wave signals transmitted and received by the antenna module. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of the present invention or the background art, the accompanying drawings used in the embodiments of the present invention or the background art will be described below.

[0041] Figure 1 This is an assembly diagram of a communication device provided in one embodiment of this application, taken from one direction.

[0042] Figure 2 This is an assembly diagram of a communication device provided in one embodiment of this application from another direction;

[0043] Figure 3 This is an exploded perspective view of a communication device provided in one embodiment of this application;

[0044] Figure 4 This is a cross-sectional view of a communication device provided in one embodiment of this application;

[0045] Figure 5 This is a schematic diagram of the inner side of the second housing of a communication device provided in one embodiment of this application;

[0046] Figure 6 This is a schematic diagram showing the distribution of at least some electronic components on the bottom surface of the motherboard of a communication device provided in one embodiment of this application;

[0047] Figure 7 This is a three-dimensional exploded view of an antenna module provided in one embodiment of this application;

[0048] Figure 8 This is a three-dimensional exploded view of an antenna module provided in one embodiment of this application from another direction;

[0049] Figure 9 This is a cross-sectional schematic diagram of an antenna module provided in one embodiment of this application;

[0050] Figure 9A , Figure 9B and Figure 9C The diagram shows the positional relationship between the radiating element and the grounding element of the antenna module in a specific embodiment of this application.

[0051] Figure 10 A schematic diagram of using a feed cable to power an antenna module in existing technology;

[0052] Figure 11 This is a schematic diagram of a feeding unit in an antenna module provided in one embodiment of this application;

[0053] Figure 12 This is a schematic diagram of a feeding unit in an antenna module provided in one embodiment of this application;

[0054] Figure 13 This is a schematic diagram of a feeding unit in an antenna module provided in one embodiment of this application;

[0055] Figure 14 This is a schematic diagram of a feeding unit in an antenna module provided in one embodiment of this application;

[0056] Figure 15 This is a schematic diagram of a feeding unit in an antenna module provided in one embodiment of this application;

[0057] Figure 16 This is a schematic diagram of a feeding unit in an antenna module provided in one embodiment of this application;

[0058] Figure 17 This is a schematic diagram of a feeding unit in an antenna module provided in one embodiment of this application;

[0059] Figure 18 This is a cross-sectional schematic diagram of the disassembled state of an antenna module provided in one embodiment of this application;

[0060] Figure 19 yes Figure 18 A cross-sectional view of the antenna module in its assembled state as shown in the embodiment.

[0061] Figure 20 This is a cross-sectional schematic diagram of the disassembled state of an antenna module provided in one embodiment of this application;

[0062] Figure 21 yes Figure 20 A cross-sectional view of the antenna module in its assembled state as shown in the embodiment.

[0063] Figure 22 This is a three-dimensional exploded view of an antenna module provided in one embodiment of this application;

[0064] Figure 23 yes Figure 22 The illustrated embodiment provides a schematic diagram of the antenna module's dimensions. Detailed Implementation

[0065] The technical terms used in this application are explained below.

[0066] A wireless AP, or Access Point, is essentially a wireless switch within a wireless network. It serves as the access point for mobile users to connect to a wired network and is widely used for network coverage in various settings, including education, healthcare, and enterprise applications. Wireless APs can be used for home broadband and enterprise intranet deployments, with wireless coverage distances ranging from tens to hundreds of meters. Typical wireless APs also include an access point client mode, allowing APs to wirelessly link with each other, thereby extending the wireless network's coverage area.

[0067] MIMO technology, or Multiple-Input Multiple-Output, refers to the use of multiple transmit and receive antennas at both the transmitting and receiving ends. This allows signals to be transmitted and received through multiple antennas, thereby improving communication quality. It makes full use of spatial resources, achieving multiple transmissions and receptions through multiple antennas. Without increasing spectrum resources or antenna transmission power, it can multiply the system's channel capacity, demonstrating significant advantages and being considered a core technology for next-generation mobile communications.

[0068] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0069] Figure 1 and Figure 2 This is an assembly diagram of a communication device provided in one embodiment of this application. Figure 3 This is an exploded perspective view of a communication device provided in one embodiment of this application. Figure 4This is a cross-sectional view of a communication device provided in one embodiment of this application. Figure 5 This is a schematic diagram of the inner side of the second housing 102 of a communication device provided in one embodiment of this application.

[0070] See Figure 1 , Figure 2 , Figure 3 and Figure 4 In one embodiment, the communication device 100 is a wireless access point (AP). The communication device 100 includes a first housing 101 and a second housing 102, which are interlocked to form an internal space G of the communication device 100. In one application environment of the communication device 100, the first housing 101 is a bottom shell, and the second housing 102 is a top shell. The first housing 101 is connected to a support, such as a desktop, wall, or other supporting surface. The second housing 102 is typically exposed to the air without any other shielding. In one embodiment, the first housing 101 is a housing with conductive material and shielding function (e.g., a metal housing).

[0071] See Figure 2 On the outer surface of the first housing 101, the first housing 101 includes a central region R1 and an edge region R2 surrounding the central region. The central region R1 is used to provide connector sockets 1011 (e.g., sockets corresponding to network ports and sockets corresponding to fiber optic interfaces) and to accommodate external cables. A foot 1012 is provided at the intersection of the central region R1 and the edge region R2. Specifically, the central region R1 is square, and there are four feet 1012 distributed at the four corners of the central region R1. The edge region R2 is equipped with a heat sink 1013, which is used to dissipate heat from the heat-generating components inside the communication device. The heat sink 1013 surrounds the connector socket 1011 and includes multiple fins, each extending from the boundary between the edge region R2 and the middle region R1 towards the outer edge of the edge region R2. The edge region R2 also has an opening 1014, which connects the internal space G of the communication device 100 to the outside. This opening 1014 is used to install an IoT (Internet of Things) card module. An IoT card can be understood as an Internet of Things card, which is a chip that provides internet access for the device.

[0072] See Figure 3In one specific embodiment, the inner surface of the first housing 101 forms multiple accommodating spaces G1. Adjacent accommodating spaces G1 are separated by a lower partition 1015. The multiple accommodating spaces G1 are independently arranged and are used to accommodate electronic components in the communication device 100. Because the accommodating spaces G1 are independent of each other, the first housing 101 constitutes a shielding structure for the electronic components. Therefore, the first housing 101 of the communication device 100 provided in this application integrates the functions of a housing and a shielding cover. By combining the first housing 101 with the motherboard 103 of the communication device 100, the first housing 101 constitutes multiple shielding covers disposed on the motherboard 103, which can shield different electronic components on the motherboard 103. Therefore, this application eliminates the need for a separate shielding structure between the housing and the motherboard of the communication device 100, which is beneficial for the thinner design of the communication device. The second housing 102 is made of a non-conductive material (e.g., plastic). The inner side of the second housing 102 is used to house the antenna module. Designing the second housing 102 as a non-conductive material does not affect the radiation efficiency of the antenna.

[0073] See Figure 3 and Figure 4 The communication device 100 includes a motherboard 103, which is fixed within the internal space G formed by the first housing 101 and the second housing 102. The motherboard 103 includes a bottom surface S1 and a top surface S2, with the bottom surface S1 facing the inner surface of the first housing 101 and the top surface S2 facing the inner surface of the second housing 102. Electronic components on the motherboard 103 include a CPU, CPU peripheral circuits, multiple RF chips, a baseband chip, an antenna module, and other functional modules (such as a power supply module, Bluetooth module, Ethernet port, fiber optic interface, etc.). The main heat-generating components and components requiring electromagnetic shielding on the motherboard 103 are located on the bottom surface S1, while the components requiring electromagnetic shielding are correspondingly housed within the shielding-like accommodating space G1 formed by the first housing 101. The main heat-generating components are cooled by the first housing 101. For example, the CPU, baseband chip, RF chip, power supply module, Bluetooth module, Ethernet port, fiber optic interface, IoT card module, and other electronic components are located on the bottom surface S1 of the motherboard 103. The antenna module 10 is located on the top surface S2 of the motherboard 103. Since the second housing 102 is made of a non-conductive material, the side of the antenna module 10 facing away from the motherboard 103 becomes a clear space, which helps to ensure antenna performance. The antenna module 10 is arranged in the edge area of ​​the motherboard 103, and the central area surrounded by the antenna module 10 is used to house the CPU peripheral circuits.

[0074] See Figure 5In one embodiment, the second housing 102 includes a plate 1021 and an upper partition 1022 protruding from the inner surface of the plate 1021. The upper partition 1022 can be integrally formed with the plate 1021. On the one hand, the upper partition 1022 is used to improve the strength of the plate 1021 and ensure the flatness of the plate 1021. On the other hand, the upper partition 1022 forms a plurality of partition spaces G2 on the inner surface of the plate 1021. In the assembled state, each antenna element of the antenna module 10 is set corresponding to a different partition space G2. In the direction perpendicular to the main board 103, the orthographic projection of each antenna element of the antenna module 10 on the second housing 102 is located in each partition space G2.

[0075] See Figure 6 In one embodiment, the bottom surface S1 of the motherboard 103 houses a CPU located in the central area. The top of the CPU houses 2G and 5G radio frequency (RF) chips and a baseband chip. The RF chip and baseband chip can be independent chips. Depending on the antenna arrangement requirements, the RF chip can accommodate multiple 2G RF antennas and multiple 5G RF chips. Similarly, the number of baseband antennas can also be set to multiple based on the antenna frequency and arrangement requirements. A Bluetooth chip is located on the left side of the CPU. An IoT card module is located on the right side of the CPU. Below the CPU are a 6G baseband chip, an RF chip, a network port, an optical fiber port, a DC power supply, and a power transformer module. The RF chip and baseband chip in the 6G baseband chip and RF chip (i.e., the 6G baseband chip and 6G RF chip) can be independent chips. Depending on the antenna arrangement requirements, the RF chip can accommodate multiple 6G RF antennas. Similarly, the number of baseband antennas can also be set to multiple based on the antenna and arrangement requirements. Other electronic components, such as CPLD logic chips, PHY chips, and other processors, can also be incorporated into the communication device provided in this application.

[0076] like Figure 3 As shown, this application directly mounts the antenna module 10 on the top surface S2 of the motherboard 103. The feed traces of each antenna in the antenna module 10 are directly arranged within the motherboard 103 (e.g., microstrip lines on the motherboard 103 form a feed system), eliminating the need for additional feed cables. If the antenna module 10 were fixed separately on an antenna board, for example, a metal plate stacked on top of the motherboard, with the RF chip feeding the antenna module via feed cables, this architecture would not only occupy space in the communication equipment but also require additional space for the feed cables. Furthermore, the assembly of the antenna board and the feed cables would prevent the internal structure of the communication equipment from becoming more streamlined. For the antenna module's signal, the signal quality fed by the feed cables is not as good as the signal quality of the direct feed method using traces within the motherboard 103 as the feed structure, as described in this application.

[0077] The antenna module 10 provided in this application is a MIMO antenna system. The antenna module 10 includes multiple sets of antennas (multiple antenna elements), each set operating at a different frequency. Generally, the antenna module may include two or more antennas operating at a first frequency and two or more antennas operating at a second frequency. For example, in one embodiment, the antenna module includes three sets of antennas: the first set is a first-frequency antenna (e.g., a 2.4G antenna, operating frequency band: 2.4–2.5 GHz), the second set is a second-frequency antenna (e.g., a 5G antenna, operating frequency band: 5.15–5.85 GHz), and the third set is a third-frequency antenna (e.g., a 6G antenna, operating frequency band: 5.925–7.125 GHz). Each set of antennas includes multiple independent antennas; an independent antenna refers to an antenna having an independent power supply and radiator, capable of performing antenna functions independently. In a specific embodiment, the antenna module includes four 2.4G antennas, four 5G antennas, and four 6G antennas. An antenna element can be configured with one antenna at one frequency (e.g., an antenna element may contain only one 6G antenna), or it may contain two antennas at different frequencies. For example, an antenna element may contain both a 2.4G antenna and a 5G antenna.

[0078] To ensure the efficiency of all antennas, each antenna needs to maintain isolation from other antennas during operation. Port isolation quantifies the influence between antennas; a higher port isolation indicates less mutual interference between two antennas. Generally, the greater the distance between antennas, the better the isolation. However, a large distance between antennas can hinder the miniaturization of communication equipment. Therefore, it is necessary to reduce the distance between antennas to save board space and achieve a smaller communication device. For low-frequency antennas, a large safe distance is required between adjacent low-frequency antennas. Typically, multiple low-frequency antennas are distributed in different corners of the circuit board to achieve isolation. However, this approach is not conducive to circuit board layout, and the RF chips connected to the antennas also need to be arranged separately to obtain better antenna performance. If the RF chips are centrally located and the antennas are arranged separately, some antennas will inevitably be connected to the RF chips via long cables, resulting in RF signal loss.

[0079] See Figure 3In this application, the antenna module 10 is arranged on the top surface S2 of the motherboard 103. The antenna module 10 includes multiple antenna elements. In one specific embodiment, the antenna module 10 includes eight antenna elements, four of which integrate antennas of a first frequency and a second frequency, such as four 2.4G antennas and four 5G antennas. That is, each antenna element includes one antenna of the first frequency and one antenna of the second frequency (which can be understood as: setting one 2.4G antenna and one 5G antenna on an antenna bracket, corresponding to the same position on the motherboard 103). Specifically, in this embodiment, the four 2.4G antennas are arranged adjacent to each other, and all the 2.4G antennas are arranged on the same side of the central area of ​​the motherboard 103. The positions of the four 2.4G antennas and the four 5G antennas on the motherboard 103 are the same. It can be understood that the first frequency is low frequency and the second frequency is high frequency. Under the condition of satisfying antenna performance and isolation, the high-frequency antenna occupies less board space than the low-frequency antenna. This application uses the second-frequency antenna as a reference for orientation and positioning. While ensuring a reasonable layout among multiple second-frequency antennas, the first-frequency antenna is placed in the corresponding second-frequency antenna positions. Decoupling technology is then used to adjust the isolation and performance of the first-frequency antenna. This design saves board space for the antenna module, facilitating the small size and thin design of communication equipment. Specifically, this application first determines the positions of four 5G antennas on the motherboard 103, then arranges four 2.4G antennas on the feed circuit board of the four 5G antennas. A decoupling structure is then implemented for the 2.4G antennas, ensuring both the isolation between adjacent 2.4G antennas and the radiation efficiency of each 2.4G antenna.

[0080] like Figure 3 and Figure 4 As shown, the communication device 100 has no internal power supply cables for powering the antenna module 10. The internal structure of the communication device 100 is simple, which not only improves the efficiency of the assembly process and reduces assembly costs, but also facilitates the maintenance of the communication device 100. One embodiment of this application provides a cable-free powered antenna module 10, which is connected to the top surface S2 of the motherboard 103.

[0081] Figure 7 This is a three-dimensional exploded view of an antenna module 10 provided in one embodiment of this application, showing its structure in one direction. Figure 8 for Figure 7 An exploded three-dimensional view of the antenna module 10 from another direction, as shown. Figure 9 for Figure 7 A cross-sectional schematic diagram of the antenna module 10 is shown. (See attached diagram.) Figure 7 , Figure 8 and Figure 9The antenna module 10 includes a radiating element 20, a grounding element 30, and a feeding element 40. The radiating element 20 and the grounding element 30 are stacked, with the grounding element 30 stacked between the main board 103 and the radiating element 20, and the grounding element 30 and the main board 103 facing each other with a gap. The stacking direction of the radiating element 20 and the grounding element 30 is a first direction A1. Along the first direction A1, the feeding element 40 is located on the side of the grounding element 30 away from the radiating element 20. The first direction A1 can also be perpendicular to the main board 103. The radiating element 20, the grounding element 30, and the feeding element 40 are all metal transmission line structures or metal patch structures. In a specific embodiment of this application, the radiating element 20, the grounding element 30, and the feeding element 40 are mounted on an insulating support, and the insulating support is assembled to the main board. The insulating support can be composed of a circuit board or other types of structures.

[0082] Next, we will describe the specific structure and positional relationship of the radiation unit 20, the grounding unit 30, and the power supply unit 40.

[0083] See Figure 7 , Figure 8 and Figure 9 The radiating element 20 is located at the top of the antenna module 10, which can be understood as the position of the antenna module 10 away from the main board 103. The radiating element 20 is adjacent to the second housing 102. The radiating element 20 includes an input interface 21, a power divider unit 22, and multiple radiating elements 23. The multiple radiating elements 23 are arranged around the input interface 21, for example, multiple radiating elements 23 are arranged in a ring area. The power divider unit 22 and the radiating elements 23 can be configured in a one-to-one correspondence and are respectively connected between each radiating element 23 and the input interface 21. The power divider unit 22 and the radiating elements 23 can also be configured in a one-to-many correspondence, for example, Figure 7 In the illustrated embodiment, one power divider unit 22 is connected to two radiating elements 23, and the radiating unit 20 includes four power divider units 22 and eight radiating elements 23. The input interface 21 is the power supply location for the radiating unit 20, and is used to electrically connect to the power supply unit 40. The radiating interface 21 is electrically connected to all the power divider units 22.

[0084] In one specific embodiment, the input interface 21 is located at the center of the radiating unit 20, the power divider unit 22 surrounds the input interface 21, and multiple radiating elements 23 surround the power divider unit 22. The radiating unit 20 can be a rotationally symmetric structure centered on the input interface 21. The shape of each radiating element 23 can be, but is not limited to, strip-shaped, arc-shaped, L-shaped, etc. In one embodiment, the operating frequency of the radiating unit 20 in the resonant state is 5 GHz, and the electrical length of each radiating element 23 is one-quarter of the wavelength of the electromagnetic wave at the operating frequency of the radiating unit 20. In one embodiment, the power divider unit 22 and the multiple radiating elements 23 are coplanar. For example, the power divider unit 22 and the multiple radiating elements 23 are metal microstrip line structures disposed on the same layer of the circuit board. In other embodiments, the plane on which the power divider unit 22 is located is different from the plane on which the multiple radiating elements 23 are located. For example, the power divider unit 22 and the multiple radiating elements 23 are disposed on different layers of the circuit board. The power divider unit 22 can be located on the middle layer of the circuit board, and the multiple radiating elements 23 can be disposed on the surface layer of the circuit board.

[0085] The grounding unit 30 has a metal layer structure. For example, in one embodiment, the grounding unit 30 is a copper foil disposed on a certain layer (which can be an intermediate layer or a surface layer) of the circuit board. In another embodiment, the grounding unit 30 can also be a metal sheet structure. The grounding unit 30 can be connected (adhesive or soldered) and fixed to the surface of the circuit board. In one embodiment, a notch 31 is formed in the central region of the grounding unit 30. The position of this notch 31 is used to set the connection structure between the radiating unit 20 and the feeding unit 40. The specific shape of the grounding unit 30 can be annular, with the outer edge of the grounding unit 30 being circular, square, or polygonal, and the inner edge of the grounding unit 30 also being circular, square, or polygonal.

[0086] Figure 9A , Figure 9B and Figure 9C The diagram illustrates the positional relationship between the radiating element 20 and the grounding element 30 in a specific embodiment of this application. In one embodiment, see [reference needed]. Figure 9A The inner edge of the grounding unit 30 is correspondingly disposed on the periphery of the input interface 21. Specifically, the vertical projection of the inner edge of the grounding unit 30 onto the plane where the radiating unit 20 is located is located on the periphery of the input interface 21. Alternatively, see [link to relevant documentation]. Figure 9B The vertical projection of the inner edge of the grounding unit 30 onto the plane where the radiating unit 20 is located can also be located inside the input interface 21. (See also...) Figure 9A , Figure 9B and Figure 9C The vertical projection of the grounding unit 30 onto the plane where the radiating unit 20 is located coincides with at least a portion of the power distribution unit 22. For example... Figure 9AAs shown, the outer edge of the grounding unit 30 is adjacent to the inner edge of the radiating element 23, or the outer edge of the grounding unit 30 is located between the inner edge of the radiating element 23 and the input interface 21. See also... Figure 9B The outer edge of the grounding unit 30 and the inner edge of the radiating element 23 can also coincide. (See reference...) Figure 9C In one embodiment, part of the projection of the grounding unit 30 onto the plane where the radiating unit 20 is located coincides with the power dividing unit 22, and another part coincides with part of the radiating oscillator 23.

[0087] See Figure 7 , Figure 8 and Figure 9 The power supply unit 40 is located between the grounding unit 30 and the motherboard 103. Specifically, the power supply unit 40 is a transmission line structure formed on an insulating support, and along a first direction, the power supply unit 40 is located on the side of the radiating unit 20 away from the grounding unit. The power supply unit 40 is electrically connected to an RF chip on the motherboard 103 and is used to power the radiating unit 20. The RF chip is electrically connected to the power supply unit 40 via a transmission line disposed within the motherboard 103.

[0088] Figure 10 For traditional solutions where power signals are transmitted between the antenna module and the motherboard via RF cables, please refer to [reference needed]. Figure 10 The antenna module is mounted above the motherboard. A feed cable powers the antenna module, and the connection point between the feed cable and ground on the motherboard is the first connection point P1. The connections between the feed cable and the radiating element 20 include the second connection point P2 and the third connection point P3. The specific locations of the first connection point P1 on the motherboard, the second connection point P2 on the antenna module, and the third connection point P3 on the antenna module; the length of the feed cable between the first and second connection points P1 and P2; the length of the feed cable between the second and third connection points P2 and P3; and the length of the feed cable between the third connection point P3 and the feed point of the radiating element 20 are all important factors affecting the radiation efficiency of the antenna module. Precisely controlling so many important factors affecting the radiation efficiency of the antenna module during design and assembly requires considerable time and specialized technical support, making the manufacturing cost of communication equipment very high. Therefore, the traditional method of transmitting feed signals using RF cables not only complicates the internal structure of the communication equipment but also makes the assembly process of the RF cables quite complex. Considering the aforementioned important factors affecting antenna radiation efficiency makes it difficult to guarantee good antenna radiation performance. In summary, the placement path of RF cables and the length of the RF cables themselves have a significant impact on antenna consistency, board layout, antenna performance, and link insertion loss.

[0089] The antenna module 10 provided in this application does not require any external RF cables for power supply. The excitation of the radiating element 20 is achieved through transmission lines arranged on the main board 103 and a feed unit 40 (also a transmission line structure) arranged on an insulating support, eliminating the impact of traditionally designed RF cables on antenna performance. In the antenna module 10 provided in this application, the carrier for transmitting electromagnetic wave signals between the radiating element 20 and the RF chip is a transmission line structure set on a circuit board or other insulating support. This simplifies the internal structure of the communication equipment, and the position and shape of the transmission lines are fixed and designed before assembling the antenna module 10, eliminating any adverse effects on the antenna during the assembly process.

[0090] For the specific structural form of the power supply unit 40, please refer to [link / reference]. Figure 11 , Figure 12 , Figure 13 and Figure 14 The implementation method shown.

[0091] See Figure 11 The feeding unit 40 includes a feeding transmission section 41 and a grounding section 42. A gap is provided between the feeding transmission section 41 and the grounding section 42, and the feeding transmission section 41 and the grounding section 42 are separated by an insulating medium 43. The insulating medium 43 between the feeding transmission section 41 and the grounding section 42 can be air, the insulating material of the insulating support, insulating glue, etc. The width of the feeding transmission section 41 includes a first width WS, and the width of the grounding section 42 includes a second width WG. The first width WS is not equal to the second width WG, which is used to achieve current balance of the antenna module 10. The unequal width design of the feeding transmission section 41 and the grounding section 42 of the feeding unit 40 has a decoupling effect. The width of the feeding transmission section 41 refers to the dimension in the direction perpendicular to the extension path of the feeding transmission section 41, and the width of the grounding section 42 refers to the dimension in the direction perpendicular to the extension path of the grounding section 42. Specifically, in one embodiment, the power transmission section 41 extends with a constant width along the first direction A1, and the power transmission section 41 also extends with a constant width along the second direction A2; the grounding section 42 extends with a constant width along the first direction A1, and the grounding section 42 also extends with a constant width along the second direction A2. For example... Figure 11As shown, the first width WS includes the width WS1 of the portion of the transmission line extending from the power supply transmission section 41 along the first direction A1 and the width WS2 of the portion of the transmission line extending from the power supply transmission section 41 along the second direction A2. The second width WG includes the width WG1 of the portion of the transmission line extending from the grounding section 42 along the first direction A1 and the width WG2 of the portion of the transmission line extending from the grounding section 42 along the second direction A2. The widths WS1 and WS2 of the portion of the transmission line extending from the power supply transmission section 41 along the first direction A1 can be equal or different; the widths WG1 and WG2 of the portion of the transmission line extending from the grounding section 42 along the first direction A1 and the second direction A2 can also be equal or different. The first width WS and the second width WG as defined in this application are not equal, which means that the width WS1 of the transmission line of the power supply transmission section 41 extending along the first direction A1 is not equal to the width WG1 of the transmission line of the grounding section 42 extending along the first direction A1, and the width WS2 of the transmission line of the power supply transmission section 41 extending along the second direction A2 is not equal to the width WG2 of the transmission line of the grounding section 42 extending along the second direction A2.

[0092] This solution achieves current balance in the antenna module 10 by using different widths for the feed transmission section 41 and the ground section 42 (i.e., the first width WS and the second width WG are unequal), thereby eliminating or reducing the coupling effect of the feed unit 40 on the radiating unit 20 and improving the radiation performance of the antenna module 10. This application also solves the matching problem of the antenna module 10 by using a feed unit 40 with a transmission line structure mounted on an insulating support.

[0093] The radiating element 20 and grounding element 30 in the antenna module provided in this application constitute an asymmetrical architecture. This asymmetrical architecture refers to the fact that the radiating element 20's radiating element 23 and the grounding element 30 have different structures. In the resonant state, the radiating element 20 and the grounding element 30 generate current imbalance. Specifically, the current in the radiating element 20 and the current in the grounding element 30 have unequal amplitudes and different directions. This application solves the impedance mismatch problem caused by the current imbalance between the radiating element 20 and the grounding element 30 by designing the feed transmission section 41 and the grounding section 42 to have unequal widths. This unequal width design enables the antenna module to achieve overall current balance.

[0094] The feed transmission section 41 and ground section 42 of the feed unit 40 form a double parallel line feed architecture. The microstrip linear power divider unit 22, combined with the double parallel line feed architecture of the feed unit 40, will cause impedance mismatch due to current imbalance if the widths of the feed transmission section 41 and ground section 42 are equal. Furthermore, the feed unit 40 will be mutually coupled with the radiating unit 20, causing changes in the antenna pattern and affecting the antenna's radiation performance. This application addresses this by using unequal-width feed transmission sections 41 and ground sections 42, enabling the feed unit 40 to perform balun and decoupling functions, achieving current balance in the antenna module 10 and improving radiation efficiency.

[0095] See Figure 11 The power supply transmission section 41 includes a first power supply terminal 411 and a second power supply terminal 412. The first power supply terminal 411 is electrically connected to the radiating unit 20, and the second power supply terminal 412 is used to electrically connect to the radio frequency chip on the motherboard 103 within the communication device. The extension path of the power supply transmission section 41 refers to the path of radio frequency signal transmission or current flow between the first power supply terminal 411 and the second power supply terminal 412. The grounding section 42 includes a first ground terminal 421 and a second ground terminal 422. The first ground terminal 421 is electrically connected to the grounding unit 30, and the second ground terminal 422 is electrically connected to the ground (i.e., the ground plane on the motherboard) on the motherboard 103. The extension path of the grounding section 42 refers to the path of current flow between the first ground terminal 421 and the second ground terminal 422. In a first direction, the first power supply terminal 411 is located between the second power supply terminal 412 and the radiating unit 20, and the first ground terminal 421 is located between the second ground terminal 422 and the radiating unit 20.

[0096] In one embodiment, the electrical length of the feed transmission section 41 along its extension path is between 0.3λ and 0.7λ. Specifically, the electrical length of the feed transmission section 41 can be 0.5λ, where λ is the wavelength of the electromagnetic wave in the resonant state of the radiating element 20. By limiting the specific range (between 0.3λ and 0.7λ) and the specific value (0.5λ) of the electrical length of the feed transmission section 41, the feed transmission section 41 can have a balun function, ensuring the repeatability and continuity of the antenna module impedance matching. The repeatability and continuity of impedance matching can be understood as the impedance matching of the two ends of the feed transmission section 41, i.e., the first feed end 411 and the second feed end 412, being the same. This eliminates the need to set other matching circuits on the feed transmission section 41 to adjust the matching impedance. Figure 11As shown, along the extension path of the power supply transmission section 41, the electrical length of the power supply transmission section 41 can be the sum of the electrical length H1 of the power supply transmission section 41 in the first direction A1 and the electrical length L1 of the power supply transmission section 41 in the second direction A2. The electrical length H1 of the power supply transmission section 41 in the first direction A1 can be between 0.1λ and 0.35λ (e.g., 0.25λ), and the electrical length L1 of the power supply transmission section 41 in the second direction A2 can be between 0.1λ and 0.35λ (e.g., 0.25λ).

[0097] In one embodiment, the extension path of the feed transmission section 41 and the extension path of the ground section 42 form a double parallel line architecture. This can be understood as follows: the gap between the first feed terminal 411 of the feed transmission section 41 and the first ground terminal 421 of the ground section 42 is the same as the gap between the second feed terminal 412 of the feed transmission section 41 and the first ground terminal 421 of the ground section 42. Furthermore, the gap between the first feed terminal 411 and the ground section 42 remains unchanged along the extension path of the first feed terminal 411 and the ground section 42. Thus, the feed unit 40 forms a double parallel line architecture, enabling the feed unit 40 to generate equal-amplitude, opposite-current signals when the antenna module is operating. This ensures that the feed unit 40 does not affect the resonance of the radiating element 20, guaranteeing that the antenna module is a vertically polarized antenna and can obtain a better radiation pattern. The equal amplitude and opposite direction of the current can be understood as: the direction of the current on the power transmission section 41 is opposite to the direction of the current on the grounding section 42, but the current amplitude on the power transmission section 41 is equal to the current amplitude on the grounding section 42. The current amplitude refers to the maximum value of the alternating current in one cycle.

[0098] The extension paths of the power supply transmission section 41 and the grounding section 42 include both the extension path in the first direction A1 and the extension path in the second direction A2, with the second direction A2 perpendicular to the first direction A1. The extension path of the power supply transmission section 41 in the first direction A1 can be understood as follows: in one embodiment, a portion of the transmission line of the power supply transmission section 41 extends in the first direction A1; in another embodiment, a portion of the transmission line of the power supply transmission section 41 has a vertical component in the first direction A1, meaning that a portion of the transmission line of the power supply transmission section 41 extends at an angle relative to the first direction A1, exhibiting both an extension tendency in the first direction A1 and an extension tendency in the second direction A2. In one embodiment of this application, the total electrical length L1 of the power supply transmission section 41 in the second direction A2 is between 0.1λ and 0.35λ; in a specific embodiment, the total electrical length L1 of the power supply transmission section 41 in the second direction A2 is 0.25λ, where λ is the wavelength of the electromagnetic wave in the resonant state of the radiating unit 20. By limiting the electrical length of the power transmission section 41 in the second direction A2, the induced current can be suppressed, decoupling between the power supply unit 40 and the radiation unit 20 can be achieved, the coupling between the power supply unit 40 and the radiation unit 20 can be reduced, and the radiation efficiency of the radiation unit 20 can be improved.

[0099] The specific form of the power supply transmission section 41 and the grounding section 42 can be a simple L-shaped transmission line structure, or it can be formed by combining multiple L-shaped transmission lines, or it can include arc-shaped transmission lines, sawtooth-shaped or wavy transmission lines, etc. In one embodiment, such as Figure 11As shown, the transmission lines of the power supply transmission section 41 extending in the second direction A2 are collinear. This solution provides a simple wiring scheme for the power supply transmission section 41, making it easier to control the electrical length of the power supply transmission section 41 and more effective in suppressing induced current. In a specific embodiment, the power supply transmission section 41 includes a first segment 413, a second segment 414, and a third segment 415. The first segment 413 extends along the second direction A2. The second segment 414 and the third segment 415 are respectively connected to both ends of the first segment 413 and both extend along the first direction A1. The second segment 414 is connected between the first segment 413 and the radiating unit 20. The third segment 415 is connected between the first segment 413 and the transmission line on the motherboard 103 used to connect the RF chip. The electrical length of the first segment 413 is 0.1λ-0.35λ (e.g., 0.25λ), the sum of the electrical lengths of the second segment 414 and the third segment 415 is 0.1λ-0.35λ (e.g., 0.25λ), and the sum of the electrical lengths of the first segment 412, the second segment 414, and the third segment 415 is the electrical length (0.5λ) along the extension path of the power supply transmission unit 41. In other embodiments, the extension direction of the first segment 413 may be set at an angle to the second direction A2, for example, the first segment 413 may be tilted at 15 degrees relative to the second direction A2 (this angle value is only an example and is not a limitation of this solution; other angle values ​​are also possible), and the electrical length of the component of the first segment 413 in the second direction A2 is 0.25λ. Similarly, the second segment 414 and the third segment 415 can also be arranged at an angle to the first direction A1, and the sum of the electrical length of the component of the second segment 414 in the first direction A1 and the electrical length of the component of the third segment 415 in the first direction A1 is 0.1λ-0.35λ (for example, it can be 0.25λ).

[0100] In this embodiment, such as Figure 11 As shown, the grounding portion 42 has a two-section structure. The grounding portion 42 includes a fourth section 423 and a fifth section 424. The fourth section 423 and the first section 413 can extend in parallel or parallel to each other. The fifth section 424 and the third section 415 extend in parallel or parallel to each other. The electrical length of the fourth section 423 can be 0.1λ-0.35λ (e.g., 0.25λ), and the electrical length of the fifth section 424 can also be 0.1λ-0.35λ (e.g., 0.25λ). The fourth section 423 is directly connected to the grounding unit 30 of the antenna module 10, either by soldering or by using conductive adhesive.

[0101] In another implementation, see Figure 12 , Figure 12 The embodiments shown and Figure 11The main difference in the illustrated embodiment is that the grounding portion 42 has a three-segment structure. In addition to the fourth segment 423 and the fifth segment 424, the grounding portion 42 also includes a sixth segment 425. The sixth segment 425 extends in parallel with the second segment 414, and an L-shaped transmission line structure can be formed between the sixth segment 425 and the fourth segment 423. The end of the sixth segment 425 furthest from the fourth segment 423 is connected to the grounding unit 30 of the feed unit 40. The extension direction of both the sixth segment 425 and the fifth segment 424 can be the first direction A1, and the sum of the electrical lengths of the sixth segment 425 and the fifth segment 424 is 0.1λ-0.35λ (for example, 0.25λ). In this embodiment, the fourth segment 423 and the grounding unit 30 of the antenna module 10 are separated by an insulating medium.

[0102] In one implementation, such as Figure 11 and Figure 12 In the illustrated embodiment, the fourth segment 423 and the fifth segment 424 are perpendicular to each other and form an L-shaped transmission line architecture, as do the first segment 413 and the third segment 415. The first segment 413 and the second segment 414 also form an L-shaped transmission line architecture. In other embodiments, the angle between the fourth segment 423 and the fifth segment 424 can be greater than 90 degrees or less than 90 degrees. Similarly, the angles between the first segment 413 and the third segment 415, and between the first segment 413 and the second segment 414, can also be greater than 90 degrees or less than 90 degrees.

[0103] In one implementation, see [reference] Figure 13The power supply transmission section 41 extending along the second direction A2 includes at least two transmission lines, which are parallel but not collinear. The vertical distances from each transmission line extending along the second direction A2 to the grounding unit 30 of the antenna module 10 are different. This solution provides a specific wiring scheme for the power supply transmission section 41. This application can set different forms of the power supply transmission section 41 according to the specific assembly environment and electromagnetic field environment of the antenna module. Different design schemes can be achieved by adjusting the specific form of the transmission in the insulation setting, which is simple and easy to implement. The at least two transmission lines are connected by transmission lines extending along the first direction A1. The extension along the first direction A1 and the extension along the second direction A2 defined in this embodiment can be understood as: coinciding with the first direction A1, or forming an angle with the first direction A1, but having a vertical component in the first direction A1; coinciding with the second direction A2, or forming an angle with the second direction A3, but having a vertical component in the second direction A2. In one specific implementation, the power supply transmission unit 41 has two transmission lines extending along the second direction A2. The power supply transmission unit 41 has a five-segment structure, meaning it includes two transmission lines extending along the second direction and three transmission lines extending along the first direction A1. The sum of the electrical lengths of the two transmission lines extending along the second direction A2 is 0.1λ-0.35λ (for example, 0.25λ), and the sum of the electrical lengths of the three transmission lines extending along the first direction A1 is also 0.1λ-0.35λ (for example, 0.25λ).

[0104] Figure 11 , Figure 12 and Figure 13 In the illustrated embodiment, the power transmission section 41 and the grounding section 42 can be coplanar, meaning they are located on the same plane. This implies that the planes of the insulating support that carries the power transmission section 41 and the grounding section 42 are identical. For example, when the insulating support is a circuit board structure, the power transmission section 41 and the grounding section 42 are located on the same layer of the circuit board. This application does not consider the thickness of the power transmission section 41 and the grounding section 42; their thicknesses can be different. However, as long as the power transmission section 41 and the grounding section 42 are located on the same plane, they can be considered coplanar. Coplanar design reduces manufacturing costs and makes it easier to control the positional relationship between the power transmission section and the grounding section.

[0105] If the insulating support has other types of structures, the power transmission section 41 and the grounding section 42 are located on the same surface of the insulating support. In this embodiment, the power transmission section 41 extends with the same width from the first power supply end 411 to the second power supply end 412. The grounding section 42 also extends with the same width from the first ground end 421 to the second ground end 422. The width of the grounding section 42 is greater than the width of the power transmission section 41.

[0106] Figure 11 , Figure 12 and Figure 13 In the illustrated embodiment, the power transmission section 41 and the grounding section 42 of the power supply unit 40 may not be coplanar. For example, when the power supply unit 40 is mounted on a circuit board, the power transmission section 41 and the grounding section 42 may be located on different layers of the circuit board. However, the structural and positional relationship of their projections on the same surface of the circuit board is as follows: Figure 11 , Figure 12 and Figure 13 The architecture shown.

[0107] In another implementation, see Figure 14 , Figure 15 , Figure 16 and Figure 17 The plane where the power supply transmission section 41 is located and the plane where the grounding section 42 is located are not coplanar, which can also be referred to as the power supply transmission section 41 and the grounding section 42 forming a heteroplanar transmission line architecture. Figure 14 and Figure 15 In the circuit diagram, the power transmission section 41 and the grounding section 42 are disposed on two surfaces of the circuit board. The power transmission section 41 is represented by solid lines and internal cross-sections, indicating that the surface of the circuit board on which the power transmission section 41 is located is a visible surface. The grounding section 42 is represented by dashed lines and blank spaces (no cross-sections), indicating that the surface of the circuit board on which the grounding section 42 is located is an invisible surface. Specifically, Figure 14 , Figure 15 , Figure 16 and Figure 17The illustrated embodiment shows that the power transmission section 41 and the grounding section 42 are located on different layers of the circuit board 43, but their projections on the same surface of the circuit board 43 are at least partially overlapping. Compared to a coplanar design, the non-planar transmission architecture provided by this solution has the advantages of saving space and board area, and can make full use of the thickness of the circuit board substrate as insulation between the power transmission section and the grounding section, resulting in lower manufacturing costs. The circuit board 43 includes a first surface 431, a second surface 432, a top edge 433, and a bottom edge 434. The first surface 431 and the second surface 432 are arranged opposite each other along a third direction A3. The power transmission section 41 is located on the first surface 431, and the grounding section 42 is located on the second surface 432. Both the power transmission section 41 and the grounding section 42 extend from the bottom edge 434 to the top edge 433. The circuit board 43 includes a plug-in structure 435 protruding from the top edge 433. The plug-in structure 435 is used for electrical connection with the radiating unit 20. Specifically, the plug-in structure 435 is provided with a conductive connection portion 436, which is electrically connected to the power supply transmission portion 41. The first ground end 421 of the ground portion 42 extends to the top edge 433 for electrical connection with the grounding unit 30. The bottom edge 434 is provided with a slot 437 for fixed connection with other circuit boards or brackets. In a third direction A3 (e.g., the third direction A3 can be the thickness direction of the circuit board), the power supply transmission portion 41 is directly opposite the ground portion 42. The third direction A3 is perpendicular to the second direction A2 and also perpendicular to the first direction A1. The extension scheme and specific shape of the power supply transmission portion 41 in the first direction A1 and the second direction A2 are as follows. Figure 11 The implementation shown is the same. The extension scheme and specific shape of the grounding part 42 in the first direction A1 and the second direction A2 are the same as those of the feed transmission part 41. In one embodiment, the feed transmission part 41 and the grounding part 42 of the antenna module provided by this solution can be disposed on two surfaces (e.g., the front and the back) of the circuit board.

[0108] Figure 14 In the embodiment shown, the power transmission section 41 extends with the same width from the first power supply terminal 411 to the second power supply terminal 412. The grounding section 42 also extends with the same width from the first ground terminal 421 to the second ground terminal 422. However, the widths of the power transmission section 41 and the grounding section 42 are not equal.

[0109] Figure 15 In the embodiment shown, for the power supply transmission unit 41 (and...) Figure 14The power transmission section 41 in the illustrated embodiments has the same structural form. From the first power supply end 411 to the second power supply end 412, the power transmission section 41 extends with a constant width. As for the grounding section 42, from the first ground end 421 to the second ground end 422, some grounding sections 42 extend with a constant width, while others extend with unequal widths. Specifically, the grounding section 42 extending along the second direction extends with a constant width, the upper half of the grounding section 42 extending along the first direction extends with a constant width, and the lower half of the grounding section 42 extending along the first direction extends with unequal widths. The unequal-width grounding section 42 has a trapezoidal structure that is narrower at the top and wider at the bottom. In other embodiments, the unequal-width grounding section 42 can also be configured in other shapes (e.g., square, circular, etc.) or in other positions (e.g., located in the upper half of the portion extending along the second direction or the portion extending along the first direction).

[0110] The feed transmission section and grounding section with unequal width extensions can be extended in a gradually varying width manner, which is beneficial for impedance adjustment.

[0111] Figure 16 In the embodiment shown, for the power transmission section 41, from the first power supply terminal 411 to the second power supply terminal 412, part of the power transmission section 41 extends with equal width, and part of the power transmission section 41 extends with unequal width. For the grounding section 42, from the first ground terminal 421 to the second ground terminal 422, the grounding section 42 extends with equal width.

[0112] Figure 17 In the embodiment shown, for the power transmission section 41, from the first power supply terminal 411 to the second power supply terminal 412, part of the power transmission section 41 extends with equal width and part of the power transmission section 41 extends with unequal width. For the grounding section 42, from the first ground terminal 421 to the second ground terminal 422, part of the grounding section 42 extends with equal width and part of the grounding section 42 extends with unequal width.

[0113] See Figure 7 , Figure 8 and Figure 9 In one embodiment, the antenna module 10 includes a support 15 made of a printed circuit board. The antenna module 10 is constructed by forming a radiating unit 20, a grounding unit 30, and a feeding unit 40 on the support 15, offering advantages such as ease of fabrication and low manufacturing cost. The support 15 includes a first plate 151, a second plate 152, and a third plate 153. The radiating unit 20 and the grounding unit 30 are formed on the first plate 151. The second plate 152 is an insulating support for mounting the feeding unit 40. The second plate 152 and the third plate 153 are interleaved and both are located between the first plate 151 and the main plate 103. The specific structure of the second plate 152 is... Figure 14 The circuit board 43 in the illustrated embodiment can have the same structure.

[0114] See Figure 18 and Figure 19 The first plate 151 includes a first layer 1511 and a second layer 1512 stacked together. In one embodiment, the first layer 1511 is the top surface of the first plate 151, and the second layer 1512 is the bottom surface of the first plate 151. The radiating unit 20 is located on the first layer 1511, and the grounding unit 30 is located on the second layer 1512. The second plate 152 includes a wiring layer 1521 and a first edge 1522 and a second edge 1523 disposed opposite to each other. The wiring layer 1521 is located between the first edge 1522 and the second edge 1523. The second plate 152 is located on one side of the first plate 151, and the first edge 1522 is connected to the first plate 151. The power supply unit 40 is disposed on the wiring layer 1521, and the wiring layer 1521 and the first layer 1511 are disposed at an angle. Specifically, the wiring layer 1521 may be perpendicular to the first layer 1511. The main board 103, grounding unit 30, and radiating unit 20 are stacked sequentially in the first direction A1. The main board 103, second board 152, and first board 151 are connected sequentially in the first direction A1. The main board 103 and first board 151 can be arranged parallel to each other. For example, if the main board 103 and first board 151 are placed horizontally, then the second board 152 is placed vertically. Both the first board 151 and the second board 152 are flat structures, and the second board 152 can be vertically connected between the main board 103 and the first board 151. This solution uses the first board 151 and the second board 152 to set up the antenna module 10, which not only simplifies the manufacturing process and reduces the manufacturing cost, but also makes the antenna module 10 lightweight, which is beneficial for the design of thin and light communication equipment.

[0115] In other embodiments, the radiating unit 20, the grounding unit 30, and the power supply unit 40 can also be mounted on other types of insulating supports, such as an integrally injection-molded plastic support. One part of the support is used to mount the radiating unit 20 and the grounding unit, and the other part is used to mount the power supply unit 40. The plastic support can be cylindrical, cubic, or other shapes suitable for supporting the radiating unit 20, the grounding unit, and the power supply unit 40.

[0116] See Figure 18 and Figure 19This solution achieves electrical connection of the grounding part 42 to the grounding unit 30 through the connection between the first edge 1522 and the first plate 151. Specifically, in one embodiment, the first edge 1522 and the first plate 151 are in contact, and the grounding part 42 on the wiring layer 1521 is in contact with the grounding unit 30 on the first plate 151 to achieve electrical connection between the grounding part 42 and the grounding unit 30. Alternatively, a stable connection between the grounding part 42 and the grounding unit 30 can be achieved by welding. In another embodiment, the grounding unit 30 is located on the surface of the first plate 151, and the grounding part 42 is located on the surface of the second plate 152. When the first plate 151 and the second plate 152 are in contact, the grounding unit and the grounding part 42 can be connected and fixed by welding. Figure 19 The black, semi-circular area in the middle is the welding location. Figure 19 The embodiments shown are merely schematic representations of the welding relationship between the grounding part 42 and the grounding unit 30, and do not constitute a limitation on the specific welding position and welding structure.

[0117] See Figure 18 and Figure 19 A connection structure 50 is provided at the connection between the first plate 151 and the second plate 152. The connection structure 50 can be understood as a connector-like structure or a plug-and-socket mating structure. The connection structure 50 is used to realize the electrical connection between the power transmission unit 41 and the radiation unit 20. In this application, the electrical connection between the power transmission unit 40 and the radiation unit 20, as well as the electrical connection between the power transmission unit 40 and the grounding unit 30, can be realized simultaneously through the assembly and connection process between the first plate 151 and the second plate 152. This electrical connection method not only has the advantages of reliability but also low loss. In one embodiment, this application realizes the electrical connection between the power transmission unit 41 and the radiation unit 20 through the mating of a structure protruding from the edge of the second plate 152 and a hole structure on the first plate 151. Specifically, the first plate 151 has a hole 1513 penetrating the first layer 1511 and the second layer 1512; the second plate 152 includes a plug-in structure 435 protruding from the first edge 1522, at least a portion of the plug-in structure 435 being located within the hole 1513; the connection structure 50 includes the hole 1513 and the plug-in structure 435; the connection structure 50 also includes a conductive connection portion 436, such as... Figure 19 As shown, the conductive connection portion 436 is electrically connected between the radiating unit 20 and the power transmission portion 41. The conductive connection portion 436 may include a conductive layer, a conductive sheet, a conductive adhesive, or a solder that is electrically connected between the radiating unit 20 and the power transmission portion 41.

[0118] like Figure 18 and Figure 19As shown, in one embodiment, the hole 1513 on the first plate 151 is a through hole, the hole 1513 includes a first open end E1 and a second open end E2, the insertion structure 435 is inserted into the hole 1513 from the first open end E1, and the conductive connection part 436 is welded to the radiation unit 20 from one side of the second open end E2. The first layer 1511 is the top surface of the first plate 151, the second layer 1512 is the bottom surface of the first plate 151, the first open end E1 is located on the bottom surface, and the second open end E2 is located on the top surface.

[0119] like Figure 19 As shown, the second edge 1523 of the second board 152 is connected to the main board 103 of the communication device. The main board 103 has a ground layer 103G and an RF chip 103F. The power supply transmission part 41 of the power supply unit 40 is electrically connected to the RF chip 103F through the transmission line in the main board 103. The ground part 42 of the power supply unit 40 is electrically connected to the ground layer 103G in the main board 103. Figure 19 The diagram schematically illustrates the connection between the grounding portion 42 and the ground layer 103G on the motherboard 103, and the connection between the power supply transmission portion 41 and the RF chip 103F via a transmission line. The specific location of the ground layer 103G, the RF chip 103F, and the form of the transmission line are not limited. It is understood that the motherboard 103 has a multi-layer circuit board structure, the ground layer 103G can be one of the layers, the transmission line can be located on one of the layers, and the RF chip 103F can be disposed on the surface of the motherboard 103. In one embodiment, the RF chip 103F is disposed on the surface of the motherboard 103 facing away from the antenna module 10, and an electromagnetic shielding space (e.g., ...) is formed through the first housing 101 of the communication device 100 and the structure of the motherboard 103. Figure 3 (As shown).

[0120] See Figure 20 and Figure 21 , Figure 20 and Figure 21 The implementation methods shown are the same as Figure 18 and Figure 19 The difference between the embodiments shown is that: Figure 18 and Figure 19 In the embodiment shown, the inner wall of the hole 1513 on the first plate 151 is made of the insulating material of the first plate 151, that is, the inner wall of the hole 1513 does not have a conductive structure. The conductive connection part 436 is welded to the radiation unit 20 from the position of the second opening end E2. Figure 20 and Figure 21In the illustrated embodiment, the inner wall of the hole 1513 in the first plate 151 is provided with a conductive layer 1514, which is electrically connected to the radiating unit 20. The insertion structure 435 is inserted into the hole 1513 of the first plate 151, and an electrical connection between the conductive connection part 436 and the conductive layer 1514 can be achieved inside the hole 1513 using conductive adhesive or solder. The connection structure 50 in this embodiment provides better strength and stability of the electrical connection between the power transmission part 41 and the radiating unit 20.

[0121] See Figure 7 , Figure 8 and Figure 9 In addition to the connection via the insertion structure 435, the second plate 152 also includes positioning posts 1524 protruding from its first edge 1522. In one embodiment, there are two positioning posts 1524, symmetrically distributed on both sides of the insertion structure 435. Correspondingly, the first plate 151 has positioning holes 1515 corresponding to the positioning posts 1524. Specifically, there are two positioning holes 1515, symmetrically distributed on both sides of the hole 1513. The positioning posts 1524 are inserted into the positioning holes 1515 to fix the first plate 151 and the second plate 152. The third plate 153 is also connected and fixed to the first plate 151 via the cooperation of positioning posts and positioning holes.

[0122] In one specific implementation, see [reference] Figure 8 The antenna module also includes a reflection unit 60 and a lumped unit 70. The lumped unit 70 is loaded on the reflection unit 60. The operation of the reflection unit 60 is controlled by controlling the lumped unit 70. The operation of the reflection unit 60 is used to switch between the high-density state and the omnidirectional state of the antenna module.

[0123] In one specific embodiment, a first main antenna 10A1 is provided on the second board 152, and the radiating element 20, the grounding element 30, and the feeding element 40 constitute a second main antenna 10A2. The resonant frequency of the first main antenna 10A1 is a first frequency, and the resonant frequency of the second main antenna 10A2 is a second frequency, which is higher than the first frequency. The first frequency is 2.4 GHz, and the second frequency is 5 GHz. The antenna module 10 includes multiple antenna elements 10A, and each antenna element 10A includes one first main antenna 10A1 and one second main antenna 10A2.

[0124] See also Figure 22 and Figure 23 , Figure 23 for Figure 22The illustrated embodiment provides a schematic diagram of the distance and height dimensions of the antenna module. The distance D3 between the first main antenna 10A1 and the first main antenna 10A1 of the adjacent antenna element 10A is between 0.2 wavelengths and 0.8 wavelengths.

[0125] The antenna unit 10A further includes a first decoupling structure 13 and a second decoupling structure 14. The first decoupling structure 13 is located on the second board 152, and the second decoupling structure 14 is located on the third board 153. The ends of the second board 152 and the third board 153 away from the first board 151 are connected to the motherboard 103 of the communication device. In the direction perpendicular to the ground plane of the motherboard 103 of the communication device, the maximum distance between the first decoupling structure 13 and the ground plane 103G of the motherboard 103 is the cross-sectional height H1 of the first decoupling structure 13. The cross-sectional height H1 of the first decoupling structure 13 is in the range of 0.01 wavelength to 0.16 wavelength. The distance between the first decoupling structure 13 and the first main antenna 10A1 is the first distance D1. The distance between the first decoupling structure 13 and the first main antenna 10A1 of the adjacent antenna unit 10A is the second distance D2. Both the first distance D1 and the second distance D2 are in the range of 0.1 wavelength to 0.6 wavelength.

[0126] The first distance D1 refers to the distance between the phase center of the first decoupling structure 13 and the phase center of the first main antenna 10A1. The second distance D2 refers to the distance between the phase center of the first decoupling structure 13 and the phase center of the first main antenna 10A1 in the adjacent antenna element 10A. This application achieves a smaller overall size for the antenna module by setting the first decoupling structure 13, which is beneficial for the thinner design of communication equipment. It also solves the problem of isolation between the first main antennas 10A1 of adjacent antenna elements. By controlling the cross-sectional height of the first decoupling structure 13, the distance between the first decoupling structure 13 and the first main antenna 10A1, and the distance between the first decoupling structure 13 and the first main antenna 10A1 of the adjacent antenna element, the isolation between adjacent first main antennas 10A1 can be improved within a limited space while reducing the impact on the radiation efficiency of the first main antenna 10A1. The simulation graph of the radiation efficiency of adjacent first main antennas 10A1 shows no obvious pits.

[0127] The antenna module 10 provided in this application designs each antenna element 10A with the same architecture. During the assembly of multiple antenna elements 10A onto the motherboard 103, there is no need to consider the specific structure of each antenna element 10A, because all antenna elements 10A have the same structure. Only the positions of the RF chips need to be considered. Therefore, this embodiment simplifies the assembly process of communication equipment, saves assembly costs, and improves manufacturing efficiency.

[0128] The second decoupling structure 14 is used to reduce the coupling between the first main antenna 10A1 and the first main antenna 10A1 of the adjacent antenna element 10A. The resonant frequency of the second decoupling structure 14 is greater than or less than the first frequency. The frequency difference between the resonant frequency of the second decoupling structure 14 and the first frequency is between 0.03 GHz and 0.33 GHz. The resonant frequency of the second decoupling structure 14 is limited to the range of (fL-0.33 GHz) to (fL-0.03 GHz) or (fH+0.03 GHz) to (fH+0.33 GHz), which can improve isolation while preventing efficiency dips from being introduced into the band. fL to fH is the frequency range of the first main antenna 10A1 (i.e., the first frequency), for example, fL to fH is 2.4 to 2.5 GHz.

[0129] The distances D4 and D5 between the second decoupling structure 14 and the first main antenna 10A1 are 0.05 wavelengths to 0.6 wavelengths. The distances D4 and D5 between the second decoupling structure 14 and the first main antenna 10A1 can be less than the distance between the first decoupling structure 13 and the first main antenna 10A1 (first distance D1), or less than the distance between the first decoupling structure 13 and the first main antenna 10A1 of the adjacent antenna element 10A (second distance D2).

[0130] This application achieves decoupling between the first main antennas 10A1 of adjacent antenna elements 10A by adjusting the resonant frequency of the second decoupling structure 14 so that its resonant frequency is not at the first frequency, but slightly higher or lower. This improves isolation while reducing the impact on antenna radiation efficiency. Specifically, when the second decoupling structure 14 resonates, it generates an efficiency dip in the electromagnetic waves at the resonant frequency of the second decoupling structure 14. For the first main antennas 10A1 of adjacent antenna elements 10A, the efficiency dip generated by the second decoupling structure 14 can avoid the in-band frequency (i.e., the first frequency) of the resonant first main antenna 10A1 of adjacent antenna elements 10A, thereby reducing the impact of the second decoupling structure 14 on the radiation efficiency of the first main antennas 10A1 of adjacent antenna elements 10A.

[0131] This application saves space on the motherboard 103 by bringing the two first main antennas closer together and mounting the first main antenna 10A1 and the second main antenna 10A2 on the same bracket, which is beneficial for the small-size design of the antenna module. Since the distance between the two first main antennas 10A1 is between 0.2 and 0.8 wavelengths, if no first decoupling structure is provided in each antenna element, the two first main antennas 10A1 will receive each other's signals in the resonant state, causing signal interference and resulting in poor isolation. Therefore, this application sets the distance between the two first main antennas 10A1 between 0.2 and 0.8 wavelengths, and uses the first decoupling structure 13 and the second decoupling structure 14 to ensure the radiation efficiency between the two first main antennas 10A1 and improve the isolation.

[0132] This application achieves a smaller antenna size by setting a first decoupling structure 13, which is beneficial for the thinner design of communication equipment. It also solves the isolation problem between adjacent first main antennas 10A1. By controlling the cross-sectional height of the first decoupling structure 13, the distance between the first decoupling structure 13 and the first main antenna 10A1, and the distance between the first decoupling structure 13 and adjacent first main antennas 10A1, the isolation between adjacent first main antennas 10A1 can be improved within a limited space while reducing the impact on the radiation efficiency of the first main antenna 10A1. This results in no obvious pits in the simulation graph of the radiation efficiency of the first main antenna 10A1.

[0133] This application achieves decoupling between the first main antennas 10A1 by adjusting the resonant frequency of the second decoupling structure 14 so that its resonant frequency is not at the first frequency, but slightly higher or lower. This improves isolation while reducing the impact on antenna radiation efficiency. Specifically, when the second decoupling structure 14 resonates, it generates an efficiency dip in the electromagnetic waves at the resonant frequency of the second decoupling structure 14. For the first main antenna 10A1, the efficiency dip generated by the second decoupling structure 14 can avoid the in-band frequency (i.e., the first frequency) of the first main antenna 10A1's resonance, thereby reducing the impact of the second decoupling structure 14 on the radiation efficiency of the first main antenna 10A1.

[0134] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An antenna module, characterized in that, include: Layered radiating and grounding units; A power supply unit is a transmission line structure formed on an insulating support. Along a first direction, the power supply unit is located on the side of the grounding unit away from the radiating unit. The power supply unit includes a power supply transmission section and a grounding section, which are insulated from each other. The width of the power supply transmission section includes a first width, and the width of the grounding section includes a second width. The first width is not equal to the second width. The width of the power supply transmission section refers to the dimension in the direction perpendicular to the extension path of the power supply transmission section, and the width of the grounding section refers to the dimension in the direction perpendicular to the extension path of the grounding section.

2. The antenna module according to claim 1, characterized in that, Along the extension path of the power supply transmission section, the electrical length of the power supply transmission section is between 0.3λ and 0.7λ, where λ is the wavelength of the electromagnetic wave in the resonant state of the radiating unit.

3. The antenna module according to claim 2, characterized in that, The extension path of the power supply transmission section and the extension path of the grounding section form a double parallel line architecture.

4. The antenna module according to any one of claims 1-3, characterized in that, The total electrical length of the power supply transmission unit in the second direction is between 0.15λ and 0.35λ, where λ is the wavelength of the electromagnetic wave in the resonant state of the radiating unit, and the second direction is perpendicular to the first direction.

5. The antenna module according to claim 4, characterized in that, The power supply transmission section has a portion of its transmission lines extending in the second direction that are collinear.

6. The antenna module according to claim 4, characterized in that, The power supply transmission section extending in the second direction includes at least two transmission line segments, which are connected by a transmission line extending in the first direction.

7. The antenna module according to any one of claims 1-3, or 5, or 6, characterized in that, The power transmission section and the grounding section are coplanar.

8. The antenna module according to claim 4, characterized in that, The power transmission section and the grounding section are coplanar.

9. The antenna module according to any one of claims 1-3, or 5, or 6, characterized in that, The plane where the power supply transmission unit is located and the plane where the grounding unit is located are not coplanar. In the third direction, the power supply transmission unit and the grounding unit are arranged opposite each other. The third direction is perpendicular to the second direction and also perpendicular to the first direction.

10. The antenna module according to claim 4, characterized in that, The plane where the power supply transmission unit is located and the plane where the grounding unit is located are not coplanar. In the third direction, the power supply transmission unit and the grounding unit are arranged opposite each other. The third direction is perpendicular to the second direction and also perpendicular to the first direction.

11. The antenna module according to any one of claims 1-3, or 5, or 6, or 8, or 10, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication equipment. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal; and / or The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal.

12. The antenna module according to claim 4, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication equipment. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal; and / or The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal.

13. The antenna module according to claim 7, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication equipment. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal; and / or The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal.

14. The antenna module according to claim 9, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication equipment. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal; and / or The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal.

15. The antenna module according to any one of claims 1-3, or 5, or 6, or 8, or 10, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. From the first power supply terminal to the second power supply terminal, a portion of the power supply transmission section extends with equal width, while a portion extends with unequal width; and / or The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

16. The antenna module according to claim 4, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. From the first power supply terminal to the second power supply terminal, a portion of the power supply transmission section extends with equal width, while a portion extends with unequal width; and / or The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

17. The antenna module according to claim 7, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. From the first power supply terminal to the second power supply terminal, a portion of the power supply transmission section extends with equal width, while a portion extends with unequal width; and / or The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

18. The antenna module according to claim 9, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. From the first power supply terminal to the second power supply terminal, a portion of the power supply transmission section extends with equal width, while a portion extends with unequal width; and / or The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

19. The antenna module according to any one of claims 1-3, or 5, or 6, or 8, or 10, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal. The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

20. The antenna module according to claim 4, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal. The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

21. The antenna module according to claim 7, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal. The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

22. The antenna module according to claim 9, characterized in that, The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to an RF chip on the motherboard within the communication device. The power supply transmission section extends with equal width from the first power supply terminal to the second power supply terminal. The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. From the first ground terminal to the second ground terminal, part of the grounding portion extends with equal width, and part of the grounding portion extends with unequal width.

23. The antenna module according to any one of claims 1-3, or 5, or 6, or 8, or 10, characterized in that, The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal. and The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to the radio frequency chip on the motherboard in the communication device. From the first power supply terminal to the first power supply terminal, part of the power supply transmission section extends with equal width, and part of the power supply transmission section extends with unequal width.

24. The antenna module according to claim 4, characterized in that, The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal. and The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to the radio frequency chip on the motherboard in the communication device. From the first power supply terminal to the first power supply terminal, part of the power supply transmission section extends with equal width, and part of the power supply transmission section extends with unequal width.

25. The antenna module according to claim 7, characterized in that, The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal. and The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to the radio frequency chip on the motherboard in the communication device. From the first power supply terminal to the first power supply terminal, part of the power supply transmission section extends with equal width, and part of the power supply transmission section extends with unequal width.

26. The antenna module according to claim 9, characterized in that, The grounding portion includes a first ground terminal and a second ground terminal. The first ground terminal is electrically connected to the grounding unit, and the second ground terminal is used to electrically connect to the ground on the motherboard of the communication equipment. The grounding portion extends with equal width from the first ground terminal to the second ground terminal. and The power supply transmission section includes a first power supply terminal and a second power supply terminal. The first power supply terminal is electrically connected to the radiating unit, and the second power supply terminal is used to electrically connect to the radio frequency chip on the motherboard in the communication device. From the first power supply terminal to the first power supply terminal, part of the power supply transmission section extends with equal width, and part of the power supply transmission section extends with unequal width.

27. The antenna module according to any one of claims 1-3, or 5, or 6, or 8, or 10, or any one of claims 12-14, or any one of claims 16-18, or any one of claims 20-22, or any one of claims 24-26, characterized in that, The antenna module includes a first board and a second board. The first plate includes a first layer and a second layer stacked together, the radiating unit is located in the first layer, and the grounding unit is located in the second layer; The second plate is the insulating support. The second plate includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second plate is located on one side of the first plate. The first edge is connected to the first plate. The power supply unit is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

28. The antenna module according to claim 4, characterized in that, The antenna module includes a first board and a second board. The first plate includes a first layer and a second layer stacked together, the radiating unit is located in the first layer, and the grounding unit is located in the second layer; The second plate is the insulating support. The second plate includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second plate is located on one side of the first plate. The first edge is connected to the first plate. The power supply unit is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

29. The antenna module according to claim 7, characterized in that, The antenna module includes a first board and a second board. The first plate includes a first layer and a second layer stacked together, the radiating unit is located in the first layer, and the grounding unit is located in the second layer; The second plate is the insulating support. The second plate includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second plate is located on one side of the first plate. The first edge is connected to the first plate. The power supply unit is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

30. The antenna module according to claim 9, characterized in that, The antenna module includes a first board and a second board. The first plate includes a first layer and a second layer stacked together, the radiating unit is located in the first layer, and the grounding unit is located in the second layer; The second plate is the insulating support. The second plate includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second plate is located on one side of the first plate. The first edge is connected to the first plate. The power supply unit is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

31. The antenna module according to claim 11, characterized in that, The antenna module includes a first board and a second board. The first plate includes a first layer and a second layer stacked together, the radiating unit is located in the first layer, and the grounding unit is located in the second layer; The second plate is the insulating support. The second plate includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second plate is located on one side of the first plate. The first edge is connected to the first plate. The power supply unit is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

32. The antenna module according to claim 15, characterized in that, The antenna module includes a first board and a second board. The first plate includes a first layer and a second layer stacked together, the radiating unit is located in the first layer, and the grounding unit is located in the second layer; The second plate is the insulating support. The second plate includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second plate is located on one side of the first plate. The first edge is connected to the first plate. The power supply unit is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

33. The antenna module according to claim 19, characterized in that, The antenna module includes a first board and a second board. The first plate includes a first layer and a second layer stacked together, the radiating unit is located in the first layer, and the grounding unit is located in the second layer; The second plate is the insulating support. The second plate includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second plate is located on one side of the first plate. The first edge is connected to the first plate. The power supply unit is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

34. The antenna module according to claim 23, characterized in that, The antenna module includes a first board and a second board. The first plate includes a first layer and a second layer stacked together, the radiating unit is located in the first layer, and the grounding unit is located in the second layer; The second plate is the insulating support. The second plate includes a wiring layer and a first edge and a second edge disposed opposite to each other. The wiring layer is located between the first edge and the second edge. The second plate is located on one side of the first plate. The first edge is connected to the first plate. The power supply unit is disposed on the wiring layer. The wiring layer and the first layer are disposed at an angle.

35. The antenna module according to claim 27, characterized in that, The grounding part is electrically connected to the grounding unit through the connection between the first edge and the first plate. A connection structure is provided at the connection between the first plate and the second plate. The connection structure is used to realize the electrical connection between the power transmission part and the radiation unit.

36. The antenna module according to any one of claims 28-34, characterized in that, The grounding part is electrically connected to the grounding unit through the connection between the first edge and the first plate. A connection structure is provided at the connection between the first plate and the second plate. The connection structure is used to realize the electrical connection between the power transmission part and the radiation unit.

37. The antenna module according to claim 35, characterized in that, The first plate has a hole that passes through the first layer and the second layer. The second plate includes a plug-in structure that protrudes from the first edge. At least a portion of the plug-in structure is located within the hole. The connection structure includes the hole and the plug-in structure. The connection structure also includes a conductive connection portion that is electrically connected between the radiating unit and the power supply transmission unit.

38. The antenna module according to claim 36, characterized in that, The first plate has a hole that passes through the first layer and the second layer. The second plate includes a plug-in structure that protrudes from the first edge. At least a portion of the plug-in structure is located within the hole. The connection structure includes the hole and the plug-in structure. The connection structure also includes a conductive connection portion that is electrically connected between the radiating unit and the power supply transmission unit.

39. The antenna module according to claim 37 or 38, characterized in that, The hole is a through hole, which includes a first open end and a second open end. The plug-in structure is inserted into the hole from the first open end, and the conductive connection part is welded to the radiation unit from one side of the second open end.

40. The antenna module according to claim 39, characterized in that, The first layer is the top surface of the first plate, the second layer is the bottom surface of the first plate, the first opening end is located on the bottom surface, and the second opening end is located on the top surface.

41. The antenna module according to claim 27, characterized in that, The second edge of the second board is connected to the motherboard of the communication device, the grounding part of the power supply unit is electrically connected to the grounding layer on the motherboard, and the power supply transmission part and the radio frequency chip on the motherboard are electrically connected through a transmission line provided on the motherboard.

42. The antenna module according to any one of claims 28-35, or 37, or 38, or 40, characterized in that, The second edge of the second board is connected to the motherboard of the communication device, the grounding part of the power supply unit is electrically connected to the grounding layer on the motherboard, and the power supply transmission part and the radio frequency chip on the motherboard are electrically connected through a transmission line provided on the motherboard.

43. The antenna module according to claim 36, characterized in that, The second edge of the second board is connected to the motherboard of the communication device, the grounding part of the power supply unit is electrically connected to the grounding layer on the motherboard, and the power supply transmission part and the radio frequency chip on the motherboard are electrically connected through a transmission line provided on the motherboard.

44. The antenna module according to claim 39, characterized in that, The second edge of the second board is connected to the motherboard of the communication device, the grounding part of the power supply unit is electrically connected to the grounding layer on the motherboard, and the power supply transmission part and the radio frequency chip on the motherboard are electrically connected through a transmission line provided on the motherboard.

45. The antenna module according to any one of claims 28-35, or 37, or 38, or 40, or 41, or 43, or 44, characterized in that, The second board is provided with a first main antenna, and the radiating unit, the grounding unit and the feeding unit constitute the second main antenna. The resonant frequency of the first main antenna is a first frequency, and the resonant frequency of the second main antenna is a second frequency, which is higher than the first frequency.

46. ​​The antenna module according to claim 36, characterized in that, The second board is provided with a first main antenna, and the radiating unit, the grounding unit and the feeding unit constitute the second main antenna. The resonant frequency of the first main antenna is a first frequency, and the resonant frequency of the second main antenna is a second frequency, which is higher than the first frequency.

47. The antenna module according to claim 39, characterized in that, The second board is provided with a first main antenna, and the radiating unit, the grounding unit and the feeding unit constitute the second main antenna. The resonant frequency of the first main antenna is a first frequency, and the resonant frequency of the second main antenna is a second frequency, which is higher than the first frequency.

48. The antenna module according to claim 42, characterized in that, The second board is provided with a first main antenna, and the radiating unit, the grounding unit and the feeding unit constitute the second main antenna. The resonant frequency of the first main antenna is a first frequency, and the resonant frequency of the second main antenna is a second frequency, which is higher than the first frequency.

49. The antenna module according to claim 45, characterized in that, The antenna module includes multiple antenna elements, each antenna element including a first main antenna and a second main antenna. The antenna element also includes a first decoupling structure and a second decoupling structure. The first decoupling structure is located on the second board. The antenna module also includes a third board, which is interleaved with the second board. The second decoupling structure is located on the third board.

50. The antenna module according to any one of claims 46-48, characterized in that, The antenna module includes multiple antenna elements, each antenna element including a first main antenna and a second main antenna. The antenna element also includes a first decoupling structure and a second decoupling structure. The first decoupling structure is located on the second board. The antenna module also includes a third board, which is interleaved with the second board. The second decoupling structure is located on the third board.

51. The antenna module according to claim 49, characterized in that, The ends of the second and third boards furthest from the first board are connected to the motherboard of the communication device. In the direction perpendicular to the ground plane of the motherboard, the maximum distance between the first decoupling structure and the ground plane is the cross-sectional height of the first decoupling structure. The cross-sectional height of the first decoupling structure is between 0.01 wavelength and 0.16 wavelength. The distance between the first decoupling structure and the first main antenna is the first distance. The distance between the first decoupling structure and the first main antenna of the adjacent antenna unit is the second distance. Both the first distance and the second distance are between 0.1 wavelength and 0.6 wavelength. The second decoupling structure is used to reduce the coupling between the first main antenna and the first main antenna of the adjacent antenna unit. The resonant frequency of the second decoupling structure is greater than or less than the first frequency.

52. The antenna module according to claim 50, characterized in that, The ends of the second and third boards furthest from the first board are connected to the motherboard of the communication device. In the direction perpendicular to the ground plane of the motherboard, the maximum distance between the first decoupling structure and the ground plane is the cross-sectional height of the first decoupling structure. The cross-sectional height of the first decoupling structure is between 0.01 wavelength and 0.16 wavelength. The distance between the first decoupling structure and the first main antenna is the first distance. The distance between the first decoupling structure and the first main antenna of the adjacent antenna unit is the second distance. Both the first distance and the second distance are between 0.1 wavelength and 0.6 wavelength. The second decoupling structure is used to reduce the coupling between the first main antenna and the first main antenna of the adjacent antenna unit. The resonant frequency of the second decoupling structure is greater than or less than the first frequency.

53. A communication device, characterized in that, It includes a radio frequency chip and an antenna module as described in any one of claims 1-52, wherein the antenna module is electrically connected to the radio frequency chip.

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