A pull-up type stable polishing silicon wafer polishing device

Abstract

The application discloses a kind of stable grinding silicon wafer grinding devices of pull-up, it is related to grinding technical field, including work base frame, the work base frame top end is equipped with work frame by bolt, stretching mechanism, the stretching mechanism includes single-phase motor and installation frame head, the installation frame head is bolted in work frame top end middle part, the single-phase motor is bolted in installation frame head top end, cleaning mechanism, the cleaning mechanism includes collection pipe, the collection pipe is bolted in work frame left side middle part.The application in the process of using, by stretching mechanism start moving polishing mechanism, and by moving polishing mechanism start speed change mechanism, then it will produce unexpected situation to move up, it will make the rotational speed of polishing end gradually smaller, increase the protection ability to silicon wafer when producing unexpected situation, avoid in polishing process, when polishing end moves up protection, the rotational speed of polishing end always maintains high-speed rotation, make silicon wafer produce damage condition.

Description

Technical Field

[0001] This invention relates to the field of grinding technology, specifically to a pull-type stable grinding device for silicon wafers. Background Technology

[0002] Silicon wafers are crucial and commonly used high-end electronic components in many fields. Silicon wafer grinding machines are widely used for single-sided grinding and polishing of various materials, including silicon wafers, zinc alloys, fiber optic connectors, stainless steel surfaces, LED sapphire substrates, optical glass wafers, quartz wafers, various wafers, molds, and light guide plates. Grinding silicon wafers is an essential step in this process. Chinese patent application number 201810318096.4 discloses "a pull-type stable grinding silicon wafer grinding device, including a work plate, with mounting plates fixedly connected to the left and right sides of the top of the work plate, and the tops of the two mounting plates fixedly connected..." The device has a horizontal plate with five through holes at its top. This invention solves the problems of unstable grinding of silicon wafers and uneven grinding pressure that can damage the wafers and reduce yield during processing. The invention utilizes a lifting mechanism with motor B to rotate shaft B, which in turn rotates the drum and moves ropes on both sides. This allows the annular base at the other end of the ropes to move upwards stably, facilitating grinding, making the process more stable and convenient, and protecting the silicon wafers from breakage during grinding, thus improving the stability of the grinding process.

[0003] Existing technologies only address the issues of unstable grinding of silicon wafers and uneven grinding pressure during the grinding process, which can damage the wafers and reduce yield. While stretching for protection during grinding maintains a high rotation speed, this method introduces a delay. Maintaining high speed during stretching can lead to over-grinding. Furthermore, using a placement slot creates gaps between the wafer and the slot. If debris from grinding gets into these gaps, it can cause the wafer to shift due to pressure, requiring further processing and increasing workload. Summary of the Invention

[0004] The purpose of this invention is to provide a pull-type silicon wafer polishing apparatus that can stably polish silicon wafers, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a pull-type stable grinding silicon wafer grinding device, comprising a working base frame, wherein a working frame is bolted to the top of the working base frame, and further comprising;

[0006] A tensioning mechanism, comprising a single-phase motor and a mounting frame head, wherein the mounting frame head is bolted to the center of the top of the working frame, and the single-phase motor is bolted to the top of the mounting frame head;

[0007] A cleaning mechanism, comprising a collection pipe, which is bolted to the middle left side of the work frame;

[0008] The placement mechanism includes an operating plate, a movable placement plate, and two limiting suction cups. The movable placement plate is movably placed at the bottom of the inner cavity of the working frame. The operating plate is bolted to the right side of the movable placement plate. The two limiting suction cups are respectively arranged on both sides of the top of the movable placement plate.

[0009] A mobile grinding mechanism, comprising two rotating motors and a fixed frame, wherein the fixed frame is movably installed in the middle of the inner cavity of the work frame, and the two rotating motors are installed at both ends of the fixed frame;

[0010] The movable annular grooves are respectively formed on the top of the limiting suction cup. A movable top ring is movably installed inside the movable annular groove. Several push rods are equidistantly installed around the bottom of the movable top ring. Several connecting recesses are formed at the bottom of the limiting suction cup. Push springs are bolted to the bottom of the push rods and the top of the inner cavity of the connecting recesses. A contact ring is movably installed on the top of the movable top ring. An annular sliding groove is formed on the top of the movable top ring. An annular sliding strip is movably installed inside the annular sliding groove. The top of the annular sliding strip is bolted to the bottom of the contact ring.

[0011] Preferably, the stretching mechanism further includes a collecting roller, a pull rope, a guide frame, and a fixing spring. The collecting roller is movably installed in the inner cavity of the mounting frame head. The bottom end of the single-phase motor passes through the mounting frame head and is connected to the top end of the collecting roller by bolts. The pull rope is movably wound around the outside of the collecting roller. The two guide frames are respectively installed at the bottom center of the two sides of the mounting frame head by bolts. The end of the pull rope away from the collecting roller passes through the inside of the guide frame and extends into the working frame. The two fixing springs are respectively installed at the middle of the top center of the inner cavity of the working frame by bolts.

[0012] Preferably, the pull rope is a double-strand pull rope, and movable through holes are provided at the bottom center of both sides of the mounting frame head and at the top of both sides of the working frame relative to the pull rope. A control panel is installed on the upper front side of the working bottom frame by bolts. The single-phase motor and the rotary motor are electrically connected to the control panel by wires, and an alarm is installed on the outside of the control panel.

[0013] Preferably, the cleaning mechanism further includes a collection bag and a blower. The collection bag is bolted to the end of the collection tube away from the working frame, and the blower is bolted to the middle right side of the working frame. The blower is electrically connected to the control panel, and exhaust vents are provided in the middle of both sides of the working frame.

[0014] Preferably, the placement mechanism further includes placement slots and transmission processing mechanisms. The placement slots on both sides are opened in the middle of the top of the movable placement plate. The movable placement plate has a rectangular structure. An operation through slot is opened at the bottom right side of the working frame. The placement slots and the limiting suction cups are both circular in top view. The two transmission processing mechanisms are respectively movably installed on the upper part of the inner cavity of the placement slots. The limiting suction cups are all located inside the placement slots.

[0015] Preferably, the transmission mechanism includes a movable ring, fan heads, a mounting base groove, air inlets, magnetic blocks, gears, transmission rods, transmission belts, and tooth blocks. The mounting base groove is located at the bottom of the inner cavity of the placement slot. The movable ring is movably mounted on the upper end of the inner cavity of the mounting base groove. Several magnetic blocks are spot-welded to the periphery of the inner cavity of the movable ring. Two fan heads are mounted at the bottom of the inner cavity of the mounting base groove via rotating shafts. Two transmission rods are mounted on the middle of opposite sides of the inner cavity of the mounting base groove via bearings. The gears on both sides are bolted to the top of the transmission rods. Several air inlets are located around the top of the inner cavity of the mounting base groove. Several tooth blocks are welded to the periphery of the movable ring. The gears on both sides mesh with the tooth blocks and the tooth grooves formed by the tooth blocks. Rollers are bolted to the bottom of the transmission rods and the bottom of the rotating shafts. Two transmission belts are movably mounted between the outer sides of the rollers.

[0016] Preferably, the mobile grinding mechanism further includes grinding discs, stabilizing slide rails, stabilizing carriages, stabilizing sliders, stabilizing ring shafts, an abnormality protection mechanism, and a speed-changing mechanism. The four stabilizing slide rails are respectively bolted to the front and rear ends of the inner cavity of the working frame. The two stabilizing carriages are bolted to the upper middle part of the opposite side of the rotating motors on both sides. The four stabilizing sliders are bolted to the front and rear ends of the opposite side of the stabilizing carriages on both sides. All stabilizing sliders are slidably connected to the inside of the stabilizing slide rails. The bottom end of the pull rope is bolted to the top of the rotating motor and the fixed frame. The two grinding discs are bolted to the bottom end of the rotating motor. The abnormality protection mechanisms on both sides are bolted to the right side of the top of the grinding discs. The speed-changing mechanism is movably installed on the left side of the inner cavity of the stabilizing slide rail at the left front end. The two stabilizing ring shafts are respectively bolted to the bottom end of the outside of the rotating motor. The bottom end of the stabilizing ring shafts is bolted to the top of the grinding discs. Magnetic rings are bolted to the outer periphery of the grinding discs on both sides.

[0017] Preferably, the speed-changing mechanism includes a guide coil, a mounting slot, elastic top bars, a mounting opening, and an elastic guide block. The mounting slot is located in the middle left side of the inner cavity of the stabilizing slide rail. The guide coil is installed inside the mounting slot by bolts, and the bottom end of the guide coil is electrically connected to the rotating motors on both sides. The mounting opening is located in the middle left side of the stabilizing slider. Several elastic top bars are installed on the right side of the inner cavity of the mounting opening by bolts. The elastic guide block is installed on the left side of the elastic top bars by bolts, and the side of the elastic guide block away from the mounting opening contacts the outside of the guide coil. The elastic guide block is electrically connected to the rotating motor.

[0018] Preferably, the abnormal protection mechanism includes a trigger cylinder, a movable block, a connecting airbag, a mounting ring, a contact guide block, a pin, a protective guide block, and a zinc strip. The trigger cylinder is bolted to the right side of the top of the grinding disc. The zinc strip is installed at the bottom of the inner cavity of the trigger cylinder, and the bottom end of the zinc strip is connected to the grinding layer at the bottom of the grinding disc. The movable block is movably installed at the top of the zinc strip. Two protective guide blocks are respectively installed at the top of the movable block and the top of the inner cavity of the trigger cylinder. The upper and lower protective guide blocks are electrically connected to the alarm. Two connecting airbags are bolted to the middle of one side of the inner cavity of the trigger cylinder on both sides. Two mounting rings are bolted to the bottom of the middle of one side of the trigger cylinder. Connecting rods are glued to the bottom of each connecting airbag. The contact guide blocks on both sides are bolted to the bottom of the connecting rods and one side of the inner cavity of the trigger cylinder on both sides. The contact guide blocks are in contact with each other. The contact guide blocks on both sides are electrically connected to the rotating motor.

[0019] Preferably, contact guide rings are bolted to the upper ends of the inner cavities of the two stabilizing ring shafts, and a connecting guide block is bolted to the bottom end of one side of the rotating motor. The contact guide block contacts the contact guide rings, and the connecting guide block and the contact guide rings are electrically connected to the connecting guide block and the protective guide block, respectively. Stabilizing slip rings are bolted to the top and bottom ends of the movable rings. A stabilizing ring groove is formed inside the mounting groove at the relative position of the stabilizing slip ring, and the stabilizing slip ring is slidably connected to the inside of the stabilizing ring groove.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. In the process of using this invention, the moving grinding mechanism is activated by the stretching mechanism, and the speed change mechanism is activated by the moving grinding mechanism. In case of an unexpected situation, when the grinding end moves upward, the rotation speed of the grinding end will gradually decrease, which increases the protection capability of the silicon wafer in case of an unexpected situation. This avoids the situation where the grinding end rotates at a high speed during the grinding process, which could damage the silicon wafer. In addition, if an abnormality occurs during the grinding process, the abnormality protection mechanism will be triggered, which will protect the grinding work immediately and stop the grinding work. At the same time, the grinding end and the silicon wafer are protected to prevent abnormalities from occurring during the grinding process and the staff not being able to detect the problem in time, which could lead to damage to the silicon wafer due to grinding negligence.

[0022] 2. This invention simultaneously activates the transmission processing mechanism through the moving grinding mechanism, directly cleaning away the debris that falls around the bottom of the placement slot cavity. This increases the stability and protection during the grinding process, preventing a large amount of debris from getting into the gap between the silicon wafer and the placement slot during grinding. As the debris accumulates, it will squeeze the silicon wafer, causing it to shift or fall into the placement slot and not be cleaned up in time. This results in the silicon wafer not being placed evenly, causing the silicon wafer to fail to meet the qualified standards in the later processing, and requiring rework.

[0023] 3. This invention uses a guide port to direct the airflow from the fan head to the outside of the silicon wafer, preventing damage caused by excessive temperature during processing. It can also remove impurities adhering to the bottom of the silicon wafer. Previously, replacing silicon wafers required either external tools or manual removal, significantly reducing processing efficiency. The lifting mechanism makes replacement much faster, eliminating the need for any tools and greatly reducing limitations during processing and replacement. It also prevents the need for external tools and maintains high efficiency during replacement. Attached Figure Description

[0024] Figure 1 A three-dimensional structural schematic diagram is provided for embodiments of the present invention;

[0025] Figure 2 This is a structural diagram of the body disposal mechanism inside the working frame provided in an embodiment of the present invention;

[0026] Figure 3 A three-dimensional structural diagram of a stable slide rail provided in an embodiment of the present invention;

[0027] Figure 4 This is a three-dimensional structural diagram of the movable placement plate provided in an embodiment of the present invention;

[0028] Figure 5 This is a three-dimensional structural diagram of the grinding disc provided in an embodiment of the present invention;

[0029] Figure 6 This is a cross-sectional view of the inside of the trigger cylinder provided in an embodiment of the present invention;

[0030] Figure 7 This is a cross-sectional view of the placement slot provided in an embodiment of the present invention;

[0031] Figure 8 Provided for embodiments of the present invention Figure 3 Enlarged structural diagram at point A in the middle;

[0032] Figure 9 Provided for embodiments of the present invention Figure 7 Enlarged structural diagram at point B.

[0033] In the diagram: 1. Working base frame; 2. Speed ​​change mechanism; 201. Conductor coil; 202. Mounting slot; 203. Elastic top bar; 204. Mounting slot; 205. Elastic guide block; 3. Tensioning mechanism; 301. Single-phase motor; 302. Mounting frame head; 303. Collecting roller; 304. Pull rope; 305. Wire frame; 306. Fixing spring; 4. Cleaning mechanism; 401. Collecting tube; 402. Collecting bag; 403. Blower; 5. Placement mechanism; 501. Operation panel; 502. Movable placement plate; 503. Limiting suction cup; 504. Placement slot; 6. Moving grinding mechanism; 601. Rotating motor; 602. Fixing frame; 603. Grinding disc; 604. Stabilizing slide rail; 605. Stabilizing slide; 606. Stabilizing slider; 607. Stabilizing ring shaft; 7. Transmission processing mechanism; 701. Movable ring; 702. Fan head; 703. Mounting bottom groove; 704. Air jet inlet; 705. Magnetic block; 706. Gear; 707. Transmission rod; 708. Transmission belt; 709. Tooth block; 8. Abnormal protection mechanism; 801. Trigger cylinder; 802. Movable block; 803. Connecting airbag; 804. Mounting ring sleeve; 805. Contact guide block; 806. Ejector pin; 807. Protective guide block; 808. Zinc bar; 9. Stabilizing slip ring; 10. Working frame; 11. Contact guide ring; 12. Connecting guide block; 13. Magnetic ring; 14. Ejector rod; 15. Ejector spring; 16. Contact ring; 17. Movable top ring; 18. Movable ring groove; 19. Annular slide bar; 20. Annular slide groove. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Example 1:

[0036] Please see Figure 1-5 and Figure 9 This embodiment provides a technical solution: a pull-type stable grinding silicon wafer grinding device, including a working base frame 1, a working frame 10 is installed on the top of the working base frame 1 by bolts, and the silicon wafer grinding device also includes a stretching mechanism 3, a cleaning mechanism 4, a placement mechanism 5, and a moving grinding mechanism 6.

[0037] The tensioning mechanism 3 includes a single-phase motor 301 and a mounting frame head 302. The mounting frame head 302 is bolted to the middle of the top of the working frame 10, and the single-phase motor 301 is bolted to the top of the mounting frame head 302.

[0038] The cleaning mechanism 4 includes a collection pipe 401, which is bolted to the middle left side of the working frame 10.

[0039] The placement mechanism 5 includes an operation plate 501, a movable placement plate 502, and a limiting suction cup 503. The movable placement plate 502 is movably placed at the bottom of the inner cavity of the work frame 10. The operation plate 501 is installed on the right side of the movable placement plate 502 by bolts. The two limiting suction cups 503 are respectively set on both sides of the top of the movable placement plate 502.

[0040] The mobile grinding mechanism 6 includes two rotating motors 601 and a fixed frame 602. The fixed frame 602 is movably installed in the middle of the inner cavity of the working frame 10, and the two rotating motors 601 are installed at both ends of the fixed frame 602.

[0041] Two movable annular grooves 18 are respectively formed at the top of the limiting suction cup 503. A movable top ring 17 is movably installed inside the movable annular groove 18. Several ejector rods 14 are equidistantly installed around the bottom of the movable top ring 17. Several connecting recesses are formed at the bottom of the limiting suction cup 503. Ejector springs 15 are bolted to the bottom of the ejector rods 14 and the top of the connecting recesses. A contact ring 16 is movably installed at the top of the movable top ring 17. An annular slide groove 20 is formed at the top of the movable top ring 17. An annular slide bar 19 is movably installed inside the annular slide groove 20. The top of the annular slide bar 19 is bolted to the bottom of the contact ring 16. A guide port is formed in the middle of the limiting suction cup 503. When the fan head 702 rotates, the air from the fan head 702 is blown to the outside of the silicon wafer through the guide port, preventing damage to the silicon wafer due to excessive temperature during processing. This also allows for… To remove impurities adhering to the top of the silicon wafer from the bottom, when the silicon wafer is placed at the top of the limiting suction cup 503, the weight of the silicon wafer itself drives the movable top ring 17 and the ejector rod 14 to move downwards, stretching the ejector spring 15. When the position of the silicon wafer needs to be adjusted, the silicon wafer is rotated to drive the annular slide bar 19 to slide within the annular slide groove 20, thus rotating and adjusting the silicon wafer. After polishing, the silicon wafer loses pressure, and the stretched ejector spring 15 drives the silicon wafer to move upwards, making replacement more convenient and avoiding placement inside the placement slot 504. When replacing, either external tools or manual removal of the silicon wafer are required, greatly reducing processing efficiency. Moreover, replacement by lifting is faster and does not require any tools, greatly reducing the limitations of processing and replacement.

[0042] In addition, see details Figure 2 The tensioning mechanism 3 also includes a collecting roller 303, a pull rope 304, a guide frame 305, and a fixing spring 306. The collecting roller 303 is movably installed in the inner cavity of the mounting frame head 302. The bottom end of the single-phase motor 301 passes through the mounting frame head 302 and is connected to the top end of the collecting roller 303 by bolts. The pull rope 304 is movably wound around the outside of the collecting roller 303. The two guide frames 305 are respectively installed at the bottom end of the middle of both sides of the mounting frame head 302 by bolts. The end of the pull rope 304 away from the collecting roller 303 passes through the inside of the guide frame 305 and extends into the inside of the working frame 10. The two fixing springs 306 are respectively installed at the middle of both sides of the top end of the inner cavity of the working frame 10 by bolts.

[0043] The pull rope 304 is a double-strand pull rope. Movable through holes are provided at the bottom center of both sides of the mounting frame head 302 and at the top of both sides of the working frame 10, respectively, relative to the pull rope 304. The control panel is installed on the upper front side of the working bottom frame 1 by bolts. The single-phase motor 301 and the rotating motor 601 are electrically connected to the control panel by wires, and an alarm is installed on the outside of the control panel.

[0044] The cleaning mechanism 4 also includes a collection bag 402 and a blower 403. The collection bag 402 is bolted to the end of the collection pipe 401 away from the working frame 10. The blower 403 is bolted to the middle right side of the working frame 10. The blower 403 is electrically connected to the control panel. Both sides of the working frame 10 have exhaust vents in the middle.

[0045] See details Figure 2 , Figure 4 The placement mechanism 5 also includes placement slots 504 and transmission processing mechanisms 7. The placement slots 504 are located at the middle of the top sides of the movable placement plate 502. The movable placement plate 502 has a rectangular structure. An operation through slot is provided at the bottom right side of the working frame 10. The placement slots 504 and the limiting suction cups 503 are both circular in top view. The two transmission processing mechanisms 7 are respectively movably installed at the upper end of the inner cavity of the placement slots 504. The limiting suction cups 503 are both located inside the placement slots 504.

[0046] Example 2:

[0047] Based on the aforementioned Embodiment 1, see details. Figure 7The transmission mechanism 7 includes a movable ring 701, a fan head 702, a mounting base 703, an air inlet 704, a magnetic block 705, a gear 706, a transmission rod 707, a transmission belt 708, and a toothed block 709. The mounting base 703 is located at the bottom of the inner cavity of the placement slot 504. The movable ring 701 is movably mounted on the upper end of the inner cavity of the mounting base 703. Several magnetic blocks 705 are spot-welded to the periphery of the inner cavity of the movable ring 701. Two fan heads 702 are mounted at the bottom of the inner cavity of the mounting base 703 via rotating shafts. Two transmission rods 707 are mounted on both sides via bearings. The mounting base 703 has gears 706 bolted to the top of the transmission rod 707 in the middle of the opposite side of the inner cavity. Several air vents 704 are formed around the top of the inner cavity of the mounting base 703. Several tooth blocks 709 are welded to the outer periphery of the movable ring 701. The gears 706 mesh with the tooth blocks 709 and the tooth grooves formed by the tooth blocks 709. Rollers are bolted to the bottom of the transmission rod 707 and the bottom of the rotating shaft. Two transmission belts 708 are movably mounted between the outer sides of the rollers. Thus, when the grinding disc 603 moves downward, it moves to... When the upper end of the inner cavity of the slot 504 is placed, the magnetic ring 13 around the outside of the grinding disc 603 and the magnetic block 705 around the inner cavity of the movable ring 701 are magnetically attracted, causing the movable ring 701 to rotate. When the movable ring 701 rotates, the meshing of the toothed block 709 around the outside of the movable ring 701 and the gear 706 will drive the gear 706 to rotate. The gear 706 will drive the transmission rod 707 to rotate. Since the transmission belt 708 is installed between the transmission wheels on both sides, the transmission wheels on both sides rotate simultaneously, which will drive the fan head 702 to rotate. The rotation of the fan head 702 generates airflow, and the airflow... Air is blown through the jet nozzle 704 to the bottom perimeter of the placement slot 504, directly cleaning up the debris that falls around the bottom perimeter of the placement slot 504. This increases stability and protection during the polishing process, preventing a large amount of debris from getting into the gap between the silicon wafer and the placement slot 504. As the debris accumulates, it will compress the silicon wafer, causing it to shift or fall into the placement slot 504 and not be cleaned up in time. This results in uneven placement of the silicon wafer, causing the silicon wafer to fail to meet the standards after processing.

[0048] The mobile grinding mechanism 6 also includes a grinding disc 603, a stabilizing slide rail 604, a stabilizing carriage 605, a stabilizing slider 606, a stabilizing ring shaft 607, an abnormal protection mechanism 8, and a speed change mechanism 2. The four stabilizing slide rails 604 are bolted to the front and rear ends of both sides of the inner cavity of the working frame 10. The two stabilizing carriages 605 are bolted to the upper middle part of the opposite side of the rotating motors 601 on both sides. The four stabilizing sliders 606 are bolted to the front and rear ends of the opposite side of the stabilizing carriages 605 on both sides. All stabilizing sliders 606 are slidably connected to the inside of the stabilizing slide rails 604. The bottom end of the pull rope 304 is bolted to the top of the rotating motor 601 and the fixed frame 602. The two grinding discs 603 are bolted to the bottom end of the rotating motor 601. The two abnormal protection mechanisms 8 are bolted to the top right of the grinding disc 603. The speed change mechanism 2 is movably installed on the left side of the inner cavity of the stabilizing slide rail 604 at the left front end. The two stabilizing ring shafts 607 are bolted to the bottom of the outside of the rotating motor 601. The bottom of the stabilizing ring shafts 607 is bolted to the top of the grinding disc 603. Magnetic rings 13 are bolted to the outer perimeter of the two grinding discs 603. In this way, the fixed spring 306 pushes the rotating motor 601 to move downward, and at the same time, the rotating motor 601 drives the grinding disc 603 to rotate, which in turn drives the fixed frame 602 and the stabilizing slide rail 605 to move downward. This will drive the stabilizing slider 606 to slide towards the bottom of the inside of the stabilizing slide rail 604, increasing the stability of the rotating motor 601 during movement.

[0049] Example 3:

[0050] Based on the aforementioned Embodiment 2, combined with Figure 8 As shown, the speed-changing mechanism 2 includes a guide coil 201, a mounting slot 202, elastic top bars 203, a mounting opening 204, and elastic guide blocks 205. The mounting slot 202 is located in the middle left side of the inner cavity of the stabilizing slide rail 604. The guide coil 201 is bolted to the inside of the mounting slot 202, and the bottom end of the guide coil 201 is electrically connected to the rotating motors 601 on both sides. The mounting opening 204 is located in the middle left side of the stabilizing slider 606. Several elastic top bars 203 are bolted to the right side of the inner cavity of the mounting opening 204, and elastic guide blocks 205 are bolted to the left side of the elastic top bars 203, with the elastic guide blocks 205 located away from the mounting slot. One side of the opening 204 contacts the outside of the conductor coil 201, and the elastic guide block 205 is electrically connected to the rotating motor 601. When the stabilizing slider 606 on the left moves downward, it will drive the elastic guide block 205 to move downward. As the elastic guide block 205 slides against the outside of the conductor coil 201 when it moves downward, the distance between the elastic guide block 205 and the bottom of the conductor coil 201 is shortened, and the resistance of the rotating motor 601 is reduced, increasing the rotation speed of the grinding disc 603. When the elastic guide block 205 moves upward, the distance between the elastic guide block 205 and the bottom of the conductor coil 201 is increased, and the resistance of the rotating motor 601 is increased, reducing the rotation speed of the rotating motor 601.

[0051] Example 4:

[0052] In conjunction with the above embodiment 2 or embodiment 3, and in combination with Figure 5 , Figure 6 As shown, the abnormal protection mechanism 8 includes a trigger cylinder 801, a movable block 802, a connecting airbag 803, a mounting ring 804, a contact guide block 805, a ejector pin 806, a protective guide block 807, and a zinc strip 808. The trigger cylinder 801 is bolted to the right side of the top of the grinding disc 603. The zinc strip 808 is installed at the bottom of the inner cavity of the trigger cylinder 801, and the bottom end of the zinc strip 808 is connected to the grinding layer at the bottom of the grinding disc 603. The movable block 802 is movably mounted on the top of the zinc strip 808. Two protective guide blocks 807 are respectively mounted on the movable block 805. The top of block 802 and the top of the inner cavity of trigger cylinder 801, the upper and lower protective guide blocks 807 are electrically connected to the alarm. Two connecting airbags 803 are bolted to the middle of one side of the inner cavity of trigger cylinder 801 on both sides. Two mounting rings 804 are bolted to the bottom of the middle of one side of trigger cylinder 801. Connecting rods are glued to the bottom of each connecting airbag 803. Contact guide blocks 805 on both sides are bolted to the bottom of the connecting rods and one side of the inner cavity of trigger cylinder 801 respectively. The contact guide blocks 805 are in contact with each other. The contact block 805 is electrically connected to the rotating motor 601. When an abnormality occurs during the grinding process of the grinding disc 603, the temperature of the grinding disc 603 increases, causing the zinc bar 808 to expand. This expansion pushes the movable block 802 upwards, bringing it into contact with the protective guide block 807 and triggering an alarm to alert the operator that the grinding disc 603 is malfunctioning and requires immediate attention. The expansion of the zinc bar 808 also pushes the ejector pin 806 upwards, bringing it into contact with the connecting airbag 803, directly piercing the zinc bar. When the airbag 803 breaks, the contact guide block 805 on one side loses its restraint and moves downward, causing the contact guide blocks 805 on both sides to separate from each other. This directly disconnects the circuit of the rotating motor 601, causing the rotating motor 601 to stop working. In the event of an abnormality in the polishing disc 603, it will immediately protect the polishing work and stop the polishing process. At the same time, it will protect the polishing end and the silicon wafer to prevent abnormalities from occurring during the polishing process. If the staff cannot detect the problem in time, it may lead to damage to the silicon wafer due to polishing negligence.

[0053] Contact guide rings 11 are bolted to the upper ends of the inner cavities of the two stabilizing ring shafts 607. A connecting guide block 12 is bolted to the bottom end of one side of the rotating motor 601. The connecting guide block 12 contacts the contact guide rings 11. The connecting guide block 12 and the contact guide rings 11 are electrically connected to the contact guide block 805 and the protection guide block 807, respectively. Stabilizing slip rings 9 are bolted to the top and bottom ends of the movable ring 701. A stabilizing ring groove is opened inside the mounting groove 703 at the relative position of the stabilizing slip ring 9. The stabilizing slip ring 9 is slidably connected to the inside of the stabilizing ring groove. In this way, the connecting guide block 12 is always in contact with the contact guide ring 11 when rotating, ensuring that power can be supplied to the contact guide block 806 and the protection guide block 807. When the movable ring 701 rotates, it will drive the stabilizing slip ring 9 to rotate. The rotation of the stabilizing slip ring 9 increases the stability of the movable ring 701 when rotating.

[0054] Working principle: During use, the silicon wafer is placed into the placement slot 504, so that the bottom surface of the silicon wafer contacts and is fixed by the top of the limiting suction cup 503. The movable placement plate 502 is moved into the working frame 10. Then, the single-phase motor 301 is started to drive the collecting roller 303 to rotate, so that the pull rope 304 is relaxed and the rotating motors 601 on both sides are freed from restraint. The fixed spring 306 pushes the rotating motors 601 to move downward. At the same time, the rotating motors 601 are started to drive the grinding disc 603 to rotate. Furthermore, the downward movement of the fixed bracket 602 and the stabilizing slide 605 causes the stabilizing slider 606 to slide towards the bottom of the stabilizing slide rail 604, increasing the stability of the rotating motor 601 during movement. The bottom of the grinding disc 603 contacts the top of the silicon wafer for grinding. As the stabilizing slider 606 on the left moves downward, it causes the elastic guide block 205 to move downward. Because the elastic guide block 205 slides against the outside of the conductor coil 201 as it moves downward, the distance between the elastic guide block 205 and the bottom of the conductor coil 201 is shortened, reducing... The resistance of the rotating motor 601 increases the rotational speed of the grinding disc 603. In case of an unexpected situation during grinding, the operator can activate the single-phase motor 301 via the control panel to rotate the collecting roller 303, collecting the pull rope 304. This also causes the fixed frame 602 and the rotating motors 601 on both sides to move upwards, which in turn moves the elastic guide block 205 upwards, increasing the distance between the elastic guide block 205 and the bottom of the guide coil 201, increasing the resistance of the rotating motor 601, reducing the rotational speed of the rotating motor 601, and... The elasticity of the elastic top strip 203 increases the fit between the elastic guide block 205 and the guide coil 201, avoiding poor contact during movement. During the stretching and polishing process, the rotation speed of the polishing end gradually increases when it moves downward. When it moves upward in case of an accident, the rotation speed of the polishing end gradually decreases, increasing the protection capability of the silicon wafer in case of an accident. This prevents the polishing end from maintaining a high rotation speed during the polishing process when it moves upward for protection, thus avoiding damage to the silicon wafer.

[0055] When an abnormality occurs during the grinding process, the temperature of the grinding disc 603 will rise, causing the zinc bar 808 to expand and push the movable block 802 upward. This causes the protective guide block 807 to come into contact, triggering an alarm to notify the staff that the grinding disc 603 has malfunctioned and requires immediate attention. When the zinc bar 808 expands, it pushes the ejector pin 806 upward, causing it to come into contact with the connecting airbag 803. This directly punctures the connecting airbag 803, causing one side of the contact guide block 805 to lose its restraint and move downward. This causes the two contact guide blocks 805 to separate from each other, directly disconnecting the circuit of the rotating motor 601 and stopping the rotating motor 601 from working. When an abnormality occurs in the grinding disc 603, protection is activated immediately, stopping the grinding work. At the same time, the grinding end and silicon wafer are protected to prevent abnormalities from occurring during the grinding process. If the staff fails to detect the problem in time, it could lead to damage to the silicon wafer due to grinding negligence.

[0056] Simultaneously, as the grinding disc 603 moves downwards and reaches the upper end of the inner cavity of the placement slot 504, the magnetic ring 13 around the outer periphery of the grinding disc 603 and the magnetic block 705 around the inner cavity of the movable ring 701 are magnetically attracted, causing the movable ring 701 to rotate. When the movable ring 701 rotates, the meshing of the toothed block 709 around the outer periphery of the movable ring 701 with the gear 706 drives the gear 706 to rotate. The gear 706 then drives the transmission rod 707 to rotate. Since a transmission belt 708 is installed between the transmission wheels on both sides, the transmission wheels on both sides rotate simultaneously, which drives the fan head 702 to rotate. The rotation of the fan head 702 generates airflow. Air is blown through the jet nozzle 704 to the bottom perimeter of the placement slot 504, directly cleaning away debris that falls around the bottom perimeter of the placement slot 504. This increases stability and protection during the polishing process, preventing a large amount of debris from accumulating in the gap between the silicon wafer and the placement slot 504. As the debris accumulates, it will compress the silicon wafer, causing it to shift or fall into the placement slot 504 and not be cleaned up in time. This results in uneven placement of the silicon wafer, causing the wafer to fail to meet the standards after processing and requiring rework.

[0057] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0058] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pull-type stable grinding silicon wafer grinding device, comprising a working base frame (1), wherein a working frame (10) is mounted on the top of the working base frame (1), characterized in that, Also includes: The tensioning mechanism (3) includes a single-phase motor (301) and a mounting frame head (302). The mounting frame head (302) is bolted to the middle of the top of the working frame (10), and the single-phase motor (301) is mounted on the top of the mounting frame head (302). The cleaning mechanism (4) includes a collection pipe (401) which is installed in the middle left side of the work frame (10); The placement mechanism (5) includes an operation plate (501), a movable placement plate (502), and a limiting suction cup (503). The movable placement plate (502) is movably placed at the bottom of the inner cavity of the working frame (10). The operation plate (501) is installed on the right side of the movable placement plate (502) by bolts. The two limiting suction cups (503) are respectively set on both sides of the top of the movable placement plate (502). The mobile grinding mechanism (6) includes two rotating motors (601) and a fixed frame (602). The fixed frame (602) is movably installed in the middle of the inner cavity of the working frame (10), and the two rotating motors (601) are installed at both ends of the fixed frame (602). Two movable annular grooves (18) are respectively opened at the top of the limiting suction cup (503). A movable top ring (17) is movably installed inside the movable annular groove (18). Several top rods (14) are equidistantly installed around the bottom of the movable top ring (17). Several connecting recesses are opened at the bottom of the limiting suction cup (503). A top spring (15) is installed between the bottom of the top rod (14) and the top of the inner cavity of the connecting recess by bolts. A contact ring (16) is movably installed at the top of the movable top ring (17). An annular sliding groove (20) is opened at the top of the movable top ring (17). An annular slide bar (19) is movably installed inside the annular sliding groove (20). The top of the annular slide bar (19) is connected to the bottom of the contact ring (16) by bolts. The placement mechanism (5) also includes a placement slot (504) and a transmission processing mechanism (7). The placement slots (504) on both sides are opened in the middle of the top two sides of the movable placement plate (502). The movable placement plate (502) has a rectangular structure. An operation through slot is opened at the bottom right side of the working frame (10). The placement slot (504) and the limiting suction cup (503) are both circular in top view. The two transmission processing mechanisms (7) are respectively movably installed on the upper end of the inner cavity of the placement slot (504). The limiting suction cup (503) is located inside the placement slot (504). The transmission mechanism (7) includes a movable ring (701), a fan head (702), a mounting groove (703), an air jet inlet (704), a magnetic block (705), a gear (706), a transmission rod (707), a transmission belt (708), and a toothed block (709). The mounting groove (703) is located at the bottom of the inner cavity of the placement slot (504). The movable ring (701) is movably mounted on the upper end of the inner cavity of the mounting groove (703). Several magnetic blocks (705) are respectively spot-welded to the periphery of the inner cavity of the movable ring (701). Two fan heads (702) are respectively mounted on the bottom end of the inner cavity of the mounting groove (703) via rotating shafts. Two transmission rods (706) 707) are respectively installed in the middle of the opposite side of the inner cavity of the mounting base groove (703) on both sides by bearings. The gears (706) on both sides are respectively installed on the top of the transmission rod (707) by bolts. Several air jet ports (704) are opened around the top of the inner cavity of the mounting base groove (703). Several tooth blocks (709) are installed around the outside of the movable ring (701) by welding. The gears (706) on both sides mesh with the tooth blocks (709) and the tooth grooves formed by the tooth blocks (709). The bottom end of the transmission rod (707) and the bottom end of the rotating shaft are both installed with pulleys by bolts. The two transmission belts (708) are respectively movably installed between the outside of the pulleys on both sides.

2. The silicon wafer grinding device with pull-up type and stable grinding capability according to claim 1, characterized in that: The tensioning mechanism (3) further includes a collecting roller (303), a pull rope (304), a guide frame (305), and a fixing spring (306). The collecting roller (303) is movably installed in the inner cavity of the mounting frame head (302). The bottom end of the single-phase motor (301) passes through the mounting frame head (302) and is connected to the top end of the collecting roller (303) by bolts. The pull rope (304) is movably wound around the outside of the collecting roller (303). The two guide frames (305) are respectively installed at the bottom end of the middle of both sides of the mounting frame head (302) by bolts. The end of the pull rope (304) away from the collecting roller (303) passes through the inside of the guide frame (305) and extends into the inside of the working frame (10). The two fixing springs (306) are respectively installed at the middle of both sides of the top end of the inner cavity of the working frame (10) by bolts.

3. The silicon wafer grinding device for stable grinding by pulling up as described in claim 2, characterized in that: The pull rope (304) is a double-strand pull rope. Movable through holes are provided at the bottom middle of both sides of the mounting frame head (302) and at the top of both sides of the working frame (10) relative to the pull rope (304). The control panel is installed on the upper front side of the working bottom frame (1) by bolts. The single-phase motor (301) and the rotating motor (601) are electrically connected to the control panel by wires respectively. An alarm is installed on the outside of the control panel.

4. The silicon wafer grinding device for stable grinding by pulling up as described in claim 3, characterized in that: The cleaning mechanism (4) also includes a collection bag (402) and a blower (403). The collection bag (402) is bolted to the end of the collection pipe (401) away from the working frame (10). The blower (403) is bolted to the middle right side of the working frame (10). The blower (403) is electrically connected to the control panel. Both sides of the working frame (10) have exhaust vents.

5. The silicon wafer grinding device for stable grinding by pulling up as described in claim 2, characterized in that: The mobile grinding mechanism (6) further includes a grinding disc (603), a stabilizing slide rail (604), a stabilizing carriage (605), a stabilizing slider (606), a stabilizing ring shaft (607), an abnormal protection mechanism (8), and a speed change mechanism (2). The four stabilizing slide rails (604) are respectively bolted to the front and rear ends of the inner cavity of the working frame (10). The two stabilizing carriages (605) are bolted to the upper middle part of the opposite side of the rotating motors (601) on both sides. The four stabilizing sliders (606) are bolted to the front and rear ends of the opposite side of the stabilizing carriages (605) on both sides. The stabilizing sliders (606) are all slidably connected to the inside of the stabilizing slide rails (604). The bottom end of the pull rope (304) is connected to the top of the rotating motor (601) and the fixed frame (602) by bolts. The two grinding discs (603) are installed at the bottom of the rotating motor (601) by bolts. The abnormal protection mechanisms (8) on both sides are installed on the right side of the top of the grinding disc (603) by bolts. The speed change mechanism (2) is movably installed on the left side of the inner cavity of the stabilizing slide rail (604) at the front left side. The two stabilizing ring shafts (607) are respectively installed at the bottom of the outside of the rotating motor (601) by bolts. The bottom end of the stabilizing ring shaft (607) is connected to the top of the grinding disc (603) by bolts. Magnetic rings (13) are installed around the outside of the grinding discs (603) on both sides by bolts.

6. The silicon wafer grinding device for stable grinding by pulling up as described in claim 5, characterized in that: The speed change mechanism (2) includes a guide coil (201), a mounting slot (202), an elastic top bar (203), a mounting opening (204), and an elastic guide block (205). The mounting slot (202) is located in the middle left side of the inner cavity of the stabilizing slide rail (604). The guide coil (201) is installed inside the mounting slot (202) by bolts. The bottom end of the guide coil (201) is electrically connected to the rotating motors (601) on both sides. The mounting opening (204) is located in the middle left side of the stabilizing slider (606). Several elastic top bars (203) are installed on the right side of the inner cavity of the mounting opening (204) by bolts. The elastic guide block (205) is installed on the left side of the elastic top bar (203) by bolts. The side of the elastic guide block (205) away from the mounting opening (204) is in contact with the outside of the guide coil (201). The elastic guide block (205) is electrically connected to the rotating motor (601).

7. The silicon wafer grinding apparatus for stable grinding by pulling up as described in claim 5, characterized in that: The abnormal protection mechanism (8) includes a trigger cylinder (801), a movable block (802), a connecting airbag (803), a mounting ring (804), a contact guide block (805), a ejector pin (806), a protective guide block (807), and a zinc strip (808). The trigger cylinder (801) is bolted to the right side of the top of the grinding disc (603). The zinc strip (808) is installed at the bottom of the inner cavity of the trigger cylinder (801), and the bottom end of the zinc strip (808) is connected to the grinding layer at the bottom of the grinding disc (603). The movable block (802) is movably installed at the top of the zinc strip 808. The two protective guide blocks (807) are respectively installed at the top of the movable block (802) and the top of the zinc strip 808. The upper and lower protective guide blocks (807) at the top of the inner cavity of the trigger cylinder (801) are electrically connected to the alarm. The two connecting airbags (803) are installed in the middle of one side of the inner cavity of the trigger cylinder (801) by bolts. The two mounting rings (804) are installed in the bottom of the middle of one side of the trigger cylinder (801) by bolts. The bottom of each connecting airbag (803) is attached with a connecting rod by adhesive. The two contact guide blocks (805) are respectively installed in the bottom of the connecting rod and one side of the inner cavity of the trigger cylinder (801) by bolts. The contact guide blocks (805) are in contact with each other. The two contact guide blocks (805) are electrically connected to the rotating motor (601).

8. The silicon wafer grinding device for stable grinding by pulling up as described in claim 5, characterized in that: The upper end of the inner cavity of the two sides of the stabilizing ring shaft (607) is respectively bolted with a contact guide ring (11). The bottom end of the rotating motor (601) is bolted with a connecting guide block (12). The connecting guide block (12) contacts the contact guide ring (11). The connecting guide block (12) and the contact guide ring (11) are electrically connected to the contact guide block (805) and the protection guide block (807) respectively. The top and bottom ends of the movable ring (701) are bolted with stabilizing slip rings (9). The mounting bottom groove (703) is provided with a stabilizing ring groove at the relative position of the stabilizing slip ring (9). The stabilizing slip ring (9) is slidably connected to the inside of the stabilizing ring groove.

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