Apparatus and method for processing hydrophilic structure on surface of transparent hard and brittle material

Abstract

The application discloses a device and a method for processing a hydrophilic structure on a transparent hard and brittle material surface, and comprises a magnetic field generator, a target material capable of generating plasma under irradiation of a laser beam, and a laser assembly for emitting the laser beam. The exit end of the laser assembly and the target material are arranged on the two sides of a transparent hard and brittle material sample along a laser beam emission path. A light spot of the laser beam emitted by the exit end passes through the transparent hard and brittle material sample and is focused on the surface of the target material close to the transparent hard and brittle material sample. The target material and the transparent hard and brittle material sample are both located in a magnetic field generated by the magnetic field generator. The magnetic induction lines of the magnetic field are perpendicular to the surface of the target material and extend in the same direction as the laser beam. The processing cost is low, the operation is simple, the process is simple, large-scale application can be easily realized, and higher processing quality and faster processing rate are ensured.

Description

Technical Field

[0001] This invention relates to the field of laser micromachining technology, and in particular to an apparatus and method for machining hydrophilic structures on the surface of transparent, hard, and brittle materials. Background Technology

[0002] Fabricating hydrophilic structures on the surface of transparent, hard, and brittle materials can endow them with self-cleaning and anti-fogging functions, which has significant application value in fields such as submarines and aerospace. Furthermore, a smaller contact angle is more conducive to improving the material's self-cleaning and anti-fogging capabilities. Currently, there are many methods for preparing hydrophilic surfaces, such as the solid-drop method, mask method, and chemical etching. However, these methods generally suffer from drawbacks such as high cost, complex processes, and environmental pollution, which limits their large-scale industrial applications.

[0003] This invention proposes a method for fabricating hydrophilic structures on the surface of transparent, hard, and brittle materials using a longitudinal magnetic field-assisted laser-induced plasma. This method utilizes a laser that passes through the transparent, hard, and brittle material sample and is focused onto a target surface below the sample, generating high-temperature, high-pressure plasma. The plasma impacts the back of the transparent, hard, and brittle material, etching a dense microstructure. This processing method requires laser energy below the ablation threshold of the transparent, hard, and brittle material, and the lower laser energy avoids problems such as microcracks and micro-chipping caused by direct laser ablation. When a longitudinal magnetic field is applied, charged particles in the plasma parallel to the magnetic field direction are unaffected, while charged particles in other directions undergo helical motion due to the Lorentz force. Furthermore, as the particle moves upwards and further from the magnet surface, the magnetic field strength weakens, the Lorentz force decreases, and the radius of the circular motion increases. When a longitudinal magnetic field is applied, the particles undergo an upward spiral motion. Compared to the linear motion without a magnetic field, this increases the distance they travel to reach the back of the transparent, hard, and brittle material. During this journey, the particles' velocity decreases due to air resistance, resulting in a lower impact velocity upon reaching the back of the material. This reduces the mechanical impact force on the transparent, hard, and brittle material, leading to a lower etching depth. Some particles, due to their low velocity, adhere to the surface of the transparent, hard, and brittle material, forming sputterings. Therefore, increasing the longitudinal magnetic field increases the number of micro / nano sputtered particles on the back of the transparent, hard, and brittle material, expands the sputtering area, and reduces the etching depth. The shallower etching depth and the large number of micro / nano particles significantly reduce the contact angle of the transparent, hard, and brittle material, increasing its hydrophilicity. Summary of the Invention

[0004] The purpose of this invention is to provide an apparatus and method for processing hydrophilic structures on the surface of transparent, hard, and brittle materials, so as to solve the problems existing in the prior art. It has low processing cost, simple operation, simple process, is easy to implement on a large scale, and ensures higher processing quality and faster processing speed.

[0005] To achieve the above objectives, the present invention provides the following solution: The present invention provides an apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material, comprising a magnetic field generator, a target material capable of generating plasma under laser beam irradiation, and a laser assembly for emitting a laser beam. The emitting end of the laser assembly and the target material are spaced apart on both sides of the transparent, hard, and brittle material sample along the laser beam emission path. The laser beam emitted by the emitting end passes through the transparent, hard, and brittle material sample and is focused on the surface of the target material near the transparent, hard, and brittle material sample. Both the target material and the transparent, hard, and brittle material sample are located in the magnetic field generated by the magnetic field generator. The magnetic field lines of the magnetic field are perpendicular to the surface of the target material and extend in the same direction as the laser beam.

[0006] Preferably, the magnetic field generator is a magnet located on the side of the target material away from the transparent hard and brittle material sample, with the N pole of the magnet facing the target material.

[0007] Preferably, the magnet is equipped with a worktable, the top of the worktable is provided with a support plane parallel to the horizontal plane, the magnet is placed on the support plane, the target material is placed on top of the magnet, and the transparent hard and brittle material sample and the emission end are arranged sequentially above the target material from bottom to top.

[0008] Preferably, the transparent hard and brittle material sample is equipped with a sample clamp, which includes a clamp base and a clamping part for clamping the transparent hard and brittle material sample. The clamping part is movably mounted on the clamp base in a direction parallel to the magnetic field lines.

[0009] Preferably, the sample base is movably provided with a support block in a direction parallel to the magnetic field lines, and the clamping part includes a pair of clamping arms mounted on the support block. The two clamping arms clamp the two sides of the transparent hard and brittle material sample and are movably mounted on the support block in a direction perpendicular to the movement of the support block. The support block and the clamping arms are each equipped with positioning elements that position them on the sample base and the support block, respectively.

[0010] Preferably, the laser assembly includes a laser, a beam expander, and a focusing field lens arranged sequentially along the laser beam transmission direction. The focusing field lens is located on the side of the transparent hard and brittle material sample away from the target material and is spaced apart from the transparent hard and brittle material sample.

[0011] Preferably, a scanning galvanometer is provided between the beam expander and the focusing field lens, and the focusing field lens is installed at the exit end of the scanning galvanometer.

[0012] Preferably, a plurality of reflectors are provided between the beam expander and the scanning galvanometer, and each of the reflectors is arranged sequentially along the laser beam transmission direction.

[0013] Preferably, the target material is made of non-ferromagnetic material.

[0014] A method for processing a device for processing a hydrophilic structure on the surface of a transparent, hard, and brittle material is also provided, comprising the following steps:

[0015] Sample installation: Install the sample fixture on the worktable, place the magnet with the N pole facing up on the support plane of the worktable, place the target on the magnet, and horizontally clamp the transparent hard and brittle material sample between the two clamping arms of the sample fixture. Adjust the height of the clamping arms to control the distance between the transparent hard and brittle material sample and the target.

[0016] Prepare the laser assembly: Prepare the laser assembly by passing the laser beam generated by the laser through the beam expander, each reflector, scanning galvanometer and focusing field lens in sequence, and then focusing the laser beam through the transparent hard and brittle material sample onto the target material.

[0017] Etching: The laser beam is controlled by the scanning galvanometer to etch the microstructure on the lower surface of the transparent, hard and brittle material sample.

[0018] Cleaning and drying: The processed transparent hard and brittle material sample is placed in a cleaning solution for ultrasonic cleaning and then blown dry to complete the processing of the transparent hard and brittle material sample.

[0019] The present invention achieves the following technical effects compared to the prior art:

[0020] Because the laser beam passes through the transparent, hard, and brittle material sample and focuses on the surface of the target near the sample, and both the target and the sample are located within the magnetic field generated by the magnetic field generator, the magnetic field lines are perpendicular to the target surface and extend in the same direction as the laser beam. This provides a longitudinal magnetic field to the plasma. When the laser ablates the target, it induces plasma, which, with the assistance of the longitudinal magnetic field, impacts the back of the transparent, hard, and brittle material sample. Simultaneously, the longitudinal magnetic field can be used to control the trajectory of the laser-induced plasma, achieving material removal through the synergistic effect of thermal and mechanical energy. Large-area microstructures are fabricated on the back of the transparent, hard, and brittle material, allowing a large number of micro- and nano-particles to adhere to it, thus achieving a hydrophilic effect. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the entire device structure of the present invention;

[0023] Figure 2 This is a scanning electron microscope image of a microgroove array structure etched on sapphire by laser-induced plasma under the assistance of a longitudinal magnetic field, using single-crystal silicon as the target material in this invention.

[0024] Figure 3 This is a scanning electron microscope image of the micro-nano particles on the surface of the microgroove array structure processed by the present invention, which uses single-crystal silicon as the target material and sapphire as the sample.

[0025] Figure 4 (a) is a surface contact angle measurement image of the original sapphire; 4(b) is a contact angle measurement image of the laser-induced plasma etching a microgroove array structure on sapphire under the assistance of a longitudinal magnetic field using single-crystal silicon as the target material in this invention.

[0026] Among them, 1-computer, 2-laser, 3-beam expander, 4-first reflecting mirror, 5-second reflecting mirror, 6-scanning galvanometer, 7-focusing field mirror, 8-transparent hard and brittle material sample, 9-target material, 10-magnet, 11-worktable, 12-sample clamp. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] The purpose of this invention is to provide an apparatus and method for processing hydrophilic structures on the surface of transparent, hard, and brittle materials, so as to solve the problems existing in the prior art. It has low processing cost, simple operation, simple process, is easy to implement on a large scale, and ensures higher processing quality and faster processing speed.

[0029] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] like Figures 1 to 4As shown, this embodiment provides an apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material. The apparatus includes a magnetic field generator, a target 9 capable of generating plasma under laser beam irradiation, and a laser 2 assembly for emitting the laser beam. The emitting end of the laser 2 assembly and the target 9 are spaced apart on both sides of a transparent, hard, and brittle material sample 8 along the laser beam emission path. The laser beam emitted from the emitting end passes through the transparent, hard, and brittle material sample 8 and is focused on the surface of the target 9 near the transparent, hard, and brittle material sample 8. Both the target 9 and the transparent, hard, and brittle material sample 8 are located in the magnetic field generated by the magnetic field generator. The magnetic field lines are perpendicular to the surface of the target 9 and extend in the same direction as the laser beam. Preferably, the magnetic field lines are parallel to the laser incident direction, that is, providing a longitudinal magnetic field to the plasma. In this process, the laser beam passes through the transparent hard and brittle material sample 8 and is focused on the surface of the target material 9 near the transparent hard and brittle material sample 8. During the laser ablation of the target material 9, high-temperature and high-pressure plasma is generated. With the assistance of the longitudinal magnetic field, the plasma impacts the back of the transparent hard and brittle material sample 8. Through the synergistic effect of thermal energy and mechanical energy, the material is removed, resulting in the formation of a large number of micro and nano particles on the back of the transparent hard and brittle material. The presence of these micro and nano particles greatly reduces the surface contact angle of the transparent hard and brittle material and increases its hydrophilicity.

[0031] Compared with existing hydrophilic surface manufacturing technologies, the processing apparatus and method of this invention have lower processing costs, simpler operation, simpler process, and are easier to implement on a large scale, ensuring higher processing quality and faster processing speed. It is a highly efficient, high-quality, and low-consumption micro-machining technology, providing a new approach for the efficient and high-quality processing of hydrophilic structures on the surfaces of transparent, hard, and brittle materials. In specific applications, the longitudinal magnetic field-assisted laser-induced plasma method proposed in this invention for processing hydrophilic structures on the surfaces of transparent, hard, and brittle materials can reduce the sapphire contact angle from the original 86° to 24°.

[0032] In a preferred embodiment of the present invention, the magnetic field generator is a magnet 10 located on the side of the target 9 away from the transparent hard and brittle material sample 8. The N pole of the magnet 10 is positioned towards the target 9 to provide a longitudinal magnetic field. The entire device has a simple structure. Further explanation is needed: under the control of the longitudinal magnetic field, the plasma undergoes a spiral motion. As it moves upwards, it is further from the surface of the magnet 10, resulting in a weaker magnetic field, a smaller Lorentz force, a larger radius of circular motion of the plasma, and greater divergence. Compared to the linear motion without an added magnetic field, the longitudinal magnetic field increases the path and divergence angle of the plasma to the back of the transparent hard and brittle material, thereby reducing the mechanical impact force of the plasma on the transparent hard and brittle material. This leads to a lower etching depth, and a large number of particles adhere to the back of the transparent hard and brittle material, forming micro- and nano-particles. The shallower etching depth and the large number of micro- and nano-particle attachments significantly reduce the contact angle of the transparent hard and brittle material, increasing its hydrophilicity.

[0033] Furthermore, the magnet 10 is equipped with a worktable 11. The top of the worktable 11 is provided with a support plane parallel to the horizontal plane. The magnet 10 is placed on the support plane, the target material 9 is placed on top of the magnet 10, and the transparent hard and brittle material sample 8 and the emission end are arranged sequentially above the target material 9 from bottom to top. By setting the worktable 11, a support carrier for the magnet 10 and other structures is formed, ensuring the stability during the working process.

[0034] Furthermore, the transparent hard and brittle material sample 8 is equipped with a sample clamp 12, which includes a clamp base and a clamping part for clamping the transparent hard and brittle material sample 8. The clamping part is movably mounted on the clamp base in a direction parallel to the magnetic field lines to adjust the distance between the transparent hard and brittle material sample 8 and the target material 9.

[0035] In a preferred embodiment of the present invention, a support block is movably provided on the sample base in a direction parallel to the magnetic field lines. The clamping part includes a pair of clamping arms mounted on the support block. The two clamping arms clamp the two sides of the transparent hard and brittle material sample 8 and are movably mounted on the support block in a direction perpendicular to the movement of the support block, so as to be able to clamp transparent hard and brittle material samples 8 of different sizes and adjust the distance between the transparent hard and brittle material sample 8 and the target material 9. The support block and the clamping arms are equipped with positioning parts, preferably set screws or limiting screws, respectively, to fix the position of the transparent hard and brittle material sample 8.

[0036] Furthermore, the laser 2 assembly includes a laser 2, a beam expander 3, and a focusing lens 7 arranged sequentially along the laser beam transmission direction. The focusing lens 7 is located on the side of the transparent hard and brittle material sample 8 away from the target material 9 and is spaced apart from the transparent hard and brittle material sample 8. A scanning galvanometer 6 is provided between the beam expander 3 and the focusing lens 7. The focusing lens is installed at the output end of the scanning galvanometer 6. Preferably, the scanning galvanometer 6 is equipped with a driving device that drives it to move horizontally. The driving device is electrically connected to a computer. The computer 1 controls the movement of the scanning galvanometer 6, so that the scanning trajectory of the laser beam is focused at different positions on the target material 9, thereby processing a large area of ​​microstructures on the back of the transparent hard and brittle material. Preferably, the computer 1 controls the scanning speed and direction of the laser through the scanning galvanometer 6.

[0037] Furthermore, several reflectors are provided between the beam expander 3 and the scanning galvanometer 6. These reflectors are arranged sequentially along the laser beam transmission direction to facilitate control of the laser beam transmission direction. Preferably, two reflectors are provided, namely the first reflector 4 and the second reflector 5. The laser beam generated by the laser 2 passes sequentially through the beam expander 3, the first reflector 4, the second reflector 5, and the scanning galvanometer 6. Then, the focusing field mirror 7 focuses the laser beam spot onto the surface of the target material 9 below the transparent, hard, and brittle material sample 8, ensuring that plasma is induced when the laser ablates the target material 9.

[0038] The target material 9 is made of non-ferromagnetic material and can generate plasma under laser focused irradiation. The target material 9 includes, but is not limited to, non-ferromagnetic materials such as copper, aluminum, and silicon. Ferromagnetic target materials 9 will shield the magnetic field and affect the processing effect of the magnetic field on the plasma.

[0039] Furthermore, a method for processing a device for processing a hydrophilic structure on the surface of a transparent, hard, and brittle material is also provided, comprising the following steps:

[0040] Sample installation: Install the sample clamp 12 on the worktable 11, place the magnet 10 with its N pole facing up on the support plane of the worktable 11, place the target material 9 on the magnet 10, and horizontally clamp the transparent hard and brittle material sample 8 between the two clamping arms of the sample clamp 12. Adjust the height of the clamping arms to control the distance between the transparent hard and brittle material sample 8 and the target material 9. Preferably, the distance between the transparent hard and brittle material sample 8 and the target material 9 is 0 to 2 mm.

[0041] Prepare laser 2 assembly: Prepare laser 2 assembly, and pass the laser beam generated by laser 2 through beam expander 3, each reflector, scanning galvanometer 6 and focusing field lens 7 in sequence, and focus it on the target material 9 through transparent hard and brittle material sample 8.

[0042] Etching: Under the control of the scanning galvanometer 6, the laser beam etches the microstructure on the lower surface of the transparent hard and brittle material sample 8.

[0043] Cleaning and drying: The processed transparent hard and brittle material sample 8 is placed in a cleaning solution for ultrasonic cleaning and then blown dry to complete the processing of the transparent hard and brittle material sample 8.

[0044] In this specific implementation, the transparent, hard, and brittle material sample 8 used is a single-crystal sapphire sheet, 10mm long, 10mm wide, and 0.43mm thick. The sample clamp 12 is mounted on the worktable 11, and the magnet 10 is placed on the worktable 11 with its N pole facing upwards. In this specific embodiment, the magnet 10 is an N52 grade NvFeB high-strength magnet 10, with dimensions of 10×10×5mm. 3The surface magnetic field strength of a single magnet 10 is 0.42T, and the magnetic field strength during processing is 0.38T. The target material 9 is then placed on the magnet 10. In this specific embodiment, the target material 9 is single-crystal silicon with a diameter of 50.8mm and a thickness of 0.43mm. Other dimensions of the target material 9 can be provided as needed, and the type of target material 9 can be silicon or other non-magnetic metals. The sapphire is horizontally clamped between the two arms of the sample clamp 12, and the height of the clamping arms is adjusted to control the distance between the sapphire and the target material 9. In this specific embodiment, the distance between the sapphire and the target material 9 is 100μm. The laser beam generated by the laser 2 passes sequentially through the beam expander 3, the first reflecting mirror 4, the second reflecting mirror 5, the scanning galvanometer 6, and the focusing field mirror 7, and is focused through the transparent sapphire onto the upper surface of the target material 9 below the sapphire. In this specific embodiment, the wavelength is 1064nm, the pulse width is 30ns, and the laser energy density is 7.4J / cm². 2 The repetition frequency is 90kHz; computer 1 controls scanning mirror 6, and the laser beam etches microstructures on the lower surface of the sample under the control of scanning mirror 6. In this specific embodiment, the processed shape is a groove array structure, the laser scanning line spacing is 50μm, the scanning speed is 5mm / s, and the number of scans is 5. The processed structure is as follows. Figure 2 As shown, a large number of micro- and nano-particles are attached around the microgroove, such as Figure 3 As shown; the sapphire processed in the above manner is placed in a solution for ultrasonic cleaning and then dried.

[0045] Any adaptive changes made according to actual needs are within the scope of protection of this invention.

[0046] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0047] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A device for processing hydrophilic structures on the surface of a transparent, hard, and brittle material, characterized in that, The device includes a magnetic field generator, a target material capable of generating plasma under the irradiation of a laser beam, and a laser assembly for emitting the laser beam. The emitting end of the laser assembly and the target material are spaced apart on both sides of a transparent hard and brittle material sample along the laser beam emission path. The laser beam emitted by the emitting end passes through the transparent hard and brittle material sample and is focused on the surface of the target material near the transparent hard and brittle material sample. Both the target material and the transparent hard and brittle material sample are located in the magnetic field generated by the magnetic field generator. The magnetic field lines of the magnetic field are perpendicular to the surface of the target material and extend in the same direction as the laser beam. The laser beam is used to pass through the transparent hard and brittle material sample and focus on the surface of the target material close to the transparent hard and brittle material sample. During the laser ablation of the target material, a high temperature and high pressure plasma is generated. With the assistance of a longitudinal magnetic field, the plasma impacts the back of the transparent hard and brittle material sample. Through the synergistic effect of thermal energy and mechanical energy, the material is removed, resulting in the formation of a large number of micro and nano particles on the back of the transparent hard and brittle material. The presence of these micro and nano particles greatly reduces the surface contact angle of the transparent hard and brittle material and increases its hydrophilicity.

2. The apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material according to claim 1, characterized in that, The magnetic field generator is a magnet located on the side of the target material away from the transparent, hard, and brittle material sample, with the N pole of the magnet facing the target material.

3. The apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material according to claim 2, characterized in that, The magnet is equipped with a worktable, and the top of the worktable is provided with a support plane parallel to the horizontal plane. The magnet is placed on the support plane, the target is placed on top of the magnet, and the transparent hard and brittle material sample and the emission end are arranged sequentially above the target from bottom to top.

4. The apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material according to claim 2 or 3, characterized in that, The transparent hard and brittle material sample is equipped with a sample clamp, which includes a clamp base and a clamping part for clamping the transparent hard and brittle material sample. The clamping part is movably mounted on the clamp base in a direction parallel to the magnetic field lines.

5. The apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material according to claim 4, characterized in that, The clamp base is movably provided with a support block in a direction parallel to the magnetic field lines. The clamping part includes a pair of clamping arms mounted on the support block. The two clamping arms clamp the two sides of the transparent hard and brittle material sample and are movably mounted on the support block in a direction perpendicular to the movement of the support block. The support block and the clamping arms are each equipped with positioning elements that position them on the clamp base and the support block, respectively.

6. The apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material according to claim 5, characterized in that, The laser assembly includes a laser, a beam expander, and a focusing lens arranged sequentially along the laser beam transmission direction. The focusing lens is located on the side of the transparent hard and brittle material sample away from the target material and is spaced apart from the transparent hard and brittle material sample.

7. The apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material according to claim 6, characterized in that, A scanning galvanometer is provided between the beam expander and the focusing field mirror, and the focusing field mirror is installed at the exit end of the scanning galvanometer.

8. The apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material according to claim 7, characterized in that, Several reflectors are provided between the beam expander and the scanning galvanometer, and each reflector is arranged sequentially along the laser beam transmission direction.

9. The apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material according to claim 8, characterized in that, The target material is made of non-ferromagnetic material.

10. A processing method using the apparatus for processing hydrophilic structures on the surface of a transparent, hard, and brittle material as described in claim 9, characterized in that, The process includes the following steps: Sample installation: Install the sample fixture on the worktable, place the magnet with the N pole facing up on the support plane of the worktable, place the target material on the magnet, and horizontally clamp the transparent hard and brittle material sample between the two clamping arms of the sample fixture. Adjust the height of the clamping arms to control the distance between the transparent hard and brittle material sample and the target material. Prepare the laser assembly: Prepare the laser assembly by passing the laser beam generated by the laser through the beam expander, each reflector, scanning galvanometer and focusing field lens in sequence, and then focusing the laser beam through the transparent hard and brittle material sample onto the target material. Etching: The laser beam is controlled by the scanning galvanometer to etch the microstructure on the lower surface of the transparent, hard and brittle material sample. Cleaning and drying: The processed transparent hard and brittle material sample is placed in a cleaning solution for ultrasonic cleaning and then blown dry to complete the processing of the transparent hard and brittle material sample.

Images