Nitrogen oxygen sensor heating control method, device, controller and storage medium

By incorporating a temperature determination and degradation unit into the nitrogen-oxygen sensor, the target temperature is adjusted according to the ambient temperature, thus solving the problems of high energy consumption and short lifespan of the nitrogen-oxygen sensor and achieving operation of the nitrogen-oxygen sensor with lower energy consumption and longer lifespan.

CN117170430BActive Publication Date: 2026-07-10WEICHAI POWER CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
WEICHAI POWER CO LTD
Filing Date
2023-08-17
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing nitrogen and oxygen sensors consume a lot of energy and have a shortened lifespan when maintaining a set temperature for a long time, and the ceramic chip is prone to cracking during the heating process.

Method used

By incorporating a temperature determination unit and a temperature degradation unit into the nitrogen-oxygen sensor, the target temperature is determined based on the ambient temperature, and temperature degradation is performed when the sensor is operating normally at the target temperature, thereby reducing heating energy consumption and preventing the ceramic chip from cracking.

Benefits of technology

This effectively reduces the heating energy consumption of the nitrogen and oxygen sensor, extends its service life, and prevents the ceramic chip from cracking.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the application provides a nitrogen-oxygen sensor heating control method and device, a controller and a storage medium, relates to the technical field of sensors, and can determine the ambient temperature of a ceramic chip in a nitrogen-oxygen sensor after the ceramic chip is heated to an initial temperature, and determine the target temperature of the ceramic chip according to the ambient temperature. When the target temperature is less than the initial temperature and the ceramic chip works normally at the target temperature, the temperature of the ceramic chip can be degraded, and the ceramic chip can be maintained at the target temperature. Controlling the ceramic chip to work at a lower temperature can not only reduce the heating energy consumption, but also prevent the ceramic chip from cracking, thereby prolonging the service life of the nitrogen-oxygen sensor.
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Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a heating control method, device, controller and storage medium for a nitrogen and oxygen sensor. Background Technology

[0002] Currently, nitrogen oxide sensors are typically installed in exhaust pipes to detect nitrogen oxide concentrations in exhaust gases. During operation, the ceramic chip within the nitrogen oxide sensor needs to be heated and maintained at a set temperature.

[0003] However, maintaining the ceramic chip at the set temperature for an extended period of time not only consumes a significant amount of heating energy but also shortens the lifespan of the nitrogen and oxygen sensor. Summary of the Invention

[0004] To address the problems in the prior art, this application provides a heating control method, apparatus, controller, and storage medium for a nitrogen-oxygen sensor. After heating the ceramic chip in the nitrogen-oxygen sensor to a set temperature, the temperature of the ceramic chip can be degraded, thereby reducing heating energy consumption and extending the service life of the nitrogen-oxygen sensor.

[0005] In a first aspect, embodiments of this application provide a heating control method for a nitrogen and oxygen sensor, the method comprising:

[0006] After the ceramic chip is heated to its initial temperature, the ambient temperature of the ceramic chip is determined.

[0007] The target temperature of the ceramic chip is determined based on the ambient temperature.

[0008] If the target temperature is lower than the initial temperature, the ceramic chip is controlled to operate at the target temperature.

[0009] If it is determined that the ceramic chip is working normally at the target temperature, then the ceramic chip is controlled to maintain operation at the target temperature.

[0010] In one possible implementation, determining the ambient temperature of the ceramic chip includes:

[0011] Obtain the current engine speed and the position of the ceramic chip;

[0012] Based on the pre-stored first correspondence, the current engine speed and the position of the ceramic chip are used to determine the ambient temperature of the ceramic chip; the first correspondence includes the correspondence between ambient temperature, engine speed and ceramic chip position.

[0013] In one possible implementation, determining the target temperature of the ceramic chip based on the ambient temperature includes:

[0014] According to the pre-stored second correspondence, the ceramic chip temperature corresponding to the ambient temperature is taken as the target temperature of the ceramic chip; the second correspondence includes the correspondence between the ambient temperature and the ceramic chip temperature.

[0015] In one possible implementation, whether the ceramic chip functions properly at the target temperature is determined by the following method:

[0016] If the difference between the target temperature and the initial temperature is less than a set temperature threshold, and / or the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the target temperature is less than a set concentration threshold, then it is determined that the ceramic chip is working normally at the target temperature.

[0017] In one possible implementation, before heating the ceramic chip to an initial temperature, the method further includes:

[0018] The ceramic chip is preheated.

[0019] If a dew point signal is received, the ceramic chip is heated to its initial temperature.

[0020] In one possible implementation, after determining the target temperature of the ceramic chip based on the ambient temperature, the method further includes:

[0021] If the target temperature is greater than or equal to the initial temperature, the ceramic chip will be maintained at the initial temperature during operation.

[0022] In one possible implementation, after the ceramic chip operates at the target temperature, the method further includes:

[0023] If it is determined that the ceramic chip cannot function properly at the target temperature, then the ceramic chip will be maintained at the initial temperature for operation.

[0024] Secondly, embodiments of this application provide a heating control device for a nitrogen and oxygen sensor, the device comprising:

[0025] A temperature determination unit is used to determine the ambient temperature of the ceramic chip after the ceramic chip is heated to an initial temperature; and to determine the target temperature of the ceramic chip based on the ambient temperature.

[0026] A temperature degradation unit is used to control the ceramic chip to operate at the target temperature if the target temperature is lower than the initial temperature; and to control the ceramic chip to maintain operation at the target temperature if it is determined that the ceramic chip is operating normally at the target temperature.

[0027] Thirdly, embodiments of this application provide a controller, including a memory and a processor, wherein the memory stores a computer program that can run on the processor, and when the computer program is executed by the processor, it implements the method described in any one of the nitrogen and oxygen sensor heating control methods of the first aspect.

[0028] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the method described in any one of the nitrogen and oxygen sensor heating control methods of the first aspect.

[0029] This application provides a method, apparatus, controller, and storage medium for heating control of a nitrogen-oxygen sensor. After the ceramic chip in the nitrogen-oxygen sensor is heated to an initial temperature, the ambient temperature of the ceramic chip is determined, and a target temperature for the ceramic chip is determined based on this ambient temperature. When the target temperature is lower than the initial temperature, and the ceramic chip operates normally at the target temperature, the temperature of the ceramic chip can be degraded to maintain it at the target temperature. Controlling the ceramic chip to operate at a lower temperature not only reduces heating energy consumption but also prevents the ceramic chip from cracking, thereby extending the service life of the nitrogen-oxygen sensor. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a nitrogen and oxygen sensor provided in an embodiment of this application;

[0032] Figure 2 A schematic diagram of a heating curve provided for an embodiment of this application;

[0033] Figure 3 A flowchart illustrating a nitrogen and oxygen sensor heating control method provided in this application embodiment;

[0034] Figure 4 This is a schematic diagram of the structure of a nitrogen and oxygen sensor heating control device provided in an embodiment of this application;

[0035] Figure 5 This is a schematic diagram of the structure of a controller provided in an embodiment of this application. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] It should be noted that the terms "comprising" and "having" and their variations used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0038] Currently, with the continuous tightening of vehicle emission standards, the market demand for nitrogen oxide sensors is constantly increasing. Vehicle exhaust pipes typically have two nitrogen oxide sensors: a front nitrogen oxide sensor and a rear nitrogen oxide sensor. The front nitrogen oxide sensor, located before the three-way catalytic converter, monitors the concentration of nitrogen and oxygen gas. This concentration value is then sent to the SCR (short-circuit catalytic converter) system. The SCR system feeds this concentration value, along with the exhaust temperature, back to the vehicle controller, enabling the SCR system to accurately inject nitrogen and oxygen, thus achieving closed-loop control of nitrogen and oxygen emissions. The rear nitrogen oxide sensor, located after the three-way catalytic converter, outputs a nitrogen and oxygen signal to determine the compliance of vehicle exhaust emissions.

[0039] Figure 1 This is a schematic diagram of a nitrogen and oxygen sensor provided in an embodiment of this application. Figure 1 As shown, the nitrogen-oxygen sensor 100 includes a probe 101 and a controller 102, with the probe 101 and controller 102 connected via a wiring harness 103. The controller 102 includes connectors 104 and 105. Connector 104 is connected to the wiring harness 103, and connector 105 is connected to a CAN bus (not shown in the figure).

[0040] The probe 101 contains a ceramic chip comprising six zirconium oxide ceramic layers (ZrO2-1, ZrO2-2, ZrO2-3, ZrO2-4, ZrO2-5, and ZrO2-6) stacked sequentially from top to bottom. A platinum heating wire is positioned between ZrO2-5 ​​and ZrO2-6. When the nitrogen-oxygen sensor 100 is operating, the ceramic chip can be heated by the platinum heating wire.

[0041] Traditional nitrogen and oxygen sensor heating control methods typically follow... Figure 2 The heating curve shown illustrates the heating of the ceramic chip. For example... Figure 2 As shown, the entire heating process of the ceramic chip is divided into different heating stages. In the initial stage (0-t1), the ceramic chip is rapidly heated. Subsequently, in the stages (t1-t2, t2-t3, and t3-t4), the heating rate of the ceramic chip is gradually reduced, ultimately maintaining the temperature of the ceramic chip at a set temperature T. This set temperature T is usually set to 800℃, the purpose of which is to eliminate the possible influence of engine exhaust when the nitrogen oxide sensor is working.

[0042] However, existing heating control methods for nitrogen and oxygen sensors cannot determine the state of the ceramic chip before heating it. If the temperature of the ceramic chip is too low, or if moisture is present on the chip, heating it will accelerate cracking. Furthermore, maintaining the ceramic chip at a set temperature such as 800°C for an extended period consumes a large amount of heating energy and also accelerates cracking, significantly shortening the lifespan of the nitrogen and oxygen sensor.

[0043] Based on this, embodiments of this application provide a heating control method, apparatus, controller, and storage medium for a nitrogen-oxygen sensor. The method involves preheating the ceramic chip in the nitrogen-oxygen sensor. After preheating, the ceramic chip is heated to an initial temperature. The ambient temperature of the ceramic chip is then determined, and a target temperature is set based on this ambient temperature. When the target temperature is lower than the initial temperature, and it is confirmed that the ceramic chip is operating normally at the target temperature, a temperature downgrade can be performed to maintain the ceramic chip at the target temperature. Controlling the ceramic chip to operate at a lower temperature not only reduces heating energy consumption but also prevents cracking of the ceramic chip, thereby extending the service life of the nitrogen-oxygen sensor.

[0044] Figure 3 A flowchart illustrating a heating control method for a nitrogen and oxygen sensor according to an embodiment of this application is shown. This method can be implemented by a controller for the nitrogen and oxygen sensor. Figure 3 As shown, the nitrogen and oxygen sensor heating control method may include the following steps:

[0045] Step S301: Preheat the ceramic chip. If a dew point signal is received, heat the ceramic chip to the initial temperature.

[0046] In one optional implementation, since the ceramic chip in the nitrogen-oxygen sensor probe is in a cold-start state when the nitrogen-oxygen sensor controller is powered on, moisture may be present on the surface of the ceramic chip. To remove any moisture from the ceramic chip surface and prevent uneven heating and cracking during subsequent heating, the nitrogen-oxygen sensor controller can apply a small heating duty cycle to the ceramic chip upon power-on, thus preheating the ceramic chip.

[0047] For example, the nitrogen and oxygen sensor controller can apply a 20% heating duty cycle to the ceramic chip to preheat the ceramic chip to 200°C, thereby evaporating any water vapor that may be present on the ceramic chip and avoiding uneven heating caused by water vapor adhering to the ceramic chip.

[0048] Furthermore, after preheating the ceramic chip, if the nitrogen oxide sensor controller receives the dew point signal sent by the vehicle controller, it can be determined that the preheating operation has been completed. At this time, the heating duty cycle applied to the ceramic chip can be increased to heat the ceramic chip to the initial temperature.

[0049] For example, after the preheating operation is completed, the heating duty cycle applied to the ceramic chip can be adjusted to 90% to heat the ceramic chip to the initial temperature. For example, the initial temperature could be 800°C.

[0050] Step S302: After the ceramic chip is heated to the initial temperature, determine the ambient temperature of the ceramic chip.

[0051] In one alternative implementation, the current engine speed and the location of the ceramic chip can be determined before determining the ambient temperature of the ceramic chip.

[0052] For example, the current engine speed can be obtained from the vehicle controller, and the position of the ceramic chip can be determined based on the position information pre-stored in the nitrogen oxide sensor controller.

[0053] The pre-stored position information in the nitrogen and oxygen sensor controller includes the probe position of the front nitrogen and oxygen sensor and the probe position of the rear nitrogen and oxygen sensor.

[0054] Engine exhaust pipes typically have two nitrogen oxide sensors: a front nitrogen oxide sensor and a rear nitrogen oxide sensor. In some embodiments, it can be first determined whether the nitrogen oxide sensor is a front or rear sensor, and then the position of the ceramic chip can be determined based on the probe positions of the front and rear nitrogen oxide sensors. Since the ceramic chip is located within the nitrogen oxide sensor probe, its position is also the position of the nitrogen oxide sensor probe.

[0055] After determining the current engine speed and the position of the ceramic chip, the ambient temperature of the ceramic chip can be determined based on a pre-stored first correspondence between the current engine speed and the position of the ceramic chip. This first correspondence includes the relationship between ambient temperature, engine speed, and the position of the ceramic chip.

[0056] In some embodiments, the first correspondence may be obtained by the nitrogen and oxygen sensor controller through self-learning.

[0057] Specifically, when the nitrogen oxide sensor controller is powered on, it can continuously record engine speed, the location of the ceramic chip, and the ambient temperature at the location of the ceramic chip at multiple moments. The ambient temperature at the location of the ceramic chip is the exhaust temperature at that location. Furthermore, the nitrogen oxide sensor controller can establish a preset correspondence and perform self-learning of ambient temperature.

[0058] In one embodiment, the first correspondence may include two sets. The first set of correspondences is the correspondence between the ambient temperature of the front nitrogen-oxygen sensor and the engine speed. This first set of correspondences can be represented by equation (1), which can be expressed as:

[0059] T1=k1*n+c1 (1)

[0060] Where T1 is the ambient temperature corresponding to the front nitrogen oxygen sensor, n is the engine speed, and k1 and c1 are both constant values ​​pre-calibrated for the front nitrogen oxygen sensor.

[0061] The second set of correspondences is the relationship between the ambient temperature of the rear nitrogen-oxygen sensor and the engine speed. The second set of correspondences can be represented by equation (2), which can be expressed as:

[0062] T2=k2*n+c2 (2)

[0063] Where T2 is the ambient temperature corresponding to the rear nitrogen-oxygen sensor, n is the engine speed, and k2 and c2 are both constant values ​​pre-calibrated for the rear nitrogen-oxygen sensor.

[0064] After a preset period of self-learning, the parameters k1 and c1 in equation (1), and the parameters k2 and c2 in equation (2) can be modified based on the engine speed, the position of the ceramic chip, and the ambient temperature at the position of the ceramic chip at multiple times. Furthermore, the modified relationship between the engine speed, the position of the ceramic chip, and the ambient temperature at the position of the ceramic chip can be stored in the controller of the nitrogen-oxygen sensor.

[0065] The self-learning process described above can be performed intermittently. For example, in some embodiments, the self-learning of ambient temperature can be performed based on the power-on time of the nitrogen-oxygen sensor; in other embodiments, the self-learning time of ambient temperature can be set by a counter.

[0066] It should be noted that the above-mentioned self-learning time setting for ambient temperature is for illustrative purposes only, and this application does not impose any limitations on the setting of the self-learning time for ambient temperature.

[0067] After establishing the first correspondence through self-learning, the ambient temperature at the location of the ceramic chip can be determined based on the current engine speed and the location of the ceramic chip.

[0068] Step S303: Determine the target temperature of the ceramic chip based on the ambient temperature.

[0069] After determining the ambient temperature of the ceramic chip, the ceramic chip temperature corresponding to the ambient temperature can be used as the target temperature of the ceramic chip according to the pre-stored second correspondence.

[0070] The second correspondence includes the correspondence between ambient temperature and ceramic chip temperature.

[0071] In other words, each ambient temperature corresponds to a target temperature. The nitrogen and oxygen sensor controller can use the target temperature corresponding to the ambient temperature at which the ceramic chip is located at the current moment as the target temperature of the ceramic chip.

[0072] Step S304: If the target temperature is lower than the initial temperature, control the ceramic chip to operate at the target temperature.

[0073] In one optional implementation, after obtaining the target temperature corresponding to the ambient temperature of the ceramic chip, the relationship between the target temperature and the initial temperature can be determined. If the target temperature is lower than the initial temperature, the ceramic chip can be controlled to operate at the target temperature.

[0074] For example, assuming the ambient temperature of the ceramic chip is 600°C, the target temperature corresponding to the ambient temperature of the ceramic chip is 700°C, and the initial temperature is 800°C, the ceramic chip can be controlled to work at the target temperature of 700°C.

[0075] In another alternative implementation, if the target temperature is greater than or equal to the initial temperature, the ceramic chip can be controlled to operate at the initial temperature.

[0076] For example, assuming the ambient temperature of the ceramic chip is 900°C, the target temperature corresponding to the ambient temperature of the ceramic chip is 850°C, and the initial temperature is 800°C, the ceramic chip can be controlled to work at 800°C.

[0077] Step S305: If it is determined that the ceramic chip is working normally at the target temperature, then control the ceramic chip to maintain the operation at the target temperature.

[0078] After adjusting the ceramic chip from its initial temperature state to the target temperature state, i.e., after temperature degradation of the ceramic chip, it is necessary to determine whether the ceramic chip works normally at the target temperature. If the ceramic chip works normally at the target temperature, it can be controlled to maintain the ceramic chip at the target temperature.

[0079] In one alternative implementation, it can be determined whether the ceramic chip is functioning properly at the target temperature by:

[0080] In one embodiment, if the difference between the target temperature and the initial temperature is less than a set temperature threshold, it can be determined that the ceramic chip is working normally at the target temperature.

[0081] The temperature threshold can be set according to actual usage. For example, the temperature threshold can be set to 100℃, or it can be set to 200℃.

[0082] For example, assuming the set temperature threshold is 100°C, the target temperature is 750°C, and the initial temperature is 800°C, it can be determined that the ceramic chip works normally at the target temperature. Furthermore, the ceramic chip can be controlled to operate at 750°C, thereby reducing the heating energy consumption of the nitrogen and oxygen sensor and extending the service life of the nitrogen and oxygen sensor.

[0083] It should be noted that the above-mentioned temperature threshold is only for illustrative purposes. The size of the temperature threshold can be set according to the actual situation, and this application does not impose any restrictions.

[0084] In another embodiment, if the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at its initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at its target temperature is less than a set concentration threshold, then it is determined that the ceramic chip is working normally at the target temperature.

[0085] The nitrogen oxide concentration values ​​detected by the nitrogen oxide sensor when the ceramic chip is at its initial temperature and when the nitrogen oxide sensor is at its target temperature should be measured under the same operating conditions. For example, both nitrogen oxide concentration values ​​could be obtained at an ambient temperature of 700℃ and an engine speed of 2000 rpm. The concentration threshold can be set according to actual usage conditions. For example, the concentration threshold could be set to 10 mg / m³. 3 For example, the concentration threshold can be set to 20 mg / m³. 3 .

[0086] For example, suppose the concentration threshold is set to 10 mg / m³. 3 The target temperature is 750℃, the initial temperature is 800℃, and the nitrogen and oxygen sensor detects a nitrogen and oxygen concentration of 120 mg / m³ when the ceramic chip is at 800℃. 3 The nitrogen and oxygen sensor detected a nitrogen and oxygen concentration of 117 mg / m³ when the ceramic chip was at 750°C. 3 This confirms that the ceramic chip is working normally at the target temperature. Furthermore, the ceramic chip can be controlled to operate at 750°C, thereby reducing the heating energy consumption of the nitrogen and oxygen sensor and extending its service life.

[0087] It should also be noted that the above-mentioned concentration threshold is only for illustrative purposes. The size of the concentration threshold can be set according to the actual situation, and this application does not impose any restrictions on it.

[0088] In another embodiment, if the difference between the target temperature and the initial temperature is less than a set temperature threshold, and the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the target temperature is less than a set concentration threshold, then it can be determined that the ceramic chip is working normally at the target temperature.

[0089] Assuming a set temperature threshold of 100℃, a target temperature of 750℃, an initial temperature of 800℃, and a set concentration threshold of 10mg / m³ 3 The nitrogen and oxygen sensor detected a nitrogen and oxygen concentration of 120 mg / m³ when the ceramic chip was at 800°C. 3 The nitrogen and oxygen sensor detected a nitrogen and oxygen concentration of 117 mg / m³ when the ceramic chip was at 750°C. 3 This confirms that the ceramic chip is working normally at the target temperature. Furthermore, the ceramic chip can be controlled to operate at 750°C, thereby reducing the heating energy consumption of the nitrogen and oxygen sensor and extending its service life.

[0090] In one alternative implementation, if it is determined that the ceramic chip cannot function properly at the target temperature, the ceramic chip can be controlled to operate at the initial temperature.

[0091] In some embodiments, if the condition for the ceramic chip to operate normally at the target temperature is determined to be that the difference between the target temperature and the initial temperature is less than a set temperature threshold, then when the difference between the target temperature and the initial temperature is greater than or equal to the set temperature threshold, the ceramic chip can be controlled to maintain operation at the initial temperature.

[0092] For example, assuming the set temperature threshold is 100°C, the target temperature is 650°C, and the initial temperature is 800°C, it can be determined that the ceramic chip cannot work properly at the target temperature. Furthermore, the ceramic chip can be controlled to operate at 800°C.

[0093] In other embodiments, if the condition for the ceramic chip to operate normally at the target temperature is determined to be that the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at its initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at its target temperature is less than a set concentration threshold, then when the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at its initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at its target temperature is greater than or equal to the set concentration threshold, the ceramic chip can be controlled to maintain operation at the initial temperature.

[0094] For example, suppose the concentration threshold is set to 10 mg / m³. 3 The target temperature is 720℃, the initial temperature is 800℃, and the nitrogen and oxygen sensor detects a nitrogen and oxygen concentration of 120 mg / m³ when the ceramic chip is at 800℃. 3 The nitrogen and oxygen sensor detected a nitrogen and oxygen concentration of 106 mg / m³ when the ceramic chip was at 720°C. 3 If so, it can be determined that the ceramic chip cannot work properly at the target temperature. Furthermore, the ceramic chip can be controlled to operate at 800°C.

[0095] In other embodiments, if the condition for determining that the ceramic chip operates normally at the target temperature is: the difference between the target temperature and the initial temperature is less than a set temperature threshold, and the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the target temperature is less than a set concentration threshold, then if the difference between the target temperature and the initial temperature is greater than or equal to the set temperature threshold, and the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the target temperature is greater than or equal to the set concentration threshold, the ceramic chip can be controlled to maintain operation at the initial temperature.

[0096] For example, suppose the temperature threshold is set to 100°C and the concentration threshold is set to 10 mg / m³. 3 The target temperature is 650℃, the initial temperature is 800℃, and the nitrogen and oxygen sensor detects a nitrogen and oxygen concentration of 120 mg / m³ when the ceramic chip is at 800℃. 3 The nitrogen and oxygen sensor detected a nitrogen and oxygen concentration of 106 mg / m³ when the ceramic chip was at 650°C. 3 If so, it can be determined that the ceramic chip cannot work properly at the target temperature. Furthermore, the ceramic chip can be controlled to operate at 800°C.

[0097] It should be noted that, in order to determine the timeliness and accuracy of the ceramic chip's normal operation at the target temperature, the above process of determining whether the ceramic chip is operating normally at the target temperature can be performed intermittently.

[0098] For example, in some embodiments, the power-on time of the nitrogen-oxygen sensor can be used as a reference to determine whether the ceramic chip is working properly at the target temperature each time. In other embodiments, a counter can be used to set the time for whether the ceramic chip is working properly at the target temperature.

[0099] Based on the same inventive concept, this embodiment of the invention also provides a structural schematic diagram of a nitrogen and oxygen sensor heating control device, as shown below. Figure 4 As shown, the nitrogen and oxygen sensor heating control device includes:

[0100] The temperature determination unit 401 is used to determine the ambient temperature of the ceramic chip after the ceramic chip is heated to the initial temperature, and to determine the target temperature of the ceramic chip based on the ambient temperature.

[0101] The temperature degradation unit 402 is used to control the ceramic chip to work at the target temperature if the target temperature is lower than the initial temperature, and to control the ceramic chip to maintain the target temperature if the ceramic chip works normally at the target temperature.

[0102] In one possible implementation, the temperature determining unit 401 is specifically used for:

[0103] The engine speed and the position of the ceramic chip at the current moment are obtained. Based on the pre-stored first correspondence, the ambient temperature of the ceramic chip is determined.

[0104] The first correspondence includes the correspondence between ambient temperature, engine speed, and ceramic chip position.

[0105] In one possible implementation, the temperature determining unit 401 is specifically used for:

[0106] Based on the pre-stored second correspondence, the ceramic chip temperature corresponding to the ambient temperature is taken as the target temperature of the ceramic chip.

[0107] The second correspondence includes the correspondence between ambient temperature and ceramic chip temperature.

[0108] In one possible implementation, the temperature degradation unit 402 is specifically used for:

[0109] The following method is used to determine whether the ceramic chip is working properly at the target temperature: if the difference between the target temperature and the initial temperature is less than the set temperature threshold, and / or, the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the target temperature is less than the set concentration threshold, then the ceramic chip is determined to be working properly at the target temperature.

[0110] In one possible implementation, the temperature determining unit 401 is further configured to:

[0111] The ceramic chip is preheated. If a dew point signal is received, the ceramic chip is heated to the initial temperature.

[0112] In one possible implementation, the temperature degradation unit 402 is further configured to:

[0113] If the target temperature is greater than or equal to the initial temperature, the ceramic chip will be maintained at the initial temperature for operation.

[0114] In one possible implementation, the temperature degradation unit 402 is further configured to:

[0115] If it is determined that the ceramic chip cannot function properly at the target temperature, then maintain the ceramic chip at the initial temperature for operation.

[0116] Based on the same inventive concept, embodiments of this application also provide a controller. This controller includes at least a memory for storing data and a processor. The processor for data processing can be implemented using a microprocessor, CPU, GPU (Graphics Processing Unit), DSP, or FPGA during processing. The memory stores operation instructions, which can be computer-executable code, to implement the various steps in the nitrogen and oxygen sensor heating control method described in the embodiments of this application.

[0117] Figure 5 This is a schematic diagram of a controller provided in an embodiment of this application. Figure 5As shown, the controller 500 includes a memory 501, a processor 502, a data acquisition module 503, and a bus 504. The memory 501, processor 502, and data acquisition module 503 are all connected via the bus 504, which is used for data transmission between the memory 501, processor 502, and data acquisition module 503.

[0118] The memory 501 can be used to store software programs and modules. The processor 502 executes various functional applications and data processing of the controller 500 by running the software programs and modules stored in the memory 501, such as the nitrogen and oxygen sensor heating control method provided in this embodiment. The memory 501 may mainly include a program storage area and a data storage area. The program storage area may store the operating system, application programs of at least one application, etc.; the data storage area may store data created according to the use of the controller 500, etc. In addition, the memory 501 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0119] The processor 502 is the control center of the controller 500. It connects various parts of the controller 500 via the bus 504 and various interfaces and lines. It executes various functions of the controller 500 and processes data by running or executing software programs and / or modules stored in the memory 501 and calling data stored in the memory 501. Optionally, the processor 502 may include one or more processing units, such as a CPU, GPU (Graphics Processing Unit), digital processing unit, etc.

[0120] This application also provides a computer-readable storage medium storing computer-executable instructions. When executed by a processor, the computer program can be used to implement the nitrogen and oxygen sensor heating control method described in any embodiment of this application.

[0121] In some possible implementations, various aspects of the nitrogen and oxygen sensor heating control method provided in this application can also be implemented as a program product, which includes program code. When the program product is run on a computer device, the program code is used to cause the computer device to perform the steps of the nitrogen and oxygen sensor heating control method according to the various exemplary embodiments of this application described above. For example, the computer device can perform actions such as... Figure 3 The flowchart illustrates the heating control method for the nitrogen and oxygen sensor.

[0122] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0123] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0124] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0125] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0126] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A heating control method for a nitrogen and oxygen sensor, characterized in that, The nitrogen and oxygen sensor includes a ceramic chip, and the method includes: After the nitrogen and oxygen sensor is cold-started, the ceramic chip is preheated to evaporate the water vapor on the surface of the ceramic chip; After receiving the dew point signal, the ceramic chip is heated to its initial temperature; Obtain the current engine speed and the position of the ceramic chip; Based on the pre-stored first correspondence, the current engine speed and the position of the ceramic chip are used to determine the ambient temperature of the ceramic chip; the first correspondence includes the correspondence between ambient temperature, engine speed and ceramic chip position; the position of the ceramic chip is determined based on the probe positions of the front nitrogen oxide sensor and the rear nitrogen oxide sensor. The target temperature of the ceramic chip is determined based on the ambient temperature. If the target temperature is lower than the initial temperature, the ceramic chip is controlled to operate at the target temperature to prevent cracking. If the difference between the target temperature and the initial temperature is less than a set temperature threshold, and the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the target temperature is less than a set concentration threshold, then the ceramic chip is controlled to maintain operation at the target temperature.

2. The method according to claim 1, characterized in that, Determining the target temperature of the ceramic chip based on the ambient temperature includes: According to the pre-stored second correspondence, the ceramic chip temperature corresponding to the ambient temperature is taken as the target temperature of the ceramic chip; the second correspondence includes the correspondence between the ambient temperature and the ceramic chip temperature.

3. The method according to claim 1, characterized in that, After determining the target temperature of the ceramic chip based on the ambient temperature, the method further includes: If the target temperature is greater than or equal to the initial temperature, the ceramic chip will be maintained at the initial temperature during operation.

4. The method according to claim 1, characterized in that, After the ceramic chip operates at the target temperature, the method further includes: If it is determined that the ceramic chip cannot function properly at the target temperature, then the ceramic chip will be maintained at the initial temperature for operation.

5. A heating control device for a nitrogen and oxygen sensor, characterized in that, The device includes: A temperature determination unit is used to preheat the ceramic chip to evaporate water vapor on its surface after a cold start of the nitrogen oxide sensor; heat the ceramic chip to an initial temperature after receiving a dew point signal; acquire the current engine speed and the position of the ceramic chip; determine the ambient temperature of the ceramic chip based on a pre-stored first correspondence, including the correspondence between ambient temperature, engine speed, and ceramic chip position; the position of the ceramic chip is determined based on the probe positions of the front and rear nitrogen oxide sensors; and determine the target temperature of the ceramic chip based on the ambient temperature. A temperature degradation unit is used to control the ceramic chip to operate at the target temperature if the target temperature is lower than the initial temperature, based on the need to prevent the ceramic chip from cracking; and to control the ceramic chip to maintain operation at the target temperature if the difference between the target temperature and the initial temperature is less than a set temperature threshold, and the difference between the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the initial temperature and the nitrogen and oxygen concentration value detected by the nitrogen and oxygen sensor when the ceramic chip is at the target temperature is less than a set concentration threshold.

6. A controller, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that can run on the processor, and when the computer program is executed by the processor, it implements the method of any one of claims 1 to 4.

7. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, it implements the method of any one of claims 1 to 4.