Wireless communication module and server having the same

Abstract

The application provides a wireless communication module and a server with the wireless communication module. The wireless communication module is installed on the server. The wireless communication module comprises a carrier plate and a first wireless communication module. The first wireless communication module is arranged on the carrier plate and electrically connected to the carrier plate. The carrier plate is also electrically connected to the server. The server controls the first wireless communication module to transmit and / or receive radio waves through the carrier plate. The wireless communication module provided by the application sets the first wireless communication module, so that the server can be directly connected to the wireless network without a network cable. The freedom of the server is improved, the server has more application scenarios, and the use requirements of the existing industrial internet are met.

Description

Technical Field

[0001] This invention relates to the field of wireless communication, and more particularly to a wireless communication module and a server having the module. Background Technology

[0002] With the rapid development of the Industrial Internet, more and more edge servers are being deployed. Edge servers are typically single-function servers, and their primary operating environment is non-standard data center environments, such as shopping malls or roadside locations without wired network interfaces. Therefore, how to connect edge servers to the network becomes a problem that needs to be solved. Summary of the Invention

[0003] Therefore, this application provides a wireless communication module and a server having the wireless communication module, so as to facilitate the server's connection to a wireless network.

[0004] The first aspect of this application provides a wireless communication module installed on a server. The wireless communication module includes a carrier board and a first wireless communication module. The first wireless communication module is disposed on the carrier board and electrically connected to the carrier board. The carrier board is also electrically connected to the server. The server controls the first wireless communication module to transmit and / or receive radio waves through the carrier board.

[0005] A second aspect of this application provides a server equipped with the wireless communication module described above.

[0006] The wireless communication module and server equipped with the wireless communication module provided in this application enable the server to connect directly to the wireless network without a network cable by setting a first wireless communication module, thereby increasing the server's flexibility, enabling the server to have more application scenarios, and meeting the usage needs of the existing industrial Internet. Attached Figure Description

[0007] Figure 1 This is a schematic diagram illustrating communication between a server and an electronic device, as provided in an embodiment of this application.

[0008] Figure 2 for Figure 1 The diagram shows the structural block diagram of the server.

[0009] Explanation of main component symbols

[0010] Electronic equipment 300

[0011] Server 200

[0012] Motherboard 210

[0013] Central Processing Unit (CPU) 211

[0014] Platform Control Hub (PCH) 212

[0015] Baseboard Management Controller (BMC) 213

[0016] Wireless communication module 100

[0017] Carrier plate 10

[0018] First wireless communication module 20

[0019] Positioning module 30

[0020] Temperature detection module 40

[0021] Memory 50

[0022] Second wireless communication module 60

[0023] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] It should be noted that when one component is referred to as "electrically connected" to another component, it can be directly on the other component or there can be an intervening component. When one component is considered to be "electrically connected" to another component, it can be a contact connection, such as a wire connection, or a non-contact connection, such as a non-contact coupling.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] In this document, unless otherwise expressly specified and limited, directional terms such as “above,” “below,” “upper end,” “lower end,” “lower surface,” “clockwise,” “counterclockwise,” “left,” and “right” indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this document and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of protection of this application.

[0028] In this document, unless otherwise expressly specified and limited, "above" or "below" a second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "below," and "over" a second feature include the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature. "Above," "below," and "under" a second feature include the first feature being directly below or diagonally below the second feature, or simply indicating that the first feature is at a lower horizontal level than the second feature.

[0029] In this document, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0030] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0031] Please refer to the following: Figure 1 and Figure 2 This application provides a wireless communication module 100, which can be installed on a server 200 to transmit and receive radio waves to transmit and exchange wireless signals, thereby facilitating communication between the server 200 and base stations, the cloud, or other electronic devices 300 (such as smart home devices, industrial internet devices, or smart medical devices) to complete signal transmission.

[0032] It is understood that server 200 can be used in electronic devices, including, but not limited to, ultra-mobile personal computers (UMPCs), handheld computers, netbooks, personal digital assistants (PDAs), wearable devices, virtual reality devices, wireless USB flash drives, Bluetooth speakers / headphones, in-vehicle devices, dashcams, security equipment, or medical devices, etc.

[0033] Understandably, server 200 can also be electrically connected to a monitor, keyboard, mouse, or other peripheral devices (not shown) to facilitate interaction with the user.

[0034] It can be understood that the wireless communication module 100 is electrically connected to the motherboard 210 inside the server 200, thereby converting the information output by the motherboard 210 into wireless signals and transmitting them out, while receiving information from base stations, the cloud or other electronic devices to transmit to the motherboard 210.

[0035] In this embodiment, the wireless communication module 100 includes a carrier board 10, a first wireless communication module 20, a memory 50, a positioning module 30, and a temperature detection module 40. The first wireless communication module 20, the memory 50, the positioning module 30, and the temperature detection module 40 are all disposed on the carrier board 10 and electrically connected to the carrier board 10. For example, in this embodiment, the first wireless communication module 20, the memory 50, the positioning module 30, and the temperature detection module 40 are all soldered onto the carrier board 10, thus ensuring a stable electrical connection between the first wireless communication module 20, the memory 50, the positioning module 30, and the temperature detection module 40 and the carrier board 10.

[0036] It is understandable that, since the motherboard 210 lacks interfaces for connecting to the first wireless communication module 20, positioning module 30, temperature detection module 40, and memory 50, directly connecting these modules to the motherboard 210 could easily lead to serious consequences due to power and signal mismatches, such as signal corruption, data loss, or even damage to the server 200. This application addresses this by providing a carrier board 10, allowing the first wireless communication module 20, memory 50, positioning module 30, and temperature detection module 40 to be electrically connected to the motherboard 210 via the carrier board 10, thereby improving the security of the server 200.

[0037] In this embodiment, the carrier board 10 is a printed circuit board (PCB). It is understood that this embodiment does not limit the material of the carrier board 10. For example, in some embodiments, the carrier board 10 may also be a ceramic circuit board, a flexible printed circuit (FPC), or other types of circuit boards.

[0038] It is understood that the first wireless communication module 20 is electrically connected to the motherboard 210 via the carrier board 10. Thus, under the control of the motherboard 210, the first wireless communication module 20 can transmit and / or receive wireless signals to enable communication between the server 200 and external devices.

[0039] It is understood that the first wireless communication module 20 may employ one or more of the following communication technologies, such as: Global System for Mobile Communications (GSM), Wideband Code Division Multiple Access (WCDMA), Long Term Evolution (LTE), 5G, Sub-6G, and other future communication technologies. For example, in this embodiment, the first wireless communication module 20 employs LTE and 5G communication technologies.

[0040] It is understood that the first wireless communication module 20 includes an antenna, a power divider, an RF switching switch, a modem, and other electronic components related to wireless communication. This application does not limit the specific structure of the first wireless communication module 20; for example, in some embodiments, the first wireless communication module 20 may also be a chip integrating the aforementioned electronic components related to wireless communication.

[0041] In this embodiment, the positioning module 30 is mounted on the carrier board 10. Thus, when the carrier board 10 is installed on the server 200, the positioning module 30 is used to obtain the current latitude and longitude data and other location information of the server 200. It can be understood that the positioning module 30 is electrically connected to the motherboard 210 of the server 200. Therefore, when the motherboard 210 detects that the positioning function has been triggered, the motherboard 210 can obtain the location information from the positioning module 30. In this embodiment, the positioning module 30 can be based on the Global Positioning System (GPS), the BeiDou Navigation Satellite System, or any other satellite positioning system.

[0042] In this embodiment, the temperature detection module 40 is also electrically connected to the first wireless communication module 20 and the positioning module 30, and is used to detect the temperature of the first wireless communication module 20 and the positioning module 30 to monitor whether the first wireless communication module 20 and the positioning module 30 are in normal working condition. It can be understood that when the temperature of the first wireless communication module 20 and / or the positioning module 30 exceeds their respective preset thresholds, it can be determined that the first wireless communication module 20 and / or the positioning module 30 are in an abnormal working state.

[0043] It is understood that the memory 50 is electrically connected to the first wireless communication module 20, the positioning module 30, and the temperature detection module 40, and is used to store data and / or program instructions generated by each module. It is also understood that this application does not limit the type of memory 50; the memory 50 can also be dynamic random access memory, static random access memory, or other types of memory.

[0044] In this embodiment, the memory 50 is an FRU chip.

[0045] In some embodiments, the carrier board 10 is further provided with a second wireless communication module 60. In this embodiment, the second wireless communication module 60 adopts Wireless Fidelity (Wi-Fi) communication technology. Thus, when the carrier board 10 is installed on the server 200, that is, when the second wireless communication module 60 is electrically connected to the motherboard 210, the second wireless communication module 60 can also connect to the wireless network through a wireless router (not shown) under the control of the motherboard 210 to realize communication between the server 200 and external devices.

[0046] It is understood that the temperature detection module 40 is also electrically connected to the second wireless communication module 60 for detecting the temperature of the second wireless communication module 60.

[0047] It is understood that when the carrier board 10 is equipped with both the first wireless communication module 20 and the second wireless communication module 60, the server 200 can communicate with external devices through the first wireless communication module 20 and / or the second wireless communication module 60.

[0048] It is understood that in other embodiments, the carrier board 10 may also replace the first wireless communication module 20 with the second wireless communication module 60.

[0049] In this embodiment, the motherboard 210 includes a central processing unit (CPU) 211, a platform controller hub (PCH) 212, and a baseboard management controller (BMC) 213.

[0050] It can be understood that CPU 211 is the control center of server 200, used to connect various parts of server 200 via various interfaces and lines. CPU 211 is electrically connected to PCH 212 and BMC 213 to control various parts of server 200 through PCH 212 and BMC 213. PCH 212 and BMC 213 are also electrically connected to wireless communication module 100. Thus, CPU 211 can also control wireless communication module 100 to execute corresponding instructions through PCH 212 and BMC 213 to achieve communication between server 200 and electronic device 300.

[0051] It can be understood that PCH212 is the input / output control center of server 200. CPU211 establishes connections with other electronic devices through PCH212 and controls the corresponding electronic devices to execute corresponding instructions.

[0052] Specifically, in this embodiment, PCH212 is electrically connected to the carrier board 10 via a Universal Serial Bus (USB) (e.g., USB 3.0 interface), and is electrically connected to the first wireless communication module 20 via the carrier board 10, enabling PCH212 to interact with the first wireless communication module 20 via the USB 3.0 protocol. Thus, CPU211 can output data to the first wireless communication module 20 via PCH212 and the carrier board 10. Upon receiving the data, the first wireless communication module 20 processes it to generate corresponding radio wave signals and transmits them. It is understood that when the first wireless communication module 20 receives wireless signals from other electronic devices 300, it can also process the received wireless signals to generate corresponding data, which is then transmitted to CPU211 via the carrier board 10 and PCH212.

[0053] In this embodiment, PCH212 is electrically connected to the carrier board 10 via a high-speed serial computer expansion bus (peripheral component interconnect express, PCIe), and is electrically connected to the second wireless communication module 60 via the carrier board 10, enabling PCH212 to interact with the second wireless communication module 60 via the PCIe protocol. Thus, CPU211 can output data to the second wireless communication module 60 via PCH212 and the carrier board 10. Upon receiving the data, the second wireless communication module 60 processes it to generate corresponding radio wave signals and transmits them to the corresponding router. It is understood that when the second wireless communication module 60 receives a wireless signal from the router, it can also process the received wireless signal to generate corresponding data, which is then transmitted to CPU211 via the carrier board 10 and PCH212.

[0054] In this embodiment, PCH212 is also electrically connected to the carrier board 10 to connect to the positioning module 30. Thus, CPU211 can obtain address information about server 200 from the positioning module 30 via PCH212 and the carrier board 10.

[0055] It is understood that the BMC213 can perform operations such as checking and firmware upgrades on the server 200 even when the server 200 is not powered on. In this embodiment, the BMC213 is electrically connected to the carrier board 10 via an I2C bus (Inter-Integrated Circuit), and is electrically connected to the temperature detection module 40 via the carrier board 10. Thus, the BMC213 can determine whether the first wireless communication module 20 and / or the second wireless communication module 60 on the wireless communication module 100 are in normal working condition through the temperature detection module 40.

[0056] In this embodiment, the BMC213 is also electrically connected to the carrier board 10 via an I2C bus (Inter-Integrated Circuit), and is electrically connected to the memory 50 via the carrier board 10. Thus, the BMC213 can obtain data from the wireless communication module 100 through the memory 50 to inspect or upgrade the firmware of the wireless communication module 100.

[0057] It is understood that in some embodiments, server 200 also includes a network interface card (NIC) (not shown). One end of the NIC is connected to motherboard 210, and the other end is connected to a wired network interface to provide computer network services to server 200. It is understood that when server 200 is equipped with both a NIC and wireless communication module 100, motherboard 210 can access the computer network through either wireless communication module 100 or NIC.

[0058] It is understood that the wireless communication module 100 provided in this application can be installed on the server 200 and connected to the motherboard 210 of the server 200, thereby enabling the server 200 to connect directly to the wireless network without a network cable, which increases the flexibility of the server 200, allows the server 200 to have more application scenarios, and meets the usage needs of the existing industrial Internet.

[0059] The wireless communication module 100 includes a carrier board 10, a first wireless communication module 20 and / or a second wireless communication module 60. The first wireless communication module 20 (and / or the second wireless communication module 60) is electrically connected to the motherboard 210 through the carrier board 10, thereby reducing the signal confusion and data loss caused by the interface and signals between the first wireless communication module 20 and / or the second wireless communication module 60 and the motherboard 210, and effectively improving the security and stability of the server 200.

[0060] The above embodiments are merely illustrative of the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to the preferred embodiments above, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of the present invention should not depart from the spirit and scope of the present invention. Those skilled in the art can also make other changes within the spirit of the present invention and use them in the design of the present invention, as long as they do not deviate from the technical effects of the present invention. These changes made according to the spirit of the present invention should all be included within the scope of protection claimed by the present invention.

Claims

1. A wireless communication module, installed on a server, characterized in that: The server includes a central processing unit and a platform control hub that are electrically connected to each other. The wireless communication module includes a carrier board, a first wireless communication module and a second wireless communication module. The first wireless communication module and the second wireless communication module are both disposed on the carrier board and are electrically connected to the carrier board. The carrier board is also electrically connected to the server. The server controls the first wireless communication module and the second wireless communication module to transmit and / or receive radio waves through the carrier board. The carrier board is electrically connected to the platform control hub via a universal serial bus, so that the central processing unit controls the first wireless communication module to transmit and / or receive radio waves through the carrier board. The carrier board is electrically connected to the platform control hub via a high-speed serial computer expansion bus, so that the central processing unit controls the second wireless communication module to transmit and / or receive radio waves through the carrier board.

2. The wireless communication module of claim 1, wherein: The carrier board is a printed circuit board.

3. The wireless communication module of claim 1, wherein: The first wireless communication module adopts Long Term Evolution (LTE) communication technology and 5G communication technology, while the second wireless communication module adopts Wireless Fidelity (WF) communication technology.

4. The wireless communication module of claim 1, wherein: The wireless communication module further includes a temperature detection module, which is disposed on the carrier board and electrically connected to the first wireless communication module and the second wireless communication module for detecting the temperature of the first wireless communication module and the second wireless communication module; the temperature detection module is also electrically connected to the carrier board so as to be electrically connected to the server through the carrier board.

5. The wireless communication module as described in claim 1, characterized in that: The wireless communication module further includes a positioning module, which is disposed on the carrier board and electrically connected to the carrier board so as to be electrically connected to the server through the carrier board.

6. A server, characterized in that: The server includes a central processing unit and a platform control hub that are electrically connected to each other, and the server also includes a wireless communication module as described in any one of claims 1-5.

7. The server as described in claim 6, characterized in that: The server also includes a baseboard management controller, which is electrically connected to the central processing unit. When a temperature detection module is provided on the carrier board of the wireless communication module, the baseboard management controller is electrically connected to the temperature detection module through the carrier board.

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