A compatible wafer backside marking fixture device

Abstract

The present invention relates to a compatible wafer backside marking jig device, comprising a support base plate, an adsorption jig carrier and a carrier rotating device, the carrier rotating device being mounted on the support base plate, and the adsorption jig carrier being mounted on the carrier rotating device; a lifting receiving platform and a pressing platform are sequentially arranged from bottom to top above the adsorption jig carrier, and a pressing lifting device for lifting the pressing platform is arranged on the lifting receiving platform. Different processing carriers can be selected according to product size and quickly replaced without complicated disassembly and assembly; it is compatible with processing of multiple sizes and multiple series of products, and is convenient for switching equipment for processing and changing models; after achieving a one-time correction of the carrier to be perpendicular to the optical path cutting, there is no need to re-calibrate the verticality later, and a series of other problems can be avoided, thereby avoiding poor batch processing of products. In order to cope with the adsorption function of warped products, two non-contact suction cups adsorb the warped products on the jig mounting base plate, and the pressing ring presses down on all sides of the product to completely smooth it out.

Description

Technical Field

[0001] The present invention relates to the technical field related to wafer processing, and in particular to a compatible wafer backside marking fixture device. Background Art

[0002] With the development of advanced packaging technology, chips are packaged as a whole wafer before being diced. Therefore, wafer backside marking has become an indispensable step in advanced semiconductor packaging. It is mainly used to mark each chip on each wafer with customer logos, direction indicators, customer-specified text information, etc.

[0003] After massive searches, it was found that the prior art publication number is CN216413023U, which discloses a contactless wafer marking device comprising: a first support frame, a second support frame, a truss, a vacuum suction cup, a positioning mechanism, and a laser; wherein, the first support frame and the second support frame are arranged in parallel; a wafer box placement area is formed between the first support frame and the second support frame; the truss is slidably arranged above the first support frame and the second support frame; the vacuum suction cup is located above the wafer box placement area and is connected to the truss; the truss is provided with the positioning mechanism on one side along the sliding direction of the first support frame and the second support frame; the laser is arranged above the first support frame and the second support frame and close to the side of the positioning mechanism.

[0004] Currently, wafer sizes on the market range from 6 to 12 inches, and there are several different sizes. Therefore, when designing equipment, corresponding fixtures need to be made for several products. This requires ensuring easy operation and high stability. However, the above method has the following problems:

[0005] When replacing the carrier for products of different sizes, due to the strict requirements of wafer product processing technology, the perpendicularity between the processing light path and the processing carrier device is less than 0.01mm. After the processing carrier device is disassembled and assembled, the flatness will change, and an angle will appear with the calibrated cutting light path. This requires that the product be tested and the actual size is measured by the imaging system, and then the flatness of the processing carrier device and the perpendicularity with the processing light path are recalibrated. Therefore, when switching between different models or series of wafer products during the production process, the assembly and disassembly time of the device is long, the calibration workload is relatively large, and the operator may omit or make mistakes, resulting in defective product processing batches.

[0006] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a compatible wafer backside marking fixture device to make it more valuable for industrial use. Summary of the Invention

[0007] In order to solve the above technical problems, the purpose of the present invention is to provide a compatible wafer back side marking fixture device.

[0008] To achieve the above object, the present invention adopts the following technical solutions:

[0009] A compatible wafer backside marking fixture device includes a support base plate, an adsorption fixture carrier and a carrier rotating device, wherein the carrier rotating device is mounted on the support base plate, and the adsorption fixture carrier is mounted on the carrier rotating device;

[0010] Above the adsorption fixture carrier, a lifting material receiving platform and a material pressing platform are arranged in sequence from bottom to top, and a material pressing lifting device for lifting and lowering the material pressing platform is provided on the lifting material receiving platform;

[0011] The adsorption fixture carrier includes an adsorption plate, a 1 / 4 marking area is opened on the adsorption plate, and at least one suction cup is installed on the adsorption plate;

[0012] The jacking material receiving platform includes a material receiving plate fixing plate, a material receiving plate and a jacking material receiving power motor. The material receiving plate is installed in the middle cavity on the material receiving plate fixing plate. The bottom of the material receiving plate fixing plate is lifted and lowered on the support platform bottom plate below through jacking material receiving guide rods. The top of the jacking material receiving guide rod is installed on the bottom of the material receiving plate fixing plate through a jacking material receiving linear bearing. The jacking material receiving power motor is installed on the support platform bottom plate below both sides of the material receiving plate fixing plate along the X-axis direction. The jacking material receiving power motor can drive the jacking material receiving cam to contact the upper large plate end contact bearing installed on the material receiving plate fixing plate.

[0013] The pressing table includes a pressing table bottom plate and a pressing ring. The four sides of the bottom of the pressing table bottom plate are all lifted and lowered on the fixed large plate of the receiving plate below through lifting guide pillars and guide bearings. The pressing ring is installed in the middle cavity of the pressing table bottom plate.

[0014] The press-plate lifting device includes a press-plate lifting power motor, a multi-stage transmission mechanism and a driven lifting device. The press-plate lifting power motor installed on one side of the fixed large plate of the material receiving plate can be connected to the driven lifting devices located on both sides of the press table bottom plate along the X-axis direction through the multi-stage transmission mechanism.

[0015] The driven jacking device includes a driven jacking bearing seat, a transmission bearing fixing seat, a transmission bearing and a mounting angle seat. The driven jacking bearing seat is installed on the large plate fixing the material receiving plate through the mounting angle seat. The driven jacking bearing seat is connected to the multi-stage transmission mechanism. The transmission bearing fixing seat is a cam structure and is installed on the driven jacking bearing seat. A transmission bearing is installed on the inner top or bottom side of the transmission bearing fixing seat. The transmission bearing can contact the jacking partition on the bottom side of the inner pressing table bottom plate.

[0016] As a further improvement of the present invention, the carrier rotation device includes a jig mounting base plate, a carrier rotation power motor, a synchronous belt transmission mechanism, a platform rotation synchronous wheel, a platform rotation shaft and a rotating bearing. The carrier rotation power motor installed on the support platform base plate can be connected to the platform rotation shaft through a synchronous belt transmission mechanism. The platform rotation shaft is installed on the support platform base plate below through a rotating bearing. The platform rotation shaft is connected to the jig mounting base plate above through the platform rotation synchronous wheel, and the adsorption plate is positioned on the jig mounting base plate.

[0017] As a further improvement of the present invention, the fixture mounting base is provided with positioning pins for positioning the adsorption plate and adsorption magnets for adsorption of the adsorption plate, and at least one vacuum supply device is installed on the inner side of the platform rotation axis.

[0018] As a further improvement of the present invention, the synchronous belt transmission mechanism includes a synchronous wheel, a belt tensioning device and a carrier rotation synchronous belt. The driving end of the carrier rotation power motor is connected to the synchronous wheel, and the carrier rotation synchronous belt is installed between the synchronous wheel and the platform rotation shaft.

[0019] As a further improvement of the present invention, at least one belt tensioning wheel for tensioning the rotating synchronous belt of the carrier is installed on the side close to the synchronous wheel.

[0020] As a further improvement of the present invention, at least one of the pressing rings is provided with a notch, and a quick-change retaining ring block is installed on the bottom plate of the pressing table on at least one side of the pressing ring along the X-axis direction.

[0021] As a further improvement of the present invention, the multi-stage transmission mechanism includes a connecting rod shaft, a first-level synchronous pulley, a press-pushing and lifting synchronous belt and a second-level synchronous pulley. The driving end of the press-pushing and lifting power motor passes through a coupling and is connected to the transmission bearing fixing seat of the driven lifting device along the positive direction of the X-axis via the press-pushing and lifting synchronous belt and the second-level synchronous pulley; the driving end of the press-pushing and lifting power motor passes through a coupling and is connected to the transmission bearing fixing seat of the driven lifting device along the negative direction of the X-axis via the connecting rod shaft, the first-level synchronous pulley, the press-pushing and lifting synchronous belt and the second-level synchronous pulley, and the connecting rod shaft is installed on the material receiving plate fixing plate on both sides along the X-axis direction through the press-pushing and lifting bearing seats.

[0022] By means of the above solution, the present invention has at least the following advantages:

[0023] The present invention can select different processing platforms according to the product size and quickly replace them without complicated disassembly and assembly;

[0024] The present invention is compatible with multiple sizes and multiple series of product processing, which is convenient for switching equipment processing and changing models, saving labor costs;

[0025] The present invention can realize a one-time correction of the verticality between the carrier and the optical path cutting, and there is no need to re-correct the verticality and a series of other problems later, thereby avoiding poor batch processing of products and causing unnecessary property losses.

[0026] In order to cope with the adsorption function of warped products, two non-contact suction cups adsorb the warped products onto the fixture mounting base, and the pressure ring presses down on all sides of the product to completely smooth the product.

[0027] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 It is a structural schematic diagram of a compatible wafer backside marking fixture device of the present invention;

[0030] Figure 2 yes Figure 1 Schematic diagram of the structure of the middle support platform base plate, adsorption fixture carrier and carrier rotation device;

[0031] Figure 3 yes Figure 2 Schematic diagram of the structure of the medium adsorption fixture carrier;

[0032] Figure 4 yes Figure 1 Structural diagram of the front side of the middle lifting receiving platform;

[0033] Figure 5 yes Figure 1 Schematic diagram of the structure on the back of the middle lifting receiving platform when it is lifted;

[0034] Figure 6 yes Figure 1 Schematic diagram of the structure on the back of the middle lifting receiving platform when it descends;

[0035] Figure 7 yes Figure 1 Schematic diagram of the structure of the middle stage rotation device;

[0036] Figure 8 yes Figure 1 Structural diagram of the intermediate pressing table;

[0037] Figure 9 yes Figure 1 Structural diagram of the medium pressure material lifting device;

[0038] Figure 10 yes Figure 9 Schematic diagram of the structure of the driven jacking device.

[0039] The meanings of the reference numerals in the figures are as follows.

[0040] Support platform bottom plate Ⅰ, adsorption fixture carrier Ⅱ, lifting material receiving platform Ⅲ, carrier rotating device Ⅳ, pressing platform Ⅴ, pressing material lifting device Ⅵ;

[0041] Adsorption plate II-1, suction cup II-2, 1 / 4 marking area II-3;

[0042] Material receiving plate fixing large plate Ⅲ-1, material receiving plate Ⅲ-2, material lifting power motor Ⅲ-3, material lifting cam Ⅲ-4, large plate end contact bearing Ⅲ-5, material lifting guide rod Ⅲ-6, material lifting linear bearing Ⅲ-7;

[0043] Fixture mounting base plate IV-1, stage rotation power motor IV-2, synchronous pulley IV-3, belt tensioner IV-4, stage rotation synchronous belt IV-5, platform rotation synchronous pulley IV-6, positioning pin IV-7, adsorption magnet IV-8, platform rotation shaft IV-9, vacuum supply device IV-10, rotary bearing IV-11;

[0044] Pressing table bottom plate V-1, lifting partition V-2, quick-change buckle block V-3, lifting guide column V-4, guide bearing V-5, pressing ring V-6;

[0045] Pressing and jacking power motor VI-1, coupling VI-2, connecting rod shaft VI-3, pressing and jacking bearing seat VI-4, first-level synchronous pulley VI-5, pressing and jacking synchronous belt VI-6, second-level synchronous pulley VI-7, driven jacking device VI-8;

[0046] Driven lifting bearing seat VI-8-1, transmission bearing fixing seat VI-8-2, transmission bearing VI-8-3, installation angle seat VI-8-4. DETAILED DESCRIPTION

[0047] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0048] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0049] Example

[0050] like Figures 1 to 10 As shown:

[0051] A compatible wafer backside marking fixture device comprises a support base plate I, an adsorption fixture carrier II and a carrier rotating device IV, wherein the carrier rotating device IV is mounted on the support base plate I, and the adsorption fixture carrier II is mounted on the carrier rotating device IV;

[0052] Above the adsorption fixture carrier II, there are arranged a lifting material receiving platform III and a material pressing platform V in order from bottom to top, and a material pressing lifting device VI for lifting and lowering the material pressing platform V is provided on the lifting material receiving platform III;

[0053] The adsorption fixture carrier II includes an adsorption plate II-1, a 1 / 4 marking area II-3 is opened on the adsorption plate II-1, and at least one suction cup II-2 is installed on the adsorption plate II-1;

[0054] The lifting material receiving platform III includes a material receiving plate fixed large plate III-1, a material receiving plate III-2 and a lifting material receiving power motor III-3. The material receiving plate III-2 is installed in the middle cavity on the material receiving plate fixed large plate III-1. The bottom of the material receiving plate fixed large plate III-1 is lifted and lowered on the supporting platform bottom plate I below through lifting material receiving guide rods III-6. The top of the lifting material receiving guide rods III-6 is installed on the bottom of the material receiving plate fixed large plate III-1 through lifting material receiving linear bearings III-7. Lifting material receiving power motors III-3 are installed on the supporting platform bottom plate I below both sides of the material receiving plate fixed large plate III-1 along the X-axis direction. The lifting material receiving power motor III-3 can drive the lifting material receiving cam III-4 to contact the large plate end contact bearing III-5 above and installed on the material receiving plate fixed large plate III-1.

[0055] The pressing table V includes a pressing table bottom plate V-1 and a pressing ring V-6. The four sides of the bottom of the pressing table bottom plate V-1 are all lifted and lowered on the fixed large plate III-1 of the receiving plate below through lifting guide pillars V-4 and guide bearings V-5. The pressing ring V-6 is installed in the middle cavity of the pressing table bottom plate V-1.

[0056] The press-lifting device VI includes a press-lifting power motor VI-1, a multi-stage transmission mechanism and a driven lifting device VI-8. The press-lifting power motor VI-1 installed on one side of the fixed large plate III-1 of the material receiving plate can be connected to the driven lifting devices VI-8 located on both sides of the press table bottom plate V-1 along the X-axis direction through the multi-stage transmission mechanism.

[0057] The driven jacking device VI-8 includes a driven jacking bearing seat VI-8-1, a transmission bearing fixing seat VI-8-2, a transmission bearing VI-8-3 and an installation angle seat VI-8-4. The driven jacking bearing seat VI-8-1 is installed on the receiving plate fixing plate III-1 through the installation angle seat VI-8-4. The driven jacking bearing seat VI-8-1 is connected to the multi-stage transmission mechanism. The transmission bearing fixing seat VI-8-2 is a cam structure and is installed on the driven jacking bearing seat VI-8-1. A transmission bearing VI-8-3 is installed on the inner top or bottom side of the transmission bearing fixing seat VI-8-2. The transmission bearing VI-8-3 can contact the jacking partition V-2 on the bottom side of the inner pressing table bottom plate V-1.

[0058] Preferably, the carrier rotating device IV includes a jig mounting base plate IV-1, a carrier rotating power motor IV-2, a synchronous belt transmission mechanism, a platform rotating synchronous wheel IV-6, a platform rotating shaft IV-9 and a rotating bearing IV-11. The carrier rotating power motor IV-2 installed on the support platform base plate I can be connected to the platform rotating shaft IV-9 through a synchronous belt transmission mechanism. The platform rotating shaft IV-9 is installed on the lower support platform base plate I through a rotating bearing IV-11. The platform rotating shaft IV-9 is connected to the upper jig mounting base plate IV-1 through the platform rotating synchronous wheel IV-6. The adsorption plate II-1 is positioned on the jig mounting base plate IV-1.

[0059] Preferably, the fixture mounting base plate IV-1 is provided with a positioning pin IV-7 for positioning the adsorption plate II-1 and an adsorption magnet IV-8 for adsorption of the adsorption plate II-1, and at least one vacuum supply device IV-10 is installed on the inner side of the platform rotating shaft IV-9.

[0060] Preferably, the synchronous belt transmission mechanism includes a synchronous wheel IV-3, a belt tensioning device IV-4 and a carrier rotation synchronous belt IV-5. The driving end of the carrier rotation power motor IV-2 is connected to the synchronous wheel IV-3, and the carrier rotation synchronous belt IV-5 is installed between the synchronous wheel IV-3 and the platform rotation shaft IV-9.

[0061] Preferably, at least one belt tensioning pulley IV-4 for tensioning the carrier rotating synchronous belt IV-5 is installed on the side close to the synchronous pulley IV-3.

[0062] Preferably, at least one of the pressing rings V-6 is provided with a notch, and a quick-change buckle block V-3 is installed on the pressing table bottom plate V-1 on at least one side of the pressing ring V-6 along the X-axis direction.

[0063] Preferably, the multi-stage transmission mechanism includes a connecting rod shaft VI-3, a first-stage synchronous pulley VI-5, a press-lift synchronous belt VI-6 and a second-stage synchronous pulley VI-7. The driving end of the press-lift power motor VI-1 passes through a coupling VI-2 and is connected to a transmission bearing fixing seat VI-8-2 of a driven lifting device VI-8 along the positive direction of the X-axis via the press-lift synchronous belt VI-6 and the second-stage synchronous pulley VI-7. The driving end of the power motor VI-1 passes through the coupling VI-2 and is connected to the transmission bearing fixing seat VI-8-2 of the driven jacking device VI-8 on the negative direction of the X-axis through the connecting rod shaft VI-3, the first-level synchronous pulley VI-5, the pressing and lifting synchronous belt VI-6 and the second-level synchronous pulley VI-7, and the connecting rod shaft VI-3 is installed on the receiving plate fixed large plate III-1 on both sides along the X-axis direction through the pressing and lifting bearing seat VI-4.

[0064] See Figure 1 As shown, a carrier device for back-side marking of multi-size compatible wafers includes a support base plate I, an adsorption fixture carrier II, a lifting receiving platform III, a carrier rotation device IV, a press platform V, and a press lifting device VI. Its main working features are as follows: an external wafer robot delivers the wafer to the lifting receiving platform III (the initial position is raised). The lifting receiving platform III descends, and the wafer falls onto the adsorption fixture carrier II, which is adsorbed and fixed. The press platform V descends under the action of the press lifting device VI, pressing the wafer (the initial position of the press platform V is raised). The laser begins marking (operating in the 1 / 4 area). After this local marking is completed, the lifting and receiving platform III rises, driving the wafer off the adsorption fixture carrier II. The carrier rotation device IV drives the adsorption fixture carrier II to rotate 90 degrees. The lifting and receiving platform III descends, and the wafer is sent to the adsorption fixture carrier II. The laser begins marking (operating in the 1 / 4 area). The above steps are repeated until the front area marking is completed. The lifting device III rises, and the pressing platform V rises under the action of the pressing and lifting device. The wafer robot removes the marked wafer and replaces the wafer to be marked, and the action is repeated. The adsorption fixture carrier II, the receiving platform III, and the pressing platform V can be quickly replaced to accommodate 8-inch and 12-inch products.

[0065] like Figure 2 、 3 As shown in 7,

[0066] Adsorption fixture carrier II includes: adsorption plate II-1, suction cup II-2, and 1 / 4 marking area II-3.

[0067] The carrier rotation device IV includes: a fixture mounting base plate IV-1, a carrier rotation power motor IV-2, a synchronous pulley IV-3, a belt tensioning pulley IV-4, a carrier rotation synchronous belt IV-5, a platform rotation synchronous pulley IV-6, a positioning pin IV-7, an adsorption magnet IV-8, a platform rotation shaft IV-9, a vacuum supply device IV-10, and a rotating bearing IV-11.

[0068] The adsorption plate II-1 of the adsorption fixture carrier II is adsorbed on the fixture mounting base plate IV-1 through the positioning pin IV-7 and the adsorption magnet IV-8 (the adsorption plate II-1 can be quickly switched according to the wafer size), and the carrier rotation device IV is locked on the support platform base plate I.

[0069] Among them, suction cup II-2 is a non-contact suction cup. In order to cope with the adsorption function of warped products, two non-contact suction cups II-2 adsorb the warped products on the fixture mounting base IV-1, and the pressing ring V-6 presses down on all sides of the product to completely smooth the product.

[0070] The adsorption fixture II is positioned and adsorbed on the fixture mounting base plate IV-1 through the positioning pin. The rotation of the platform rotation power motor IV-2 drives the synchronous wheel IV-3 to rotate, and the belt tensioning wheel IV-4 drives the platform rotation synchronous belt IV-5 to rotate (the belt tensioning wheel IV-4 can adjust the tightness of the platform rotation synchronous belt IV-5). The platform rotation synchronous belt IV-5 is locked on the platform rotation shaft IV-9, and the platform rotation shaft IV-9 is connected to the support base plate I through the rotating bearing IV-11.

[0071] like Figures 4-6 As shown:

[0072] The jacking material receiving platform III includes: a material receiving plate fixing large plate III-1, a material receiving plate III-2, a jacking material receiving power motor III-3, a jacking material receiving cam III-4, a large plate end contact bearing III-5, a jacking material receiving guide rod III-6, and a jacking material receiving linear bearing III-7.

[0073] The receiving plate III-2 is adsorbed on the receiving plate fixed large plate III-1 by a magnet (the receiving plate III-2 can be quickly replaced according to the size of the wafer). The lifting receiving power motor III-3 drives the lifting receiving cam III-4 to rotate, and the lifting receiving cam III-4 drives the large plate end contact bearing III-5 fixed on the receiving plate fixed large plate III-1 to reciprocate up and down.

[0074] like Figures 8-10 As shown:

[0075] The pressing table V includes: a pressing table bottom plate V-1, a lifting partition plate V-2, a quick-change buckle block V-3, a lifting guide column V-4, a guide bearing V-5, and a pressing ring V-6.

[0076] The press jacking device VI includes: a press jacking power motor VI-1, a coupling VI-2, a connecting rod shaft VI-3, a press jacking bearing seat VI-4, a first-level synchronous pulley VI-5, a press jacking synchronous belt VI-6, a second-level synchronous pulley VI-7, and a driven jacking device VI-8.

[0077] The driven jacking device VI-8 includes: a driven jacking bearing seat VI-8-1, a transmission bearing fixing seat VI-8-2, a transmission bearing VI-8-3, and a mounting angle seat VI-8-4.

[0078] Material pressing and lifting device VI: The material pressing and lifting power motor VI-1 rotates through the coupling VI-2 to drive the connecting rod shaft VI-3 to rotate, and the driven lifting device VI-8 rotates through the first-level synchronous pulley VI-5, the material pressing and lifting synchronous belt VI-6, and the second-level synchronous pulley VI-7, thereby driving the material pressing table V to do up and down reciprocating motion.

[0079] Pressing table V: The quick-change retaining ring block V-3 is installed on the bottom plate V-1 of the pressing table. There are notches at both ends of the pressing ring V-6. When installing, you need to align the notches with the quick-change retaining ring block V-3 and press and rotate it to achieve quick change between 8-inch and 12-inch wafers.

[0080] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly referring to the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0081] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A compatible wafer backside marking fixture device, comprising a support base plate (I), an adsorption fixture carrier (II) and a carrier rotating device (IV), wherein the carrier rotating device (IV) is mounted on the support base plate (I), and the adsorption fixture carrier (II) is mounted on the carrier rotating device (IV); Its characteristics are: Above the adsorption fixture carrier (II), a lifting material receiving platform (III) and a material pressing platform (V) are sequentially arranged from bottom to top, and a material pressing lifting device (VI) for lifting and lowering the material pressing platform (V) is arranged on the lifting material receiving platform (III); The adsorption fixture carrier (II) includes an adsorption plate (II-1), a 1 / 4 marking area (II-3) is opened on the adsorption plate (II-1), and at least one suction cup (II-2) is installed on the adsorption plate (II-1); The lifting material receiving platform (III) includes a material receiving plate fixing plate (III-1), a material receiving plate (III-2) and a lifting material receiving power motor (III-3). The material receiving plate (III-2) is installed in the middle cavity of the material receiving plate fixing plate (III-1). The bottom of the material receiving plate fixing plate (III-1) is lifted and lowered on the supporting platform bottom plate (I) through lifting material receiving guide rods (III-6). The top of the lifting material receiving guide rod (III-6) is lifted and lowered through the lifting material receiving guide rod (III-6). A lifting material receiving linear bearing (III-7) is installed at the bottom of the material receiving plate fixed large plate (III-1), and a lifting material receiving power motor (III-3) is installed on the support platform bottom plate (I) below both sides of the material receiving plate fixed large plate (III-1) along the X-axis direction. The lifting material receiving power motor (III-3) can drive the lifting material receiving cam (III-4) to contact the large plate end contact bearing (III-5) installed on the upper part of the material receiving plate fixed large plate (III-1); The pressing platform (V) includes a pressing platform bottom plate (V-1) and a pressing ring (V-6). The four sides of the bottom of the pressing platform bottom plate (V-1) are all lifted and lowered on the fixed plate (III-1) of the receiving plate below through lifting guide pillars (V-4) and guide bearings (V-5). The pressing ring (V-6) is installed in the middle cavity of the pressing platform bottom plate (V-1). The material pressing and lifting device (VI) includes a material pressing and lifting power motor (VI-1), a multi-stage transmission mechanism and a driven lifting device (VI-8). The material pressing and lifting power motor (VI-1) installed on one side of the material receiving plate fixing plate (III-1) can be connected to the driven lifting devices (VI-8) located on both sides of the material pressing table bottom plate (V-1) along the X-axis direction through the multi-stage transmission mechanism. The driven jacking device (VI-8) includes a driven jacking bearing seat (VI-8-1), a transmission bearing fixing seat (VI-8-2), a transmission bearing (VI-8-3) and a mounting angle seat (VI-8-4). The driven jacking bearing seat (VI-8-1) is mounted on the material receiving plate fixing plate (III-1) through the mounting angle seat (VI-8-4). The driven jacking bearing seat (VI-8-1) is connected to the multi-stage transmission bearing fixing seat (VI-8-2). The transmission bearing fixing seat (Ⅵ-8-2) is a cam structure and is installed on the driven lifting bearing seat (Ⅵ-8-1). A transmission bearing (Ⅵ-8-3) is installed on the inner top or bottom side of the transmission bearing fixing seat (Ⅵ-8-2). The transmission bearing (Ⅵ-8-3) can contact the lifting partition (Ⅴ-2) on the bottom side of the inner pressing table bottom plate (Ⅴ-1).

2. The compatible wafer backside marking fixture device according to claim 1, characterized in that: The platform rotating device (Ⅳ) includes a fixture mounting base plate (Ⅳ-1), a platform rotating power motor (Ⅳ-2), a synchronous belt transmission mechanism, a platform rotating synchronous wheel (Ⅳ-6), a platform rotating shaft (Ⅳ-9) and a rotating bearing (Ⅳ-11). The platform rotating power motor (Ⅳ-2) installed on the support platform base plate (Ⅰ) can be connected to the platform rotating shaft (Ⅳ-9) through a synchronous belt transmission mechanism. The platform rotating shaft (Ⅳ-9) is installed on the lower support platform base plate (Ⅰ) through a rotating bearing (Ⅳ-11). The platform rotating shaft (Ⅳ-9) is connected to the upper fixture mounting base plate (Ⅳ-1) through the platform rotating synchronous wheel (Ⅳ-6). The adsorption plate (Ⅱ-1) is positioned on the fixture mounting base plate (Ⅳ-1).

3. The compatible wafer backside marking fixture device according to claim 2, characterized in that: The jig mounting base (Ⅳ-1) is provided with a positioning pin (Ⅳ-7) for positioning the adsorption plate (Ⅱ-1) and an adsorption magnet (Ⅳ-8) for adsorbing the adsorption plate (Ⅱ-1), and at least one vacuum supply device (Ⅳ-10) is installed on the inner side of the platform rotation shaft (Ⅳ-9).

4. The compatible wafer backside marking fixture device according to claim 2, characterized in that: The synchronous belt transmission mechanism includes a synchronous wheel (Ⅳ-3), a belt tensioning device (Ⅳ-4) and a carrier rotation synchronous belt (Ⅳ-5). The driving end of the carrier rotation power motor (Ⅳ-2) is connected to the synchronous wheel (Ⅳ-3), and the carrier rotation synchronous belt (Ⅳ-5) is installed between the synchronous wheel (Ⅳ-3) and the platform rotation shaft (Ⅳ-9).

5. The compatible wafer backside marking fixture device according to claim 4, characterized in that: At least one belt tensioning wheel (IV-4) for tensioning the carrier rotating synchronous belt (IV-5) is installed on a side close to the synchronous wheel (IV-3).

6. The compatible wafer backside marking fixture device according to claim 1, characterized in that: At least one of the pressing rings (V-6) is provided with a notch, and a quick-change buckle block (V-3) is installed on the pressing table bottom plate (V-1) on at least one side of the pressing ring (V-6) along the X-axis direction.

7. The compatible wafer backside marking fixture device according to claim 1, characterized in that: The multi-stage transmission mechanism includes a connecting rod shaft (VI-3), a first-stage synchronous pulley (VI-5), a material pressing and lifting synchronous belt (VI-6) and a second-stage synchronous pulley (VI-7); the driving end of the material pressing and lifting power motor (VI-1) is connected to the transmission bearing fixing seat (VI-8-2) of the driven lifting device (VI-8) along the positive direction of the X-axis through the material pressing and lifting synchronous belt (VI-6) and the second-stage synchronous pulley (VI-7); the material pressing and lifting power motor (VI-1) is connected to the transmission bearing fixing seat (VI-8-2) of the driven lifting device (VI-8) along the positive direction of the X-axis through the coupling (VI-2); The driving end of the power motor (VI-1) passes through the coupling (VI-2) and is connected to the transmission bearing fixing seat (VI-8-2) of the driven jacking device (VI-8) along the negative direction of the X-axis through the connecting rod shaft (VI-3), the first-level synchronous pulley (VI-5), the pressing and lifting synchronous belt (VI-6) and the second-level synchronous pulley (VI-7), and the connecting rod shaft (VI-3) is installed on the material receiving plate fixing plate (III-1) on both sides along the X-axis direction through the pressing and lifting bearing seat (VI-4).

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