Chip package structure

Abstract

This invention discloses a chip packaging structure, comprising: a housing having a storage cavity; a chip disposed in the storage cavity; and a heat dissipation assembly including a liquid cooling plate and a conduit. The liquid cooling plate is disposed in the storage cavity and thermally connected to the chip. A first end of the conduit is disposed in the storage cavity and communicates with the liquid cooling plate, and a second end of the conduit protrudes beyond the housing. When the liquid cooling plate is pressed and moves within the storage cavity, it can drive the conduit to move relative to the housing. This chip packaging structure effectively avoids failure at the connection between the conduit and the liquid cooling plate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a chip packaging structure. Background Technology

[0002] In related technologies, the higher the power density of a semiconductor power module, the greater its heat generation. When the heat generation of a semiconductor power module is high, if the power module is not cooled, it will lead to both unstable operation and a shorter lifespan.

[0003] Existing power modules use liquid cooling plates to dissipate heat from the chip. Specifically, after the liquid cooling plate comes into contact with the chip, a cooling medium is introduced into the liquid cooling plate through pipes. The circulating cooling medium can quickly remove the heat generated by the chip. In practical applications, existing power modules are placed in module fixtures. In some cases, the module fixtures apply pressure to the power module, which can cause the liquid cooling plate to move, creating a downward shear force at the interface between the liquid cooling plate and the pipes, thereby damaging the connection between the pipes and the liquid cooling plate. Thus, after the connection between the pipes and the liquid cooling plate is damaged, the cooling medium will leak out from the damaged area, potentially causing the semiconductor power module to fail. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a chip packaging structure that can effectively avoid failure at the connection between the pipe and the liquid cooling plate.

[0005] A chip packaging structure according to a first aspect of the present invention includes:

[0006] The casing has a storage cavity;

[0007] The chip is disposed in the storage cavity;

[0008] A heat dissipation assembly includes a liquid cooling plate and a pipe. The liquid cooling plate is disposed in the storage cavity and is thermally connected to the chip. The first end of the pipe is disposed in the storage cavity and communicates with the liquid cooling plate, and the second end of the pipe protrudes outside the housing. When the liquid cooling plate is pressed and moves in the storage cavity, the liquid cooling plate can drive the pipe to move relative to the housing.

[0009] The chip packaging structure according to embodiments of the present invention has at least the following beneficial effects: after the liquid cooling plate and the chip are thermally connected, the liquid cooling plate can dissipate heat from the chip. When the liquid cooling plate is pressed and moves in the storage cavity, the liquid cooling plate can drive the pipe to move relative to the housing. Specifically, since the pipe and the liquid cooling plate can move together relative to the housing, the connection between the liquid cooling plate and the pipe will not be damaged by shear force when the liquid cooling plate is pressed. Thus, the pipe can continue to deliver cooling medium to the liquid cooling plate. The liquid cooling plate can ensure good heat dissipation effect on the chip and can also effectively avoid failure at the connection between the pipe and the liquid cooling plate.

[0010] According to some embodiments of the chip packaging structure of the present invention, the housing is provided with a first through hole communicating with the storage cavity, the pipe passes through the first through hole, and along the movement direction of the liquid cooling plate, the size of the first through hole is larger than the size of the pipe.

[0011] According to some embodiments of the chip packaging structure of the present invention, the heat dissipation assembly further includes a slider and a cover plate. The housing is also provided with a sliding groove, the sliding groove being connected to the first through hole. The slider is provided with a second through hole, and the cover plate is provided with a third through hole. Along the movement direction of the liquid cooling plate, the size of the second through hole is equal to the size of the pipe, and the size of the third through hole is larger than the size of the pipe. The slider is located in the sliding groove, and the cover plate is connected to the housing to close the opening of the sliding groove. The pipe passes through the first through hole, the second through hole, and the third through hole in sequence. Along the direction in which the pipe enters the first through hole, the projection of the first through hole falls on the slider. When the liquid cooling plate is pressed and moves, the pipe can drive the slider to slide along the sliding groove.

[0012] According to some embodiments of the chip packaging structure of the present invention, the heat dissipation assembly further includes a first seal and a second seal, wherein the first seal is disposed between the groove wall of the sliding groove and the slider, and the second seal is disposed between the pipe and the slider.

[0013] According to some embodiments of the present invention, in the chip packaging structure, the heat dissipation component further includes a flexible element that is deformable, the conduit passing through the flexible element, and the flexible element being connected to the wall of the first through hole to close the first through hole.

[0014] According to some embodiments of the chip packaging structure of the present invention, the heat dissipation assembly further includes a slider. The housing includes a main body and a protrusion. The main body is provided with a sliding groove communicating with the first through hole. The protrusion is connected to the groove wall of the sliding groove and protrudes outward. The slider is disposed in the sliding groove, and the protrusion and the groove wall of the sliding groove together clamp the opposite sides of the slider. The slider is provided with a second through hole. Along the movement direction of the liquid cooling plate, the size of the second through hole is equal to the size of the pipe. The pipe passes through the first through hole and the second through hole in sequence. Along the direction in which the pipe enters the first through hole, the projection of the first through hole falls on the slider. When the liquid cooling plate is pressed and moves, the pipe can drive the slider to slide along the sliding groove.

[0015] According to some embodiments of the present invention, in a chip packaging structure, the liquid cooling plate internally defines an inlet, an outlet, and a flow channel, both the outlet and the inlet being connected to the flow channel, and two pipes are provided, one pipe being connected to the inlet and the other pipe being connected to the outlet; wherein at least a portion of the flow channel is curved.

[0016] According to some embodiments of the chip packaging structure of the present invention, the liquid cooling plate has flow guide columns, and multiple flow channels are provided. The flow guide columns are used to divert the cooling medium entering from the inlet to each of the flow channels.

[0017] According to some embodiments of the present invention, the chip is in contact with the surface of the liquid cooling plate.

[0018] A chip packaging structure according to a second aspect of the present invention includes:

[0019] The casing has a storage cavity;

[0020] The chip is disposed in the storage cavity;

[0021] The heat dissipation assembly includes a liquid cooling plate and pipes, wherein the liquid cooling plate is disposed in the storage cavity and is thermally connected to the chip.

[0022] The pipeline includes a first pipe and a second pipe connected to each other. The first pipe is a flexible pipe, which is disposed in the storage cavity and communicates with the liquid cooling plate. The second pipe is connected to the housing and protrudes out of the housing. When the liquid cooling plate is pressed and moves in the storage cavity, the liquid cooling plate can drive the first pipe to bend.

[0023] The chip packaging structure according to embodiments of the present invention has at least the following beneficial effects: after the liquid cooling plate and the chip are thermally connected, the liquid cooling plate can dissipate heat for the chip. When the liquid cooling plate is pressed and moves in the storage cavity, since the first tube is a flexible tube that can be bent, the liquid cooling plate can drive the first tube to move relative to the housing. Specifically, since the first tube and the liquid cooling plate can move together relative to the housing, the connection between the liquid cooling plate and the first tube will not be damaged by shear force when the liquid cooling plate is pressed. Thus, the pipe can continue to deliver cooling medium to the liquid cooling plate, and the liquid cooling plate can ensure good heat dissipation effect on the chip, while also effectively preventing failure of the connection between the pipe and the liquid cooling plate.

[0024] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0026] Figure 1 This is a schematic diagram of the chip packaging structure according to the first embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the liquid cooling plate and pipes in the chip packaging structure of some embodiments of the present invention;

[0028] Figure 3 This is a partially exploded view of the chip packaging structure according to some embodiments of the present invention;

[0029] Figure 4 This is a schematic diagram of the chip packaging structure according to the second embodiment of the present invention;

[0030] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0031] Figure 6 This is a schematic diagram of the first sealing element in a chip packaging structure according to some embodiments of the present invention;

[0032] Figure 7 This is a schematic diagram of a liquid cooling plate in a chip packaging structure according to some embodiments of the present invention;

[0033] Figure 8 This is a cross-sectional schematic diagram of the liquid cooling plate in the chip packaging structure of some embodiments of the present invention.

[0034] Figure label:

[0035] The chip packaging structure includes a housing 100, a storage cavity 110, a first through hole 120, a sliding groove 130, a heat dissipation component 200, a liquid cooling plate 210, an inlet 211, an outlet 212, a flow channel 213, a guide column 214, a pipe 220, a first end 221, a second end 222, a slider 230, a second through hole 231, a cover plate 240, a third through hole 241, and a first seal 250. Detailed Implementation

[0036] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0037] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0038] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0039] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0040] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0041] In related technologies, the higher the power density of a semiconductor power module, the greater its heat generation. When the heat generation of a semiconductor power module is high, if the power module is not cooled, it will lead to both unstable operation and a shorter lifespan.

[0042] Existing power modules dissipate heat from the chip via a liquid cooling plate 210. Specifically, after the liquid cooling plate 210 comes into contact with the chip, a cooling medium is introduced into the liquid cooling plate 210 through a pipe 220. The circulating cooling medium can quickly remove heat from the chip. Specifically, the pipe 220 passes through the housing 100 and connects to the liquid cooling plate 210. The pipe 220 and the housing 100 are fixedly connected. However, existing power modules may come into contact with external objects in practice. When these external objects exert significant pressure on the power module—specifically, when external pressure acts on the top cover of the housing 100—causing deformation of the top cover, this can further cause the liquid cooling plate 210 to move. This creates a downward shear force at the interface between the liquid cooling plate 210 and the pipe 220, potentially disrupting the connection between the pipe 220 and the liquid cooling plate 210. For example, the connection between the pipe 220 and the liquid cooling plate 210 may break, or the connection may rupture, allowing the cooling medium to leak out. On the one hand, damage at the connection between pipe 220 and liquid cooling plate 210 will result in less cooling medium circulating within liquid cooling plate 210, thereby reducing the heat dissipation performance of the semiconductor power module. On the other hand, overflow of cooling medium may cause the semiconductor power module to fail. Therefore, this application proposes a chip packaging structure 10.

[0043] Please refer to Figure 1 In some embodiments, the chip package structure 10 includes a housing 100, a chip (not shown), and a heat dissipation assembly 200. The housing 100 has a storage cavity 110, and the housing 100 can be square or spherical. The chip is disposed in the storage cavity 110. Multiple chips can be present. The heat dissipation assembly 200 includes a liquid cooling plate 210 and a conduit 220. The liquid cooling plate 210 is disposed in the storage cavity 110 and is thermally connected to the chip. Specifically, the thermal connection can involve contact between the chip and the liquid cooling plate 210 without any coating or padding of other materials in between, effectively reducing contact thermal resistance. Please refer to... Figure 2The first end 221 of the pipe 220 is disposed in the storage cavity 110 and communicates with the liquid cooling plate 210, and the second end 222 of the pipe 220 passes through the housing 100 and protrudes out of the housing 100. When the liquid cooling plate 210 is pressed and moves in the storage cavity 110, the liquid cooling plate 210 can drive the pipe 220 to move relative to the housing 100. After the liquid cooling plate 210 and the chip are thermally connected, the liquid cooling plate 210 can dissipate heat from the chip. When the liquid cooling plate 210 is pressed and moves within the storage cavity 110, it can drive the pipe 220 to move relative to the housing 100. Specifically, since the pipe 220 and the liquid cooling plate 210 can move together relative to the housing 100, the connection between the liquid cooling plate 210 and the pipe 220 will not be damaged by shear force when the liquid cooling plate 210 is under pressure. Therefore, the pipe 220 can continue to deliver cooling medium to the liquid cooling plate 210, ensuring good heat dissipation for the chip and effectively preventing failure at the connection between the pipe 220 and the liquid cooling plate 210. Thus, the chip packaging structure 10 not only has good heat dissipation performance but also high reliability. The chip packaging structure 10 can be used in grid inverters or converters.

[0044] The following explains how the liquid cooling plate 210 can drive the pipe 220 to move relative to the housing 100. For details, please refer to [link to relevant documentation]. Figure 4 and Figure 5 In some embodiments, the housing 100 is provided with a first through hole 120 communicating with the storage cavity 110. A pipe 220 passes through the first through hole 120. Along the movement direction of the liquid cooling plate 210, the size of the first through hole 120 is larger than the size of the pipe 220. The movement direction of the liquid cooling plate 210 refers to the following: when the liquid cooling plate 210 is placed flat in the storage cavity 110 of the housing 100, it will move in the height direction of the housing 100 under pressure; therefore, the movement direction of the liquid cooling plate 210 can be the height direction of the housing 100. When the liquid cooling plate 210 is placed sideways in the storage cavity 110 of the housing 100, it will move in the width direction of the housing 100 under pressure; therefore, the movement direction of the liquid cooling plate 210 can be the width direction of the housing 100. Specifically, the larger size of the first through hole 120 than the pipe 220 means that when the pipe 220 is cylindrical, the first through hole 120 is circular, and the diameter of the first through hole 120 is larger than the diameter of the pipe 220. When the pipe 220 is square, the first through hole 120 is also square, with both its length and width exceeding those of the pipe 220. Alternatively, the pipe 220 can be cylindrical, and the first through hole 120 can be oblong. Thus, a gap exists between the pipe 220 and the first through hole 120 (see reference for details). Figure 5 The pipe 220 can move within the first through hole 120, thereby preventing damage to the connection between the pipe 220 and the liquid cooling plate 210.

[0045] In some cases, it is necessary to provide gas insulation for the chip within the chip package structure 10. That is, the storage cavity 110 inside the housing 100 is configured as a sealed space. For details, please refer to... Figure 2 and Figure 3 In some embodiments, the heat dissipation assembly 200 further includes a slider 230 and a cover plate 240. The housing 100 is also provided with a sliding groove 130, which communicates with the first through hole 120. The slider 230 is provided with a second through hole 231, and the cover plate 240 is provided with a third through hole 241. Along the movement direction of the liquid cooling plate 210, the size of the second through hole 231 is equal to the size of the pipe 220, and the size of the third through hole 241 is larger than the size of the pipe 220. The slider 230 is located in the sliding groove 130, and the cover plate 240 is connected to the housing 100 to close the opening of the sliding groove 130. The pipe 220 passes sequentially through the first through hole 120, the second through hole 231, and the third through hole 241. Along the direction in which the pipe 220 enters the first through hole 120, the projection of the first through hole 120 falls on the slider 230. When the liquid cooling plate 210 is pressed and moves, the pipe 220 can drive the slider 230 to slide along the sliding groove 130. Specifically, when the size of the second through-hole 231 is equal to the size of the pipe 220, and the projection of the first through-hole 120 falls on the slider 230 along the direction in which the pipe 220 passes through the first through-hole 120, the slider 230 slides in the sliding groove 130. The slider 230 can cover the first through-hole 120, thus sealing the first through-hole 120. Furthermore, after the cover plate 240 is connected to the housing 100, it can seal the slider 230 in the sliding groove 130, preventing the slider 230 from falling out. And because the size of the third through-hole 241 is larger than the size of the pipe 220, and the size of the first through-hole 120 is larger than the size of the pipe 220, when the pipe 220 and the slider 230 move together, the pipe 220 will not contact the housing 100 or the cover plate 240, thus preventing damage to the connection between the pipe 220 and the liquid cooling plate 210. In essence, the chip packaging structure 10 not only has good heat dissipation but also good sealing performance.

[0046] Furthermore, to improve the sealing performance of the chip package structure 10, a sealing element can be incorporated. For details, please refer to... Figure 6In some embodiments, the heat dissipation assembly 200 further includes a first seal 250 and a second seal (the second seal can be referenced to the first seal 250). The first seal 250 is disposed between the groove wall of the sliding groove 130 and the slider 230, and the second seal is disposed between the pipe 220 and the slider 230. The first seal 250 can be a sealing ring. The groove wall of the sliding groove 130 has a sealing groove, and the sealing ring is disposed in the sealing groove. The slider 230 abuts against the groove wall of the sliding groove 130. Thus, with the first seal 250 added between the sliding groove 130 and the slider 230, when the slider 230 slides relative to the sliding groove 130, the first seal 250 can prevent external gas from entering the storage chamber 110. The second seal can also be a sealing ring. The slider 230 has a sealing groove, and the sealing ring is disposed in the sealing groove. After the pipe 220 passes through the slider 230, the sealing ring is located between the slider 230 and the pipe 220. Thus, by adding a second seal between the pipe 220 and the slider 230, the sealing performance of the pipe 220 after passing through the slider 230 can be guaranteed to be good. The second seal can prevent external gas from entering the storage chamber 110.

[0047] Besides the aforementioned use of slider 230 and cover plate 240 to enable chip packaging structure 10 to have both good heat dissipation and good sealing, there are other methods. Specifically, in some embodiments, the heat dissipation component 200 also includes a flexible element that can deform. The pipe 220 passes through the flexible element, and the flexible element is connected to the wall of the first through hole 120 to close the first through hole 120. Specifically, the flexible element can be soft leather. The first through hole 120 can be circular, and the leather can also be circular. The area of ​​the leather is larger than the area of ​​the first through hole 120. The outer periphery of the leather is connected to the wall of the first through hole 120, and the inner periphery of the leather is connected to the pipe 220. The leather can act like a gear shift sleeve, not only closing the first through hole 120 but also moving with the pipe 220 when it moves. Specifically, the deformation characteristics of the flexible element can adapt to the movement needs of the pipe 220. In addition, the flexible component can also be made of latex. After the latex seals the first through hole 120, it can provide good sealing performance. Furthermore, the deformable nature of latex ensures that it will not obstruct the movement of the pipe 220.

[0048] Besides the aforementioned method of using slider 230 and cover plate 240 to enable chip package structure 10 to have both good heat dissipation and good sealing, there are other methods. Specifically, in some embodiments, heat dissipation assembly 200 also includes slider 230. Housing 100 includes a main body and a protrusion. The main body is provided with a sliding groove 130 communicating with the first through hole 120. The protrusion is connected to and protrudes from the groove wall of sliding groove 130. Slider 230 is disposed in sliding groove 130, and the protrusion and the groove wall of sliding groove 130 together clamp the opposite sides of slider 230. It is conceivable that the distance between the protrusion and the groove wall of sliding groove 130 is equal to the thickness of slider 230. In this way, slider 230 can be slidably disposed in sliding groove 130, and due to the presence of protrusion, it can be ensured that slider 230 will not detach from sliding groove 130. The slider 230 is provided with a second through hole 231. Along the movement direction of the liquid cooling plate 210, the size of the second through hole 231 is equal to the size of the pipe 220. The pipe 220 passes sequentially through the first through hole 120 and the second through hole 231. Along the direction in which the pipe 220 enters the first through hole 120, the projection of the first through hole 120 falls on the slider 230. When the liquid cooling plate 210 is pressed and moves, the pipe 220 can drive the slider 230 to slide along the sliding groove 130. Specifically, when the size of the second through hole 231 is equal to the size of the pipe 220, and along the direction in which the pipe 220 enters the first through hole 120, the projection of the first through hole 120 falls on the slider 230, the slider 230 slides in the sliding groove 130. The slider 230 can cover the first through hole 120, thus sealing the first through hole 120. Furthermore, the protrusion and the groove wall of the sliding groove 130 together clamp the slider 230, preventing it from falling out. Therefore, when the pipe 220 and the slider 230 move together, the pipe 220 will not come into contact with the housing 100, thus preventing damage to the connection between the pipe 220 and the liquid cooling plate 210. Specifically, the chip packaging structure 10 not only has good heat dissipation but also good sealing performance.

[0049] The specific structure of the liquid cooling plate 210 is described below. Please refer to [link / reference]. Figure 7 and Figure 8In some embodiments, the liquid cooling plate 210 internally defines an inlet 211, an outlet 212, and a flow channel 213. Both the outlet 212 and the inlet 211 communicate with the flow channel 213. Two pipes 220 are provided, one communicating with the inlet 211 and the other with the outlet 212. At least a portion of the flow channel 213 is curved. Specifically, the curved configuration of at least a portion of the flow channel 213 can be a U-shaped arrangement surrounding the interior of the liquid cooling plate 210. Alternatively, the curved configuration of at least a portion of the flow channel 213 can be a labyrinthine arrangement surrounding the interior of the liquid cooling plate 210. The flow channel 213 may include multiple U-shaped surrounding areas, rather than a single, continuous U-shaped area. Similarly, a labyrinthine flow channel is also possible. The curved configuration of the flow channel 213 allows for uniform distribution of the cooling medium and slows down the flow rate, ensuring uniform heat dissipation from the chip, thus minimizing the temperature difference between the various power chips. The cooling medium can be a gas or a liquid, such as liquid nitrogen or ice water.

[0050] Furthermore, by setting multiple flow channels 213, the liquid cooling plate 210 can achieve uniform heat dissipation for multiple chips, thereby minimizing the temperature difference between the chips. For details, please refer to... Figure 8 In some embodiments, the liquid cooling plate 210 has flow guide columns 214, and multiple flow channels 213 are provided. The flow guide columns 214 are used to divert the cooling medium entering from the inlet 211 into each flow channel 213. The flow guide columns 214 are located at the inlet 211 and are cylindrical. Multiple flow guide columns 214 are provided, for example, eight. The eight flow guide columns 214 are spaced apart. After passing through the flow guide columns 214, the cooling medium is diverted and then enters each flow channel 213.

[0051] Furthermore, in some embodiments, the chip abuts against the surface of the liquid cooling plate 210. Specifically, the chip packaging structure 10 has a plurality of chips and liquid cooling plates 210. Multiple chips abut against the surface of each liquid cooling plate 210, and then the multiple liquid cooling plates 210 are stacked. Wherein, after the chip abuts against the surface of the liquid cooling plate 210, no coating or padding of other materials is required between the chip and the liquid cooling plate 210, which effectively reduces contact thermal resistance and improves the cooling effect of the liquid cooling plate 210 on the chip. In addition, terminals can be provided on the liquid cooling plate 210, and then the chip can be mounted on the terminals, which also allows the chip and the liquid cooling plate 210 to make direct contact.

[0052] The chip packaging structure 10 can also be implemented in other ways. In some embodiments, the chip packaging structure 10 includes a housing 100, a chip, and a heat dissipation assembly 200. The housing 100 has a storage cavity 110. The chip is disposed in the storage cavity 110. The heat dissipation assembly 200 includes a liquid cooling plate 210 and a conduit 220. The liquid cooling plate 210 is disposed in the storage cavity 110 and is thermally connected to the chip. The conduit 220 includes a first tube and a second tube connected to each other. The first tube is a flexible tube. Specifically, the flexible tube can be one of a variety of materials such as a fluoroplastic hose, a polyurethane hose, a rubber hose, and a plastic corrugated pipe. The first tube is disposed in the storage cavity 110 and communicates with the liquid cooling plate 210. The second tube is connected to the housing 100 and protrudes beyond the housing 100. The second tube can be a flexible tube or a rigid tube. A rigid tube can have higher strength. When the liquid cooling plate 210 is pressed and moves in the storage cavity 110, the liquid cooling plate 210 can cause the first tube to bend. After the liquid cooling plate 210 and the chip are thermally connected, the liquid cooling plate 210 can dissipate heat for the chip. When the liquid cooling plate 210 is pressed and moves within the storage cavity 110, the first tube, being a flexible tube, can bend. Therefore, the liquid cooling plate 210 can drive the first tube to move relative to the housing 100. Specifically, since the first tube and the liquid cooling plate 210 can move together relative to the housing 100, the connection between the liquid cooling plate 210 and the first tube will not be damaged by shear force when the liquid cooling plate 210 is pressed. Thus, the pipe 220 can continue to deliver cooling medium to the liquid cooling plate 210. The liquid cooling plate 210 can ensure good heat dissipation for the chip and effectively prevent failure at the connection between the pipe 220 and the liquid cooling plate 210. Therefore, the chip packaging structure 10 not only has good heat dissipation performance but also high reliability.

[0053] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A chip package structure, characterized by, The application relates to a chip cooling device. The chip cooling device comprises a shell, a chip, and a heat dissipation assembly. The shell has a storage cavity. The chip is arranged in the storage cavity. The heat dissipation assembly comprises a liquid cooling plate and a pipe. The liquid cooling plate is arranged in the storage cavity and is in heat conduction connection with the chip. The first end of the pipe is arranged in the storage cavity and is in communication with the liquid cooling plate.

2. The chip package structure of claim 1, wherein, The second end of the pipe protrudes out of the shell.

3. The chip package structure of claim 1, wherein, When the liquid cooling plate is pressed to move in the storage cavity, the liquid cooling plate can drive the pipe to move relative to the shell.

4. The chip package structure of claim 1, wherein, The shell is provided with a first through hole in communication with the storage cavity.

5. The chip package structure of claim 1, wherein, The pipe is arranged in the first through hole.

6. A chip package structure, characterized by In the moving direction of the liquid cooling plate, the size of the first through hole is larger than the size of the pipe. The heat dissipation assembly further comprises a sliding block and a cover plate. The shell is further provided with a sliding groove in communication with the first through hole. The sliding block is provided with a second through hole. The cover plate is provided with a third through hole. In the moving direction of the liquid cooling plate, the size of the second through hole is equal to the size of the pipe. The size of the third through hole is larger than the size of the pipe. The sliding block is arranged in the sliding groove. The cover plate is connected to the shell to close the opening of the sliding groove. The pipe is arranged in the first through hole, the second through hole and the third through hole in sequence. In the direction of the pipe penetrating into the first through hole, the projection of the first through hole falls on the sliding block. When the liquid cooling plate is pressed to move, the pipe can drive the sliding block to slide along the sliding groove. The liquid cooling plate is internally defined with an inlet, an outlet and a flow channel. The outlet and the inlet are in communication with the flow channel. The pipe is provided with two pipes. One pipe is in communication with the inlet. The other pipe is in communication with the outlet. At least part of the flow channel is arranged in a curved mode. The heat dissipation assembly further comprises a first sealing member and a second sealing member. The first sealing member is arranged between the groove wall of the sliding groove and the sliding block. The second sealing member is arranged between the pipe and the sliding block. The heat dissipation assembly further comprises a flexible member. The flexible member can be deformed. The pipe is arranged in the flexible member. The flexible member is connected to the hole wall of the first through hole to close the first through hole. The liquid cooling plate has a flow guide column. The flow channel is provided with multiple flow channels. The flow guide column is used for distributing the cooling medium entering from the inlet into each flow channel. The chip abuts against the surface of the liquid cooling plate. The application relates to a chip cooling device. The chip cooling device comprises a shell, a chip, and a heat dissipation assembly. The shell has a storage cavity. The chip is arranged in the storage cavity. The heat dissipation assembly comprises a liquid cooling plate and a pipe. The liquid cooling plate is arranged in the storage cavity and is in heat conduction connection with the chip. The first end of the pipe is arranged in the storage cavity and is in communication with the liquid cooling plate. The second end of the pipe protrudes out of the shell. When the liquid cooling plate is pressed to move in the storage cavity, the liquid cooling plate can drive the pipe to move relative to the shell. The shell is provided with a first through hole in communication with the storage cavity. The pipe is arranged in the first through hole. In the moving direction of the liquid cooling plate, the size of the first through hole is larger than the size of the pipe. The heat dissipation assembly further comprises a sliding block, the shell comprises a main body part and a protruding part, the main body part is provided with a sliding groove communicated with the first through hole, the protruding part is connected to the groove wall of the sliding groove and protrudes, the sliding block is arranged in the sliding groove, and the protruding part and the groove wall of the sliding groove jointly clamp opposite sides of the sliding block; the sliding block is provided with a second through hole, the size of the second through hole is equal to the size of the pipeline along the movement direction of the liquid cooling plate, the pipeline is sequentially arranged in the first through hole and the second through hole, and the projection of the first through hole falls on the sliding block along the direction in which the pipeline penetrates into the first through hole; when the liquid cooling plate is pressed to move, the pipeline can drive the sliding block to slide along the sliding groove; The liquid cooling plate is internally defined with an inlet, an outlet and a flow channel, the outlet and the inlet are communicated with the flow channel, and the pipeline is provided with two, one of the pipelines is communicated with the inlet, and the other pipeline is communicated with the outlet; wherein at least part of the flow channel is arranged in a curved manner.

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