A guard for a waveguide load

Abstract

The utility model relates to a kind of compression waveguide load protection device, belong to compression waveguide load protection technical field, to solve the problem that waveguide load terminal device cannot provide shock absorption protection after falling to ground, heat cannot be guided when waveguide load terminal device high-power use and waveguide load shell natural cooling cooling efficiency is slower.The upper and lower surfaces of the compression waveguide load main body are provided with heat conduction mechanism facilitating the temperature of the compression waveguide load main body to be exported, the outer surface of the upper shell is provided with heat dissipation mechanism facilitating heat dissipation, the two sides of the compression waveguide load main body are provided with buffer mechanism facilitating buffer shock absorption.A positioning slider and a buffer slider controlled by a buffer spring are slidably connected to a slide rod arranged in the upper shell and the lower shell, a first clamping block and a second clamping block are connected to the buffer slider, and a plug rod and a clamping spring are arranged between the first clamping block and the second clamping block, so as to clamp and fix the compression waveguide load main body while playing a role of shock absorption.

Description

Technical Field

[0001] This invention relates to the field of compression waveguide load protection technology, specifically to a protection device for compression waveguide loads. Background Technology

[0002] Waveguide loads are terminating devices in transmission lines, primarily used to absorb power from radio frequency (RF) or microwave systems. Waveguide loads require low residual return loss within their operating frequency band and maximum power output for their size. They are mainly used as test ports on test instruments, absorption terminals in radio stations and radar stations, terminals in communication test equipment, and as equivalent antennas during radar transmitter debugging and testing. While low-power loads are currently the mainstream in the market, as radar system antenna arrays increase and system power grows, the need for medium- to high-power loads is increasing, leading to a gradual increase in application demand.

[0003] Existing technologies lack the structural features of shock absorption protection for waveguide load termination devices, rapid heat conduction for high-power applications, and rapid air cooling. This makes the internal components rigidly connected to the outer casing extremely susceptible to damage after a fall, rendering the device unusable. Furthermore, during prolonged high-frequency use, heat rises rapidly and cannot be quickly dissipated, affecting high-frequency operating time. Moreover, most of the heat transferred to the outer casing cools naturally, resulting in low cooling efficiency and inconvenience. To address these shortcomings, this invention designs a protective device for compressing waveguide loads. Summary of the Invention

[0004] This invention provides a protective device for compressed waveguide loads, which has the advantages of shock absorption protection for waveguide load terminal devices, rapid conduction of high-power heat, and rapid cooling by air cooling.

[0005] The present invention provides the following technical solution: a protective device for a compression waveguide load, comprising an upper shell, wherein a compression waveguide load body is disposed inside the upper shell, and heat conduction mechanisms are provided on both the upper and lower surfaces of the compression waveguide load body to facilitate the heat conduction of the compression waveguide load body; a heat dissipation mechanism is provided on the outer surface of the upper shell to facilitate heat dissipation; and buffer mechanisms are provided on both sides of the compression waveguide load body to facilitate buffering and shock absorption.

[0006] A buffer mechanism is provided, comprising a fixed block, a sliding rod, a connecting plug, a positioning slider, a buffer slider, and a buffer spring. The fixed block is fixedly connected to the top of the inner cavity of the upper housing, the sliding rod is fixedly connected to the lower surface of the fixed block, the connecting plug is fixedly connected to the bottom end of the sliding rod, the positioning slider is slidably connected to the sliding rod, the buffer slider is slidably connected to the sliding rod, and the buffer spring is movably sleeved on the sliding rod.

[0007] As a preferred embodiment of the present invention, the buffer mechanism further includes a first clamping block, a movable groove, a plug rod, a second clamping block, and a clamping spring. The first clamping block is fixedly connected to the buffer slider. The movable groove is formed on the upper surface of the first clamping block. The plug rod is slidably connected inside the movable groove. The second clamping block is fixedly connected to the top end of the plug rod. The clamping spring is movably sleeved on the plug rod.

[0008] As a preferred embodiment of the present invention, the heat dissipation mechanism includes heat dissipation fins, an air guide shroud, mounting holes, an air outlet, a fan, and mounting screws. The heat dissipation fins are fixedly connected to the upper surface of the upper housing, the air guide shroud is fixedly sleeved on the heat dissipation fins, the mounting holes are opened on one side of the air guide shroud, the air outlet is opened on one side of the air guide shroud, the fan is fixedly assembled on one side of the air guide shroud, and the mounting screws are threaded into the inside of the fan.

[0009] As a preferred embodiment of the present invention, the heat conduction mechanism includes a first heat conduction pad, a first heat conduction fin, a second heat conduction pad, and a second heat conduction fin. The first heat conduction pad is fixedly connected to the upper surface of the compression waveguide load body, the first heat conduction fin is fixedly connected to the upper surface of the first heat conduction pad, the second heat conduction fin is fixedly connected to the top of the inner cavity of the upper shell, and the second heat conduction pad is fixedly connected to the lower surface of the second heat conduction fin.

[0010] As a preferred embodiment of the present invention, a lower outer shell is fixedly connected to the lower surface of the upper outer shell, an installation head is fixedly connected to the top of the upper outer shell, a sealing head is fixedly sleeved on the top of the installation head, and an insertion hole is provided at the bottom of the inner cavity of the lower outer shell.

[0011] As a preferred embodiment of the present invention, a connector is fixedly connected to the top of the compression waveguide load body, and the connector is provided with threaded teeth.

[0012] As a preferred embodiment of the present invention, the top of the sealing head is retractable, and the interior of the mounting head is movably connected with threaded teeth.

[0013] As a preferred embodiment of the present invention, the first thermally conductive pad and the first thermally conductive fin are further disposed on the lower surface of the compression waveguide load body, and the second thermally conductive pad and the second thermally conductive fin are further disposed at the bottom of the inner cavity of the lower outer shell, with the first thermally conductive fin slidably inserted into the interior of the second thermally conductive fin.

[0014] As a preferred embodiment of the present invention, the heat dissipation fins are fixedly connected to the lower surface of the lower housing, and the fan is threaded through the mounting hole.

[0015] As a preferred embodiment of the present invention, the first clamping block and the second clamping block are clamped and fixed on the compression waveguide load body, the buffer spring is disposed on the upper and lower sides of the positioning slider, the buffer slider is disposed on the inner side of the positioning slider, and the connecting plug is fixedly inserted into the socket.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. This protective device for a compressed waveguide load involves the upper and lower outer shells being dropped to the ground. The compressed waveguide load body rapidly falls within the upper and lower outer shells under its own weight. During this descent, the first clamping block moves downwards. Since the first clamping block is fixedly connected to a buffer slider, and the buffer slider is slidably connected to a wind deflector and limited by a buffer spring, the buffer spring supports the compressed waveguide load body as it falls and moves downwards. Because the buffer spring deforms during this support, it effectively absorbs and resets the inertial force generated by the fall, thus protecting the compressed waveguide load body. This device effectively prevents damage to the compressed waveguide load body after a fall.

[0018] 2. This protective device for a compressed waveguide load, after the compressed waveguide load body heats up, the heat generated by the compressed waveguide load body is absorbed by a first thermally conductive pad. At this time, since the first thermally conductive pad is connected to a first thermally conductive fin, and a second thermally conductive fin is inserted into the first thermally conductive fin, the first thermally conductive pad quickly transfers the heat to the first thermally conductive fin after receiving the heat from the compressed waveguide load body, and then transfers the heat from the first thermally conductive fin to the second thermally conductive fin through the fin. Since the second thermally conductive fin is connected to the upper and lower outer shells through the second thermally conductive pad, the second thermally conductive fin receives the temperature and introduces the temperature into the interior of the second thermally conductive pad and transfers it to the upper and lower outer shells for heat dissipation. At the same time, since the first and second thermally conductive fins on the upper and lower sides of the compressed waveguide load body are slidably inserted, the compressed waveguide load body can still conduct heat even after being hit. This device facilitates the heat dissipation of the compressed waveguide load body.

[0019] 3. This protective device for a compression waveguide load works by starting a fan, which drives the air inside the air guide shroud to pass through the mounting hole and be discharged by the fan. At this time, as the air inside the air guide shroud is discharged, the air inside the heat dissipation fins is quickly drawn into the interior of the air guide shroud. At the same time, the cooler external air rushes into the interior of the heat dissipation fins to achieve airflow. During the airflow process, the cool external air enters the interior of the heat dissipation fins and comes into contact with the heat dissipation fins to carry out heat exchange, thereby reducing the temperature of the heat dissipation fins, the upper shell, and the lower shell. At this time, the air continues to flow, is gathered by the air guide shroud, and is discharged from the mounting hole. This device facilitates the dissipation of heat from the compression waveguide load body conducted by the heat conduction mechanism. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a bottom view of the outer casing structure of the present invention;

[0022] Figure 3 This is a schematic diagram of the exploded structure of the outer shell of the present invention;

[0023] Figure 4 This is a schematic diagram of the exploded structure of the compressed waveguide load and heat conduction mechanism of the present invention;

[0024] Figure 5 This is an exploded view of the heat dissipation mechanism of the present invention;

[0025] Figure 6 This is a schematic diagram of the compressed waveguide load and buffer mechanism structure of the present invention;

[0026] Figure 7 For the present invention Figure 6 Enlarged schematic diagram of the structure at point A in the middle;

[0027] Figure 8 This is a cross-sectional view of the first clamping block of the present invention.

[0028] In the diagram: 1. Upper outer shell; 101. Lower outer shell; 102. Mounting head; 103. Sealing head; 104. Insertion hole; 2. Compression waveguide load body; 201. Connector; 202. Threaded teeth; 3. Heat conduction mechanism; 301. First heat conduction pad; 302. First heat conduction fin; 303. Second heat conduction pad; 304. Second heat conduction fin; 4. Heat dissipation mechanism; 401. Heat dissipation fin; 402. Air guide cover; 403. Mounting hole; 404. Air outlet; 405. Fan; 406. Mounting screw; 5. Buffer mechanism; 501. Fixing block; 502. Slide rod; 503. Connecting plug; 504. Positioning slider; 505. Buffer slider; 506. Buffer spring; 507. First clamping block; 508. Movable groove; 509. Insert rod; 510. Second clamping block; 511. Clamping spring. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figure 1-8 A protective device for a compression waveguide load includes an upper outer shell 1, inside which a compression waveguide load body 2 is disposed. Both the upper and lower surfaces of the compression waveguide load body 2 are provided with heat-conducting mechanisms 3 to facilitate the dissipation of heat from the compression waveguide load body 2. The outer surface of the upper outer shell 1 is provided with a heat dissipation mechanism 4 to facilitate heat dissipation. Both sides of the compression waveguide load body 2 are provided with buffering mechanisms 5 to facilitate shock absorption. A lower outer shell 101 is fixedly connected to the lower surface of the upper outer shell 1. A mounting head 102 is fixedly connected to the top of the upper outer shell 1. A sealing head 103 is fixedly sleeved on the top of the mounting head 102. An insertion hole 104 is opened at the bottom of the inner cavity of the lower outer shell 101. The top of the sealing head 103 is retractable. Threaded teeth 202 are movably inserted into the interior of the mounting head 102.

[0031] Please see Figure 4 A connector 201 is fixedly connected to the top of the compression waveguide load body 2, and threaded teeth 202 are provided on the connector 201.

[0032] Please see Figure 6-8The buffer mechanism 5 includes a fixed block 501, a slide rod 502, a connecting plug 503, a positioning slider 504, a buffer slider 505, and a buffer spring 506. The fixed block 501 is fixedly connected to the top of the inner cavity of the upper housing 1. The slide rod 502 is fixedly connected to the lower surface of the fixed block 501. The connecting plug 503 is fixedly connected to the bottom end of the slide rod 502. The positioning slider 504 is slidably connected to the slide rod 502. The buffer slider 505 is slidably connected to the slide rod 502. The buffer spring 506 is movably sleeved on the slide rod 502. The buffer mechanism 5 also includes a first clamping block 507, a movable groove 508, an insert rod 509, and a second clamping block. 510 and clamping spring 511, first clamping block 507 is fixedly connected to buffer slider 505, movable groove 508 is opened on the upper surface of first clamping block 507, insertion rod 509 is slidably connected inside movable groove 508, second clamping block 510 is fixedly connected to the top of insertion rod 509, clamping spring 511 is movably sleeved on insertion rod 509, first clamping block 507 and second clamping block 510 are clamped and fixed on compressed waveguide load body 2, buffer spring 506 is set on the upper and lower sides of positioning slider 504, buffer slider 505 is set on the inner side of positioning slider 504, and connecting plug 503 is fixedly inserted into the inside of socket 104.

[0033] By setting a first clamping block 507 and a second clamping block 510, the compressed waveguide load body 2 is clamped and fixed. By setting a buffer slider 505, the buffer slider 505 is driven to slide along the slide bar 502 when the compressed waveguide load body 2 falls to the ground. By setting a buffer spring 506, the buffer slider 505 is supported while absorbing the force of the compressed waveguide load body 2 falling due to inertia.

[0034] Please see Figure 5 The heat dissipation mechanism 4 includes heat dissipation fins 401, air guide shroud 402, mounting hole 403, air outlet 404, fan 405, and mounting screw 406. The heat dissipation fins 401 are fixedly connected to the upper surface of the upper outer shell 1. The air guide shroud 402 is fixedly sleeved on the heat dissipation fins 401. The mounting hole 403 is opened on one side of the air guide shroud 402. The air outlet 404 is opened on one side of the air guide shroud 402. The fan 405 is fixedly assembled on one side of the air guide shroud 402. The mounting screw 406 is threaded into the inside of the fan 405. The heat dissipation fins 401 are fixedly connected to the lower surface of the lower outer shell 101. The fan 405 is threaded through the fan and threaded into the inside of the mounting hole 403.

[0035] By setting the air guide shroud 402, it is easy to drive the air flow in all the air slots on the heat dissipation fins 401. By setting the heat dissipation fins 401, it is easy to dissipate the temperature of the compressed waveguide load body 2 and the heat conduction mechanism 3 to the lower outer shell 101 set on the upper outer shell 1 for heat dissipation treatment.

[0036] Please see Figure 4 The heat conduction mechanism 3 includes a first heat conduction pad 301, a first heat conduction fin 302, a second heat conduction pad 303, and a second heat conduction fin 304. The first heat conduction pad 301 is fixedly connected to the upper surface of the compression waveguide load body 2, the first heat conduction fin 302 is fixedly connected to the upper surface of the first heat conduction pad 301, the second heat conduction fin 304 is fixedly connected to the top of the inner cavity of the upper outer shell 1, and the second heat conduction pad 303 is fixedly connected to the lower surface of the second heat conduction fin 304. The first heat conduction pad 301 and the first heat conduction fin 302 are also disposed on the lower surface of the compression waveguide load body 2, and the second heat conduction pad 303 and the second heat conduction fin 304 are also disposed at the bottom of the inner cavity of the lower outer shell 101. The first heat conduction fin 302 is slidably inserted into the interior of the second heat conduction fin 304.

[0037] By setting a first thermally conductive pad 301, heat generated by the compressed waveguide load body 2 is dissipated. By setting a first thermally conductive fin 302 and a second thermally conductive fin 304, heat is dissipated from the first thermally conductive pad 301 while heat conduction is not affected when the compressed waveguide load body 2 is moved up and down due to an impact. By setting a second thermally conductive pad 303, heat is transferred from the first thermally conductive fin 302 and the second thermally conductive fin 304 to the upper outer shell 1 and the lower outer shell 101 and dissipated by the heat dissipation mechanism 4.

[0038] Working principle: In the initial state of a protective device for a compressed waveguide load, the lower outer shell 101 is located at the bottom of the upper outer shell 1, and the mounting head 102 and the sealing head 103 are fixed on the upper outer shell 1. Simultaneously, the compressed waveguide load body 2 is located inside the upper outer shell 1 and the lower outer shell 101 to protect the compressed waveguide load body 2. The connector 201 and threaded teeth 202 at the top of the compressed waveguide load body 2 are movably inserted into the mounting head 102 to facilitate connection with external wiring while protecting the wiring. A first thermally conductive pad 301 and a first thermally conductive fin 302 are located on the upper and lower surfaces of the compressed waveguide load body 2, and a second thermally conductive pad 303 and a second thermally conductive fin 304 are located on the upper outer shell 1 and the lower outer shell 101. The inner side of the lower outer shell 101 is designed to facilitate the heat dissipation of the compressed waveguide load body 2. Meanwhile, heat dissipation fins 401 are provided on the outer sides of the upper outer shell 1 and the lower outer shell 101, and a fan 405 is provided behind the heat dissipation fins 401 to dissipate the dissipated heat. A positioning slider 504 and a buffer slider 505 controlled by a buffer spring 506 are slidably connected on the slide rod 502 provided inside the upper outer shell 1 and the lower outer shell 101. At the same time, a first clamping block 507 and a second clamping block 510 are connected to the buffer slider 505. An insert rod 509 and a clamping spring 511 are provided between the first clamping block 507 and the second clamping block 510 to clamp and fix the compressed waveguide load body 2 while providing a shock absorption function.

[0039] When it is necessary to prevent damage to the compressed waveguide load body 2 after a fall, firstly, after the upper outer shell 1 and the lower outer shell 101 fall to the ground, the compressed waveguide load body 2 will rapidly fall within the upper outer shell 1 and the lower outer shell 101 under its own gravity. During the fall of the compressed waveguide load body 2, the first clamping block 507 will move downwards accordingly. Since the first clamping block 507 is fixedly connected to the buffer slider 505, and the buffer slider 505 is slidably connected to the air guide shroud 402 and limited by the buffer spring 506, the buffer spring 506 will support the compressed waveguide load body 2 by supporting the buffer slider 505 during the fall of the compressed waveguide load body 2. Since the buffer spring 506 will deform during the support of the buffer slider 505, it will effectively absorb and reset the inertial force generated by the fall of the compressed waveguide load body 2, thereby achieving protection of the compressed waveguide load body 2. This device is convenient for preventing damage to the compressed waveguide load body 2 after a fall.

[0040] When it is necessary to dissipate the heat from the compressed waveguide load body 2, the heat generated by the compressed waveguide load body 2 after it heats up is first absorbed by the first thermally conductive pad 301. At this time, since the first thermally conductive pad 301 is connected to the first thermally conductive fin 302, and the first thermally conductive fin 302 is inserted with the second thermally conductive fin 304, the first thermally conductive pad 301 quickly transfers the heat to the first thermally conductive fin 302 after receiving the heat from the compressed waveguide load body 2, and then transfers the heat from the first thermally conductive fin 302 to the second thermally conductive fin 304 through the fins. Inside 04, since the second heat-conducting fin 304 is connected to the upper outer shell 1 and the lower outer shell 101 through the second heat-conducting pad 303, the second heat-conducting fin 304 receives the temperature and then introduces the temperature into the interior of the second heat-conducting pad 303 and transfers it to the upper outer shell 1 and the lower outer shell 101 for heat dissipation. At the same time, since the first heat-conducting fin 302 and the second heat-conducting fin 304 on the upper and lower sides of the compression waveguide load body 2 are slidably inserted, the compression waveguide load body 2 can still conduct heat even after being hit. This device facilitates the heat dissipation of the compression waveguide load body 2.

[0041] When it is necessary to dissipate the heat from the compressed waveguide load body 2 discharged by the heat conduction mechanism 3, the fan 405 is first started to drive the air in the air guide shroud 402 through the mounting hole 403 and discharged by the fan 405. At this time, as the air in the air guide shroud 402 is discharged, the air in the heat dissipation fins 401 is quickly drawn into the interior of the air guide shroud 402. At the same time, the external air with a lower temperature rushes into the interior of the heat dissipation fins 401 to achieve air flow. During the air flow, the external low-temperature air enters the interior of the heat dissipation fins 401 and comes into contact with the heat dissipation fins 401 to perform heat exchange, thereby reducing the temperature of the heat dissipation fins 401, the upper shell 1 and the lower shell 101. At this time, the air continues to flow, is gathered by the air guide shroud 402 and discharged from the mounting hole 403. This device facilitates the dissipation of the heat from the compressed waveguide load body 2 discharged by the heat conduction mechanism 3.

[0042] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0043] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A protective device for a compressed waveguide load, comprising an upper housing (1), characterized in that: The upper shell (1) is provided with a compression waveguide load body (2) inside. The upper and lower surfaces of the compression waveguide load body (2) are provided with heat conduction mechanisms (3) to facilitate the heat dissipation of the compression waveguide load body (2). The outer surface of the upper shell (1) is provided with heat dissipation mechanisms (4) to facilitate heat dissipation. The two sides of the compression waveguide load body (2) are provided with buffering mechanisms (5) to facilitate buffering and shock absorption. A buffer mechanism (5) is provided, comprising a fixed block (501), a slide rod (502), a connecting plug (503), a positioning slider (504), a buffer slider (505), and a buffer spring (506). The fixed block (501) is fixedly connected to the top of the inner cavity of the upper outer shell (1). The slide rod (502) is fixedly connected to the lower surface of the fixed block (501). The connecting plug (503) is fixedly connected to the bottom end of the slide rod (502). The positioning slider (504) is slidably connected to the slide rod (502). The buffer slider (505) is slidably connected to the slide rod (502). The buffer spring (506) is movably sleeved on the slide rod (502). The buffer mechanism (5) further includes a first clamping block (507), a movable groove (508), a plug rod (509), a second clamping block (510), and a clamping spring (511). The first clamping block (507) is fixedly connected to the buffer slider (505). The movable groove (508) is opened on the upper surface of the first clamping block (507). The plug rod (509) is slidably connected inside the movable groove (508). The second clamping block (510) is fixedly connected to the top end of the plug rod (509). The clamping spring (511) is movably sleeved on the plug rod (509). The first clamping block (507) and the second clamping block (510) are clamped and fixed on the compression waveguide load body (2). The buffer spring (506) is set on the upper and lower sides of the positioning slider (504). The buffer slider (505) is set on the inner side of the positioning slider (504). The connecting plug (503) is fixedly inserted into the inside of the socket (104).

2. The protective device for a compressed waveguide load according to claim 1, characterized in that: The heat dissipation mechanism (4) includes heat dissipation fins (401), air guide shroud (402), mounting hole (403), air outlet (404), fan (405), and mounting screw (406). The heat dissipation fins (401) are fixedly connected to the upper surface of the upper shell (1). The air guide shroud (402) is fixedly sleeved on the heat dissipation fins (401). The mounting hole (403) is opened on one side of the air guide shroud (402). The air outlet (404) is opened on one side of the air guide shroud (402). The fan (405) is fixedly assembled on one side of the air guide shroud (402). The mounting screw (406) is threaded into the inside of the fan (405).

3. The protective device for a compressed waveguide load according to claim 1, characterized in that: The heat conduction mechanism (3) includes a first heat conduction pad (301), a first heat conduction fin (302), a second heat conduction pad (303), and a second heat conduction fin (304). The first heat conduction pad (301) is fixedly connected to the upper surface of the compressed waveguide load body (2). The first heat conduction fin (302) is fixedly connected to the upper surface of the first heat conduction pad (301). The second heat conduction fin (304) is fixedly connected to the top of the inner cavity of the upper outer shell (1). The second heat conduction pad (303) is fixedly connected to the lower surface of the second heat conduction fin (304).

4. The protective device for a compressed waveguide load according to claim 1, characterized in that: The lower surface of the upper outer shell (1) is fixedly connected to the lower outer shell (1), the top of the upper outer shell (1) is fixedly connected to the mounting head (102), the top of the mounting head (102) is fixedly sleeved with a sealing head (103), and the bottom of the inner cavity of the lower outer shell (101) is provided with an insertion hole (104).

5. The protective device for a compressed waveguide load according to claim 1, characterized in that: The top end of the compressed waveguide load body (2) is fixedly connected to a connector (201), and the connector (201) is provided with threaded teeth (202).

6. The protective device for a compressed waveguide load according to claim 4, characterized in that: The top of the sealing head (103) is retractable, and the interior of the mounting head (102) is movably connected with threaded teeth (202).

7. The protective device for a compressed waveguide load according to claim 3, characterized in that: The first thermal pad (301) and the first thermal fin (302) are also disposed on the lower surface of the compression waveguide load body (2), and the second thermal pad (303) and the second thermal fin (304) are also disposed at the bottom of the inner cavity of the lower outer shell (101). The first thermal fin (302) is slidably inserted into the interior of the second thermal fin (304).

8. The protective device for a compressed waveguide load according to claim 2, characterized in that: The heat dissipation fins (401) are fixedly connected to the lower surface of the lower housing (101), and the fan (405) is threaded through the fan (405) and connected to the inside of the mounting hole (403).

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