Loudspeaker module and electronic device
By adding a resonant cavity and resonant structure to the speaker module, the frequency band absorption of the audio signal is controlled, solving the problems of audio quality degradation and computing resource consumption in digital EQ technology, and realizing real-time processing of high-quality audio.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- VIVO MOBILE COMM CO LTD
- Filing Date
- 2023-10-12
- Publication Date
- 2026-05-29
AI Technical Summary
Digital EQ technology suffers from quantization and sampling errors when processing audio signals, leading to a decrease in audio quality. Furthermore, the complex algorithm operations consume computational resources, affecting the real-time performance of the audio.
The speaker module is equipped with a resonant cavity, a first resonant structure, and a second resonant structure. By changing the state of the resonant structure, the opening or closing of the opening is controlled, so that the resonant cavity can absorb audio signals of a specific frequency band, avoiding the conversion of analog signals to digital signals for processing and simplifying algorithm calculations.
Improve audio quality, avoid quantization errors and latency, save computing resources, and enhance the user's audio experience.
Smart Images
Figure CN117202054B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of communication technology, specifically relating to a speaker module and electronic device. Background Technology
[0002] Digital EQ (Equalization) technology is a digital signal processing technique used to adjust the frequency response of audio signals to improve sound quality. Digital EQ technology requires converting analog audio signals into digital signals for processing; however, this process involves precision loss due to quantization and sampling errors, leading to a deterioration in audio quality. Furthermore, because digital EQ technology requires complex algorithmic calculations, latency occurs during signal processing and computation, consuming significant computing resources and impacting the real-time performance of the audio. Summary of the Invention
[0003] The purpose of this application is to provide a speaker module and electronic device that can solve the problem in the related art where processing audio signals easily leads to a decrease in audio quality.
[0004] In a first aspect, embodiments of this application provide a loudspeaker module, comprising a housing, a sound-emitting body, a first resonant structure, and a second resonant structure. The sound-emitting body is disposed within the housing, forming a front cavity between the sound-emitting body and the housing. The housing has a resonant cavity and an opening communicating with the resonant cavity. The resonant cavity communicates with the front cavity through the opening. A first end of the first resonant structure and a first end of the second resonant structure are respectively connected to two opposite side walls of the housing at the opening.
[0005] When the second end of the first resonant structure is in contact with the second end of the second resonant structure, the opening is in a closed state; when there is a gap between the second end of the first resonant structure and the second end of the second resonant structure, the opening is in an open state, and the resonant cavity can absorb the audio signal emitted by the sound-emitting body.
[0006] Secondly, embodiments of this application also provide an electronic device, including the aforementioned speaker module.
[0007] In this embodiment, the speaker module is equipped with a resonant cavity, a first resonant structure, and a second resonant structure. By changing the states of the first and second resonant structures, the opening of the resonant cavity can be opened, allowing the resonant cavity to absorb audio signals of a certain frequency band emitted by the sound source, achieving resonant sound absorption and thus regulating audio through hardware structure. This eliminates the need to convert analog audio signals to digital signals for processing, avoiding sampling and quantization errors that occur during signal processing, thereby improving audio quality. Furthermore, it eliminates the need for complex algorithm calculations, avoiding delays caused by signal processing and computation, saving computing resources, and enhancing the user's audio experience. Attached Figure Description
[0008] Figure 1 This is a cross-sectional view of the speaker module disclosed in the embodiments of this application;
[0009] Figure 2 This is a schematic diagram illustrating the sound absorption effect of different resonant cavities on audio signals of different frequency bands as disclosed in the embodiments of this application;
[0010] Figure 3 This is a schematic diagram of a portion of the housing and the resonant structure disclosed in the embodiments of this application;
[0011] Figure 4 This is a schematic diagram of the opening being closed according to an embodiment of this application;
[0012] Figure 5 This is a schematic diagram of the opening in the first open state as disclosed in the embodiments of this application;
[0013] Figure 6 This is a schematic diagram of the opening in the second open state as disclosed in the embodiments of this application;
[0014] Figure 7 This is a schematic diagram of a resonance structure disclosed in another embodiment of this application.
[0015] Explanation of reference numerals in the attached figures:
[0016] 100 - Shell, 110 - Front cavity, 120 - Sound guide channel, 130 - Shell wall, 131 - Shell side wall, 132 - Shell top wall, 140 - Spacer, 150 - Rear cavity
[0017] 200-sound-producing body,
[0018] 300 - Resonance cavity, 310 - Opening,
[0019] 410 - First resonance structure, 420 - Second resonance structure
[0020] 401-Deformation element, 4011-First shape memory alloy layer, 4012-Second shape memory alloy layer, 402-Adjusting element, a-First flexible heating layer, b-Second flexible heating layer. Detailed Implementation
[0021] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0022] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0023] The speaker module and electronic device provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.
[0024] Please refer to Figures 1-7 The speaker module disclosed in this application includes a housing 100, a sound-emitting body 200, a first resonant structure 410, and a second resonant structure 420. The housing 100 serves as the mounting base for the sound-emitting body 200, the first resonant structure 410, and the second resonant structure 420. The sound-emitting body 200 is disposed within the housing 100 and is used to emit audio signals. The first resonant structure 410 and the second resonant structure 420 control the opening or closing of the opening 310, thereby controlling whether the audio signal enters the resonant cavity 300. The audio signal can resonate within the resonant cavity 300 to achieve sound absorption.
[0025] A front cavity 110 is formed between the sound-emitting body 200 and the housing 100. The housing 100 has a resonant cavity 300 and an opening 310 communicating with the resonant cavity 300. The resonant cavity 300 is connected to the front cavity 110 through the opening 310. A first resonant structure 410 and a second resonant structure 420 are disposed at the opening 310. Specifically, the first end of the first resonant structure 410 and the first end of the second resonant structure 420 are respectively connected to the opposite side walls of the housing 100 at the opening. Optionally, the housing 100 includes a shell wall 130, the sound-emitting body 200 is disposed on the shell wall 130, and a front cavity 110 is formed between the shell wall 130 and the sound-emitting body 200. The resonant cavity 300 is disposed in the front cavity 110, and the front cavity 110 is connected to the external atmosphere. Figure 1 As shown, a rear cavity 150 is also formed between the shell wall 130 and the sound generator 200. The rear cavity 150 is a closed cavity used to assist the vibration of the tympanic membrane of the sound generator 200.
[0026] The resonant cavity 300 can be a cubic structure or a structure of other shapes; this embodiment does not limit the structure of the resonant cavity 300. The audio signal emitted by the sound-emitting body 200 can enter the resonant cavity 300 through the opening 310. Therefore, the first resonant structure 410 and the second resonant structure 420 located at the opening 310 can control the opening and closing of the opening 310, thereby controlling whether the audio signal emitted by the sound-emitting body 200 can enter the resonant cavity 300. It should be noted that resonant cavities 300 with different design parameters have different sound absorption frequency bands; therefore, by setting a resonant cavity 300 of appropriate size, it is possible to absorb audio signals of corresponding frequency bands.
[0027] When the second end of the first resonant structure 410 is in contact with the second end of the second resonant structure 420, the opening 310 is in a closed state; when there is a gap between the second ends of the first resonant structure 410 and the second resonant structure 420, the opening 310 is in an open state, and the resonant cavity 300 can absorb the audio signal emitted by the sound emitter 200. Specifically, the resonant cavity 300 absorbs the audio signal of a certain frequency band emitted by the sound emitter 200, and this frequency band corresponds to the design parameters of the resonant cavity 300. Optionally, the first resonant structure 410 and the second resonant structure 420 can be deformable structures, and their deformation can be controlled to make the second end of the first resonant structure 410 contact or separate from the second end of the second resonant structure 420; the first resonant structure 410 and the second resonant structure 420 can also be structures that can move relative to the housing 100, and their movement position can be changed to make the second end of the first resonant structure 410 contact or separate from the second end of the second resonant structure 420.
[0028] In this embodiment, the speaker module is supplemented with a resonant cavity 300, a first resonant structure 410, and a second resonant structure 420. By changing the states of the first and second resonant structures 410 and 420, the opening 310 of the resonant cavity 300 can be opened, allowing the resonant cavity 300 to absorb audio signals of a certain frequency band emitted by the sound emitter 200, achieving resonant sound absorption and thus regulating audio through hardware structure. This eliminates the need to convert analog audio signals to digital signals for processing, avoiding sampling and quantization errors that occur during signal processing, thereby improving audio quality. Furthermore, it eliminates the need for complex algorithm calculations, avoiding delays caused by signal processing and computation, saving computing resources, and enhancing the user's audio experience.
[0029] In an optional embodiment, both the first resonant structure 410 and the second resonant structure 420 include a deformation element 401, which has a first deformation state and a second deformation state. The deformation of the deformation element 401 in the first deformation state is less than the deformation of the deformation element 401 in the second deformation state. Optionally, the first end of the deformation element 401 of the first resonant structure 410 and the first end of the deformation element 401 of the second resonant structure 420 are respectively connected to the opposite side walls of the housing 100 at the opening 310. The first end of the deformation element 401 of the first resonant structure 410 is in contact with or has a gap with the second end of the deformation element 401 of the second resonant structure 420.
[0030] Optionally, the deformation element 401 can be an electro-deformation element, with the state of the deformation element 401 when it is not energized being the first deformation state, and the state of the deformation element 401 when it is energized being the second deformation state. Of course, the deformation element 401 can also be a thermo-deformation element, which deforms according to temperature changes, or it can be an element that deforms according to other factors.
[0031] Specifically, such as Figure 4 As shown, when both the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 are in the first deformation state, the second end of the first resonant structure 410 is in contact with the second end of the second resonant structure 420, and the opening 310 is in a closed state. Optionally, the second end of the deformation element 401 of the first resonant structure 410 is opposite to the second end of the deformation element 401 of the second resonant structure 420, and there is no gap between them; Figure 5 and Figure 6As shown, when at least one of the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 is in the second deformation state, there is a gap between the second end of the first resonant structure 410 and the second end of the second resonant structure 420, and the opening 310 is in the open state. Optionally, a gap is formed between the second end of the deformation element 401 of the first resonant structure 410 and the second end of the deformation element 401 of the second resonant structure 420.
[0032] Optionally, when the deformation element 401 of the first resonant structure 410 or the deformation element 401 of the second resonant structure 420 is in a second deformation state, and when both the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 are in a second deformation state, the opening 310 is in an open state.
[0033] In this embodiment, the opening 310 is opened or closed directly by the deformation of the deformation element 401 itself, eliminating the need for additional structures to drive the movement of the first resonant structure 410 and the second resonant structure 420. This simplifies the number of components and facilitates the miniaturization of the speaker module. Furthermore, the deformation elements 401 of the first resonant structure 410 and the second resonant structure 420 can simultaneously deform to open or close the opening 310, improving the opening and closing efficiency of the opening 310 and enabling the resonant cavity 300 to resonate and absorb sound in a timely manner.
[0034] In one optional embodiment, during the process of the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 switching from the first deformation state to the second deformation state, the deformation directions of the two are the same. Specifically, during this deformation process, the second end of the first resonant structure 410 and the second end of the second resonant structure 420 remain opposite each other, and the gap between them increases, and the opening 310 gradually opens.
[0035] In another embodiment, during the process of the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 switching from the first deformation state to the second deformation state, their deformation directions are opposite. Specifically, when both the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 are in the second deformation state, the second end of the first resonant structure 410 and the second end of the second resonant structure 420 are misaligned, and the gap formed between them is relatively large.
[0036] Thus, by setting the deformation direction of the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 to be opposite, the maximum opening of the opening 310 can be increased, which is more conducive to the audio signal of the corresponding frequency band of the resonant cavity 300 entering the resonant cavity 300, and thus more conducive to the adjustment of the audio signal.
[0037] In an optional embodiment, both the first resonant structure 410 and the second resonant structure 420 further include an adjusting member 402, which is connected to the deformation element 401 to adjust the deformation state of the deformation element 401. Optionally, when the deformation element 401 is a thermo-deformable element, the adjusting member 402 can be a heating element, which is in contact with the thermo-deformable element; when the deformation element 401 is an electro-deformable element, the adjusting member 402 can be an electronically controlled element, which is electrically connected to the electro-deformable element. Thus, by directly incorporating the adjusting member 402 into the first resonant structure 410 and the second resonant structure 420, it is advantageous to directly adjust the amount of deformation that causes the deformation element 401 to deform, allowing the speaker module itself to complete the tuning process.
[0038] Of course, in other embodiments, the first resonant structure 410 and the second resonant structure 420 may not have the adjustment member 402, but only the deformation element 401, and the deformation element 401 may be controlled by a structure other than the speaker module.
[0039] In a further embodiment, the opening state of the opening 310 includes a first opening state and a second opening state. The opening degree of the opening 310 in the first opening state is less than or greater than the opening degree of the opening 310 in the second opening state. That is, the opening degree of the opening 310 in the first opening state is different from the opening degree of the opening 310 in the second opening state. By adjusting the deformation element 401 through the adjusting member 402, the opening 310 can be switched between the first opening state and the second opening state.
[0040] like Figure 5 As shown, when the adjusting member 402 of one of the first resonant structures 410 and the second resonant structure 420 adjusts the corresponding deformation element 401 to a second deformation state, and the adjusting member 402 of the other adjusts the corresponding deformation element 401 to a first deformation state, the opening 310 is in a first open state, and the opening degree of the opening 310 is small; as Figure 6 As shown, when the adjustment members 402 of the first resonance structure 410 and the second resonance structure 420 respectively adjust the corresponding deformation elements 401 to be in the second deformation state, the opening 310 is in the second open state, and the opening degree of the opening 310 is relatively large.
[0041] In this embodiment, the opening of the opening 310 can be adjusted by the adjusting member 402, thereby adjusting the absorption intensity of the resonant cavity 300 for the corresponding frequency band of audio signals as needed.
[0042] Optionally, during the process of the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 switching from the first deformation state to the second deformation state, the deformation directions of the two are opposite. When both the deformation element 401 of the first resonant structure 410 and the deformation element 401 of the second resonant structure 420 are in the second deformation state, the second opening state is the maximum opening state of the opening 310, at which time the opening of the opening 310 reaches its maximum.
[0043] In one optional embodiment, the deformation element 401 can be a thermally expanding and contracting structure, and the adjusting element 402 is a heating wire, which heats the thermally expanding and contracting structure. In another embodiment, the adjusting element 402 is a flexible heating layer, and the deformation element 401 includes a shape memory alloy layer. The flexible heating layer is attached to the shape memory alloy layer, and during the deformation of the shape memory alloy layer, the flexible heating layer, due to its flexibility, can deform along with the shape memory alloy layer. Optionally, the flexible heating layer can be a resistance heating layer. In this way, the shape memory alloy layer and the flexible heating layer are attached, increasing their connection area. The flexible heating layer fully heats the shape memory alloy layer, and because it can deform along with the shape memory alloy layer, it ensures that the shape memory alloy layer and the flexible heating layer remain in contact. The flexible heating layer does not change its heat transfer effect on the shape memory alloy layer due to the deformation of the shape memory alloy layer, ensuring that the flexible heating layer can adjust the shape memory alloy layer in real time.
[0044] In a further embodiment, the flexible heating layer of the first resonant structure 410 is a first flexible heating layer a, and the flexible heating layer of the second resonant structure 420 is a second flexible heating layer b. The first flexible heating layer a and the shape memory alloy layer of the first resonant structure 410 are bonded together along a first direction, and the second flexible heating layer b and the shape memory alloy layer of the second resonant structure 420 are bonded together along a second direction, with the first direction being opposite to the second direction. Thus, when the first flexible heating layer a heats the shape memory alloy layer of the first resonant structure 410, and the second flexible heating layer b heats the shape memory alloy layer of the second resonant structure 420, the deformation directions of the shape memory alloy layers of the first resonant structure 410 and the second resonant structure 420 are opposite.
[0045] In one optional embodiment, each deformation element 401 may include only one shape memory alloy layer. Thus, when the flexible heating layer heats the shape memory alloy layer but does not reach its phase transition temperature, the deformation element 401 is in a first deformation state; when the flexible heating layer heats the shape memory alloy layer to its phase transition temperature, the deformation element 401 deforms and is in a second deformation state.
[0046] In another embodiment, such as Figure 7 As shown, the deformation element 401 includes at least two shape memory alloy layers, which are sequentially bonded together. Each shape memory alloy layer includes a first shape memory alloy layer 4011 and a second shape memory alloy layer 4012. The phase transition temperature of the first shape memory alloy layer 4011 is lower than that of the second shape memory alloy layer 4012. Moreover, the deformation of the first shape memory alloy layer 4011 under its phase transition temperature condition is less than or greater than that of the second shape memory alloy layer 4012 under its phase transition temperature condition. That is, the deformation of the first shape memory alloy layer 4011 and the second shape memory alloy layer 4012 under their own phase transition temperature conditions are different.
[0047] Optionally, the phase transition temperature of the first shape memory alloy layer 4011 can be 50°C, and the phase transition temperature of the second shape memory alloy layer 4012 can be 60°C. When the flexible heating layer is heated to 50°C, the deformation amount generated by the deformation element 401 is the deformation amount of the first shape memory alloy layer 4011 under its phase transition temperature condition; when the flexible heating layer is heated to 60°C, the deformation amount generated by the deformation element 401 is the deformation amount of the second shape memory alloy layer 4012 under its phase transition temperature condition. Of course, users can also set shape memory alloy layers with other phase transition temperatures as needed.
[0048] In this embodiment, the same deformation element 401 is provided with at least two shape memory alloy layers. By adjusting the heating temperature of the deformation element 401 by the flexible heating layer, the deformation of the deformation element 401 can be adjusted, thereby changing the opening of the opening 310, which is beneficial to further adjust the sound absorption intensity and achieve more precise adjustment of the audio signal.
[0049] In one alternative embodiment, the speaker module may be provided with only one resonant cavity 300.
[0050] In another embodiment, such as Figure 1As shown, there are at least two resonant cavities 300, arranged sequentially, and each resonant cavity 300 has a different volume, so that each resonant cavity 300 can absorb audio signals of different frequency bands emitted by the sound emitter 200. With this arrangement, when it is necessary to absorb an audio signal of a certain frequency band, the opening 310 of the first resonant structure 410 and the second resonant structure 420 of the resonant cavity 300 corresponding to that frequency band is controlled to open. The user can adjust the various deformation elements 401 as needed, thereby adjusting the sound absorption effect of the resonant cavity 300 to achieve the purpose of adjusting the audio.
[0051] according to Figure 2 The sound absorption effect of resonant cavities 300 of different volumes on audio signals is shown. It can be seen that due to the presence of the front cavity 110, the frequency response curve of the speaker module shows a resonance peak in the 4kHz-6kHz frequency band, which makes the sibilance of the final sound obvious. Therefore, in this solution, by adjusting the deformation element 401 of the resonant cavity 300 corresponding to the 4kHz-6kHz frequency band, the opening 310 of the resonant cavity 300 is opened. Then, the resonant cavity 300 can absorb audio signals in the 4kHz-6kHz frequency band, eliminate resonance peaks, and improve audio quality.
[0052] In an optional embodiment, a sound guiding channel 120 is further provided inside the housing 100, which communicates with the front cavity 110. Each resonant cavity 300 is arranged sequentially along the extending direction of the sound guiding channel 120. After the sound emitter 200 emits an audio signal, it diffuses to the outside of the housing 100 through the front cavity 110 and the sound guiding channel 120 in sequence. Thus, during the propagation of the audio signal, it flows through each resonant cavity 300 in sequence, which is beneficial for each resonant cavity 300 to absorb the audio signal of the corresponding frequency band, thereby achieving the effect of tuning.
[0053] Of course, in other embodiments, each resonant cavity 300 may also be arranged sequentially in other directions, so that each resonant cavity 300 can absorb audio signals of the corresponding frequency band.
[0054] In an optional embodiment, the housing 100 includes a housing wall 130 and at least one spacer 140. Each spacer 140 is connected to the inner wall surface of the housing wall 130, so that a portion of the space in the front cavity 110 forms a resonant cavity 300. The spacer 140 and the inner wall surface of the housing wall 130 together form the resonant cavity 300. Optionally, an opening 310 is formed between the edge of the spacer 140 and its opposite inner wall surface of the housing wall 130, or an opening 310 is formed between the edge of the spacer 140 and its adjacent spacer 140. Using this embodiment, the resonant cavity 300 can be formed simply by providing spacers 140 to cooperate with the housing wall 130, which simplifies the structure of the resonant cavity 300. Furthermore, the space of the resonant cavity 300 is adjacent to the inner wall surface of the housing 100, which helps to reduce the influence of the resonant cavity 300 itself on the propagation of audio signals.
[0055] Optionally, the front cavity 110 is provided with at least two spacers 140, each spacer 140 being spaced apart along the extending direction of the sound guide channel 120, so that the formed resonant cavities 300 are sequentially arranged along the extending direction of the sound guide channel 120. Figure 1 As shown, the shell wall 130 includes a top shell wall 132 and a side shell wall 131. A sound-emitting body 200 is disposed on the side shell wall 131, and the sound-emitting body 200 is opposite to the top shell wall 132. The first end of each spacer 140 is connected to the top shell wall 132, and the second end of each spacer 140 forms an opening 310 with the second end of an adjacent spacer 140 or the side shell wall 131. The spacers 140 and the top shell wall 132 together form a resonant cavity 300, and the distance between two adjacent spacers 140 and the distance between a spacer 140 and an adjacent side shell wall 131 are not equal. Specifically, the resonant cavity 300 located at the edge is formed by the spacers 140, the top shell wall 132, and the side shell wall 131, while the resonant cavity 300 located in the middle is formed by two adjacent spacers 140 and the top shell wall 132.
[0056] Of course, in other embodiments, the spacer 140 may not be provided in the front cavity 110, and other separate structures may be provided in the housing 100 to form the resonant cavity 300.
[0057] Based on the speaker module disclosed in this application, this application also provides an electronic device, which includes the speaker module described in the above embodiments. With this configuration, the electronic device can control the first resonant structure 410 and the second resonant structure 420 of the speaker module to control the resonant cavity 300 to absorb audio signals of a certain frequency band emitted by the sound emitter 200, achieving resonant sound absorption and thus regulating audio through hardware structure. There is no need to convert analog audio signals into digital signals for processing, therefore eliminating problems such as sampling and quantization errors that occur during signal processing, which is beneficial for improving audio quality. At the same time, complex algorithm calculations are unnecessary, avoiding delays caused by signal processing and computation, saving computing resources, and improving the user's audio experience.
[0058] The electronic devices disclosed in this application can be smartphones, tablets, e-book readers, wearable devices, video game consoles, etc. This application does not limit the specific types of electronic devices.
[0059] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. A speaker module, characterized in that, The system includes a housing (100), a sound-generating body (200), a first resonant structure (410), and a second resonant structure (420). The sound-generating body (200) is disposed within the housing (100), forming a front cavity (110) between the sound-generating body (200) and the housing (100). The housing (100) has a resonant cavity (300) and an opening (310) communicating with the resonant cavity (300). The resonant cavity (300) communicates with the front cavity (110) through the opening (310). The first end of the first resonant structure (410) and the first end of the second resonant structure (420) are respectively connected to the opposite side walls of the housing (100) at the opening (310). When the second end of the first resonant structure (410) is in contact with the second end of the second resonant structure (420), the opening (310) is in a closed state; when there is a gap between the second end of the first resonant structure (410) and the second end of the second resonant structure (420), the opening (310) is in an open state, and the resonant cavity (300) can absorb the audio signal emitted by the sound emitter (200).
2. The speaker module according to claim 1, characterized in that, Both the first resonant structure (410) and the second resonant structure (420) include a deformation element (401), which has a first deformation state and a second deformation state. The deformation of the deformation element (401) in the first deformation state is less than the deformation of the deformation element (401) in the second deformation state. When both the deformation element (401) of the first resonant structure (410) and the deformation element (401) of the second resonant structure (420) are in the first deformation state, the opening (310) is in the closed state. When at least one of the deformation element (401) of the first resonant structure (410) and the deformation element (401) of the second resonant structure (420) is in the second deformation state, the opening (310) is in the open state.
3. The speaker module according to claim 2, characterized in that, During the process of the deformation element (401) of the first resonant structure (410) and the deformation element (401) of the second resonant structure (420) switching from the first deformation state to the second deformation state, their deformation directions are opposite.
4. The speaker module according to claim 2, characterized in that, Both the first resonant structure (410) and the second resonant structure (420) further include an adjusting member (402), which is connected to the deformation element (401) to adjust the deformation state of the deformation element (401). The opening state of the opening (310) includes a first opening state and a second opening state. The opening degree of the opening (310) in the first opening state is less than or greater than the opening degree of the opening (310) in the second opening state. When the adjusting member (402) of one of the first resonant structure (410) and the second resonant structure (420) adjusts the corresponding deformation element (401) to be in the second deformation state, and the adjusting member (402) of the other adjusts the corresponding deformation element (401) to be in the first deformation state, the opening (310) is in the first open state. When the adjusting member (402) of the first resonance structure (410) and the second resonance structure (420) respectively adjusts the corresponding deformation element (401) to be in the second deformation state, the opening (310) is in the second open state.
5. The speaker module according to claim 4, characterized in that, The adjusting element (402) is a flexible heating layer, and the deformation element (401) includes a shape memory alloy layer, with the flexible heating layer and the shape memory alloy layer being attached together.
6. The speaker module according to claim 5, characterized in that, The deformation element (401) includes at least two shape memory alloy layers, which are sequentially bonded together. The shape memory alloy layers include a first shape memory alloy layer (4011) and a second shape memory alloy layer (4012). The phase transition temperature of the first shape memory alloy layer (4011) is lower than that of the second shape memory alloy layer (4012), and the deformation of the first shape memory alloy layer (4011) under its phase transition temperature condition is less than or greater than that of the second shape memory alloy layer (4012) under its phase transition temperature condition.
7. The speaker module according to claim 1, characterized in that, The number of resonant cavities (300) is at least two, and each resonant cavity (300) is arranged sequentially, and each resonant cavity (300) has a different volume, so that each resonant cavity (300) can absorb audio signals of different frequency bands emitted by the sound-emitting body (200).
8. The speaker module according to claim 7, characterized in that, The housing (100) is also provided with a sound guiding channel (120), which is connected to the front cavity (110), and each of the resonant cavities (300) is arranged sequentially along the extension direction of the sound guiding channel (120).
9. The speaker module according to claim 8, characterized in that, The housing (100) includes a shell wall (130) and at least one spacer (140), each of the spacers (140) being connected to the inner wall surface of the shell wall (130), and the spacers (140) and the inner wall surface of the shell wall (130) together form the resonant cavity (300).
10. An electronic device, characterized in that, Includes the speaker module as described in any one of claims 1-9.