Holding mechanism cleaning system and control method thereof, electronic device

Abstract

The application discloses a wafer holding mechanism cleaning system and a control method thereof and electronic equipment. The wafer holding mechanism cleaning system comprises a spraying mechanism pipeline, a blowing mechanism pipeline, a spraying and blowing mechanism, a cleaning tank and a controller. The water inlet end of the spraying mechanism pipeline is connected with an external water supply device, the water inlet end of the blowing mechanism pipeline is connected with an external gas supply device, the water outlet end of the spraying mechanism pipeline and the gas outlet end of the blowing mechanism pipeline are connected with the spraying and blowing mechanism respectively, the spraying and blowing mechanism is located in the cleaning tank, the controller is in communication connection with the spraying mechanism pipeline and the blowing mechanism pipeline, and the spraying mechanism pipeline is controlled to supply water to the spraying and blowing mechanism and the blowing mechanism pipeline is controlled to supply gas to the spraying and blowing mechanism. The wafer holding mechanism contact position with the corrosion liquid is sprayed and dried in all directions, the residual high-concentration NaOH corrosion liquid can be completely cleaned, the wafer holding mechanism moves back and forth to pollute the equipment platform is avoided, the wafer holding mechanism alkali crystallization phenomenon is prevented, and the machine maintenance cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit technology, and in particular to a die holding mechanism cleaning system and its control method, as well as electronic equipment. Background Technology

[0002] Currently, the typical process for 12-inch silicon wafers used in integrated circuits involves straight-line pulling, truncation, outer diameter rolling, notch grooving, slicing, grinding, chamfering, etching, rough polishing, fine polishing, cleaning, and packaging. Among these processes, grinding is a mechanical machining step. Under the pressure of the grinding wheel, a stress damage layer of a certain depth inevitably forms on the silicon wafer surface, and the wafer undergoes stress deformation. Due to the incomplete lattice and loose structure in the damage layer, the surface of the ground silicon wafer is easily contaminated by impurities such as metal ions, leading to contamination diffusion and other adverse effects on subsequent production processes. Therefore, after grinding, the silicon wafer undergoes chemical etching to release the stress from the grinding process, remove the grinding damage layer, and optimize flatness.

[0003] Chemical etching of silicon wafer surfaces generally employs wet etching. To minimize the introduction of metal ions or other impurities, acidic solutions consisting of a mixture of hydrofluoric acid (HF) and nitric acid (HNO3), as well as alkaline solutions such as potassium hydroxide (KOH) or sodium hydroxide (NaOH), are currently the primary methods used. Compared to acid etching, alkaline etching offers a controllable reaction rate, exhibits anisotropic behavior, and results in better wafer flatness without edge collapse. Therefore, alkaline etching is the mainstream process used by the vast majority of 12-inch silicon wafer manufacturers in China.

[0004] Currently, the commonly used etching solution for alkaline etching is a 48% NaOH solution. The alkaline etching machine is designed as a basketless type, containing more than a dozen processing tanks. A wafer-holding mechanism is needed to pick up silicon wafers and place them into different processing tanks, thus achieving wafer transfer. When the wafer-holding mechanism returns from the NaOH etching tank to the cleaning tank, it undergoes approximately 30 seconds of immersion cleaning. However, this cleaning is incomplete, and a high concentration of NaOH solution remains on the upper part of the wafer-holding mechanism. At room temperature, this solution easily crystallizes and precipitates onto the upper surface of the wafer-holding mechanism. As the alkali crystals accumulate excessively, the machine will trigger an abnormal alarm. Currently, to solve the problem of alkali crystallization in the wafer-holding mechanism of the alkaline etching machine, the machine must be shut down at least twice a week for cleaning, which is time-consuming, labor-intensive, and disrupts production. Summary of the Invention

[0005] Therefore, it is necessary to address the technical problem of the lack of a cleaning system for the holding mechanism in the existing technology, and to provide a cleaning system for the holding mechanism, its control method, and electronic equipment.

[0006] This invention provides a cleaning system for a plate-holding mechanism, comprising: a spray mechanism pipeline, a blowing mechanism pipeline, a blowing mechanism, a cleaning tank, and a controller. The water inlet of the spray mechanism pipeline is connected to an external water supply device, the water inlet of the blowing mechanism pipeline is connected to an external air supply device, the water outlet of the spray mechanism pipeline and the air outlet of the blowing mechanism pipeline are respectively connected to the blowing mechanism, the blowing mechanism is located in the cleaning tank, and the controller is communicatively connected to the spray mechanism pipeline and the blowing mechanism pipeline, controlling the spray mechanism pipeline to supply water to the blowing mechanism and controlling the blowing mechanism pipeline to supply air to the blowing mechanism.

[0007] Furthermore, the cleaning tank includes a position detection module, a lifting device, and a tank body. The position detection module and the lifting device are housed in the tank body. The position detection module is communicatively connected to the controller. The position detection module is used to detect the position of the holding mechanism and sends a positioning signal to the controller when the holding mechanism is in the cleaning position in the tank body.

[0008] The blowing angle, position, and duration of the blowing mechanism are adjustable, and it is used to clean the plate holding mechanism.

[0009] The lifting device is fixed inside the tank and is connected to the blowing mechanism to control the working position of the blowing mechanism.

[0010] Furthermore, the spraying mechanism includes: a main spraying pipe, multiple spraying branch pipes, and a support frame. The multiple spraying branch pipes are arranged parallel to each other and each has several nozzles arranged in a straight line. The opening inclination angles of the nozzles at different positions are different. The support frame is connected to the lifting device, and the lifting device controls the position of the support frame in the tank. The multiple spraying branch pipes are supported by the support frame, and both ends of the spraying branch pipes are respectively connected to the main spraying pipe. The main spraying pipe is connected to the water outlet of the spraying mechanism pipeline and the air outlet of the purging mechanism pipeline.

[0011] Furthermore, the film holding mechanism includes a film holding mechanism clamping plate and a film holding mechanism roller clamped and fixed by the film holding mechanism clamping plate. The angular openings of the nozzles at both ends of the blowing branch pipe have an angle with the axis of the nozzle, while the angular openings of the nozzles in the middle of the blowing branch pipe have no angle with the axis of the nozzle. When the film holding mechanism clamping plate is located in the groove, the angular openings of the nozzles at both ends of the blowing branch pipe face the film holding mechanism clamping plate.

[0012] Furthermore, the film holding mechanism includes two sets of clamping units. Each set of clamping units includes a film holding mechanism clamping plate and a film holding mechanism roller clamped and fixed by the film holding mechanism clamping plate. The blowing branch pipe includes a second blowing branch pipe located in the middle, and a first blowing branch pipe and a third blowing branch pipe located on both sides of the second blowing branch pipe. When the film holding mechanism clamping plate is located in the groove, the first blowing branch pipe and the third blowing branch pipe are located on the outside of the two sets of clamping units, and the second blowing branch pipe is located on the inner layer of the two sets of clamping units.

[0013] The blowing mechanism also includes a first motor, the drive end of which is connected to a second blowing branch pipe, driving the second blowing branch pipe to rotate around the axis of the second blowing branch pipe;

[0014] The first and third jetting branches are rotatable.

[0015] Furthermore, the lifting device includes a spiral drive cover, an internal screw, and a lifting motor. The spiral drive cover is fixed to the bottom of the groove, the internal screw is housed within the spiral drive cover, the drive end of the lifting motor is connected to the top of the internal screw, and the support frame is connected to the internal screw.

[0016] This invention provides a control method for the cleaning system of the wafer holding mechanism as described above, comprising:

[0017] Cleaning instructions received;

[0018] Control the spray mechanism pipeline to supply water to the blowing mechanism, and control the purging mechanism pipeline to supply air to the blowing mechanism.

[0019] Further, controlling the spray mechanism pipeline to supply water to the purging mechanism and controlling the purging mechanism pipeline to supply air to the purging mechanism includes:

[0020] The system controls the spray mechanism pipeline to supply water to the spray mechanism to perform the spraying operation. During the spraying operation, the system controls the lifting device to drive the spray mechanism to move downward and adjusts the spraying angle of the spray mechanism.

[0021] After the spraying operation is completed, control the spraying mechanism pipeline to stop supplying water to the blowing mechanism and control the blowing mechanism to reset;

[0022] The system controls the purging mechanism pipeline to supply air to the spraying mechanism to perform the purging operation. During the purging operation, the system controls the lifting device to drive the spraying mechanism to move downward and adjusts the spraying angle of the spraying mechanism.

[0023] Furthermore, the film holding mechanism includes a film holding mechanism clamping plate and a film holding mechanism roller fixed to the lower end of the film holding mechanism clamping plate. Controlling the lifting device to drive the blowing mechanism downward includes:

[0024] The lifting device is controlled at a first speed to drive the blowing mechanism to move downward for a first cleaning stroke, and then the lifting device is controlled at a second speed to drive the blowing mechanism to move downward for a second cleaning stroke, wherein the first speed is greater than the second speed.

[0025] This invention provides an electronic device, comprising:

[0026] At least one processor; and,

[0027] A memory communicatively connected to at least one of the processors; wherein,

[0028] The memory stores instructions that can be executed by at least one of the processors to enable at least one of the processors to perform the control method of the holding mechanism cleaning system as described above.

[0029] This invention provides a wafer holding mechanism cleaning system for cleaning wafer holding mechanisms. When the wafer holding mechanism is in the cleaning tank, the system controls the spray mechanism pipeline to supply water to the blowing mechanism and controls the blowing mechanism pipeline to supply air to the blowing mechanism. This spraying and blowing operation on the wafer holding mechanism thoroughly cleans the parts of the wafer holding mechanism that have come into contact with the etching solution, preventing residual high-concentration NaOH etching solution from contaminating the equipment platform due to the wafer holding mechanism's movement, preventing alkali crystallization in the wafer holding mechanism, and reducing equipment maintenance costs. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a cleaning system for a sheet holding mechanism according to the present invention;

[0031] Figure 2 This is a schematic diagram of the overall three-dimensional structure of the cleaning tank of the present invention;

[0032] Figure 3 This is a three-dimensional schematic diagram of the blowing mechanism and lifting device of the present invention;

[0033] Figure 4 This is a schematic diagram of the opening angle of the nozzle of the jet branch pipe of the present invention;

[0034] Figure 5 This is a schematic diagram of the swing of the second jet branch pipe of the present invention;

[0035] Figure 6 This is a schematic diagram showing the details of the sheet-holding mechanism involved in the present invention;

[0036] Figure 7 This is a schematic diagram of the layout of the alkaline corrosion process tank involved in the present invention;

[0037] Figure 8 This is a flowchart illustrating the control method of a cleaning system for a wafer holding mechanism as described above, according to an embodiment of the present invention.

[0038] Figure 9 This is a schematic diagram of the hardware structure of an electronic device according to the present invention.

[0039] Marker description

[0040] 1-External water supply device; 2-First solenoid valve; 3-First pneumatic valve; 4-First manual valve; 5-Water pipe; 6-Cleaning tank; 7-External air supply device; 8-Second solenoid valve; 9-Second pneumatic valve; 10-Second manual valve; 11-Check valve; 12-Air pipe; 13-Slab holding mechanism clamp; 14-Slab holding mechanism roller; 15-Second motor; 16-Third motor; 17-Position detection module; 18-Tank body; 19-First cleaning stroke; 20-Second cleaning stroke; 21-Upper limit switch for contact with corrosive liquid; 22-Slide rail support rod; 23- 24-First jetting branch pipe; 25-Second jetting branch pipe; 26-Third jetting branch pipe; 27-Rotary joint; 28-Ball bearing; 29-First motor; 30-Screw drive cover; 31-Built-in screw; 32-Swing angle of second jetting branch pipe; 33-Support frame; 34-Nozzle; 35-Water / air spray direction; 36-Loading end of machine platform; 37-Ultrasonic cleaning tank; 38-Low concentration NaOH corrosion tank; 39-First rapid exhaust spray rinsing tank; 40-High concentration NaOH corrosion tank; 41-Second rapid exhaust spray rinsing tank. Detailed Implementation

[0041] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. Identical components are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively.

[0042] like Figure 1The diagram shows a structural schematic of a cleaning system for a holding mechanism according to the present invention, including: a spray mechanism pipeline, a blowing mechanism pipeline, a blowing mechanism, a cleaning tank 6, and a controller. The water inlet of the spray mechanism pipeline is connected to an external water supply device 1, the water inlet of the blowing mechanism pipeline is connected to an external air supply device 7, the water outlet of the spray mechanism pipeline and the air outlet of the blowing mechanism pipeline are respectively connected to the blowing mechanism, the blowing mechanism is located in the cleaning tank 6, and the controller is communicatively connected to the spray mechanism pipeline and the blowing mechanism pipeline, controlling the spray mechanism pipeline to supply water to the blowing mechanism and controlling the blowing mechanism pipeline to supply air to the blowing mechanism.

[0043] Specifically, this invention provides a wafer holding mechanism cleaning system for cleaning the wafer holding mechanism that holds silicon wafers. When the wafer holding mechanism is located in the cleaning tank 6, the spray mechanism pipeline is controlled to supply water to the blowing mechanism, and the blowing mechanism pipeline is controlled to supply air to the blowing mechanism. This allows for spraying and blowing operations on the wafer holding mechanism, thoroughly cleaning any parts of the wafer holding mechanism that have come into contact with the etching solution. This effectively removes residual high-concentration NaOH etching solution, prevents the wafer holding mechanism from moving back and forth and contaminating the equipment platform, prevents alkali crystallization in the wafer holding mechanism, and reduces equipment maintenance costs.

[0044] The water inlet of the spray mechanism pipeline is connected to an external water supply device 1, which is preferably a Central Chemical Supply System (CCSS) for the alkali corrosion machine. The parts of the tablet holding mechanism that come into contact with the alkali solution are thoroughly cleaned by spraying under certain pressure.

[0045] In some embodiments, the spray mechanism pipeline includes a first solenoid valve 2, a first pneumatic valve 3, a first manual valve 4, and a water pipe 5. The first pneumatic valve 3 is controlled by the first solenoid valve 2, thereby controlling the opening and closing of the spray mechanism pipeline. The first manual valve 4 is located after the first pneumatic valve 3 and can manually adjust the spray pressure. Specifically, the water supply for the spray mechanism pipeline is deionized water, the water pipe 5 is a deionized water pipe, and the water pressure at the nozzle outlet is 0.3-0.4 MPa.

[0046] The air inlet of the purging mechanism pipeline is connected to an external air supply device 7. The external air supply device 7 is preferably factory compressed air. The cleaned plate-holding mechanism is dried by purging at a certain pressure.

[0047] In some embodiments, the purging mechanism pipeline includes a second solenoid valve 8, a second pneumatic valve 9, a second manual valve 10, a check valve 11, and an air pipe 12. The second pneumatic valve 9 is controlled by the second solenoid valve 8 to open and close the purging mechanism pipeline. The second solenoid valve 8 is driven by the machine's programmable logic controller (PLC) and automatically opens after spraying is completed. The second manual valve 10 is located after the second pneumatic valve 9 and can be manually adjusted to adjust the purging pressure. Specifically, the nozzle outlet air pressure is 0.5-0.6 MPa. The check valve 11 is located after the second manual valve 10 to prevent spraying water from flowing back into the air path.

[0048] The spraying mechanism pipeline and the purging mechanism pipeline are pulled and protected by tank chains. The ends of the two are integrated together as a single pipeline and connected to the spraying mechanism.

[0049] In some embodiments, the bottom of the tank body 18 of the cleaning tank 6 is provided with a drain hole for discharging cleaning waste liquid.

[0050] Preferably, the water supply for the spraying mechanism is plant deionized water, and the water pressure of the spray head can be adjusted by a manual valve. The water pipe of the spraying mechanism is made of polyfluoroalkoxy (PFA), and the spray head is made of polyvinylidene fluoride (PVDF-F).

[0051] Preferably, the air source for the purging mechanism is plant compressed air, and the air pressure at the nozzle can be adjusted via a hand valve. The air pipe material of the purging mechanism pipeline is PFA.

[0052] This invention provides a wafer holding mechanism cleaning system for cleaning wafer holding mechanisms. When the wafer holding mechanism is in the cleaning tank, the system controls the spray mechanism pipeline to supply water to the blowing mechanism and controls the blowing mechanism pipeline to supply air to the blowing mechanism. This spraying and blowing operation on the wafer holding mechanism thoroughly cleans the parts of the wafer holding mechanism that have come into contact with the etching solution, preventing residual high-concentration NaOH etching solution from contaminating the equipment platform due to the wafer holding mechanism's movement, preventing alkali crystallization in the wafer holding mechanism, and reducing equipment maintenance costs.

[0053] like Figures 1 to 7As shown, another embodiment of the present invention provides a cleaning system for a sheet holding mechanism. The sheet holding mechanism includes a sheet holding mechanism clamping plate 13 and a sheet holding mechanism roller 14 clamped and fixed by the sheet holding mechanism clamping plate 13. The sheet holding mechanism cleaning system includes: a spray mechanism pipeline, a blowing mechanism pipeline, a blowing mechanism, a cleaning tank 6, and a controller. The water inlet of the spray mechanism pipeline is connected to an external water supply device 1, the water inlet of the blowing mechanism pipeline is connected to an external air supply device 7, the water outlet of the spray mechanism pipeline and the air outlet of the blowing mechanism pipeline are respectively connected to the blowing mechanism. The blowing mechanism is located in the cleaning tank 6. The controller is communicatively connected to the spray mechanism pipeline and the blowing mechanism pipeline, controlling the spray mechanism pipeline to supply water to the blowing mechanism and controlling the blowing mechanism pipeline to supply air to the blowing mechanism.

[0054] The cleaning tank 6 includes a position detection module 17, a lifting device, and a tank body 18. The position detection module 17 and the lifting device are housed in the tank body 18. The position detection module 17 is communicatively connected to the controller. The position detection module 17 is used to detect the position of the holding mechanism and send a positioning signal to the controller when the holding mechanism is in the cleaning position in the tank body 18.

[0055] The blowing angle, position, and duration of the blowing mechanism are adjustable, and it is used to clean the plate holding mechanism.

[0056] The lifting device is fixed inside the tank 18 and is connected to the blowing mechanism to control the working position of the blowing mechanism.

[0057] The blowing mechanism includes: a main blowing pipe 23, multiple blowing branch pipes, and a support frame 33. The multiple blowing branch pipes are arranged parallel to each other and each has a number of nozzles 34 arranged in a straight line. The opening inclination angles of the multiple nozzles 34 at different positions are different. The support frame 33 is connected to the lifting device, and the lifting device controls the position of the support frame 33 in the tank 18. The multiple blowing branch pipes are supported by the support frame 33, and both ends of the blowing branch pipes are respectively connected to the main blowing pipe 23. The main blowing pipe 23 is connected to the water outlet of the spray mechanism pipeline and the air outlet of the purging mechanism pipeline.

[0058] The angular openings of the nozzles 34 at both ends of the blow-blowing branch pipe are at an angle to the axis of the nozzles 34, while the angular openings of the nozzles 34 in the middle of the blow-blowing branch pipe are not at an angle to the axis of the nozzles 34. Furthermore, when the clamping plate 13 of the plate holding mechanism is located in the groove 18, the angular openings of the nozzles 34 at both ends of the blow-blowing branch pipe face the clamping plate 13 of the plate holding mechanism.

[0059] The film holding mechanism includes two sets of clamping units. Each set of clamping units includes a film holding mechanism clamping plate 13 and a film holding mechanism roller 14 clamped and fixed by the film holding mechanism clamping plate 13. The blowing branch pipe includes a second blowing branch pipe 25 located in the middle, and a first blowing branch pipe 24 and a third blowing branch pipe 26 located on both sides of the second blowing branch pipe 25. When the film holding mechanism clamping plate 13 is located in the groove 18, the first blowing branch pipe 24 and the third blowing branch pipe 26 are located on the outside of the two sets of clamping units, and the second blowing branch pipe 25 is located on the inner layer of the two sets of clamping units.

[0060] The blowing mechanism also includes a first motor 29, the drive end of the first motor 29 being connected to a second blowing branch pipe 25, driving the second blowing branch pipe 25 to rotate around the axis of the second blowing branch pipe 25;

[0061] The first jet branch pipe 24 and the third jet branch pipe 26 are rotatable;

[0062] The lifting device includes a spiral drive cover 30, an internal screw 31, and a lifting motor. The spiral drive cover 30 is fixed to the bottom of the groove 18. The internal screw 31 is housed within the spiral drive cover 30. The drive end of the lifting motor is connected to the top of the internal screw 31. The support frame 33 is connected to the internal screw 31.

[0063] Specifically, such as Figure 2 As shown, the cleaning tank consists of three parts: a position detection module 17, a lifting device, and a tank body 18.

[0064] In some embodiments, the position detection module 17 consists of two sets of laser through-beam sensors. Each set of sensors includes a sensor transmitter and a sensor receiver. The two sets of laser through-beam sensors are symmetrically arranged on the front and rear sides of the tank 18. Specifically, after the sheet holding mechanism reaches the cleaning position, the two end faces of the sheet holding mechanism roller 14 of the sheet holding mechanism are projected onto the side wall of the tank 18.

[0065] In some embodiments, the tank 18 is made of transparent PVC material, which makes it easy for operators to observe the cleaning process.

[0066] like Figure 3-5 As shown, the blowing mechanism mainly includes a main blowing pipe 23, a first blowing branch pipe 24, a second blowing branch pipe 25, a third blowing branch pipe 26, a first motor 29, and a support frame 33. The first, second, and third blowing branch pipes are arranged parallel to each other and each has several nozzles arranged in a straight line.

[0067] In some embodiments, a spacing is provided between the three jetting branches that can be passed through the plate-holding mechanism.

[0068] To ensure that the passing of the plate-holding mechanism is not affected, the spacing between the three jetting branches is preferably 120 mm.

[0069] like Figure 4 As shown, the opening angles of the nozzles 34 at different positions on the blow-off branch pipe are different. Specifically, the nozzles on both sides near the clamping plate of the plate holding mechanism have an opening angle of 60 degrees with the axis of the branch pipe, while the nozzles in the middle position have a vertical angle without any angle. At this time, the cleaning effect on the plate holding mechanism is the best. The support frame 33 has three pairs of through holes on both sides. The first and third blowing branch pipes pass through the first and third through holes of the support frame, respectively. The water / air inlet end is connected to the blowing main pipe 23 through the rotary joint 27. The first and third through holes of the support frame 33 are equipped with ball bearings 28. By rotating the first and third blowing branch pipes, the angle between the nozzle and the holding mechanism can be adjusted. When the central axis of the nozzle is at a 45-degree angle to the outer side of the holding mechanism clamp plate 13, the water / air pressure will be decomposed into a first component perpendicular to the surface of the holding mechanism clamp plate and a second component parallel to the outer surface of the holding mechanism. The first component can continuously impact the alkaline solution and water droplets adhering to the surface of the holding mechanism, and the second component can ensure that the cleaning liquid flows downward along the surface of the holding mechanism. At this time, the cleaning and drying effect on the outer surface of the holding mechanism clamp plate 13 and the holding mechanism roller 14 is the best. A ball bearing 28 is installed in the second through hole in the middle of the support frame 33. The water / air inlet end of the second jetting branch pipe 25 passes through the support frame and is connected to the jetting main pipe 23 via a rotary joint 27. The other end is connected to the drive end of the first motor 29. During the jetting process, the second jetting branch pipe 25 always reciprocates within a certain angle range, such as... Figure 5 As shown, the cleaning and drying effect on the surfaces of the plate holding mechanism clamp 13 and the plate holding mechanism roller 14 is best when the swing angle of the second jet branch pipe is kept at 90 degrees.

[0070] In this embodiment, by setting different opening inclination angles of the nozzles at different positions on the blowing branch pipe, the nozzles can effectively clean and dry the clamping plates and rollers of the tablet holding mechanism that come into contact with the alkaline solution.

[0071] Preferably, the first motor 29 is a swing motor.

[0072] like Figure 3 As shown, the lifting device includes a screw drive cover 30, an internal screw 31, and a lifting motor.

[0073] In some embodiments, the lifting device includes two sets of lifting units, each set of lifting units including a spiral drive cover 30, a built-in screw 31 and a lifting motor, the lifting motor including a second motor 15 and a third motor 16.

[0074] The spiral drive cover 30 is fixed at the middle position on both sides of the bottom of the tank 18. The built-in screw 31 is located inside the spiral drive cover 30. The second motor 15 and the third motor 16 are respectively fixed to the upper part of the two spiral drive covers 30, and the motor drive end is connected to the top of the built-in screw 31. The built-in screw 31 is threadedly connected to the side support frame of the blowing mechanism. The built-in screw 31 can drive the blowing mechanism to move up and down, controlling the working position of the blowing mechanism. The bottom four corners of the tank 18 are provided with slide rail support rods 22 for the blowing mechanism. The four corners of the support frame 33 are respectively fitted onto the four slide rail support rods 22 and slide along the slide rail support rods 22. The part of the holding mechanism that contacts the alkaline solution can be cleaned in sections, improving the cleaning efficiency.

[0075] like Figure 6 As shown, the lifting speed of the blowing mechanism is different in the first cleaning stroke 19 and the second cleaning stroke 20, so as to achieve the purpose of cleaning the part of the holding mechanism that comes into contact with the alkali solution in stages.

[0076] Preferably, the second motor 15 and the third motor 16 are variable frequency motors.

[0077] like Figure 7 As shown, in this embodiment, the process route of the alkaline etching process is as follows: The wafer holding mechanism first takes out the silicon wafer from the wafer cassette at the loading end 36 of the alkaline etching machine and puts it into the ultrasonic cleaning tank 37 to clean the silicon wafer. After cleaning, the silicon wafer is taken out from the ultrasonic cleaning tank 37 and put into the low-concentration NaOH tank 38 for the first etching. The silicon wafer is then taken out and put into the first QuickDump Rinser (QDR) tank 39 for rinsing. After rinsing, the silicon wafer is taken out and put into the high-concentration NaOH tank 40 for the second etching. After that, the silicon wafer is taken out and put into the second QuickDump Rinser 41 for rinsing again. At this time, the wafer holding mechanism returns to the cleaning position of the cleaning tank 6. After the position detection module 17 effectively identifies the position, the spraying and drying begin.

[0078] Specifically, when the wafer holding mechanism is performing wafer pick-and-place operations, the automatic cleaning system is in standby mode. When the wafer holding mechanism finishes the pick-and-place operation, the position detection module 17 detects that the wafer holding mechanism has returned to the cleaning position on the machine, and after certain conditions are met, such as the wafer holding mechanism not moving within 10 seconds, a signal is sent to the machine's industrial control computer. The machine's industrial control computer sends a signal command to the PLC controller, and the PLC controller outputs an electrical signal to control the solenoid valve, starting the cleaning and drying process, thus forming an automatic cleaning process. In particular, within one cycle, the automatic cleaning system only performs one cleaning action.

[0079] The online automatic cleaning system for the plate-holding mechanism of the alkaline etching machine provided in this embodiment includes a front-end pipeline of the spray mechanism, a front-end pipeline of the purging mechanism, and a cleaning tank. In the cleaning tank, the three purging branches of the spray mechanism have nozzles with different opening angles at different positions, resulting in better cleaning of the clamping plate area of ​​the plate-holding mechanism. Specifically, the angle between the nozzles of the first and third purging branches and the plate-holding mechanism is adjustable. The second purging branch, driven by the first motor, continuously oscillates within a certain angle range, avoiding cleaning dead zones caused by fixed-angle spraying. Furthermore, during the self-cleaning process, the second and third motors drive the purging mechanism to rise and fall, achieving segmented cleaning of different parts of the plate-holding mechanism. By spraying and drying the parts of the plate-holding mechanism that have come into contact with the etching solution in all directions, residual high-concentration NaOH etching solution can be thoroughly cleaned, preventing the plate-holding mechanism from moving back and forth and contaminating the equipment platform, preventing alkali crystallization in the plate-holding mechanism, and reducing machine maintenance costs.

[0080] The online automatic cleaning system for the plate-holding mechanism of the alkali etching machine provided in this embodiment includes water / air circuit on / off control components at the water inlet of the spray mechanism and the air inlet of the purging mechanism. These water / air circuit on / off control components are preferably solenoid valves and are controlled by the PLC controller of the alkali etching machine. The opening and closing of the solenoid valves are linked to the position of the plate-holding mechanism of the alkali etching machine. When the plate-holding mechanism is performing a plate-picking and placing operation and is not in the cleaning position, the automatic cleaning system is in standby mode. When the plate-holding mechanism finishes the plate-picking and placing operation and the position detection module 17 detects that the plate-holding mechanism has returned to the cleaning position, it sends a signal to the machine's industrial control computer. The machine's industrial control computer sends a signal command to the PLC controller, and the PLC controller outputs an electrical signal to control the solenoid valve, starting the cleaning and drying process, thus forming an automatic cleaning process and ensuring the normal operation of the alkali etching operation.

[0081] like Figure 8 The diagram shown is a flowchart of a control method for a cleaning system of a wafer holding mechanism as described above, according to an embodiment of the present invention, including:

[0082] Step S801: A cleaning instruction is received;

[0083] Step S802: Control the spray mechanism pipeline to supply water to the blowing mechanism and control the purging mechanism pipeline to supply air to the blowing mechanism.

[0084] Specifically, this embodiment can be implemented by the controller of the cleaning system of the holding mechanism.

[0085] When the user needs to clean the holding mechanism, a cleaning instruction is generated, and step S801 is executed.

[0086] In some embodiments, when the position detection module 17 of the cleaning tank 6 detects that the holding mechanism has reached the cleaning position, a cleaning instruction is triggered.

[0087] Then, step S802 is executed, controlling the spray mechanism pipeline to supply water to the blowing mechanism and controlling the purging mechanism pipeline to supply air to the blowing mechanism.

[0088] Specifically, first, the spray mechanism pipeline is controlled to supply water to the blowing mechanism, so that the blowing mechanism sprays water to the plate holding mechanism to complete the spraying operation. Then, the purging mechanism pipeline is controlled to supply air to the blowing mechanism, so that the blowing mechanism sprays air to the plate holding mechanism to complete the purging operation.

[0089] In some embodiments, the spray mechanism pipeline includes a first solenoid valve 2, a first pneumatic valve 3, a first manual valve 4, and a water pipe 5. The first pneumatic valve 3 is controlled by the first solenoid valve 2, thereby controlling the opening and closing of the spray mechanism pipeline. The first manual valve 4 is located after the first pneumatic valve 3 and is normally open.

[0090] In some embodiments, the purging mechanism pipeline includes a second solenoid valve 8, a second pneumatic valve 9, a second manual valve 10, a check valve 11, and an air pipe 12. The second pneumatic valve 9 is controlled by the second solenoid valve 8 to realize the opening and closing of the purging mechanism pipeline. The second solenoid valve 8 is driven by the machine's PLC and automatically opens after spraying is completed. The second manual valve 10 is located after the second pneumatic valve 9 and is normally open.

[0091] This embodiment provides a control method for a wafer holding mechanism cleaning system. The method cleans the wafer holding mechanism that holds the silicon wafer. When the wafer holding mechanism is in the cleaning tank, the spray mechanism pipeline is controlled to supply water to the blowing mechanism, and the blowing mechanism pipeline is controlled to supply air to the blowing mechanism. This allows for spraying and blowing operations on the wafer holding mechanism. By spraying and drying the parts of the wafer holding mechanism that have come into contact with the etching solution, residual high-concentration NaOH etching solution can be thoroughly cleaned. This prevents the wafer holding mechanism from moving back and forth and contaminating the equipment platform, prevents alkali crystallization in the wafer holding mechanism, and reduces machine maintenance costs.

[0092] In one embodiment, controlling the spray mechanism pipeline to supply water to the purging mechanism and controlling the purging mechanism pipeline to supply air to the purging mechanism includes:

[0093] The system controls the spray mechanism pipeline to supply water to the spray mechanism to perform the spraying operation. During the spraying operation, the system controls the lifting device to drive the spray mechanism to move downward and adjusts the spraying angle of the spray mechanism.

[0094] After the spraying operation is completed, control the spraying mechanism pipeline to stop supplying water to the blowing mechanism and control the blowing mechanism to reset;

[0095] The system controls the purging mechanism pipeline to supply air to the spraying mechanism to perform the purging operation. During the purging operation, the system controls the lifting device to drive the spraying mechanism to move downward and adjusts the spraying angle of the spraying mechanism.

[0096] Specifically, during the process of controlling the spray mechanism pipeline to supply water to the spray mechanism to perform the spraying operation, the lifting motor of the lifting device, such as the second motor 15 and the third motor 16, drives the spray mechanism to rise and fall. At the same time, the first motor 29 drives the second spray branch pipe 25 to swing back and forth within a certain angle range, thereby adjusting the spraying angle of the spray mechanism and achieving a wide-range spraying.

[0097] After the spraying operation is completed, the spraying mechanism pipeline is controlled to stop supplying water to the blowing mechanism, and the lifting motor is controlled to drive the blowing mechanism to move upward to the starting position to complete the reset.

[0098] Then, during the process of controlling the purging mechanism pipeline to supply air to the spraying mechanism to perform the purging operation, the lifting motor of the lifting device, such as the second motor 15 and the third motor 16, drives the spraying mechanism to rise and fall. At the same time, the first motor 29 drives the second spraying branch pipe 25 to swing back and forth within a certain angle range, thereby adjusting the spraying angle of the spraying mechanism and realizing a wide-range purging.

[0099] This embodiment achieves wide-area spraying and purging by adjusting the spraying angle of the spraying mechanism.

[0100] In some embodiments, adjusting the blowing angle of the blowing mechanism is achieved by driving the second blowing branch pipe 25 to swing back and forth within a preset angle range.

[0101] Since the second jet branch pipe 25 is located between the two sets of clamping units, the second jet branch pipe 25 can swing back and forth within a preset angle range to spray and blow on the inner side of the two sets of clamping units.

[0102] In one embodiment, the film holding mechanism includes a film holding mechanism clamp 13 and a film holding mechanism roller 14 fixed to the lower end of the film holding mechanism clamp 13. Controlling the lifting device to drive the blowing mechanism downward includes:

[0103] The lifting device is controlled at a first speed to drive the blowing mechanism to move downward for a first cleaning stroke, and then the lifting device is controlled at a second speed to drive the blowing mechanism to move downward for a second cleaning stroke, wherein the first speed is greater than the second speed.

[0104] Specifically, during the first cleaning stroke 19, the blowing mechanism moves quickly, and the simple structure of the washing mechanism makes it easy to clean the clamps 13 of the film holding mechanism on both sides. During the second cleaning stroke 20, the blowing mechanism moves slowly, focusing on washing the film holding mechanism rollers 14 of the film holding mechanism.

[0105] The working process of the online automatic cleaning system for the film holding mechanism in this embodiment is described below:

[0106] Step A: The wafer holding mechanism of the alkaline etching machine removes the silicon wafer to be processed from the wafer cassette at the end of the machine's support platform and sequentially places it into the ultrasonic cleaning tank 37, the low-concentration NaOH etching tank 38, the first fast-drain spray rinsing tank 39, the high-concentration NaOH etching tank 40, and the second fast-drain spray rinsing tank 41. After that, the wafer holding mechanism returns to the cleaning tank 6. The position detection module 17 identifies that the wafer holding mechanism is in the cleaning position and that the wafer holding mechanism has no other movement within 10 seconds, and sends a signal to the machine's industrial control computer.

[0107] Step B: The machine tool's industrial control computer sends a signal command to the PLC controller, the first solenoid valve 2 of the spray mechanism opens, the first pneumatic valve 3 opens, and the first manual valve 4 is normally open, the automatic cleaning of the spray mechanism begins, and deionized water passes through the first solenoid valve 2, the first pneumatic valve 3, the first manual valve 4 and the water pipe into the main spray pipe 23, with a water pressure of 0.3-0.4 MPa.

[0108] Step C: The second motor 15 and the third motor 16 start, the built-in screw 31 rotates and drives the blowing mechanism to move downward. At the same time, the first motor 29 starts, driving the second blowing branch pipe 25 to oscillate back and forth within a 90-degree range. Deionized water is sprayed from the nozzles of the first blowing branch pipe 24, the second blowing branch pipe 25, and the third blowing branch pipe 26. The spray jets of the first and third blowing branch pipes 24 and 26 form a 45-degree angle with the outer surface of the clamping plate 13 of the film holding mechanism. The spray angle of the spray jet of the second blowing branch pipe 25 oscillates back and forth, and the cleaning waste liquid flows downward along the surface of the film holding mechanism. During the first cleaning stroke 19, the blowing mechanism moves quickly, and the simple structure makes it easy to clean the clamping plates 13 of the film holding mechanism on both sides. During the second cleaning stroke 20, the blowing mechanism moves slowly, focusing on cleaning the film holding mechanism roller 14 of the film holding mechanism.

[0109] Step D: After the spraying ends, the machine's PLC controller receives a signal, the first solenoid valve 2 of the spraying mechanism closes, the blowing mechanism returns to its original position, the second solenoid valve 8 of the purging mechanism opens, the second pneumatic valve 9 opens, the second hand valve 10 is normally open, and the purging mechanism starts working. The plant's compressed air passes through the second solenoid valve 8, the second pneumatic valve 9, the second hand valve 10, the check valve 11, and the air pipe 12 in sequence into the main blowing pipe 23, with a pressure of 0.5-0.6 MPa.

[0110] Step E: The difference from Step C is that deionized water is replaced with compressed air. Repeat Step C to blow away the residual droplets on the plate clamps 13 and rollers 14 of the plate holding mechanism on both sides after the drying spray.

[0111] Step F: After step E is completed, the blowing mechanism returns to its original position, the tablet holding mechanism automatically completes cleaning, and step A is executed to enter the next cycle.

[0112] like Figure 9 The diagram shown is a hardware structure schematic of an electronic device according to the present invention, comprising:

[0113] At least one processor 901; and,

[0114] A memory 902 is communicatively connected to at least one of the processors 901; wherein,

[0115] The memory 902 stores instructions that can be executed by at least one of the processors to enable the at least one processor to perform the control method of the holding mechanism cleaning system as described above.

[0116] Figure 9 Take the 901 processor as an example.

[0117] The electronic device may also include an input device 903 and a display device 904.

[0118] The processor 901, memory 902, input device 903 and display device 904 can be connected by a bus or other means. The figure shows an example of connection by bus.

[0119] The memory 902, as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the program instructions / modules corresponding to the control method of the cleaning system of the holding mechanism in the embodiments of this application, for example, Figure 8 The method flow is shown. The processor 901 executes various functional applications and data processing by running non-volatile software programs, instructions, and modules stored in the memory 902, thereby realizing the control method of the chip holder cleaning system in the above embodiment.

[0120] Memory 902 may include a program storage area and a data storage area. The program storage area may store an operating system and application programs required for at least one function. The data storage area may store data created based on the use of the control method of the wafer holder cleaning system. Furthermore, memory 902 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. In some embodiments, memory 902 may optionally include memory remotely located relative to processor 901, and these remote memories may be connected via a network to means of performing the control method of the wafer holder cleaning system. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0121] The input device 903 can receive user clicks and generate signal inputs related to user settings and function control of the control method for the cleaning system of the holding mechanism. The display device 904 may include a display screen or other display device.

[0122] When one or more modules are stored in the memory 902, and are run by one or more processors 901, the control method of the plate holding mechanism cleaning system in any of the above method embodiments is executed.

[0123] This embodiment cleans the wafer holding mechanism. When the wafer holding mechanism is in the cleaning tank, the spray mechanism pipeline supplies water to the blowing mechanism, and the blowing mechanism pipeline supplies air to the blowing mechanism. Thus, the spray and blowing mechanism sprays and blows the wafer holding mechanism. By spraying and drying the parts of the wafer holding mechanism that have been in contact with the etching solution, the residual high-concentration NaOH etching solution can be thoroughly cleaned, preventing the wafer holding mechanism from moving back and forth and contaminating the equipment platform, preventing the occurrence of alkali crystallization in the wafer holding mechanism, and reducing the machine maintenance cost.

[0124] One embodiment of the present invention provides a storage medium storing computer instructions, which, when executed by a computer, are used to perform all steps of the control method for the cleaning system of the holding mechanism as described above.

[0125] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A tablet holder mechanism cleaning system, characterized by, The utility model provides a kind of film washing device, including: spraying mechanism pipeline, blowing mechanism pipeline, blowing mechanism, cleaning tank (6) and controller, the water inlet of spraying mechanism pipeline is connected with external water supply device (1), the water inlet of blowing mechanism pipeline is connected with external gas supply device (7), the water outlet of spraying mechanism pipeline and the gas outlet of blowing mechanism pipeline are connected with blowing mechanism respectively, blowing mechanism is located in cleaning tank (6), the controller is connected with spraying mechanism pipeline and blowing mechanism pipeline communication, controls spraying mechanism pipeline and controls blowing mechanism pipeline to supply gas to blowing mechanism; The cleaning tank (6) includes a position detection module (17), a lifting device, and a tank body (18). The position detection module (17) and the lifting device are housed in the tank body (18). The position detection module (17) is connected with the controller in communication. The position detection module (17) is used for detecting the position of the film holding mechanism and sending a signal to the controller when the film holding mechanism is in the cleaning position in the tank body (18). The blowing angle, position, and duration of the blowing mechanism can be adjusted to clean the film holding mechanism. The lifting device is fixed in the tank body (18) and connected with the blowing mechanism to control the working position of the blowing mechanism. The blowing mechanism includes a blowing main pipe (23), multiple blowing branch pipes, and a support frame (33). The multiple blowing branch pipes are arranged parallel to each other and linearly arranged with multiple nozzles (34). The opening inclination angles of the nozzles (34) at different positions are different. The support frame (33) is connected with the lifting device. The lifting device controls the position of the support frame (33) in the tank body (18). The multiple blowing branch pipes are supported by the support frame (33), and the two ends of the blowing branch pipe are connected with the blowing main pipe (23), respectively. The blowing main pipe (23) is connected with the water outlet of the spraying mechanism pipeline and the gas outlet of the blowing mechanism pipeline. The film holding mechanism includes a film holding mechanism clamp (13) and a film holding mechanism roller (14) fixed by the film holding mechanism clamp (13). The angle opening of the nozzles (34) at the two ends of the blowing branch pipe has an angle with the axis of the nozzles (34). The angle opening of the nozzles (34) in the middle of the blowing branch pipe has no angle with the axis of the nozzles (34). When the film holding mechanism clamp (13) is in the tank body (18), the angle opening of the nozzles (34) at the two ends of the blowing branch pipe is directed towards the film holding mechanism clamp (13). ​ 2. The sheet handling mechanism cleaning system according to claim 1, characterized by, The holding mechanism comprises two groups of clamping units, each group of clamping units comprises a holding mechanism clamping plate (13) and a holding mechanism roller (14) fixedly clamped by the holding mechanism clamping plate (13), the blowing branch pipe comprises a second blowing branch pipe (25) located in the middle and a first blowing branch pipe (24) and a third blowing branch pipe (26) located on both sides of the second blowing branch pipe (25), when the holding mechanism clamping plate (13) is located in the groove (18), the first blowing branch pipe (24) and the third blowing branch pipe (26) are located outside the two groups of clamping units, and the second blowing branch pipe (25) is located in the inner layer of the two groups of clamping units; The blowing mechanism further comprises a first motor (29), the driving end of the first motor (29) is connected with the second blowing branch pipe (25), and the second blowing branch pipe (25) is driven to rotate around the axis of the second blowing branch pipe (25); The first blowing branch pipe (24) and the third blowing branch pipe (26) can rotate.

3. The instrument holding mechanism cleaning system according to claim 1, wherein The lifting device comprises a screw transmission cover (30), an internal screw rod (31) and a lifting motor, the screw transmission cover (30) is fixed at the bottom of the groove (18), the internal screw rod (31) is accommodated in the screw transmission cover (30), the driving end of the lifting motor is connected with the top of the internal screw rod (31), and the support frame (33) is connected with the internal screw rod (31).

4. A control method of a sheet handling mechanism cleaning system according to any one of claims 1 to 3, characterized in that, Comprise: Receiving a cleaning instruction; Controlling the spray mechanism pipeline to supply water to the blowing mechanism and controlling the blowing mechanism pipeline to supply gas to the blowing mechanism.

5. The control method of the sheet handling mechanism cleaning system according to claim 4, characterized by, The control of the spray mechanism pipeline to supply water to the blowing mechanism and the control of the blowing mechanism pipeline to supply gas to the blowing mechanism comprise: Controlling the spray mechanism pipeline to supply water to the blowing mechanism to perform a spraying operation, and controlling the lifting device to drive the blowing mechanism to move downward and adjust the blowing angle of the blowing mechanism during the spraying operation; After the spraying operation is completed, the spray mechanism pipeline is controlled to stop supplying water to the blowing mechanism and the blowing mechanism is controlled to reset; Controlling the blowing mechanism pipeline to supply gas to the blowing mechanism to perform a blowing operation, and controlling the lifting device to drive the blowing mechanism to move downward and adjust the blowing angle of the blowing mechanism during the blowing operation.

6. The control method of the sheet handling mechanism cleaning system according to claim 5, wherein The holding mechanism comprises a holding mechanism clamping plate (13) and a holding mechanism roller (14) fixed at the lower end of the holding mechanism clamping plate (13), and the control of the lifting device to drive the blowing mechanism to move downward comprises: Controlling the lifting device to drive the blowing mechanism to move downward by a first cleaning stroke at a first speed, and then controlling the lifting device to drive the blowing mechanism to move downward by a second cleaning stroke at a second speed, the first speed being greater than the second speed.

7. An electronic device, comprising: Comprise: At least one processor; And The memory is in communication connection with the at least one processor; wherein The memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the control method of the sheet handling mechanism cleaning system as claimed in any one of claims 4 to 6.

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