A composite board and its processing technology

Abstract

This invention discloses a composite board and its processing technology, relating to the field of composite board technology. The composite board includes an outer MDF and an inner MDF, with a layer of particleboard sandwiched between the outer and inner MDF. Both sides of the particleboard are connected to the outer and inner MDF by adhesive. The inner layer of the outer MDF has a densely distributed channel 1, and the inner layer of the inner MDF has a densely distributed channel 2. One channel 1 has two inlets on the inner surface of the outer MDF, which extend into the outer MDF and are connected to form a single unit. Another channel 2 has two inlets on the inner surface of the inner MDF, which extend into the inner MDF and are connected to form a single unit. A third channel is formed in the particleboard. Channels 1, 2, and 3 form a closed loop, and adhesive penetrates through this closed loop to form a locking structure, thereby connecting the three layers more tightly and improving the strength of the composite board.

Description

Technical Field

[0001] This invention relates to the field of composite board technology, specifically to a composite board and its processing technology. Background Technology

[0002] Wood composite boards are laminated structural boards made by gluing two thin face veneers to a thicker core layer. The face veneers are spaced apart, which ensures greater rigidity without increasing the amount of material used, and they are widely used in the furniture manufacturing industry.

[0003] Among wood-based panels, MDF and particleboard are two common materials, especially bamboo MDF and bamboo particleboard, which have superior performance compared to other woods, particularly in terms of strength. Therefore, using bamboo panels is a popular approach for manufacturing high-quality furniture.

[0004] MDF has good workability, low strength, and high cost; particleboard has good strength, poor workability, and low cost. Each has its own advantages and disadvantages. For the furniture industry, the workability of the board surface is very important, as it determines whether the appearance of the furniture is restricted by processing. Therefore, MDF is often used as the surface material for furniture. However, if MDF is used exclusively, the strength of the board will be limited, making the furniture more susceptible to damage.

[0005] Based on this, the present invention proposes a method for processing a composite board by combining MDF and particleboard. Summary of the Invention

[0006] The purpose of this invention is to provide a composite board and its processing technology, thereby solving the following technical problems:

[0007] How to improve the strength performance of composite panels.

[0008] The objective of this invention can be achieved through the following technical solutions:

[0009] A composite board includes an outer MDF and an inner MDF, with a layer of particleboard sandwiched between the outer MDF and the inner MDF. Both sides of the particleboard are connected to the outer MDF and the inner MDF by adhesive.

[0010] In a further embodiment of the present invention: the inner layer of the outer MDF has a densely distributed channel 1, and the inner layer of the inner MDF has a densely distributed channel 2.

[0011] In a further embodiment of the present invention: a channel has two inlets on the inner surface of the outer MDF, the two inlets extending into the interior of the outer MDF and connecting to form a single unit.

[0012] In a further embodiment of the present invention: a channel two has two inlets on the inner surface of the inner density board, the two inlets extending into the interior of the inner density board and connecting to form a single unit.

[0013] In a further embodiment of the present invention: a channel three is provided in the particleboard, and the channel three passes through both sides of the particleboard.

[0014] In a further embodiment of the present invention: the ports of channel three located on both sides of the particleboard correspond to one inlet of channel one and one inlet of channel two, respectively. Channel one, channel two and channel three form a closed loop channel, through which the glue flows.

[0015] In a further embodiment of the present invention: the outer MDF, inner MDF, and particleboard are all bamboo-based materials.

[0016] In a further embodiment of the present invention: the outer MDF has a thickness of 3-4 mm, the inner MDF has a thickness of 2-3 mm, and the particleboard has a density of 1-2 mm.

[0017] In a further embodiment of the present invention: Channel 1, Channel 2 and Channel 3 are all obtained by machining.

[0018] A composite board processing technology as described above includes the following steps:

[0019] S1: Apply a layer of glue to the inner layers of both the outer MDF and the inner MDF, and apply a layer of glue to both layers of the particleboard. Then, glue the outer MDF, particleboard and inner MDF together in sequence to form a composite board prototype.

[0020] S2: Place the composite board prototype in a vacuum chamber, seal the vacuum chamber, and draw a negative pressure to -(0.5-0.6)MPa. Hold the pressure for 5-8 minutes, then introduce compressed air into the vacuum chamber until the pressure is 0. Hold the pressure for 5-8 minutes, and then continue to draw a negative pressure to (0.5-0.6)MPa. Hold the pressure for 10-12 minutes.

[0021] S3: After holding the pressure for 10-12 minutes, a composite board is formed. Remove the composite board from the vacuum chamber, and polish the residual adhesive at the edges to obtain a qualified composite board.

[0022] In a further embodiment of the present invention: in step S2, the pressure setting inside the vacuum chamber is controlled by a program.

[0023] The beneficial effects of this invention are:

[0024] (1) The composite board of the present invention combines MDF and particleboard to form a three-layer composite structure with two inner and outer MDF layers sandwiching a middle particleboard layer. The MDF and particleboard are bonded together with glue. The channels on the MDF and the channels on the particleboard form a closed loop channel. The glue penetrates the closed loop channel to form a locking structure, thereby connecting the three-layer structure more tightly and improving the strength of the composite board.

[0025] (2) During the processing of the composite board, the composite board is compacted by vacuum negative pressure. The first negative pressure can initially compact the three-layer board and crush most of the air bubbles generated by the glue during bonding. The intermediate back pressure can make the air bubbles that are difficult to crush in the glue rebound to a larger state. Finally, the negative pressure can compress the air bubbles that have rebounded to a larger state at once, so that the density of the glue after compaction is greater and the amount of air bubbles is greatly reduced, making the connection effect of the composite board stronger and thus improving the strength performance of the composite board. Attached Figure Description

[0026] The invention will now be further described with reference to the accompanying drawings.

[0027] Figure 1 This is a schematic diagram of the composite plate in this invention;

[0028] Figure 2 yes Figure 1 A magnified structural diagram of part A in the middle.

[0029] In the diagram: 100, outer MDF; 101, channel one; 200, inner MDF; 201, channel two; 300, particleboard; 301, channel three. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1

[0032] Take three pieces: 100, 200, and 300. The dimensions of 100 are 40cm long, 20cm wide, and 3cm thick; the dimensions of 200 are 40cm long, 20cm wide, and 2cm thick; and the dimensions of 300 are 40cm long, 20cm wide, and 1cm thick. Apply a layer of MD I adhesive evenly to the inside of 100, the side of 200, and both sides of 300. Then, glue 100, 300, and 200 together in sequence to form a preliminary composite board shape. Place the preliminary composite board shape in a vacuum chamber. The program controls the pressure inside the vacuum chamber. After sealing the vacuum chamber, draw a negative pressure to -0.5MPa and hold the pressure for 5 minutes. Then, introduce compressed air into the vacuum chamber until the pressure is 0 and hold the pressure for 5 minutes. Continue to draw a negative pressure to -0.5MPa and hold the pressure for 10 minutes to form the composite board. Remove the composite board from the vacuum chamber and sand off any remaining adhesive at the edges to obtain the finished composite board.

[0033] Example 2

[0034] Compared with Example 1, the only difference is that the thickness of 100 is 4cm, the thickness of 200 is 3cm, and the thickness of 300 is 1cm.

[0035] Example 3

[0036] Take three pieces: 100, 200, and 300. The dimensions of 100 are 40cm long, 20cm wide, and 3cm thick; the dimensions of 200 are 40cm long, 20cm wide, and 2cm thick; and the dimensions of 300 are 40cm long, 20cm wide, and 1cm thick. Apply a layer of MD I adhesive evenly to the inside of 100, the side of 200, and both sides of 300. Then, glue 100, 300, and 200 together in sequence to form a preliminary composite board shape. Place the preliminary composite board shape in a vacuum chamber. The program controls the pressure inside the vacuum chamber. After sealing the vacuum chamber, draw a negative pressure to -0.6MPa and hold the pressure for 8 minutes. Then, introduce compressed air into the vacuum chamber until the pressure is 0 and hold the pressure for 8 minutes. Continue to draw a negative pressure to -0.6MPa and hold the pressure for 12 minutes to form the composite board. Remove the composite board from the vacuum chamber and sand off any remaining adhesive at the edges to obtain the finished composite board.

[0037] Example 4

[0038] Compared with Example 3, the only difference is that the thickness of 100 is 4cm, the thickness of 200 is 3cm, and the thickness of 300 is 1cm.

[0039] Comparative Example 1

[0040] Take a piece of 100, a piece of 200, and a piece of 300. The dimensions of 100 are 40cm long, 20cm wide, and 3cm thick. The dimensions of 200 are 40cm long, 20cm wide, and 2cm thick. The dimensions of 300 are 40cm long, 20cm wide, and 1cm thick. Apply a layer of MD I adhesive evenly to the inside of 100, the side of 200, and both sides of 300. Then, glue 100, 300, and 200 together in sequence and heat-press for 5 minutes to form a composite board.

[0041] Comparative Example 2

[0042] Compared with Comparative Example 1, the only difference is that the thickness of 100 is 4cm, the thickness of 200 is 3cm, and the thickness of 300 is 1cm.

[0043] Comparative Example 3

[0044] Take one piece of 100 (without the inner layer 101), one piece of 200 (without the inner layer 201), and one piece of 300 (without the outer surface 301). The dimensions of 100 are 40cm long, 20cm wide, and 3cm thick; the dimensions of 200 are 40cm long, 20cm wide, and 2cm thick; and the dimensions of 300 are 40cm long, 20cm wide, and 1cm thick. Apply a layer of MD evenly to the inner side of 100, the side of 200, and both sides of 300. First, glue 100, 300, and 200 are bonded together in sequence to form a preliminary composite board shape. The preliminary composite board shape is placed in a vacuum chamber, and the pressure inside the vacuum chamber is controlled by the program. After the vacuum chamber is sealed, the negative pressure is drawn to -0.6MPa and held for 8 minutes. Then, compressed air is introduced into the vacuum chamber until the pressure is 0 and held for 8 minutes. The negative pressure is drawn to -0.6MPa and held for 12 minutes to form the composite board. The composite board is then removed from the vacuum chamber, and the residual glue at the edges is sanded to obtain the finished composite board.

[0045] Comparative Example 4

[0046] Compared with Comparative Example 3, the only difference is that the thickness of 100 is 4cm, the thickness of 200 is 3cm, and the thickness of 300 is 1cm.

[0047] Comparative Example 5

[0048] Take a piece of 100 (without 101 on the inner layer), a piece of 200 (without 201 on the inner layer), and a piece of 300 (without 301 on the surface). The dimensions of 100 are 40cm long, 20cm wide, and 3cm thick. The dimensions of 200 are 40cm long, 20cm wide, and 2cm thick. The dimensions of 300 are 40cm long, 20cm wide, and 1cm thick. Apply a layer of MD I adhesive evenly to the inner side of 100, the side of 200, and both sides of 300. Then, glue 100, 300, and 200 together in sequence and heat-press for 5 minutes to form a composite board.

[0049] Comparative Example 6

[0050] Compared to Comparative Example 5, the only difference is that the thickness of 100 is 4cm, the thickness of 200 is 3cm, and the thickness of 300 is 1cm.

[0051] Comparative Example 7

[0052] Take a piece of material 100, with dimensions of 40cm in length, 20cm in width, and 6mm in thickness.

[0053] Comparative Example 8

[0054] Take a piece of material 100, with dimensions of 40cm in length, 20cm in width, and 9mm in thickness.

[0055] Comparative Example 9

[0056] Take a piece of 300mm material, with dimensions of 40cm in length, 20cm in width, and 6mm in thickness.

[0057] Comparative Example 10

[0058] Take a piece of 300mm material, with dimensions of 40cm in length, 20cm in width, and 9mm in thickness.

[0059] To provide a clear understanding of the differences between Examples 1-4 and Comparative Examples 1-10, some data from the examples and comparative examples are listed in Table 1, as follows:

[0060] Table 1

[0061]

[0062]

[0063] The composite boards prepared in Examples 1-4 and Comparative Examples 1-4 were subjected to performance tests in accordance with GB / T50329-2012. The test results are listed in Table 2 below:

[0064] Table 2

[0065]

[0066]

[0067] Analysis of the data in Table 2 shows that the mechanical strength of the composite plates obtained in Examples 1-4 is significantly better than that in Comparative Examples 1-10. Therefore, the composite plate of the present invention has higher strength.

[0068] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0069] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0070] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A composite board, characterized in that, It includes an outer MDF (100) and an inner MDF (200), with a layer of particleboard (300) sandwiched between the outer MDF (100) and the inner MDF (200). Both sides of the particleboard are connected to the outer MDF (100) and the inner MDF (200) by glue. The inner layer of the outer density board (100) has a densely packed channel one (101), and the inner layer of the inner density board (200) has a densely packed channel two (201). A channel one (101) has two inlets on the inner surface of the outer density board (100). The two inlets extend into the interior of the outer density board (100) and connect to form a channel one (101). Channel 2 (201) has two inlets on the inner surface of the inner density board (200). The two inlets extend into the interior of the inner density board (200) and connect to form channel 2 (201). The particleboard (300) has a channel three (301) that passes through both sides of the particleboard (300); The ports of channel three (301) on both sides of the particleboard (300) correspond to one inlet of channel one (101) and one inlet of channel two (201), respectively. Channel one (101), channel two (201) and channel three (301) form a closed loop channel, through which the glue flows. The glue runs through the closed loop to form a locking structure.

2. The composite board according to claim 1, characterized in that, The outer MDF (100), inner MDF (200), and particleboard (300) are all bamboo-based boards.

3. A composite board processing technology based on any one of claims 1-2, characterized in that, Includes the following steps: S1: Apply a layer of glue to the inner layers of the outer MDF (100) and inner MDF (200), and apply a layer of glue to both layers of the particleboard (300). Then, glue the outer MDF (100), particleboard (300) and inner MDF (200) together in sequence to form a composite board prototype. S2: Place the composite board prototype in a vacuum chamber, seal the vacuum chamber and draw a negative pressure to -(0.5-0.6) MPa, hold the pressure for 5-8 minutes, then introduce compressed air into the vacuum chamber until the pressure is 0, hold the pressure for 5-8 minutes, and then continue to draw a negative pressure to -(0.5-0.6) MPa, and hold the pressure for 10-12 minutes. S3: After holding the pressure for 10-12 minutes, a composite board is formed. Remove the composite board from the vacuum chamber, and polish the residual adhesive at the edges to obtain a qualified composite board.

4. The composite board processing technology according to claim 3, characterized in that, In step S2, the pressure setting inside the vacuum chamber is controlled by a program.

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