Thin film deposition machine with open-close shielding device

Abstract

The present application provides a thin film deposition machine with an openable and closable shielding device, which mainly comprises a reaction cavity, a supporting disc, a cover ring and a shielding mechanism. The shielding mechanism comprises a first supporting arm, a second supporting arm, a first shielding plate and a second shielding plate, and the first and second shielding plates are respectively placed on the first and second supporting arms. The bottom surfaces of the first and second shielding plates and the supporting disc have corresponding alignment mechanisms, so that the first and second shielding plates can be positioned and placed on the supporting disc. The top surfaces of the first and second shielding plates and the cover ring also have corresponding alignment mechanisms, so that the cover ring can be positioned on the first and second shielding plates and divide a cleaning space in the reaction cavity, thereby facilitating the cleaning of the cavity and the target material.

Description

TECHNICAL FIELD

[0001] The present application relates to a thin film deposition machine with a shielding device, which shields a carrier disk by a shielding mechanism to avoid contaminating the carrier disk during cleaning the processing chamber. BACKGROUND

[0002] Chemical vapor deposition (CVD), physical vapor deposition (PVD) and atomic layer deposition (ALD) are commonly used thin film deposition devices, which are widely used in the processes of integrated circuits, light emitting diodes and displays.

[0003] The deposition device mainly includes a chamber and a wafer carrier disk, wherein the wafer carrier disk is located in the chamber and is used to carry at least one wafer. Taking physical vapor deposition as an example, a target material needs to be arranged in the chamber, wherein the target material faces the wafer on the wafer carrier disk. During physical vapor deposition, inert gas and / or reaction gas can be delivered into the chamber, a bias voltage is applied to the target material and the wafer carrier disk respectively, and the wafer carried by the wafer carrier disk is heated.

[0004] The inert gas in the chamber is ionized due to the high voltage electric field, and the ionized inert gas is attracted by the bias voltage on the target material and bombards the target material. The target atoms or molecules sputtered from the target material are attracted by the bias voltage on the wafer carrier disk and are deposited on the surface of the heated wafer to form a thin film on the surface of the wafer.

[0005] After a period of use, the inner surface of the chamber will form a deposition film, so the chamber needs to be cleaned periodically to avoid the deposition film falling off during the process and thus contaminating the wafer. In addition, the surface of the target material may also form oxides or other contaminants, so the target material also needs to be cleaned periodically. Generally, a burn-in process is usually used to remove the oxides or other contaminants on the surface of the target material by plasma ions bombarding the target material in the chamber.

[0006] When cleaning the chamber and the target material as described above, the wafer carrier disk and the wafer in the chamber need to be removed or isolated to avoid contaminating the wafer carrier disk and the wafer during the cleaning process. SUMMARY

[0007] Generally, a thin film deposition chamber needs to be cleaned after a period of use to remove the thin film deposited in the chamber and the oxide or nitride on the target. The particles generated during the cleaning process will contaminate the carrier plate, so the carrier plate and the contaminants need to be isolated. The present application provides a thin film deposition machine with an openable and closable shielding device. The device mainly drives two shielding plates to swing in opposite directions by a driving device, so that the two shielding plates operate in an open state and a shielding state. The shielding plate in the shielding state can be placed on the carrier plate, and the shielding plate and the carrier plate are aligned by an alignment mechanism, so that the shielding plate can reliably shield the carrier plate.

[0008] The present application provides a thin film deposition machine with an openable and closable shielding device. The device mainly includes a reaction chamber, a carrier plate and a shielding mechanism. The shielding mechanism includes a driving device, two carrier arms and two shielding plates. The driving device carries the two shielding plates by the two carrier arms respectively, and drives the two shielding plates to swing in opposite directions, so that the two shielding plates operate in an open state or a shielding state.

[0009] The lower surface of the shielding plate is provided with two different alignment units. When the shielding plate is placed on the carrier arm, one of the two alignment units is aligned with the alignment unit of the carrier arm, so that the shielding plate is placed on the fixed position of the carrier arm. When the shielding plate contacts the carrier plate, the other alignment unit is aligned with the alignment unit on the carrier plate, so that the shielding plate is placed on the fixed position of the carrier plate and can reliably shield the carrier surface of the carrier plate.

[0010] The present application provides a thin film deposition machine with an openable and closable shielding device. The device mainly includes a reaction chamber, a carrier plate and a shielding mechanism. The shielding mechanism includes a driving device, two carrier arms and two shielding plates. The driving device carries the two shielding plates by the two carrier arms respectively, and drives the two shielding plates to swing in opposite directions, so that the two shielding plates operate in an open state or a shielding state.

[0011] The two carrier arms are respectively connected to an arc-shaped support frame for carrying the shielding plate. When the two shielding plates are closed, the two arc-shaped support frames form a ring-shaped support frame, and an opening is formed on the inner side of the two arc-shaped support frames. The area of the opening is larger than the cross-sectional area of the carrier plate or the area of the carrier surface of the carrier plate, so that the carrier plate can pass through the opening on the inner side of the two arc-shaped support frames and carry and drive the shielding plate away from the arc-shaped support frames. In the above process, the two carrier arms and the arc-shaped support frames do not need to be driven to swing, which is beneficial to improve the convenience in use.

[0012] To achieve the above object, the present application provides a thin film deposition machine with an open-close shielding device, which comprises a reaction chamber including a receiving space; a carrier disk located in the receiving space and including a carrier surface and a plurality of alignment protrusions, wherein the carrier surface is used to carry at least one substrate, and the alignment protrusions are located around the carrier surface; and an open-close shielding device, which comprises a first carrier arm located in the receiving space and including a plurality of first alignment portions; a second carrier arm located in the receiving space and including a plurality of second alignment portions; a first shielding plate, wherein the upper surface of the first shielding plate includes a first arc-shaped groove or a first arc-shaped protrusion, and the lower surface of the first shielding plate includes a plurality of third alignment portions and a plurality of first alignment recesses located inside the third alignment portions, wherein the third alignment portions and the first alignment portions are used to align the first shielding plate and the first carrier arm; a second shielding plate, wherein the upper surface of the second shielding plate includes a second arc-shaped groove or a second arc-shaped protrusion, and the lower surface of the second shielding plate includes a plurality of fourth alignment portions and a plurality of second alignment recesses located inside the fourth alignment portions, wherein the fourth alignment portions and the second alignment portions are used to align the second shielding plate and the second carrier arm; and a driving device connected to the first carrier arm and the second carrier arm and used to drive the first shielding plate and the second shielding plate to swing in opposite directions through the first carrier arm and the second carrier arm respectively, so that the first shielding plate and the second shielding plate are switched between an open state and a shielding state, wherein in the shielding state, the first shielding plate and the second shielding plate are aligned with the alignment protrusions of the carrier disk through the first alignment recesses and the second alignment recesses respectively, and the carrier surface of the carrier disk is shielded by the first shielding plate and the second shielding plate.

[0013] In at least one embodiment of the present application, the driving device includes a shaft sealing device and at least one driving motor, and the driving motor is connected to the first carrier arm and the second carrier arm through the shaft sealing device.

[0014] In at least one embodiment of the present application, it includes a blocking piece, one end of the blocking piece is connected to the reaction chamber, and the other end of the blocking piece forms an annular protrusion; and a cover ring, which is placed on the annular protrusion of the blocking piece, wherein the bottom of the cover ring includes at least one alignment recess, and the cover ring is aligned with the alignment protrusions of the carrier disk through the alignment recess.

[0015] In at least one embodiment of the present application, when the cover ring is connected to the first shielding plate and the second shielding plate, the first arc-shaped protrusion and the second arc-shaped protrusion located on the upper surfaces of the first shielding plate and the second shielding plate are located in the alignment recesses of the bottom of the cover ring.

[0016] In at least one embodiment of the present application, the bottom of the cover ring is provided with at least one protrusion, and a positioning recess is formed at the bottom of the cover ring via the protrusion. When the cover ring connects the first shielding plate and the second shielding plate, the protrusion at the bottom of the cover ring is positioned in the first arc-shaped recess and the second arc-shaped recess on the upper surface of the first shielding plate and the second shielding plate.

[0017] In at least one embodiment of the present application, the first bearing arm includes a first arc-shaped support frame for bearing the first shielding plate, and the first positioning portion is positioned on the first arc-shaped support frame. The second bearing arm includes a second arc-shaped support frame for bearing the second shielding plate, and the second positioning portion is positioned on the second arc-shaped support frame.

[0018] In at least one embodiment of the present application, when the first shielding plate and the second shielding plate operate in the shielding state, the first arc-shaped support frame and the second arc-shaped support frame form a ring-shaped support frame.

[0019] In at least one embodiment of the present application, the ring-shaped support frame formed by the first arc-shaped support frame and the second arc-shaped support frame has an opening on the inner side, and the area of the opening is greater than the area of the bearing surface of the bearing disc.

[0020] In at least one embodiment of the present application, the first shielding plate includes a protruding portion, and the second shielding plate includes a recessed portion. When the first shielding plate and the second shielding plate operate in the shielding state, the protruding portion of the first shielding plate enters the recessed portion of the second shielding plate.

[0021] In at least one embodiment of the present application, two sensing areas are connected to the reaction cavity, and the thickness of the two sensing areas is less than that of the reaction cavity. At least one position sensing unit is arranged in each of the two sensing areas to sense the first shielding plate and the second shielding plate entering the sensing area.

[0022] The present application has the beneficial effect of providing a thin film deposition machine with an openable and closable shielding device. The shielding plate operating in the shielding state can be placed on the bearing disc, and the shielding plate and the bearing disc are aligned by the alignment mechanism, so that the shielding plate can reliably shield the bearing disc. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 FIG. 1 is a side cross-sectional view of an embodiment of the thin film deposition machine with the openable and closable shielding device of the present application operating in the shielding state.

[0024] Figure 2 FIG. 4 is an exploded perspective view of an embodiment of the openable and closable shielding device of the present application.

[0025] Figure 3 FIG. 5 is a perspective view of an embodiment of the openable and closable shielding device of the present application.

[0026] Figure 4Fig. 1 is a perspective view of an embodiment of the shielding plate of the openable and closable shielding device of the present application.

[0027] Figure 5 Fig. 2 is an enlarged sectional view of an embodiment of the partial structure of the thin film deposition machine of the present application.

[0028] Figure 6 Fig. 3 is a sectional view of an embodiment of the driving device of the thin film deposition machine of the present application.

[0029] Figure 7 Fig. 4 is a top view of an embodiment of the thin film deposition machine of the present application operating in an open state.

[0030] Figure 8 Fig. 5 is a top view of an embodiment of the thin film deposition machine of the present application operating in a shielding state.

[0031] Figure 9 Fig. 6 is a side sectional view of an embodiment of the shielding plate connected to the carrier disc of the thin film deposition machine of the present application.

[0032] Figure 10 Fig. 7 is a side sectional view of an embodiment of the shielding plate connected to the cover ring driven by the carrier disc of the thin film deposition machine of the present application.

[0033] BRIEF DESCRIPTION OF THE DRAWINGS 10 - thin film deposition machine; 100 - openable and closable shielding device; 11 - reaction cavity; 111 - blocking member; 1111 - annular protrusion; 113 - sensing area; 115 - target material; 12 - accommodating space; 121 - cleaning space; 13 - carrier disc; 131 - carrier surface; 133 - annular member; 135 - alignment protrusion; 141 - first carrier arm; 142 - opening; 143 - second carrier arm; 145 - first arc-shaped support frame; 1451 - first alignment portion; 147 - second arc-shaped support frame; 1471 - second alignment portion; 15 - shielding member; 151 - first shielding plate; 1511 - third alignment portion; 1512 - protrusion portion; 1513 - first alignment recess; 1515 - first arc-shaped recess; 153 - second shielding plate; 1531 - fourth alignment portion; 1532 - recessed portion; 1533 - second alignment recess; 1535 - second arc-shaped recess; 16 - cover ring; 161 - alignment recess; 163 - protrusion; 17 - driving device; 171 - driving motor; 173 - shaft sealing device; 1731 - outer tube body; 1732 - space; 1733 - shaft body; 18 - lifting unit; 19 - position sensing unit. DETAILED DESCRIPTION

[0034] Please refer to Figure 1Figure 1 shows a side view of a thin film deposition system with a shutter device in a closed state according to an embodiment of the present application. As shown in Figure 1, the thin film deposition system 10 includes a reaction chamber 11, a carrier disk 13, and a shutter device 100. The reaction chamber 11 includes a receiving space 12 for receiving the carrier disk 13 and part of the shutter device 100.

[0035] The carrier disk 13 is located in the receiving space 12 of the reaction chamber 11. The carrier disk 13 includes a carrier surface 131 for carrying at least one substrate. For example, the reaction chamber 11 can be a physical vapor deposition chamber, and the reaction chamber 11 includes a target 115 facing the carrier disk 13. For example, the target 115 can be disposed on an upper surface of the reaction chamber 11 and face the carrier surface 131 of the carrier disk 13 and / or the substrate.

[0036] Please refer to Figure 2 and Figure 3 The shutter device 100 includes a first carrier arm 141, a second carrier arm 143, a first shutter plate 151, a second shutter plate 153, and a driving device 17. The first carrier arm 141, the second carrier arm 143, the first shutter plate 151, and the second shutter plate 153 are located in the receiving space 12. The driving device 17 is connected to the first carrier arm 141 and the second carrier arm 143, and the first carrier arm 141 and the second carrier arm 143 are used to carry the first shutter plate 151 and the second shutter plate 153, respectively. The driving device 17 can drive the first shutter plate 151 and the second shutter plate 153 to swing in opposite directions through the first carrier arm 141 and the second carrier arm 143, respectively. For example, the first carrier arm 141 and the second carrier arm 143 can swing in opposite directions synchronously with the driving device 17 as the axis.

[0037] In an embodiment of the present application, the first carrier arm 141 includes a first arc-shaped support frame 145, and the second carrier arm 143 includes a second arc-shaped support frame 147. The first arc-shaped support frame 145 and the second arc-shaped support frame 147 are used to carry the first shutter plate 151 and the second shutter plate 153, respectively. The driving device 17 can drive the first arc-shaped support frame 145 and the second arc-shaped support frame 147 to swing through the first carrier arm 141 and the second carrier arm 143, respectively, so that the first arc-shaped support frame 145 and the second arc-shaped support frame 147 are close to or away from each other and operate in an open state or a closed state. For example, the first arc-shaped support frame 145 and the second arc-shaped support frame 147 can be semicircular. When the first shutter plate 151 and the second shutter plate 153 operate in a shielding state, the first arc-shaped support frame 145 and the second arc-shaped support frame 147 form a ring-shaped support frame, and an opening 142 is formed on the inner side of the first arc-shaped support frame 145 and the second arc-shaped support frame 147.

[0038] The first supporting arm 141 includes a plurality of first positioning portions 1451, and the second supporting arm 143 includes a plurality of second positioning portions 1471. For example, the first positioning portions 1451 are arranged on the top of the first arc-shaped supporting frame 145, and the second positioning portions 1471 are arranged on the top of the second arc-shaped supporting frame 147.

[0039] As shown in Figure 4 and Figure 5 , the lower surface of the first shielding plate 151 is provided with a plurality of third positioning portions 1511 and a plurality of first positioning recesses 1513, wherein the first positioning recesses 1513 are located inside the third positioning portions 1511. The lower surface of the second shielding plate 153 is provided with a plurality of fourth positioning portions 1531 and a plurality of second positioning recesses 1533, wherein the second positioning recesses 1533 are located inside the fourth positioning portions 1531.

[0040] Specifically, the third positioning portions 1511 and the first positioning portions 1451 are corresponding structures and are used to position the first shielding plate 151 and the first supporting arm 141 or the first arc-shaped supporting frame 145, and the fourth positioning portions 1531 and the second positioning portions 1471 are corresponding structures and are used to position the second shielding plate 153 and the second supporting arm 143 or the second arc-shaped supporting frame 147. For example, the first positioning portions 1451 and the second positioning portions 1471 can be protruding conical bodies on the surfaces of the first arc-shaped supporting frame 145 and the second arc-shaped supporting frame 147, and the third positioning portions 1511 and the fourth positioning portions 1531 can be conical recesses arranged on the lower surfaces of the first shielding plate 151 and the second shielding plate 153.

[0041] The first positioning portions 1451 and the second positioning portions 1471 are protruding conical bodies, and the third positioning portions 1511 and the fourth positioning portions 1531 are conical recesses. This is only one embodiment of the present application. In different embodiments, the first positioning portions 1451 and the second positioning portions 1471 are conical recesses, and the third positioning portions 1511 and the fourth positioning portions 1531 are protruding conical bodies.

[0042] In one embodiment of the present application, as shown in Figure 6 , the driving device 17 includes at least one driving motor 171 and a shaft sealing device 173, wherein the driving motor 171 is connected to the first supporting arm 141 and the second supporting arm 143 through the shaft sealing device 173. The driving motor 171 is located outside the accommodating space 12 of the reaction cavity 11, and the shaft sealing device 173 passes through and is arranged in the reaction cavity 11, wherein part of the shaft sealing device 173 is located inside the accommodating space 12 of the reaction cavity 11.

[0043] The shaft seal device 173 includes an outer tube 1731 and a shaft 1733. The outer tube 1731 includes a space 1732 for receiving the shaft 1733, wherein the outer tube 1731 and the shaft 1733 are coaxially arranged and rotatable relative to each other. The outer tube 1731 is connected to the first carrier arm 141 and drives the first shielding plate 151 to swing via the first carrier arm 141. The shaft 1733 is connected to the second carrier arm 143 and drives the second shielding plate 153 to swing via the second carrier arm 143.

[0044] The shaft seal device 173 can be a general shaft seal and is mainly used to isolate the receiving space 12 of the reaction chamber 11 from the outside space to maintain the vacuum of the receiving space 12. In another embodiment of the present application, the shaft seal device 173 can be a magnetic fluid seal.

[0045] Specifically, the thin film deposition machine 10 and / or the openable and closable shielding device 100 of the present application can operate in two states, i.e. an open state and a shielding state. As shown in Figure 7 The driving device 17 can drive the first shielding plate 151 and the second shielding plate 153 to swing in opposite directions so that the first shielding plate 151 and the second shielding plate 153 are away from each other and operate in the open state. The first shielding plate 151 and the second shielding plate 153 operating in the open state form a space therebetween so that the target 115 and the carrier disk 13 are not blocked by the first shielding plate 151 and the second shielding plate 153 and the thin film deposition can be performed on the substrate on the carrier disk 13.

[0046] As shown in Figure 8 The driving device 17 can drive the first shielding plate 151 and the second shielding plate 153 to swing in opposite directions so that the first shielding plate 151 and the second shielding plate 153 are away from each other and operate in the open state. The first shielding plate 151 and the second shielding plate 153 operating in the open state form a space therebetween so that the target 115 and the carrier disk 13 are not blocked by the first shielding plate 151 and the second shielding plate 153 and the thin film deposition can be performed on the substrate on the carrier disk 13.

[0047] In an embodiment of the present application, as shown in Figure 7 and Figure 8As shown, the reaction cavity 11 can be connected with two sensing areas 113, wherein the sensing areas 113 protrude from the side surface of the reaction cavity 11, and the thickness of the sensing areas 113 is smaller than that of the reaction cavity 11. When the first shielding plate 151 and the second shielding plate 153 are operated in the open state, part of the first shielding plate 151 and part of the second shielding plate 153 will enter the two sensing areas 113, respectively, wherein the area of the first shielding plate 151 and the second shielding plate 153 located in the sensing areas 113 is smaller than that of the first shielding plate 151 and the second shielding plate 153 located in the accommodation space 12.

[0048] The two sensing areas 113 can be respectively arranged on the two adjacent side edges of the reaction cavity 11, and at least one position sensing unit 19 is arranged on each of the two sensing areas 113, respectively, to sense the first shielding plate 151 and the second shielding plate 153 entering the sensing areas 113, so as to determine whether the first shielding plate 151 and the second shielding plate 153 are in the open state, thereby avoiding abnormal collision of the carrier disk 13, the first shielding plate 151 and the second shielding plate 153. For example, the position sensing unit 19 can be a light sensing unit.

[0049] As shown in Figure 1 and Figure 5 , the carrier disk 13 can include an annular member 133 and a plurality of alignment protrusions 135, wherein the annular member 133 and the alignment protrusions 135 are located around the carrier surface 131 of the carrier disk 13, for example, the alignment protrusions 135 are located outside the annular member 133. In an embodiment of the present application, the annular member 133 can include a plurality of setting holes, and the alignment protrusions 135 pass through the setting holes of the annular member 133 and protrude from the upper surface of the annular member 133.

[0050] The thin film deposition machine 10 includes a blocking piece 111 and a cover ring 16, wherein one end of the blocking piece 111 is connected with the reaction cavity 11, and the other end forms an annular protrusion 1111 in the accommodation space 12. The cover ring 16 is placed on the annular protrusion 1111 of the blocking piece 111, and the bottom of the cover ring 16 includes at least one alignment recess 161, wherein the alignment recess 161 of the cover ring 16 corresponds to the alignment protrusion 135 of the carrier disk 13.

[0051] When the first shielding plate 151 and the second shielding plate 153 are operated in the open state, the carrier disk 13 can be connected and driven to approach the cover ring 16 by a lifting unit 18, for example, the lifting unit 18 can be a linear actuator. The alignment recess 161 of the cover ring 16 aligns with the alignment protrusion 135 of the carrier disk 13, and guides the cover ring 16 to a specific position on the carrier disk 13, so as to perform thin film deposition on the substrate on the carrier disk 13.

[0052] As shown in Figure 4 , Figure 5 and Figure 9As shown, the first alignment recess 1513 of the first shielding plate 151 and the second alignment recess 1533 of the second shielding plate 153 can correspond to the alignment protrusion 135 of the carrier disk 13. The lifting unit 18 can drive the carrier disk 13 to approach the first shielding plate 151 and the second shielding plate 153 operating in the shielding state, wherein the first alignment recess 1513 of the first shielding plate 151 and the second alignment recess 1533 of the second shielding plate 153 can align the alignment protrusion 135 of the carrier disk 13, and guide the first shielding plate 151 and the second shielding plate 153 to a specific position of the carrier disk 13 to shield the carrier surface 131 of the carrier disk 13.

[0053] In addition, a protrusion 1512 and a recess 1532 can be respectively arranged on the side surfaces of the first shielding plate 151 and the second shielding plate 153. When the first shielding plate 151 and the second shielding plate 153 operate in the shielding state, the protrusion 1512 of the first shielding plate 151 can enter the recess 1532 of the second shielding plate 153, so that the protrusion 1512 and the recess 1532 overlap each other, which can improve the shielding effect of the first shielding plate 151 and the second shielding plate 153 on the additional circuit board 13.

[0054] As shown, Figure 10 The lifting unit 18 can continue to drive the carrier disk 13 and the first shielding plate 151 and the second shielding plate 153 carried thereby to displace toward the covering ring 16, so that the first shielding plate 151 and the second shielding plate 153 are away from the first arc-shaped support frame 145 and the second arc-shaped support frame 147. Then the first shielding plate 151 and the second shielding plate 153 on the carrier disk 13 will contact the covering ring 16 on the stopper 111.

[0055] Specifically, the opening 142 formed on the inner side of the first arc-shaped support frame 145 and the second arc-shaped support frame 147 can have an area larger than the cross-sectional area of the carrier disk 13 and / or the area of the carrier surface 131, so that the carrier disk 13 can pass through the opening 142 and drive the first shielding plate 151 and the second shielding plate 153 to be away from the first arc-shaped support frame 145 and the second arc-shaped support frame 147, for example, the opening 142 and the cross section of the carrier disk 13 can be circular. During the displacement of the carrier disk 13 driving the first shielding plate 151 and the second shielding plate 153 toward the covering ring 16, the first carrier arm 141 and the second carrier arm 143 do not need to be swung in the opposite direction by the driving device 17, which can improve the convenience in use.

[0056] As shown, Figure 2 , Figure 5 and Figure 10As shown, the bottom of the cover ring 16 can be provided with at least one protrusion 163, for example, the protrusion 163 can be annular, and a positioning recess 161 is formed on the bottom of the cover ring 16 via the protrusion 163. The upper surfaces of the first shielding plate 151 and the second shielding plate 153 can be respectively provided with a first arc-shaped recess 1515 and a second arc-shaped recess 1535, wherein the first arc-shaped recess 1515 and the second arc-shaped recess 1535 correspond to the protrusion 163 on the bottom surface of the cover ring 16.

[0057] Specifically, when the first shielding plate 151 and the second shielding plate 153 contact the cover ring 16, the protrusion 163 on the bottom of the cover ring 16 enters the first arc-shaped recess 1515 of the first shielding plate 151 and the second arc-shaped recess 1535 of the second shielding plate 153 to position the first shielding plate 151, the second shielding plate 153 and the cover ring 16.

[0058] In another embodiment of the present application, the bottom of the cover ring 16 can be provided with the protrusion 163, and the positioning recess 161 is concave inward from the bottom surface of the cover ring 16. At this time, the first arc-shaped recess 1515 and the second arc-shaped recess 1535 on the first shielding plate 151 and the second shielding plate 153 can be replaced by a first arc-shaped protrusion and a second arc-shaped protrusion. When the cover ring 16 connects the first shielding plate 151 and the second shielding plate 153, the first arc-shaped protrusion and the second arc-shaped protrusion on the upper surfaces of the first shielding plate 151 and the second shielding plate 153 enter the positioning recess 161 on the bottom of the cover ring 16.

[0059] The first shielding plate 151 and the second shielding plate 153 operating in the shielding state can divide a cleaning space 121 in the accommodation space 12 after contacting the cover ring 16. A burn-in process can be performed in the cleaning space 121 to clean the target material 115 and the reaction chamber 11 and / or the blocking piece 111 in the cleaning space 121, and remove oxides, nitrides or other contaminants on the surface of the target material 115 and deposition films on the surface of the reaction chamber 11 and / or the blocking piece 111.

[0060] Advantages of the present application:

[0061] The present application provides a thin film deposition machine with an opening and closing shielding device. The shielding plate operating in the shielding state can be placed on the carrier disc, and the shielding plate and the carrier disc are aligned by the alignment mechanism, so that the shielding plate can reliably shield the carrier disc.

[0062] The above description is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application. Any equivalent changes and modifications made in accordance with the shape, structure, features and spirit of the present application described in the patent application scope should be included in the patent application scope of the present application.

Claims

1. A thin film deposition machine with an openable / closable shielding device, characterized in that, include: The reaction chamber includes the accommodating space: A carrier plate is located within the accommodating space and includes a carrier surface and a plurality of alignment protrusions, wherein the carrier surface is used to carry the substrate and the alignment protrusions are located around the carrier surface. The retractable shielding device includes: The first support arm is located within the accommodating space and includes several first alignment portions; The second support arm is located within the accommodating space and includes several second alignment portions; The first shielding plate has an upper surface including a first arc-shaped groove or a first arc-shaped protrusion, and a lower surface including a plurality of third alignment portions and a plurality of first alignment recesses. The first alignment recesses are located inside the third alignment portions, wherein the third alignment portions and the first alignment portions are used to align the first shielding plate and the first bearing arm. The second shielding plate has an upper surface including a second arc-shaped groove or a second arc-shaped protrusion, and a lower surface including a plurality of fourth alignment portions and a plurality of second alignment recesses, the second alignment recesses being located inside the fourth alignment portions, wherein the fourth alignment portions and the second alignment portions are used to align the second shielding plate and the second support arm; and A driving device connects the first support arm and the second support arm, and drives the first shielding plate and the second shielding plate to swing in opposite directions through the first support arm and the second support arm, so that the first shielding plate and the second shielding plate switch between an open state and a shielding state. In the shielding state, the first shielding plate and the second shielding plate are aligned with the alignment protrusion of the support plate through the first alignment recess and the second alignment recess, respectively, and the first shielding plate and the second shielding plate shield the support surface of the support plate. The first support arm includes a first arc-shaped support frame for supporting the first shielding plate, and the first alignment portion is located on the first arc-shaped support frame. The second support arm includes a second arc-shaped support frame for supporting the second shielding plate, and the second alignment portion is located on the second arc-shaped support frame. When the first shielding plate and the second shielding plate are in the shielding state, the first arc-shaped support frame and the second arc-shaped support frame form an annular support frame. The inner side of the annular support frame formed by the first arc-shaped support frame and the second arc-shaped support frame has an opening, and the area of ​​the opening is larger than the area of ​​the bearing surface of the support plate. The support plate drives the first shielding plate and the second shielding plate away from the first arc-shaped support frame and the second arc-shaped support frame.

2. The thin film deposition machine with an openable / closing shielding device according to claim 1, characterized in that, The drive device includes a shaft sealing device and a drive motor, and the drive motor is connected to the first support arm and the second support arm through the shaft sealing device.

3. The thin film deposition machine with an openable / closing shielding device according to claim 1, characterized in that, include: A baffle, one end of which is connected to the reaction chamber, and the other end of which forms an annular protrusion; and A cover ring is placed on the annular protrusion of the stop, wherein the bottom of the cover ring includes an alignment recess, and the cover ring aligns with the alignment protrusion of the carrier plate through the alignment recess.

4. The thin film deposition machine with an openable / closing shielding device according to claim 3, characterized in that, When the cover ring connects the first shielding plate and the second shielding plate, the first arc-shaped protrusion and the second arc-shaped protrusion on the upper surface of the first shielding plate and the second shielding plate will be located in the alignment recess at the bottom of the cover ring.

5. The thin film deposition machine with an openable / closing shielding device according to claim 3, characterized in that, The bottom of the cover ring is provided with a protrusion, and the alignment recess is formed at the bottom of the cover ring through the protrusion. When the cover ring is connected to the first shielding plate and the second shielding plate, the protrusion at the bottom of the cover ring will be located in the first arc-shaped groove and the second arc-shaped groove on the upper surface of the first shielding plate and the second shielding plate.

6. The thin film deposition machine with an openable / closing shielding device according to claim 1, characterized in that, The first shielding plate includes a protrusion, and the second shielding plate includes a recess. When the first shielding plate and the second shielding plate are in the shielding state, the protrusion of the first shielding plate will enter the recess of the second shielding plate.

7. The thin film deposition machine with an openable / closing shielding device according to claim 1, characterized in that, The device includes two sensing areas connected to the reaction chamber. The thickness of the two sensing areas is smaller than that of the reaction chamber. Each of the two sensing areas is provided with a position sensing unit to sense the first shielding plate and the second shielding plate entering the sensing area.

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