A dip-glue suction nozzle and a dip-glue method

Abstract

The application discloses a glue-dipping suction nozzle and a glue-dipping method, and belongs to the technical field of glue-dipping of optical devices, which comprises a main body, one end of the main body is provided with a glue-dipping column, a plurality of glue-dipping heads are arranged in the glue-dipping column, one end of the plurality of glue-dipping heads extends into the glue-dipping column and is connected with the bottom of the glue-dipping column through a spring, the other end of the plurality of glue-dipping heads extends out of the glue-dipping column, and the length of the part of the glue-dipping heads extending out of the glue-dipping column is different from that of the other part of the glue-dipping heads. The glue-dipping suction nozzle is characterized in that a plurality of glue-dipping heads extending out of the glue-dipping column at different lengths in the vertical direction are arranged, different glue-dipping heads are brought into contact with the glue-dipping surface by pressing with different pressures when glue-dipping, and point-shaped glue and arrayed glue points are formed on the glue-dipping surface, respectively; when a region-shaped glue surface needs to be formed on the glue-dipping surface, the contact amount of the glue-dipping heads with glue is increased, the amount of glue carried by the glue-dipping heads is increased, and a region-shaped glue surface is formed on the glue-dipping surface.

Description

Technical Field

[0001] This invention belongs to the field of optical device dispensing technology, specifically relating to a dispensing nozzle and dispensing method. Background Technology

[0002] With the rapid advancement of intelligent technology and the ever-changing progress of science and technology, the application of dispensing curing bonding as a connection method is becoming increasingly widespread in various industries, and dispensing technology has also made great strides.

[0003] Currently, the most widely used dispensing method is using a dispensing machine. This machine uses air pressure to force the adhesive from a syringe through a needle, dispensing it onto the desired bonding location. However, for adhesives with high viscosity, air pressure is insufficient to expel the adhesive. A conventional method involves installing a screw valve on the dispensing machine, using a rotating screw to expel the adhesive. While this method can expel high-viscosity adhesives, the increased extrusion pressure makes it more difficult to control the dispensing radius, resulting in an inability to consistently dispense adhesives with smaller diameters.

[0004] To address the challenge of consistently dispensing small-diameter adhesives using dispensing machines, a method using a dipping head to apply adhesive before dispensing can be employed. This dipping head does not require a pinhole structure for adhesive delivery; its tip can be designed with a small conical shape, enabling it to dispense adhesive as small as 50μm in diameter. However, when dispensing over a specific area using dipping, this method struggles to simultaneously handle both small-diameter dispensing and targeted area dispensing. Summary of the Invention

[0005] In view of one or more of the above-mentioned defects or improvement needs of the prior art, the present invention provides a glue-dipping nozzle and glue-dipping method to solve the problem that the existing glue-dipping device cannot separately realize the functions of small-diameter glue dispensing and regional glue dispensing.

[0006] To achieve the above objectives, the present invention provides an adhesive applicator nozzle, comprising:

[0007] The main body has an adhesive-dipping column at one end, and the adhesive-dipping column has multiple adhesive-dipping heads inside.

[0008] Multiple adhesive applicators are arranged in an array inside the adhesive applicator column. One end of each adhesive applicator extends into the adhesive applicator column and is connected to the bottom of the adhesive applicator column by a spring. The other end of each adhesive applicator extends out of the adhesive applicator column, and at least some of the adhesive applicators extend out of the adhesive applicator column by different lengths than other parts of the adhesive applicators.

[0009] As a further improvement of the present invention, the plurality of adhesive dipping heads are arranged in an array, and the plurality of adhesive dipping heads include at least one first adhesive dipping head and a plurality of second adhesive dipping heads, wherein the length of the first adhesive dipping head extending out of the adhesive dipping column is greater than the length of the plurality of second adhesive dipping heads extending out of the adhesive dipping column.

[0010] Furthermore, the first adhesive applicator is located at the center of the array, and multiple second adhesive applicators are arranged circumferentially around the first adhesive applicator.

[0011] As a further improvement of the present invention, the plurality of adhesive dipping heads further includes a plurality of third adhesive dipping heads, which are circumferentially arranged around the plurality of second adhesive dipping heads, and the length of the plurality of second adhesive dipping heads extending out of the adhesive dipping column is greater than the length of the plurality of third adhesive dipping heads extending out of the adhesive dipping column.

[0012] As a further improvement of the present invention, the plurality of adhesive dispensing heads are arranged in a ring array or a square array.

[0013] As a further improvement of the present invention, the length of the first adhesive applicator extending out of the adhesive applicator column is 150-300 μm; the length of the second adhesive applicator extending out of the adhesive applicator column is 100-200 μm.

[0014] As a further improvement of the present invention, the length of the third adhesive-dipping head extending out of the adhesive-dipping column is 50-100 μm.

[0015] As a further improvement of the present invention, the distance between the first adhesive applicator and the second adhesive applicator along the first direction is greater than the distance between the second adhesive applicator and the third adhesive applicator along the first direction.

[0016] As a further improvement of the present invention, the length of the third adhesive-dipping head extending out of the adhesive-dipping column is 30-50 μm.

[0017] This application also includes a method for applying adhesive, which involves applying adhesive through the adhesive nozzle, comprising the following steps:

[0018] Apply pressure to the main body to press the glue-dipped head into the glue-dipped tray containing glue;

[0019] Apply a first pressure, a second pressure, or a third pressure to the main body, so that the first glue-dipping head, the second glue-dipping head, or the third glue-dipping head is pressed into the glue-dipping tray respectively;

[0020] Move the adhesive nozzle above the dispensing area and press down on the main body with the first pressure, the second pressure, or the third pressure to form dotted adhesive, arrayed adhesive, or sheet-like adhesive on the dispensing area.

[0021] As a further improvement of the present invention, the thickness of the adhesive in the adhesive tray is 50-100 μm.

[0022] As a further improvement of the present invention, when the adhesive nozzle dispenses adhesive, each of the adhesive dispensing heads is subjected to a pressure of 30 to 60g by the main body.

[0023] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0024] In summary, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art include:

[0025] (1) The adhesive nozzle of the present invention has multiple adhesive heads with different lengths of adhesive column extending vertically, so that the distance between each adhesive head and the adhesive surface is different. When it is necessary to form a dot adhesive, an array adhesive, or a regional adhesive surface, the adhesive head is adjusted to contact the adhesive surface to form dot adhesive and array adhesive dots on the adhesive surface respectively. When it is necessary to form a regional adhesive surface on the adhesive surface, the amount of adhesive carried on the adhesive head is increased by increasing the amount of contact between the adhesive head and the adhesive to form a regional adhesive surface on the adhesive surface.

[0026] (2) The adhesive nozzle of the present invention is provided with a first adhesive head, a second adhesive head and a third adhesive head arranged in an array, and the length of each adhesive head extending out of the adhesive column is distributed sequentially. When the adhesive nozzle of the present application is used for adhesive application, different pressures are applied so that different adhesive heads come into contact with the adhesive surface to form dot adhesive, array adhesive and area adhesive surface respectively on the adhesive surface.

[0027] (3) The adhesive nozzle of the present invention controls the length of each adhesive tip extending from the adhesive column so that when the first adhesive tip, the second adhesive tip and the third adhesive tip come into contact with the adhesive, the amount of adhesive in contact with the bottom and the surrounding area of ​​each adhesive tip is different. The first adhesive tip and the second adhesive tip have less contact with the adhesive, and can form dot-shaped adhesive and array-shaped adhesive on the dispensing surface, respectively. When all three adhesive tips are used to apply adhesive, the amount of adhesive adhering to the first adhesive tip and the second adhesive tip is more. When the three adhesive tips apply adhesive, the dispensing surface of the first adhesive tip and the second adhesive tip is larger in all directions, connecting the adhesive dots to form a regional adhesive surface on the dispensing surface.

[0028] (4) The adhesive nozzle of the present invention controls the gap between the first adhesive head, the second adhesive head and the third adhesive head. By appropriately reducing the gap between the second adhesive head and the third adhesive head, the first adhesive head and the second adhesive head can form an array of adhesive dots on the adhesive surface when they come into contact with the adhesive surface. When the third adhesive head comes into contact with the adhesive surface at the same time, the first adhesive head and the second adhesive head increase the contact area with the adhesive. When they come into contact with the adhesive surface, the amount of adhesive carried by the first adhesive head and the second adhesive head will diffuse outwards and merge with the adhesive dots of the third adhesive head to form a regional adhesive surface on the adhesive surface.

[0029] (5) The glue application method of the present invention controls the length of the first glue application head, the second glue application head and the third glue application head extending out of the glue application column, and controls the thickness of the glue in the glue application tray, so that when the third glue application head adheres to the glue, the bottom surface of the glue application column is correspondingly adhered to the glue. When the glue is applied, the bottom surface of the glue application column contacts the glue application surface to form a regional glue surface on the glue application surface. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the adhesive-dipped nozzle in an embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of the bottom structure of the adhesive suction nozzle in an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the adhesive nozzle forming dotted adhesive in an embodiment of the present invention;

[0033] Figure 4 This is a schematic diagram of the array of adhesive dots formed by the adhesive nozzle in an embodiment of the present invention;

[0034] Figure 5 This is a schematic diagram of the adhesive surface in the area formed by the adhesive nozzle in an embodiment of the present invention.

[0035] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically:

[0036] 1. Main body; 2. Adhesive dipping column; 3. First adhesive dipping head; 4. Second adhesive dipping head; 5. Third adhesive dipping head; 6. Adhesive dipping tray; 7. Adhesive application surface. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0038] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] Example:

[0043] Please see Figures 1-5 The adhesive nozzle in a preferred embodiment of the present invention includes a main body 1, one end of which is provided with an adhesive column 2. The adhesive column 2 is provided with a plurality of adhesive heads, which are distributed inside the adhesive column 2. One end of each adhesive head extends into the adhesive column 2 and is connected to the bottom of the adhesive column 2 by a spring; the other end extends out of the adhesive column 2, and the lengths of the portion of the adhesive head extending out of the adhesive column 2 are different from those of the portion of the adhesive head extending out of the adhesive column 2.

[0044] The adhesive nozzle in this application has multiple adhesive heads with different lengths extending vertically from the adhesive column 2, so that the distance between each adhesive head and the adhesive surface 7 is different. During dispensing, different pressures are applied to achieve contact between different adhesive heads and the adhesive surface 7, so as to form dot-shaped adhesive and array adhesive dots on the adhesive surface 7 respectively. When it is necessary to form a regional adhesive surface on the adhesive surface 7, the amount of adhesive carried by the adhesive head is increased by increasing the contact amount between the adhesive head and the adhesive, so as to form a regional adhesive surface on the adhesive surface 7.

[0045] Optionally, the main body 1 in this application is a glue-dip head connecting shaft, which is used to connect the main body 1 to the glue-dispensing device to realize the glue-dip and glue-dispensing processes. Optionally, the main body 1 can also be the glue-dispensing device itself.

[0046] More preferably, in this application, a guide plate extends outward from the glue-dipping column 2 of the main body 1, and the guide plate encloses a frame-shaped space, within which multiple glue-dipping heads are disposed. The guide plate guides the glue-dipping heads and ensures that each glue-dipping head can extend and retract vertically, thus ensuring the accuracy of glue dispensing.

[0047] Furthermore, the plurality of adhesive dipping heads in this application include at least one first adhesive dipping head 3 and a plurality of second adhesive dipping heads 4, wherein the length of the first adhesive dipping head 3 extending out of the adhesive dipping column 2 is greater than the length of the plurality of second adhesive dipping heads 4 extending out of the adhesive dipping column 2, and the first adhesive dipping head 3 is located at the center of the array, and the plurality of second adhesive dipping heads 4 are arranged circumferentially around the first adhesive dipping head 3. When using the adhesive nozzle of this application for dispensing, in order to achieve separate dispensing of single dots and dispensing of arrays, the first adhesive head 3 protrudes from the plane formed by the end face of the second adhesive head 4, so that when the first adhesive head 3 contacts the dispensing surface 7 to form an adhesive dot, the second adhesive head 4 does not contact the dispensing surface 7 to form an adhesive dot alone; when it is necessary to form an array of adhesive dots, the second adhesive head 4 is arranged around the first adhesive head 3, and the first adhesive head 3 and the second adhesive head 4 together form an array arrangement structure. By increasing the downward pressure on the main body 1, the spring at the end of the first adhesive head 3 is compressed, and the lower end faces of the first adhesive head 3 and the second adhesive head 4 are located on the same plane to form an array of adhesive dots on the dispensing surface 7.

[0048] Furthermore, as a preferred embodiment of the present invention, the plurality of adhesive dipping heads in this application also include a plurality of third adhesive dipping heads 5. The plurality of third adhesive dipping heads 5 are also circumferentially arranged around the plurality of second adhesive dipping heads 4, and the length of the plurality of second adhesive dipping heads 4 extending out of the adhesive dipping column 2 is greater than the length of the plurality of third adhesive dipping heads 5 extending out of the adhesive dipping column 2. When the plurality of adhesive dipping heads are used to form a regional adhesive surface, since the lengths of the first adhesive dipping head 3, the second adhesive dipping head 4 and the third adhesive dipping head 5 are not the same, when the third adhesive dipping head 5 comes into contact with the adhesive, it means that a certain amount of adhesive is carried on the sidewalls of the first adhesive dipping head 3 and the second adhesive dipping head 4. When the first adhesive dipping head 3, the second adhesive dipping head 4 and the third adhesive dipping head 5 all come into contact with the adhesive dot surface 7, the adhesive on the first adhesive dipping head 3 and the second adhesive dipping head 4 tends to diffuse outwards, thereby connecting the adhesive dots to form a whole, so as to form a complete regional adhesive surface.

[0049] Furthermore, the multiple adhesive dispensing heads in this application are arranged in a ring array or a square array. Depending on the dispensing requirements, the multiple adhesive dispensing heads in this application can be arranged in various ways. As one optional embodiment, the first adhesive dispensing head 3 in this application is one, located at the center of the array; the second adhesive dispensing heads 4 are eight, distributed around the first adhesive dispensing head 3, forming a 3*3 array; and the third adhesive dispensing heads 5 are sixteen, distributed around the second adhesive dispensing heads 4, forming a 5*5 square array.

[0050] Furthermore, as a preferred embodiment of the present invention, the first adhesive dispensing head 3 extends out of the adhesive dispensing column 2 by 150–300 μm, and the second adhesive dispensing head 4 extends out of the adhesive dispensing column 2 by 100–200 μm. The difference in the lengths of the first adhesive dispensing head 3 and the second adhesive dispensing head 4 is to facilitate the formation of dotted adhesive and arrayed adhesive dots respectively during dispensing, and to prevent the second adhesive dispensing head 4 from becoming contaminated with adhesive during the formation of dotted adhesive, thus avoiding contamination of the dispensing surface 7.

[0051] Furthermore, the third adhesive applicator 5 extends 50–100 μm beyond the adhesive applicator column 2. The third adhesive applicator 5 is designed to form a regional adhesive surface. Its protrusion is only a limited distance from the opening of the adhesive applicator column 2. When the third adhesive applicator 5 dispenses adhesive, it indicates that the first adhesive applicator 3 and the second adhesive applicator 4 have already adhered to a significant amount of adhesive, facilitating the three to work together to form a regional adhesive surface.

[0052] Furthermore, as an optional embodiment of the present invention, the distance between the first adhesive head 3 and the second adhesive head 4 along the first direction is greater than the distance between the second adhesive head 4 and the third adhesive head 5 along the first direction. Since the first adhesive head 3 and the second adhesive head 4 are used to form dot adhesive and array adhesive dots respectively, the distance between each adhesive head is relatively far to avoid glue overflow and connection between each adhesive head, thus ensuring the formation of array adhesive; the distance between the second adhesive head 4 and the third adhesive head 5 is relatively close to ensure that when the first adhesive head 3 and the second adhesive head 4 carry more glue, the glue can overflow to the surroundings to connect each adhesive dot into a whole to form a regional adhesive surface.

[0053] It is worth noting that the first direction here refers to any direction of the plane where the glue-adhesive column 2 is located. It can be the length and width of the rectangular plane or the diagonal direction of the rectangular plane.

[0054] Further optionally, since the length of the third adhesive applicator 5 extending from the adhesive column 2 in this application is only 50-100 μm, when the adhesive dots cannot be connected as a whole, when the third adhesive applicator 5 is pressed down to contact the adhesive, the third adhesive applicator 5 retracts under the action of the spring, so that the adhesive column 2 also adheres to the plane. When the adhesive is dispensed using the adhesive nozzle, by pressing down the main body 1, the bottom surface of the adhesive column 2 also contacts the dispensing surface 7, thereby forming a regional adhesive surface on the dispensing surface 7.

[0055] Optionally, in this application, the length of the third adhesive applicator 5 extending beyond the adhesive column 2 is 30–50 μm. By appropriately reducing the length of the third adhesive applicator 5 extending beyond the adhesive column 2, when the third adhesive applicator 5 is applying adhesive, a large amount of adhesive has already adhered to the first adhesive applicator 3 and the second adhesive applicator 4. The adhesive adhering to the first adhesive applicator 3 and the second adhesive applicator 4 connects the adhesive dots into a whole to form a regional adhesive surface.

[0056] Furthermore, the first adhesive applicator 3, the second adhesive applicator 4, and the third adhesive applicator 5 in this application are square columnar structures with a base length and width between 50 and 100 μm.

[0057] Based on the above-mentioned adhesive nozzle, this application also includes an adhesive application method, which includes the following steps:

[0058] Apply pressure to the main body 1 to press the glue-dipping head into the glue-dipping tray 6 containing glue;

[0059] Apply a first pressure, a second pressure, or a third pressure to the main body 1, so that the first glue-dipping head 3, the second glue-dipping head 4, or the third glue-dipping head 5 are pressed into the glue-dipping head respectively; it is worth noting that when the second glue-dipping head 4 is sticking to glue, it means that the first glue-dipping head 3 must be immersed in glue, and when the third glue-dipping head 5 is sticking to glue, it means that the first glue-dipping head 3 and the second glue-dipping head 4 must be immersed in glue.

[0060] The adhesive nozzle is moved above the dispensing area, and the main body 1 is pressed down with a first pressure, a second pressure, or a third pressure to form dot-shaped adhesive, array-distributed adhesive, or sheet-like adhesive on the dispensing area, respectively. It is worth noting that the dispensing pressure of the adhesive nozzle corresponds to its dispensing pressure in the dispensing tray 6. When the first pressure is applied, only the first dispensing head 3 adheres to the adhesive in the dispensing tray 6; when the second pressure is applied, both the first and second dispensing heads 3 and 4 adhere to the adhesive; and when the third pressure is applied, adhesive adheres to the first, second, and third dispensing heads 3 and 5, respectively, to form dot-shaped adhesive, array-distributed adhesive, or sheet-like adhesive.

[0061] More preferably, when applying adhesive in the adhesive tray 6, the thickness of the adhesive in the adhesive tray 6 is 50-100 μm. The relatively low thickness of the adhesive in the adhesive tray 6 is to ensure that the amount of adhesive adhering to the first adhesive head 3 and the second adhesive head 4 is controllable when forming dotted adhesive and array-distributed adhesive, so as to ensure that the size of the adhesive dots is uniform. At the same time, since the length of the third adhesive column 2 extending from the adhesive column 2 in this application is 50-100 μm, when the third adhesive column 2 is immersed in the adhesive, it means that the plane of the adhesive column 2 is also adhered with adhesive. Then, when applying adhesive, by pressing the bottom surface of the adhesive column 2 onto the adhesive surface 7, a sheet-like area of ​​adhesive is formed on the adhesive surface 7.

[0062] More preferably, in this application, the pressure applied to each adhesive applicator by the body 1 is 30-60g. It is worth noting that the pressure received by each adhesive applicator here is the pressure distributed across each applicator. When different numbers of applicators come into contact with the dispensing surface 7, the pressure applied to the body 1 represents the sum of the pressures applied to each applicator. Therefore, when forming dotted adhesive, arrayed adhesive, or sheet-like adhesive, the first pressure, second pressure, and third pressure represent the sum of the pressures received by different numbers of applicators, respectively.

[0063] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A glue-dipped nozzle, characterized in that, include: The main body has a countersunk hole at one end, a glue-dipping column inside the countersunk hole, and multiple glue-dipping heads inside the glue-dipping column; Multiple adhesive applicators are arranged in an array inside the adhesive applicator column. One end of each adhesive applicator extends into the adhesive applicator column and is connected to the bottom of the adhesive applicator column by a spring. The other end of each adhesive applicator extends out of the adhesive applicator column, and at least some of the adhesive applicators extend out of the adhesive applicator column by different lengths than other parts of the adhesive applicators. The plurality of adhesive dipping heads includes at least one first adhesive dipping head and a plurality of second adhesive dipping heads, wherein the first adhesive dipping head extends beyond the adhesive dipping column by a greater length than the plurality of second adhesive dipping heads extend beyond the adhesive dipping column; Furthermore, the first adhesive applicator is located at the center of the array, and multiple second adhesive applicators are arranged circumferentially around the first adhesive applicator. The plurality of adhesive dipping heads also include a plurality of third adhesive dipping heads, which are circumferentially arranged around the plurality of second adhesive dipping heads, and the length of the plurality of second adhesive dipping heads extending out of the adhesive dipping column is greater than the length of the plurality of third adhesive dipping heads extending out of the adhesive dipping column.

2. The adhesive-dipped nozzle according to claim 1, characterized in that, The multiple adhesive dispensing heads are arranged in a ring array or a square array.

3. The adhesive-dipped nozzle according to claim 1 or 2, characterized in that, The first adhesive applicator extends 150-300 μm beyond the adhesive applicator column; the second adhesive applicator extends 100-200 μm beyond the adhesive applicator column.

4. The adhesive-dipped nozzle according to claim 3, characterized in that, The length of the third adhesive-dipping head extending out of the adhesive-dipping column is 50~100μm.

5. The adhesive-dipped nozzle according to claim 4, characterized in that, The distance between the first adhesive applicator and the second adhesive applicator along the first direction is greater than the distance between the second adhesive applicator and the third adhesive applicator along the first direction.

6. The adhesive-dipped nozzle according to claim 3, characterized in that, The third adhesive applicator extends 30-50 μm beyond the adhesive applicator column.

7. A method for applying adhesive, wherein adhesive is applied using an adhesive-applying nozzle as described in any one of claims 1 to 6, characterized in that, Includes the following steps: Apply pressure to the main body to press the glue-dipped head into the glue-dipped tray containing glue; Apply a first pressure, a second pressure, or a third pressure to the main body, so that the first glue-dipping head, the second glue-dipping head, or the third glue-dipping head is pressed into the glue-dipping tray respectively; Move the adhesive nozzle above the dispensing area and press down on the main body with the first pressure, the second pressure, or the third pressure to form dotted adhesive, arrayed adhesive, or sheet-like adhesive on the dispensing area.

8. The adhesive application method according to claim 7, characterized in that, The thickness of the adhesive in the adhesive dipping tray is 50~100μm.

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