An optical device assembly apparatus and assembly method

Abstract

The application discloses an optical device assembling device and an assembling method, and belongs to the technical field of optical module manufacturing. The device comprises a base, a first fixing module and a second fixing module are arranged on the base, a first placing groove is arranged on the first fixing module, a second placing groove is arranged on the second fixing module, and the first placing groove and the second placing groove at least partially coincide along a first direction. A first displacement mechanism is further arranged on the first fixing module and / or the second fixing module, and is used for driving the first fixing module and / or the second fixing module to move along the first direction. The optical device assembling device can realize the assembly of a substrate and a PCB board in the case that the substrate is attached to an optoelectronic module, avoids the problem that the substrate is continuously stressed by the optoelectronic module in a conventional assembly process, greatly improves the assembly stability of the optical device, improves the overall product assembly yield of the optical device, and improves the service life of the product.

Description

Technical Field

[0001] This invention belongs to the field of optical module manufacturing technology, and specifically relates to an optical device assembly device. Background Technology

[0002] An optical module is an optoelectronic device that performs photoelectric and electro-optical conversion. The receiver of an optical module receives optical signals and converts them into electrical signals, while the transmitter converts the electrical signals back into optical signals and transmits them again.

[0003] Optical modules typically consist of a housing, an internal PCB board, a substrate mounted on the PCB, various electronic and optoelectronic modules placed on the substrate, and a ferrule structure connected to the substrate. In conventional assembly processes, the substrate is first bonded to vias on the PCB board, and then the optoelectronic modules are assembled onto the substrate, fitting into the vias. During the assembly of the optoelectronic modules, the substrate and PCB board are subjected to continuous stress, which weakens the bond strength between them. This can lead to separation of the substrate and PCB board during product use, resulting in lower product yield and reduced product lifespan. Summary of the Invention

[0004] In view of one or more of the above-mentioned defects or improvement needs of the prior art, the present invention provides an optical device assembly apparatus to solve the problem that existing PCB boards and substrates are prone to detachment during assembly.

[0005] To achieve the above objectives, the present invention provides an optical device assembly apparatus, comprising:

[0006] The base has a first fixing module and a second fixing module. The first fixing module has a first placement groove, and the second fixing module has a second placement groove. The first placement groove and the second placement groove at least partially overlap along a first direction.

[0007] The first fixing module and / or the second fixing module are provided with a first displacement mechanism, which is used to drive the first fixing module and / or the second fixing module to move along a first direction.

[0008] As a further improvement of the present invention, the second placement groove includes an adsorption port located on the bottom surface of the groove opening, and the adsorption port is connected to a vacuum adsorption component.

[0009] As a further improvement of the present invention, one side of the second placement groove is provided with a dispensing port that extends through the second placement groove along the first direction.

[0010] As a further improvement of the present invention, a third placement groove is provided on one side of the second placement groove along the second direction. The third placement groove is located on the side of the second placement groove away from the first placement groove, and the third placement groove opens toward the side of the second placement groove.

[0011] As a further improvement of the present invention, the second fixing module includes a second displacement mechanism, the second placement slot is disposed on the second displacement mechanism, and the second displacement mechanism has driving members that move along a second direction and a third direction respectively.

[0012] As a further improvement of the present invention, the first fixing module includes a first clamping port and a second clamping port that are spaced apart along a second direction. The first clamping port and the second clamping port together constitute the first placement groove. The first clamping port and the second clamping port are close to or away from each other along a third direction.

[0013] As a further improvement of the present invention, a sliding block is provided on one side of the second clamping opening along a third direction. The sliding block is connected to a sliding screw, and the sliding block and the sliding screw are matched. The sliding screw is used to drive the sliding block to move along a third direction.

[0014] As a further improvement of the present invention, the base is provided with support rods around its perimeter along a first direction, and a plurality of the support rods are located on the same side of the base as the first fixing module or the second fixing module, and the length of the plurality of support rods is not less than the distance between the first placement slot surface and the base.

[0015] As a further improvement of the present invention, the base is also provided with a clearance groove, which at least partially overlaps with the dispensing port along the first direction.

[0016] This application also includes an optical device assembly method, which is implemented by the above-mentioned optical device assembly apparatus, and includes the following steps:

[0017] S1. Obtain the PCB board and the substrate assembled with the optoelectronic module;

[0018] S2. Fix the PCB board in the first placement slot; create negative pressure at the suction port of the second placement slot;

[0019] S3. Pass the substrate through the through hole on the PCB board, so that the substrate and the ferrule connected to the substrate are located on both sides of the PCB board along the first direction.

[0020] S4. Adjust the relative position of the PCB board and the substrate so that the substrate is attached to the preset position on the PCB board.

[0021] S5. The assembly device that fixes the PCB board and the substrate is flipped over as a whole, and adhesive is applied to the circumference of the substrate and cured.

[0022] As a further improvement of the present invention, step S4 specifically includes:

[0023] S401, The first displacement mechanism adjusts the position of the PCB board along the first direction;

[0024] S402, The second displacement mechanism adjusts the position of the substrate so that the substrate and the preset position on the PCB are aligned along the first direction;

[0025] S403, The first displacement mechanism adjusts the position of the PCB board along the first direction so that the PCB board is in close contact with the substrate.

[0026] As a further improvement of the present invention, step S3 specifically includes:

[0027] Place the substrate on top of the PCB board, clamp the substrate at an angle to the horizontal direction, and pass the substrate through the through-hole of the PCB board.

[0028] As a further improvement of the present invention, step S3 also includes fixing the substrate position:

[0029] One side of the substrate is overlapped with the side of the second placement groove, and the first displacement mechanism controls the PCB board to move away from the base, so that the substrate falls on the second placement groove.

[0030] The vacuum adsorption assembly is evacuated, and the substrate is attached to the second placement groove.

[0031] Place the insert in the third slot and secure it with adhesive.

[0032] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0033] In summary, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art include:

[0034] (1) The optical device assembly apparatus of the present invention uses a first fixing module and a second fixing module to fix a PCB board and a substrate respectively using a first placement slot and a second placement slot. A first displacement mechanism moves the PCB board and / or substrate to achieve relative contact between the PCB board and the substrate. Then, adhesive is used to fix the PCB board and the substrate, and finally, the adhesive is cured to achieve the assembly of the optical device. The optical device assembly apparatus of this application can complete the bonding assembly between the PCB board and the substrate after the optoelectronic modules on the substrate are mounted. Simultaneously, by inverting the entire optical device assembly apparatus, the substrate can be fixed on the back of the PCB board to complete the overall assembly of the optical device. This avoids the problem of continuous stress on the substrate by the optoelectronic modules during conventional assembly, which could lead to separation between the substrate and the PCB board. This greatly improves the assembly stability of the optical device, increases the overall product assembly yield of the optical device, and extends the product's service life.

[0035] (2) The optical device assembly device of the present invention uses an adsorption port at the bottom of the second placement groove to vacuum the substrate in the second placement groove by using a vacuum adsorption component; at the same time, the first clamping port and the second clamping port are used to fix the PCB board, so that the PCB board and the substrate can be inverted as a whole in the subsequent process, so as to apply glue to the back of the PCB board and realize the bonding and fixing of the PCB board and the substrate.

[0036] (3) The optical device assembly apparatus of the present invention provides that by opening a dispensing port through the first direction on one side of the second placement groove, the optical device assembly apparatus can be inverted as a whole and the adhesive can be directly dispensed on the back side of the second placement groove. The adhesive leaks through the dispensing port to the outer periphery of the substrate to achieve bonding and fixing of the substrate and the PCB board.

[0037] (4) The optical device assembly device of the present invention provides support rods around the base and limits the length of the support rods so that when the optical device assembly device is inverted, the support rods support the device to stand up, and the PCB board and substrate located on the first placement slot and the second placement slot are in a floating state, so as to avoid the PCB board and substrate from contacting the table surface and causing wear of the optical device.

[0038] (5) The optical device assembly method of the present invention, when the substrate, the ferrule and the optoelectronic module on its surface are assembled, can be achieved by inserting the substrate through the through hole of the PCB board, so that the ferrule and the substrate are respectively located on both sides of the PCB board. Then, by moving the substrate, the substrate is aligned with the preset position on the PCB board. With the PCB board and the substrate fixed as a whole, the PCB board and the substrate are flipped and glue is applied in the circumferential direction of the substrate to achieve the overall fixation of the optical device. Attached Figure Description

[0039] Figure 1This is a schematic diagram of the overall structure of the optical device assembly device in an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of the inverted structure of the optical device assembly device in an embodiment of the present invention;

[0041] Figure 3 This is a schematic diagram of the overall structure of the first fixing module in an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of the overall structure of the second fixing module in an embodiment of the present invention;

[0043] Figure 5 This is a schematic diagram of the overall structure of the PCB board in an embodiment of the present invention;

[0044] Figure 6 This is a schematic diagram of the overall structure of the substrate in an embodiment of the present invention;

[0045] Figure 7 This is a schematic flowchart of the optical device assembly method in an embodiment of the present invention.

[0046] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically:

[0047] 1. Base; 2. First fixing module; 3. Second fixing module; 4. First displacement mechanism; 5. Second displacement mechanism; 6. Second placement slot; 7. Adsorption port; 8. Vacuum adsorption assembly; 9. Dispensing port; 10. Third placement slot; 11. Positioning pin; 12. First clamping port; 13. Second clamping port; 14. Sliding block; 15. Sliding screw; 16. Support rod; 17. Alternating groove; 18. PCB board; 19. Substrate; 20. Insert; 21. Through hole. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0049] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0051] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0052] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0053] Example:

[0054] Please see Figures 1-7In a preferred embodiment of the present invention, the optical device assembly device includes a base 1, on which a first fixing module 2 and a second fixing module 3 are respectively disposed. The first fixing module 2 is provided with a first placement groove, and the second fixing module 3 is provided with a second placement groove 6. The first placement groove and the second placement groove 6 at least partially overlap along a first direction. At the same time, the first fixing module 2 and / or the second fixing module 3 are provided with a first displacement mechanism 4, which is used to drive the first fixing module 2 and / or the second fixing module 3 to move along the first direction.

[0055] Specifically, the first fixing module 2 and the second fixing module 3 in this application are used to fix the PCB board 18 and the substrate 19, respectively. By having the first placement groove and the second placement groove 6 partially overlap along the first direction, the substrate 19 can pass through the through hole 21 on the PCB board 18 even when the ferrule 20 and the optoelectronic module are bonded and fixed. This allows the substrate 19 and the ferrule 20 to be located on both sides of the PCB board 18 along the first direction. The corresponding positions of the substrate 19 and the PCB board 18 are adjusted by the first displacement mechanism 4 so that the substrate 19 passes through the through hole 21 of the PCB board 18, the substrate 19 and the PCB board 18 are aligned, and the substrate 19 and the PCB board 18 are bonded, thus completing the overall assembly of the optical device. The optical device assembly apparatus of this application can bond the substrate 19 and the optoelectronic module to the PCB board 18 after the substrate 19 is assembled. This avoids the problem of bonding the PCB board 18 to the substrate 19 and then bonding the optoelectronic module in conventional bonding methods. It also avoids the problem of the substrate 19 being continuously stressed during the bonding process of the optoelectronic module, which would cause the bonding strength between the substrate 19 and the PCB board 18 to decrease and separate. This improves the overall assembly strength of the optical device and ensures the assembly yield of the optical device.

[0056] Preferably, in this application, the first direction is the vertical direction, the second direction is the length direction in which the PCB board 18 is placed, and the third direction is the width direction in which the PCB board 18 is placed. Optionally, the first direction is the Z-axis direction in the spatial coordinate system, the second direction is the X-axis direction, and the third direction is the Y-axis direction.

[0057] Optionally, the optical device in this application refers to the combination of PCB board 18, substrate 19, ferrule 20 and optoelectronic module on the surface of substrate 19 in the optical module. The optoelectronic module on the surface of substrate 19 in this application includes one or more of lens, wavelength division multiplexer, optoelectronic chip and collimating lens.

[0058] As a further improvement of the present invention, the second placement groove 6 in this application includes an adsorption port 7 located on the bottom surface of the groove opening, and the adsorption port 7 is connected to a vacuum adsorption component 8. Since the PCB board 18 and the substrate 19 are involved in the overall flipping and inversion, this application uses the vacuum adsorption component 8 to adsorb and fix the substrate 19 as a whole, so as to avoid relative displacement between the substrate 19 and the PCB board 18 during the flipping process or the dispensing process, and to ensure that the substrate 19 is bonded to the preset position of the PCB board 18.

[0059] Furthermore, one side of the second placement groove 6 in this application is also provided with a dispensing port 9 that extends through the second placement groove 6 along the first direction. Since the substrate 19 is placed on the second placement groove 6, the back side of the substrate 19 is obstructed, and the adhesive cannot be applied around the substrate 19. Based on this, this application provides a corresponding dispensing port 9 on the second placement groove 6, so that when the optical device assembly device is flipped over, adhesive can be applied to the back side of the substrate 19 through the dispensing port 9 to achieve bonding between the substrate 19 and the PCB board 18.

[0060] Preferably, the dispensing port 9 is located beside the adsorption port 7. The opening of the dispensing port 9 itself does not obstruct the placement of the adsorption port 7 and the vacuum adsorption assembly 8.

[0061] Furthermore, as a preferred embodiment of the present invention, a third placement groove 10 is further provided on one side of the second placement groove 6 along the second direction. The third placement groove 10 is located on the side of the second placement groove 6 away from the first placement groove, and the third placement groove 10 opens towards the side of the second placement groove 6. When the substrate 19 and the PCB board 18 are relatively fixed, since the ferrule 20 is connected to the substrate 19, in order to avoid breaking the optical fiber between the ferrule 20 and the substrate 19 during the bonding process, the present application provides a corresponding third placement groove 10. The third placement groove 10 is used to place and fix the ferrule 20, so that the position of the ferrule 20 and the substrate 19 is relatively fixed, avoiding problems such as optical fiber breakage caused by the ferrule 20 shaking randomly.

[0062] Preferably, the insert 20 in this application is an LC insert, and the insert 20 is arranged in pairs. Correspondingly, the third placement slot 10 is also arranged in pairs. The third placement slot 10 has a structure with an arc-shaped groove on its surface, which is used to match the insert 20 to realize the placement and fixation of the insert 20. Correspondingly, the third placement slot 10 in this application is only used to place the insert 20. When the entire device is inverted, the insert 20 needs to be fixed to the third placement slot 10 by means of tape or the like.

[0063] Furthermore, as a preferred embodiment of the present invention, the height difference between the slot opening surface of the third placement slot 10 and the slot opening surface of the second placement slot 6 along the first direction is 2mm~2.5mm. Since the ferrule 20 and the substrate 19 are connected as a whole, and the ferrule 20 passes through the through hole 21 on the PCB board 18, the ferrule 20 and the substrate 19 are respectively disposed on both sides of the PCB board 18 along the first direction. The ferrule 20 and the substrate 19 are connected by optical fiber. In order to avoid the optical fiber being placed at the through hole 21 of the PCB board 18, which would cause the optical fiber to detach from the substrate 19, the present application correspondingly limits the relative distance and relative height difference between the third placement slot 10 and the second placement slot 6, so that after the ferrule 20 and the substrate 19 are respectively placed on the second placement slot 6 and the third placement slot 10, the optical fiber of the two will not be excessively pulled, thus ensuring the connection stability between the ferrule 20 and the substrate 19.

[0064] Further, as a preferred embodiment of the present invention, the second fixing module 3 includes a second displacement mechanism 5, the second placement groove 6 is disposed on the second displacement mechanism 5, and the second displacement mechanism 5 has driving members that move along the second direction and the third direction respectively. The second displacement mechanism 5 is used to drive the second placement groove 6 to move in the horizontal direction. During the assembly process of the substrate 19 and the PCB board 18, the optoelectronic module on the substrate 19 needs to be disposed in the through hole 21 of the PCB board 18, and the optoelectronic module on the substrate 19 needs to meet the light transmission requirements of the optical device. Therefore, the position of the optoelectronic module on the substrate 19 is relatively fixed with the position of the PCB board 18, that is, the substrate 19 needs to be mounted to the preset position of the PCB board 18. The present application correspondingly provides a second displacement mechanism 5, which is used to adjust the position of the substrate 19 so that the pre-attached position on the substrate 19 and the PCB board 18 is vertically aligned, which facilitates the subsequent attachment of the substrate 19 to the PCB board 18.

[0065] Furthermore, as a preferred embodiment of the present invention, the first fixing module 2 in this application includes a first clamping port 12 and a second clamping port 13 spaced apart along a second direction. The first clamping port 12 and the second clamping port 13 together constitute the aforementioned first placement groove for fixing the PCB board 18. Specifically, the PCB board 18 has a square structure overall, but it is not an absolute rectangle. One end of the PCB board 18 is a gold finger, and its width along the third direction is wider than other parts. Therefore, this application correspondingly provides a first clamping port 12 and a second clamping port 13 to clamp the PCB board 18 along its length direction, thereby fixing the PCB board 18.

[0066] Furthermore, as a preferred embodiment of the present invention, the second clamping opening 13 in this application is also provided with a corresponding positioning pin 11, and the PCB board 18 is provided with corresponding mating notches on both sides along the length direction. The positioning pin 11 is used to engage with the notches on the PCB board 18 to limit and fix the PCB board 18.

[0067] Further preferably, in this application, a sliding block 14 is provided on one side of the second clamping port along the third direction. The sliding block 14 is connected to a sliding screw 15, and the sliding block 14 matches the sliding screw 15. The sliding screw 15 is used to drive the slider to move along the third direction. Specifically, the first clamping port 12 and the second clamping port 13 can only realize the placement of the PCB board 18, but cannot realize the clamping of the PCB board 18. However, this application requires the PCB board 18 and the substrate 19 to be inverted. In order to prevent the PCB board 18 from detaching from the first placement slot, this application provides a corresponding sliding block 14. The sliding screw 15 drives the sliding block 14 to move along the third direction to realize the clamping of the PCB board 18. After clamping and fixing, the sliding screw 15 is locked to realize the stable clamping of the PCB board 18.

[0068] Preferably, the sliding block 14 in this application is located on the side of the second clamping opening 13 away from the positioning pin 11.

[0069] More preferably, since the second displacement mechanism 5 is disposed below the second placement groove 6 in this application to achieve the corresponding horizontal displacement of the substrate 19, the first displacement mechanism 4 is disposed below the first placement groove in this application to achieve the vertical displacement of the PCB board 18, ultimately achieving the alignment and attachment of the substrate 19 and the PCB board 18. Optionally, the first displacement mechanism 4 in this application may also be disposed below the second placement groove 6, or the first displacement mechanism 4 may be disposed on both the first placement groove and the second placement groove 6.

[0070] More preferably, the base 1 in this application is further provided with support rods 16 around its perimeter along a first direction. Multiple support rods 16 are disposed on the same side of the base 1 as the first fixing module 2 or the second fixing module 3. All support rods 16 are positioned above the platform of the base 1, and the length of each support rod 16 is not less than the distance between the platform of the first placement slot and the platform of the base 1. Since the optical device assembly device in this application needs to be inverted as a whole, to prevent the photoelectric modules on the ferrule 20, PCB board 18, and substrate 19 from pressing onto the platform after the device is inverted, thus preventing damage to the optical devices, this application provides corresponding support rods 16. By controlling the length of the support rods 16, after the optical device assembly device is flipped and inverted, the support rods 16 support the platform, allowing the components in the optical devices to float and preventing damage.

[0071] Furthermore, the base 1 in this application is also provided with a clearance groove 17, which at least partially overlaps with the dispensing port 9 along the first direction. Since this application requires the entire optical device assembly device to be inverted and dispensing adhesive from the back of the device, the adhesive can drip through the dispensing port 9 onto the substrate 19 to achieve bonding between the substrate 19 and the PCB board 18. Therefore, to facilitate dispensing, this application correspondingly provides a clearance groove 17 on the base 1, ensuring that after the optical device assembly device is flipped over, there are no obstructions above the dispensing port 9, facilitating dispensing.

[0072] Based on the optical device assembly apparatus of this application, this application also includes an optical device assembly method, which is implemented by the above-mentioned optical device assembly apparatus, specifically including the following steps:

[0073] S1. Obtain the PCB board 18 and the substrate 19 on which the optoelectronic module is assembled. It is worth noting that the substrate 19 on which the optoelectronic module is assembled in this application can be a structure formed after the optoelectronic module is assembled onto the substrate 19, or it can be the substrate 19 that has been detached from the PCB board 18 after the optoelectronic module has been assembled in a conventional assembly method.

[0074] S2. Fix the PCB board 18 in the first placement slot and form a negative pressure at the suction port 7 of the second placement slot 6.

[0075] S3. Pass the substrate 19 through the through hole 21 on the PCB board 18, so that the substrate 19 and the ferrule 20 connected to the substrate 19 are located on both sides of the PCB board 18 along the first direction.

[0076] S4. Adjust the relative position of PCB board 18 and substrate 19 so that substrate 19 is attached to the preset position of PCB board 18.

[0077] S5. The assembly device that fixes the PCB board 18 and the substrate 19 is flipped over as a whole, and adhesive is applied to the circumference of the substrate 19 and cured.

[0078] Furthermore, step S4 in this application specifically includes:

[0079] S401, The first displacement mechanism 4 adjusts the position of the PCB board 18 along the first direction;

[0080] S402, the second displacement mechanism 5 adjusts the position of the substrate 19 so that the substrate 19 and the preset position on the PCB board 18 are aligned in the first direction;

[0081] S403, the first displacement mechanism 4 adjusts the position of the PCB board 18 along the first direction so that the PCB board 18 is in close contact with the substrate 19.

[0082] Furthermore, in step S4 of this application, the substrate 19 is adjusted after being fixed by vacuum adsorption. Specifically, the vacuum adsorption component 8 generates negative pressure, and when the substrate 19 falls into the second placement groove 6, the substrate 19 is adsorbed and fixed in the second placement groove 6. Then, the displacement of the substrate 19 along the second direction and the third direction is adjusted by the second displacement mechanism 5 to achieve vertical alignment between the substrate 19 and the pre-attached position on the PCB board 18.

[0083] Furthermore, step S3 in this application specifically includes:

[0084] The substrate 19 is placed above the PCB board 18 and clamped at an angle to the horizontal direction, allowing it to pass through the through-hole 21 of the PCB board 18. It should be noted that the "above" of the PCB board 18 refers to the side of the PCB board 18 where the optoelectronic device is mounted. During the actual assembly of the optical module, the substrate 19 is slightly larger than the through-hole 21 on the PCB board 18. Therefore, the substrate 19 cannot be directly dropped vertically into the through-hole 21. Since the areas of the substrate 19 and the through-hole 21 are roughly equivalent, in actual operation, only a slight tilt of the substrate 19 is needed to allow it to pass vertically through the through-hole 21. It is worth noting that a certain distance is maintained between the substrate 19 and the second placement slot 6 in the first direction to facilitate the vertical passage of the substrate 19 through the through-hole 21. After the substrate 19 passes through the through-hole 21, the distance between the PCB board 18 and the substrate 19 along the first direction is adjusted to achieve proper attachment.

[0085] Furthermore, step S3 of this application also includes: overlapping one side of the substrate 19 with the side of the second placement groove 6; the first moving mechanism controls the PCB board 18 to move away from the base 1, and the substrate 19 falls onto the second placement groove 6; the vacuum adsorption assembly 8 draws a vacuum, and the substrate 19 is attached to the second placement groove 6; the insert 20 is placed on the platform of the third placement groove 10 and bonded and fixed. Since the substrate 19 is larger than the size of the through hole 21, when the substrate 19 is placed at an angle into the through hole 21, the substrate 19 may overlap the edge of the through hole 21. At this time, the first moving mechanism can drive the PCB board 18 to move upward, so that the substrate 19 falls from the through hole 21 and is placed in the second placement groove 6, and then fixed by drawing a vacuum. Meanwhile, since the ferrule 20 in this application is connected to the substrate 19, in order to prevent the ferrule 20 from being suspended in the air after the optical device assembly device is inverted, which would cause the optical fiber between the ferrule 20 and the substrate 19 to be disconnected, this application uses the third placement slot 10 to position the ferrule 20 and uses glue to stick the ferrule 20 to the third placement slot 10, so as to achieve relative fixation of the position of the ferrule 20, which facilitates the subsequent bonding and fixing between the substrate 19 and the PCB board 18.

[0086] Specifically, in S2 of this application, the PCB board 18 is fixed as follows: the PCB board 18 is placed between the first clamping port 12 and the second clamping port 13, the notch of the PCB board 18 is aligned with the positioning pin 11 at the second clamping port 13 to achieve initial fixation of the PCB board 18, and then the sliding screw 15 is turned. The sliding screw 15 drives the sliding block 14 to move toward the PCB board 18, and the sliding block 14 clamps the PCB board 18 against the second clamping port 13 to achieve fixation of the PCB board 18.

[0087] The overall assembly process of the optical device in this application is as follows:

[0088] The PCB board 18 is fixed between the first clamping port 12 and the second clamping port 13. The sliding screw 15 is rotated, and the sliding screw 15 drives the sliding block 14 to move toward the PCB board 18. The sliding block 14 presses the PCB board 18 against it, and the PCB board 18 is fixed in the first placement slot. The substrate 19 is clamped at an angle to the horizontal direction. The substrate 19 is passed obliquely through the through hole 21 and placed in the second placement groove 6. The vacuum adsorption component 8 draws a vacuum to adsorb and fix the substrate 19 on the second placement groove 6. The insert 20 is placed on the third placement groove 10 and fixed on the third placement groove 10. The second displacement mechanism 5 adjusts the displacement of the substrate 19 along the second and third directions so that the substrate 19 is aligned with the pre-attached position on the PCB board 18 in the first direction. The first displacement mechanism 4 controls the PCB board 18 to move toward the substrate 19. The PCB board 18 and the substrate 19 are tightly attached to each other and the substrate 19 is attached to the preset position on the PCB board 18. The entire optical module assembly device is flipped over, and the support rod 16 abuts against the table. The overall structure of the PCB board 18 and the substrate 19 is flipped and inverted. Glue is applied through the glue dispensing port 9. The glue overflows through the glue dispensing port 9 to the periphery of the substrate 19 and the substrate 19 is bonded to the PCB board 18. The substrate 19 is baked and the substrate 19 is bonded and fixed to the PCB board 18. Turn off the suction force of the vacuum adsorption component 8, turn the sliding screw 15, and the sliding block 14 moves away from the PCB board 18 to remove the structure that is attached to the PCB board 18 and the substrate 19, thus completing the assembly of the optical device.

[0089] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An optical device assembly apparatus, characterized by, The utility model relates to a kind of assembly device for PCB and substrate, including: Base, first fixed module and second fixed module are equipped on the base, first placing groove is equipped on the first fixed module, second placing groove is equipped on the second fixed module, one side of the second placing groove is equipped with glue dispensing port, the second placing groove is penetrated along the first direction, the first placing groove and the second placing groove are at least partially coincident along the first direction; First displacement mechanism is equipped on the first fixed module and / or the second fixed module, and the first displacement mechanism is used to drive the first fixed module and / or the second fixed module to move along the first direction; The second fixed module includes second displacement mechanism, and the second placing groove is arranged on the second displacement mechanism, and the second displacement mechanism has driving member moving along second direction and third direction respectively; Third placing groove is further arranged on one side of the second placing groove along the second direction, and the third placing groove is used to place ferrule, the third placing groove is arranged on the side of the second placing groove away from the first placing groove, and the third placing groove is opened on the side towards the second placing groove; The first fixed module is used to fix PCB, the first direction is vertical direction of PCB, the second direction is length direction of PCB, and the third direction is width direction of PCB.

2. The optical device assembly apparatus of claim 1, wherein, The second placing groove includes suction port arranged on the bottom surface of the groove, and the suction port is communicated with vacuum suction assembly.

3. The optical device assembly apparatus of any one of claims 1-2, wherein, The first fixed module includes first clamping port and second clamping port arranged at intervals along the second direction, and the first clamping port and the second clamping port jointly constitute the first placing groove.

4. The optical device assembly apparatus of claim 3, wherein, Sliding block is arranged on one side edge of the second clamping port along the third direction, the sliding block is connected with sliding screw rod, the sliding block is matched with the sliding screw rod, and the sliding screw rod is used to drive the sliding block to move along the third direction.

5. The optical device assembly apparatus of any one of claims 1-2, wherein, Supporting rods are arranged around the base along the first direction, a plurality of supporting rods are arranged on the same side of the base with the first fixed module or the second fixed module, and the length of the plurality of supporting rods is not less than the distance between the top surface of the first placing groove and the base.

6. The optical device assembly apparatus of claim 1, wherein, Avoiding groove is further arranged on the base, and the avoiding groove is at least partially coincident with the glue dispensing port along the first direction.

7. An optical device assembling method, which is implemented by the optical device assembling apparatus according to any one of claims 1 to 6, characterized by, The utility model relates to a kind of assembly device for PCB and substrate, including: S1, obtaining PCB and substrate assembled with optoelectronic module; S2, fixing PCB in the first placing groove;Forming negative pressure in the suction port of the second placing groove; S3, passing the substrate through the via on the PCB, so that the substrate and the ferrule connected with the substrate are located on the two sides of the PCB along the first direction respectively; S4, adjusting the relative position of the PCB and the substrate, so that the substrate is attached to the predetermined position of the PCB; S5, flipping the assembly device with fixed PCB and substrate as a whole, dispensing glue on the circumference of the substrate and solidifying.

8. The optical device assembly method of claim 7, wherein, The step S4 specifically includes: S401, adjusting the position of the PCB along the first direction by the first displacement mechanism; S402, adjusting the position of the substrate by the second displacement mechanism, so that the substrate and the predetermined position on the PCB are aligned along the first direction. S403、the first displacement mechanism adjusts the position of the PCB board in the first direction, so that the PCB board is close to the substrate.

9. The optical device assembly method according to claim 7 or 8, wherein, The step S3 specifically comprises: The substrate is placed above the PCB board, the substrate is clamped obliquely to the horizontal direction, and the substrate passes through the via of the PCB board.

10. The optical device assembly method of claim 7 or 8, wherein, The step S3 further comprises: One side of the substrate is overlapped on the side of the second placement groove, the first displacement mechanism controls the movement of the PCB board away from the base, and the substrate falls on the second placement groove; The vacuum suction assembly is vacuumized, and the substrate is attached in the second placement groove; The ferrule is placed on the third placement groove and is fixed by adhesion.

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