A bionic adhesive pad suitable for vacuum and high temperature environments and a preparation method thereof

Abstract

The present invention discloses a bionic adhesive pad suitable for use in vacuum and high-temperature environments and a preparation method thereof, belonging to the technical field of polymer materials and their preparation. The bionic adhesive pad is precisely manufactured from a high-temperature resistant polymer substrate and has a microcolumn array structure, which can form good contact with a smooth surface and utilize van der Waals force to achieve adhesion, fixation and transportation of the bionic adhesive pad and the smooth surface; the microstructure ensures the discrete distribution of the contact area, increases the perimeter of the contact area, and thereby increases the adhesion work required to overcome crack propagation during interface separation, thereby enhancing the stability of adhesion; the bionic adhesive pad of the present invention is suitable for the repeated fixation and transportation needs of smooth and fragile material surfaces in vacuum and high-temperature processes in the pan-semiconductor industry, solving the problems of easy scratches caused by mechanical clamping, easy residual glue caused by chemical glue, and unusable vacuum suction cups.

Description

Technical Field

[0001] The present invention belongs to the technical field of polymer materials and their preparation, and particularly relates to a bionic adhesive pad suitable for use in vacuum and high-temperature environments and a preparation method thereof. Background Art

[0002] The pan-semiconductor industry encompasses high-end technology fields such as integrated circuits, flat panel displays, and LEDs. It boasts a long lifecycle, high ceilings, and a strong industrial chain driving force. It holds a dominant position in key industries and sectors critical to national security and the national economy, and is a vital pillar of the national economy. The high technical barriers and high prices associated with pan-semiconductor equipment and components are largely due to the demanding manufacturing environments. Environmental factors such as vacuum, high temperatures, and corrosion raise the barrier to entry for many technological applications.

[0003] Taking the repeated fixation and handling of smooth and fragile material surfaces such as glass, wafers, and photovoltaic panels as an example, conventional methods often bring certain technical bottlenecks in vacuum and high-temperature environments. For example, the failure of the suction cup's negative pressure in a vacuum environment, residual marks during adhesive desorption in a high-temperature environment, edge damage caused by mechanical clamping, long-lasting electrostatic adsorption, and susceptibility to electrical effects on the substrate surface. These problems restrict interface manipulation applications such as fixation and movement of smooth surfaces in vacuum and high-temperature environments. For example, patent CN 116277104 A discloses a negative pressure adsorption manipulator, and patent CN 218984838 U discloses a thin-walled negative pressure suction cup industrial robot gripper. Both patents utilize negative pressure suction cups to grasp and carry objects, and have advantages such as strong adsorption force, stable performance, and little influence from foreign objects. However, the negative pressure suction cup structure of the invention is based on pressure difference and is not suitable for vacuum environments. Patent CN 110767596 A discloses an electrostatic suction cup that can adsorb semiconductor wafers or glass substrates, but its cost is high, the adsorption process takes a long time, and it is easily affected by the electrical properties of the product surface. The center will shift due to static electricity residue or deflection, affecting positioning accuracy. Patent CN 219476659 discloses an electrostatic suction cup that can adsorb semiconductor wafers or glass substrates, but its cost is high, the adsorption process takes a long time, and it is easily affected by the electrical properties of the product surface. The center will shift due to static electricity residue or deflection, affecting positioning accuracy. U discloses a high-temperature resistant clamping assembly and a wafer handling device formed thereof, which has the advantages of high efficiency and good environmental adaptability, but mechanical clamping can easily damage the contact surface. For large-sized and heavy glass, mechanical clamping will produce edge stress concentration, which can easily cause the risk of brittle material breaking and cracking. In addition, the clamping position in the coating process will affect the coating uniformity. Patent CN109704125A discloses an automatic attaching device and an attaching device for sheet double-sided tape, which are used to achieve attachment between double-sided tape and solid components, and can effectively fix and transport glass, display screens and other components. However, the double-sided tape is easy to remain and is difficult to clean, which affects the yield rate. At the same time, the cleaning process increases the manpower input. Due to the limitations of the above technologies, the pan-semiconductor industry still lacks a technology that can adapt to the repeated fixation and handling of smooth surfaces such as glass and wafers in vacuum and high-temperature environments.

[0004] There are many creatures in nature that have extraordinary adhesion abilities, such as geckos, flies, spiders, ants, beetles, etc. They can crawl and stay freely on vertical surfaces and even ceiling surfaces. Take geckos as an example. The base of their toes has millions of fibrous bristle tissues ranging in size from millimeters to nanometers and arranged in layers. When the gecko's toes come into contact with the surface of an object, there is a force between the bristle array and the molecules on the surface of the object, which is called van der Waals force. A large number of van der Waals forces converge to create an extremely strong adhesion force that is enough to support its own weight. Van der Waals force is a weak electromagnetic force generated when the distance between molecules is very close. It still exists even in harsh environments such as vacuum, high and low temperatures. This force makes interface manipulation in harsh environments in fields such as semiconductors and aerospace feasible.

[0005] Inspired by natural biological adhesion systems, biomimetic adhesive structures with microarray morphology have been demonstrated to be effective for fixation and transport applications on solid smooth surfaces. U.S. Patent US20160206243A1 discloses an octopus-like biomimetic microstructure array. The microstructure exhibits good adhesion under normal pressure or in water by creating a local negative pressure, but cannot exhibit effective adhesion in a vacuum environment. U.S. Patent US9120953B2 discloses an adhesive material having an array of terminally swollen microstructures that is advantageous for obtaining by a terminal dipping process. U.S. Patent US20150010732A1 and Chinese Patent ZL201910608241.7 each disclose a method for preparing an adhesive material having an array of terminally swollen microstructures, demonstrating the advantages of a columnar microstructure array design in enhancing interfacial adhesion. Professor Cutkosky's team at Stanford University in the United States disclosed a biomimetic adhesive material with a wedge-shaped array structure (Ruotolo W, Brouwer D, Cutkosky MR. Fromgrasping to manipulation with gecko-inspired adhesives on a multifingergripper. Science Robotics 2021; 6(61):eabi9773.), the normal adhesion of this type of material depends on the tangential friction force, which shows certain advantages in control. However, the terminal swelling and wedge-shaped microstructures disclosed in the above-mentioned prior art often involve molds with weak mechanical structure strength such as photolithography and soft templates during the preparation and molding process, and high-temperature resistant rubber materials often require high-temperature and high-pressure molding conditions. Therefore, the research foundation of bionic adhesion technology in high-temperature environments is relatively lacking.

[0006] In 2007, Professor Dai Liming of Georgia Institute of Technology in the United States introduced a carbon nanotube array obtained by PECVD technology (Qu L, Dai L. Gecko-Foot-Mimetic Aligned Single-Walled CarbonNanotube Dry Adhesives with Unique Electrical and Thermal Properties. Advanced Materials2007; 19(22):3844-3849.) also showed excellent biomimetic adhesion ability, and in 2016 verified that the van der Waals force was still effective in a high temperature environment of up to 1033℃, and even the interfacial adhesion tended to increase with increasing temperature [Xu M, Du F, Ganguli S, Roy A, Dai L. Carbon nanotube dry adhesives with temperature-enhanced adhesion over a large temperature range. Nat Commun 2016; 7:13450.]. However, due to the structural strength issues of carbon nanotube arrays themselves, their application in reusable and high-cleanliness pan-semiconductor vacuum environments still faces great challenges (Ji K, Meng G, Yuan C, Cui E, LiY, Sun J, et al. Synergistic effect of Fe and Al2O3 layers on the growth of vertically aligned carbon nanotubes for gecko-inspired adhesive applications. Journal of Manufacturing Processes 2018;33:238-244.). Summary of the Invention

[0007] The present invention provides a bionic adhesive pad suitable for use in vacuum and high-temperature environments and a preparation method thereof, which solves the problems in the prior art of easy scratching due to mechanical clamping, easy residual adhesive residue due to chemical glue, and unusable vacuum suction cups. It can improve the automation level and production line yield of pan-semiconductor processes such as photoelectric panel transmission, vacuum coating, and bonding fixation.

[0008] In order to achieve the above objectives, the present invention adopts the following technical solutions:

[0009] A bionic adhesive pad suitable for use in vacuum and high-temperature environments, comprising a column array layer, a backing layer, and a connecting layer; the column array layer is distributed on the surface of the backing layer, and the connecting layer is used to connect the backing layer and the end effector of the automation equipment; the surface of the column array layer is flat;

[0010] The adhesive pad is provided with a sheet release operation window or structure, wherein the operation window is a hollow structure preset in the middle area of ​​the bionic adhesive pad when the sheet is released or unloaded by blowing or mechanical ejection, or a mechanical engaging concave-convex groove preset in the backing layer of the bionic adhesive pad when the sheet is released or unloaded by mechanical rotation;

[0011] The base materials of the column array layer and the backing layer of the bionic adhesive pad are a composite of one or more high-temperature resistant polymer materials such as fluororubber, perfluoroether rubber, fluorosilicone rubber, and high-temperature resistant silicone rubber;

[0012] The shape of the bionic adhesive pad is circular, square or other cuttable shapes;

[0013] The cross-sectional shape of a single straight column unit in the straight column array layer is a combination of one or more of a circle, a hexagon or other polygons;

[0014] The straight column array layer is a close-packed array of straight columns with the same cross-sectional (circumscribed circle) diameter or an arrangement and combination of straight column units with different cross-sectional (circumscribed circle) diameters;

[0015] The surface roughness of the straight column units in the straight column array layer is Ra less than 0.1 μm;

[0016] The straight column units in the straight column array layer are arranged in an equidistant manner or in a cross-shaped vertical and horizontal arrangement;

[0017] The arrangement of the straight column array layer on the backing layer can be a method of covering the entire backing layer, or can be arranged along a specific pattern. In the method of arranging along the specific pattern, the blank area outside the pattern arrangement can be a cross-shaped or S-shaped blank area. The blank area provides a snapping operation space for a mechanical snapping fixation method, and is also conducive to quickly and smoothly guiding the airflow from the center to the surrounding area when using an air blowing method to release the sheet, thereby reducing the large stress impact that may be caused by the central airflow.

[0018] The backing layer serves as a support layer for the column array layer. The backing layer and the column array layer can be integrally formed of the same material, or can be a gradient distribution of a variable modulus material, wherein the variable modulus material gradient distribution is such that the material modulus of the column array layer is lower than the material modulus of the backing layer.

[0019] The connecting layer may be a double-sided adhesive layer or a mechanical clamping layer. When the connecting layer is a double-sided adhesive layer, the double-sided adhesive layer is preferably a high-temperature resistant polyimide double-sided adhesive layer. When the connecting layer is a mechanical clamping layer, the shape of the clamping groove is a dovetail groove, a circle or a polygon.

[0020] When the bionic adhesive pad is used to realize the debonding by means of air blowing and central ejector pin, a through hole structure is reserved in the middle of the bionic adhesive pad, and the diameter of the through hole is slightly larger than the diameter of the air hole or the ejector pin for mechanical debonding.

[0021] Beneficial Effects: The present invention provides a biomimetic adhesive pad suitable for use in vacuum and high-temperature environments and a method for preparing the same. The adhesive pad is made from a high-temperature-resistant polymer substrate through processes such as flat vulcanization or injection molding. The mold used in the flat vulcanization or injection molding process requires a smooth bottom surface at the end, preferably with a roughness Ra of less than 0.1µm. The biomimetic adhesive pad comprises a straight column array layer, which can reduce the equivalent modulus of the contact layer, thereby improving the adequacy of effective interface contact. The ends of the straight column array layer interact with the smooth solid surface through van der Waals forces, which facilitate adhesion, fixation, and transport of the biomimetic adhesive pad to the smooth surface. The straight column unit microstructure in the straight column array layer ensures a discrete distribution of contact areas, increasing the perimeter of the contact area, thereby increasing the adhesion work required to overcome crack propagation during interface separation and enhancing adhesion stability. Based on the contact splitting principle, the discrete contact areas extend the path of desorption crack propagation, increasing the amount of work required to overcome adhesion energy during desorption, thereby improving adhesion stability. The van der Waals adhesion mechanism formed by the bionic adhesive pad of the present invention in contact with smooth surfaces such as glass and wafers can adapt to the vacuum environment commonly seen in the pan-semiconductor industry. At the same time, the high-temperature resistant rubber substrate of the bionic adhesive pad can ensure the stable use of the bionic adhesive pad in a high-temperature environment. It is suitable for the repeated fixation and transportation needs of smooth and fragile material surfaces (glass, wafers, etc.) in vacuum, high-temperature and other processes in the pan-semiconductor industry, and solves technical problems such as easy scratches caused by mechanical clamping, easy residual glue caused by chemical glue, and unusable vacuum suction cups. It has broad application prospects in automation fields such as lossless transportation, efficient fixation, and full-space operation in the pan-semiconductor industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the biomimetic adhesive pad hierarchy in an embodiment of the present invention, where 1 represents a column array layer, 2 represents a backing layer, 3 represents a connection layer, and 4 represents a through hole;

[0023] Figure 2 Schematic diagram of an adhesive pad with closely packed cylindrical structures having a diameter of 300 μm according to an embodiment of the present invention;

[0024] Figure 3 Schematic diagram of a close-packed adhesive pad with a hexagonal straight column cross section in an embodiment of the present invention;

[0025] Figure 4 Schematic diagram of an adhesive pad with a close-packed arrangement of cylinders with diameters of 1500µm and 1000µm alternatingly arranged in an embodiment of the present invention;

[0026] Figure 5 Schematic diagram of a biomimetic adhesive pad with a cross-shaped unstructured area in a straight column array layer according to an embodiment of the present invention;

[0027] Figure 6Schematic diagram of a biomimetic adhesive pad with an S-shaped cross-structured area left in a straight column array layer according to an embodiment of the present invention;

[0028] Figure 7 Schematic diagram of the mechanical engagement with the fixture in an embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the application of the bionic adhesive pad in an embodiment of the present invention;

[0030] Figure 9 Schematic diagram of rotational decomposition in an embodiment of the present invention;

[0031] Figure 10 Schematic diagram of air blowing to separate tablets in an embodiment of the present invention;

[0032] Figure 11 This is a photo of a biomimetic adhesive pad with different straight column array layers according to an embodiment of the present invention;

[0033] Figure 12 The adhesion of the bionic adhesive pad with 150µm diameter straight column units arranged equidistantly in an environment ranging from room temperature to 300°C is shown in the embodiment of the present invention.

[0034] Figure 13 1. A comparison of the adhesion forces of six bionic adhesive pads in vacuum and normal pressure environments according to an embodiment of the present invention;

[0035] Figure 14 Schematic diagram of the change of the interfacial adhesion force of the bionic adhesive pad under different negative pressure environments in an embodiment of the present invention;

[0036] Figure 15 Schematic diagram of the change in adhesion of six types of bionic adhesive pads under different pre-pressures in an embodiment of the present invention;

[0037] Figure 16 The relationship between the perimeter of the contact area between the end of the straight column of the six biomimetic adhesive pads and the glass and the adhesion force in the embodiment of the present invention;

[0038] Figure 17 Schematic diagram of the reusability of six types of bionic adhesive pads according to an embodiment of the present invention;

[0039] Figure 18 Figure 3 is a schematic diagram of the implementation process of the bionic adhesive pad rotational desorption and air blowing desorption schemes in an embodiment of the present invention, where a is a schematic diagram of rotational desorption, b is a simulation result of the stress change of a single micropillar during the rotational desorption process, c is a simulation result of the cohesive force change at the contact surface between the micropillar and the glass substrate, d is the desorption force value at different desorption rates, e is an image of the desorption process, and f is a glass processing application of a robotic arm with an adhesive pad. DETAILED DESCRIPTION

[0040] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments:

[0041] like Figure 1 As shown, a bionic adhesive pad suitable for use in vacuum and high-temperature environments includes a straight column array layer 1, a backing layer 2, and a connecting layer 3; the straight column array layer 1 is distributed on the surface of the backing layer 2, and the connecting layer 3 is used to connect the backing layer 2 and the end effector of the automation equipment; the surface of the straight column array layer is flat, and the surface roughness Ra ≤ 0.1µm; a through-hole structure is reserved at the center position of the bionic adhesive pad, and the through-hole aperture is slightly larger than the diameter of the air hole or the ejector pin for mechanical debonding. The through-hole has a diameter of about 2mm, which reserves an operation window for debonding by blowing or center ejector.

[0042] The above-mentioned bionic adhesive pad suitable for vacuum and high temperature environment is prepared by flat vulcanization or injection molding and other processes; the flat vulcanization process is to realize the pressing and heating vulcanization of the mold through two upper and lower flat pressure plates and a temperature-controlled heating module. The preferred flat vulcanization process can realize vacuum negative pressure assisted prepolymer filling. The flat vulcanization mold is preferably a stainless steel, nickel-based or aluminum alloy mold, and the mold is subjected to anti-sticking treatment. The anti-sticking treatment is preferably a high-temperature resistant fluorine-containing group anti-sticking system, or it can be chemical plating, electroplating, oxidation, sputtering low surface energy coating, such as silicon oxide or aluminum oxide coating and other non-transferable coatings; the injection molding process is preferably a metal-based mold, such as a stainless steel, nickel-based or aluminum alloy mold. The mold surface also requires anti-sticking pretreatment, and the method is the same as the flat vulcanization process. The mold reserves an overflow port or groove to ensure that the microscale cavities corresponding to the microstructure can be completely filled during the pressure filling process.

[0043] The mold used in the flat plate vulcanization or injection molding process needs to have a smooth end bottom surface, and the roughness of the smooth bottom surface is preferably Ra < 0.1µm. After the filling and curing molding is completed by the flat plate vulcanization or injection molding process, the rubber prepolymer is formed according to the demoulding line designed for the mold. For some high-temperature resistant rubber materials, a two-stage vulcanization treatment is required to further enhance the intrinsic mechanical strength of the rubber and reduce the mark residue of the bionic adhesive pad during the application process; the two-stage vulcanization treatment varies in vulcanization time and temperature according to the type of rubber substrate, and both time and temperature are longer and higher than the one-stage vulcanization time; after the two-stage vulcanization process is completed, the bionic adhesive pad can be obtained after cooling to room temperature in the furnace.

[0044] like Figure 2 As shown, straight column units of the same diameter are arranged in an equidistant manner, wherein the cross section of the straight column unit is circular, the center spacing L of the straight column unit is 1.5 times the diameter D of the straight column cross section, and the angle between the center points of three adjacent units is 60°;

[0045] like Figure 3As shown, the cross section of the straight column unit of the bionic adhesive pad is hexagonal, and the units are arranged equidistantly. The center spacing L of the straight column units is 1.5 times the diameter D of the circumscribed circle of the hexagonal section, and the angle between the centers of the circumscribed circles of any two of the three adjacent units is 60°.

[0046] like Figure 4 As shown, the cross-section of the straight column unit of the biomimetic adhesive pad is a circle with two diameters. The straight column units are arranged in a cross-sectional manner. The unit with a smaller cross-sectional diameter is arranged at the intersection of the diagonals of a square formed by four straight column units with a larger cross-sectional diameter. The center spacing L of the straight column units with a larger cross-sectional diameter on the same side of the square is 1.5 times the larger cross-sectional diameter D.

[0047] like Figure 5 and Figure 6 As shown, in order to provide working space for mechanical engagement and fixation, the straight column units leave a blank area in the center of the backing layer in a cross or S-shaped shape, the size of which is determined by the specific mechanical engagement fixing parts. The straight column units can be arranged in an equidistant arrangement or a cross-shaped arrangement, or in combination. The blank areas are characterized by being interconnected.

[0048] Figure 11 The six biomimetic adhesive pads described in this embodiment are shown. The cross-sections of the straight column units in their straight column array layers are circular, and they are arranged in an equidistant and cross-sectional arrangement. From left to right, the six biomimetic adhesive pads have straight column unit diameters of 1000μm / 1500μm, 500μm / 1000μm, 1000μm, 500μm, 300μm, and 150μm. The two biomimetic adhesive pad samples of 1000μm / 1500μm and 500μm / 1000μm are arranged in a cross-sectional arrangement, with straight column unit heights of 1000μm and 500μm, respectively. The samples with straight column unit diameters of 1000μm, 500μm, 300μm, and 150μm are arranged in an equidistant arrangement, with straight column unit heights equal to their respective cross-sectional diameters, and all of the straight column unit cross-sections are circular.

[0049] Figure 12The adhesion force of a biomimetic adhesive pad with densely arranged straight column units of 150µm in a high-temperature environment ranging from room temperature to 300°C is shown. The cross-section of the straight column units of the biomimetic adhesive pad is circular and is arranged equidistantly. The center spacing of the straight column units is 1.5 times the diameter of the circumscribed circle of the hexagonal cross-section, and the height of the straight column units is 150µm. The sample is prepared using a fluororubber substrate with good high-temperature resistance and chemical corrosion resistance. The thermal decomposition temperature of the substrate is about 355°C. A DMA thermal mechanical dynamic analyzer is used to test the changes in the adhesion performance of the sample under different temperature environments. The adhesion target surface is a smooth glass surface. According to the experimental results, the adhesion force of the sample is about 12N at room temperature of 20°C. As the ambient temperature increases, the adhesion force decreases slightly, but still remains above 11N, without significant attenuation. Therefore, the biomimetic adhesive pad in this embodiment is suitable for use in high-temperature environments ranging from room temperature to 300°C.

[0050] Figure 13 Shown Figure 11 The adhesion forces of bionic adhesive pads with six different diameters of straight column units under vacuum and normal pressure environments were compared. The experiment verified that the adhesion values ​​of samples with different straight column unit diameters in air and vacuum environments were similar. Therefore, the bionic adhesive pad relies on van der Waals force as the main action mechanism under normal pressure and vacuum environments, showing good adaptability of the interface contact force to the ambient air pressure (normal pressure or vacuum).

[0051] Figure 14 Shown Figure 11 The changes in the interfacial adhesion force of the bionic adhesive pads with six different diameter straight column units under different negative pressure environments were studied. During the experiment, the bionic adhesive pad samples were attached to the glass and placed in a vacuum chamber with adjustable cavity air pressure. The cavity pressure was adjusted by vacuum pumping, and the changes in the adhesion force of the samples were tested. The experiment showed that with the increase of vacuum degree, the normal adhesion force decreased. This was because the local area where the end of some micro-columns was not fully fitted with the glass, and the embedded air escaped during the vacuum pumping process, resulting in a void in the local contact, which in turn affected the stability of the adhesion force. However, the overall adhesion value was still maintained above 90%, further verifying the good adhesion performance of the bionic adhesive pad in a vacuum environment.

[0052] Figure 15 The adhesion changes of the bionic adhesive pads with the above six diameter straight column units under different preloads are demonstrated. The target adhesion surface is a smooth glass surface. The experimental results show that with the increase of preload, the effective adhesion area continues to increase, and then the adhesion force gradually increases. When the initial preload exceeds 10N, the adhesion area of ​​each sample is stable, indicating that when the bionic adhesive pad is used, the required preload is above 10N to achieve stable adhesion.

[0053] Figure 16The relationship between the circumference of the contact area between the ends of the straight columns and the glass of the six samples and the adhesion force is demonstrated. The results show that as the contact circumference increases (the contact circumference refers to the sum of the circumferences of all the straight columns on the adhesion pad. Under the same contact area, the smaller the straight column diameter and the greater the number of arranged straight column units, the larger the corresponding circumference), the adhesion force of the bionic adhesion pad tends to increase. Among them, the peeling force is not affected by the arrangement of the straight columns, but only increases monotonically with the increase of the circumference. The normal pull-off force is related to the arrangement. The figure shows the equidistant arrangement of straight columns of the same diameter and the cross-shaped vertical and horizontal arrangement of straight columns of different diameters. Under the same arrangement, the normal pull-off force also increases monotonically with the increase of the circumference. This is because according to the contact separation theory, the larger the contact circumference, the greater the adhesion work required to overcome during separation, and the corresponding greater the adhesion force. In practical applications, this result corresponds to the stability of the adhesion of the bionic adhesion pad.

[0054] Figure 17 The reusability of the six bionic adhesive pads was demonstrated. After 300 cycles of adhesion-desorption tests, the adhesion values ​​of the bionic adhesive pads remained basically stable, demonstrating the stable reusability of the bionic adhesive pads.

[0055] Figure 18 The implementation process of the biomimetic adhesive pad rotational debonding scheme is demonstrated: after the biomimetic adhesive pad is stably adhered to the glass, in order to achieve debonding and debonding, the biomimetic adhesive pad is rotated to cause the straight column array layer on the biomimetic adhesive pad to produce twisting deformation under the action of bending moment, thereby destroying the effective contact between the end of the straight column unit and the glass surface, thereby achieving debonding of the straight column unit from the glass surface. Since the rotational debonding process uses the central axis of the entire circular biomimetic adhesive pad as the rotation reference, the debonding process can achieve the debonding of the entire sample matrix in a short time, thereby achieving efficient debonding operation (a, schematic diagram of rotational desorption, applying torque to the sample to separate it from the glass substrate; b, simulation results of the stress change of a single microcolumn during the rotational desorption process; c, simulation results of the change in the adhesion force at the contact surface between the microcolumn and the glass substrate; d, non Desorption force values ​​at the same desorption rate; e. Image of the desorption process, with the column collapsing under torque; f. Glass processing application of a robotic arm with a rubber pad, where (I) preloads the preloaded material downward, (II) lifts upward and adheres to the glass, (III) moves to the right, (IV) rotates to desorb and release the glass, and (V) lifts upward. ) Implementation of the biomimetic adhesive pad air-blowing debonding solution: After the biomimetic adhesive pad is stably adhered to the glass, to achieve debonding and debonding, a pressured airflow, either air or nitrogen, is applied through the pre-set through-hole structure in the center of the biomimetic adhesive pad. This airflow, which can be either air or nitrogen, impacts and sweeps along the microstructure gap to the contact interface, providing the debonding force required to debond the biomimetic adhesive pad from the glass surface, thereby also achieving efficient debonding and debonding.

[0056] The above are only preferred embodiments of the present invention and cannot be used to limit the scope of protection of the present invention. Any changes made on the basis of the technical solution in accordance with the technical ideas proposed by the present invention fall within the scope of protection of the present invention.

Claims

1. A bionic adhesive pad suitable for use in vacuum and high temperature environments, characterized in that: It includes a straight column array layer, a backing layer, and a connecting layer; the connecting layer is used to connect the backing layer and the end effector of the automation equipment; the straight column array layer is evenly distributed on the surface of the backing layer, and the surface of the straight column array layer is flat and adheres to the surface of the object; the straight column array layer is arranged on the backing layer in a manner of covering the backing layer or arranged along a specific pattern; the manner of arranging along the specific pattern is to set a cross-shaped or S-shaped blank area, and the blank area provides a clamping working space for the mechanical clamping and fixing method of the connecting layer, and is also conducive to quickly guiding the airflow from the center to the surroundings when using the air blowing method to release the film, thereby reducing the large stress impact that may be caused by the central airflow. ; The straight column array layer is formed by equidistantly arranging straight column units of the same cross-sectional diameter or by arranging straight column units of different cross-sectional diameters in a cross-sectional and vertical arrangement; wherein, when the straight column units of the same cross-sectional diameter are arranged in an equidistant manner, the center spacing L of the straight column units is 1.5 times the cross-sectional diameter D of the straight column, and the angle between the center lines of the three adjacent units is 60°; when the straight column units of different cross-sectional diameters are arranged in a cross-sectional and vertical arrangement, the unit with the smaller cross-sectional diameter is arranged at the intersection of the diagonals of the square formed by four straight column units with the larger cross-sectional diameter, and the center spacing L of the straight column units with the larger cross-sectional diameter on the same side of the square is 1.5 times the larger cross-sectional diameter D.

2. The bionic adhesive pad suitable for use in vacuum and high temperature environments according to claim 1, characterized in that: The cross-sectional shape of a single straight column unit in the straight column array layer is a circle, a hexagon or other polygons or a combination thereof.

3. The bionic adhesive pad suitable for use in vacuum and high temperature environments according to claim 1, characterized in that: The bionic adhesive pad is provided with a sheet-unwinding operation structure.

4. The bionic adhesive pad suitable for use in vacuum and high temperature environments according to claim 1, characterized in that: The connecting layer is a double-sided adhesive layer or a mechanical clamping layer.

5. The bionic adhesive pad suitable for use in vacuum and high temperature environments according to claim 1 or 2, characterized in that: The surface roughness of the straight column units in the straight column array layer is Ra<0.1µm.

6. The bionic adhesive pad suitable for use in vacuum and high temperature environments according to claim 1 or 2, characterized in that: The backing layer and the column array layer are integrally formed of the same high-temperature resistant material or are gradiently distributed with variable modulus high-temperature resistant materials.

7. The bionic adhesive pad suitable for use in vacuum and high temperature environments according to claim 6, characterized in that: The variable modulus high temperature resistant material is distributed in a gradient manner such that the material modulus of the straight column array layer is lower than the material modulus of the backing layer.

8. The bionic adhesive pad suitable for use in vacuum and high temperature environments according to claim 3, characterized in that: The sheet-release operation structure is a hollow structure preset in the middle area of ​​the bionic adhesive pad when the sheet is released by blowing or mechanical ejector, or a mechanically engaged concave-convex groove preset in the backing layer of the bionic adhesive pad when the sheet is released by mechanical rotation.

9. The method for preparing a biomimetic adhesive pad suitable for use in vacuum and high temperature environments according to any one of claims 1 to 8, characterized in that: The bionic adhesive pad suitable for use in a vacuum and high-temperature environment is prepared by a flat plate vulcanization or injection molding process, and the mold used for the flat plate vulcanization or injection molding process has a smooth end bottom surface with a roughness Ra<0.1µm.

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