Dewar assembly, method of processing thereof and detection device

Abstract

The application discloses a Dewar assembly, a processing method thereof and a detection device. The Dewar assembly comprises a packaging device and a plurality of functional devices. The packaging device has a sealed cavity, and the plurality of functional devices are installed in the sealed cavity. Each of the functional devices is a non-gas-absorbing special device. One or more of the plurality of functional devices can be a bearing part of a getter structure, and / or the packaging device is a bearing part of the getter structure. The getter structure further comprises a getter layer arranged on a part of a surface of the bearing part which communicates with the sealed cavity. The getter structure absorbs gas in the sealed cavity by using the getter layer. In the Dewar assembly, the volume of the sealed cavity of the packaging device is relatively small, so that the formation of a vacuum environment in the Dewar assembly is less difficult, and the leak rate of the Dewar assembly can be greatly reduced, thereby improving the vacuum reliability of the Dewar assembly.

Description

Technical Field

[0001] This application belongs to the field of refrigeration equipment technology, specifically relating to a Dewar component, its processing method, and a detection device. Background Technology

[0002] Cryogenic detectors, such as infrared detectors, are typically mounted on Dewar assemblies to provide a vacuum environment. To maintain the continuity of this vacuum environment, current Dewar assemblies usually incorporate columnar or tubular suction structures within their housings. These suction structures result in relatively large housing sizes, which not only further complicates the creation of a vacuum environment within the Dewar assembly but also significantly increases the leakage rate, leading to relatively low vacuum reliability in current Dewar assemblies. Summary of the Invention

[0003] The purpose of this application is to provide a Dewar assembly, its processing method, and a detection device. In this Dewar assembly, the volume of the sealed cavity of the encapsulated device is relatively small, which makes it easier to form a vacuum environment inside the Dewar assembly and can significantly reduce the leakage rate of the Dewar assembly, thereby improving the vacuum reliability of the Dewar assembly.

[0004] In a first aspect, embodiments of this application disclose a Dewar assembly, which includes an encapsulation device and multiple functional devices. The encapsulation device has a sealed cavity, and the multiple functional devices are all installed in the sealed cavity. Each of the functional devices is a non-suction-specific component, and one or more of the multiple functional devices can serve as a support part of the suction structure, and / or the encapsulation device serves as a support part of the suction structure.

[0005] The air-absorbing structure further includes a getter layer disposed on the surface of the support portion in communication with the sealing cavity, and the air-absorbing structure uses the getter layer to absorb the gas in the sealing cavity.

[0006] Secondly, this application also discloses a method for processing a Dewar component, which includes:

[0007] Remove the oxide layer from the surface of the carrier portion to form a first intermediate part, wherein the carrier portion includes at least one of a packaging device and a functional device;

[0008] A passivation layer is formed on the surface of the first intermediate component to form a second intermediate component;

[0009] A getter layer is formed on the surface of the second intermediate to form a getter structure.

[0010] Thirdly, this application also discloses a detection device, which includes a detector and the aforementioned Dewar assembly. The Dewar assembly includes a substrate, and both the substrate and the detector are disposed within the sealed cavity of the Dewar assembly, with the detector mounted on the substrate.

[0011] This application discloses a Dewar assembly, which includes an encapsulation device and a functional device disposed within a sealed cavity of the encapsulation device. By using at least one of the encapsulation device and the functional device as the support portion of the getter structure in the Dewar assembly, and by providing a getter layer on the surface of the support portion in communication with the sealed cavity, even if gas leaks into the Dewar assembly, the getter layer can absorb the gas, thereby improving the continuity of the vacuum environment of the Dewar assembly. Furthermore, as described above, in the technical solution disclosed in this application, by using the encapsulation device and the functional device, which are originally the basic components of the Dewar assembly, as the support portion for the getter layer in the getter structure, it is no longer necessary to provide additional support for the getter layer within the Dewar assembly. This results in a relatively smaller overall size of the Dewar assembly, i.e., a smaller encapsulation device. This reduces the leakage rate of the encapsulation device and also reduces the volume of the sealed cavity, making it easier to form a vacuum environment within the Dewar assembly, thereby improving the vacuum reliability of the Dewar assembly. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0013] Figure 1 This is a schematic diagram of the structure of the Dewar component disclosed in the embodiments of this application;

[0014] Figure 2 This is a schematic diagram of the structure of the housing in the Dewar assembly disclosed in the embodiments of this application;

[0015] Figure 3 This is a schematic diagram of the structure of the cover in the Dewar assembly disclosed in the embodiments of this application;

[0016] Figure 4 This is a schematic diagram of the structure of the radiation screen in the Dewar assembly disclosed in the embodiments of this application;

[0017] Figure 5 This is a flowchart of the processing method of the Dewar component disclosed in the embodiments of this application.

[0018] Figure label:

[0019] 110-Housing, 120-Base, 210-Shell, 220-Light Inlet Component, 300-Getter Layer, 410-Substrate, 420-Lead Ring, 430-Radiation Screen, 440-Cold Finger, 450-Cold Head, 500-Detector. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0022] like Figures 1-4 As shown in the illustration, this application discloses a Dewar assembly, which includes a packaging device and multiple functional devices. The packaging device is a general term for the structures in the Dewar assembly used to provide packaging. For ease of processing and assembly, the packaging device typically includes multiple separately processed devices, which are interconnected during the assembly of the Dewar assembly to form a packaging device that provides mounting and protection for other devices in the Dewar assembly. For example, the packaging device may specifically include a housing 110, a base 120, a cover 210, and a light-gathering element 220. Of course, in other embodiments of this application, the packaging device may also include other devices, which are not limited herein. The housing 110 is mounted on the base 120, and the cover 210 is mounted on the side of the housing 110 opposite to the base 120.

[0023] More specifically, the housing 110, base 120, and cover 210 can all be formed of materials with relatively high structural strength, such as metal, to provide relatively reliable protection for other devices within the Dewar assembly and to ensure the overall structural integrity of the Dewar assembly's encapsulation device is relatively reliable. To ensure that the entire encapsulation device can form a sealed space while allowing external light to enter the Dewar assembly and be captured by devices such as the detector 500 installed within it, the light-gathering element 220 is formed of a light-transmitting material and is installed at the end of the cover 210 opposite to the housing 110.

[0024] Functional devices are a collective term for the devices in a Dewar assembly that provide corresponding functions. There can be multiple functional devices, and the specific number is not limited herein. For example, in the embodiments of this application, functional devices may include at least a substrate 410, a lead ring 420, and a radiation screen 430. As mentioned above, the packaged device has a sealed cavity, and based on this, each functional device is installed within the sealed cavity. Furthermore, the Dewar assembly can provide mounting for cryogenic detectors, etc., and therefore, the sealed cavity can also accommodate the detector 500.

[0025] To facilitate power supply to the detector 500, as described above, the functional components include a substrate 410 and a lead ring 420. Specifically, the detector 500 can be mounted on the substrate 410, and the lead ring 420 is connected to the substrate 410, with a portion of the lead ring 420 extending outside the housing 110. By connecting it to an external power source or other equipment, the detector 500 can be ensured to operate normally.

[0026] In order to ensure a relatively good vacuum continuity in the Dewar assembly based on the above structure, the Dewar assembly disclosed in this application embodiment is provided with a gas suction structure. When a small amount of gas is generated or seeps into the sealed cavity of the Dewar assembly, the gas can be absorbed by the gas suction structure to maintain a relatively high vacuum in the sealed cavity of the Dewar assembly.

[0027] To prevent the introduction of additional components into the Dewar assembly when a getter structure is provided, in this embodiment, the basic structure of the Dewar assembly can be used to form the getter structure. Specifically, in this embodiment, one or more of the multiple functional components, and / or the encapsulation device, can be used as the carrier of the getter structure. Since both the encapsulation device and the functional components are the basic structure for forming the Dewar assembly, by using one or more of them as the carrier structure (i.e., the carrier) for the getter layer, it is unnecessary to provide additional components to carry the getter layer. Thus, without changing the number, structure, and size of the functional components, the size of the encapsulation device can be relatively small. This results in fewer connections, such as welds, within the encapsulation device, and smaller weld sizes, thereby reducing the leakage rate of the encapsulation device used to form the sealed cavity. With a relatively small encapsulation device size, the size of the resulting cavity is also relatively small, thus reducing the difficulty of forming a vacuum environment within the sealed cavity.

[0028] In other words, in this embodiment, both the encapsulation device and the functional devices are non-gas-absorbing dedicated components. That is, the two types of devices in the Dewar assembly are not only used to provide gas absorption, but also provide gas absorption while providing other functions. More specifically, as mentioned above, the encapsulation device has a sealed cavity. That is, the encapsulation device is used to provide encapsulation in the Dewar assembly disclosed in this application. Of course, the encapsulation device can also provide other additional technical effects such as protection. For the sake of brevity, these will not be described in detail here. As for the multiple functional devices, each of them has its own initial function. For example, the substrate 410 can provide mounting for the detector 500, the lead ring 420 can provide power to the detector 500, and the radiation screen 430 is used to provide corresponding light distribution for the detector 500. In this application, by using the functional devices as the carrier of the gas-absorbing structure, the functional devices can form a gas-absorbing structure while providing their original functions, so as to provide the function of absorbing gas.

[0029] It should be noted that among multiple functional devices, each functional device can serve as a support for the suction structure. However, if certain functional devices have specific functions such as electrical connection, they may not be used as support for the suction structure to prevent them from adversely affecting their original function. Simply put, in this application, not all functional devices necessarily need to serve as support for the suction structure.

[0030] When at least one of the encapsulation device and the functional device is used as the carrier, in order to form a gas-absorbing structure, a getter layer needs to be provided on the portion of the carrier surface that communicates with the sealed cavity. This getter layer absorbs the gas within the sealed cavity. In other words, the gas-absorbing structure includes the carrier and the getter layer provided on the portion of the carrier surface that communicates with the sealed cavity. The getter layer 300 is a gas-absorbing material that, when activated, can absorb gas, thereby maintaining a vacuum environment in the corresponding space. More specifically, the getter layer 300 may include materials such as zirconium oxide, zirconium vanadium iron, and titanium zirconium vanadium. It should be noted that the getter layer 300 can be provided on the portion of the inner surface of any of the housing 110, base 120, and cover 210 used to form the sealed cavity. However, to ensure good light transmission of the light-emitting element 220, the surface of the light-emitting element 220 is not provided with the getter layer 300.

[0031] Specifically, the getter layer 300 may be provided only on the portion of the inner surface of the packaged device used to form a sealed cavity. As described above, the packaged device has a sealed cavity, that is, the sealed cavity is surrounded by multiple parts or multiple devices included in the packaged device. Correspondingly, the inner surface of the packaged device necessarily includes a portion for forming a sealed cavity, and for this purpose, the getter layer 300 may be provided on the aforementioned portion.

[0032] Alternatively, the getter layer 300 can be provided only on the portion of the surface of the functional device that communicates with the sealed cavity. As described above, the functional device is installed inside the sealed cavity, and therefore, the surface of the functional device must also include a portion that is directly exposed to the sealed cavity. This portion is the part of the surface of the functional device that communicates with the sealed cavity, and the getter layer 300 can be provided on this portion.

[0033] As described above, a getter layer 300 is provided on the carrier portion. This getter layer 300 can absorb gas, so even if air or other gases enter the sealed cavity of the Dewar assembly as the usage time increases, the getter layer 300 on the carrier portion can absorb the gas, thus maintaining a relatively continuous vacuum environment in the sealed cavity of the Dewar assembly. Alternatively, the getter layer 300 can be provided on both the encapsulation device and the functional device simultaneously, thereby further increasing the area of ​​the getter layer in the Dewar assembly and improving the getter efficiency and getter capacity of the Dewar assembly.

[0034] This application discloses a Dewar assembly, which includes a packaging device and a plurality of functional devices disposed within a sealed cavity of the packaging device. By using one or more of the packaging device and / or the plurality of functional devices as the support portion of the gas-getting structure in the Dewar assembly, and by providing a getter layer 300 on the surface of the support portion in communication with the sealed cavity, even if gas leaks into the Dewar assembly, the getter layer 300 can absorb the gas, thereby ensuring a relatively good continuity of the vacuum environment of the Dewar assembly. Furthermore, as described above, in the technical solutions disclosed in the embodiments of this application, the encapsulation device and each functional device are non-getting dedicated components. By using the encapsulation device and functional devices, which are originally the basic components constituting the Dewar assembly, as the carriers in the getter structure to carry the getter layer, it is no longer necessary to set additional devices in the Dewar assembly to provide a carrier for the getter layer. As a result, the overall size of the Dewar assembly is relatively small, that is, the size of the encapsulation device is smaller. On the one hand, this can reduce the leakage rate of the encapsulation device. On the other hand, it can also make the volume of the sealed cavity relatively small, reducing the difficulty of forming a vacuum environment in the Dewar assembly, thereby improving the vacuum reliability of the Dewar assembly.

[0035] As mentioned above, the getter layer 300 needs to be activated during use, and considering factors such as cost and effectiveness, heating is generally used to activate the getter layer 300. Therefore, before the Dewar assembly is used, the activation process of the getter layer 300 in the Dewar assembly can be directly achieved by heating. Afterwards, the device with the activated getter layer 300 can be assembled into a single unit, or the device with the activated getter layer 300 can be assembled into a packaged device.

[0036] However, as the Dewar assembly is used for an extended period, gas gradually intrudes into the sealed cavity, and the amount of gas absorbed by the getter layer 300 also gradually increases. This can lead to a risk of reduced getter efficiency or even failure of the getter layer. In this case, to extend the lifespan of the Dewar assembly, it is usually necessary to reactivate the getter layer 300 inside the Dewar assembly. During the reactivation process, to reduce workload and prevent damage to the Dewar assembly during disassembly and assembly, a heat source is typically placed outside the Dewar assembly to activate the getter layer 300 located inside the Dewar assembly. Based on this, the getter layer 300 can be placed on the surface of the encapsulation device in the Dewar assembly, and / or on one or more surfaces of the functional device that are relatively close to the encapsulation device, to reduce the difficulty of activating the getter layer 300.

[0037] As described above, the encapsulation device may include a base 120 and a housing 110, with the housing 110 connected to the base 120. More specifically, the functional device may include a cold finger 440, which is located within a sealed cavity and mounted on the base 120. More specifically, the cold finger 440 may be connected to the central region of the substrate 410 of the Dewar assembly, with the portion of the cold finger 440 connected to the substrate 410 forming a cold head 450. In this embodiment, at least a portion of the housing 110 may be disposed around the cold finger 440, and a getter layer 300 may be provided on the inner surface of the housing 110 facing the cold finger 440. In this case, the getter layer 300 disposed on the surface of the housing 110 can be activated by direct heating, which has relatively good activation efficiency and effect. It should be noted that the thickness of the getter layer 300 itself is relatively small, and thus, in a macroscopic sense, the getter layer 300 and the shell 110 can be considered as an integral structure. For ease of description, the shell 110 on which the getter layer 300 is formed will still be regarded as the "shell" in the following text.

[0038] Furthermore, in the design of the housing 110, since no other large-sized devices need to be installed between the housing 110 and the cold finger 440, such as the columnar or tube-shaped suction structure additionally provided to provide suction in the current solution, in this application, the part of the housing 110 surrounding the cold finger 440 can be configured to conform to the shape of the cold finger 440. That is, the shape of the housing 110 and the cold finger 440 is similar. This can minimize the gap between the housing 110 and the cold finger 440, thereby making the volume of the space sandwiched between the housing 110 and the cold finger 440 relatively smaller.

[0039] Simultaneously, the housing 110 and the cold finger 440 are arranged adjacent to each other. Adjacent means that they are spaced apart but do not contact each other, and the gap between them is relatively small. This further reduces the gap between the housing 110 and the cold finger 440, making the volume of the entire sealing cavity smaller, thereby reducing the difficulty of forming a vacuum environment in the Dewar assembly and lowering the leakage rate of the packaged device. Of course, in order to ensure that the cold finger 440 can be properly installed into the housing 110, the housing 110 still needs to reserve an installation gap for the cold finger 440. That is, when the cold finger 440 is installed into the housing 110, there is still a relatively small gap between the two opposing parts. The specific size of the gap can be flexibly determined according to the actual situation, but the size of this gap must be much smaller than the gap between the housing and the cold finger in the current technical solution that requires an additional suction structure.

[0040] In other words, in this embodiment, the portion of the housing 110 surrounding the cold finger 440 and closely adjacent to the cold finger 440 can be configured such that, in the direction perpendicular to the axial direction of the cold finger 440, the gap between the portion of the cold finger 440 directly opposite the housing 110 and the housing 110 is less than 3mm. Furthermore, if the installation accuracy allows, the gap between the cold finger 440 and the housing 110 in the aforementioned direction can be less than 2mm. This prevents the installation of any additional devices between the cold finger and the housing, ensuring a relatively small gap between the cold finger and the housing. Consequently, the volume of the space enclosed by the cold finger and the housing is relatively small. This can significantly reduce the overall volume of the cavity within the Dewar assembly, thereby reducing the difficulty of forming a vacuum environment within the Dewar assembly and decreasing the leakage rate of the Dewar assembly.

[0041] It should be noted that, generally speaking, the cold finger 440 is a cylindrical structure. In this case, the direction perpendicular to the axial direction of the cold finger is the radial direction of the cold finger 440. In addition, the thickness of the getter layer 300 formed on the support portion is usually small, generally less than 1 mm, and can even be less than 2 μm. This can basically ensure that it has the required getter capacity, so that there is at least a greater than 1 mm assembly gap between the getter layer 300 and the cold finger, thereby ensuring that the cold finger 440 can be properly installed into the housing 110 and that the cold finger and the getter layer 300 are spaced apart from each other.

[0042] In order to increase the amount of getter layer 300 provided inside the Dewar assembly, optionally, the inner surface of the enclosure 210 of the encapsulation device is provided with getter layer 300. In this case, the getter layer 300 on the inner surface of the enclosure 210 can also be activated by directly heating outside the Dewar assembly.

[0043] As described above, a getter layer 300 can also be provided on the surface of the functional device. Similar to the housing 110, the functional device with the getter layer 300 will still be referred to as the "functional device" below. Optionally, the functional device includes a radiation screen 430, which is located inside the housing 210, and the outer surface of the radiation screen 430 can be provided with the getter layer 300. Specifically, the outer surface of the radiation screen 430 can include the surface of the radiation screen 430 facing the housing 210. In this case, after the Dewar assembly has been used for a period of time, the getter layer 300 on the outer surface of the radiation screen 430 can be activated by heating directly outside the Dewar assembly, utilizing the effect of heat propagation through radiation, and thus providing the function of absorbing gas.

[0044] Furthermore, in designing the cover 210 of the Dewar assembly, the cover 210 can be contoured to the radiating screen 430, thereby reducing the gap between them and thus decreasing the volume of the space between them. Simultaneously, by designing their dimensions accordingly, they can be positioned adjacent to each other, further reducing the volume of the space between the cover 210 and the radiating screen 430, thereby further reducing the volume of the receiving cavity. This achieves the goal of reducing the difficulty of forming a vacuum environment in the sealed cavity and reducing the leakage rate of the packaged device.

[0045] Similarly, the housing 210 and the radiating screen 430, which are contoured and adjacent to each other, can also be designed in accordance with the description of the housing and the cooling finger in the above embodiments. Specifically, the structure of the housing 210 can be adaptively designed based on the shape of the radiating screen 430, so that after the radiating screen 430 is installed inside the housing 210, there is a relatively small gap between any position on the radiating screen 430 and the corresponding position in the housing 210 along the direction perpendicular to the optical axis of the light-gathering element. This gap can be less than 3mm, and can be further reduced to less than 2mm if the installation accuracy is sufficient. This results in a relatively small volume of the space between the housing 210 and the radiating screen 430, where no other additional devices can be installed, further reducing the overall volume of the receiving cavity. It should be noted that the direction perpendicular to the optical axis of the light-gathering element is the radial direction of the cooling finger.

[0046] With a getter layer 300 provided on the outer surface of the radiation screen 430, a getter layer 300 can be further provided on the inner surface of the radiation screen 430. In this way, during the process of heating the radiation screen 430 by radiation, the getter layers 300 on both the inner and outer surfaces of the radiation screen 430 can be activated simultaneously. This significantly improves the gas absorption capacity within the Dewar assembly without substantially increasing the complexity and time required for the activation process of the getter layer 300.

[0047] As described above, in the Dewar assembly disclosed in this application, at least one of the encapsulation device and the functional device can serve as the carrier of the getter structure, and a getter layer is covered on the surface of the carrier that communicates with the sealed cavity, thereby enabling the getter layers on the surface of the carrier to form a dense film layer, which can specifically be an insulating film. In this case, compared to the carrier, the insulating film is closer to the space inside the encapsulation device; that is, the insulating film can surround the sealed cavity and isolate the carrier and the sealed cavity, thereby preventing gas that may be released from the carrier from entering the sealed cavity from the surface of the carrier communicating with the sealed cavity.

[0048] In other words, when using the above-mentioned technical solution, the getter layer can also be used to cover the surface of the support portion. Therefore, even if there is a microporous structure inside the support portion, the gas within the microporous structure can be suppressed or even prevented from escaping from the surface of the support portion towards the sealing cavity to the outside of the support portion, thus preventing disruption of the vacuum environment inside the sealing cavity, under the action of the insulating membrane. Furthermore, as described above, when the encapsulation device and functional device are used as the support portion of the getter structure in this application, the overall size of the encapsulation device is relatively small. This can significantly reduce the area of ​​the portion of the encapsulation device that communicates with the sealing cavity, thereby reducing the venting source area of ​​the encapsulation device. Therefore, even if the suppressive effect of the getter layer on the gas release effect on the surface of the support portion decreases over time, the amount of gas escaping from the encapsulation device into the sealing cavity is still significantly reduced by decreasing the venting source area, achieving the goal of improving the maintenance time of the vacuum environment of the Dewar assembly.

[0049] As mentioned above, due to current technological limitations, even when using high-strength, hard materials such as metals to form the support component, microporous structures may still exist within the material. Furthermore, during and after the formation of a vacuum environment within the sealed cavity enclosed by the support component, gas inside the material may escape from its surface and enter the sealed cavity, disrupting the vacuum environment. Therefore, when at least a portion of the support component is made of a material capable of releasing gas from its surface, the getter layer 300 can cover the surface of the gas-releasing material that communicates with the sealed cavity.

[0050] Based on the above technical solution, in order to balance the processing difficulty, the getter layer 300 can generally cover the surface of the support part that communicates with the sealing cavity in the material that can release gas on the surface. However, due to the influence of parameters such as the precision of the processing technology, in actual applications, the getter layer 300 may not be able to form a complete and dense film. In other words, there may be small pores in the getter layer 300 that covers the surface of the material that can release gas on the surface that communicates with the sealing cavity. Although the gas released by the material that can release gas on the surface may still be able to enter the sealing cavity through the aforementioned small pores, this technical solution can greatly reduce the difficulty of forming the getter layer 300, significantly reduce the processing cost of the getter layer 300, and thus improve the overall performance of the Dewar assembly.

[0051] As for the gas released by the surface gas-releasing material and entering the sealed cavity through the aforementioned tiny pores, it can be absorbed by the getter layer 300 covering the surface of the surface gas-releasing material. At the same time, since the amount of gas released by the surface gas-releasing material itself is relatively small, and the amount of gas that can enter the sealed cavity through the tiny pores on the getter layer 300 is even smaller, even if the surface gas-releasing material may release gas into the sealed cavity due to the tiny pores on the getter layer 300, it will not have an adverse effect on the stability of the vacuum environment of the sealed cavity. However, when adopting this technical solution, the difficulty of forming the getter layer 300 and the processing cost can be greatly reduced, thus it is also a more preferred technical solution.

[0052] Based on the Dewar component disclosed in any of the above embodiments, this application also discloses a processing method for processing any of the above-described Dewar components. For example... Figure 5 As shown, the processing method includes:

[0053] S1. Remove the oxide layer on the surface of the carrier portion to form a first intermediate component. Specifically, an acidic solution can be used to react with the oxide layer to remove it, and this method is relatively efficient and effective. The specific components of the acidic solution can be determined according to actual needs and are not limited here. Additionally, ultrasound can be used to assist the removal process, thereby separating the substance formed by the reaction between the acidic solution and the oxide layer from the surface of the carrier portion, ensuring complete removal of the oxide layer. The reaction time between the carrier portion and the acidic solution can also be determined according to actual conditions. The carrier portion includes at least one of a packaging device and a functional device.

[0054] After step S1 above, the processing method may further include:

[0055] S2. A passivation layer is formed on the surface of the first intermediate component. Specifically, by immersing the first intermediate component in a passivation solution for a preset time, a passivation layer can be formed on the surface of the first intermediate component, thereby forming the second intermediate component. Specifically, the specific components of the passivation solution can be flexibly selected according to the material of the carrier and other specific circumstances, and this article does not limit them.

[0056] Furthermore, after step S2, the processing method disclosed in this application embodiment may further include:

[0057] S3. A getter layer is formed on the surface of the second intermediate component. Specifically, the method by which the getter layer 300 is formed on the surface of the second intermediate component can be selected based on the specific type of getter layer 300. To improve the film-forming efficiency and stability of the getter layer 300, in a specific embodiment of this application, magnetron sputtering can be used to form the getter layer on the surface of the second intermediate component, thereby forming a getter structure. In addition, in step S3 above, the getter layer can be formed only on the portion of the second intermediate component that communicates with the formed sealing cavity. Considering the processing difficulty, the getter layer can be formed on both the surface of the second intermediate component used to form the sealing cavity and the surface of the portion of the second intermediate component located within the sealing cavity.

[0058] To further improve the adhesion reliability of the getter layer on the surface of the carrier, the processing method of the Dewar assembly disclosed in this application may further include a step of removing process debris and other impurities before step S1. Specifically, process debris on the surface of the carrier can be removed by immersing the workpiece to be coated in an alkaline solution and supplementing it with an ultrasonic cleaning process, thereby improving the surface cleanliness of the carrier. Furthermore, a deionized water cleaning step may be added between steps S1 and S2 to prevent the acidic solution remaining on the surface of the first intermediate part from adversely affecting the passivation process. Of course, the processing of the Dewar assembly includes not only the above steps, but may also include the manufacturing and forming process of the carrier and other components, as well as the assembly process between components, etc. For the sake of brevity, these will not be described in detail here.

[0059] As described above, the carrier portion of the Dewar assembly is provided with a getter layer 300. However, for some devices such as the substrate 410, due to the need for circuit layout or other reasons, it may not be possible to provide a getter layer 300. As described above, even if the device is formed of materials such as metal and its formed state is a solid structure, due to the influence of the material itself, the device may have a microporous structure containing gas inside. Therefore, in order to further reduce the probability of the vacuum environment inside the Dewar assembly being destroyed by the device itself, the processing method disclosed in this application embodiment further includes:

[0060] Before assembling the Dewar assembly, the gas in the non-suction structure, which includes the aforementioned substrate 410, is removed. Specifically, the gas in the non-suction structure can be removed by baking. To prevent damage to the workpiece during the baking process, the baking temperature can be controlled at 80-100°C. By appropriately increasing the baking time, it can also be ensured that the gas in the non-suction structure can escape from the interior of the workpiece.

[0061] After the Dewar assembly is completed, a vacuum pump can be used to evacuate the sealed cavity of the Dewar assembly. A helium mass spectrometer can then be used to detect leaks. Once the leak rate meets the requirements, the getter layer 300 can be activated by heating or other methods, allowing it to function and maintain a reliable vacuum environment within the sealed cavity of the Dewar assembly. Alternatively, after the gas in the non-getting structure has been removed, the Dewar assembly can also be completed in a vacuum environment to prevent gas from re-entering the non-getting structure and other components. In this case, the getter layer 300 is pre-activated before the Dewar assembly is assembled.

[0062] Based on the Dewar assembly disclosed in any of the above embodiments, this application also discloses a detection device, which includes a detector 500 and any of the above Dewar assemblies. Specifically, the detector 500 can be an infrared detector. The detector 500 is disposed in the sealed cavity of the Dewar assembly, and the detector 500 can be mounted on the substrate 410 of the Dewar assembly. The substrate 410 of the Dewar assembly is mounted on the cold finger 440 of the Dewar assembly, and the cold finger 440 can provide a lower temperature environment for the detector 500.

[0063] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0064] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A dewar assembly characterized by, The getter structure comprises a packaging device and a plurality of functional devices, the packaging device has a sealed cavity, the packaging device comprises a base and a shell connected to each other, the plurality of functional devices are installed in the sealed cavity, the packaging device and each of the functional devices are non-gas-absorbing special devices, the packaging device serves as a bearing part of the getter structure, or one or more of the plurality of functional devices serves as a bearing part of the getter structure, and the packaging device serves as a bearing part of the getter structure; The getter structure further comprises a getter layer arranged on a part of the surface of the bearing part in communication with the sealed cavity, and the getter structure absorbs the gas in the sealed cavity by using the getter layer; The functional device comprises a cold finger, the cold finger is installed on the base, at least a part of the shell is arranged outside the cold finger, and the inner surface of the shell towards the cold finger is provided with the getter layer, the part of the shell arranged outside the cold finger is shaped and arranged in close proximity to the cold finger, and in the direction perpendicular to the axial direction of the cold finger, the gap between the part of the cold finger opposite to the shell and the shell is less than 3mm.

2. The dewar assembly of claim 1, wherein, The packaging device comprises a cover and a light inlet piece, one end of the cover is connected to the shell, and the light inlet piece is arranged at the other end of the cover, and the inner surface of the cover is provided with the getter layer.

3. The dewar assembly of claim 1, wherein, The packaging device comprises a cover and a light inlet piece, the functional device comprises a radiation screen, the radiation screen is located on the inner side of the cover, and the outer surface of the radiation screen is provided with the getter layer; The cover is shaped and arranged in close proximity to the radiation screen; The inner surface of the radiation screen is provided with the getter layer.

4. The dewar assembly of claim 1, wherein, The part of the surface of the bearing part in communication with the sealed cavity is covered with the getter layer, and the getter layer surrounds an isolation membrane, which surrounds the sealed cavity and isolates the bearing part and the sealed cavity.

5. The dewar assembly of claim 1, wherein, At least a part of the bearing part is made of a material capable of releasing gas, the getter layer covers the surface of the material capable of releasing gas in communication with the sealed cavity, and the gas released from the surface of the part covered by the getter layer is prevented from entering the sealed cavity.

6. A method of processing a dewar assembly as claimed in any one of claims 1 to 5, wherein, The processing method comprises: Removing the oxide layer on the surface of the bearing part to form a first intermediate part, wherein the bearing part comprises a packaging device, or the bearing part comprises a packaging device and one or more functional devices; Forming a passivation layer on the surface of the first intermediate part to form a second intermediate part; Forming a getter layer on the surface of the second intermediate part to form a getter structure.

7. The method of claim 6, wherein, Forming a getter layer on the surface of the second intermediate part to form a getter structure, specifically: Forming a getter layer on the surface of the second intermediate part to form a getter structure by using a magnetron sputtering method.

8. The method of claim 7, wherein, The Dewar assembly comprises a substrate for installing a detector, and the processing method further comprises: Removing the gas in the non-getter structure before assembling the Dewar assembly, wherein the non-getter structure comprises the substrate.

9. A detection device, characterized in that A Dewar assembly comprising a detector and the substrate of any one of claims 1-5, the substrate and the detector disposed within a sealed cavity of the Dewar assembly, and the detector mounted to the substrate.

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