Hollow glass microsphere foam composite material and preparation method and application thereof

Abstract

The application discloses a hollow glass microsphere foam composite material and a preparation method and application thereof. The composite material comprises the following preparation raw materials: hollow glass microspheres, an adhesive, an additive and a water-based solvent, and the adhesive at least contains polysaccharide biomass. The raw material composition of the hollow glass microspheres as the main body, the adhesive at least polysaccharide biomass, the additive and the water-based solvent is selected, and an environment-friendly composite board is prepared. The weight proportion of the hollow glass microspheres in the board is not less than 80%, and the board has the properties of light weight, high strength, heat insulation, heat preservation, A1-grade fire prevention and A1-grade building material.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of composite materials, in particular to a hollow glass microsphere foam composite material and a preparation method and application thereof. BACKGROUND

[0002] Traditional thermal insulation materials are generally light, loose and porous materials, which can be divided into organic materials and inorganic materials according to their components.

[0003] Organic thermal insulation materials have low thermal conductivity, but are flammable, not fireproof, and pollute the environment. For example, foamed plastics are formed by adding additives to organic high molecular resin as the main material and gas as the filler and then heating and foaming. Although such foamed plastics have good thermal insulation performance, they have poor fire resistance and high temperature resistance, and their production process is not environmentally friendly.

[0004] Although inorganic thermal insulation materials have good fire resistance and flame retardance, their thermal conductivity is relatively large, and their thermal insulation performance is poor. For example, high-end inorganic non-metal thermal insulation boards on the market are mainly sintered from foamed glass and ceramic and hollow glass microspheres. The production process requires powder processing equipment such as presses, dryers and sintering furnaces, which has problems such as large production area, high investment, high energy consumption, high production cost, difficult product quality control and the like.

[0005] How to balance the fire resistance and thermal insulation performance of the material, especially to achieve A1 fire resistance grade, and simplify the preparation process, save energy and protect the environment, has become a technical problem to be solved in the field. SUMMARY

[0006] In order to improve the above technical problems, the present application provides a composite material, the preparation raw material of the composite material comprises the following components: hollow glass microspheres, adhesive, additives and water-based solvent, the adhesive at least contains polysaccharide biomass.

[0007] According to the embodiment of the present application, the true density of the hollow glass microspheres is not more than 0.50 g / cm 3 , for example, 0.15-0.50 g / cm 3 , such as 0.20 g / cm 3 , 0.25 g / cm 3 , 0.30 g / cm 3 .

[0008] According to the embodiment of the present application, the tap density of the hollow glass microspheres is not more than 0.35 g / cm 3 , for example, 0.13 g / cm 3 , 0.15 g / cm 3 , 0.16 g / cm 30.20 g / cm 3 0.25 g / cm 3 .

[0009] According to an embodiment of the present application, the isostatic strength of the hollow glass microspheres is 1.5-50 MPa, for example 2.0 MPa, 2.07 MPa, 2.5 MPa, 2.62 MPa, 3.0 MPa, 3.5 MPa, 5 MPa, 10 MPa, 15 MPa, 20 MPa, 30 MPa, 40 MPa or 50 MPa.

[0010] According to an embodiment of the present application, the thermal conductivity of the hollow glass microspheres is not more than 0.08 W / m·K, for example 0.045 W / m·K, 0.048 W / m·K, 0.05 W / m·K, 0.06 W / m·K or 0.07 W / m·K.

[0011] According to an embodiment of the present application, the preparation raw material contains 40-100 parts by weight of the hollow glass microspheres, for example 45-60 parts, such as 46 parts, 47 parts, 48 parts, 49 parts, 50 parts, 51 parts, 52 parts, 53 parts, 55 parts, 56 parts, 57 parts, 58 parts, 59 parts.

[0012] According to an embodiment of the present application, the composite material is mainly composed of the hollow glass microspheres, in particular, the weight percentage of the hollow glass microspheres in the composite material is not less than 75%, preferably not less than 82%, for example 81%, 83%, 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 95% or even higher.

[0013] According to an embodiment of the present application, the polysaccharide biomass is selected from one or more of cellulose, modified cellulose, chitosan, corn starch, modified starch, soybean starch, oxidized starch and waxy rice starch, for example from one or more of modified cellulose, modified starch and waxy rice starch. Preferably, the modified cellulose is selected from hydroxypropyl methyl cellulose, hydroxymethyl cellulose and / or hydroxypropyl cellulose. Preferably, the modified starch is selected from hydroxymethyl starch and / or hydroxypropyl starch.

[0014] According to an embodiment of the present application, the adhesive can further contain an alkali metal silicate, such as water glass.

[0015] According to an embodiment of the present application, the preparation raw material contains 2-20 parts by weight of the adhesive, for example 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts.

[0016] In some embodiments, the adhesive is only polysaccharide biomass, such as one or more of corn starch, modified starch, soybean starch, oxidized starch, and waxy rice starch;

[0017] In some embodiments, the adhesive is composed of polysaccharide biomass and alkali metal silicate, such as cellulose and / or modified cellulose and alkali metal silicate. Preferably, the weight ratio of polysaccharide biomass to alkali metal silicate is (0.5-2):1, preferably 1:1.

[0018] According to embodiments of the present application, the auxiliary agent can be selected from one or more of corrosion-resistant agents, water-resistant agents, dispersants, and the like.

[0019] According to embodiments of the present application, the preparation raw material contains 0.1-5 parts by weight of auxiliary agent, for example, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 1 part, 1.5 parts, 2 parts, 3 parts, 4 parts.

[0020] According to embodiments of the present application, the corrosion-resistant agent is selected from one or more of calcium oxide, organosilicon, borax, boric acid, ammonium dihydrogen phosphate, urea, and resin, and the like. The addition of corrosion-resistant agent can also improve the water resistance and / or mold resistance of the composite material.

[0021] According to embodiments of the present application, the water-resistant agent is selected from one or more of potassium methyl silicate, sodium methyl silicate, polyvinyl alcohol, acrylate, cyanate (such as isocyanate), egg white, calcium oxide, tung oil, organosilicon, and the like.

[0022] According to embodiments of the present application, the dispersant is selected from one or more of ultra-fine fumed white carbon black and polyhydroxy acid ammonium salt, and the like.

[0023] According to embodiments of the present application, the aqueous solvent is water, a mixture of water and alcohol, the weight percentage of water in the mixture being not less than 95%. The alcohol can be selected from ethanol and / or glycerol.

[0024] According to embodiments of the present application, the water is pure water, deionized water, or clean tap water.

[0025] According to embodiments of the present application, the preparation raw material contains 10-50 parts by weight of aqueous solvent, for example, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts.

[0026] According to an exemplary embodiment of the present application, the composite material comprises the following preparation raw materials in parts by weight: hollow glass microspheres 50 parts, hydroxypropyl starch 1 part, hydroxymethyl starch 1 part, waxy rice starch 4 parts, pure water 20 parts, calcium oxide 0.2 parts, ammonium dihydrogen phosphate 0.2 parts;

[0027] Preferably, the hollow glass microspheres have the following performance parameters: true density 0.2 g / cm 3 , tap density 0.13 g / cm 3 , isostatic strength 3.5 MPa, and thermal conductivity 0.045 W / m·K.

[0028] According to an exemplary embodiment of the present application, the raw materials for preparing the composite material include the following components by weight: 65 parts of hollow glass microspheres, 2 parts of hydroxypropyl starch, 5 parts of waxy rice starch, 20 parts of purified water, 0.1 part of calcium oxide, 0.1 part of sodium dihydrogen phosphate, and 0.1 part of potassium methyl silicate;

[0029] Preferably, the hollow glass microspheres have the following performance parameters: true density 0.25 g / cm 3 , tap density 0.16 g / cm 3 , isostatic strength 5.2 MPa, and thermal conductivity 0.048 W / m·K.

[0030] According to an exemplary embodiment of the present application, the raw materials for preparing the composite material include the following components by weight: 50 parts of hollow glass microspheres, 1 part of hydroxypropyl starch, 1 part of hydroxymethyl starch, 6 parts of waxy rice starch, 20 parts of purified water, 0.1 part of calcium oxide, and 0.2 part of sodium methyl silicate;

[0031] Preferably, the hollow glass microspheres have the following performance parameters: true density 0.2 g / cm 3 , tap density 0.13 g / cm 3 , isostatic strength 3.5 MPa, and thermal conductivity 0.045 W / m·K.

[0032] According to an exemplary embodiment of the present application, the raw materials for preparing the composite material include the following components by weight: 75 parts of hollow glass microspheres, 2 parts of hydroxypropyl starch, 4 parts of waxy rice starch, 20 parts of purified water, 0.1 part of calcium oxide, 0.2 part of isocyanate, and 0.2 part of sodium methyl silicate;

[0033] Preferably, the hollow glass microspheres have the following performance parameters: true density 0.3 g / cm 3 , tap density 0.2 g / cm 3 , isostatic strength 12 MPa, and thermal conductivity 0.06 W / m·K.

[0034] According to an exemplary embodiment of the present application, the raw materials for preparing the composite material include the following components by weight: 50 parts of hollow glass microspheres, 1.5 parts of hydroxypropyl starch, 0.5 part of hydroxymethyl starch, 4 parts of waxy rice starch, 20 parts of purified water, 0.1 part of calcium oxide, 0.1 part of acrylate, 0.3 part of ethanol, and 0.2 part of sodium methyl silicate;

[0035] Preferably, the hollow glass microspheres have the following performance parameters: true density 0.2 g / cm 3 , tap density 0.13 g / cm 3 , isostatic strength 3.5 MPa, and thermal conductivity 0.045 W / m·K.

[0036] According to an exemplary embodiment of the present application, the raw materials for preparing the composite material include the following components by weight: 40 parts of hollow glass microspheres, 4 parts of hydroxypropyl methyl cellulose, 40 parts of purified water, 4 parts of water glass, 0.1 part of calcium oxide, 0.1 part of acrylate, and 0.2 part of sodium methyl silicate.

[0037] Preferably, the hollow glass microspheres have the following performance parameters: true density 0.2 g / cm 3 , tap density 0.13 g / cm 3 , isostatic strength 3.5 MPa, and thermal conductivity 0.045 W / m·K.

[0038] According to an exemplary embodiment of the present application, the raw materials for preparing the composite material include the following components by weight: 60 parts of hollow glass microspheres, 4 parts of hydroxypropyl methyl cellulose, 40 parts of purified water, 4 parts of water glass, 0.1 part of calcium oxide, 0.2 part of isocyanate, and 0.2 part of sodium methyl silicate.

[0039] Preferably, the hollow glass microspheres have the following performance parameters: true density 0.3 g / cm 3 , tap density 0.2 g / cm 3 , isostatic strength 12 MPa, and thermal conductivity 0.06 W / m·K.

[0040] According to an embodiment of the present application, the composite material is a plate, such as an open-closed hole plate. The open hole refers to the pores formed between the hollow glass microspheres and between the hollow glass microspheres and the adhesive. The closed hole refers to the closed hole formed by the hollow structure inside the hollow glass microspheres.

[0041] According to an embodiment of the present application, the composite material has one or more of the following properties, and preferably has all of the following properties:

[0042] (1) The apparent density is not more than 0.21 g / cm 3 , and is preferably 0.14-0.2 g / cm 3 ;

[0043] (2) The true density is not more than 0.25 g / cm 3 , and is preferably 0.19-0.23 g / cm 3 ;

[0044] (3) the compressive strength is not less than 0.1 MPa, for example, 0.6-2.0 MPa;

[0045] (4) the thermal conductivity is not more than 0.06 W / m·K, preferably 0.04-0.05 W / m·K;

[0046] (5) the combustion performance at least meets the A1 level of the combustion performance grade of one of the following national standards: GB / T5464-2010, GB / T14402-2007, GB 8624-2012;

[0047] (6) meets the A1 level of the building material standard of GB / T5464-2010.

[0048] The application also provides a preparation method of the composite material, comprising the following steps: mixing the hollow glass microspheres, the adhesive, the additive and the aqueous solvent to obtain the composite material.

[0049] According to the embodiments of the application, in the preparation method, the hollow glass microspheres, the additive and the aqueous solvent have the selection and the amount as shown above, respectively.

[0050] According to the embodiments of the application, when the adhesive contains one or more of the starch substances such as corn starch, modified starch, soybean starch, oxidized starch and waxy rice starch, the starch substance is first mixed with the aqueous solvent to form a paste.

[0051] According to the embodiments of the application, when the adhesive contains alkali metal silicate, the alkali metal silicate is first mixed with water to form a solution.

[0052] According to some embodiments of the application, the preparation method comprises the following steps: mixing the adhesive with the aqueous solvent to form a paste, and then diluting the paste to obtain a gel; mixing the hollow glass microspheres and the additive with the gel to obtain a composite mortar; and forming the composite mortar and removing the aqueous solvent to obtain the composite material.

[0053] The adhesive is selected from one or more of the starch substances such as corn starch, modified starch, soybean starch, oxidized starch and waxy rice starch.

[0054] According to the embodiments of the application, the dilution is performed by using the aqueous solvent to dilute the concentration of the paste by 2-3 times.

[0055] According to some embodiments of the present application, when the adhesive is composed of alkali metal silicate and cellulose and / or modified cellulose, the preparation method comprises the following steps: mixing alkali metal silicate with water to form an alkali metal silicate solution; mixing hollow glass microspheres, cellulose and / or modified cellulose, and an auxiliary agent to obtain a mixture; mixing the mixture with the alkali metal silicate solution to obtain a composite cement; and shaping the composite cement and removing the aqueous solvent to obtain the composite material.

[0056] According to embodiments of the present application, the temperature for removing the aqueous solvent is less than 100℃, for example, normal temperature dehydration.

[0057] The present application also provides the use of the above-mentioned composite material in the field of fire prevention, heat insulation and / or thermal insulation, preferably as a building material.

[0058] Advantages

[0059] The present application selects a raw material composition with hollow glass microspheres as the main body, an adhesive containing at least polysaccharide biomass, and an auxiliary agent and an aqueous solvent, to prepare an environmentally friendly open-closed hole composite board. The weight proportion of hollow glass microspheres in the board is not less than 80%, and the board has the properties of lightweight, high strength, heat insulation, thermal insulation, A1-grade fire prevention, and A1-grade building material.

[0060] The production process of the composite board of the present application is simplified, and water-based alcohol mixed solvent or pure water solvent is used, which is safe in production and even achieves zero emission of organic solvents. There is no need to use a press and energy-consuming drying equipment and several processes, and dehydration can be completed at low temperature or normal temperature, reducing the temperature resistance requirement of the forming mold. The production site is greatly reduced, the investment cost is reduced, the energy is saved, which is conducive to environmental protection, and the operating cost in the production process is also reduced, thereby having the advantage of low cost, enhancing the market competitiveness of the product. BRIEF DESCRIPTION OF DRAWINGS

[0061] Figure 1 A microstructure diagram of the composite board prepared in Example 1.

[0062] Figure 2 A physical diagram of the composite board prepared in Example 1. DETAILED DESCRIPTION

[0063] The technical solutions of the present application will be further described in detail below in combination with specific embodiments. It should be understood that the following examples are only illustratively described and explained, and should not be interpreted as limiting the scope of protection of the present application. Any technology realized based on the above-mentioned content of the present application is covered within the scope of protection intended by the present application.

[0064] The raw materials and reagents used in the following examples are commercially available or can be prepared by known methods, unless otherwise specified.

[0065] Example 1

[0066] The composite board is made of the following raw materials by weight: 1 part of hydroxypropyl starch, 1 part of hydroxymethyl starch, 4 parts of waxy corn starch, 50 parts of hollow glass microspheres, 20 parts of pure water, 0.2 parts of calcium oxide and 0.2 parts of ammonium dihydrogen phosphate.

[0067] The hollow glass microspheres are high-strength, low-density vitrified hollow glass microspheres.

[0068] (1) True density: 0.2 g / cm 3 ;

[0069] (2) Tap density: 0.13 g / cm 3 ;

[0070] (3) Isostatic strength: 3.5 MPa;

[0071] (4) Thermal conductivity of powder: 0.045 W / m·K.

[0072] The preparation method of the composite board is as follows:

[0073] (1) Hydroxypropyl starch and hydroxymethyl starch and waxy corn starch are gelatinized in an appropriate amount of pure water;

[0074] (2) The gelatinized mixed starch adhesive is diluted with pure water to obtain a starch glue solution;

[0075] (3) The hollow glass microspheres, calcium oxide and ammonium dihydrogen phosphate are uniformly mixed with the starch glue solution to form a composite mortar;

[0076] (4) The composite mortar is introduced into a mold for molding;

[0077] (5) The molded composite mortar is naturally air-dried to obtain a composite board.

[0078] Figure 1 The scanning electron microscope image of the composite board obtained in Example 1 shows that the composite board has a large number of hollow glass microspheres, and the adhesive between the microspheres is relatively small, there are a large number of pores between the microspheres, and the microspheres are point-bonded by the adhesive. Therefore, the thermal conductivity of this kind of composite board is relatively low, and it can achieve A1 grade flame retardation after testing.

[0079] Figure 2 The physical image of the composite board obtained in Example 1 shows that the composite board has a certain strength and a regular shape, and the appearance is white, consistent with the color of the hollow glass microspheres.

[0080] Example 2

[0081] The composite board is made of the following raw materials by weight: hydroxypropyl starch 2 parts, waxy corn starch 5 parts, hollow glass microspheres 65 parts, pure water 20 parts, calcium oxide 0.1 part, sodium dihydrogen phosphate 0.1 part, and potassium methyl silicate 0.1 part.

[0082] The hollow glass microspheres are high-strength, low-density vitrified hollow glass microspheres.

[0083] (1) True density: 0.25 g / cm 3 ;

[0084] (2) Tap density: 0.16 g / cm 3 ;

[0085] (3) Isostatic strength: 5.2 MPa;

[0086] (4) Powder thermal conductivity: 0.048 W / m·K.

[0087] The preparation method of the composite board is as follows:

[0088] (1) Hydroxypropyl starch and waxy corn starch are gelatinized in an appropriate amount of pure water;

[0089] (2) The gelatinized mixed starch adhesive is diluted with pure water to obtain a starch glue solution;

[0090] (3) The hollow glass microspheres, calcium oxide, sodium dihydrogen phosphate, and potassium methyl silicate are uniformly mixed with the starch glue solution to form a composite mortar;

[0091] (4) The composite mortar is introduced into a mold for molding;

[0092] (5) The molded composite mortar is naturally air-dried and dehydrated to obtain the composite board.

[0093] Example 3

[0094] The composite board is made of the following raw materials by weight: hydroxypropyl starch 1 part, hydroxymethyl starch 1 part, waxy corn starch 6 parts, hollow glass microspheres 50 parts, pure water 20 parts, calcium oxide 0.1 part, and sodium methyl silicate 0.2 part.

[0095] The hollow glass microspheres are high-strength, low-density vitrified hollow glass microspheres.

[0096] (1) True density: 0.2 g / cm 3 ;

[0097] (2) Tap density: 0.13 g / cm 3 ;

[0098] (3) Isostatic strength: 3.5 MPa;

[0099] (4) Powder thermal conductivity: 0.045 W / m·K.

[0100] The specific preparation steps of the composite board are as follows:

[0101] (1) Hydroxypropyl starch, hydroxymethyl starch and waxy rice starch are gelatinized in a proper amount of purified water;

[0102] (2) The gelatinized mixed starch adhesive is diluted with purified water to obtain a starch glue solution;

[0103] (3) Hollow glass microspheres, calcium oxide, methyl sodium silicate and the starch glue solution are uniformly mixed into a composite mortar;

[0104] (4) The composite mortar is introduced into a mold for molding;

[0105] (5) The composite mortar is naturally air-dried and dehydrated to obtain a lightweight open-closed hole A-grade fireproof board.

[0106] Example 4

[0107] The composite board is made of the following raw materials by weight: hydroxypropyl starch 2 parts, waxy rice starch 4 parts, hollow glass microspheres 75 parts, purified water 20 parts, calcium oxide 0.1 part, isocyanate 0.2 part, and methyl sodium silicate 0.2 part.

[0108] The inorganic filler is high-strength and low-density vitrified hollow glass microspheres.

[0109] (1) True density: 0.3 g / cm 3 ;

[0110] (2) Tap density: 0.2 g / cm 3 ;

[0111] (3) Isostatic strength: 12 MPa;

[0112] (4) Powder thermal conductivity: 0.06 W / m·K.

[0113] The specific preparation steps of the composite board are as follows:

[0114] (1) Hydroxypropyl starch and waxy rice starch are gelatinized in a proper amount of purified water;

[0115] (2) The gelatinized mixed starch adhesive is diluted with purified water to obtain a starch glue solution;

[0116] (3) Hollow glass microspheres, calcium oxide, isocyanate, methyl sodium silicate and the starch glue solution are uniformly mixed into a composite mortar;

[0117] (4) the composite cement is introduced into a mold to form;

[0118] (5) the formed composite cement is naturally dried to obtain the composite board.

[0119] Example 5

[0120] The composite board is made of the following raw materials by weight: 1.5 parts of hydroxypropyl starch, 0.5 parts of hydroxymethyl starch, 4 parts of waxy rice starch, 50 parts of hollow glass microspheres, 20 parts of pure water, 0.1 parts of calcium oxide, 0.1 parts of acrylate, 0.3 parts of ethanol, and 0.2 parts of sodium methyl silicate.

[0121] The hollow glass microspheres are high-strength and low-density vitrified hollow glass microspheres.

[0122] (1) True density: 0.2 g / cm 3 ;

[0123] (2) Tap density: 0.13 g / cm 3 ;

[0124] (3) Isostatic strength: 3.5 MPa;

[0125] (4) Thermal conductivity of powder: 0.045 W / m·K.

[0126] The specific preparation steps of the composite board are as follows:

[0127] (1) Hydroxypropyl starch, hydroxymethyl starch, and waxy rice starch are gelatinized in an appropriate amount of pure water;

[0128] (2) The gelatinized mixed starch adhesive is diluted with pure water to obtain a starch glue solution;

[0129] (3) The hollow glass microspheres, calcium oxide, acrylate, ethanol, and sodium methyl silicate are uniformly mixed with the starch glue solution to form a composite cement;

[0130] (4) The composite cement is introduced into a mold to form;

[0131] (5) The formed composite cement is naturally dried to obtain the composite board.

[0132] Example 6

[0133] The composite board is made of the following raw materials by weight: 4 parts of hydroxypropyl methyl cellulose, 40 parts of hollow glass microspheres, 40 parts of pure water, 4 parts of water glass (modulus 3.3), 0.1 parts of calcium oxide, 0.1 parts of acrylate, and 0.2 parts of sodium methyl silicate.

[0134] The hollow glass microspheres are high-strength and low-density vitrified hollow glass microspheres.

[0135] (1) True density: 0.2 g / cm 3 ;

[0136] (2) Tap density: 0.13 g / cm 3 ;

[0137] (3) Isostatic strength: 3.5 MPa;

[0138] (4) Powder thermal conductivity: 0.045 W / m·K.

[0139] The specific preparation steps of the composite board are as follows:

[0140] (1) Deionized water and water glass are fully mixed to form a water glass solution;

[0141] (2) Hollow glass microspheres, hydroxypropyl methylcellulose, calcium oxide, acrylate, and sodium methyl silicate are mixed uniformly;

[0142] (3) (1) and (2) are fully mixed into a composite cement;

[0143] (4) The composite cement is filled into a mold and compacted into shape;

[0144] (5) The composite cement is placed in a 100℃ oven for drying to obtain a lightweight open-closed hole A-grade fireproof board.

[0145] Example 7

[0146] The composite board is made from the following raw materials by weight: hydroxypropyl methylcellulose 4 parts, hollow glass microspheres 60 parts, pure water 40 parts, water glass (modulus 3.3) 4 parts, calcium oxide 0.1 part, isocyanate 0.2 part, and sodium methyl silicate 0.2 part.

[0147] Among them, the inorganic filler is high-strength and low-density vitrified hollow glass microspheres.

[0148] (1) True density: 0.3 g / cm 3 ;

[0149] (2) Tap density: 0.2 g / cm 3 ;

[0150] (3) Isostatic strength: 12 MPa;

[0151] (4) Powder thermal conductivity: 0.06 W / m·K.

[0152] The specific preparation steps of the composite board are as follows:

[0153] (1) Deionized water and water glass are fully mixed to form a water glass solution;

[0154] (2) mixing hollow glass microspheres with hydroxypropyl methylcellulose, calcium oxide, isocyanate, and sodium methylsilicate uniformly;

[0155] (3) mixing (1) and (2) to form a composite cement;

[0156] (4) filling the composite cement into a mold and compacting to form;

[0157] (5) drying the composite cement in an oven at 100°C to obtain a lightweight open-closed hole A-level fireproof plate.

[0158] Table 1 shows the test data of the composite plate prepared in Examples 1-7.

[0159] Table 1

[0160]

[0161]

[0162] Note: [1] The initial temperature in the combustion furnace is 750°C, and the final temperature in the furnace is 773°C, 779°C, 772°C, 781°C, and 779°C, respectively, and the average temperature rise of the furnace is 0.4°C.

[0163] The samples of Examples 1-5 meet the A1-level building material detection standard of GB / T 5464-2010. According to the test by the National Supervision and Inspection Center for Quality of Flame Retardant Materials and Products, the average temperature rise of the furnace is 0.4°C, the ignition time is 0 seconds, and the average sample mass loss is 5.85%; which is far lower than the national detection standard for A1-level building materials: the temperature rise of the furnace is ≤30°C, the ignition time is 0 seconds, and the sample mass loss is ≤50%.

[0164] The combustion performance of the samples of Examples 1-5 at least meets the A1-level combustion performance grade of one of the following national standards: GB / T 5464-2010, GB / T 14402-2007, and GB 8624-2012.

[0165] In summary, the present application uses specific hollow glass microspheres, adhesives, additives, solvents, and the raw material composition of the amount thereof, to obtain a lightweight, environmentally friendly, high compressive strength, heat preservation, heat insulation, A1-level fireproof open-closed hole composite plate.

[0166] The embodiments of the present application have been described above. However, the present application is not limited to the above-described embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A panel, characterized in that The raw material for preparing the board comprises the following components: hollow glass microspheres 40-100 parts by weight, adhesive 2-20 parts by weight, auxiliary agent 0.1-5 parts by weight, and aqueous solvent 10-50 parts by weight, wherein the adhesive is polysaccharide biomass; The hollow glass microspheres have a true density of not more than 0.50 g / cm 3 ; The tap density of the hollow glass microspheres is not more than 0.35 g / cm 3 ; The isostatic strength of the hollow glass microspheres is 1.5-50 MPa; The hollow glass microspheres have a thermal conductivity of not more than 0.08 W / m K; The polysaccharide biomass is selected from one or more of cellulose, modified cellulose, chitosan, corn starch, modified starch, soybean starch, oxidized starch, and waxy rice starch.

2. The panel of claim 1, wherein The weight percentage of the hollow glass microspheres in the board is not less than 82%.

3. The panel of claim 1, wherein The auxiliary agent is selected from one or more of corrosion-resistant agent, water-proof agent, and dispersing agent; the aqueous solvent is water or a mixture of water and alcohol, wherein the weight percentage of water in the mixture of water and alcohol is not less than 95%.

4. The panel of claim 3, wherein The corrosion-resistant agent is selected from one or more of calcium oxide, silicone, borax, boric acid, ammonium dihydrogen phosphate, urea, and resin; The water-proof agent is selected from one or more of potassium methylsiliconate, sodium methylsiliconate, polyvinyl alcohol, acrylate, cyanate, egg white, calcium oxide, tung oil, and silicone; The dispersing agent is selected from one or more of ultra-fine fumed silica and polyhydroxy acid ammonium salt.

5. The panel of claim 4, wherein The water is pure water, and the raw materials for preparing the plate material comprise the following components in parts by weight: hollow glass microspheres 50 parts, hydroxypropyl starch 1 part, hydroxymethyl starch 1 part, waxy rice starch 4 parts, pure water 20 parts, calcium oxide 0.2 parts, and ammonium dihydrogen phosphate 0.2 parts; the hollow glass microspheres have the following performance parameters: true density 0.2 g / cm 3 , tap density 0.13 g / cm 3 , isostatic strength 3.5 MPa, and thermal conductivity coefficient 0.045 W / m K. Alternatively, the water is pure water, and the raw materials for preparing the plate material comprise the following components in parts by weight: hollow glass microspheres 65 parts, hydroxypropyl starch 2 parts, waxy rice starch 5 parts, pure water 20 parts, calcium oxide 0.1 part, ammonium dihydrogen phosphate 0.1 part, and potassium methyl silicate 0.1 part; the hollow glass microspheres have the following performance parameters: true density 0.25 g / cm 3 , tap density 0.16 g / cm 3 , isostatic strength 5.2 MPa, and thermal conductivity 0.048 W / m K. Alternatively, the water is pure water, and the raw materials for preparing the plate material include the following components in parts by weight: hollow glass microspheres 50 parts, hydroxypropyl starch 1 part, hydroxymethyl starch 1 part, waxy rice starch 6 parts, pure water 20 parts, calcium oxide 0.1 part, and sodium methyl silicate 0.2 part; the hollow glass microspheres have the following performance parameters: true density 0.2 g / cm 3 , tap density 0.13 g / cm 3 , isostatic strength 3.5 MPa, and thermal conductivity 0.045 W / m K. Alternatively, the water is pure water, and the raw materials for preparing the plate material include the following components in parts by weight: hollow glass microspheres 75 parts, hydroxypropyl starch 2 parts, waxy rice starch 4 parts, pure water 20 parts, calcium oxide 0.1 part, isocyanate 0.2 part, and sodium methylsilicate 0.2 part; the hollow glass microspheres have the following performance parameters: true density 0.3 g / cm 3 , tap density 0.2 g / cm 3 , isostatic strength 12 MPa, and thermal conductivity 0.06 W / m K. Alternatively, the water is pure water, and the raw materials for preparing the plate material include the following components in parts by weight: hollow glass microspheres 50 parts, hydroxypropyl starch 1.5 parts, hydroxymethyl starch 0.5 parts, waxy rice starch 4 parts, pure water 20 parts, calcium oxide 0.1 part, acrylate 0.1 part, ethanol 0.3 part, and sodium methylsilicate 0.2 part; the hollow glass microspheres have the following performance parameters: true density 0.2 g / cm 3 , tap density 0.13 g / cm 3 , isostatic strength 3.5 MPa, and thermal conductivity coefficient 0.045 W / m K.

6. Panel according to any of the claims 1-5, characterized in that The board has the following properties: (1) apparent density not more than 0.21 g / cm3 3 ; (2) true density is not more than 0.25 g / cm 3 ; (3) compressive strength not less than 0.1 MPa; (4) thermal conductivity of not more than 0.06 W / m K; (5) combustion performance at least meeting the A1 level of the combustion performance grade of one of the following national standards: GB / T5464-2010, GB / T14402-2007, and GB 8624-2012; (6) meeting the A1 level of the building material standard of GB / T5464-2010.

7. A method of producing the panel according to any one of claims 1 to 6, characterized in that, The preparation method comprises the following steps: mixing the hollow glass microspheres, polysaccharide biomass, auxiliary agent, and aqueous solvent to obtain the board.

8. The preparation method according to claim 7, characterized in that, When the adhesive contains one or more of corn starch, modified starch, soybean starch, oxidized starch, and waxy rice starch, the starches are first mixed with the aqueous solvent to be gelatinized and diluted to form a gel.

9. Use of the board of any one of claims 1-6 in the field of fire prevention, heat insulation, and / or thermal insulation.

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