A motherboard heat dissipation simulation test platform

Abstract

The application discloses a mainboard heat dissipation simulation test platform and belongs to the technical field of communication equipment. The application comprises a case shell, a cover plate, a simulation heat source, a supporting plate, a heat dissipation plate and a heat conduction pad; the simulation heat source is arranged on the supporting plate, the heat conduction pad covers the simulation heat source and is in contact with the heat dissipation plate or the cover plate, the two sides of a ventilation hole are provided with clamping grooves, the clamping grooves are provided with ventilation hole baffles, the case simulates the shell of a communication equipment and protects the heat source and the supporting plate; the simulation heat source is consistent with the parameters of a main heat source in an electronic equipment and generates heat in the test; the cover plate and the heat dissipation plate provide heat dissipation for the heat source; the heat conduction pad reduces the contact thermal resistance between the heat source and the cover plate and the heat dissipation plate and improves the heat conduction efficiency. The application can effectively simulate the heat dissipation system of the communication equipment, including the processes of heat generation of the heat source, heat conduction and shell heat dissipation; the application has the characteristics of simplicity, effectiveness and low cost and is particularly suitable for the heat dissipation simulation test of the communication equipment in the heat dissipation design stage.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of communication measurement and control, in particular to a mainboard heat dissipation simulation test platform. BACKGROUND

[0002] With the development of electronic equipment towards miniaturization, high power and high integration, the heat flux density increases greatly, and the heat generation per unit volume is increasing. The heat dissipation problem has become a bottleneck restricting the environmental adaptability and reliability of electronic equipment. In high-power equipment, the performance of the equipment is often reduced or even abnormal due to unreasonable heat dissipation design. In the traditional thermal design of electronic equipment, the structure form, heat dissipation mode, fan and heat conduction material model of the equipment are generally determined according to experience, and then the heat dissipation scheme of the equipment is determined, and the simulation is verified. However, many parameters used in calculation and simulation cannot be directly obtained, so the accuracy of the simulation results cannot be guaranteed. When the equipment is developed, the heat dissipation design is unreasonable in the process of environmental test. At this time, the improvement of the heat dissipation system of the equipment will cause waste of resources and delay of progress. Therefore, an electronic equipment heat dissipation system simulation platform is needed to perform heat dissipation simulation test in the heat dissipation design stage of the equipment. SUMMARY

[0003] Therefore, the present application provides a mainboard heat dissipation simulation test platform, which can perform heat dissipation simulation test in the design stage, verify the heat dissipation method of the equipment, and avoid problems in the design stage caused by unreasonable heat dissipation design.

[0004] In order to achieve the above purpose, the technical scheme provided by the present application is as follows:

[0005] A mainboard heat dissipation simulation test platform, comprising a case, a heat dissipation plate 150 and a heat source, the case 110 comprises a cover plate 120 and a case shell 110, the cover plate 120 and the case shell 110 are connected by screws, the case shell 110 comprises four side surfaces and a bottom surface, the heat source is a simulated heat source 130, and the case further comprises a heat conduction pad 160, a temperature measuring probe and a supporting plate 140;

[0006] The simulated heat source 130 is arranged on the upper surface of the supporting plate 140, the heat conduction pad 160 covers the simulated heat source 130, the heat conduction pad 160 is in contact with the heat dissipation plate 150, the temperature measuring probe is clamped between the heat conduction pad 160 and the simulated heat source 130, and the heat dissipation plate 150 and the supporting plate 140 are connected by screws to press and fix the heat conduction pad 160, the temperature measuring probe and the simulated heat source 130;

[0007] The cover plate 120 is provided with a ventilation hole, and the four sides of the case shell 110 are provided with ventilation holes and cable interfaces.

[0008] Further, the ventilation hole baffle 170 is provided with a push-pull groove.

[0009] Further, the lower surface of the heat dissipation plate 150 is provided with a size scale.

[0010] Further, the lower surface of the heat dissipation plate 150 is provided with a boss, and the boss is in contact with the heat-conducting pad 160.

[0011] A mainboard heat dissipation simulation test platform comprises a case and a heat source, the case comprises a cover plate 220 and a case shell 210, the cover plate 220 and the case shell 210 are connected through screws, the case shell 210 comprises four sides and a bottom surface, the upper surface of the cover plate 220 is provided with heat dissipation fins, the heat source is an analog heat source 230, the case is further provided with a heat-conducting pad 260, a temperature measuring probe and a supporting plate 240;

[0012] The analog heat source 230 is arranged on the upper surface of the supporting plate 240, the heat-conducting pad 260 covers the analog heat source 230, the heat-conducting pad 260 is in contact with the lower surface of the cover plate 220, the temperature measuring probe is clamped between the heat-conducting pad 260 and the analog heat source 230, the cover plate 220 and the supporting plate 240 are connected through screws, so that the heat-conducting pad 260, the temperature measuring probe and the analog heat source 230 are pressed and fixed.

[0013] The lower surface of the cover plate 220 is provided with a positioning pin 250, and the supporting plate is provided with a corresponding positioning hole; the lower surface of the supporting plate 240 is provided with a supporting plate handle 280,

[0014] The four sides of the case shell 210 are provided with ventilation holes and cable interfaces, the cable of the temperature measuring probe and the analog heat source 230 is connected to the outside of the case through the cable interface, and the two sides of the ventilation hole are provided with a clamping groove, and the clamping groove is provided with a ventilation hole baffle 270.

[0015] Further, the ventilation hole baffle 270 is provided with a push-pull groove.

[0016] Further, the lower surface of the cover plate 220 is provided with a size scale.

[0017] Further, the lower surface of the cover plate 220 is provided with a boss, and the boss is in contact with the heat-conducting pad 260.

[0018] Due to the adoption of the above scheme, the present application has the following beneficial effects:

[0019] 1. The heat dissipation simulation test platform of the present application uses a simulated heat source instead of a chip, processor, integrated module or other heat generating device, and the platform has low manufacturing cost.

[0020] 2. The present application has wide application range and is suitable for most natural heat dissipation electronic devices.

[0021] 3. The present application performs heat dissipation simulation test in the device design stage, verifies the rationality of the heat dissipation design, can find out the device heat dissipation hidden danger in advance, and reduces the development cost. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a schematic structural view of a mainboard heat dissipation simulation test platform with built-in heat dissipation fins in the embodiment of the present application.

[0023] Figure 2 is a schematic structural view of a mainboard heat dissipation simulation test platform with external heat dissipation fins in the embodiment of the present application.

[0024] Specifically, the reference signs in the figure are as follows:

[0025] 110, case body; 120, cover plate; 130, simulated heat source; 140, supporting plate; 150, heat dissipation plate; 160, heat conduction pad; 170, vent baffle; 210, case body; 220, cover plate; 230, simulated heat source; 240, supporting plate; 250, positioning pin; 260, heat conduction pad; 270, vent baffle. DETAILED DESCRIPTION

[0026] The present application will be further described in detail below in combination with the drawings and specific embodiments.

[0027] A mainboard heat dissipation simulation test platform, as shown in Figure 1 , comprises a case, a heat dissipation plate 150 and a heat source, the case 110 comprises a cover plate 120 and a case body 110, the cover plate 120 and the case body 110 are connected by screws, the case body 110 comprises four sides and a bottom, the heat source is a simulated heat source 130, and the case further comprises a heat conduction pad 160, a temperature measuring probe and a supporting plate 140;

[0028] The simulated heat source 130 is arranged on the upper surface of the supporting plate 140, the heat conduction pad 160 covers the simulated heat source 130, the heat conduction pad 160 is in contact with the heat dissipation plate 150, the temperature measuring probe is clamped between the heat conduction pad 160 and the simulated heat source 130, and the heat dissipation plate 150 and the supporting plate 140 are connected by screws to press and fix the heat conduction pad 160, the temperature measuring probe and the simulated heat source 130.

[0029] The cover plate 120 is provided with a ventilation hole, and the four sides of the cabinet shell 110 are provided with ventilation holes and cable interfaces. The cable of the temperature measuring probe and the simulated heat source 130 is connected to the outside of the cabinet through the cable interface, and the two sides of the ventilation hole are provided with clamping grooves, and the clamping grooves are provided with ventilation hole flaps 170.

[0030] Further, the ventilation hole flap 170 is provided with a push-pull groove.

[0031] Further, the lower surface of the heat dissipation plate 150 is provided with a size scale.

[0032] Further, the lower surface of the heat dissipation plate 150 is provided with a boss, and the boss is in contact with the heat-conducting pad 160.

[0033] A mainboard heat dissipation simulation test platform, as shown in Figure 2 The cabinet includes a cover plate 220 and a cabinet shell 210, and the cover plate 220 and the cabinet shell 210 are connected by screws. The cabinet shell 210 includes four sides and a bottom surface. The upper surface of the cover plate 220 is provided with heat dissipation fins. The heat source is a simulated heat source 230. The cabinet is also provided with a heat-conducting pad 260, a temperature measuring probe, and a supporting plate 240.

[0034] The simulated heat source 230 is arranged on the upper surface of the supporting plate 240, the heat-conducting pad 260 covers the simulated heat source 230, and the heat-conducting pad 260 is in contact with the lower surface of the cover plate 220. The temperature measuring probe is clamped between the heat-conducting pad 260 and the simulated heat source 230. The cover plate 220 and the supporting plate 240 are connected by screws to press and fix the heat-conducting pad 260, the temperature measuring probe, and the simulated heat source 230.

[0035] The lower surface of the cover plate 220 is provided with a positioning pin 250, and the supporting plate is provided with a corresponding positioning hole. The lower surface of the supporting plate 240 is provided with a supporting plate handle 280,

[0036] The four sides of the cabinet shell 210 are provided with ventilation holes and cable interfaces. The cable of the temperature measuring probe and the simulated heat source 230 is connected to the outside of the cabinet through the cable interface, and the two sides of the ventilation hole are provided with clamping grooves, and the clamping grooves are provided with ventilation hole flaps 270.

[0037] Further, the ventilation hole flap 270 is provided with a push-pull groove.

[0038] Further, the lower surface of the cover plate 220 is provided with a size scale.

[0039] Further, the lower surface of the cover plate 220 is provided with a boss, and the boss is in contact with the heat-conducting pad 260.

[0040] Specifically, when the heat of the mainboard is small, the built-in fin mode is adopted, when the heat of the mainboard is high, the external fin mode is adopted, according to the heat source parameters of the electronic mainboard, the size and heat of the heat source are sorted out, and then the corresponding simulated heat source is selected, during testing, the platform is placed in the temperature chamber, the temperature chamber is adjusted to the daily working temperature of the equipment, the temperature measuring probe is connected to the temperature measuring instrument, and after the temperature of the temperature measuring instrument is stable, the temperature of the temperature measuring instrument is recorded.

[0041] If the temperature of the simulated heat source is lower than the allowable working temperature of the corresponding heat source, the heat dissipation scheme is feasible, otherwise, the heat dissipation scheme is not feasible.

[0042] The push-pull groove on the vent baffle makes the vent baffle easy to push and pull during operation, and by pushing and pulling the vent baffle, the simulated platform can have different lengths of vents.

[0043] The size scale on the lower surface of the cover plate and the heat dissipation plate makes the simulated heat source easy to arrange and place.

[0044] In summary, the present application carries out heat dissipation simulation test in the equipment design stage, verifies the rationality of the heat dissipation design, can find out the hidden danger of equipment heat dissipation in advance, and reduces the development cost.

[0045] Finally, it should be noted that: the above only describes the preferred embodiments of the present application, and does not limit the present application, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present application defined by the appended claims should be included in the protection scope of the present application.

Claims

1. A mainboard heat dissipation simulation test platform, comprising a case, a heat dissipation plate (150) and a heat source, the case (110) comprising a cover plate (120) and a case shell (110), the cover plate (120) and the case shell (110) being connected by screws, the case shell (110) comprising four side surfaces and a bottom surface, characterized in that, The heat source is an analog heat source (130), and the cabinet further comprises a heat-conducting pad (160), a temperature measuring probe and a supporting plate (140); The analog heat source (130) is arranged on the upper surface of the supporting plate (140), the heat-conducting pad (160) covers the analog heat source (130), the heat-conducting pad (160) is in contact with the heat-dissipating plate (150), the temperature measuring probe is clamped between the heat-conducting pad (160) and the analog heat source (130), the heat-dissipating plate (150) is connected with the supporting plate (140) through screws, and the heat-conducting pad (160), the temperature measuring probe and the analog heat source (130) are fixed by being pressed; and the lower surface of the heat-dissipating plate (150) is provided with a size scale. The upper surface of the cover plate (120) is provided with a ventilation hole, the four sides of the cabinet shell (110) are provided with ventilation holes and cable interfaces, the cable of the temperature measuring probe and the analog heat source (130) is connected with the outside of the cabinet through the cable interfaces, the two sides of the ventilation hole are provided with clamping grooves, the clamping grooves are provided with ventilation hole baffles (170), and the ventilation hole baffles (170) are provided with push-pull grooves.

2. The motherboard heat dissipation simulation test platform according to claim 1, wherein, The lower surface of the heat-dissipating plate (150) is provided with a convex table, and the convex table is in contact with the heat-conducting pad (160).

3. A mainboard heat dissipation simulation test platform, comprising a case and a heat source, the case comprising a cover plate (220) and a case shell (210), the cover plate (220) and the case shell (210) being connected by screws, the case shell (210) comprising four side surfaces and a bottom surface, characterized in that, The upper surface of the cover plate (220) is provided with heat-dissipating fins, the heat source is an analog heat source (230), and the cabinet further comprises a heat-conducting pad (260), a temperature measuring probe and a supporting plate (240); The analog heat source (230) is arranged on the upper surface of the supporting plate (240), the heat-conducting pad (260) covers the analog heat source (230), the heat-conducting pad (260) is in contact with the lower surface of the cover plate (220), the temperature measuring probe is clamped between the heat-conducting pad (260) and the analog heat source (230), the cover plate (220) is connected with the supporting plate (240) through screws, and the heat-conducting pad (260), the temperature measuring probe and the analog heat source (230) are fixed by being pressed; and the lower surface of the cover plate (220) is provided with a size scale. The lower surface of the cover plate (220) is provided with a positioning pin (250), and the supporting plate is provided with a corresponding positioning hole; the lower surface of the supporting plate (240) is provided with a supporting plate handle (280), The four sides of the cabinet shell (210) are provided with ventilation holes and cable interfaces, the cable of the temperature measuring probe and the analog heat source (230) is connected with the outside of the cabinet through the cable interfaces, the two sides of the ventilation hole are provided with clamping grooves, the clamping grooves are provided with ventilation hole baffles (270), and the ventilation hole baffles (270) are provided with push-pull grooves.

4. The motherboard heat dissipation simulation test platform according to claim 3, characterized in that, The lower surface of the cover plate (220) is provided with a convex table, and the convex table is in contact with the heat-conducting pad (260).

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