Loadport apparatus, system and method for manufacturing electronic devices

Abstract

An electronic device manufacturing system includes a factory interface having a load port. The load port may include a faceplate having a back surface. The back surface may have a groove extending along an outer portion of the faceplate. The groove may include a neck region and a flared base region. The neck region may have a rectangular cross-section extending to the flared base region. A bulb-shaped seal or a rectangular seal may be positioned in the groove and may be configured to seal the interface between the load port and the factory interface. Methods of assembling a factory interface for an electronic device manufacturing system, as well as other aspects, are also provided.

Description

[0001] This application is a divisional application of the invention patent application with application date of November 9, 2017, application number 201780068408.4, and invention name “Loading port equipment, system and method for manufacturing electronic devices”.

[0002] Related applications

[0003] This application claims priority to U.S. non-provisional patent application Ser. No. 15 / 348,961, filed on Nov. 10, 2016, entitled “ELECTRONIC DEVICE MANUFACTURING LOAD PORT APPARATUS, SYSTEMS, AND METHODS” (Attorney Docket No. 24538-03 / USA), which is hereby incorporated by reference in its entirety for all purposes. Technical Field

[0004] The present disclosure relates to the manufacture of electronic devices, and more particularly to factory interface loadport seals. Background Art

[0005] Substrate processing in semiconductor electronic device manufacturing is typically accomplished by multiple processing tools, with substrates traveling between processing tools in substrate carriers (e.g., Front Opening Unified Pods or FOUPs). The substrate carriers may be docked to loading ports of a factory interface, such as an Equipment Front End Module or EFEM. The factory interface may include a robotic substrate handling device operable to transfer substrates between the substrate carriers and the processing tools. An environmentally controlled atmosphere may be provided within and between the substrate carriers and the factory interface, and within and between the factory interface and the processing tools. Poor control of various environmental factors (e.g., humidity, temperature, oxygen, and / or levels of contaminants / particles) may adversely affect substrate properties and substrate processing. Existing electronic device manufacturing systems may therefore benefit from improved environmental control at the factory interface.

[0006] Thus, improved electronic device manufacturing loadport apparatus, systems, and methods are desired. Summary of the Invention

[0007] According to a first aspect, a load port is provided that is configured to interface with a substrate carrier and a factory interface of an electronic device manufacturing system. The load port includes a faceplate configured to couple to a front side of a housing of the factory interface. The faceplate has a back surface that faces the front side of the housing of the factory interface. The back surface has a groove that extends along an outer portion of the faceplate, the groove including a neck region and a flared base region. The neck region has a rectangular cross-section that extends to the flared base region. The load port also includes a seal disposed in the groove. When the faceplate is coupled to the front side, the seal is configured to engage the front side of the housing of the factory interface.

[0008] According to a second aspect, an electronic device manufacturing system is provided. The electronic device manufacturing system includes a substrate processing tool and a factory interface. The factory interface includes a housing having a front side and a rear side. The front side has a front side opening, and the rear side is coupled to the substrate processing tool. The factory interface also includes a loading port, which is constructed to dock with a substrate carrier. The loading port includes a panel that is coupled to the front side of the factory interface housing at the front side opening of the housing. The panel has a back surface that faces the front side of the housing. The back surface has a groove that extends along an outer portion of the panel. The groove includes a neck area and an outward-flared base area. The neck area has a rectangular cross-section that extends to the outward-flared base area. The loading port also includes a seal that is disposed in the groove. When the panel is coupled to the front side, the seal is constructed to engage the front side of the housing.

[0009] According to a third aspect, a method for assembling a factory interface for an electronic device manufacturing system is provided. The method includes the steps of providing a load port configured to interface with a substrate carrier, the load port including a faceplate having a back surface. The method also includes the steps of providing a groove in the back surface of the faceplate, the groove extending along an outer portion of the faceplate. The groove includes a neck region and a flared base region. The neck region has a rectangular cross-section extending to the flared base region. The method also includes the steps of placing a seal in the groove.

[0010] Other aspects, features and advantages of these and other embodiments according to the present disclosure may be apparent from the following detailed description, the appended claims and the accompanying drawings.Accordingly, the drawings and description herein should be considered illustrative in nature and not restrictive. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described below are for illustration purposes only and are not necessarily drawn to scale. The drawings are not intended to limit the scope of the present disclosure in any way.

[0012] Figure 1A side schematic diagram of an electronic device manufacturing system according to an embodiment of the present disclosure is shown.

[0013] Figure 2 Depicted is a front perspective view of a loadport according to an embodiment of the present disclosure.

[0014] Figure 3 Depicted is a simplified rear view of a loadport according to an embodiment of the present disclosure.

[0015] Figure 4A The embodiment according to the present disclosure is shown along Figure 3 A partial cross-sectional view of a seal taken along section line 4A-4A, the seal being located in a groove in a panel of a load port.

[0016] Figure 4B The embodiment according to the present disclosure is shown Figure 4A Cross-sectional view of the seal.

[0017] Figure 4C The embodiment according to the present disclosure is shown Figure 4A Partial cross-sectional view of the groove.

[0018] Figure 4D The embodiment according to the present disclosure is shown Figure 4A A partial cross-sectional view of a seal and groove, wherein the front side of the factory interface engages the seal.

[0019] Figure 5 The embodiment according to the present disclosure is shown Figure 4A A partial cross-sectional view of a replacement seal and groove, wherein the front side of the factory interface engages the replacement seal.

[0020] Figure 6 A method of assembling a factory interface for an electronic device manufacturing system according to an embodiment of the present disclosure is depicted. DETAILED DESCRIPTION

[0021] Reference will now be made in detail to example embodiments of the present disclosure, which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.

[0022] Electronic device manufacturing may involve maintaining and / or providing a controlled environment between various components (e.g., substrate carriers, load ports, factory interfaces, and processing tools) in order to reduce undesirable humidity, temperature, oxygen, and / or contaminant / particle levels that may adversely affect substrate properties and / or substrate processing. The interfaces between components may include various seals. For example, during maintenance procedures and / or level or position adjustments of one component relative to another, some of these seals may be subjected to horizontal and / or vertical component displacement under compression. Such component displacement may damage the seal and / or cause the seal to tear and / or become detached from its component, which may adversely affect its sealing function.

[0023] In one aspect, an electronic device manufacturing system according to one or more embodiments of the present disclosure includes an improved loading port seal. The improved loading port seal in some embodiments may take the form of a groove of a particular shape and / or size that extends along an outer portion of the back surface of the panel of the loading port. The back surface may be constructed to interface with the front side of the factory interface. A seal of a particular shape, size and / or material according to one or more embodiments may be placed in the groove. The configuration of the groove and seal described herein may reduce or eliminate the possibility of the seal being damaged, torn and / or falling off during component displacement. The configuration of the groove and seal described herein may also have other advantages, such as ease of installation and removal, and effective sealing under non-uniform compression.

[0024] Further details of example embodiments depicting and describing improved load port seals, as well as other aspects including methods of assembling a factory interface for an electronic device manufacturing system, are provided below in conjunction with Figures 1 to 6 Explain in more detail.

[0025] Figure 1 A schematic side view of an electronic device manufacturing system 100 is shown in accordance with one or more embodiments. The electronic device manufacturing system 100 may include a substrate carrier 102, a load port 104, a factory interface 106, and a substrate processing tool 108. The load port 104 may be coupled to the factory interface 106, which may be coupled to the substrate processing tool 108. In some embodiments, equipment within and / or coupled to the electronic device manufacturing system 100 (e.g., gas supply lines, vacuum pumps, etc. (not shown)) may place one or more of the substrate carrier 102, the load port 104, the factory interface 106, and the substrate processing tool 108 in an environmentally controlled atmosphere (e.g., in a non-reactive and / or inert gas environment, under vacuum, or the like), depending on the open or closed state of a door, door opener, gate / slit valve, or similar mechanism at its interface.

[0026] The substrate carrier 102 can be configured to carry one or more substrates. The substrate can be any suitable article used to manufacture electronic devices or circuit components, such as a silicon-containing disk or wafer, a patterned wafer, a glass plate, or the like. In some embodiments, the substrate carrier 102 can be, for example, a front-opening wafer unpacking unit (FOUP) and can include a carrier door 110.

[0027] The load port 104 can be configured to receive a substrate carrier 102 thereon. The load port 104 can have a panel 112 having a panel opening 114 configured to receive a carrier door 110 therein. The load port 104 can also have a carrier door opener 116 configured to contact (i.e., for example, latch to or otherwise attach to) the carrier door 110 and open the carrier door 110 to allow substrates to be transferred into and out of the substrate carrier 102. In some embodiments, the carrier door opener 116 can contact the carrier door 110, move the carrier door 110 inward (i.e., as shown in FIG. 1 ). Figure 1 The panel 112 is then cleared (rightward as shown) sufficiently, and the carrier door 110 is then moved downward to provide access to the substrate carrier 102.

[0028] The factory interface 106 can be any suitable enclosure having a housing 117 with a front side 118, a rear side 120, a top 122, a bottom 124, and two sidewalls (not separately shown). The front side 118 can have one or more front side openings 126 configured to receive and couple to corresponding loadports 104. The factory interface 106 can include a robotic substrate handler (not shown) configured to transfer substrates from the substrate carrier 102 through the factory interface 106 to the substrate processing tool 108.

[0029] The substrate processing tool 108 may perform one or more processes on one or more substrates, such as physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, pre-cleaning, metal or metal oxide removal, or the like. Other processes may be performed on the substrates therein. The substrate processing tool 108 may include one or more load lock chambers, a transfer chamber, and one or more processing chambers (none shown). The one or more load lock chambers may be coupled to the factory interface 106, and the transfer chamber may be coupled to the one or more load lock chambers and to the one or more processing chambers. A robotic substrate handling device of the factory interface 106 may transfer substrates into and out of the one or more load lock chambers. The substrate processing tool 108 may include a transfer robot (not shown) that is at least partially housed within the transfer chamber. The transfer robot may be configured to transfer substrates to and from the one or more load lock chambers and the one or more processing chambers.

[0030] Figure 2 A front perspective view of a load port 204 is depicted, according to one or more embodiments. In some embodiments, the load port 204 can be the same as or similar to the load port 104. The load port 204 can include a faceplate 212 having a faceplate opening 214. The load port 204 can also include a carrier door opener 216 that seals the faceplate opening 214 when the carrier door opener 216 is closed against the faceplate 212. The carrier door opener 216 can have one or more connectors 228 configured to contact and attach to the carrier door 110 of the substrate carrier 102. The connectors 228 can be, for example, suction-type devices, vacuum devices, etc. Other suitable types of connector devices capable of attaching to the carrier door 110 can be used. A mounting platform 230 can be provided that extends outwardly from the faceplate 212. The mounting platform 230 can be configured to receive the substrate carrier 102 thereon. Various mechanisms (not shown) may be included on and / or around the mounting table 230 to lock the substrate carrier 102 into place on the mounting table 230. The load port 204 may also include a lower portion 232 that may house an open / close mechanism ( Figure 2 Not shown), the opening / closing mechanism is coupled to the carrier door opener 216. In some embodiments, the opening / closing mechanism can attach the carrier door opener 216 to the carrier door 110 and open the carrier door 110, as described above in conjunction with Figure 1 described.

[0031] Figure 3A rear view of a load port 304 is depicted according to one or more embodiments. In some embodiments, the load port 304 can be the same or similar to the load ports 104 and / or 204. The load port 304 can include a panel 312 and a carrier door opener 316 that seals the panel opening when the carrier door opener 316 is closed against the panel 312. Figure 3 The loading port 304 may also include an opening / closing mechanism 334 (not shown in FIG. Figure 3 Partially shown in FIG), the opening / closing mechanism 334 can open and close the carrier door opener 316, as described above in conjunction with Figure 1 and / or Figure 2 The panel 312 may have a back surface 336 having a groove 338 extending around an outer portion and / or perimeter of the panel 312. In some embodiments, the groove 338 may be approximately 1.5 mm to 5.0 mm from the outer portion of the panel 312 and may be approximately 20 mm to 25 mm from the top and / or bottom edge of the panel 312. Other groove locations may be used. When the load port 304 is coupled to the factory interface, the back surface 336 may face the front side of the factory interface, for example, the front side 118 ( Figure 1 ). A seal 340 can be disposed in the groove 338. The seal 340 can seal the interface between the load port 304 and the factory interface (eg, the factory interface 106) when the load port 304 and the factory interface are coupled together.

[0032] Figure 4A A seal 440 is depicted in accordance with one or more embodiments, positioned within a groove 438 of the back surface 436 of the loadport panel 412. In some embodiments, the groove 438 may be aligned with the Figure 3 The groove 338 is the same or similar to the groove 338, and in some embodiments, the seal 440 can be the same as the groove 338. Figure 3 In one or more embodiments, the seal 440 may be made of EPDM (ethylene propylene diene monomer) foam material, and the seal 440 may have an uncompressed rectangular cross-sectional shape before being inserted into the groove 438, such as Figure 4B In some embodiments, the seal 440 may have an uncompressed height H1 of about 9.9 mm to 12.1 mm and an uncompressed width W1 of about 4.5 mm to 5.5 mm. The seal 440 may have a height-to-width ratio of about 2.0 to 2.4. When the seal 440 is located in the groove 438 ( Figure 4A), the seal 440 may have an uncompressed height H2 above the groove of about 6.1 mm to 7.5 mm in some embodiments, and an insertion height H3 of about 3.8 mm to 4.6 mm. In one or more embodiments, the seal 440 may have an uncompressed height H1 of about 10.5 mm to 11.5 mm and an uncompressed width W1 of about 4.7 mm to 5.2 mm. The seal 440 may have a height to width ratio in the range of about 2.1 to 2.3. When the seal 440 is located in the groove 438 ( Figure 4A ), the seal 440 may, in some embodiments, have an uncompressed height H2 above the groove of approximately 6.5 mm to 7.1 mm and an insertion height H3 of approximately 4.0 mm to 4.4 mm. The seal 440 disposed in the groove 438 may have a maximum insertion height H3 that ranges from approximately 35% to 40% of the height H1 of the seal 440.

[0033] Figure 4CGroove 438 is shown without seal 440 disposed therein. In some embodiments, groove 438 may have a depth D1 ranging from approximately 3.8 mm to 4.6 mm, and in some embodiments, depth D1 may be from approximately 4.0 mm to approximately 4.4 mm. Groove 438 may have a neck region 442 and a flared base region 444. Neck region 442 may have a rectangular cross-section extending to flared base region 444. In some embodiments, neck region 442 may have a width W2 of approximately 3.2 mm to 3.8 mm and a depth D2 of approximately 1.8 mm to 2.2 mm. In some embodiments, neck region 442 may have a width W2 of approximately 3.3 mm to 3.7 mm and a depth D2 of approximately 1.9 mm to 2.1 mm. In some embodiments, flared base region 444 may have a width W3 of approximately 5.0 mm to 6.1 mm and a depth D3 of approximately 2.0 mm to 2.4 mm. In some embodiments, the flared base region 444 may have a width W3 of approximately 5.3 mm to 5.9 mm and a depth D3 of approximately 2.1 mm to 2.3 mm. In one or more embodiments, the ratio of the groove depth D1 to the neck region depth D2 may be approximately 1.8 to 2.2, the ratio of the flared base region width W3 to the neck region width W2 may be approximately 1.4 to 1.8, and / or the ratio of the groove depth D1 to the neck region width W2 may be approximately 1 to 1.35. In some embodiments, the ratio of the groove depth D1 to the neck region depth D2 may be approximately 1.9 to 2.1, the ratio of the flared base region width W3 to the neck region width W2 may be approximately 1.5 to 1.7, and / or the ratio of the groove depth D1 to the neck region width W2 may be approximately 1.1 to 1.3. In some embodiments, the flared base region 444 may have a sidewall angle A1 ranging from approximately 30 degrees to 35 degrees. Sidewall angles exceeding 35 degrees may reduce the effectiveness of groove 338 in retaining seal 440 during side loading. Other suitable groove sizes and / or ratios may be used.

[0034] Back to Figure 4A In some embodiments, when seal 440 is seated in groove 438, neck region 442 can be configured to compress the rectangular cross-section of seal 440 in neck region 442 by approximately 27% to 33%, and in some embodiments by approximately 28% to 31%, as indicated by arrow 446. In some embodiments, this neck compression, combined with a ratio of groove depth D1 to neck region width W2 in the range of approximately 1.1 to 1.3, can provide a favorable compromise between seal retention within groove 438 and ease of installation / removal of seal 440. Other suitable compression amounts / ratios can be used.

[0035] The configuration of the groove 338 and seal 440 can advantageously allow seal 440 to expand outward into the flared base region 444. This expansion can push against the walls of the flared base region 444 and help maintain seal 440 in place. During vertical and horizontal shear loading, the walls of the neck region 442 can provide better support for seal 440 than other known grooves having only rectangular cross-sections, typical dovetail cross-sections, and / or combined rectangular-dovetail cross-sections. For example, a vertical shear load on a seal in a groove having only a rectangular cross-section can create a spring effect in the seal, causing the seal to exit the groove when the horizontal shear force is removed. Similarly, a horizontal shear load on a seal in a groove having a typical dovetail cross-section can cause the seal to pinch and fold, allowing it to eject from the groove. In some embodiments, the portion of seal 440 that extends to the exterior of the groove 338 can have a greater width than the portion of seal 440 located within the groove 338.

[0036] Figure 4D The compression of seal 440 is shown when the loadport of panel 412 is coupled to a factory interface having a front side 418 of the factory interface housing. As shown, when the loadport is coupled to the factory interface, seal 440 may engage front side 418 and, in some embodiments, may be compressed by approximately 31% to 38%, and in some embodiments, by approximately 33% to 36%. In some embodiments, seal 440 may have a compressed height above the groove CH2 of approximately 2.7 mm to 3.3 mm, and in some embodiments, approximately 2.8 mm to 3.1 mm. In some embodiments, the height above the groove CH2 of seal 440 may be configured to be compressed by approximately 50% to 60%, and in some embodiments, by approximately 52% to 57%, upon engagement with front side 418. Other suitable compression amounts / ratios may be used.

[0037] Figure 5An alternative seal 540 is depicted, positioned within the groove 438 of the panel 412. As shown, the alternative seal 540 can be compressed by engaging the front side 518 of the factory interface housing. The alternative seal 540 can be a bulb-shaped seal having retaining fingers 548 (only two are labeled). Other numbers of retaining fingers can be used. The retaining fingers 548 can be positioned within the groove 438. In some embodiments, the alternative seal 540 can be an extruded FKM (fluoroelastomer) bulb-shaped seal having retaining fingers. In some embodiments, the alternative seal 540 can have an uncompressed outer diameter (OD) of approximately 8.2 mm to 10 mm, an uncompressed inner diameter (ID) of approximately 6.2 mm to 7.6 mm, an uncompressed length of approximately 12.3 mm to 15 mm, a finger width (FW) of approximately 3.7 mm to 4.5 mm, and / or a finger thickness (FT) of approximately 0.9 mm to 1.1 mm. In some embodiments, the alternative seal 540 may have an uncompressed outer diameter OD of approximately 8.6 mm to 9.6 mm, an uncompressed inner diameter ID of approximately 6.5 mm to 7.2 mm, an uncompressed length of approximately 13 mm to 14.4 mm, a finger width FW of approximately 3.9 mm to 4.3 mm, and / or a finger thickness FT of approximately 0.95 mm to 1.05 mm. In some embodiments, the alternative seal 540 may be slightly better than the seal 440 in terms of sealing ability, but may have a higher cost.

[0038] The configuration of the groove 438 and the seals 440 and / or 540 can advantageously provide an effective seal even when the compression of the seals 440 and / or 540 is uneven. That is, despite the uneven compression of the seals 440 and / or 540, the seals 440 and / or 540 maintain an appropriate level of environmental isolation between the factory interface and the loadport / substrate carrier (e.g., an environmental seal that reduces and / or prevents room air, oxygen, etc. from entering the factory interface through the loadport / factory interface seal location, such that room air, oxygen, etc. can be maintained below a predetermined level within the factory interface). For example, to flatten some loadports, when the loadport is coupled to the factory interface, more seal compression may occur at the top of the loadport faceplate than at the bottom of the loadport faceplate (or vice versa). In some embodiments, approximately 55% to 65% of the seal compression may occur at the top of the faceplate (e.g., at the coupling of the loadport and the factory interface), while 25% to 35% of the seal compression may occur at the bottom of the faceplate. Similarly, uneven seal compression may occur between the left and right sides of a panel coupled to a load port of a factory interface. The grooves and seals described herein can advantageously provide effective sealing in these situations.

[0039] Figure 6A method 600 for assembling a factory interface for an electronic device manufacturing system is shown according to one or more embodiments. At process block 602, the method 600 may include providing a load port configured to interface with a substrate carrier, the load port including a faceplate having a back surface. For example, referring to Figure 3 A load port 304 may be provided that is configured to interface with a substrate carrier, such as the substrate carrier 102 ( Figure 1 The loadport 304 may have a faceplate 312 with a back surface 336 .

[0040] At process block 604, the back surface of the panel may be provided with a groove extending along an outer portion of the panel, the groove including a neck region and a flared base region, the neck region having a rectangular cross-section extending to the flared base region. Figure 4A and Figure 4C As shown, for example, the back surface 436 may have a groove 438 including a neck region 442 and a flared base region 444 , where the neck region 442 has a rectangular cross-section that extends into the flared base region 444 .

[0041] And at process block 606, method 600 may include the step of placing a seal in the groove. For example, seal 440 may be placed in groove 438, as shown in FIG. Figure 4A shown.

[0042] The above description discloses only example embodiments of the present disclosure. Modifications of the devices, systems, and methods disclosed above may fall within the scope of protection of the present disclosure. Therefore, although example embodiments of the present disclosure have been disclosed, it should be understood that other embodiments may fall within the scope of protection of the present disclosure, as determined by the appended claims.

Claims

1. A loading port comprising: a panel including a back surface configured to face a front side of a housing of a factory interface of an electronic device manufacturing system, wherein the panel has a panel opening for allowing a substrate to be transferred therethrough, wherein a slot formed in the back surface extends along an outer portion of the panel, and wherein the slot includes a flared base region and a neck region having a rectangular cross-section extending to the flared base region; as well as a seal at least partially disposed in the groove formed in the back surface of the load port, the seal being configured to engage the front side of the housing of the factory interface in response to the panel being coupled to the front side of the housing, wherein, when the seal is disposed in the groove, a width of a portion of the seal located outside of the groove is wider than a width of a portion of the seal proximate the neck region.

2. The loadport of claim 1, wherein the slot extends along an outer perimeter of the panel. 3 . The loadport of claim 1 , wherein the seal has a rectangular cross-section prior to being seated in the groove.

4. The loadport of claim 1 , wherein the seal comprises ethylene propylene diene monomer (EPDM) foam.

5. The loadport of claim 1 , wherein the seal comprises an extruded bulb seal comprising: a bulb portion configured to be disposed between the back surface of the loadport and the front side of the housing of the factory interface; as well as A retaining finger is disposed in the slot.

6. The loadport of claim 1, the seal comprising fluoroelastomer (FKM).

7. The loadport of claim 1, wherein the seal is configured to maintain environmental isolation between the factory interface and the loadport in response to uneven compression of the seal against the front side of the housing.

8. A factory interface of an electronic device manufacturing system, the factory interface comprising: a housing having a front side and a rear side, the rear side of the housing being configured to couple to a load lock of a substrate processing tool coupled to the factory interface; as well as A loading port, the loading port comprising: a panel including a back surface configured to face the front side of the housing, wherein a groove formed in the back surface extends along an outer portion of the panel, and wherein the groove includes a flared base region and a neck region having a rectangular cross-section extending to the flared base region; and a seal at least partially disposed in the groove formed in the back surface of the load port, the seal being configured to engage the front side of the housing of the factory interface in response to the panel being coupled to the front side of the housing, wherein, when the seal is disposed in the groove, a width of a portion of the seal located outside of the groove is wider than a width of a portion of the seal proximate the neck region.

9. The factory interface of claim 8, wherein the slot extends along an outer perimeter of the panel.

10. The factory interface of claim 8, wherein the seal has a rectangular cross-section prior to being seated in the groove.

11. The factory interface of claim 8, wherein the seal comprises ethylene propylene diene monomer (EPDM) foam.

12. The factory interface of claim 8, wherein the seal comprises an extruded bulb seal comprising: a bulb portion configured to be disposed between the back surface of the loadport and the front side of the housing of the factory interface; as well as A retaining finger is disposed in the slot.

13. The factory interface of claim 8, wherein the seal comprises fluoroelastomer (FKM).

14. The factory interface of claim 8, wherein the seal is configured to maintain environmental isolation between the factory interface and the loadport in response to uneven compression of the seal against the front side of the housing.

15. A method of assembling a factory interface for an electronic device manufacturing system, the method comprising the steps of: coupling a faceplate of a loadport to a front side of a housing of a factory interface, wherein a load lock of a substrate processing tool coupled to the factory interface is configured to couple to a rear side of the housing of the factory interface, wherein the faceplate includes a back surface configured to face the front side of the housing, wherein a slot formed in the back surface extends along an exterior portion of the faceplate, and wherein the slot includes a flared base region and a neck region having a rectangular cross-section extending to the flared base region; as well as In response to coupling the panel to the front side of the housing, a seal at least partially disposed in the groove formed in the back surface of the loading port is engaged with the front side of the housing of the factory interface, wherein, when the seal is disposed in the groove, a width of a portion of the seal located outside the groove is wider than a width of a portion of the seal proximate the neck region.

16. The method of claim 15, wherein the groove extends along the outer periphery of the panel.

17. The method of claim 15, wherein the seal has a rectangular cross-section prior to being positioned in the groove.

18. The method of claim 15, wherein the seal comprises an extruded bulb seal comprising: a bulb portion configured to be disposed between the back surface of the loadport and the front side of the housing of the factory interface; as well as A retaining finger is disposed in the slot.

19. The method of claim 15, wherein the seal comprises at least one of ethylene propylene diene monomer (EPDM) foam or fluoroelastomer (FKM).

20. The method of claim 15, wherein the seal is configured to maintain environmental isolation between the factory interface and the loadport in response to uneven compression of the seal against the front side of the housing.

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