A heater and a preparation method thereof, and a smoking set

Abstract

The application provides a heater, a preparation method of the heater and a smoking set. The heater is used for heating an aerosol forming substrate, volatilizing at least one component in the aerosol forming substrate and forming an aerosol for a user to smoke. The heater comprises a substrate and a heating film. The heating film is covered on the surface of the substrate. The material of the heating film is one or more of iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, titanium, titanium alloy, aluminum and aluminum alloy. The thickness of the heating film is 0.01-5 microns. The heating film can heat the aerosol forming substrate through the combination of infrared radiation and contact heat conduction, so that the heating film is electrified and generates heat to promote the decomposition of the aerosol forming substrate. The heating film is prepared based on the overall inventive concept of preparing a thin film structure of a base metal or a base metal alloy. The heating film can completely cover the substrate, the heating is uniform, the infrared radiation emissivity can be reduced, and the heat loss can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of smoking sets, and in particular to a heater, a preparation method thereof, and a smoking set. BACKGROUND

[0002] At present, with the rapid development of heating non-combustion aerosol generating devices, the heater becomes a core component, determining the overall design and performance quality level of the aerosol generating device. The working temperature of the existing heating non-combustion electronic cigarette is about 300℃, which can effectively avoid various harmful substances generated under the condition of ordinary cigarette ignition, has the advantages of no tar, no ash, no open flame, etc., and is recognized by consumers. The core components of the heating non-combustion electronic cigarette are battery, main board, heater and other three components.

[0003] In the prior art, an oxide, a nitride, or a noble metal and an alloy material are usually used to manufacture a heating body or a heating wire. The above-mentioned technology has high infrared radiation emissivity and high heat loss. In the prior art, a base metal is also used to manufacture a heating body thick film. However, the heating body thick film manufactured by using the base metal has a large thickness and small resistance. The heating body thick film cannot completely cover the base material, and part of the resistance is exposed, resulting in uneven heating. SUMMARY

[0004] The present application provides a heater and a preparation method thereof smoking set. By arranging a heating film with a thickness of 0.01 μm to 5 μm on the surface of a base material, and using a combined heating mode of auxiliary infrared radiation and direct contact conduction heating, the problems of uneven heating of the heater and incomplete coverage of the base material are solved. At the same time, the infrared radiation emissivity of the heater is reduced, and the heat loss is reduced.

[0005] In a first aspect, the present application provides a heater for heating an aerosol-forming substrate and volatilizing at least one component in the aerosol-forming substrate to form an aerosol for a user to smoke, the heater comprising:

[0006] a base body;

[0007] a heating film arranged on the surface of the base body, the heating film being made of one or more of iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, titanium, titanium alloy, aluminum, and aluminum alloy, and having a thickness of 0.01 μm to 5 μm;

[0008] The heating film can heat the aerosol-forming substrate by a combined mode of infrared radiation and contact heat conduction.

[0009] In a possible design, the heating power of the heating film by infrared radiation is less than the heating power of the heating film by contact heat conduction.

[0010] In a possible design, the infrared emissivity of the heating film is less than 30%.

[0011] In a possible design, the resistivity p of the heating film satisfies: 1E-7 Ω·m≤p≤1E-5 Ω·m.

[0012] In a possible design, the square resistance Rsq of the heating film satisfies: 0.5 Ω / sq≤Rsq≤10 Ω / sq.

[0013] In a possible design, the heater further includes a protective film, and the protective film is made of one of a metal, an alloy, a conductive nitride and a conductive oxide.

[0014] In a possible design, the protective film is made of one or more of silver, a silver alloy, platinum, a platinum alloy, titanium nitride, doped indium oxide, doped zinc oxide, silicon oxide and aluminum oxide.

[0015] In a possible design, the thickness of the protective film is 0.005 μm to 0.5 μm; and / or the overall infrared emissivity of the heating film and the protective film is less than 30%.

[0016] In a possible design, the heater further includes an electrode film, and the electrode film is electrically connected to the heating film.

[0017] In a possible design, the electrode film is made of one or more of iron, nickel, chromium, titanium, aluminum, gold, silver, platinum and titanium nitride; and / or the square resistance of the electrode film is less than or equal to 0.01 Ω / sq.

[0018] In a possible design, the number of the electrode films is at least two, and when the number of the electrode films is greater than or equal to three, the electrode films are alternately arranged along the axial direction of the substrate, and adjacent electrode films are respectively connected to the positive and negative poles of a power supply.

[0019] In a possible design, the electrode film is an electrode film group, the electrode film group includes a positive electrode film and a negative electrode film, and the positive electrode film and the negative electrode film are respectively connected to the positive and negative poles of a power supply.

[0020] The number of the electrode film groups is one or more, and when the number of the electrode film groups is more than one, the positive electrode films and the negative electrode films are alternately arranged along the circumferential direction of the substrate.

[0021] In a possible design, the electrode film is an electrode film group, the electrode film group includes a body portion extending along the axial direction of the substrate, and the body portion includes a first body portion in contact with the outer surface of the heating film and a second body portion in contact with the outer surface of the substrate.

[0022] The second body part is provided with a connecting part extending along the circumference of the base body at one end away from the first body part, and the electrode film group is connected with the power supply through the connecting part.

[0023] In a second aspect, the application provides a preparation method of a heater, comprising the following steps:

[0024] providing a base body;

[0025] forming a heating film on the surface of the base body, the material of the heating film being one or more of iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, titanium, titanium alloy, aluminum and aluminum alloy, and the thickness of the heating film being 0.01-5 μm;

[0026] The heating film can heat the aerosol forming substrate by a combination of infrared radiation and contact heat conduction, and volatilize at least one component in the aerosol forming substrate to form an aerosol for a user to smoke.

[0027] In a possible design, after the heating film is formed on the surface of the base body, the method further comprises forming a protective film on the surface of the heating film, the material of the protective film being one of metal, alloy, conductive nitride and conductive oxide.

[0028] In a third aspect, the application provides a smoking set, which comprises the heater according to the first aspect or the heater prepared by the preparation method according to the second aspect.

[0029] The technical solution provided by the application has at least the following beneficial effects:

[0030] In the application, the heating film is prepared based on the overall inventive concept of preparing a thin film structure of base metal or base metal alloy. When the thickness of the heating film is 0.01-5 μm, the heating film made of base metal or base metal alloy has few or even no defects such as loose pores, so that the crystal grains formed by metal elements in the heating film are small and uniform, which can completely cover the base body, ensuring uniform heating in use and improving the overall uniformity of the heating film. Moreover, the heating film of the application is thin, has small resistance and low heat loss. At the same time, the heating film of the application has both infrared radiation and contact heat conduction, which reduces the energy loss caused by too high infrared emissivity of the heating film during operation, thereby improving the energy utilization rate of the heating film, reducing the power consumption of the heating film for heating the aerosol forming substrate, improving the available time of the power supply, and further improving the endurance of the smoking set. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0032] Figure 1 A structural schematic diagram of a heater provided by the present application, wherein the number of electrode films is two;

[0033] Figure 2 A front view of Figure 1

[0034] Figure 3 A structural schematic diagram of a heater provided by the present application, wherein the number of electrode films is three;

[0035] Figure 4 A front view of Figure 3

[0036] Figure 5 A structural schematic diagram of another heater provided by the present application;

[0037] Figure 6 A top view of Figure 5

[0038] Figure 7 A top view of Figure 5

[0039] Figure 8 A preparation flow chart of the heater of the present application.

[0040] The drawings are identified as follows:

[0041] 1 - base body;

[0042] 2 - heating film;

[0043] 3 - electrode film;

[0044] 31 - positive electrode film;

[0045] 32 - negative electrode film;

[0046] 33 - body part;

[0047] 331 - first body part;

[0048] 332 - second body part;

[0049] 34 - connecting part. DETAILED DESCRIPTION

[0050] ​​​​In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application and not to limit the present application.

[0051] In the description of the present specification, unless explicitly defined and limited, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance; unless otherwise specified or stated, the term "multiple" means two or more; the terms "connection", "fixation" and the like should be understood in a broad sense, for example, "connection" can be fixed connection or detachable connection, or integral connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium.

[0052] For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0053] In the description of the present specification, it should be understood that the "upper", "lower" and the like described in the embodiments of the present application are described from the angle shown in the drawings, and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when referring to an element connected to another element "on" or "below", it can be directly connected to another element "on" or "below", or indirectly connected to another element "on" or "below" through an intermediate element.

[0054] The present application provides a smoking set, which comprises a shell and a heater mounted on the shell, and the heater is connected with a power supply. When the smoking set is in a working state, the heater can heat an aerosol-forming substrate placed in the shell, so that at least one component in the aerosol-forming substrate volatilizes into an aerosol for a user to smoke.

[0055] Specifically, as shown in Figure 1 The heater comprises a base body 1, a heating film 2 arranged on the outer surface of the base body 1, and an electrode film 3 arranged on the outer surface of the base body 1 and / or arranged on the outer surface of the heating film 2. During the working process of the heater, the heating film 2 is connected with the power supply through the electrode film 3.

[0056] In the present application, the base body 1 constitutes a bearing of the heater, for loading the heating film 2. The base body 1 is a circumferential body structure, for example, the base body 1 is a hollow cylindrical structure, and the hollow structure of the base body 1 forms a cavity for accommodating the aerosol-forming substrate, i.e. a cylindrical hole penetrating through the middle part of the base body 1. The heater of the present application generates heat through the circumferential body structure itself, thereby realizing heating of the aerosol-forming substrate and ensuring uniformity of the heating temperature distribution and high efficiency of the generated aerosol.

[0057] In the present application, the heating film 2 loaded on the base body 1 generates heat by the principle of resistance heating, and is used to provide heat for the heater. The heating film 2 is formed on the entire surface of the base body 1, so that the entire heater can uniformly heat, avoiding local overheating.

[0058] Specifically, the material of the heating film 2 used in the present application is one or more of iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, titanium, titanium alloy, aluminum and aluminum alloy. The thickness of the heating film 2 is 0.01 μm-5 μm. The present application is based on the preparation of a thin film structure of a base metal or a base metal alloy as a whole inventive concept. When the thickness of the heating film is 0.01 μm-5 μm, the heating film made of a base metal or a base metal alloy has few or even no defects such as loose pores in the interior, so that the crystal grains formed by the metal elements in the heating film are small and uniform, which can completely cover the base body, and can ensure uniform heating in use, thereby improving the overall uniformity of the heating film. Moreover, the heating film of the present application is thin, has small resistance, and has low heat loss. In addition, the heating film uses a combination of infrared radiation and contact heat conduction to heat the aerosol-forming substrate, so that the heating film 2 is powered on and generates heat to promote the decomposition of the aerosol-forming substrate. The heating heater of the present application uniformly heats and can completely cover the base material while reducing the infrared radiation emissivity and reducing heat loss.

[0059] It can be understood that the heating film 2 can be single-layer, and the material of the heating film 2 can be a single material or a composite material formed by two or more materials. When the heating film 2 is prepared by using a composite material, the mixing method and mixing ratio of various materials are not specially limited in the present application, and can be flexibly adjusted according to actual production needs and use needs, so as to increase the flexibility of the material selection of the heating film 2, thereby achieving the purposes of reducing the production cost of the heating film 2 and simplifying the manufacturing process of the heating film 2. Optionally, the heating film 2 can also be a laminated structure, for example, the heating film 2 is a laminated titanium film and aluminum film, and of course other materials can also be selected. The present application does not make any limitation here, and only needs to control the thickness of the heating film 2 within 0.01 μm-5 μm.

[0060] In the present application, compared with the heating film 2 only having one heating form of infrared radiation, the heating film 2 heats the aerosol-forming substrate by a combination of infrared radiation heating and contact heat conduction, thereby reducing the energy loss of the heating film 2 due to the too high infrared emissivity during the working process, improving the energy utilization rate of the heating film 2, reducing the power consumption of the heating film 2 for heating the aerosol-forming substrate, thereby improving the available time of the power supply, and further improving the endurance of the smoking set.

[0061] In the present application, the infrared radiation heating power of the heating film 2 is less than the contact heat conduction heating power of the heating film 2, which not only meets the heating efficiency of the heating film, but also further reduces the energy loss of the infrared radiation of the heating film, thereby improving the energy utilization rate of the heating film 2, reducing the power consumption of the power supply consumed by the heating film 2 for heating the aerosol forming substrate, thereby prolonging the use time of the power supply, and further improving the endurance of the smoking set.

[0062] In the present application, the thickness of the heating film 2 can be specifically 0.01 μm, 0.05 μm, 0.1 μm, 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm, 3 μm, 4 μm and 5 μm, etc., which is not limited herein. If the thickness of the heating film 2 is greater than 5 μm, the difference in thermal expansion rate is large, the film layer is easy to fall off, and the resistance is too small to achieve the required resistance. If the thickness of the heating film 2 is less than 0.01 μm, the thickness is easy to be uneven, and it is easy to burn out in use. Controlling the thickness of the heating film 2 to be 0.01 μm to 5 μm can improve the overall uniformity of the heating film 2 while having lower heat loss.

[0063] In the present application, the infrared emissivity of the heating film 2 is less than 30%, which can be specifically 10%, 13%, 15%, 20%, 22%, 26% and 28%, etc., which is not limited herein. The infrared heating rate of the heating film 2 in the present application is small, which can reduce the energy loss of the heating film 2 due to the too high infrared emissivity during work.

[0064] In the present application, the resistivity p of the heating film 2 needs to meet: 1E-7 Ω·m≤p≤1E-5 Ω·m, and the resistivity of the heating film 2 can be specifically 1E-7 Ω·m, 5E-7 Ω·m, 1E-6 Ω·m, 3E-6 Ω·m, 8E-6 Ω·m and 1E-5 Ω·m, etc., which is not limited herein. Controlling the resistivity of the heating film 2 within the above range can facilitate the selection of the material of the heating film 2, increase the selection range and flexibility of the material of the heating film 2, and improve the working performance and stability of the heating film 2.

[0065] In the present application, the square resistance Rsq of the heating film 2 needs to meet: 0.5 Ω / sq≤Rsq≤10 Ω / sq. If the square resistance Rsq of the heating film 2 is less than 0.5 Ω / sq, the processing precision of the heating film 2 is increased, thereby increasing the processing cost of the heating film 2; if the square resistance Rsq of the heating film 2 is greater than 10 Ω / sq, the infrared emissivity of the heating film 2 is large, thereby increasing the energy loss of the heating film 2 during work. Therefore, 0.5 Ω / sq≤Rsq≤10 Ω / sq can reduce the energy loss of the heating film 2, and at the same time, can reduce the processing cost of the heating film 2.

[0066] Further, in order to avoid oxidation of the heating film 2 during use, at least one protective film (not shown in the drawings) is formed on the heating film 2.

[0067] The protective film can be divided into conductive protective film and non-conductive protective film according to the conductive performance, the conductive protective film includes one or more of silver, silver alloy, platinum, platinum alloy, titanium nitride, doped indium oxide and doped zinc oxide, and the non-conductive protective film includes one or more of silicon oxide and aluminum oxide, wherein the doping elements in the doped indium oxide and the doped zinc oxide in the conductive protective film include one or more of Sn, W, Zr, Mo, Al, Ce and Hf, and the conductive performance of the protective film can be realized by controlling the concentration of the doping elements. Preferably, the material of the protective film of the present application is one or more of doped tin indium oxide and doped aluminum zinc oxide, wherein the mixing ratio of the doped tin indium oxide (ITO) is 90% In2O3 and 10% SnO2, and the mixing ratio of the doped aluminum zinc oxide (AZO) is 95% ZnO and 5% Al2O3. The protective film with the above-mentioned material can further reduce the infrared heating rate of the heating film 2, improve the oxidation resistance of the heating film 2, and reduce the energy loss during the heating process of the heating film 2.

[0068] The present application selects the protective film with the above-mentioned material and combines the heating film 2 and the protective film, which is beneficial to prepare a heater with low resistance and long service life. Specifically, for the heating film made of base metal materials such as iron, nickel, chromium, titanium and aluminum, oxidation will occur when it is exposed to oxygen and electrolyte (i.e. moisture or water in the atmosphere), and metal oxide is generated on the surface of the metal, thereby reducing the heating effect. Therefore, a conductive protective film made of silver alloy, platinum alloy, titanium nitride, doped indium oxide and doped zinc oxide can be formed on the surface of the heating film, which can improve the oxidation resistance of the heating film and the conductive performance of the heating film, thereby further reducing the infrared emissivity. A non-conductive protective film made of silicon oxide and aluminum oxide can also be formed on the surface of the heating film to improve the oxidation resistance of the heating film. Of course, for the heating film made of base metal alloy materials such as iron alloy, nickel alloy, chromium alloy, titanium alloy and aluminum alloy, the addition of different metals in the material of the heating film makes some alloys have certain oxidation resistance, and some alloys have weak oxidation resistance. The heating film can also be oxidized during use, and the oxidation resistance of the heating film 2 can be further improved by adding a protective film. Therefore, the present application combines the heating film made of the above-mentioned base metal or alloy material with low resistivity and the protective film, which can reduce the resistivity of the heating film 2, so that the heater can uniformly heat, reduce the infrared emissivity and have strong oxidation resistance, thereby improving the efficiency of the heater and prolonging the service life of the heater.

[0069] In the present application, the thickness of the protective film is 0.005-0.5 μm, and can be 0.005, 0.01, 0.02, 0.05, 0.08, 0.1, 0.2, 0.3, 0.4, 0.5 μm, etc. If the thickness of the protective film is greater than 0.5 μm, the production cost is high; if the thickness of the protective film is less than 0.005 μm, the film layer is too thin to protect the heating film 2.

[0070] It should be noted that the protective film can only cover the heating film 2 on the surface of the substrate 1, or can cover the entire substrate 1.

[0071] In the present application, the heating film 2 and the protective film are formed on the surface of the substrate 1 along the radial direction of the substrate 1, and specifically, the heating film 2 and the protective film can be formed on the outer surface of the substrate 1, or can be formed on the inner surface of the substrate 1. Preferably, the heating film 2 is formed on the outer surface of the substrate, and then the protective film is formed on the outer surface of the heating film 2, thereby obtaining a heater.

[0072] In the present application, the overall infrared heating rate of the heating film 2 and the protective film is less than 30%, and optionally, the overall infrared heating rate of the heating film 2 and the protective film can be 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 24%, 26%, 28%, 29%, etc. When the protective film and the heating film 2 are attached together on the surface of the substrate 1, the infrared emissivity of the heater can be significantly reduced, so that the heater has a lower heat damage when uniformly heated, thereby improving the heating efficiency of the heating body.

[0073] The electrode film 3 of the present application can be radially arranged, or can be circumferentially arranged, and specifically:

[0074] As shown in Figures 1-4 , the electrode film 3 extends along the circumference of the substrate 1, and the projection shape of the electrode film 3 along the axial direction of the substrate 1 is annular, so as to facilitate the processing of the electrode film 3. The number of electrode films 3 is at least two, as shown in Figure 1 and Figure 2 When the number of electrode films 3 is two, the electrode films 3 are located at both ends of the heating film 2 along the axial direction of the substrate 1, and the electrode films 3 are attached to the outer surface of the substrate 1, and / or the electrode films 3 are attached to the outer surface of the heating film 2; as shown in Figure 3 and Figure 4As shown, when the number of electrode films 3 is greater than or equal to three (hereinafter, the number of electrode films 3 is taken as three as an example), along the axial direction of the base body 1, two electrode films 3 are located at both ends of the heating film 2, and one electrode film 3 is located at the middle of the heating film 2, that is, the three electrode films 3 are uniformly distributed on the outer surface of the electrode film 3, the two electrode films 3 located at both ends of the heating film 2 are connected with the positive electrode of the power supply to form a positive electrode film, and the electrode film 3 located at the middle of the heating film 2 is connected with the negative electrode of the power supply to form a negative electrode film (or, the two electrode films 3 located at both ends of the heating film 2 are connected with the negative electrode of the power supply to form a negative electrode film, and the electrode film 3 located at the middle of the heating film 2 is connected with the positive electrode of the power supply to form a positive electrode film), at this time, the heating film 2 is divided into two parts in parallel to each other by the above-mentioned positive electrode film and negative electrode film. Among them, along the axial direction of the base body 1, the electrode films 3 are uniformly distributed, so that the heat generated between the parts of the heating film 2 in parallel to each other is the same, thereby enabling the heater to uniformly heat the aerosol forming substrate, and further improving the working performance of the heater.

[0075] As shown in Figures 5-6 , the electrode film 3 is an electrode film group, the electrode film group is composed of one positive electrode film 31 and one negative electrode film 32, and the positive electrode film 31 and the negative electrode film 32 have the same structure, taking the positive electrode film 31 as an example, as shown in Figure 6 , the positive electrode film 31 includes a body part 33 extending along the axial direction of the base body 1, the body part 33 includes a first body part 331 and a second body part 332, the first body part 331 is attached to the outer surface of the heating film 2, the second body part 332 is attached to the outer surface of the base body 1, and the end of the second body part 332 away from the first body part 331 is provided with a connecting part 34 extending along the circumferential direction of the base body 1, the positive electrode film 31 is connected with the power supply through the connecting part 34 to increase the connectable area of the positive electrode film 31, thereby increasing the stability of the connection between the positive electrode film 31 and the power supply, and improving the working stability of the positive electrode film 31. Specifically, the projection shape of the positive electrode film 31 along the direction perpendicular to the outer surface of the base body 1 can be L-shaped, L-shaped, etc., and the specific structure and shape of the positive electrode film 31 are not specially limited in the present application.

[0076] Among them, the number of electrode film groups can be one or more, when the number of electrode film groups is one, as shown in Figure 5 , the positive electrode film 31 and the negative electrode film 32 are uniformly distributed along the circumferential direction of the base body 1 and are distributed on both sides of the base body 1, and the heating film 2 is divided into two parts in parallel to each other by the positive electrode film 31 and the negative electrode film 32. When the number of electrode film groups is more than one, taking the number of electrode film groups as two as an example, as shown in Figure 7As shown, the positive electrode film 31 and the negative electrode film 32 are alternately arranged along the circumference of the base 1, and the positive electrode film 31 and the negative electrode film 32 are uniformly distributed along the axis of the base 1, at this time, the heating film 2 is divided into four parts in parallel by two positive electrode films 31 and two negative electrode films 32. Among them, the uniform distribution of the positive electrode film 31 and the negative electrode film 32 makes the heat generated between each part of the heating film 2 in parallel the same, so that the heater can uniformly heat the aerosol forming substrate, thereby improving the working performance of the heater.

[0077] In addition, the material of the positive electrode film 31 can be one of gold (Au), silver (Ag), platinum (Pt), and tin (TiN), the material of the negative electrode film 32 can be one of gold (Au), silver (Ag), platinum (Pt), and tin (TiN), and the material of the positive electrode film 31 and the material of the negative electrode film 32 can be the same or different, so as to increase the flexibility of the material of the positive electrode film 31 and the negative electrode film 32, thereby facilitating the replacement of damaged positive electrode film 31 and negative electrode film 32. At the same time, the sheet resistance of the positive electrode film 31 and the negative electrode film 32 needs to be less than or equal to 0.01 Ω / sq, which can be 0.0001 Ω / sq, 0.0005 Ω / sq, 0.001 Ω / sq, 0.005 Ω / sq, 0.003 Ω / sq and 0.01 Ω / sq, etc., so as to reduce the infrared emissivity of the positive electrode film 31 and the negative electrode film 32, thereby further reducing the energy loss of the heater.

[0078] In actual application process, after the electrode film 3 is connected to the positive electrode and the negative electrode of the power supply, the heater generates heat, and the generated heat is transmitted to the aerosol generating device through the base, thereby generating aerosol simulating smoke.

[0079] Since the electrode film 3 and the heating film 2 are both conductive materials, the base 1 needs to be made of insulating material to avoid short circuit of the heating film 2 caused by the electrode film 3 of the base 1, thereby improving the working stability of the heating film 2, and further improving the working stability of the heater.

[0080] In the present application, the material of the base 1 includes but is not limited to glass, ceramic, etc.

[0081] In addition, the material of the substrate 1 can be one or more of alumina, zirconia, iron-chromium-aluminum alloy, nickel-chromium alloy, nickel metal, and titanium metal. The above-mentioned conductive material has the characteristics of high temperature resistance, stable physical and chemical properties at high temperature, and no harmful substance release at high temperature. The material of the substrate can be determined according to actual needs, and is not limited herein. It should be noted that when the substrate is a conductive substrate, an insulating film needs to be prepared on the outer surface of the conductive substrate during use to avoid the influence of the conductive performance of the conductive substrate on the use of the heating film. Specifically, the insulating film can be an organic insulating film and an inorganic insulating film, wherein the inorganic insulating film includes at least one of a silicon dioxide insulating film, a silicon nitride insulating film, an aluminum oxide insulating film, and an aluminum nitride insulating film, and the organic insulating film includes at least one of a polyimide insulating film, a polyvinylidene fluoride insulating film, and a polytetrafluoroethylene insulating film. In some embodiments, a slurry containing an organic insulating material can be coated on the surface of the conductive substrate, and then dried.

[0082] In the present application, the inner surface and / or the outer surface of the substrate 1 is provided with a mirror surface, and the roughness of the inner surface and / or the outer surface of the substrate 1 is less than or equal to 0.16 μm, and can be 0.05 μm, 0.08 μm, 0.1 μm, 0.12 μm, 0.13 μm, 0.14 μm, 0.15 μm, and 0.16 μm, and the like, and is not limited herein.

[0083] The present application can further reduce the infrared emissivity of the heating film 2 by providing a substrate of a conductive material with a certain roughness.

[0084] In a second aspect, the present application provides a preparation method of a heater, including the following steps:

[0085] Step S100, providing a substrate 1;

[0086] Step S1200, forming a heating film 2 on the surface of the substrate 1, the material of the heating film 2 is one or more of iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, titanium, titanium alloy, aluminum, and aluminum alloy, the thickness of the heating film 2 is 0.01 μm-5 μm, and the heating film 2 can heat the aerosol forming substrate by a combination of infrared radiation and contact heat conduction.

[0087] In the above scheme, the preparation method of the heater is simple, can realize uniform heating while reducing the infrared emissivity of the heater, thereby improving the emission efficiency and prolonging the service life of the heater.

[0088] The preparation method of the present application will be described in detail below according to specific steps.

[0089] Step S100, providing a circumferential body substrate 1, and cleaning and drying the circumferential body substrate 1.

[0090] In the above steps, the cleaning and drying of the substrate 1 can enhance the bonding force between the subsequently prepared heating film 2 and the substrate 1, prevent the heating film 2 from falling off during use, and enhance the service life of the heater.

[0091] In step S200, the circumferential body substrate 1 is subjected to a film plating treatment to form a heating film 2 on the surface of the substrate 1, wherein the heating film 2 is made of one or more of iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, titanium, titanium alloy, aluminum, and aluminum alloy, and the thickness of the heating film 2 is 0.01 μm to 5 μm.

[0092] As an optional technical solution of the present application, when the substrate is a conductive substrate, an insulating film needs to be prepared on the outer surface of the conductive substrate before step 200, so as to avoid the influence of the conductive performance of the conductive substrate on the use of the heating film. Specifically, the insulating film can be an organic insulating film and an inorganic insulating film, wherein the inorganic insulating film includes at least one of a silicon dioxide insulating film, a silicon nitride insulating film, an aluminum oxide insulating film, and an aluminum nitride insulating film, and the organic insulating film includes at least one of a polyimide insulating film, a polyvinylidene fluoride insulating film, and a polytetrafluoroethylene insulating film. The material of the insulating film can be selected according to actual needs, which is not limited herein.

[0093] As an optional technical solution of the present application, the heating film is formed by at least one of a physical vapor deposition process, a chemical plating process, or an electroplating process in a vacuum environment and a protective atmosphere.

[0094] The thickness of the heating film 2 can be specifically 0.01 μm, 0.05 μm, 0.1 μm, 0.2 μm, 0.5 μm, 0.8 μm, 1 μm, 2 μm, 3 μm, 4 μm, and 5 μm, which is not limited herein. When the thickness of the heating film 2 is greater than 5 μm, the difference in thermal expansion rate is large, the film layer is prone to fall off, and the resistance is too small to achieve the required resistance. When the thickness of the heating film 2 is less than 0.01 μm, the thickness is prone to be uneven, and the heating film 2 is prone to be burned out during use. The thickness of the heating film 2 is preferably 0.01 μm to 5 μm, which can improve the overall uniformity of the heating film 2 while having a lower heat loss.

[0095] The infrared emissivity of the heating film 2 is less than 30%, which can be specifically 10%, 13%, 15%, 20%, 22%, 26%, and 28%, which is not limited herein. The infrared emissivity of the heating film 2 is small, which can reduce the energy loss of the heating film 2 during work due to the high infrared emissivity.

[0096] The resistivity of the heating film 2 is 1E-7 Ω·m to 1E-5 Ω·m, and can be 1E-7 Ω·m, 5E-7 Ω·m, 1E-6 Ω·m, 3E-6 Ω·m, 8E-9 Ω·m, and 1E-5 Ω·m, etc. The resistivity of the heating film 2 is controlled within the above range, which facilitates the selection of the material of the heating film 2, increases the selection range and flexibility of the material of the heating film 2, and improves the working performance and stability of the heating film 2.

[0097] After step S200, a protective film is formed on the surface of the heating film 2 away from the substrate 1.

[0098] In the above step, the protective film is prepared on the surface of the heating film 2 away from the substrate 1, and the protective film is used to protect the heating film 2 and ensure the service life of the heater.

[0099] Specifically, the protective film is formed by at least one process of physical vapor deposition such as magnetron sputtering and electron beam evaporation, and chemical vapor deposition, and the preparation method of the protective film can be selected according to actual needs, which is not limited herein.

[0100] It should be noted that the protective film can only cover the heating film 2 on the outer surface of the substrate 1, or can cover the entire substrate.

[0101] In the present application, the material of the protective film includes one or more of copper, copper alloy, silver, silver alloy, platinum, platinum alloy, titanium nitride, doped indium oxide, and doped zinc oxide.

[0102] In the present application, the thickness of the protective film is 0.005 μm to 0.5 μm, and can be 0.005 μm, 0.01 μm, 0.02 μm, 0.05 μm, 0.08 μm, 0.1 μm, 0.2 μm, 0.3 μm, 0.4 μm, and 0.5 μm, etc. If the thickness of the protective film is greater than 0.5 μm, the production cost is high. If the thickness of the protective film is less than 0.005 μm, the film layer is too thin to protect the heating film 2.

[0103] The protective film can also be formed on the surface of the substrate 1, that is, the substrate 1 is cleaned and dried first, the protective film is formed on the outer surface of the dried substrate 1, and then the heating film 2 is formed on the outer surface of the protective film.

[0104] The overall infrared heating rate of the protective film and the heating film 2 is less than 20%, and can be 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, etc. When the protective film and the conductive protective film are attached to the surface of the substrate together, the infrared emissivity of the heater will not be increased.

[0105] After step S200, the electrode film 3 is formed on the surface of the heating film 2 or the protective film. The electrode film 3 can be prepared by physical vapor deposition, or can be prepared by other methods, and the present application does not limit the method.

[0106] In order to make the skilled in the art better understand the technical solutions of the present application, the present application is further described in detail below in combination with specific embodiments.

[0107] The selection of the material of the substrate 1, the material of the heating film 2, the material of the electrode film 3 and the material of the protective film is exemplified below.

[0108] Embodiment 1:

[0109] The substrate 1 is made of high borosilicate glass, and a nickel film is plated on the outer surface of the substrate 1 to form the heating film. At this time, the thickness of the heating film 2 is 0.034 μm, the sheet resistance of the heating film is 2 Ω / sq, and the infrared emissivity of the heating film is 13%. An aluminum oxide film is plated on the outer surface of the heating film 2 to form the protective film, and the thickness of the protective film is 0.2 μm. Silver paste is plated on the outer surface of the protective film along the axis of the substrate 1 to form two annular electrode films 3 distributed at the two ends of the heating film 2 along the axis of the substrate 1. At this time, the sheet resistance of the electrode film 3 is 0.005 Ω / sq.

[0110] In this embodiment, the infrared emissivity of the heater is 15%, and the resistance of the heater is 1.5 Ω. A voltage of 5 V is applied to the positive electrode film 31 and the negative electrode film 32 respectively. The temperature field distribution is uniform after stabilization, the temperature difference between the two parts of the heating film 2 in parallel is less than 5 °C, and the maximum temperature can reach 262 °C.

[0111] Embodiment 2:

[0112] The substrate 1 is made of insulating treated aluminum, and a titanium film is plated on the outer surface of the substrate 1 to form the heating film. At this time, the thickness of the heating film 2 is 0.1 μm, the sheet resistance of the heating film 2 is 4.2 Ω / sq, and the infrared emissivity of the heating film 2 is 30%. A silver-chromium alloy film is plated on the outer surface of the heating film 2 to form the protective film, and the thickness of the protective film is 0.005 μm. Gold paste is plated on the outer surface of the protective film along the direction parallel to the axis of the substrate 1 to form the positive electrode film 31 and the negative electrode film 32. At this time, the sheet resistance of the positive electrode film 31 and the negative electrode film 32 is 0.01 Ω / sq.

[0113] In this embodiment, the infrared emissivity of the heater is 17%, and the resistance of the heater is 1.5 Ω. A voltage of 6 V is applied to the positive electrode film 31 and the negative electrode film 32 respectively. The temperature field distribution is uniform after stabilization, the temperature difference between the two parts of the heating film 2 in parallel is less than 5 °C, and the maximum temperature can reach 325 °C.

[0114] Embodiment 3:

[0115] The substrate 1 is made of quartz glass, and an iron-chromium-aluminum alloy film is coated on the outer surface of the substrate 1 to form a heating film, wherein the thickness of the heating film 2 is 2.8 μm, the sheet resistance of the heating film 2 is 0.5 Ω / sq, the infrared emissivity of the heating film 2 is 25%, an indium tin oxide (ITO) film is coated on the outer surface of the heating film 2 to form a protective film, the thickness of the protective film is 0.05 μm, and a printed titanium nitride slurry is coated on the outer surface of the protective film to form two annular electrode films 3 distributed at the two ends of the heating film 2 along the axial direction of the substrate 1, wherein the sheet resistance of the electrode film 3 is 0.006 Ω / sq.

[0116] In this embodiment, the infrared emissivity of the heater is 11.2%, the resistance of the heater is 0.5 Ω, a voltage of 4 V is applied to the positive electrode film 31 and the negative electrode film 32 respectively, the temperature field distribution is uniform after stabilization, the temperature difference between the two parts of the heating film 2 in parallel is less than 5°C, and the maximum temperature can reach 350°C.

[0117] Embodiment 4:

[0118] The substrate 1 is made of insulating alumina, and a 316L film is coated on the outer surface of the substrate 1 to form a heating film, wherein the thickness of the heating film 2 is 0.21 μm, the sheet resistance of the heating film 2 is 2.3 Ω / sq, the infrared emissivity of the heating film 2 is 20%, a gold film is coated on the outer surface of the heating film 2 to form a protective film, the thickness of the protective film is 0.01 μm, and a gold slurry is coated on the outer surface of the protective film in the direction parallel to the axial line of the substrate 1 to form the positive electrode film 31 and the negative electrode film 32, wherein the sheet resistance of the electrode film 3 is 0.005 Ω / sq.

[0119] In this embodiment, the infrared emissivity of the heater is 9.8%, the resistance of the heater is 0.81 Ω, a voltage of 4.4 V is applied to the positive electrode film 31 and the negative electrode film 32 respectively, the temperature field distribution is uniform after stabilization, the temperature difference between the two parts of the heating film 2 in parallel is less than 5°C, and the maximum temperature can reach 323°C.

[0120] Embodiment 5:

[0121] The substrate 1 is made of insulating zirconia, and a nickel-chromium alloy film is coated on the outer surface of the substrate 1 to form a heating film 2, wherein the thickness of the heating film 2 is 0.1 μm, the sheet resistance of the heating film 2 is 6.9 Ω / sq, the infrared emissivity of the heating film 2 is 21%, and a silver slurry is coated on the outer surface of the heating film in the direction parallel to the axial line of the substrate 1 to form the positive electrode film 31 and the negative electrode film 32, wherein the sheet resistance of the positive electrode film 31 and the negative electrode film 32 is 0.003 Ω / sq.

[0122] In this embodiment, the infrared emissivity of the heater is 21%, the resistance of the heater is 2.4 Ω, a voltage of 7 V is applied to the positive electrode film 31 and the negative electrode film 32 respectively, the temperature field distribution is uniform after stabilization, the temperature difference between the two parts of the heating film 2 in parallel is less than 5°C, and the maximum temperature can reach 282°C.

[0123] Example 6:

[0124] Different from example 3, the iron-chromium-aluminum alloy film is plated on the outer surface of the substrate 1 to form the heating film, at this time, the thickness of the heating film 2 is 5 μm, the square resistance of the heating film 2 is 0.28 Ω / sq, the infrared emissivity of the heating film 2 is 22%, the indium tin oxide (ITO) is plated on the outer surface of the heating film 2 to form the protective film, the thickness of the protective film is 0.05 μm, the titanium nitride slurry is plated on the outer surface of the protective film to form two annular electrode films 3 which are distributed on both ends of the heating film 2 along the axial direction of the substrate 1, at this time, the square resistance of the electrode film 3 is 0.006 Ω / sq.

[0125] In this example, the infrared emissivity of the heater is 10.2%, the resistance of the heater is 0.28 Ω, the voltage of 3 V is applied on the positive electrode film 31 and the negative electrode film 32 respectively, the temperature field distribution is uniform after stabilization, the temperature difference between the two parts of the heating film 2 in parallel is less than 5 °C, and the highest temperature can reach 350 °C.

[0126] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Various modifications and changes can be made by those skilled in the art based on the principles and spirit of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A heater for heating an aerosol-forming substrate and volatilising at least one component in the aerosol-forming substrate to form an aerosol for a user to smoke, characterised in that, The heater comprises: a base body (1) in a circumferential body structure; a heating film (2) covering the surface of the base body (1), the material of the heating film (2) being one or more of iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, titanium, titanium alloy, aluminum and aluminum alloy, the thickness of the heating film (2) being 0.01-5 μm, and the infrared emissivity of the heating film (2) being less than 30%; The heating film (2) can heat the aerosol-forming substrate by a combination of infrared radiation and contact heat conduction.

2. The heater of claim 1, wherein The heating power of the heating film (2) by infrared radiation is less than the heating power of the heating film (2) by contact heat conduction.

3. The heater of claim 1, wherein, The heating film (2) comprises at least one of the following characteristics: a. The resistivity p of the heating film (2) satisfies 1E-7 Ω·m≤p≤1E-5 Ω·m; b. The square resistance Rsq of the heating film (2) satisfies 0.5 Ω / sq≤Rsq≤10 Ω / sq.

4. The heater of claim 1, wherein The heater further comprises a protective film covering the heating film (2), the material of the protective film being one or more of metal, alloy, conductive nitride and conductive oxide.

5. The heater of claim 4, wherein, The material of the protective film is one or more of silver, silver alloy, platinum, platinum alloy, titanium nitride, doped indium oxide, doped zinc oxide, silicon oxide and aluminum oxide.

6. The heater of claim 4, wherein, The thickness of the protective film is 0.005-0.5 μm. The overall infrared emissivity of the heating film (2) and the protective film is less than 30%.

7. The heater of claim 1, wherein The heater further comprises an electrode film (3) electrically connected to the heating film (2).

8. The heater of claim 7, wherein, The material of the electrode film (3) is one or more of iron, nickel, chromium, titanium, aluminum, gold, silver, platinum and titanium nitride. The square resistance of the electrode film (3) is less than or equal to 0.01 Ω / sq.

9. The heater of claim 7, wherein, The number of the electrode film (3) is at least two, and when the number of the electrode film (3) is greater than or equal to three, the electrode films (3) are alternately arranged along the axial direction of the base body (1), and adjacent electrode films (3) are respectively connected to the positive and negative electrodes of a power supply.

10. The heater of claim 7, wherein, The electrode film (3) is an electrode film group, the electrode film group comprising a positive electrode film (31) and a negative electrode film (32), and the positive electrode film (31) and the negative electrode film (32) are respectively connected to the positive and negative electrodes of a power supply. The number of the electrode film group is one or more, and when the number of the electrode film group is multiple, the positive electrode film (31) and the negative electrode film (32) are alternately arranged along the circumferential direction of the base body (1).

11. The heater of claim 7, wherein, The electrode film (3) is an electrode film group, the electrode film group comprising a body portion (33) extending along the axial direction of the base body (1), and the body portion (33) comprises a first body portion (331) in contact with the outer surface of the heating film (2) and a second body portion (332) in contact with the outer surface of the base body (1). The second body part (332) is provided with a connecting part (34) extending circumferentially along the base body (1) at one end away from the first body part (331), and the electrode film group is connected with a power supply through the connecting part (34).

12. A method of producing a heater, characterized by, The method comprises the following steps: providing a base body (1); forming a heating film (2) on the surface of the base body (1), the heating film (2) being made of one or more of iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, titanium, titanium alloy, aluminum and aluminum alloy, the thickness of the heating film (2) being 0.01-5 μm, and the infrared emissivity of the heating film (2) being less than 30%; the heating film (2) can heat the aerosol forming substrate by a combination of infrared radiation and contact heat conduction, and volatilize at least one component in the aerosol forming substrate to form an aerosol for a user to smoke.

13. The method of claim 12, wherein, after forming the heating film (2) on the surface of the base body (1), a protective film is further formed on the surface of the heating film (2), the protective film being made of one of metal, alloy, conductive nitride and conductive oxide.

14. A smoking article, characterized by The smoking set comprises: a shell; the heater of any one of claims 1-11 or the heater prepared by the method of any one of claims 12-13 is installed in the shell.

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