LED packaging structure and packaging method

Abstract

The present invention relates to the field of LED technology, and in particular to an LED packaging structure and packaging method. The LED packaging structure provided by the present invention includes a substrate, an LED, and a colloid layer, wherein the LED is arranged on the substrate, and the colloid layer covers the LED; the middle part of the colloid layer away from the surface of one side of the substrate forms a depression toward the LED; the LED packaging method provided by the present invention mounts the LED on the substrate; the position of the LED is identified, and a colloid layer with a depression in the middle part is formed based on the LED by first diffusing outward from the center of the LED and then shrinking, or shrinking from the periphery of the LED to the center of the LED, and solidifying the colloid layer. The position setting of the depression and the LED simplifies the structure required to emit a larger area of ​​evenly distributed light, reduces the structural complexity of the light board manufacturing process, effectively reduces the manufacturing process steps, and reduces the manufacturing cost, thereby being able to achieve a significant improvement in lighting effects in terms of light type and visual effects, and significantly reduce costs without changing the display effect.

Description

Technical field

[0001] The present invention relates to the technical field of LEDs, and in particular to an LED packaging structure and a packaging method. [Background Technology]

[0002] With the upgrading of consumption, ultra-thin and low-cost display and lighting products have become a clear trend. To significantly reduce costs, the fewer lamps used, without changing the light density and display and lighting effects, the more cost-effective it is. Therefore, it is necessary to make the LED light output angle as batwing-shaped as possible and increase the angle. Traditional LED packaging methods often use refractive lenses to refract and diffuse light away from the optical axis, allowing the LED to emit light over a larger area and more uniformly, thereby increasing the LED's illumination range. However, this structure requires the addition of a refractive lens, which increases the complexity and cost. [Summary of the invention]

[0003] In order to solve the existing problems, the present invention provides an LED packaging structure and a packaging method.

[0004] In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions: an LED packaging structure, wherein the LED packaging structure is a single LED chip packaging structure, wherein the LED packaging structure includes a substrate, an LED, and a colloid layer, wherein the LED is arranged on the substrate, and the colloid layer covers the LED; the colloid layer forms a depression toward the LED in the middle portion of a surface on one side away from the substrate; the colloid layer forming the depression is formed by first diffusing outward from the center of the LED and then contracting, or contracting from the periphery of the LED toward the center of the LED, based on the LED.

[0005] Preferably, the bottom surface of the depression is arc-shaped; the ratio of the distance from the lowest point of the depression to the substrate to the maximum diameter of the colloid layer is less than or equal to 0.6; and the ratio of the maximum thickness of the colloid layer to the maximum diameter of the colloid layer is less than or equal to 0.6.

[0006] Preferably, the colloid layer is made of a material with a viscosity greater than or equal to 3000 mPa·s and a thixotropic index greater than or equal to 3.

[0007] In order to solve the above technical problems, the present invention provides another technical solution as follows: a LED packaging method, specifically comprising the following steps:

[0008] Mount the LED on the substrate;

[0009] Identify the position of the LED, and use the LED as a reference to form a colloidal layer with a concave middle portion by first expanding outward from the center of the LED and then contracting, or contracting from the periphery of the LED toward the center of the LED; the colloidal layer with the concave middle portion covers a single LED chip;

[0010] The colloid layer is cured.

[0011] Preferably, the method of first diffusing outward from the center of the LED and then contracting specifically includes the following steps:

[0012] Aim the dispensing head at the center of the LED and spray the glue dots toward the center of the LED at a preset speed. When the glue dots initially fall, they spread outward from the center of the LED.

[0013] The glue dispensing operation is performed a preset number of times at a preset time interval on the same LED center. After the glue dispensing is completed, the glue dots that spread from the LED center to the surrounding areas shrink toward the LED center to form a glue layer with a concave middle portion.

[0014] Preferably, the preset speed is greater than 5 mm / s, the viscosity of the glue point is greater than or equal to 3000 mPa·s, the thixotropic index is greater than or equal to 3, and the preset time interval is less than 1 s.

[0015] Preferably, the method of shrinking from the periphery of the LED to the center of the LED specifically includes the following steps:

[0016] The dispensing head uses the center of the LED as the reference point and the preset distance as the distance between the dispensing point and the center of the LED. Glue points are dispensed around the center of the LED at the preset distance according to the preset number of glue points, so that the glue points flow to cover the chip and shrink toward the center of the LED to form a colloid layer with a concave middle part.

[0017] Preferably, the number of the preset glue dots is greater than or equal to 4, the preset distance is less than or equal to 5 mm, the glue dot amount is greater than or equal to 0.001 mg, the viscosity is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3.

[0018] Preferably, the method of shrinking from the periphery of the LED to the center of the LED specifically includes the following steps:

[0019] The dispensing head uses the center of the LED as the center of the circle and draws a circle with a preset radius as the radius of the circle, so that the glue dots flow to cover the chip and shrink toward the center of the LED to form a colloidal layer with a concave middle part.

[0020] Preferably, the preset circle radius is less than or equal to 5 mm, the glue dispensing amount is greater than or equal to 0.001 mg, the viscosity is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3.

[0021] Compared with the prior art, the LED packaging structure and packaging method provided by the present invention have the following beneficial effects:

[0022] 1. An embodiment of the present invention provides an LED packaging structure comprising a substrate, an LED, and a colloid layer, wherein the LED is disposed on the substrate and the colloid layer covers the LED; a middle portion of the colloid layer on a surface away from the substrate forms a depression toward the LED. The depression covers the LED, and because the depression forms a concave light diverging surface, it can achieve an effect similar to the surface of a refractive lens, effectively expanding the light output angle, allowing the LED to emit a larger area of ​​evenly distributed light, but without the need for a refractive lens to refract the LED light. The positioning of the depression and the LED simplifies the structure required to emit a larger area of ​​evenly distributed light, reduces the complexity of the structure, effectively reduces the manufacturing process, reduces manufacturing costs, and can significantly improve the lighting effect in terms of light type and visual effects, thereby significantly reducing costs without changing the display effect.

[0023] 2. The bottom surface of the recess provided in the embodiments of the present invention is curved; the ratio of the distance from the lowest point of the recess to the substrate to the maximum diameter of the colloid layer is less than or equal to 0.6; and the ratio of the maximum thickness of the colloid layer to the maximum diameter of the colloid layer is less than or equal to 0.6. The aforementioned proportional relationships allow for adjustment of the light curve angle and batwing shape, enabling the LED to produce different light curve angles and batwing shapes. Based on the specific requirements for a large, evenly distributed light pattern and visual effect, the aforementioned proportional relationships can be adjusted to achieve the desired specific recess shape, fully meeting the needs of different lighting scenarios.

[0024] 3. The viscosity of the material selected for the colloidal layer provided in the embodiment of the present invention is greater than or equal to 3000mPa·s, and the thixotropic index is greater than or equal to 3. The key parameters of the material selected for the colloidal layer that determine the formation of the depression are viscosity and thixotropic index. The greater the viscosity and thixotropic index, the easier it is to form a depression, and the specific shape of the depression is closely related to the light pattern and visual effect formed by the light emitted by the LED passing through the depression. By setting the above-mentioned viscosity and thixotropic index, the material selected for the colloidal layer can have a strong depression structure forming ability, which can better promote the formation of the depression, thereby ensuring that the depression can be formed more efficiently during the manufacturing process, while also improving the efficiency of the manufacturing process, and ensuring further cost reduction and efficiency improvement without changing the display effect.

[0025] 4. An LED packaging method provided in an embodiment of the present invention comprises mounting an LED on a substrate; identifying the position of the LED, and using the LED as a reference to form a colloidal layer having a concave middle portion by first diffusing outward from the center of the LED and then contracting, or contracting from the periphery of the LED toward the center of the LED, and curing the colloidal layer, thereby dispensing glue to form the concave portion. This allows light emitted by the LED to be dispersed through the concave portion by refraction, so that the light emitted by the LED is refracted into light with a large and uniformly distributed illumination area. There is no need to add a refractive lens to the structure to refract the light, thereby increasing the illumination range of the LED. Only by relying on the concave portion formed by the dispensing process during LED packaging, the light emitted by the LED can be refracted and dispersed more evenly over a larger area by passing through the special structure of the concave portion. This significantly improves the light pattern and visual effect of the light emitted by the LED. At the same time, since there is no need to introduce a refractive lens to achieve this effect, the structural complexity is reduced, the manufacturing cost is reduced, and the cost is significantly reduced without changing the display effect.

[0026] 5. The method provided in the embodiments of the present invention, wherein the glue first spreads outward from the center of the LED and then contracts, specifically includes the following steps: aligning the dispensing head with the center of the LED and dispensing the glue at a preset speed, so that the glue initially spreads outward from the center of the LED; performing the dispensing operation on the same LED a preset number of times at a preset time interval; after dispensing, the glue that spreads outward from the center of the LED contracts toward the center of the LED to form a colloidal layer with a concave center. The preset speed is greater than 5 mm / s, the viscosity of the glue is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3. The greater the viscosity and thixotropic index, the more likely the concave portion is to be formed. The preset time interval is less than 1 second. The morphological structure of the depression is controlled by controlling the preset speed and the preset time interval. The greater the preset speed, the larger the depression formed. The shorter the preset time interval, the denser the glue points, and the larger the depression formed. The greater the viscosity and thixotropic index, the easier it is to form a depression. The specific shape of the depression can be controlled by adjusting the above parameters, and the angle of the light curve and the display effect of the bat-wing shape can be adjusted to meet the needs of different light types and visual effects.

[0027] 6. The method of shrinking from the periphery of the LED to the center of the LED provided in the embodiment of the present invention specifically includes the following steps: the dispensing head uses the center of the LED as the reference point, uses the preset distance as the distance between the dispensing point and the center of the LED, and dispenses glue dots at the preset distance around the center of the LED according to the preset number of glue dots, so that the glue dots flow to cover the chip and shrink toward the center of the LED to form a colloidal layer with a concave middle portion. The preset number of glue dots determines the consistency in all directions; the more the number, the better. The preset distance determines the size of the concave portion; the smaller the preset distance, the smaller the concave portion formed. The amount of glue dots is related to the preset number of glue dots and the preset distance. The more the preset number of glue dots and the larger the preset distance, the more glue dots are required. The amount of glue dots needs to be adjusted according to the preset number of glue dots and the preset distance to cover the top of the chip. The preset speed is greater than 5 mm / s, the viscosity of the glue dots is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3. The greater the viscosity and thixotropic index, the easier it is to form a concave portion. The preset circle radius is less than or equal to 5 mm, and the glue dot amount is greater than or equal to 0.001 mg. By utilizing the above parameters and the corresponding relationship between the above parameters and the depression to adjust the depression, it is ensured that the required specific depression can be formed, thereby ensuring that the LED emits a corresponding large area and evenly distributed light pattern and visual effect.

[0028] 7. The method of shrinking from the periphery of the LED to the center of the LED provided in the embodiment of the present invention specifically includes the following steps: the dispensing head uses the center of the LED as the center of the circle and performs a dispensing operation in a circle with a preset circle radius as the radius of the circle, so that the glue dots flow to cover the chip and shrink toward the center of the LED to form a colloidal layer with a depression in the middle part. The preset circle radius determines the size of the depression. The closer to the center of the LED, the smaller the depression formed. The amount of glue dispensed is related to the preset circle radius. The larger the preset circle radius, the more glue dispensing is required. The amount of glue dispensed needs to be adjusted according to the preset circle radius to cover the top of the chip. The preset speed is greater than 5mm / s, the viscosity of the glue dots is greater than or equal to 3000mPa·s, and the thixotropic index is greater than or equal to 3. The greater the viscosity and thixotropic index, the easier it is to form a depression. The preset circle radius is less than or equal to 5 mm, and the glue dot amount is greater than or equal to 0.001 mg. By utilizing the above parameters and the corresponding relationship between the above parameters and the depression to adjust the depression, it is ensured that the required specific depression can be formed, thereby ensuring that the LED emits a corresponding large area and evenly distributed light pattern and visual effect.

Brief Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 It is a cross-sectional schematic diagram of an LED packaging structure provided by the first embodiment of the present invention.

[0031] Figure 2 This is a first light output curve diagram of an LED package structure provided by the first embodiment of the present invention.

[0032] Figure 3 This is a second light output curve diagram of an LED package structure provided by the first embodiment of the present invention.

[0033] Figure 4 This is a third light output curve diagram of an LED package structure provided by the first embodiment of the present invention.

[0034] Figure 5 This is a fourth light output curve diagram of an LED package structure provided by the first embodiment of the present invention.

[0035] Figure 6 This is a comparison diagram of light output curves of an LED packaging method provided by the first embodiment of the present invention and a method using a refractive lens.

[0036] Figure 7 This is a schematic diagram of the dimensions of an LED packaging structure provided by the first embodiment of the present invention.

[0037] Figure 8 This is a comparison diagram of light output curves of various parameter series of an LED packaging structure provided by the first embodiment of the present invention.

[0038] Figure 9 This is a flowchart of the steps of an LED packaging method provided by the second embodiment of the present invention.

[0039] Figure 10 This is a schematic cross-sectional view of an LED packaging method provided by the second embodiment of the present invention in the initial state after glue dispensing is completed.

[0040] Figure 11 This is a schematic diagram of a cross-section of a LED packaging method provided by the second embodiment of the present invention, wherein the glue shrinks toward the center of the LED. Figure 1 .

[0041] Figure 12 This is a flowchart of step S2 of an LED packaging method provided by the second embodiment of the present invention.

[0042] Figure 13 This is a schematic diagram of the initial state of the dispensing completion of an LED packaging method provided by the third embodiment of the present invention. Figure 1 .

[0043] Figure 14 This is a schematic diagram of a cross-section of a LED packaging method provided by the third embodiment of the present invention, wherein the glue shrinks toward the center of the LED. Figure 2 .

[0044] Figure 15 This is a schematic diagram of the initial state of the dispensing completion of an LED packaging method provided by the fourth embodiment of the present invention. Figure 2 .

[0045] Figure 16 This is a schematic diagram of a cross-section of a LED packaging method provided by the fourth embodiment of the present invention, wherein the glue shrinks toward the center of the LED. Figure 3 .

[0046] Description of the accompanying drawings:

[0047] 1. LED packaging structure;

[0048] 11. Depression; 12. Colloid layer; 13. LED; 14. Substrate; 15. Glue. [Specific implementation method]

[0049] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0050] See also Figure 1The first embodiment of the present invention provides an LED packaging structure 1, including a substrate 14, an LED 13 and a colloid layer 12, wherein the LED 13 is arranged on the substrate 14, and the colloid layer 12 covers the LED 13; the middle part of the surface of the colloid layer 12 on the side away from the substrate 14 forms a recess 11 toward the LED 13. Since the recess 11 covers the LED 13 and forms a concave light diverging surface, it can achieve an effect similar to the surface of a refractive lens, effectively expand the light output angle, so that the LED 13 can emit a larger area of ​​evenly distributed light, but there is no need to set a refractive lens to refract the light emitted by the LED 13. The position setting of the recess 11 and the LED 13 simplifies the structure required for emitting a larger area of ​​evenly distributed light. There is no need to add a refractive lens structure to the LED packaging structure 1. Instead, it only relies on the recess 11 structure formed when the colloid layer 12 is packaged, so that when light passes through the recess 11, the light output angle can be effectively expanded, so that the LED 13 can emit a larger area of ​​evenly distributed light, reducing the complexity of the structure, effectively reducing the manufacturing process in the manufacturing link, and reducing the manufacturing cost, so that the lighting effect can be greatly improved in terms of light type and visual effect, thereby meeting the requirement of significantly reducing costs without changing the display effect.

[0051] It is understandable that the LED 13 used can be a light-emitting device such as an ordinary LED chip, a large-angle LED chip, a CSP lamp bead, etc.

[0052] To better illustrate the effects achieved by the LED packaging structure 1 of this embodiment, the following two examples are given.

[0053] Example 1, please combine Figure 2 and Figure 3 Specifically, an ordinary LED chip is selected as the specific LED selection type, and a structure in which a colloidal layer 12 is formed with a recess 11 toward the LED 13 is adopted, and compared with an ordinary LED chip encapsulated with only an ordinary colloidal layer, the first light emission curve is the light emission curve of the ordinary LED chip encapsulated with the ordinary colloidal layer, and the second light emission curve is the light emission curve of the ordinary LED chip encapsulated with the colloidal layer 12 structure with a recess 11 toward the LED 13. It can be seen that with the colloidal layer 12 structure with a recess 11 toward the LED 13, the light emission curve angle of the light emitted by the LED 13 is larger, and the outward expansion of the bat-wing angle shape of the light emission has a better display effect, which can effectively expand the light emission angle, so that the LED 13 can emit light with a larger area and uniform distribution, and the visual effect is improved after the light board is made.

[0054] Example 2, please combine Figure 4 and Figure 5Specifically, CSP lamp beads are selected as the specific LED type, and a structure in which a colloidal layer 12 is formed with a recess 11 facing the LED 13 is adopted. The structure is compared with CSP lamp beads encapsulated with only an ordinary colloidal layer. The third light emission curve is the light emission curve of the CSP lamp beads encapsulated with the ordinary colloidal layer, and the fourth light emission curve is the light emission curve of the CSP lamp beads encapsulated with the colloidal layer 12 structure with a recess 11 facing the LED 13. It can be seen that the colloidal layer 12 structure with a recess 11 facing the LED 13 has a larger light emission curve angle of the light emitted by the LED 13, and the outward expansion of the bat-wing angle shape of the light emission has a better display effect, which can effectively expand the light emission angle, so that the LED 13 can emit a larger area of ​​evenly distributed light, and the visual effect is improved after the light board is made.

[0055] It can be understood that the glue 15 includes commonly used packaging glue systems such as silicone and epoxy.

[0056] See also Figure 6 To better illustrate the advantages of the colloidal layer 12 with the depression 11 over the refractive lens, the light emission effects of the LED 13 with the depression 11 formed by the colloidal layer 12 prepared in this embodiment are compared with those of the conventional LED with an open angle using a refractive lens. The first simulation curve is the light emission curve of the conventional LED with an open angle using the colloidal layer 12 with the depression 11 formed toward the LED 13, and the second simulation curve is the light emission curve of the conventional LED with an open angle using a refractive lens. Figure 6 The comparison results show that the LED 13 with the colloid layer 12 forming the recess 11 has a significantly more advantageous light output effect than the LED 13 using a refractive lens. From the perspective of light pattern and display effect, compared to the traditional refractive lens, the light emitted by the LED package structure 1 with the colloid layer 12 forming the recess 11 has a more optimal light pattern and visual effect, a larger light output angle, and a bat-wing shape with a better display effect. Furthermore, because the structure and manufacturing process of the recess 11 formed by the colloid layer 12 are simpler than those of a refractive lens, the manufacturing cost can be significantly reduced, thereby achieving an improved lighting effect at a lower cost, which has a more significant advantage over the traditional refractive lens.

[0057] It is understandable that the curing conditions are specifically selected according to the type of glue 15, and preferred methods include baking curing, UV curing (ultraviolet curing), etc.

[0058] See also Figure 7, the bottom surface of the recess 11 is arc-shaped; the distance from the lowest point of the recess 11 to the substrate 14 is set to h, the maximum thickness of the colloid layer 12 is H, and the maximum diameter of the colloid layer 12 is R. The ratio of h to R, h / R, is the center aspect ratio p, p≤0.6; the ratio of H to R, H / R, is the maximum aspect ratio P, P≤0.6. The setting of the above-mentioned proportional relationship makes it possible to adjust h, H and R and then adjust p and P, thereby adjusting the light curve angle and batwing shape, so that the light emitted by the LED 13 can form different light curve angles and batwing shapes after passing through the colloid layer 12. According to the specific requirements of the light type and visual effect of emitting a large area of ​​evenly distributed light, the above-mentioned proportional relationship is adjusted to obtain the required specific shape of the recess 11, which can fully meet the needs of different lighting scenarios.

[0059] See also Figure 8 By adjusting h, H, and R, and thereby adjusting p and P, while simultaneously satisfying P ≤ 0.6 and p ≤ 0.6, a series of different combinations of center aspect ratios p and maximum aspect ratios P ​​can be obtained. The light curve angles and batwing shapes emitted by these series of combinations also vary due to the adjustment of the above parameters. The first series of curves are light output curves for LED package structures using the key parameters of series one; the second series of curves are light output curves for LED package structures using the key parameters of series two; and the third series of curves are light output curves for LED package structures using the key parameters of series three. Specifically, referring to Table 1, Series 1, Series 2, and Series 3 are different combinations of center aspect ratios p and maximum aspect ratios P. The center aspect ratios p and maximum aspect ratios P ​​increase or decrease simultaneously. When the center aspect ratios p and maximum aspect ratios P ​​decrease, the batwing angle expands outward, and the light output angle increases. When the center aspect ratios p and maximum aspect ratios P ​​increase, the batwing angle contracts inward, and the light output angle decreases.

[0060] serial number Series One Series 2 Series Three H(mm) 1.3 0.94 0.9 h(mm) 1.28 0.86 0.8 R(mm) 3.2 3.5 3.6 H / R 0.41 0.27 0.25 h / R 0.40 0.25 0.22

[0061] Table 1 Key parameters of different series

[0062] It is understandable that by adjusting h, H, and R, and thus p and P, a series of different combinations of center aspect ratios p and maximum aspect ratios P ​​are obtained. A combination of center aspect ratios p and maximum aspect ratios P ​​that matches different light patterns and visual effects can be selected. Thus, by adjusting the aforementioned proportional relationships, the angle of the light curve and the batwing shape can be adjusted. Based on the specific requirements for a large, evenly distributed light pattern and visual effect, the aforementioned proportional relationships can be adjusted to achieve the desired specific shape of the recess 11, fully meeting the needs of different lighting scenarios.

[0063] Specifically, the viscosity of the material selected for the colloidal layer 12 is greater than or equal to 3000mPa·s, and the thixotropic index is greater than or equal to 3. The key parameters of the material selected for the colloidal layer 12 that determine the formation of the recess 11 are viscosity and thixotropic index. The greater the viscosity and thixotropic index, the easier it is to form the recess 11, and the specific shape of the recess 11 is closely related to the light pattern and visual effect formed by the light emitted by the LED 13 passing through the recess 11. By setting the above-mentioned viscosity and thixotropic index, the material selected for the colloidal layer 12 can have a strong ability to form the structure of the recess 11, which can better promote the formation of the recess 11, thereby ensuring that the recess 11 can be formed more efficiently during the manufacturing process, while also improving the efficiency of the manufacturing process, and ensuring further cost reduction and efficiency improvement without changing the display effect.

[0064] See also Figure 9 A second embodiment of the present invention provides an LED packaging method, comprising the following steps:

[0065] Step S1, mounting the LED 13 on the substrate 14;

[0066] Step S2, identifying the position of the LED 13, and using the LED 13 as a reference, forming a colloidal layer 12 having a concave middle portion 11 by first expanding outward from the center of the LED 13 and then contracting, or by contracting from the periphery of the LED 13 toward the center of the LED 13;

[0067] Step S3 , curing the colloid layer 12 .

[0068] See also Figures 10 and 11 The glue dispensing operation causes the glue 15 to be ejected from the dispensing head, fall on the center of the LED 13 and then spread to the surrounding areas. During the spreading process, the glue 15 begins to accumulate due to its high viscosity. Figure 10 The image shows the state where glue 15 begins to accumulate due to high viscosity during its diffusion process. At the same time, it is also affected by the diffusion of glue 15 from the center. After the last glue 15 is shot, some glue 15 will flow back. Figure 11 The figure shows that part of the glue 15 flows back toward the center of the LED 13 and shrinks, forming a colloidal layer 12 with a depression 11 in the middle portion. The high viscosity and high thixotropic properties of the glue 15 result in very little backflow of the glue 15. The thickness of the colloidal layer 12 in the middle portion of the surface away from the substrate 14 on the side facing the LED 13 is lower than the thickness of the colloidal layer 12 at other positions, thereby forming a depression 11.

[0069] The LED 13 is mounted on the substrate 14; the position of the LED 13 is identified, and a colloidal layer 12 with a recess 11 in the middle is formed by shrinking from the periphery of the LED 13 toward the center of the LED 13 based on the LED 13, and the colloidal layer 12 is cured, thereby dispensing glue to form the recess 11, so that the light emitted by the LED 13 is dispersed by refraction through the recess 11, so that the light emitted by the LED 13 is refracted into light with a large irradiation area and uniform distribution. There is no need to add a refractive lens to the structure to refract the light, thereby increasing the irradiation range of the LED 13. Only by relying on the recess 11 formed by the dispensing process when the LED 13 is packaged, the light emitted by the LED 13 can be refracted and dispersed to a larger area more evenly by passing through the special structure of the recess 11, so that the light emitted by the LED 13 is greatly improved in both the light pattern and the visual effect presented. At the same time, since there is no need to introduce a refractive lens to achieve this effect, the structural complexity is reduced, the manufacturing cost is reduced, and the cost is greatly reduced without changing the display effect.

[0070] Specifically, the LED 13 used can be a light-emitting device such as an ordinary LED chip, a large-angle LED chip, or a CSP lamp bead.

[0071] Specifically, the glue 15 includes common packaging glue systems such as silicone and epoxy.

[0072] Specifically, the curing conditions are selected according to the type of glue 15, and preferred methods include baking curing, UV curing (ultraviolet curing), etc.

[0073] See also Figure 12 Furthermore, as a specific implementation method, the method of first diffusing outward from the center of LED 13 and then contracting in step S2 is specifically as follows:

[0074] In step S21 , the glue dispensing head is aligned with the center of LED 13 , and glue dots are ejected toward the center of LED 13 at a preset speed to perform glue dispensing operation, so that the glue dots spread outward from the center of LED 13 when they initially fall.

[0075] In step S22 , a preset number of glue dispensing operations are performed on the center of the same LED 13 at a preset time interval. After the glue dispensing is completed, the glue dots that spread from the center of the LED 13 to the surrounding areas shrink toward the center of the LED 13 to form a glue layer 12 with a concave middle portion 11 .

[0076] It can be understood that the dispensing operation causes the glue 15 to be ejected from the dispensing head, fall above the center of the LED 13, and then spread to the surrounding areas. During the diffusion, the glue 15 begins to accumulate due to its high viscosity. At the same time, it is affected by the diffusion of the glue 15 from the center. After the last glue 15 is shot, the glue 15 will partially flow back. However, the high viscosity and high thixotropic properties of the glue 15 result in very little glue 15 flowing back, thereby forming a depression 11.

[0077] Specifically, the preset speed is greater than 5 mm / s, the viscosity of the glue point is greater than or equal to 3000 mPa·s, the thixotropic index is greater than or equal to 3, and the preset time interval is less than 1 s.

[0078] It is understandable that the preset speed, preset time interval, viscosity of the glue dots, and thixotropic index all affect the specific morphology of the recess 11, namely, the distance h between the lowest point of the recess 11 and the substrate 14, the maximum thickness H of the colloid layer 12, and the maximum diameter R of the colloid layer 12, thereby affecting the formation of different light curve angles and batwing shapes. The morphological structure of the recess 11 is controlled by adjusting the preset speed and preset time interval. The greater the preset speed, the larger the pits of the recess 11 formed. The shorter the preset time interval, the denser the glue dots, and the larger the pits of the recess 11 formed. The greater the viscosity and thixotropic index, the easier it is to form the recess 11. Therefore, the specific morphology of the recess 11 can be controlled by adjusting the above parameters, and the light curve angle and batwing shape display effect can be adjusted to meet the requirements of different light patterns and visual effects.

[0079] The third embodiment of the present invention provides an LED packaging method, which differs from the LED packaging method provided in the second embodiment in that the method of shrinking from the periphery of the LED 13 to the center of the LED 13 in step S2 is specifically as follows:

[0080] In step S21, the dispensing head uses the center of LED 13 as a reference point and a preset distance between the dispensing point and the center of LED 13. The dispensing head dispenses a preset number of glue dots around the center of LED 13, causing the glue dots to flow to cover the chip and shrink toward the center of LED 13 to form a colloid layer 12 with a central depression 11.

[0081] See also Figure 13 and Figure 14 The dispensing head uses the center of LED 13 as the reference point, and uses the preset distance as the distance between the dispensing point and the center of LED 13. The dispensing head dispenses the glue dots according to the preset number of glue dots around the center of LED 13. Figure 13 The figure shows the state where glue 15 surrounds LED 13 and begins to spread after the glue dispensing operation. The glue dots flow to cover LED 13 and shrink toward the center of LED 13 to form a glue layer 12 with a concave middle portion 11. Figure 14The state in which the glue 15 partially flows back toward the center of the LED 13 and shrinks to form the glue layer 12 with a concave middle portion 11 is shown.

[0082] As you can understand, the number of glue dots determines the package consistency of LED 13 in all directions. The more glue dots, the better. However, too many glue dots will affect the packaging speed, so a trade-off needs to be made between packaging consistency and packaging efficiency. The preset distance determines the size of recess 11. The smaller the preset distance, the smaller the recess 11. The amount of glue dots is related to the preset number of glue dots and the preset distance. The more glue dots there are and the larger the preset distance, the more glue dots are required. The amount of glue dots needs to be adjusted according to the preset number of glue dots and the preset distance to cover the top of the chip.

[0083] Specifically, the preset speed is greater than 5 mm / s, the viscosity of the glue dot is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3. The greater the viscosity and thixotropic index, the easier it is to form the depression 11. The preset circle radius is less than or equal to 5 mm, and the glue dot amount is greater than or equal to 0.001 mg. By utilizing the above parameters and their corresponding relationship with the depression 11 to adjust the depression 11, it is ensured that the desired specific depression 11 can be formed, thereby ensuring that the LED 13 achieves a corresponding large area and evenly distributed light pattern and visual effect.

[0084] The fourth embodiment of the present invention provides an LED packaging method, which differs from the LED packaging method provided in the second embodiment in that the method of shrinking from the periphery of LED 13 to the center of LED 13 in step S2 is specifically as follows:

[0085] In step S21, the dispensing head draws a circle with the center of LED 13 as the center and a preset circle radius as the radius of the circle, so that the glue dots flow to cover the chip and shrink toward the center of LED 13 to form a colloidal layer 12 with a concave middle part 11.

[0086] See also Figure 15 and Figure 16 The dispensing head takes the center of LED 13 as the center of the circle and performs dispensing operation by drawing a circle with the preset circle radius as the radius of the circle. Figure 15 The figure shows the initial state after the glue dispensing operation is performed with a preset circle radius. The glue 15 surrounds the LED 13 with the preset circle radius. The glue dots flow to cover the chip and shrink toward the center of the LED 13 to form a glue layer 12 with a concave middle portion 11. Figure 16 The state in which the glue 15 partially flows back toward the center of the LED 13 and shrinks to form a glue layer 12 with a concave middle portion 11 is shown.

[0087] As you can understand, the preset circle radius determines the size of the depression 11. The closer to the center of the LED 13, the smaller the depression 11. The amount of glue dispensed is related to the preset circle radius. The larger the preset circle radius, the more glue is required. The amount of glue dispensed needs to be adjusted according to the preset circle radius to cover the top of the chip.

[0088] Specifically, the preset speed is greater than 5 mm / s, the viscosity of the glue dot is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3. The greater the viscosity and thixotropic index, the easier it is to form the depression 11. The preset circle radius is less than or equal to 5 mm, and the glue dot amount is greater than or equal to 0.001 mg. By utilizing the above parameters and their corresponding relationship with the depression 11 to adjust the depression 11, it is ensured that the desired specific depression 11 can be formed, thereby ensuring that the LED 13 achieves a corresponding large area and evenly distributed light pattern and visual effect.

[0089] In the embodiments provided herein, it should be understood that "B corresponding to A" means that B is associated with A and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B based solely on A; B can also be determined based on A and / or other information.

[0090] It should be understood that references to "one embodiment" or "an embodiment" throughout this specification mean that specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing throughout this specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also be aware that the embodiments described in this specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present invention.

[0091] In various embodiments of the present invention, it should be understood that the size of the serial numbers of the above-mentioned processes does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0092] The flow charts and block diagrams in the accompanying drawings of the present invention illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementation schemes, the functions marked in the box can also occur in a different order than those marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which is determined based on the functions involved. It should be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0093] Compared with the prior art, the LED packaging structure and packaging method provided by the present invention have the following beneficial effects:

[0094] 1. An embodiment of the present invention provides an LED packaging structure comprising a substrate, an LED, and a colloid layer, wherein the LED is disposed on the substrate and the colloid layer covers the LED; a middle portion of the colloid layer on a surface away from the substrate forms a depression toward the LED. The depression covers the LED, and because the depression forms a concave light diverging surface, it can achieve an effect similar to the surface of a refractive lens, effectively expanding the light output angle, allowing the LED to emit a larger area of ​​evenly distributed light, but without the need for a refractive lens to refract the LED light. The positioning of the depression and the LED simplifies the structure required to emit a larger area of ​​evenly distributed light, reduces the complexity of the structure, effectively reduces the manufacturing process, reduces manufacturing costs, and can significantly improve the lighting effect in terms of light type and visual effects, thereby significantly reducing costs without changing the display effect.

[0095] 2. The bottom surface of the recess provided in the embodiments of the present invention is curved; the ratio of the distance from the lowest point of the recess to the substrate to the maximum diameter of the colloid layer is less than or equal to 0.6; and the ratio of the maximum thickness of the colloid layer to the maximum diameter of the colloid layer is less than or equal to 0.6. The aforementioned proportional relationships allow for adjustment of the light curve angle and batwing shape, enabling the LED to produce different light curve angles and batwing shapes. Based on the specific requirements for a large, evenly distributed light pattern and visual effect, the aforementioned proportional relationships can be adjusted to achieve the desired specific recess shape, fully meeting the needs of different lighting scenarios.

[0096] 3. The viscosity of the material selected for the colloidal layer provided in the embodiment of the present invention is greater than or equal to 3000mPa·s, and the thixotropic index is greater than or equal to 3. The key parameters of the material selected for the colloidal layer that determine the formation of the depression are viscosity and thixotropic index. The greater the viscosity and thixotropic index, the easier it is to form a depression, and the specific shape of the depression is closely related to the light pattern and visual effect formed by the light emitted by the LED passing through the depression. By setting the above-mentioned viscosity and thixotropic index, the material selected for the colloidal layer can have a strong depression structure forming ability, which can better promote the formation of the depression, thereby ensuring that the depression can be formed more efficiently during the manufacturing process, while also improving the efficiency of the manufacturing process, and ensuring further cost reduction and efficiency improvement without changing the display effect.

[0097] 4. An LED packaging method provided in an embodiment of the present invention comprises mounting an LED on a substrate; identifying the position of the LED, and using the LED as a reference to form a colloidal layer having a concave middle portion by first diffusing outward from the center of the LED and then contracting, or contracting from the periphery of the LED toward the center of the LED, and curing the colloidal layer, thereby dispensing glue to form the concave portion. This allows light emitted by the LED to be dispersed through the concave portion by refraction, so that the light emitted by the LED is refracted into light with a large and uniformly distributed illumination area. There is no need to add a refractive lens to the structure to refract the light, thereby increasing the illumination range of the LED. Only by relying on the concave portion formed by the dispensing process during LED packaging, the light emitted by the LED can be refracted and dispersed more evenly over a larger area by passing through the special structure of the concave portion. This significantly improves the light pattern and visual effect of the light emitted by the LED. At the same time, since there is no need to introduce a refractive lens to achieve this effect, the structural complexity is reduced, the manufacturing cost is reduced, and the cost is significantly reduced without changing the display effect.

[0098] 5. The method provided in the embodiments of the present invention, wherein the glue first spreads outward from the center of the LED and then contracts, specifically includes the following steps: aligning the dispensing head with the center of the LED and dispensing the glue at a preset speed, so that the glue initially spreads outward from the center of the LED; performing the dispensing operation on the same LED a preset number of times at a preset time interval; after dispensing, the glue that spreads outward from the center of the LED contracts toward the center of the LED to form a colloidal layer with a concave center. The preset speed is greater than 5 mm / s, the viscosity of the glue is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3. The greater the viscosity and thixotropic index, the more likely the concave portion is to be formed. The preset time interval is less than 1 second. The morphological structure of the depression is controlled by controlling the preset speed and the preset time interval. The greater the preset speed, the larger the depression formed. The shorter the preset time interval, the denser the glue points, and the larger the depression formed. The greater the viscosity and thixotropic index, the easier it is to form a depression. The specific shape of the depression can be controlled by adjusting the above parameters, and the angle of the light curve and the display effect of the bat-wing shape can be adjusted to meet the needs of different light types and visual effects.

[0099] 6. The method of shrinking from the periphery of the LED to the center of the LED provided in the embodiment of the present invention specifically includes the following steps: the dispensing head uses the center of the LED as the reference point, uses the preset distance as the distance between the dispensing point and the center of the LED, and dispenses glue dots at the preset distance around the center of the LED according to the preset number of glue dots, so that the glue dots flow to cover the chip and shrink toward the center of the LED to form a colloidal layer with a concave middle portion. The preset number of glue dots determines the consistency in all directions; the more the number, the better. The preset distance determines the size of the concave portion; the smaller the preset distance, the smaller the concave portion formed. The amount of glue dots is related to the preset number of glue dots and the preset distance. The more the preset number of glue dots and the larger the preset distance, the more glue dots are required. The amount of glue dots needs to be adjusted according to the preset number of glue dots and the preset distance to cover the top of the chip. The preset speed is greater than 5 mm / s, the viscosity of the glue dots is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3. The greater the viscosity and thixotropic index, the easier it is to form a concave portion. The preset circle radius is less than or equal to 5 mm, and the glue dot amount is greater than or equal to 0.001 mg. By utilizing the above parameters and the corresponding relationship between the above parameters and the depression to adjust the depression, it is ensured that the required specific depression can be formed, thereby ensuring that the LED emits a corresponding large area and evenly distributed light pattern and visual effect.

[0100] 7. The method of shrinking from the periphery of the LED to the center of the LED provided in the embodiment of the present invention specifically includes the following steps: the dispensing head uses the center of the LED as the center of the circle and performs a dispensing operation in a circle with a preset circle radius as the radius of the circle, so that the glue dots flow to cover the chip and shrink toward the center of the LED to form a colloidal layer with a depression in the middle part. The preset circle radius determines the size of the depression. The closer to the center of the LED, the smaller the depression formed. The amount of glue dispensed is related to the preset circle radius. The larger the preset circle radius, the more glue dispensing is required. The amount of glue dispensed needs to be adjusted according to the preset circle radius to cover the top of the chip. The preset speed is greater than 5mm / s, the viscosity of the glue dots is greater than or equal to 3000mPa·s, and the thixotropic index is greater than or equal to 3. The greater the viscosity and thixotropic index, the easier it is to form a depression. The preset circle radius is less than or equal to 5 mm, and the glue dot amount is greater than or equal to 0.001 mg. By utilizing the above parameters and the corresponding relationship between the above parameters and the depression to adjust the depression, it is ensured that the required specific depression can be formed, thereby ensuring that the LED emits a corresponding large area and evenly distributed light pattern and visual effect.

[0101] The above is a detailed introduction to an LED packaging structure and packaging method disclosed in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention. Any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An LED package structure, wherein the LED package structure is a single LED chip package structure, characterized in that: The LED packaging structure includes a substrate, an LED, and a colloid layer. The LED is disposed on the substrate, and the colloid layer covers the LED. The colloid layer is recessed toward the LED in a middle portion of a surface on one side of the substrate away from the substrate. The recessed colloid layer is formed by first expanding outward from the center of the LED and then contracting, or by contracting from the periphery of the LED toward the center of the LED, based on the LED. The bottom surface of the depression is arc-shaped; the distance from the lowest point of the depression to the substrate is set to h, the maximum thickness of the colloid layer is H, and the maximum diameter of the colloid layer is R; the ratio of h to R (h / R) is the center aspect ratio p, where p is less than 0.6; the ratio of H to R (H / R) is the maximum aspect ratio P, where P is less than or equal to 0.6; by adjusting h, H, and R, and then adjusting p and P, the light curve angle and batwing shape are adjusted, so that the light emitted by the LED forms different light curve angles and batwing shapes after passing through the colloid layer.

2. The LED package structure according to claim 1, wherein: The viscosity of the material used for the colloid layer is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3.

3. An LED packaging method for preparing the LED packaging structure according to any one of claims 1 to 2, characterized in that: The following steps are involved: Mount the LED on the substrate; Identify the position of the LED and use the LED as a reference to form a colloidal layer with a concave middle portion by first expanding outward from the center of the LED and then contracting, or contracting from the periphery of the LED to the center of the LED; The colloid layer is cured.

4. The LED packaging method according to claim 3, wherein: The method of first spreading outward from the center of the LED and then contracting specifically includes the following steps: Aim the dispensing head at the center of the LED and spray the glue dots toward the center of the LED at a preset speed. When the glue dots initially fall, they spread outward from the center of the LED. The glue dispensing operation is performed a preset number of times at a preset time interval on the same LED center. After the glue dispensing is completed, the glue dots that spread from the LED center to the surrounding areas shrink toward the LED center to form a glue layer with a concave middle portion.

5. The LED packaging method according to claim 4, wherein: The preset speed is greater than 5 mm / s, the viscosity of the glue point is greater than or equal to 3000 mPa·s, the thixotropic index is greater than or equal to 3, and the preset time interval is less than 1 s.

6. The LED packaging method according to claim 3, wherein: The method of shrinking from the periphery of the LED to the center of the LED specifically includes the following steps: The dispensing head uses the center of the LED as the reference point and the preset distance as the distance between the dispensing point and the center of the LED. Glue points are dispensed around the center of the LED at the preset distance according to the preset number of glue points, so that the glue points flow to cover the chip and shrink toward the center of the LED to form a colloid layer with a concave middle part.

7. The LED packaging method according to claim 6, wherein: The number of preset glue dots is greater than or equal to 4, the preset distance is less than or equal to 5 mm, the glue dot amount is greater than or equal to 0.001 mg, the viscosity is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3.

8. The LED packaging method according to claim 3, wherein: The method of shrinking from the periphery of the LED to the center of the LED specifically includes the following steps: The dispensing head uses the center of the LED as the center of the circle and draws a circle with a preset radius as the radius of the circle, so that the glue dots flow to cover the chip and shrink toward the center of the LED to form a colloidal layer with a concave middle part.

9. The LED packaging method according to claim 8, wherein: The preset circle radius is less than or equal to 5 mm, the glue dispensing amount is greater than or equal to 0.001 mg, the viscosity is greater than or equal to 3000 mPa·s, and the thixotropic index is greater than or equal to 3.

Images