An igbt cleaning device

Abstract

The present application relates to a kind of IGBT cleaning device, including rack, top open box is equipped on the rack, box is matched with the cover plate that is turned over in the open at open, the upper surface or lower surface of cover plate is equipped with cover plate groove, cover plate is equipped with retractable locking mechanism on the position corresponding to the opposite side of cover plate groove;Box is equipped with first horizontal moving platform, first horizontal moving platform is installed with the air knife or plasma torch that moves horizontally by first horizontal moving platform, the nozzle of air knife or plasma torch is towards cover plate and is spaced apart with cover plate between interval distance that avoids cover plate overturning;The inner bottom surface of box is equipped with dust extraction mechanism;Rack is also equipped with material conveying mechanism by first motor driving and parallel with box.The present application realizes the cleaning of automation, improves the cleaning effect and cleaning efficiency, and reduces cost.

Description

Technical Field

[0001] This invention relates to the field of IGBT manufacturing technology, and in particular to an IGBT cleaning device. Background Technology

[0002] IGBT is the abbreviation for Insulated Gate Bipolar Transistor, a semiconductor switching device mainly composed of a heat sink substrate, a DBC substrate, an IGBT chip, a diode chip, and bonding wires. In existing technologies, ultrasonic welding is used to bond the terminals to the DBC (Directed Bonding) substrate. Copper base On the board. The DBC substrate needs to be cleaned before and after soldering the terminals. To ensure soldering quality, the IGBT terminals should be cleaned before soldering to ensure the solder joints are not affected by external dust and impurities. After soldering, cleaning is also necessary to remove residues generated during the soldering process. However, in existing technology, the traditional cleaning method mainly involves manual cleaning with a handheld nitrogen gun. This method is inconvenient, time-consuming, labor-intensive, and has low cleaning efficiency; it also cannot guarantee uniform and comprehensive cleaning, and is affected by the surrounding environment, resulting in poor cleaning effects. Summary of the Invention

[0003] To address the shortcomings of existing solutions, this invention provides an IGBT cleaning device.

[0004] The technical solution adopted by this invention to solve its technical problem is: an IGBT cleaning device, including a frame, a box with an open top is provided on the frame, a cover plate that flips inside the open is matched and installed at the opening of the box, a cover plate groove is provided on the upper or lower surface of the cover plate, a positioning post is provided at the bottom of the cover plate groove, and a cover plate through hole is provided in the center of the bottom of the cover plate groove; a retractable locking mechanism is provided on the cover plate at positions corresponding to opposite sides of the cover plate groove, the locking mechanism includes two symmetrically arranged grippers and two cylinders that correspond one-to-one with the two grippers and drive the grippers to extend and retract; a retractable locking mechanism is provided inside the box. A first horizontal moving platform moves along the XY axes. An air knife or plasma spray gun, which moves horizontally along the first horizontal moving platform, is mounted on the first horizontal moving platform. The nozzle of the air knife or plasma spray gun faces the cover plate and is spaced apart from the cover plate by a distance to avoid the cover plate from flipping. A dust collection mechanism is provided on the inner bottom surface of the housing. A material conveying mechanism driven by a first motor is also provided on the frame, parallel to the housing. The material conveying structure includes a material conveyor belt and a robotic arm mounted on the frame. The material conveyor belt is parallel to the housing and driven by the first motor mounted on the frame. The robotic arm is positioned above the housing and the material conveyor belt.

[0005] Preferably, the gripper is a long horizontal bar, and a locking block is provided on the opposing surfaces of the two grippers, with multiple locking blocks spaced apart on each gripper.

[0006] Preferably, the dust collection mechanism includes a funnel-shaped dust collection hopper disposed on the bottom surface of the housing and a negative pressure dust removal fan mounted on the frame and connected to the lower outlet of the dust collection hopper.

[0007] Preferably, the robotic arm includes a second horizontal moving platform mounted on a frame and located above the housing, a mounting base horizontally slidably mounted on the second horizontal moving platform, and a gripper cylinder vertically slidably mounted on the mounting base.

[0008] Preferably, fiber optic sensors are installed on the frame at positions corresponding to the beginning and end of the material conveyor belt, and the frame is also equipped with liftable stops corresponding to the fiber optic sensors.

[0009] Preferably, the extension and retraction direction of the locking mechanism is perpendicular to the center line of the cover plate's flipping axis.

[0010] The beneficial effects of this invention are as follows: This invention uses a robotic arm to place the carrier tray containing IGBTs into the groove of the cover plate, and then locks it onto the cover plate through a locking mechanism. After that, the substrate is flipped into the box by flipping the cover plate. Finally, dust is removed by a moving air knife or plasma spray gun inside the box, realizing automated dust removal. It can remove dust from the substrate very thoroughly and evenly, and the removed dust is removed from the box by a dust suction mechanism, keeping the box clean and improving the cleaning effect and efficiency. It avoids the influence of the surrounding environment during the dust removal process, making it convenient to operate. At the same time, the material conveying mechanism solves the problem of inconvenience of manual operation and also improves work efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the box body according to an embodiment of the present invention; Figure 3 A schematic diagram of an embodiment of the present invention showing the placement of an IGBT on the cover plate and the removal of two side walls of the housing; Component names and serial numbers in the diagram: 1-Frame 2-Box 3-Cover plate 30-Cover plate groove 31-Positioning post 32-Cover plate through hole 4-Locking mechanism 40-Gripper 41-Cylinder 400-Clamping block 5-First horizontal moving platform 50-Air knife 6-Dust collection hopper 7-Material conveyor belt 70-Robot arm 700-Second horizontal moving platform 701-Mounting base 702-Gripper cylinder 8-Light sensor 80-Stop block. Detailed Implementation

[0012] The present invention will be further described below with reference to embodiments, providing a clear and complete description. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. The implementation conditions used in the embodiments may be further adjusted according to the specific manufacturer's conditions, and the implementation conditions not specified are generally those in conventional experiments. Furthermore, the directional terms mentioned in the present invention, such as "up," "down," "front," "back," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying illustrations. The use of directional terms is for better and clearer explanation and understanding of the present invention, and is not intended to indicate or imply any necessary orientation of the present invention; therefore, they should not be construed as limitations on the present invention.

[0013] Examples of embodiments of the present invention Figures 1 to 3As shown, an IGBT cleaning device includes a frame 1 with a housing 2 having an open top mounted on the frame 1. The housing 2 is positioned on the left side of the frame 1. One or more side walls of the housing 2 can be made of transparent glass, allowing for clear observation of the interior of the housing 2 during dust removal, such as the cleanliness of the internal space and the cleaning progress. A cover 3 that flips inside the opening is fitted onto the housing 2. The cover 3 closes the opening at the top of the housing 2. The flipping of the cover 3 can be achieved by a second motor located at the midpoint of the rear outer wall near the top of the opening of the housing 2, which drives the cover 3 to rotate. A servo motor is selected as the motor, and a rear rotating shaft is fixedly connected to the output shaft of the second motor. A through hole is provided in the middle of the rear side wall of the housing 2 for the rear rotating shaft to pass through. The rear rotating shaft extends into the housing 2 through this through hole and connects to the rear side wall of the cover plate 3. At the same time, a groove is provided in the middle of the front inner wall of the housing 2, which is the position corresponding to the rear rotating shaft. A bearing is installed in the groove, and the front rotating shaft is installed in the inner ring of the bearing. The front rotating shaft is connected to the front side wall of the cover plate 3. In this way, driven by the second motor, the cover plate 3 can rotate up and down in the opening. A cover plate groove 30 is provided on the upper or lower surface of the cover plate 3, that is, a groove 30 is provided on the upper surface of the cover plate 3. A cover plate groove 30 is provided on the lower surface of the cover plate 3. By flipping the cover plate 3, the cover plate groove 30 will be rotated to face the inner bottom surface of the housing 2. The cover plate groove 30 is designed as a rectangular structure to hold the IGBT carrier tray. The IGBT is positioned on the carrier tray. The cover plate 3 is provided with retractable locking mechanisms 4 on opposite sides of the cover plate groove 30. That is, locking mechanisms 4 are provided on both the left and right sides of the top or bottom surface of the cover plate 3. The locking mechanisms 4 position the IGBT and the carrier tray on the cover plate 3. At this time, the extension and retraction direction of the locking mechanism 4 is perpendicular to the axis of rotation of the cover plate 3. That is, the axis of the cover plate 3 flipping is in the front-back direction. The locking mechanism 4 is set on the left and right sides of the cover plate groove 30 to avoid the locking mechanism 4 from having an adverse effect on the flipping of the cover plate 3. As for the locking mechanism 4, the locking mechanism 4 includes two symmetrically arranged claws 40 and two cylinders 41 that correspond one-to-one with the two claws 40 and drive the claws 40 to extend and retract. A claw 40 and a cylinder 41 that drives the claw 40 are set on the left side of the top surface of the cover plate 3. A claw 40 and a cylinder 41 that drive the claw 40 are also set on the right side of the top surface of the cover plate 3. The IGBT and the carrier plate are fixed by driving the claw 40 to move into the cover plate groove 30 through the cylinder 41.To ensure the locking mechanism 4 is secure and prevent the IGBT and carrier plate from falling off during the flipping of the cover plate 3, the gripper 40 is a long, horizontal bar. Each of the two grippers 40 has a locking block 400 on its opposing surface, with multiple locking blocks 400 spaced apart on each gripper 40. The opposing surfaces of the two horizontal bars are the inner surfaces, and the cylinder 41 is connected to the middle of the outer surface of the horizontal bar. Multiple locking blocks 400 are spaced apart along the front-back direction of the inner surface of the horizontal bar. The carrier plate is then configured as a rectangular frame with a square through-hole in the center that matches the IGBT heat sink. Top grooves are provided on the top surface of the carrier plate at positions corresponding to the locking blocks 400. These top grooves allow for sliding and elastic pressing against the IGBT heat sink, engaging with the locking blocks 400. The telescopic positioning component, which is locked in conjunction with the 00, includes a sliding rod and a telescopic spring. The telescopic spring is sleeved on the sliding rod, and its outer end, corresponding to the top slide groove, is connected to the sliding rod. Its inner end is connected to the groove wall of the top slide groove, and its outer end is the end away from the square through hole. In the initial state, the sliding rod is in the top slide groove. Driven by the cylinder, the crossbar moves into the groove of the cover plate. The locking block 400 on the crossbar inserts into the top slide groove and pushes the sliding rod into the square through hole. The end of the sliding rod adjacent to the square through hole slides out of the top slide groove and presses against the IGBT heat sink substrate to position the IGBT and the carrier plate. During and after the flipping of the cover plate 3, the IGBT will not fall off the cover plate. The housing 2 is provided with a first horizontal moving plate. Platform 5, the first horizontal moving platform 5, is a moving platform that moves in the XY axis direction. An air knife 50 or plasma spray gun is mounted on the first horizontal moving platform 5, moving horizontally along it. The nozzle of the air knife 50 or plasma spray gun faces the cover plate 3 and is spaced apart from the cover plate 3 by a distance to avoid its flipping. After the air knife 50 or plasma spray gun is mounted on the first horizontal moving platform 5, it can move horizontally. After the IGBT is placed on and positioned on the cover plate 3, the cover plate 3 flips, so the IGBT is facing the nozzle, and the nozzle faces the IGBT. As the air knife 50 or plasma spray gun moves, the IGBT can be thoroughly cleaned. To prevent the air knife 50 or plasma spray gun from causing the cover plate 3 to flip... The first horizontal moving platform 5 is located in the lower part of the housing 2. There is a distance between the nozzle of the air knife 50 or plasma spray gun and the cover plate 3, which is greater than the radius of the cover plate 3's rotation, i.e., half the length of the cover plate 3 in the left-right direction. A dust collection mechanism is installed on the inner bottom surface of the housing 2 to remove dust removed from the IGBTs by the air knife 50 or plasma spray gun, maintaining a clean internal environment and preventing dust from re-adhering to the IGBTs when the air knife 50 or plasma spray gun stops working. A material conveying mechanism driven by the first motor is also installed on the frame 1, parallel to the housing 2. This mechanism conveys the IGBTs to be cleaned to the cover plate 3, achieving automatic feeding and facilitating use.

[0014] Further improvements, such as Figure 3 As shown, the dust collection mechanism includes a funnel-shaped dust collection hopper 6 located on the bottom surface of the housing 2, and a negative pressure dust removal fan (not shown) mounted on the frame 1 and connected to the lower outlet of the dust collection hopper 6. If the bottom surface of the housing 2 is set into a funnel-shaped structure to form a dust collection hopper, the dust removed from the IGBT will fall into the dust collection hopper 6. At the same time, the negative pressure dust removal fan will suck the dust away from the dust collection hopper 6 to keep the inside of the housing 2 clean.

[0015] Further improvements, such as Figure 1As shown, the material conveying structure includes a material conveyor belt 7 and a robot arm 70 mounted on the frame 1. The material conveyor belt 7 is arranged parallel to the housing 2 and driven by a first motor mounted on the frame 1. The robot arm 70 is positioned above the housing 2 and the material conveyor belt 7. The material conveyor belt 7 is located on the right side of the housing 2 and consists of a left-side conveyor belt and a right-side conveyor belt arranged parallel to each other. The two conveyor belts move synchronously driven by the first motor. The bottom surfaces of the left and right sides of the IGBT carrier tray abut against the left and right conveyor belts respectively. When this IGBT cleaning device is used for cleaning before IGBT soldering, the robot arm 70 is positioned on the housing 2. The IGBT cleaning device is located at the upper rear side, above the tail end of the material conveyor belt 7. When the IGBT cleaning device is used for cleaning after IGBT welding, the robot arm 70 is positioned at the upper front side of the housing 2, above the head of the material conveyor belt 7. The material conveyor belt 7 transports the IGBTs to the area below the robot arm 70. The robot arm 70 then picks up the carrier tray containing the IGBTs from the material conveyor belt 7, moves it to the top of the housing 2, and places the carrier tray in the cover plate groove 30. The locking mechanism 4 then locks and positions the carrier tray on the cover plate 3. Finally, the cover plate 3 is flipped to place the IGBTs inside the housing 2, where they are cleaned using an air knife 50 or a plasma spray gun. At this time, the robot arm 70 includes a second horizontal moving platform 700 set on the frame 1 and located above the housing 2, a mounting base 701 horizontally slidably set on the second horizontal moving platform 700, and a gripper cylinder 702 vertically slidably set on the mounting base 701. The mounting base 701 is moved by the second horizontal moving platform 700 so that the gripper cylinder 702 is moved directly above the material conveyor belt 7. The gripper cylinder 702 is used to grab the IGBT and transport the IGBT directly above the housing 2. Then the gripper cylinder 702 descends and places the IGBT in the cover plate groove 30. The second horizontal moving platform 700 can be a moving platform that can move in the XY axis direction. Fiber optic sensors 8 are installed on the frame 1 at the beginning and end positions of the material conveyor belt 7. A liftable stop block 80 corresponding to the fiber optic sensors 8 is also installed on the frame 1. The fiber optic sensors 8 are reflective fiber optic sensors used to detect the presence of items on the material conveyor belt 7. The fiber optic sensors 8 are positioned slightly higher than the material conveyor belt 7, corresponding to the beginning (feeding end) and end (discharge end) of the material conveyor belt 7. Thus, when an IGBT passes through the feeding end of the material conveyor belt 7, the fiber optic sensor 8 at the beginning position can detect the presence of material on the material conveyor belt 7. When the fiber optic sensor 8 at the end position detects material, the stop block 80 is raised, lifting the carrier tray containing the IGBT from the material conveyor belt. The gripper cylinder 702 then grasps the IGBT carrier tray, achieving automated production. The lifting and lowering of the stop block 80 is driven by a lifting cylinder installed on the frame 1.

[0016] Further improvements, such as Figure 2 As shown, the cover plate groove 30 has a positioning post 31 at the bottom of the groove. The positioning post 31 can be used to cooperate with the through hole on the edge of the heat sink substrate of the IGBT to form a positioning, which further enhances the stability of the IGBT on the cover plate 3. The cover plate groove 30 has a cover plate through hole 32 in the center of the bottom of the groove, which facilitates the installation and positioning of the IGBT on the cover plate 3.

[0017] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. An IGBT cleaning device, characterized in that: The device includes a frame with an open-top housing. A cover plate that flips within the open is fitted onto the housing. The cover plate is driven by a second motor located near the top center of the rear outer wall of the housing opening. A cover plate groove is formed on the upper or lower surface of the cover plate, with a positioning post at the bottom and a through hole at the center of the groove. A retractable locking mechanism is positioned on the cover plate corresponding to the two sides of the groove. The locking mechanism includes two symmetrically arranged grippers and two cylinders that correspond to and drive the grippers to extend and retract. A first horizontal moving platform movable in the XY axis direction is installed inside the housing. An air knife or plasma spray gun, which moves horizontally along the platform, is mounted on the first horizontal moving platform. The nozzle of the air knife or plasma spray gun faces the cover plate and is spaced apart from it by a distance to prevent the cover plate from flipping. A dust collection mechanism is provided on the inner bottom surface of the housing. The frame... A material conveying mechanism driven by a first motor is also provided parallel to the housing. The material conveying mechanism includes a material conveyor belt and a robot arm mounted on the frame. The material conveyor belt is arranged parallel to the housing and driven by the first motor mounted on the frame. The robot arm is positioned above the housing and the material conveyor belt. The extension and retraction direction of the locking mechanism is perpendicular to the center line of the cover plate flipping axis. The gripper is a long strip-shaped crossbar. Each of the two grippers has a locking block on its opposing surface. Multiple locking blocks are spaced apart on each gripper. The cover plate groove is used to place the IGBT carrier tray, and the IGBT is positioned on the carrier tray. The carrier tray is configured as a rectangular frame with a square through hole in the middle that matches the heat sink of the IGBT. Top grooves are provided on the top surface of the carrier tray at positions corresponding to the locking blocks. A telescopic positioning component that can elastically extend and retract against the heat sink of the IGBT and locks with the locking block is slidably arranged in the top groove. The telescopic positioning component includes a sliding rod and a telescopic spring.

2. The IGBT cleaning device according to claim 1, characterized in that... The dust collection mechanism includes a funnel-shaped dust collection hopper located on the bottom surface of the housing and a negative pressure dust removal fan mounted on the frame and connected to the lower outlet of the dust collection hopper.

3. The IGBT cleaning device according to claim 1, characterized in that... The robotic arm includes a second horizontal moving platform mounted on a frame and located above the housing, a mounting base horizontally slidably mounted on the second horizontal moving platform, and a gripper cylinder vertically slidably mounted on the mounting base.

4. The IGBT cleaning device according to claim 1, characterized in that... The frame is equipped with fiber optic sensors at the beginning and end of the material conveyor belt, and the frame is also equipped with lifting blocks corresponding to the fiber optic sensors.

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