Polyhedral oligomeric silsesquioxane and preparation method and application thereof

Abstract

The application provides a kind of polyhedral oligomeric silsesquioxane and its preparation method and application, belong to polyhedral oligomeric silsesquioxane technical field, the structural formula of polyhedral oligomeric silsesquioxane of the application is as shown in formula (1): formula (1) in, R a , R b , R c , R d , R e , R f , R g , R h At least one of them is different, and each is independently-SCH2COOCH2CH (OH) CH2OOC (CH3) =CH2, -SCH2COOCH2CH (OH) CH2O (CH2) 4Si (OCH3) 3.The polyhedral oligomeric silsesquioxane of the application is applied to adhesive or coating material, which can improve the hardness, wear resistance of adhesive or coating material, and reduce the shrinkage rate when resin curing.

Description

Technical Field

[0001] This application relates to the field of polyhedral oligomeric silsesquioxane technology, specifically to a polyhedral oligomeric silsesquioxane, its preparation method, and its application. Background Technology

[0002] Polyhedral oligomeric silsesquioxanes (POSS), as a novel nano-organic-inorganic hybrid material, possess a rigid cage-like structure at the nanoscale, with molecular sizes typically ranging from 1 to 3 nm. They consist of an inorganic framework core formed by Si-O-Si, surrounded by organic groups. POSS side groups exhibit reactive or polymerizable functional groups, a controllable number of active groups, and good compatibility with organic compounds. They can be used in adhesives or coating systems, forming diverse structures such as star-shaped, beaded, or three-dimensional cross-linked networks with other polymers. This enhances the adhesion, temperature resistance, chemical resistance, insulation, shrinkage, gloss, hardness, and abrasion resistance of coatings. POSS combines the good reactivity, moldability, and low cost of organic polymers with the excellent properties of inorganic materials, such as high temperature resistance, high strength, and regular crystal forms, into a single material, greatly facilitating material design and adjustment. It holds significant potential in the preparation of high-performance adhesives or new coating materials.

[0003] Ultraviolet (UV) curing technology is widely used due to its advantages such as fast curing speed, low curing temperature, energy saving, environmental friendliness, and good film-forming properties. However, photosensitive resins only achieve optimal performance when exposed to sufficiently high radiation intensity. For areas not easily exposed to UV radiation (such as shadow covering or filler covering), resin curing is affected. Furthermore, due to the short curing time, residual stress, hardness, abrasion resistance, and volume shrinkage are easily present in the cured resin, leading to defects that limit its practical applications. UV-moisture dual-curing technology offers a significant synergistic effect, combining the fast curing speed of UV curing with the deep curing capabilities of moisture curing. It overcomes the limitations of UV curing alone in terms of curing depth and the limitations of colored systems, while also mitigating the drawbacks of long moisture curing times. Therefore, based on this background, the development and application of combining POSS-based materials with UV-moisture dual-curing technology has broad market value and promising prospects. For example, Chinese patent (CN109868084A) discloses a UV-polymerized POSS-modified acrylic pressure-sensitive adhesive. This pressure-sensitive adhesive has excellent tack, peel strength, tensile strength, and high-temperature resistance. Its drawback is that modification is only performed on one corner of the POSS, which can easily cause POSS agglomeration or even phase separation. Chinese patent (CN 112062964A) discloses a method for preparing a dual-curable polysiloxane acrylic resin and its application. Its advantages include a simple preparation process, good product stability, high resin curing efficiency, and good mechanical properties and high / low temperature resistance. Its disadvantage is that the resin has low hardness and poor wear resistance after curing. Summary of the Invention

[0004] The purpose of this application is to overcome the shortcomings of the prior art and provide a polyhedral oligomeric silsesquioxane, its preparation method and application; the polyhedral oligomeric silsesquioxane, when applied to adhesives or coating materials, can improve the hardness and wear resistance of adhesives or coating materials, and reduce the shrinkage rate during resin curing.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: a polyhedral oligomeric silsesquioxane, characterized in that the structural formula of the polyhedral oligomeric silsesquioxane is shown in formula (1):

[0006]

[0007] In equation (1), R a R b R c R d R e R f R g R h At least one of them is different, and each is independently -SCH2COOCH2CH(OH)CH2OOC(CH3)=CH2.

[0008] -SCH2COOCH2CH(OH)CH2O(CH2)4Si(OCH3)3.

[0009] In this application, by introducing methacryloxy and alkoxy groups onto the eight side groups of POSS, a polyhedral oligomeric silsesquioxane is obtained for the preparation of adhesives or coating materials. Firstly, the polyhedral oligomeric silsesquioxane can act as an inorganic molecule, enhancing the hardness and wear resistance of the adhesive or coating material. Secondly, the functional groups on the side groups of the polyhedral oligomeric silsesquioxane can prevent the aggregation of organic molecules in the adhesive or coating material, improving the temperature resistance and compatibility of the resin in the adhesive or coating material. Thirdly, during curing, the polyhedral oligomeric silsesquioxane acts as a crosslinking site, forming an interpenetrating crosslinking network with the resin in the adhesive or coating material, reducing the shrinkage rate of the adhesive or coating material. Fourthly, the functional groups on the side groups of the polyhedral oligomeric silsesquioxane enable the adhesive or coating material to undergo both photocuring and moisture curing simultaneously, broadening the application range of the adhesive or coating material.

[0010] Optionally, the structural formula of the polyhedral oligomeric silsesquioxane is shown in formula (2) or formula (3):

[0011]

[0012] The inventors discovered that when polyhedral oligomeric silsesquioxanes are structured as shown in formula (2) or formula (3), the adhesives or coatings exhibit better performance when applied to them.

[0013] Secondly, a method for preparing the aforementioned polyhedral oligomeric silsesquioxane is provided, comprising the following steps:

[0014] Preparation of intermediate product A: OctadecylvinylPOSS and mercaptoacetic acid were dissolved in the first solvent, and a photocatalyst was added to carry out the first reaction. After post-treatment, the resulting product was obtained as intermediate product A.

[0015] Preparation of polyhedral oligomeric silsesquioxanes: Under an inert gas atmosphere at 50–80 °C, intermediate product A is dissolved in a second solvent, and glycidyl methacrylate, 3-glycidyl etheroxypropyltrimethoxysilane and a polymerization inhibitor are added for a second reaction. After post-treatment, the resulting product is polyhedral oligomeric silsesquioxanes.

[0016] This application first involves an addition reaction of the alkenyl group on the side group of octavinylPOSS, and the resulting intermediate A then undergoes a second addition reaction to obtain a polyhedral oligomeric silsesquioxane. The specific reaction route is shown below:

[0017]

[0018] Where R1 is -SCH2COOH, R a R b R c R d R e R f R g R h At least one of them is different, and each is independently -SCH2COOCH2CH(OH)CH2OOC(CH3)=CH2.

[0019] -SCH2COOCH2CH(OH)CH2O(CH2)4Si(OCH3)3.

[0020] Optionally, the photocatalyst is at least one of 2,2-dimethoxy-2-phenylacetophenone and 2,2-dimethyl-2-hydroxyacetophenone; and / or, the polymerization inhibitor is at least one of phenothiazine, p-hydroxyanisole, hydroquinone, and N,N-dibutyldithiocarbamate.

[0021] The inventors discovered that when the photocatalyst is 2,2-dimethoxy-2-phenylacetophenone and the polymerization inhibitor is p-hydroxyanisole, the rates and yields of the first and second addition reactions are higher.

[0022] Optionally, during the preparation of the intermediate product, the molar ratio of octavinylPOSS to mercaptoacetic acid is 1:(8-20); for example, it can be 1:8, 1:9, 1:10, 1:12, 1:14, 1:16, 1:18, or 1:20. This application is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0023] Optionally, the mass of the photocatalyst is 0.3% to 1% of the total mass of octavinylPOSS and mercaptoacetic acid; for example, it can be 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, or 1%; this application is not limited to the listed values, and other unlisted values ​​within the range are equally applicable.

[0024] Optionally, the mass of the second solvent is 30-50% of the total mass of octavinylPOSS and mercaptoacetic acid; for example, it can be 30%, 32%, 35%, 38%, 40%, 43%, 45%, 47%, or 50%. This application is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0025] Optionally, the molar ratio of intermediate product A, glycidyl methacrylate, and 3-glycidyl etheroxypropyltrimethoxysilane is 1:(1-10):(0.01-8); for example, it can be 1:1:0.01, 1:3:0.01, 1:5:0.01, 1:7:0.01, 1:10:0.01, 1:1:0.1, 1:1:0.5, 1:1:1, 1:1:3, 1:1:5, or 1:1:8. This application is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0026] This application regulates the groups on the side groups of polyhedral oligomeric silsesquioxane by adjusting the molar ratio of intermediate product A, glycidyl methacrylate, and 3-glycidyl etheroxypropyltrimethoxysilane.

[0027] Optionally, the mass of the polymerization inhibitor is 0.1% to 1% of the total mass of intermediate product A, glycidyl methacrylate, and 3-glycidyl etheroxypropyltrimethoxysilane; for example, it can be 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, or 1%. This application is not limited to the listed values, and other unlisted values ​​within the scope are equally applicable.

[0028] Optionally, the mass of the second solvent is 50% to 100% of the total mass of intermediate product A, glycidyl methacrylate, and 3-glycidyl etheroxypropyltrimethoxysilane. For example, it can be 50%, 52%, 55%, 58%, 60%, 63%, 65%, 67%, 70%, 82%, 85%, 88%, 90%, 93%, 95%, 97%, or 100%. This application is not limited to the listed values, and other unlisted values ​​within the range are also applicable.

[0029] In this application, the types of the first solvent and the second solvent are not limited, as long as they can solvent the reactants. Preferably, the first solvent and the second solvent are each independently at least one of tetrahydrofuran, toluene, and dimethylformamide; more preferably, the first solvent and the second solvent are tetrahydrofuran.

[0030] Optionally, the conditions for the first reaction are as follows: reaction under ultraviolet light irradiation for 20 to 40 minutes; optionally, the wavelength of the ultraviolet light is 315 to 400 nm, preferably 365 nm.

[0031] Optionally, the post-processing includes at least one of solvent removal, purification, and drying;

[0032] Optionally, the solvent removal is performed by vacuum heating and drying;

[0033] Optionally, the purification method may be extraction, column chromatography, precipitation and / or crystallization, preferably extraction and / or crystallization, and more preferably extraction; wherein, the purification method is not limited, as long as the intermediate product can be purified;

[0034] Optionally, the solvent for extraction is n-hexane or anhydrous diethyl ether;

[0035] Optionally, the drying process can be natural air drying, atmospheric pressure heating drying, or reduced pressure heating drying, preferably reduced pressure heating drying, and more preferably drying in a vacuum oven at 30–50°C, for example, 40°C.

[0036] On another note, the application of the aforementioned polyhedral oligomeric silsesquioxane in the preparation of conformal coatings or conformal adhesives is provided.

[0037] On another note, a conformal coating is also provided, comprising the following components in parts by weight: 50-60 parts of photocurable resin, 15-25 parts of diluent, 20-25 parts of the polyhedral oligomeric silsesquioxane, 2-5 parts of silane coupling agent, 2-5 parts of photoinitiator, and 0.3-0.6 parts of defoamer.

[0038] Optionally, the photocurable resin is a silicone-modified acrylate;

[0039] And / or, the diluent is at least one of isooctyl acrylate, cyclic trimethylolpropane formal acrylate, isobornyl acrylate, isobornyl methacrylate, 2-phenoxyethyl acrylate, tetrahydrofurfuryl acrylate, and N,N-dimethylacrylamide.

[0040] And / or, the photoinitiator is at least one of 2-hydroxy-methylphenylpropane-1-one, 1-hydroxycyclohexylphenyl ketone, benzoin dimethyl ether, and benzophenone;

[0041] And / or, the siloxane coupling agent is at least one of methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, and aminopropyltriethoxysilane;

[0042] And / or, the defoamer is an organosilicone defoamer; optionally, the defoamer is at least one of BYK-020, BYK-022, BYK-028, and BYK-093.

[0043] Compared with the prior art, the beneficial effects of this application are as follows: By introducing methacryloyloxy and alkoxy groups onto the eight side groups of POSS, the resulting polyhedral oligomeric silsesquioxane can be used to prepare adhesives or coating materials. Firstly, the polyhedral oligomeric silsesquioxane can act as an inorganic molecule, enhancing the hardness and wear resistance of the adhesive or coating material. Secondly, the functional groups on the side groups of the polyhedral oligomeric silsesquioxane can prevent the aggregation of organic molecules in the adhesive or coating material, thereby improving the temperature resistance and compatibility of the resin in the adhesive or coating material. Thirdly, during curing, the polyhedral oligomeric silsesquioxane acts as a crosslinking site, forming an interpenetrating crosslinking network with the resin in the adhesive or coating material, reducing the shrinkage rate of the adhesive or coating material. Fourthly, the functional groups on the side groups of the polyhedral oligomeric silsesquioxane enable the adhesive or coating material to undergo both light curing and moisture curing simultaneously, broadening the application range of the adhesive or coating material. Detailed Implementation

[0044] To better illustrate the purpose, technical solution, and advantages of this application, the following description, in conjunction with specific embodiments and comparative examples, aims to provide a detailed understanding of the content of this application, rather than limiting it. All other embodiments obtained by those skilled in the art without inventive effort are within the protection scope of this application. Unless otherwise specified, the experimental reagents and instruments involved in the implementation of this application are all commonly used reagents and instruments.

[0045] Example 1

[0046] This embodiment provides a polyhedral oligomeric silsesquioxane, the structural formula of which is shown in formula (2):

[0047]

[0048] The preparation method of the polyhedral oligomeric silsesquioxane described in this embodiment is as follows:

[0049] Preparation of intermediate product A: At room temperature, 63.3 g (0.1 mol) octavinyl POSS and 110.4 g (1.2 mol) mercaptoacetic acid were dissolved in 100 ml tetrahydrofuran. After stirring evenly, 0.87 g of photocatalyst 2,2-dimethoxy-2-phenylacetophenone was added. The reaction was then carried out under a 365 nm UV lamp for 30 min. The solvent of the first product was removed by rotary evaporation at 50 °C and 1.33 kPa to obtain the second product. The second product was extracted with anhydrous diethyl ether at room temperature. After centrifugation, the supernatant was removed, and the lower layer was removed by rotary evaporation to remove the residual solvent, thus obtaining intermediate product A.

[0050] Preparation of polyhedral oligomeric silsesquioxane: At room temperature, 84.2 g (0.6 mol) glycidyl methacrylate and 47.26 g (0.2 mol) 3-glycidyl etheroxypropyltrimethoxysilane were dissolved in 100 mL of dimethylformamide to obtain the first solution;

[0051] At 70°C and under a nitrogen atmosphere, 136.9 g (0.1 mol) of intermediate product A was dissolved in 100 ml of dimethylformamide. After stirring evenly, the first solution and 1.34 g of p-hydroxyanisole were added and reacted for 7 h. The solvent of the resulting third product was removed by rotary evaporation at 75°C and an atmospheric pressure of 1.33 kPa to obtain a polyhedral oligomeric silsesquioxane with the structural formula shown in formula (2).

[0052] Example 2

[0053] This embodiment provides a polyhedral oligomeric silsesquioxane and its preparation method. The only difference between the preparation method of the polyhedral oligomeric silsesquioxane in this embodiment and that in Example 1 is that the mass of mercaptoacetic acid is 73.6 g and the amount of substance is 0.8 mol.

[0054] Example 3

[0055] This embodiment provides a polyhedral oligomeric silsesquioxane and its preparation method. The only difference between the preparation method of the polyhedral oligomeric silsesquioxane in this embodiment and that in Example 1 is that the mass of mercaptoacetic acid is 184g and the amount of substance is 2mol.

[0056] Example 4

[0057] This embodiment provides a polyhedral oligomeric silsesquioxane, the structural formula of which is shown in formula (3):

[0058]

[0059] The preparation method of the polyhedral oligomeric silsesquioxane described in this embodiment is as follows:

[0060] Preparation of intermediate product A: At room temperature, 63.3 g (0.1 mol) octavinyl POSS and 110.4 g (1.2 mol) mercaptoacetic acid were dissolved in 100 ml tetrahydrofuran. After stirring evenly, 0.87 g of photocatalyst 2,2-dimethoxy-2-phenylacetophenone was added. The reaction was then carried out under a 365 nm UV lamp for 30 min. The solvent of the first product was removed by rotary evaporation at 50 °C and 1.33 kPa to obtain the second product. The second product was extracted with anhydrous diethyl ether at room temperature. After centrifugation, the supernatant was removed, and the lower layer was removed by rotary evaporation to remove the residual solvent, thus obtaining intermediate product A.

[0061] Preparation of polyhedral oligomeric silsesquioxane: At room temperature, 56.8 g (0.4 mol) glycidyl methacrylate and 94.52 g (0.4 mol) 3-glycidyl etheroxypropyltrimethoxysilane were dissolved in 100 mL of dimethylformamide to obtain the first solution;

[0062] At 70°C and under a nitrogen atmosphere, 136.9 g (0.1 mol) of intermediate product A was dissolved in 100 ml of dimethylformamide. After stirring evenly, the first solution and 1.44 g of p-hydroxyanisole were added and reacted for 7 h. The solvent of the resulting third product was removed by rotary evaporation at 75°C and an atmospheric pressure of 1.33 kPa to obtain a polyhedral oligomeric silsesquioxane with the structural formula shown in formula (3).

[0063] Comparative Example 1

[0064] This comparative example provides a polyhedral oligomeric silsesquioxane, the structural formula of which is shown in formula (4):

[0065]

[0066] The preparation method of the polyhedral oligomeric silsesquioxane described in this comparative example is as follows:

[0067] Preparation of intermediate product A: At room temperature, 63.3 g (0.1 mol) octavinyl POSS and 110.4 g (1.2 mol) mercaptoacetic acid were dissolved in 100 ml tetrahydrofuran. After stirring evenly, 0.87 g of photocatalyst 2,2-dimethoxy-2-phenylacetophenone was added. The reaction was then carried out under a 365 nm UV lamp for 30 min. The solvent of the first product was removed by rotary evaporation at 50 °C and 1.33 kPa to obtain the second product. The second product was extracted with anhydrous diethyl ether at room temperature. After centrifugation, the supernatant was removed, and the lower layer was removed by rotary evaporation to remove the residual solvent, thus obtaining intermediate product A.

[0068] Preparation of polyhedral oligomeric silsesquioxane: At room temperature, 142 g (1 mol) of glycidyl methacrylate was dissolved in 100 mL of dimethylformamide to obtain the first solution;

[0069] At 70°C and under a nitrogen atmosphere, 136.9 g (0.1 mol) of intermediate product A was dissolved in 100 ml of dimethylformamide. After stirring evenly, the first solution and 1.4 g of p-hydroxyanisole were added and reacted for 7 h. The solvent of the resulting third product was removed by rotary evaporation at 75°C and an atmospheric pressure of 1.33 kPa to obtain a polyhedral oligomeric silsesquioxane with the structural formula shown in formula (4).

[0070] Comparative Example 2

[0071] This comparative example provides a polyhedral oligomeric silsesquioxane, the structural formula of which is shown in formula (5):

[0072]

[0073] The preparation method of the polyhedral oligomeric silsesquioxane described in this comparative example is as follows:

[0074] Preparation of intermediate product A: At room temperature, 63.3 g (0.1 mol) octavinyl POSS and 110.4 g (1.2 mol) mercaptoacetic acid were dissolved in 100 ml tetrahydrofuran. After stirring evenly, 0.87 g of photocatalyst 2,2-dimethoxy-2-phenylacetophenone was added. The reaction was then carried out under a 365 nm UV lamp for 30 min. The solvent of the first product was removed by rotary evaporation at 50 °C and 1.33 kPa to obtain the second product. The second product was extracted with anhydrous diethyl ether at room temperature. After centrifugation, the supernatant was removed, and the lower layer was removed by rotary evaporation to remove the residual solvent, thus obtaining intermediate product A.

[0075] Preparation of polyhedral oligomeric silsesquioxane: At room temperature, 236.3 g (1 mol) of 3-glycidyl etheroxypropyltrimethoxysilane was dissolved in 100 mL of dimethylformamide to obtain the first solution;

[0076] At 70°C and under a nitrogen atmosphere, 136.9 g (0.1 mol) of intermediate product A was dissolved in 100 ml of dimethylformamide. After stirring evenly, the first solution and 1.4 g of p-hydroxyanisole were added and reacted for 7 h. The solvent of the resulting third product was removed by rotary evaporation at 75°C and an atmospheric pressure of 1.33 kPa to obtain a polyhedral oligomeric silsesquioxane with the structural formula shown in formula (4).

[0077] Examples 5-8 and Comparative Examples 3-4

[0078] The components and weight parts of the conformal coatings in Examples 5-8 and Comparative Examples 3-4 are shown in Table 1. The preparation methods of the conformal coatings in Examples 5-8 and Comparative Examples 3-4 are as follows:

[0079] According to Table 1, organosilicon-modified acrylate, cyclic trimethylolpropane acetal acrylate, polyhedral oligomeric silsesquioxane, 1-hydroxycyclohexylphenyl ketone, aminopropyltriethoxysilane, and BYK-022 were continuously stirred evenly at room temperature in the dark to obtain a conformal coating.

[0080] The slurry is coated onto the substrate, and then passed through a wavelength of 365nm and an energy of 500mJ / cm. 2 The LED light source is UV cured, and then left to stand for 4 hours at 25℃ and 50% humidity for moisture curing until completely dry, thus obtaining a UV-moisture dual-cured conformal coating.

[0081] Table 1

[0082]

[0083]

[0084] Performance testing:

[0085] (1) Viscosity: The rotational viscosity of the conformal coating was tested at 25°C and 50% humidity.

[0086] (2) UV curing time: wavelength 365nm, energy 500mj / cm 2 The time required for UV curing of LED light sources;

[0087] (3) Moisture curing time: The time required for moisture curing under constant temperature and humidity (25℃, 50% humidity) conditions in absolute light protection; to ensure light protection, all samples were covered with aluminum foil.

[0088] (4) Pencil hardness: Tested according to Article 2.3 of the national standard GB 6739-86 "Coating Hardness - Pencil Hardness Method";

[0089] (5) Shrinkage rate: The ratio of the area of ​​the conformal coating after curing to the area of ​​the slurry before curing;

[0090] (6) Abrasion resistance: According to the national standard GB / T 1768—2006, the rotation speed is 60r / min, the load is 1000g, and the mass loss of the coating is tested after 500 rotations.

[0091] The test results are shown in Table 2.

[0092] Table 2

[0093]

[0094]

[0095] As can be seen from the experimental data in Table 2, the polyhedral oligomeric silsesquioxane of this application can not only be cured by moisture but also by ultraviolet light. In addition, the polyhedral oligomeric silsesquioxane of this application can effectively improve the hardness and abrasion resistance of conformal coatings and significantly reduce the shrinkage rate of conformal coatings, thus enabling conformal coatings to have a wider range of application applications.

[0096] Finally, it should be noted that the above embodiments are used to illustrate the technical solutions of this application and not to limit the scope of protection of this application. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the substance and scope of the technical solutions of this application.

Claims

1. A polyhedral oligomeric silsesquioxane, characterized in that, The structural formula of the polyhedral oligomeric silsesquioxane is shown in formula (1): Equation (1), In equation (1), R a R b R c R d R e R f R g R h At least one of them is different, and each is independently -SCH2COOCH2CH(OH)CH2OOCC(CH3)=CH2. -SCH2COOCH2CH(OH)CH2O(CH2)4Si(OCH3)3.

2. The polyhedral oligomeric silsesquioxane as described in claim 1, characterized in that, The structural formula of the polyhedral oligomeric silsesquioxane is shown in formula (2) or formula (3): Equation (2), Equation (3).

3. A method for preparing a polyhedral oligomeric silsesquioxane as described in claim 1 or 2, characterized in that, Includes the following steps: Preparation of intermediate product A: OctadecylvinylPOSS and mercaptoacetic acid were dissolved in the first solvent, and a photocatalyst was added to carry out the first reaction. After post-treatment, the resulting product was obtained as intermediate product A. Preparation of polyhedral oligomeric silsesquioxanes: Under an inert gas atmosphere at 50-80°C, intermediate product A is dissolved in a second solvent, and glycidyl methacrylate, 3-glycidyl etheroxypropyltrimethoxysilane and a polymerization inhibitor are added for a second reaction. After post-treatment, the resulting product is polyhedral oligomeric silsesquioxanes.

4. The preparation method according to claim 3, characterized in that, The photocatalyst is at least one of 2,2-dimethoxy-2-phenylacetophenone and 2,2-dimethyl-2-hydroxyacetophenone; and / or the polymerization inhibitor is at least one of phenothiazine, p-hydroxyanisole, hydroquinone, and N,N-dibutyldithiocarbamate.

5. The preparation method according to claim 3, characterized in that, The molar ratio of octavinylPOSS to mercaptoacetic acid is 1:(8~20); and / or, the mass of the photocatalyst is 0.3~1% of the total mass of octavinylPOSS and mercaptoacetic acid; and / or, the mass of the first solvent is 30~50% of the total mass of octavinylPOSS and mercaptoacetic acid.

6. The preparation method according to claim 3, characterized in that, The molar ratio of intermediate product A, glycidyl methacrylate, and 3-glycidyl etheroxypropyltrimethoxysilane is 1:(1~10):(0.01~8); and / or, the mass of the polymerization inhibitor is 0.1~1% of the total mass of intermediate product A, glycidyl methacrylate, and 3-glycidyl etheroxypropyltrimethoxysilane; and / or, the mass of the second solvent is 50~100% of the total mass of intermediate product A, glycidyl methacrylate, and 3-glycidyl etheroxypropyltrimethoxysilane.

7. The preparation method according to claim 3, characterized in that, The first solvent and the second solvent are each independently at least one of tetrahydrofuran, toluene, and dimethylformamide.

8. The use of the polyhedral oligomeric silsesquioxane as described in claim 1 or 2 in the preparation of adhesives or coating materials.

9. A three-proof paint, characterized in that, It comprises the following components: a photocurable resin, a diluent, the polyhedral oligomeric silsesquioxane as described in claim 1 or 2, a silane coupling agent, a photoinitiator, and a defoamer.

10. The conformal coating as described in claim 9, characterized in that, The photocurable resin is an organosilicon-modified acrylate; And / or, the diluent is at least one of isooctyl acrylate, cyclic trimethylolpropane formal acrylate, isobornyl acrylate, isobornyl methacrylate, 2-phenoxyethyl acrylate, tetrahydrofurfuryl acrylate, and N,N-dimethylacrylamide. And / or, the photoinitiator is at least one of 2-hydroxy-methylphenylpropane-1-one, 1-hydroxycyclohexylphenyl ketone, benzoin dimethyl ether, and benzophenone; And / or, the silane coupling agent is at least one of methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, and aminopropyltriethoxysilane; And / or, the defoamer is an organosilicone defoamer.

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