A wafer flipping mechanism

Abstract

The present invention belongs to the field of wafer technology, and in particular to a wafer flipping mechanism, comprising a housing, and also comprising a control screen, a camera, an entry and exit device, a flipping device, and a self-locking device mounted on the housing. The wafer flipping mechanism, by providing an entry and exit device, can flip the wafer outside the housing when flipping it, without requiring space for flipping the wafer inside the housing, and without affecting the robot arm's ability to take the next wafer for cleaning. The wafer can be moved in two directions, front and back, by moving the rack. When the holding seat is located in front of the housing, it is convenient to take and place the wafer. When it is located at the rear of the housing, it is convenient to flip the wafer, thereby automatically flipping the wafer, solving the technical problem that the existing wafer needs to be flipped after cleaning, and the cleaning efficiency is reduced by flipping it by the robot arm.

Description

Technical Field

[0001] The present invention relates to the field of wafer technology, and in particular to a wafer flipping mechanism. Background Art

[0002] A wafer refers to the silicon chip used to manufacture silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions.

[0003] After the cleaning process is complete, the robot absorbs the lower surface of the wafer (non-cleaned side) and then takes it out of the basket, places it on the cleaning machine to clean the upper surface (cleaned side) of the wafer. After cleaning is completed, the robot absorbs the lower surface of the wafer and puts the wafer back into the basket again. This will cause the cleaned side of the wafer to face upward. When the robot takes off a wafer, dust will be shaken off, causing the dust to adhere to the cleaned side of the wafer, affecting the quality of wafer cleaning. The existing basket only has the function of holding wafers and cannot flip the wafer after cleaning. Or it can be flipped by a robot with a flip function. This operation increases the movement of the robot and affects the cleaning efficiency. After the robot flips, the wafer faces downward and is only fixed by negative pressure. When there is a problem with the negative pressure suction of the robot, the adsorbed wafer will fall, increasing production losses. Summary of the Invention

[0004] Based on the technical problem that wafers need to be turned over after cleaning to prevent dust from falling on the cleaned surface of the wafer and affecting the quality of the wafer, and that the cleaning efficiency is reduced by turning the wafer over by a robot, the present invention proposes a wafer turning mechanism.

[0005] The present invention provides a wafer flipping mechanism, comprising a housing, a control screen, a camera, an entry and exit device, a flipping device, and a self-locking device mounted on the housing;

[0006] The camera is fixedly mounted on the outer surface of the housing of the control screen, and the camera captures the movement of the manipulator holding the wafer;

[0007] An in-and-out device is disposed inside the housing and pushes wafers that need to be cleaned and wafers that have been cleaned to the outside of the housing. The in-and-out device includes a holding seat for holding wafers, a drive mechanism, and an in-and-out mechanism. The drive mechanism includes a transmission gear. Movement of the transmission gear drives the in-and-out mechanisms at different levels to move. The in-and-out mechanism includes a moving block. The moving block drives the holding seat to move horizontally back and forth under the rotation of the transmission gear.

[0008] A flipping device, comprising a flipping gear for flipping, wherein the flipping mechanism is located on one side of the moving block, and the rotation of the flipping gear drives the holding seat to flip over;

[0009] A self-locking device is arranged inside the holding seat and fixes the wafer in the holding seat. The self-locking device includes a fixing mechanism and a locking mechanism. The fixing mechanism includes a fixing block. When the wafer is turned over, the fixing block rises to support and fix the wafer in the holding seat. When the wafer is taken out, the fixing block descends to release the wafer in the holding seat. The locking mechanism includes a magnetic ball and a fixing groove. The outer surface of the magnetic ball is magnetically adsorbed to the inner wall of the fixing groove to fix the fixing block.

[0010] Preferably, the driving mechanism further comprises a driving motor fixedly mounted on the inner wall of the lower end of the housing, the output shaft of the driving motor being fixedly mounted with a rotating shaft via a coupling, and one end of the rotating shaft being slidably engaged with the inner wall of the transmission gear to drive the rotation of the transmission gear;

[0011] An adjusting motor is fixedly mounted on the inner wall of the upper end of the shell, and a screw is fixedly mounted on the output shaft of the adjusting motor through a coupling, and a movable plate is threadedly connected to the outer surface of the screw, and the lower surface of the movable plate is rotatably connected to the outer surface of the transmission gear through a bearing to drive the lifting action of the transmission gear and to limit the movable plate. A distance measuring sensor is fixedly mounted on the inner wall of the lower end of the shell, and the distance measuring sensor detects the position of the movable plate inside the shell.

[0012] Through the above technical solution, the transmission gear can be engaged with different moving gears through the rotation of the screw rod, so that the receiving seats at different levels can be controlled to move in and out.

[0013] Preferably, the entry and exit mechanism also includes a limiting groove body, the outer surface of the limiting groove body is fixedly installed with the outer surface of the outer shell, and one side thereof extends through the inner wall of the outer shell to the interior thereof, the outer surface of the moving block is slidably inserted into the inner top wall of the limiting groove body, the outer surface of the moving block is fixedly installed with a moving rack, the inner wall of the limiting groove body is rotatably connected with a moving gear, the outer surface of the moving gear is meshed with the outer surface of the moving rack, and the outer surface of the moving gear is meshed with the outer surface of the transmission gear.

[0014] Through the above technical solution, the rotation of the transmission gear drives the rotation of the mobile gear, thereby driving the mobile rack engaged with the mobile gear to move horizontally. By raising and lowering the transmission gear, it can be engaged with the mobile gears at different levels, and multiple holding seats can be driven in and out by one drive motor.

[0015] Preferably, the inner bottom wall of the limiting groove body is fixedly installed with symmetrically distributed lower contact pieces, the lower surface of the movable rack is fixedly installed with an upper contact piece, and the upper surface of the lower contact piece is electrically connected to the lower surface of the upper contact piece to realize the limiting action of the movement of the movable rack.

[0016] Through the above technical solution, the moving rack has two different upper contact pieces. After the two upper contact pieces contact the lower contact piece in the limit slot body, different resistances are generated to judge the position of the moving rack. When the upper contact pieces of the moving rack are in contact with the lower contact piece, the moving rack is in a reset state. After the moving rack moves, different upper contact pieces contact the lower contact piece, and different resistance values ​​are generated. The position of the moving rack can be judged, and it is convenient to stop the driving motor. At the same time, the position of the moving rack is known, which is convenient for driving the holding seat to move to the required position.

[0017] Preferably, the flipping device also includes a flipping shell installed on the outer surface of the moving block, the cross-section of the flipping shell is an inverted U shape, a dual-axis motor is fixedly installed on the inner wall of the flipping shell, and half gears are installed on the inner walls of both ends of the flipping shell through bearings. One end of the output shaft of the dual-axis motor drives the half gear to rotate through the cooperation of a belt and a pulley, and the outer surface of the half gear engages with the outer surface of the flipping gear to drive the holding seat to flip.

[0018] Through the above technical solution, the flipping of the holding seat and the movement of the fixed block can be achieved through the rotation of a half gear, which can reduce the investment in the driving source and reduce the production cost. After the half gear rotates and engages with the outer surface of the flipping gear, the half gear rotates half a circle to drive the flipping gear to rotate one circle.

[0019] Preferably, a connecting shaft is fixedly installed on the outer surfaces of both sides of the receiving seat, one end of the connecting shaft passes through the inner wall of the flip shell and is rotatably connected to the inner wall of the flip shell through a bearing, and one end of the connecting shaft is fixedly installed on the inner wall of the flip gear.

[0020] Through the above technical solution, the rotation of the connecting shaft can drive the placement seat to flip, thereby turning the wafer over.

[0021] Preferably, a plug-in rod with a limit block is fixedly installed on the inner wall of the flip shell, and one end of the two plug-in rods is slidably sleeved with an electromagnet for locking the connecting shaft. The two electromagnets are symmetrically distributed, and the appearance of the electromagnet has a semicircular notch adapted for the connecting shaft, and the outer surface of the plug-in rod is sleeved with a reset spring for resetting the electromagnet.

[0022] Through the above technical solution, after the two symmetrical electromagnets are energized, the electromagnets move on the plug-in rod and adsorb each other, clamping the connecting shaft in the middle of the electromagnet to prevent the connecting shaft from rotating on its own and affecting the flipping of the wafer.

[0023] Preferably, the fixing mechanism also includes a transmission rod with a gear, and both ends of the transmission rod are rotatably connected to the inner wall of the flip shell through bearings. The outer surface of the gear of the transmission rod is engaged with the outer surface of the half gear to drive the rotation of the transmission rod. The inner wall of the flip shell is equipped with a fixed shaft through a bearing seat, and one end of the transmission rod drives the rotation of the fixed shaft through a gear plate group.

[0024] Through the above technical solution, after the half gear rotates to one side of the transfer rod, it can drive the transfer rod to rotate. One rotation of the half gear can complete the self-locking of the wafer and the flipping of the placement seat.

[0025] Preferably, a fixed gear is fixedly installed at one end of the fixed shaft, the outer surface of the receiving seat is slidably inserted into the outer surface of the fixed block, the outer surface of the fixed block is fixedly installed with a fixed rack, and the outer surface of the fixed gear is meshed with the outer surface of the fixed rack.

[0026] Through the above technical solution, the fixed rack can be driven to rise and fall by rotating the fixed gear, so that the fixed block can be located inside the holding seat, supporting both sides of the wafer inserted in the holding seat to prevent the wafer from falling during flipping. At the same time, when the fixed gear is rotated to a place where there is no tooth groove, it does not engage with the fixed rack, so that the fixed rack does not cause obstruction when the holding seat is flipped.

[0027] Preferably, the locking mechanism also includes a locking groove provided inside the holding seat, a telescopic rod being fixedly mounted on the inner wall of the locking groove, one end of the telescopic rod being fixedly mounted to the outer surface of the magnetic ball through a connecting plate, a connecting spring for resetting the magnetic ball being fixedly mounted on the inner wall of the locking groove, the fixing groove being provided on the outer surface of the fixing block, and the outer surface of the magnetic ball being slidably plugged into the inner wall of the fixing groove.

[0028] Through the above technical solution, the magnetic ball is limited by the telescopic rod, and the reset spring facilitates the resetting of the magnetic ball. The magnetic ball is inserted into the fixed groove and can be adsorbed with the inner wall of the fixed groove to limit the fixed block, so that the fixed block can be fixed inside the holding seat to achieve support and fixation of the wafer.

[0029] The beneficial effects of the present invention are:

[0030] 1. By setting up an entry and exit device, when the wafer is turned over, it can be turned over outside the shell, and there is no need to set up the space required for turning the wafer inside the shell, which does not affect the robot arm taking the next wafer for cleaning. The wafer can be moved in two directions, front and back, by moving the rack. When the holding seat is located in front of the shell, it is convenient to take and place the wafer. When it is located at the back of the shell, it is convenient to turn the wafer over, so that the wafer can be automatically turned over, which solves the technical problems that the existing wafer needs to be turned over after cleaning, prevents dust from falling on the cleaning surface of the wafer and affecting the quality of the wafer, and reduces the cleaning efficiency by turning it over by the robot.

[0031] 2. By setting up a flipping device, when the wafer is turned over, the holding seat with the wafer can be driven to flip over. The dual-axis motor drives the rotation of the flipping gear to flip the wafer and keep the cleaned side of the wafer facing down. The flipped holding seat can be locked through the adsorption of the electromagnet to prevent the holding seat from deflecting by itself, causing the wafer to be not in a horizontal state, affecting the subsequent placement.

[0032] 3. By setting a self-locking device, the wafer can be fixed during the flipping process. The fixed block can be raised and lowered by the drive of the dual-axis motor, and the lower end of the wafer can be supported so that the wafer cannot be separated from the holder, thereby preventing the wafer from moving and causing damage to the wafer when the wafer is flipped. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of a wafer flipping mechanism proposed by the present invention;

[0034] Figure 2 A three-dimensional diagram of the adjustment motor structure of a wafer flipping mechanism proposed by the present invention;

[0035] Figure 3 A three-dimensional diagram of a lead screw structure of a wafer flipping mechanism proposed by the present invention;

[0036] Figure 4 A three-dimensional diagram of the drive motor structure of a wafer flipping mechanism proposed by the present invention;

[0037] Figure 5A three-dimensional diagram of a movable rack structure of a wafer flipping mechanism proposed by the present invention;

[0038] Figure 6 A three-dimensional diagram of the lower contact piece structure of a wafer flipping mechanism proposed by the present invention;

[0039] Figure 7 A three-dimensional diagram of a dual-axis motor structure of a wafer flipping mechanism proposed by the present invention;

[0040] Figure 8 A three-dimensional diagram of a half-gear structure of a wafer flipping mechanism proposed by the present invention;

[0041] Figure 9 A three-dimensional diagram of the electromagnet structure of a wafer flipping mechanism proposed by the present invention;

[0042] Figure 10 A three-dimensional diagram of a wafer holding seat structure of a wafer flipping mechanism proposed by the present invention;

[0043] Figure 11 A three-dimensional diagram of a fixed axis structure of a wafer flipping mechanism proposed by the present invention;

[0044] Figure 12 This is a three-dimensional diagram of a fixed missing gear structure of a wafer flipping mechanism proposed by the present invention;

[0045] Figure 13 A three-dimensional diagram of a fixed rack structure of a wafer flipping mechanism proposed by the present invention;

[0046] Figure 14 This is a three-dimensional diagram of the fixed block structure of the wafer flipping mechanism proposed by the present invention.

[0047] In the figure: 1. Housing; 11. Control screen; 12. Camera; 20. Serving seat; 2. Driving motor; 21. Rotating shaft; 22. Transfer gear; 23. Adjusting motor; 24. Screw; 25. Moving plate; 26. Distance sensor; 3. Limiting groove; 31. Moving block; 32. Moving rack; 33. Moving gear; 34. Lower contact piece; 35. Upper contact piece; 4. Flip housing; 41. Dual-axis motor; 42. Half gear; 5. Connecting shaft; 51. Flip gear; 52. Connecting rod; 53. Electromagnet; 54. Reset spring; 6. Transfer rod; 61. Fixed shaft; 62. Fixed missing gear; 63. Fixed block; 64. Fixed rack; 7. Locking groove; 71. Telescopic rod; 72. Magnetic ball; 73. Connecting spring; 74. Fixed groove. DETAILED DESCRIPTION

[0048] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0049] Referring to Figure 1-14 , a wafer flipping mechanism includes a housing 1. The cross-section of the housing 1 is in a shape of a Chinese character 'hui', and further includes a control screen 11, a camera 12, an inlet / outlet device, a flipping device, and a self-locking device installed on the housing 1;

[0050] The camera 12 is fixedly installed on the outer surface of the housing of the control screen 11. When the control screen 11 is foldable, it is convenient to adjust the screen angle of the control screen 11. The control screen 11 can display the quantity of wafers after cleaning, and can also manually control the inlet / outlet device, the flipping device, and the self-locking device, which is convenient for manual operation. The camera 12 captures the actions of the manipulator holding the wafer. After the actions of the manipulator are captured by the camera 12, it is possible to automatically control the inlet / outlet device to move in and out, which is convenient for the manipulator to place the wafer on the inlet / outlet device.

[0051] As Figure 2-6 shown, in order to ensure that when the wafer is flipped, it does not affect the manipulator's picking up of other wafers, an inlet / outlet device is provided. The inlet / outlet device is located inside the housing 1 and pushes the wafers to be cleaned and the wafers after cleaning to the outside of the housing 1. The existing wafer baskets for holding wafers cannot flip the wafers. After the wafers after cleaning are sent into the basket by the manipulator, the cleaning surface faces up, which is likely to cause dust to shake off when the manipulator picks up the next wafer, resulting in contamination of the cleaned wafers. The inlet / outlet device includes a holding seat 20 for holding wafers, a driving mechanism, and an inlet / outlet mechanism. The groove for holding wafers inside the holding seat 20 is in an arch shape, which is convenient for the manipulator to pick up, and at the same time, the arc-shaped end can limit the wafer, which is convenient for supporting the wafer during flipping.

[0052] The driving mechanism includes a transmission gear 22. The movement of the transmission gear 22 drives the inlet / outlet mechanisms at different levels to move. The inlet / outlet mechanism includes a moving block 31. The moving block 31 drives the holding seat 20 to perform a horizontal forward and backward movement under the rotation of the transmission gear 22.

[0053] Specifically, in order to drive multiple holding seats 20 to move in and out of the housing 1, the driving mechanism further includes a driving motor 2 fixedly installed on the inner wall of the lower end of the housing 1. The output shaft of the driving motor 2 is fixedly installed with a rotating shaft 21 through a coupling. One end of the rotating shaft 21 is rotationally connected to the outer surface of the housing 1 through a bearing. One end of the rotating shaft 21 is slidably inserted into the inner wall of the transmission gear 22 to drive the transmission gear 22 to rotate while not affecting the lifting of the transmission gear 22;

[0054] In order to realize the movement of a driving motor 2 to drive the multi-layer holding seat 20 to enter and exit the shell 1, an adjusting motor 23 is fixedly installed on the inner wall of the upper end of the shell 1, and the output shaft of the adjusting motor 23 is fixedly installed with a screw rod 24 through a coupling. One end of the screw rod 24 is rotatably connected to the inner wall of the shell 1 through a bearing. In order to adjust the position of the transmission gear 22, the outer surface of the screw rod 24 is threadedly connected to a movable plate 25. The lower surface of the movable plate 25 is rotatably connected to the outer surface of the transmission gear 22 through a bearing to realize the lifting and lowering movement of the driving transmission gear 22 and the limiting movement of the movable plate 25. A distance sensor 26 is fixedly installed on the inner wall of the lower end of the shell 1. The distance sensor 26 detects the position of the movable plate 25 inside the shell 1.

[0055] Specifically, in order to convert the rotational movement of the transmission gear 22 into the movement of the holding seat 20, the entry and exit mechanism also includes a limiting groove body 3. After the outer surface of the limiting groove body 3 is fixedly installed with the outer surface of the outer shell 1, one side extends through the inner wall of the outer shell 1 to its interior, so that the transmission gear 22 can drive the moving block 31 to move. The outer surface of the moving block 31 is slidably plugged into the inner top wall of the limiting groove body 3. The outer surface of the moving block 31 is fixedly installed with a moving rack 32. In order to drive the moving rack 32 to move back and forth, the inner wall of the limiting groove body 3 is rotatably connected to a moving gear 33. The outer surface of the moving gear 33 is meshed with the outer surface of the moving rack 32, and the outer surface of the moving gear 33 is meshed with the outer surface of the transmission gear 22.

[0056] In order to limit and control the moving rack 32, a symmetrically distributed lower contact piece 34 is fixedly installed on the inner bottom wall of the limiting groove body 3, and at the same time, it is convenient to identify the position of the moving rack 32 in the limiting groove body 3. An upper contact piece 35 is fixedly installed on the lower surface of the moving rack 32. The upper surface of the lower contact piece 34 is electrically connected to the lower surface of the upper contact piece 35 to realize the limiting action of the movement of the moving rack 32. There are two lower contact pieces 34 and two upper contact pieces 35. The resistance values ​​of the two upper contact pieces 35 are different. The position of the moving rack 32 is judged by generating different resistance values ​​by contact with the lower contact piece 34. The upper contact piece 35 can also be replaced by a photoelectric switch transmitting end, and the photoelectric switch receiving end of the lower contact piece 34 is used to judge the position of the moving rack 32.

[0057] like Figure 7-9 As shown, in order to automatically flip the wafer, a flipping device is provided. The flipping device includes a flipping gear 51 for flipping. The flipping mechanism is located on one side of the moving block 31. The rotation of the flipping gear 51 drives the holding seat 20 to flip.

[0058] Specifically, the flipping device also includes a flipping shell 4 installed on the outer surface of the moving block 31. The cross-section of the flipping shell 4 is an inverted U shape. In order to achieve stable flipping of the wafer, a dual-axis motor 41 is fixedly installed on the inner wall of the flipping shell 4. The dual-axis motor 41 drives the two ends of the holding seat 20 to flip synchronously. In order to drive the holding seat 20 to flip, half gears 42 are installed on the inner walls of both ends of the flipping shell 4 through bearings. One end of the output shaft of the dual-axis motor 41 drives the half gear 42 to rotate through the cooperation of the belt and the pulley. According to actual production conditions, the cooperation of the belt and the pulley can also be replaced with a synchronous belt and synchronous wheel or a chain and sprocket. The outer surface of the half gear 42 is engaged with the outer surface of the flipping gear 51 to drive the holding seat 20 to flip. The number of teeth of the half gear 42 is the same as the number of teeth of the flipping gear 51. After the half gear 42 rotates half a circle, it can drive the flipping gear 51 to rotate one circle.

[0059] Furthermore, in order to drive the holding seat 20 to flip, a connecting shaft 5 is fixedly installed on the outer surfaces of both sides of the holding seat 20. One end of the connecting shaft 5 passes through the inner wall of the flip shell 4 and is rotatably connected to the inner wall of the flip shell 4 through a bearing. One end of the connecting shaft 5 is fixedly installed on the inner wall of the flip gear 51.

[0060] Furthermore, in order to limit the connecting shaft 5 and prevent the holding seat 20 from rotating on its own, a plug-in rod 52 with a limit block is fixedly installed on the inner wall of the flip shell 4. One end of the two plug-in rods 52 is slidably sleeved with an electromagnet 53 for locking the connecting shaft 5. The upper end of the electromagnet 53 is slidably inserted into the plug-in rod 52, which can limit the electromagnet 53 while enabling the electromagnet 53 to be raised and lowered. The two electromagnets 53 are symmetrically distributed. The appearance of the electromagnet 53 is a semicircular notch adapted for the connecting shaft 5. After the two electromagnets 53 are adsorbed, the notch forms a full circle shape that can clamp the connecting shaft 5. The outer surface of the plug-in rod 52 is sleeved with a reset spring 54 for resetting the electromagnet 53. The two ends of the reset spring 54 are fixed to the outer surfaces of the plug-in rod 52 and the electromagnet 53 respectively.

[0061] like Figure 10-14As shown, in order to support and fix the wafer during the flipping process, a self-locking device is provided. The self-locking device is located inside the holding seat 20 and fixes the wafer in the holding seat 20. In order to reduce the contact area with the wafer and prevent contamination of the wafer cleaning surface, the self-locking device includes a fixing mechanism and a locking mechanism. The fixing mechanism includes a fixing block 63. One end of the fixing block 63 is an arc surface, which is convenient for fitting with the outer side surface of the wafer. When the wafer is flipped, the fixing block 63 is raised to support and fix the wafer in the holding seat 20. When the wafer is taken out, the fixing block 63 is lowered to release the fixing action of the wafer in the holding seat 20. The locking mechanism includes a magnetic ball 72 and a fixing groove 74. The outer surface of the magnetic ball 72 is magnetically adsorbed to the inner wall of the fixing groove 74 to fix the fixing block 63.

[0062] Specifically, in order to control the movement of the fixed block 63 by rotating a half gear 42, the fixing mechanism also includes a transmission rod 6 with a gear. The gear of the transmission rod 6 has the same number of teeth as the flip gear 51. The two ends of the transmission rod 6 are rotatably connected to the inner wall of the flip shell 4 through bearings. In order to drive the rotation of the transmission rod 6, the outer surface of the gear of the transmission rod 6 is engaged with the outer surface of the half gear 42 to drive the rotation of the transmission rod 6. In order to drive the fixed block 63 to automatically rise and fall, a fixed shaft 61 is installed on the inner wall of the flip shell 4 through a bearing seat, and one end of the transmission rod 6 drives the rotation of the fixed shaft 61 through a gear plate group.

[0063] Furthermore, in order to drive the lifting and lowering of the fixed block 63, a fixed gear 62 is fixedly installed at one end of the fixed shaft 61. In order to limit the fixed block 63, the outer surface of the holding seat 20 is slidably inserted into the outer surface of the fixed block 63. The outer surface of the fixed block 63 is fixedly installed with a fixed rack 64. The outer surface of the fixed gear 62 is engaged with the outer surface of the fixed rack 64 to realize the automatic lifting and lowering of the fixed block 63, and can support the wafer after being fitted with the outer side surface of the wafer.

[0064] When locking sill 75 , locking sill 77 is positioned between locking sill 7 and locking sill 73 , and locking sill 77 is positioned between the top and bottom of locking sill 7 and the bottom of locking sill 73 .

[0065] Working principle: When the robot needs to take the wafer in the holding seat 20 for cleaning, the empty robot approaches the housing 1, and the camera 12 captures the robot, which controls the drive motor 2 in the housing 1 to start, and the drive motor 2 drives the rotating shaft 21 to rotate, and the rotating shaft 21 drives the transmission gear 22 connected thereto to rotate, and the rotation of the transmission gear 22 drives the rotation of the moving gear 33 in the limiting groove 3, and after the moving gear 33 rotates, it drives the moving rack 32 meshed with it to move in the limiting groove 3 toward the front of the housing 1. The robot moves in the opposite direction. After the upper contact piece 35 at the rear end of the moving rack 32 contacts the lower contact piece 34 of the limiting groove body 3 near the front end of the shell 1, a resistance value is generated, and the driving motor 2 stops driving the rotating shaft 21. At the same time, the moving rack 32 drives the flip shell 4 to move out of the shell 1 through the moving block 31. After the holding seat 20 on the flip shell 4 drives the wafer to move out of the shell 1, one end of the robot is adsorbed by negative pressure on the lower surface of the wafer in the holding seat 20, and then drives the wafer into the cleaning machine to clean the upper surface of the wafer.

[0066] After the wafer cleaning is completed, the manipulator performs negative pressure adsorption on the lower surface of the wafer again and then takes out the wafer, driving the wafer to turn to the housing 1. The camera 12 on the housing 1 captures the presence of the wafer and the manipulator. After the manipulator places the wafer in the holding seat 20 outside the housing 1, the camera 12 captures that the wafer is in place and the manipulator leaves. The drive motor 2 is started to drive the movement of the moving rack 32, so that the holding seat 20 moves to the rear side of the housing 1 to perform the wafer flipping action. After the contact piece 35 on the front end of the moving rack 32 contacts the lower contact piece 34 on the rear end inner wall of the limiting groove body 3, the resistance value is generated, and the drive motor 2 stops, and the holding seat 20 is located outside the rear side of the housing 1;

[0067] The adjusting motor 23 in the housing 1 drives the screw 24 to rotate. The adjusting plate threadedly connected to the screw 24 can drive the transfer gear 22 mounted thereon via a bearing to rise and fall, so that the transfer gear 22 disengages from the moving gear 33 meshing with it and then meshes with the moving gear 33 above or below it. The position of the moving gear 33 is measured by the distance sensor 26, and the adjusting motor 23 is controlled to stop driving the screw 24 to rotate. The drive motor 2 is started again, driving the next holding seat 20 to move toward the front side of the housing 1, so that the robot can adsorb the next wafer for cleaning.

[0068] At the same time, the dual-axis motor 41 in the flip shell 4 is started, and the half gear 42 is driven to rotate by the cooperation of the belt and the pulley. After the half gear 42 is able to mesh with the gear on the transmission rod 6, it drives the transmission rod 6 to rotate one circle. After the transmission rod 6 rotates one circle, it drives the fixed shaft 61 in the flip shell 4 to rotate through the transmission of the toothed disc group. The fixed shaft 61 drives the fixed missing gear 62 to rotate one circle, and the fixed missing gear 62 rotates the fixed rack 64 meshed with it to rise. After the fixed rack 64 drives the upper fixed groove 74 of the fixed block 63 on the holding seat 20 to disengage the magnetic ball 72, the fixed block 63 is lifted up. During the rotation process, the fixed block 63 presses the magnetic ball 72 on the receiving seat 20, and the magnetic ball 72 can be retracted in the locking groove 7. The telescopic rod 71 and the connecting spring 73 are compressed. When the magnetic ball 72 encounters the fixing groove 74 of the fixed block 63, the magnetic ball 72 is reset under the elastic force of the connecting spring 73. The magnetic ball 72 is inserted into the fixing groove 74 and adsorbed on the inner wall of the fixing groove 74. The fixed block 63 contacts and fits the outer side surface of the wafer in the receiving seat 20. The fixed gear 62 rotates one circle so that the side without the tooth groove faces downward to fix the rack 64, which does not hinder the fixed rack 64 from turning over with the receiving seat 20.

[0069] After the electromagnet 53 in the flip housing 4 is powered off and the clamping of the connecting shaft 5 is released, the electromagnet 53 is reset under the action of the reset spring 54 on the plug rod 52, and the half gear 42 continues to rotate, disengaging from the gear on the transmission rod 6 and then engaging with the flip gear 51 on the connecting shaft 5, driving the connecting shaft 5 to rotate one circle, so that the receiving seat 20 drives the wafer to flip over. After the flip is completed, the electromagnet 53 is powered on again to clamp and fix the connecting shaft 5;

[0070] The adjusting motor 23 drives the transfer gear 22 to rise and fall again, and after engaging with the previous transfer gear 22, drives the rear side receiving seat 20 to reset to the shell 1. After the two upper contact pieces 35 of the moving rack 32 contact the two lower contact pieces 34 in the limiting groove 3, when two different resistance values ​​are generated, the driving motor 2 stops and the receiving seat 20 resets.

[0071] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A wafer flipping mechanism, comprising a housing (1), characterized in that: It also includes a control screen (11), a camera (12), an entry and exit device, a flip device, and a self-locking device installed on the housing (1); The camera (12) is fixedly mounted on the outer surface of the housing of the control screen (11), and the camera (12) captures the action of the robot holding the wafer; An entry and exit device is arranged inside the housing (1) and pushes wafers that need to be cleaned and wafers that have been cleaned to the outside of the housing (1). The entry and exit device includes a holding seat (20) for holding wafers, a driving mechanism, and an entry and exit mechanism. The driving mechanism includes a transmission gear (22). The movement of the transmission gear (22) drives the entry and exit mechanisms at different levels to move. The entry and exit mechanism includes a moving block (31). The moving block (31) drives the holding seat (20) to move horizontally forward and backward under the rotation of the transmission gear (22); A flipping device, comprising a flipping gear (51) for flipping, wherein the flipping mechanism is located on one side of the moving block (31), and the rotation of the flipping gear (51) drives the holding seat (20) to flip over; A self-locking device is provided inside the receiving seat (20) and performs a fixing action on the wafer in the receiving seat (20). The self-locking device comprises a fixing mechanism and a locking mechanism. The fixing mechanism comprises a fixing block (63). When the wafer is turned over, the fixing block (63) is raised to support and fix the wafer in the receiving seat (20). When the wafer is taken out, the fixing block (63) is lowered to release the fixing action of the wafer in the receiving seat (20). The locking mechanism comprises a magnetic ball (72) and a fixing groove (74). The outer surface of the magnetic ball (72) is magnetically adsorbed to the inner wall of the fixing groove (74) to fix the fixing block (63).

2. The wafer flipping mechanism according to claim 1, characterized in that: The driving mechanism further comprises a driving motor (2) fixedly mounted on the inner wall of the lower end of the housing (1); an output shaft of the driving motor (2) is fixedly mounted with a rotating shaft (21) via a coupling; one end of the rotating shaft (21) is slidably plugged into the inner wall of the transmission gear (22) to drive the transmission gear (22) to rotate; An adjusting motor (23) is fixedly mounted on the inner wall of the upper end of the housing (1); a screw rod (24) is fixedly mounted on the output shaft of the adjusting motor (23) via a coupling; a movable plate (25) is threadedly connected to the outer surface of the screw rod (24); the lower surface of the movable plate (25) is rotatably connected to the outer surface of the transmission gear (22) via a bearing to achieve a lifting action of the transmission gear (22) and a position limiting action of the movable plate (25); a distance sensor (26) is fixedly mounted on the inner wall of the lower end of the housing (1); the distance sensor (26) detects the position of the movable plate (25) inside the housing (1).

3. The wafer flipping mechanism according to claim 1, wherein: The entry and exit mechanism further comprises a limiting groove body (3), the outer surface of the limiting groove body (3) is fixedly mounted on the outer surface of the outer shell (1), and one side thereof passes through the inner wall of the outer shell (1) and extends to the interior thereof; the outer surface of the moving block (31) is slidably plugged into the inner top wall of the limiting groove body (3); a moving rack (32) is fixedly mounted on the outer surface of the moving block (31); a moving gear (33) is rotatably connected to the inner wall of the limiting groove body (3); the outer surface of the moving gear (33) is meshed with the outer surface of the moving rack (32), and the outer surface of the moving gear (33) is meshed with the outer surface of the transmission gear (22).

4. The wafer flipping mechanism according to claim 3, wherein: A symmetrically distributed lower contact piece (34) is fixedly mounted on the inner bottom wall of the limiting groove body (3), an upper contact piece (35) is fixedly mounted on the lower surface of the movable rack (32), and the upper surface of the lower contact piece (34) is electrically connected to the lower surface of the upper contact piece (35) to achieve a limiting action on the movement of the movable rack (32).

5. The wafer flipping mechanism according to claim 1, characterized in that: The flipping device further comprises a flipping shell (4) mounted on the outer surface of the moving block (31), the cross section of the flipping shell (4) being in an inverted U shape, a double-axis motor (41) being fixedly mounted on the inner wall of the flipping shell (4), half gears (42) being mounted on the inner walls of both ends of the flipping shell (4) via bearings, one end of the output shaft of the double-axis motor (41) driving the half gear (42) to rotate through the cooperation of a belt and a pulley, and the outer surface of the half gear (42) meshes with the outer surface of the flipping gear (51) to drive the holding seat (20) to flip.

6. The wafer flipping mechanism according to claim 5, characterized in that: A connecting shaft (5) is fixedly mounted on both outer surfaces of the receiving seat (20). One end of the connecting shaft (5) passes through the inner wall of the flip shell (4) and is rotatably connected to the inner wall of the flip shell (4) via a bearing. One end of the connecting shaft (5) is fixedly mounted on the inner wall of the flip gear (51).

7. The wafer flipping mechanism according to claim 6, characterized in that: A plug-in rod (52) with a limit block is fixedly installed on the inner wall of the flip shell (4), and one end of each of the two plug-in rods (52) is slidably sleeved with an electromagnet (53) for locking the connecting shaft (5), and the two electromagnets (53) are symmetrically distributed. The appearance of the electromagnet (53) is a semicircular notch adapted to the connecting shaft (5), and the outer surface of the plug-in rod (52) is sleeved with a reset spring (54) for resetting the electromagnet (53).

8. The wafer flipping mechanism according to claim 5, characterized in that: The fixing mechanism further comprises a transmission rod (6) with a gear, both ends of the transmission rod (6) being rotatably connected to the inner wall of the flip shell (4) via bearings, the outer surface of the gear of the transmission rod (6) being engaged with the outer surface of the half gear (42) to achieve a rotational movement of driving the transmission rod (6), the inner wall of the flip shell (4) being mounted with a fixed shaft (61) via a bearing seat, and one end of the transmission rod (6) driving the rotation of the fixed shaft (61) via a gear wheel assembly.

9. The wafer flipping mechanism according to claim 8, characterized in that: A fixed gear (62) is fixedly mounted on one end of the fixed shaft (61); the outer surface of the receiving seat (20) is slidably plugged into the outer surface of the fixed block (63); a fixed rack (64) is fixedly mounted on the outer surface of the fixed block (63); and the outer surface of the fixed gear (62) is meshed with the outer surface of the fixed rack (64).

10. The wafer flipping mechanism according to claim 1, characterized in that: The locking mechanism further comprises a locking groove (7) provided inside the receiving seat (20), a telescopic rod (71) being fixedly mounted on the inner wall of the locking groove (7), one end of the telescopic rod (71) being fixedly mounted on the outer surface of the magnetic ball (72) via a connecting plate, a connecting spring (73) for resetting the magnetic ball (72) being fixedly mounted on the inner wall of the locking groove (7), the fixing groove (74) being provided on the outer surface of the fixing block (63), the outer surface of the magnetic ball (72) being slidably plugged into the inner wall of the fixing groove (74).

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