Dynamic glass comprising a substrate having interlaced mesh electrodes

Abstract

Some embodiments relate to a light modulator, the light modulator comprising a transparent substrate or a reflective substrate, a plurality of electrodes are applied to the substrate in a pattern across the substrate. A controller can apply an electric potential to the electrodes to obtain an electromagnetic field between the electrodes, thereby providing electrophoretic movement of particles toward or from the electrodes, wherein the electrodes are a plurality of interlaced mesh electrodes (210, 230), the plurality of interlaced mesh electrodes comprising a plurality of main lines (211, 212, 213, 214, 215), the plurality of main lines being connected to another plurality of main lines via a plurality of interconnects (221, 241, 242, 222, 223, 243).

Description

Technical Field

[0001] The subject matter of the present disclosure relates to dynamic glazing, light modulators, substrates, methods of manufacturing substrates, methods of manufacturing light modulators, dynamic glazing methods, and computer readable media. Background Art

[0002] US Patent Application 11 / 041579, Publication No. US20050185104 A1, “Optically Active Glass” discloses known optically active glass based on the dielectrophoretic effect and is incorporated herein by reference.

[0003] The known system comprises two parallel plates made of a transparent dielectric material such as glass or plastic material. The internal volume defined between the plates is subdivided into a plurality of small independent volumes or individual cells filled with a dielectric liquid. The liquid contains a suspension of particles of the dielectric material. The faces of the two plates facing each other carry electrodes facing each other. The electrodes are connected to a power supply associated with a control device.

[0004] The electrodes of each plate are formed by pairs of interlaced combs. The electrodes of the two interlaced combs can be subjected to voltages of the same or opposite polarity. By applying appropriate voltages to the electrodes, the particles can be concentrated at different locations between the electrodes, giving the system a transparent or non-transparent appearance.

[0005] There are a number of disadvantages associated with known systems. For example, it may be desirable that the electric field across the substrate is uniform. Another disadvantage of known systems is that in a non-transparent configuration, a uniform appearance of the glass is desirable. This aspect may also affect safety. For example, if the glass is configured to be an intermediate state between non-transparent and transparent, the lack of uniformity may cause confusion or confusion. Another disadvantage is that when the glass is converted from a non-transparent configuration to a transparent configuration, it is desirable that the conversion process occurs at a uniform speed across the entire glass.

[0006] Furthermore, the life expectancy of the known device is also limited. After repeated cycles of changing transparency, the electrodes can become damaged. If this occurs, a portion of the known device will cease to function. There is also the problem of damage to the electrode lines during the manufacturing process. Damage to the long thin lines used in conventional dynamic glass can affect manufacturing yields. Summary of the invention

[0007] It would be advantageous to have an improved dynamic glass that solves these and other problems. The dynamic glass is configured to include at least two substrates, each of which has at least two mesh electrodes. The mesh electrodes on the substrates are staggered (also referred to as interdigitated) so that an electromagnetic field can be established between the mesh electrodes on the substrates by applying an electric potential or current to the mesh electrodes. In an interdigitated pattern, a main line is directly located between two other main lines of different mesh electrodes (or, if the main line is located at the edge, adjacent to a single main line of different mesh electrodes). This electromagnetic field is used to control the movement of charged particles between substrates by electrophoretic motion. This in turn causes changes in the optical properties of the dynamic glass. By appropriate selection of particles, drives, etc., embodiments of optical properties that can be changed in this manner include: transparency, translucency, reflectivity, etc.

[0008] In one embodiment, a plurality of interlaced mesh electrodes cross at a plurality of intersections. At the intersections, two main lines of the same mesh electrode can be connected by an interconnection line (e.g., a conductive bridge), thereby, for example, balancing the potential in the mesh electrode over a large surface even across the substrate. The conductive bridge can be insulated from the other mesh electrodes.

[0009] Dynamic glass according to one embodiment improves yield and life due to the ability to reroute in a mesh electrode. For example, a cut line in an electrode may be caused by a production defect. If the current and / or potential is rerouted to bypass the cut, the defect will not cause a defect, resulting in improved yield. For example, during use of the product, electrochemical degradation may cause a cut line in an electrode. Rerouting to bypass such a cut avoids replacing the product, thereby improving life.

[0010] The interconnect allows the points where the mesh electrodes on the substrate are connected to the controller to be close to each other. As a result, the mesh electrodes have a more uniform potential across the mesh electrodes. This allows for better control of the potential difference between two relative points on two relative mesh electrodes. As a result, unwanted field lines are reduced. For example, when dynamic glass (also known as vertical drive) is turned on, the mesh electrodes on the same substrate can be driven to the same potential; the use of mesh electrodes causes the potentials of the mesh electrodes to be closer to each other across the substrate. Thus, the transition from the closed state to the open state is improved. The increase in potential uniformity also reduces unwanted electrochemical processes driven by unwanted potential differences between the two electrodes.

[0011] The use of an interlaced mesh electrode makes the potential of the light modulator locally more uniform. The interlaced mesh electrode also improves the uniformity on a large scale; this improvement is greater if the electrode material is highly conductive.

[0012] The mesh electrodes intersect at multiple intersections on the substrate. At such intersections, current has the opportunity to flow from one mesh electrode to another mesh electrode. It is desirable to control this current flow. For example, a dielectric may be arranged between two mesh electrodes to completely block this current flow. In one embodiment, the current is not always blocked, but is allowed when a predetermined criterion is met. For example, the current flow can be controlled only when the potential difference between the two mesh electrodes is greater than a threshold value. For example, a current control component can be obtained by semiconductor deposition and / or patterning at the intersection. For example, a diode such as a Zener diode may be installed in the intersection between the two mesh electrodes. The Zener diode may include two opposing junctions; alternatively, some spacers may include Zener junctions of different orientations.

[0013] When substrates are used in light modulators, it is generally desirable to keep the two substrates at a constant distance from each other. This constant distance can be achieved by arranging a plurality of spacers between the two substrates. Advantageously, the spacers can be mounted in the intersection, for example above or below the interconnect at the intersection. This reduces the optical impact of the spacers. The spacers may comprise an electrically insulating material. The spacers may comprise a semiconductor material. The spacers are preferably transparent.

[0014] There may also be additional spacers that are not arranged at the intersection. Such spacers may be insulating and help to keep the substrates in the light modulator at a fixed distance. Advantageously, another spacer (in particular, a spacer that is not at the intersection) may be conductive and configured to connect the mesh electrode to a connection point at the opposite substrate. Furthermore, such spacers are preferably transparent.

[0015] The spacer material is typically a dielectric to block current from flowing from one substrate to the other. However, the spacer is configured to allow current if some predetermined conditions are met (e.g., if the potential difference between the mesh electrode on one substrate and the mesh electrode on the other substrate is greater than a threshold).

[0016] A substrate according to an embodiment may be used in a light modulator (also referred to as an optical modulator). Dynamic glass is an important application of light modulators. A transparent substrate or a reflective substrate for applications such as these, for example, dynamic glass, may have two mesh electrodes, each mesh electrode having a plurality of main lines. The main lines are alternately arranged on the substrate so that an electric field can be established between subsequent lines or adjacent lines by providing a potential difference to the electrodes.

[0017] For example, two such substrates can be arranged relative to each other so that charged particles suspended in a fluid between the substrates can be moved by applying a voltage to the electrodes. Typically, the electrode designs for the bottom substrate and the top substrate are identical, but this is not necessary. Likewise, the two designs are typically aligned with each other, but this is not necessary. The particles can absorb or reflect light. The reflection can be specular or diffuse or something in between. The particles can emit light, for example with phosphorescence or fluorescence.

[0018] Light modulators provide panels whose transparency or reflectivity, etc. can be changed. In one embodiment, the color or color intensity, etc. can be changed. Light modulators can be used as covers, such as covers for containers (e.g., closed closets, etc.). A particularly advantageous application is dynamic glass. Dynamic glass is also called smart window or optically active glass.

[0019] In one embodiment, the controller is configured to apply an electric potential to electrodes on the substrate of the light modulator to obtain an electromagnetic field between the electrodes. The electromagnetic field provides the particles with electrophoretic movement toward or from the electrodes. As the particles change position, the optical properties of the panel change, for example, its transparency or reflectivity. If the particles are colored, the color of the panel can change. By changing the field established between the paired electrodes, the particles can be moved to the desired direction. The inventors have found that it is not necessary to limit the control of the light modulator to only changing whether the field is applied between the electrodes, but can also include changing the maximum amplitude. Note that it is advantageous to use an alternating current. For example, by driving with a lower maximum amplitude, the rate of change in the light modulator is changed. This is advantageous, for example, when driving toward a desired target transparency or target reflectivity, the maximum amplitude can be reduced to avoid overshoot. When starting to drive toward the target transparency or target reflectivity, the maximum amplitude can be increased additionally or alternatively. For example, the controller can be configured to obtain one of a plurality of transparency levels or reflectivity levels in the light modulator by using an alternating current of one of a plurality of maximum amplitudes. The relationship can be indicated by an algorithm or the like. The relationship between the transparency level or reflectivity level and the maximum amplitude can be controlled by a lookup table, for example, indicating a sequence of maximum amplitudes to drive towards transparency or reflectivity. Note that an AC voltage is also possible. The controller can be configured to provide an interface between the mesh electrode and a power supply.

[0020] The controller may be implemented as a single integrated device (e.g., a microchip), but may also be distributed across multiple sub-controllers. Multiple sub-controllers may, for example, control different parts of the device. For example, one sub-controller is assigned to each substrate. The controller may be integrated with the substrate, such as in a spacer, in an optical layer, on a substrate outside the optical layer, etc., but the controller may also be located outside the light modulator. Multiple controllers may communicate wirelessly or by wire. The controller may include one or more microchips for implementing the functions of the controller.

[0021] Another aspect of the invention is a building comprising a light modulator according to an embodiment, thereby providing dynamic glass. The light modulator can, for example, modulate the optical properties of a window pane. Another aspect of the invention is a car comprising a light modulator according to an embodiment. For example, the car and / or the building may comprise a light modulator and a controller configured to control the transparency or reflectivity of the light modulator by controlling the voltage on the electrodes of the light modulator, the controller being electrically connected or capable of being electrically connected to the light modulator.

[0022] Another aspect of the invention is a light modulator that can be used in applications other than dynamic glass. Another aspect of the invention is a substrate for use in a light modulator.

[0023] Another aspect of the invention is a method of manufacturing a substrate and / or a light modulator, for example for dynamic glass. Interestingly, the substrate can first be manufactured in a default form (e.g., a rectangular form), after which the substrate is cut into a desired (e.g., non-rectangular) shape. The mesh electrode maintains its interconnectivity even if it has been cut into a shape. The cutting can also be performed after the manufactured substrate (e.g., a substrate in the default form) is assembled in a light modulator including an optical layer. In this case, a seal can be applied to the edges of the cut light modulator.

[0024] Substrates with multiple interlaced mesh electrodes can be manufactured in a variety of ways. Some substrates have additional advantages, such as all main lines in the same plane, all main lines configured for fluid contact (e.g., all main lines exposed on the surface of the substrate), avoiding the use of through holes, etc.

[0025] Dynamic glass is an electronic device that can be driven by a power source, such as under the control of a controller. For example, the controller can instruct the power source to apply specific waveforms to specific electrodes to achieve various transparency or reflectivity effects or remove the above effects. The controller can include a microprocessor.

[0026] An embodiment of the method may be implemented on a computer as a computer-implemented method, or may be implemented in dedicated hardware, or a combination of the two. An executable code of an embodiment of the method may be stored on a computer program product. Examples of computer program products include memory devices, optical storage devices, integrated circuits, servers, online software, etc. Preferably, the computer program product includes a non-transitory program code stored on a computer-readable medium for implementing an embodiment of the method when the program product is executed on a computer.

[0027] In one embodiment, the computer program comprises computer program code, which is suitable for performing all or part of the steps of an embodiment of the method when the computer program is run on a computer. Preferably, the computer program is implemented on a computer readable medium. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Further details, aspects and embodiments will be described by way of example only and with reference to the accompanying drawings. The elements in the drawings are illustrated for the sake of simplicity and clarity and are not necessarily drawn to scale. In the drawings, elements corresponding to elements already described may have the same reference numerals. In the drawings:

[0029] Figure 1 An example of an embodiment of a substrate is schematically shown,

[0030] Figure 2a An example of an embodiment of a substrate is schematically shown,

[0031] Figure 2b An example of an embodiment of a substrate is schematically shown,

[0032] Figure 2c schematically illustrates an example of an embodiment of a junction,

[0033] Figure 3 An example of an embodiment of a substrate is schematically shown,

[0034] Figure 4 An example of an embodiment of a substrate is schematically shown,

[0035] Figure 5a to Figure 5e An example of one embodiment of manufacturing a substrate is schematically shown,

[0036] Figure 6a to Figure 6g An example of one embodiment of manufacturing a substrate is schematically shown,

[0037] Figures 7a to 7c An example of one embodiment of manufacturing a substrate is schematically shown,

[0038] Figure 8a schematically illustrates an example of an embodiment of a junction,

[0039] Figure 8b schematically illustrates an example of an embodiment of a junction,

[0040] Figure 8c to Figure 8e An example of one embodiment of making a crossover point is schematically shown,

[0041] Figure 9a An example of an embodiment of an electrode is schematically shown,

[0042] Figure 9b An example of an embodiment of an electrode is schematically shown,

[0043] Fig.9c An example of an embodiment of a substrate is schematically shown,

[0044] Figure 9d to Figure 9h An example of one embodiment of manufacturing a substrate is schematically shown,

[0045] Figure 10a to Figure 10b An example of an embodiment of a substrate is schematically shown,

[0046] Fig.10c and Fig.10d schematically illustrates an example of an embodiment of cutting a substrate,

[0047] Fig.11a An example of an embodiment of a substrate is schematically shown,

[0048] Fig.11b An example of an embodiment of a substrate is schematically shown,

[0049] Fig.11c An example of an embodiment of a substrate is schematically shown,

[0050] Fig.11d An example of an embodiment of a substrate is schematically shown,

[0051] Fig.11e An example of an embodiment of a substrate is schematically shown,

[0052] Fig.11f An example of an embodiment of a substrate is schematically shown,

[0053] Fig.12a schematically illustrates an example of an embodiment of a light modulator,

[0054] Figure 12b schematically illustrates an example of an embodiment of a light modulator,

[0055] Fig.12c Schematically shows an example of an embodiment of a motor vehicle,

[0056] Figures 13a to 13c schematically shows an embodiment of a light modulator,

[0057] Fig.14aschematically illustrates an example of an embodiment of a method for manufacturing a substrate,

[0058] Fig.14b Schematically shows an example of an embodiment of a mesh electrode constructed from main lines and interconnecting lines,

[0059] Fig.14c schematically illustrates an example of an embodiment of a light modulator constructed from a substrate,

[0060] Fig.14d An example of one embodiment of operating dynamic glass is schematically shown,

[0061] Fig.15a schematically shows a computer-readable medium having a writable portion comprising a computer program according to one embodiment,

[0062] Fig.15b A representation of a processor system according to one embodiment is schematically shown.

[0063] Reference Number List

[0064] The following list of references and abbreviations is provided to facilitate understanding of the drawings and should not be construed as limiting the claims.

[0065] 10. Optical Modulator

[0066] 11. First substrate

[0067] 12. Second substrate

[0068] 13, 13a, 13b Electrode

[0069] 14, 14a, 14b Electrode

[0070] 15 Fluid

[0071] 16 Controller

[0072] 30 pcs

[0073] 20 Car

[0074] 21. Optical Modulator

[0075] 40 Optical Modulator

[0076] 41 First substrate

[0077] 42 Second substrate

[0078] 43 Third substrate

[0079] 46 Controller

[0080] 100 substrates

[0081] 101 First Direction

[0082] 102 Second Direction

[0083] 110 first mesh electrode

[0084] 120 second mesh electrode

[0085] 111-113 Main Line

[0086] 121-123 Main Line

[0087] 151 Interconnection

[0088] 200-205 base plate

[0089] 210 first mesh electrode

[0090] 211-215 Main Line

[0091] 221-223 Interconnection lines

[0092] 230 second mesh electrode

[0093] 231-235 Main Line

[0094] 231' Main route below

[0095] 241-243 Interconnection lines

[0096] 251-253 intersection

[0097] 254 Current control components

[0098] 261-266 Main Line

[0099] 271-273 Interconnection lines

[0100] 281 First mesh electrode

[0101] 282 second mesh electrode

[0102] 283 Dielectric

[0103] 284.1, 284.2 Through hole

[0104] 285.1, 285.2 Through hole

[0105] 286 interconnect lines

[0106] 287 Cutting Line

[0107] 288 Distance between consecutive through holes

[0108] 291-293 Mesh Electrode

[0109] 294 Smaller distance

[0110] 295 Larger distance

[0111] 296 interconnection lines

[0112] 297 A set of through holes

[0113] 301 first mesh electrode

[0114] 302 second mesh electrode

[0115] 351 Interconnection lines

[0116] 352 Insulator

[0117] 400 substrate

[0118] 411 Electrical connection

[0119] 412 Cutting Line

[0120] 421 First Edge

[0121] 422 Second Edge

[0122] 431 First mesh electrode

[0123] 432 second mesh electrode

[0124] 811 second conductive pattern

[0125] 812 first conductive pattern

[0126] 821-823 Main Line

[0127] 831 Interconnection lines

[0128] 842-844 Main Line

[0129] 851 Dielectric

[0130] 852 Interconnection lines

[0131] 853 Spacer

[0132] 901 Mesh Electrode

[0133] 902, 903 Main Line

[0134] 904 Interconnection lines

[0135] 905, 906 mesh electrode

[0136] 907 Dielectric

[0137] 1210 First mesh electrode

[0138] 1211 Second mesh electrode

[0139] 1212 Dielectric

[0140] 1213 Electrical connection foil

[0141] 1214 Cutting Line

[0142] 1000, 1001 Computer readable medium

[0143] 1010 Writable part

[0144] 1020 Computer Programs

[0145] 1110 Integrated Circuit

[0146] 1120 Processing Unit

[0147] 1122 Memory

[0148] 1124 ASIC

[0149] 1126 Connecting elements

[0150] 1130 Interconnection

[0151] 1140 Processor System DETAILED DESCRIPTION

[0152] While the subject matter of the present disclosure is susceptible of embodiment in many different forms, one or more specific embodiments are shown in the drawings and will be described in detail herein, it being understood that the present disclosure is to be considered as illustrative of the principles of the subject matter of the present disclosure and is not intended to be limited to the specific embodiments shown and described.

[0153] Hereinafter, for ease of understanding, the elements of the embodiments are described in operation. However, it will be apparent that the corresponding elements are arranged to perform the functions described by them. In addition, the subject matter of the present disclosure is not limited to the embodiments, but also includes each other combination of the features described herein or recorded in the mutually different dependent claims.

[0154] Figure 1 An example of one embodiment of a substrate 100 is schematically shown. At least two mesh electrodes are arranged across the surface of the substrate 100 in a pattern. Figure 1 Shown in FIG. 1 are two electrodes located on the same surface: a first electrode 110 and a second electrode 120 .

[0155] Figure 1 The electrodes 110 and 120 shown in FIG. 1 are mesh electrodes. The fingers of the mesh electrode are interconnected by a plurality of interconnects. One such interconnect is shown: interconnect 151.

[0156] The first mesh electrode 110 and the second mesh electrode 120 each include a plurality of main lines. Figure 1 As shown in , the first mesh electrode 110 includes main lines 111, 112 and 113, and the second mesh electrode 120 includes main lines 121, 122 and 123. Typically, each mesh electrode will include more than three lines. The main lines extend across the substrate. The mesh electrodes are electrically insulated or capable of being electrically insulated from each other. A plurality of main lines of the first electrode and the second electrode are alternately arranged on the substrate relative to each other. The main lines extend across the substrate in a first direction 101. When viewed in a second direction 102, the main lines from different multiple main lines meet alternately, for example, the first multiple main lines and the second multiple main lines from the first mesh electrode and the second mesh electrode, respectively, meet alternately. The first direction and the second direction are at an angle to each other, and the angle may be substantially perpendicular, but this is not necessary. The first direction and the second direction may each be parallel to the side of the substrate, but this is not necessary.

[0157] Figure 1 The interlaced mesh electrodes shown in FIG. 1 are combs interlaced with each other in pairs. In this figure, each mesh electrode has a connecting line, which in this case extends along the left and right sides of the substrate and does not cross the main line. It should be noted that such connecting lines are not necessary in the case of having interconnections, and in fact such connecting lines are preferably avoided.

[0158] The two mesh electrodes are interlaced; for example, each mesh electrode includes a plurality of main lines that are alternately arranged on the substrate. This alternating arrangement is also referred to as interdigitation. The mesh electrodes increase internal connections through interconnects. For example, there are multiple electrical paths from most or even substantially all of the main lines to the electrical connector.

[0159] There may be more than two electrodes on the same side of the substrate, for example to facilitate finer-grained control. For example, when three or more mesh electrodes are used on a single substrate, different voltages may be applied to the mesh electrodes, thereby producing effects on the particles that cannot be achieved with two mesh electrodes. For example, multiple electrodes may facilitate segmented substrates, such as for segmented light modulators. For example, in a segmented light modulator, some regions may have different optical properties, such as different transparencies or reflectivities. An embodiment with two electrodes is shown below, but additional electrodes may be added to them, for example by replicating similar structures adjacent to each other.

[0160] At least a portion of the first mesh electrode 110 and the second mesh electrode 120 are applied to the same side of the substrate. For example, the main line may be in fluid contact with the fluid in the optical layer. In this case, the interconnect (such as, interconnect 151) may be applied in a different layer or plane than the main line. However, this is not required, and in different arrangements, a portion of the main line may not be in fluid contact, for example, electrically insulated from the mesh electrode 120 and the mesh electrode 110 in a different manner.

[0161] The two electrodes are arranged to span the substrate in a pattern. There may also be one, two or more electrodes on the other surface of the substrate 100, for example, to facilitate stacking of three or more substrates. The electrodes may be applied to the substrate by photolithography (e.g., using a mask representing the electrode pattern). The electrodes may also be applied by embedding the electrodes in the substrate.

[0162] Two or more substrates (such as substrate 100) can be combined into a light modulator. One exciting application of light modulators is dynamic glass, also known as smart glass (e.g., light modulators), which can be used in homes, offices, greenhouses, cars, etc. The optical properties of the dynamic glass (such as transparency level or reflectivity level) can be electrically adapted. For example, in dynamic glass, two substrates (such as substrate 100) can be stacked so that the sides with two electrodes applied face each other. A fluid with particles is enclosed between the two substrates, which is called an optical layer. The particles are charged or can be charged. The optical properties can change depending on a variety of factors, including the type of particles. For example, if the particles absorb light, a change in transparency can be obtained. For example, if the particles reflect, a change in reflectivity can be obtained.

[0163] By generating an electromagnetic field between different mesh electrodes (for example, between mesh electrodes on the same substrate, or between mesh electrodes on opposite substrates), particles can move toward or from one of the multiple mesh electrodes by electrophoresis, thereby resulting in modulation of the optical properties of the light modulator.

[0164] For example, switching to a non-transparent state or switching to a non-reflective state can be performed by creating an alternating voltage on at least one of the first substrate and the second substrate, by applying an alternating current between at least a first mesh electrode and a second mesh electrode on the first substrate, and / or by applying an alternating current between a first mesh electrode and a second mesh electrode on the second substrate.

[0165] For example, switching to a transparent state or switching to a reflective state can be performed by creating an alternating voltage between the first substrate and the second substrate, by applying an alternating current between a first mesh electrode on the first substrate and a first mesh electrode on the second substrate, and / or by applying an alternating current between a second mesh electrode on the first substrate and a second mesh electrode on the second substrate.

[0166] In the case where the mesh electrodes cross each other, there are intersection points. Figure 1 An interconnect 151 is shown having a crossover point with the main line 112. Typically, there are many crossover points. They may be distributed across the substrate in a regular pattern. They may be distributed across the substrate in a random pattern.

[0167] In one embodiment, a plurality of interconnects extend in a second direction. In the illustrated embodiment, the interconnects 151 extend in a second direction 102, which is orthogonal to the first direction 101, in which the main line extends. Orthogonal or substantially orthogonal angles are convenient, but not required. The angle between the interconnects and the main line has an effect on the diffraction of the light modulator. For example, in one embodiment, the angle varies across the substrate (e.g., in a pattern or randomly) to reduce diffraction.

[0168] The controller may be electrically connected to the plurality of electrodes. The controller may control the electric field between the electrodes. For example, the controller may include a processor and a connected memory. The memory includes processor instructions for execution by the processor. The processor instructions cause the processor to control the electric field. In one embodiment, the controller includes a sub-controller for each substrate.

[0169] exist Figure 1 In the embodiment, the main line is connected to the connection line, which connects the main lines of the mesh electrodes to each other without crossing another mesh electrode on the substrate. Figure 1 In FIG. 1 , the connection line extends on the left side of electrode 120 and on the right side of electrode 110. Interestingly, the mesh electrode does not require such a connection line. Figure 1 By removing the connecting lines from the substrate 100, a voltage or current can be applied to the two mesh electrodes from any point along the left and right edges of the substrate 1. This is advantageous when the substrate 100 is installed in, for example, a light modulator, especially a dynamic glass. The dynamic glass embodiment is further discussed elsewhere in this article.

[0170] In one embodiment, an electrode (eg, two or more electrodes) is applied to one surface of each substrate. There may also be one, two or more electrodes on the other surface of substrate 100, for example to facilitate stacking of three or more substrates.

[0171] Some of the following embodiments show examples of modulating transparency levels or reflectivity levels. Light modulators can be adapted for other optical effects. For example, if desired, the embodiments can be modified to different translucency levels rather than different transparency levels. If desired, the type of particles that can be used in an embodiment can be changed, for example, to particles that absorb or reflect different wavelengths, and to particles that reflect specularly or diffusely to different degrees. For example, in one embodiment, the light modulator can modulate different reflectance levels. The particles can also emit light. Stacking multiple optical layers further increases the possibilities.

[0172] Two sets of alternating main lines are sufficient to provide an electrically adaptable glass; thanks to the alternating two sets, the electric field at any part of the substrate can be controlled, since two opposing electrodes define the part from two opposing sides. Figure 1 The straight lines shown in the figure can be modified in many ways. For example, the shape of the lines (e.g., main lines or interconnecting lines) can be changed, for example, making them wavy rather than straight. For example, short branches extending from the main lines or interconnecting lines can be added. Such modifications change the diffraction of the display, and in particular can reduce the diffraction of the display. Although these modifications are not shown in the figures, they can be added if desired.

[0173] Figure 2a An example of an embodiment of a substrate 200 is schematically shown. The substrate 200 may be used in a dynamic glass. A plurality of mesh electrodes are applied to the substrate 200: Figure 2a Shown in FIG. 1 are two mesh electrodes: mesh electrode 210 and mesh electrode 230. The two mesh electrodes can be used to create an electromagnetic field between the mesh electrodes. When an optical fluid is used, this electromagnetic field can be used to provide electrophoretic motion of particles toward or from the electrodes. Two mesh electrodes are sufficient to create an optical modulator (e.g., dynamic glass), however, better control of the electromagnetic field is possible when there are more than two mesh electrodes.

[0174] In this embodiment, each of the plurality of mesh electrodes includes a plurality of main lines extending along the first direction. For example, the mesh electrode 210 includes a plurality of main lines: main lines 211, 212, 213, 214, and 215 are shown. For example, the mesh electrode 230 includes a plurality of main lines: main lines 231, 232, 233, 234, and 235 are shown.

[0175] Creating long, thin electrode lines, such as these main lines, can be subject to production defects. If a main line is connected to a controller by only a single path, a cut in the main line will electrically insulate the main line after the cut. In dynamic glass, this will be seen as a loss of controllable area, such as a line failure. For example, a line failure can be seen as a black line in a grayscale panel. Adding interconnects, such as interconnect lines, alleviates this problem.

[0176] In the illustrated embodiment, the main lines of the plurality of mesh electrodes (e.g., mesh electrodes 210 and 230) extend in the same direction (e.g., in the first direction 101), for example, they are parallel. The main lines can be used to control the optical properties of the light modulator. It should be noted that the main lines of the plurality of mesh electrodes are arranged in an alternating pattern on the substrate, i.e., staggered. Such a pattern is also referred to as an interdigitated pattern. For example, the main lines of the mesh electrodes 210 and 230 are arranged successively; two or more main lines are arranged successively on the substrate.

[0177] The main lines of the mesh electrode are connected to each other through a plurality of interconnection lines. The plurality of interconnection lines electrically connect the main lines of the mesh electrode together. Specifically, the plurality of main lines of the mesh electrode are connected to other main lines of the mesh electrode through a plurality of interconnection lines.

[0178] For example, the main lines of mesh electrode 210 are connected to other main lines of the same mesh electrode through multiple interconnection lines (interconnection lines 221, 222, and 223 are shown). For example, main lines 211 and 212 are connected through interconnection line 221; main lines 213 and 214 are connected through interconnection line 222, etc. Similarly, the main lines of mesh electrode 230 are interconnected through interconnection lines (interconnection lines 241, 242, and 243 are shown). In practice, there may be more main lines for the two mesh electrodes than the five shown; for each mesh electrode, there may be more interconnection lines than the three shown.

[0179] The interconnection line crosses another mesh electrode to form a cross point. For example, the interconnection line 221 connects two main lines of the mesh electrode 210 but crosses the main line 231 of the mesh electrode 230. Figure 2a Six crossover points are shown, one for each interconnection line. One crossover point has been marked by a dotted circle and reference numeral 251. In practice, there may be more crossover points.

[0180] The interconnecting lines are connected to the mesh electrodes, which will have the same potential when the substrate is used in an optical modulator. In one embodiment, the lines of different potentials are insulated from each other by means of an intermediate dielectric at the intersection points or intersection sections.

[0181] In addition to increasing the useful life of the substrate by protecting the electrodes from unwanted cuts (e.g., cuts that occur due to small defects during manufacturing, or cuts due to aging of the device), the interconnects have an additional surprising benefit. Long and thin lines limit the scale of light modulators because their resistance increases with their length. Therefore, the electromagnetic field is not uniform. By adding interconnects, the uniformity of the electromagnetic field is improved, making the transparency level or reflectivity level more uniform, especially if the mesh electrodes on the substrate are powered from the same edge, or even from the same point on the edge of the substrate.

[0182] The plurality of crossover points may be distributed across the substrate in a variety of ways. For example, they may be randomly distributed across the substrate. For example, they may be distributed in a regular pattern. For example, the distribution may be obtained as a result of an optimization process, such as optimization for diffraction, uniformity, and possibly other desired properties.

[0183] It is advantageous to connect a main line to one or more other main lines of the same mesh electrode, for example, it protects a particular main line from being cut. Advantageously, all main lines are provided with interconnecting lines, but this is not necessary. For example, in one embodiment, the number of main lines in the mesh electrode including at least two interconnecting lines is at least two, at least 10, at least half of the number of main lines, at least 90% of the main lines, or substantially all main lines. For example, in one embodiment, the main line is connected to at least 2, at least 4, at least 8 or at least 16 interconnecting lines. For example, the main line is connected to the interconnecting line within a certain distance from the edge of the substrate, and the distance is less than 10% of the length of the main line, less than 10cm, or less than 5cm, etc.

[0184] In one embodiment, a substantial portion of the mesh electrodes on the substrate are exposed to the surface of the substrate so that when the substrate is used in an optical modulator, the mesh electrodes are in fluid contact with the optical layer. It is not necessary to expose all mesh electrodes in this manner. For example, at the intersection, the first of the two intersecting mesh electrodes may extend below the second of the two intersecting mesh electrodes so that a portion of the first mesh electrode may not be exposed and is not in fluid contact. However, this unexposed portion does not significantly affect the optical properties of the optical modulator. For example, a large portion of the mesh electrodes (such as at least 80%, at least 90%, etc.) may be arranged to be in fluid contact. For example, in one embodiment, all main lines are in fluid contact.

[0185] It can be produced, for example, by performing the following Figure 2a The substrate shown in FIG.

[0186] - patterning a first mesh electrode on a substrate. The mesh electrode may include a plurality of main lines and a plurality of interconnecting lines. In one embodiment, the main lines may be regularly distributed across the substrate, while the plurality of interconnecting lines may be randomly distributed,

[0187] - Patterning is performed on top of electrically insulating areas (also called islands or patches) of interconnect lines, in particular at locations where the interconnect lines will intersect the second mesh electrode, and on top of main lines of the first mesh electrode that will subsequently intersect the interconnect lines of the second mesh electrode.

[0188] -Patterning a second mesh electrode on the substrate. The second mesh electrode may also include a plurality of main lines and a plurality of interconnecting lines. The plurality of main lines of the second mesh electrode may intersect with the main lines of the first plurality of main lines. The main lines of the second mesh electrode intersect with the interconnecting lines of the first mesh electrode at the location where the isolation island is patterned. The interconnecting lines of the second mesh electrode intersect with the main lines of the first mesh electrode at the location where the isolation island is patterned on the main lines on the first mesh electrode.

[0189] Using a regular pattern of main lines (eg equal distances between the main lines of the first mesh electrode and the second mesh electrode) results in a uniform electric field. The random distribution of the interconnecting lines reduces the contribution to diffraction. The above fabrication can be extended to more than two electrodes.

[0190] In the above-described manufacturing, the electrode lines may not be located at the same height. It is also possible to place the main lines at the same height above the entire surface of the dielectric. For example, the main lines of all mesh electrodes can be patterned and the interconnects can be placed, for example, under the dielectric covering the entire surface. The electrical connection between the interconnect lines and the electrode lines can be completed using through holes (e.g., holes at specific intersections in the dielectric and then covered with metal). Typically, the substrate itself is a dielectric.

[0191] Regardless of how the interconnects are placed, they prevent loss of electrical connection, for example, due to line interruptions such as during production or due to electrical corrosion of the line. This configuration will increase production yields and also increase the life of the product.

[0192] Interestingly, the improvement to the interconnect reduces the resistance at larger distances from the connector to the substrate. In conventional interdigitated lines, very long and thin electrodes will have significant resistance, especially for very large displays. By having interconnects between interdigitated lines, the electrodes are transformed from an electrical perspective into a mesh electrode. This results in lower resistance of the electrical tracks, better distribution of the electric field, and thus greater uniformity in the operation of the device.

[0193] The interconnect allows the mesh electrodes to be powered from points close to each other (e.g., from the same edge, from the same connector, from the same point), which has several advantages. In the absence of interconnecting lines, for example when powered from opposite edges of the substrate, there will be a local potential difference between the main lines even if the input voltage is the same. At a fixed area in the device, this difference is caused by the distance from the connector (which produces a specific electrode line resistance). This distance, and therefore the resistance, is different between the two interdigitated electrodes and varies across the substrate as the area under consideration is closer to one connector or closer to the other connector. As shown in FIG. Figure 2a As shown in , the end of electrode line 215 has a significantly higher length than the point near the end of electrode line 215 in electrode line 235 or 234. This potential difference will produce a DC offset, thus maintaining a fixed low electrocorrosion rate. For example, it is generally desired that adjacent main lines on a substrate have the same potential; for example, this can be used when the display is turned on (also referred to as vertical drive). However, in the absence of interconnection lines (for example, in the absence of mesh electrodes), due to the different distances of two points relative to each other to the connector (for example, measured along their main lines), a small horizontal electric field will still be generated. This undesirable small potential difference on the substrate will interfere with the direction of the electric field and the performance of the display. Therefore, when the corresponding mesh electrodes have the same input voltage, the use of interconnection lines can be used to ensure that the points relative to each other on adjacent main lines have a closer potential.

[0194] Figure 2b An example of an embodiment of a substrate 201 is schematically shown. If it is desired to have finer control over the motion of particles in an optical modulator (such as an optical modulator used in dynamic glass), more electrodes can be added to the substrate. For example, in an optical modulator, there are at least two electrodes on each substrate, but there can be more than two electrodes. For example, at least three electrodes can be applied to at least one of the first substrate and the second substrate. For example, in one embodiment, two electrodes can be applied to the first substrate and three electrodes can be applied to the second substrate. See, for example, US patent application 16 / 994918 (incorporated herein by reference), for many embodiments with different numbers of electrode configurations, the electrodes can be implemented as mesh electrodes.

[0195] A system in which one substrate has at least two electrodes and the other substrate has at least three electrodes has a variety of advantages. For example, such a light modulator can be driven so as to reduce the so-called curtain effect. The curtain effect occurs during the closing of the window, where it seems that a curtain is drawn between the electrodes. The curtain effect is a disadvantage, which itself is obviously distracting, and it also increases diffraction. Compared to the side with 2 electrodes, the electrodes can be closer to each other on the side with 3 electrodes, for example, less than 50 microns, more preferably less than 40 microns, such as 35 microns. This means that the electric field is stronger. Accordingly, the closing is faster and the curtain effect is also reduced. Using a 2+2 panel to move the electrodes closer to each other will result in a reduction in maximum transparency or reflectivity. But this can be avoided when additional electrodes are available. When opened, some additional electrodes may not be used, so the loss of maximum transparency or reflectivity is small. Additional electrodes on the substrate (for example, more than two electrodes) can be configured not to attract particles when the panel is opened, but to attract particles when the panel is closed. For example, a panel with at least 2 electrodes per substrate can have at least 4 electrodes in total. The substrates in the panel may have at least 5 electrodes, such as a 2+3 design; or, at least 6 electrodes, such as a 2+4 or 3+3 design; or, at least 8 electrodes, such as a 4+4 design, or using two 2+2 designs in which 3 substrates are stacked together, with two electrodes on each side of the middle substrate.

[0196] Substrates with more than two electrodes may also benefit from using mesh electrodes. For example, at least three mesh electrodes may be applied to the substrate. The same techniques used for two electrodes may be extended to three electrodes. For example, Figure 2b A substrate 201 with three mesh electrodes is shown: a first mesh electrode, showing main lines 261 and 264 of the first mesh electrode and interconnection line 271; a second mesh electrode, showing main lines 262 and 265 of the second mesh electrode and interconnection line 272; a third mesh electrode, showing main lines 263 and 266 of the third mesh electrode and interconnection line 273. The interconnection lines of the mesh electrode intersect with one or more main lines of other mesh electrodes on the substrate. For example, in this example, the interconnection line 271 has two intersections: intersection 252 and intersection 253. The intersections can be formed as in the embodiment with two mesh electrodes. For example, a dielectric can be arranged between an interconnection line (e.g., interconnection line 271) and a main line of another mesh electrode. Depending on the manufacturing method, the interconnection line can be located in a different plane from the mesh electrode; the mesh electrode can be located in the same plane or in a different plane.

[0197] The substrate 201 is applied with three mesh electrodes, more mesh electrodes may be used, for example four or more mesh electrodes, etc. When the substrate is used in an optical modulator, the opposite substrate may also have at least three mesh electrodes, or four or more mesh electrodes, etc. The opposite substrate may have a different number of electrodes.

[0198] Figure 2c An example of one embodiment of a crossover point is schematically shown. Figure 2c Two main lines 211 and 212 belonging to the same first mesh electrode are shown. For example, the two main lines may be the main lines of the mesh electrode 210. Figure 2c An interconnection line 221 is shown between the main lines 211 and 212. The interconnection line 221 crosses the main line 231 of the different second mesh electrode, creating a crossover point. Since different mesh electrodes sometimes need to have different potentials and sometimes need to have the same potential, it is important that the potentials of the first mesh electrode and the second mesh electrode can be controlled independently of each other.

[0199] This can be achieved by arranging the current control component 254 between the interconnection 221 and the main line 231. A portion of the interconnection 221 extends below the current control component 254, while the interconnection 221 extends above the current control component 254. The portion of the main line 231 extending below the current control component 254 is indicated by a dashed line and reference numeral 231'. It is also possible in the opposite way, for example the interconnection 221 partially extends below the current control component 254, while the main line 231 extends above the current control component 254. The latter has the advantage that the entire main line can be in fluid contact in the optical modulator.

[0200] Typically, current control component 254 will be made of a transparent material. Component 254 may include a semiconductor material, or just an insulating material. For example, component 254 may include an inorganic material (e.g., silicon dioxide) or an organic material (e.g., polyamide, photoresist, acrylic resist, etc.).

[0201] The current control component controls the current that can flow between the main line 231 and the interconnection line 221 (ie, between the two mesh electrodes). A common choice for a current control element is to use a dielectric; in this example, the current is controlled by blocking it.

[0202] Another option of the current control component is that the current control component is configured to allow current to pass if the potential between the interconnection 221 and the main line 231 meets the criteria. For example, if the voltage difference between the interconnection 221 and the main line 231 is high (e.g., the voltage difference is higher than a threshold), the current may be allowed to travel through the current control component 254. For example, if the voltage difference between the interconnection 221 and the main line 231 is low (e.g., the voltage difference is lower than a threshold), the current may be blocked and not allowed to travel through the current control component 254. Note that the interconnection 221 and the main line 211 are part of the same mesh electrode. Therefore, if the potential difference between the first mesh electrode and the second mesh electrode is high (e.g., high at the intersection, e.g., higher than a threshold of the current control component), the current is allowed to travel between the first mesh electrode and the second mesh electrode. There are a variety of semiconductor components that control current, for example, the current control component may be a Zener diode.

[0203] In one embodiment, the Zener diode comprises two back-to-back Zener junctions of opposite polarity connected in series. If the voltage difference is greater than a threshold value T or less than a threshold value -T, current can flow, otherwise current cannot flow. Such a Zener diode avoids large voltage differences (e.g., so-called overvoltages) that can damage the system. The Zener diode is also beneficial if the connection points of the mesh electrodes are far apart.

[0204] For example, an interdigitated pattern in which the interconnection includes a current control component (such as a Zener diode) has several advantages. For example, when turning on the display (also called vertical drive). The drive can be done at high voltage. The diode will pass current both in the case of high positive voltage and high negative voltage. At higher voltages, the mesh density is increased because the current control component connects two mesh electrodes. In the opening phase, the mesh electrodes of the same substrate are preferably at the same potential. This is also beneficial for the life of the product.

[0205] In one embodiment, the on drive on both mesh 1 and mesh 2 of the substrate is 24V AC. The Zener diode is configured to pass current when the potential difference is above 23V. Therefore, if a portion of mesh 1 is damaged and becomes insulated, mesh 1 will be at 0V, but mesh 2 will be at 24V. At this point, the Zener diode will pass power so that the potential of mesh 1 is equal to the potential of mesh 2, which is 24V in this example. When off, mesh 1 may be at a potential of, for example, 10V, while mesh 2 may be at a potential of -10V. The potential difference of the Zener diode is then 20V (lower than 23V), so the Zener diode blocks current, which means that a horizontal electric field is generated.

[0206] When switching off the device (also referred to as horizontal driving), it is advantageous to insulate each mesh electrode. As a result, horizontal driving will only occur at low voltages to prevent conduction via the Zener diodes.

[0207] It may happen that a part of the electrode mesh 1 becomes insulated. This may happen, for example, if there are two cuts between two interconnects. In that case, there is a suspended line. The method of using a Zener diode for the dielectric interconnect of the second mesh will help to discharge this insulated part. Actuation at high voltage will charge a part of the electrode of mesh 1. When the device is turned off, the Zener diode from the interconnect of mesh 2 will discharge the insulated branch until the potential is lower than the potential that activates the Zener diode. Therefore, when the device is driven to the non-transparent state, this part of the electrode mesh 1 will not remain transparent.

[0208] Figure 3 An example of one embodiment of a substrate is schematically shown. Figure 3 Shown in FIG. 3 are parts of two mesh electrodes 301 and 302. The main lines of the two mesh electrodes are indicated on the left by reference numerals 301 and 302 of the two mesh electrodes, respectively. Figure 3 301 and 302. The insulator insulates the two mesh electrodes 301 and 302 from each other. Note that Figure 3 Some interconnection lines shown in FIG. 3 connect two main lines of the mesh electrode 301 , and some interconnection lines connect two main lines of the mesh electrode 302 .

[0209] exist Figure 3 In an embodiment, the main line is not straight but wavy, while the interconnecting line is straight. Additionally or alternatively, the interconnecting line may be wavy. Using non-straight lines has a smaller effect on diffraction, and since there are many possible non-straight lines, this has the advantage that their effect on diffraction can be optimized. The extent to which the electrode line contributes to diffraction depends on its shape, and by changing the shape, this contribution can be changed. For example, a wavy line can be constructed by connecting shapes such as line segments, semicircles, sinusoids, etc. Figure 3 Two mesh electrodes are shown in FIG, but more non-linear mesh electrodes may be combined.

[0210] Figure 4 An example of one embodiment of a substrate 400 is schematically shown. Figure 44. Shown in FIG. 4 are a plurality of mesh electrodes, in this embodiment, two mesh electrodes 431 and 432. Each of the mesh electrodes includes a plurality of main lines and a plurality of interconnecting lines. The substrate has four edges. Two opposing edges have reference numbers: edge 421 and edge 422. Edge 421 and edge 422 are arranged so that they coincide with the main lines of all mesh electrodes. For example, the main lines of mesh electrode 4341 and mesh electrode 432 reach edge 421 and edge 422.

[0211] The connector 411 is arranged on the edge 421 and is electrically connected to one or more main lines of all mesh electrodes (e.g., mesh electrode 431 and mesh electrode 432). The controller can conveniently control all mesh electrodes by connecting the controller to the connector 411. For example, the connector 411 may have an interface for connecting a wire to the connector 411. The other end of the wire may be connected to the controller. Due to the interconnection, the connector 411 may be arranged on one edge of the substrate, or even at a point on one edge of the substrate.

[0212] Preferably, the connection points where the mesh electrode on the substrate (whether before or after cutting) is connected to a cable or the like (which is connected to a power source, such as a controller) are close to each other. For example, the connection points may be located on the same edge of the substrate. The connection points do not necessarily have to be located on one edge. The connection points may also be located on the substrate, for example on the back side of the substrate opposite the mesh electrode. Again, it is preferred that the connection points are close to each other. For example, the connection points may be located in a single connector. For example, the connection points may be 10 cm or closer to each other, or 5 cm or closer.

[0213] Using a mesh electrode has another important advantage, that is, the substrate can be cut into a variety of shapes. For example, the substrate 400 can be manufactured in a rectangular form. However, after the rectangular shape has been produced, it can be cut into different shapes. Figure 4 A cutting line 412 is shown in the form of a thick dashed line along which the substrate 400 can be cut. An endless variety of shapes can be cut from the substrate 400 without changing the manufacture of the substrate itself. Even after cutting the substrate, the connector 411 is still connected to all mesh electrodes. In a conventional design without interconnecting lines, cutting the design is impossible because the main lines are sensitive to line interruptions.

[0214] The substrates can be cut before the two substrates are combined into the light modulator, and the substrates can also be cut after the two substrates are combined into the light modulator. For example, an assembly that can form a light modulator includes at least two substrates, and between the two substrates is an optical layer with fluid and particles. The assembly can be cut after assembly to obtain a light modulator of a specific shape.

[0215] By first making a rectangular substrate and then cutting it, a non-rectangular substrate can be provided. The connection points can be distributed on the substrate. For example, an electrical connector can be provided to a mesh electrode on the substrate at a single point.

[0216] A connector such as connector 411 may be mounted on the optical modulator before or after cutting. For example, a connector may be mounted on the edge of a substrate, the connector may be connected to all of the plurality of mesh electrodes on the substrate, or even to all of the mesh electrodes on two substrates. On the other hand, the connector may be connected to a controller.

[0217] A free cut of the device can be obtained without electrical interference. The cut may even include a hole. During cutting, the cut edges of the substrates can be sealed, for example by melting, gluing. The sealing keeps the fluid between the substrates.

[0218] Cutting the device after module production removes the seal of the device. A welding process can be used to recreate the module insulation / module seal after cutting. Melting is particularly effective for plastic substrates. Melting can be done, for example, using a laser, which can also be used for the cutting itself. Glass substrates can also be cut and sealed. If the cutting is done at substrate level before assembly, it can also be done without leaving accessible edges.

[0219] An edge strip of contact foil may be placed at the edge of the module. If the cutting ensures that a small edge corresponding to the distance between 2 interdigitated electrode lines is left, the device will function properly.

[0220] Another advantage of using interconnects is that the light modulator is less sensitive to damage. For example, if a portion of the light modulator is accidentally cut (e.g., due to a collision with an object), the light modulator will still remain functional. If fluid leaks due to the collision, this can be stopped by gluing, melting or otherwise sealing the cut portion of the light modulator.

[0221] In one embodiment, the controller is electrically connected to a plurality of mesh electrodes on the substrate at a connection area on the substrate. The connection of this connection area makes the distance to the power supply equal, thereby minimizing the potential difference between two points opposite to each other on two continuous main lines of two mesh electrodes. For example, the connection area can be formed by a connector connected to one or more substrates. For example, the connection points in the connection area on the substrate are close to each other, such as 10 cm, 5 cm, 1 cm, or even closer. The mesh electrodes are connected close to each other so that the resistance to a position on the substrate (for example, the resistance to two relative points on the relative main line) is close to each other. In one embodiment, the resistance from a point on the relative main line to the power supply (for example, measured as a percentage of the smaller resistance minus the larger resistance) is within 10%, within 5%, within 1% and below.

[0222] The connection area may be located at an edge of the substrate or at the back side of the substrate, etc.

[0223] There are a variety of ways in which a substrate according to an embodiment may be manufactured. For example, a method of manufacturing a substrate used in an optical modulator (e.g., an optical modulator for dynamic glass) may include:

[0224] - providing a substrate. For example, a dielectric substrate. For example, a plastic or glass substrate, etc.; and

[0225] - applying a plurality of staggered mesh electrodes on the substrate, the plurality of staggered mesh electrodes extending across the substrate in a two-dimensional pattern, two mesh electrodes of the plurality of mesh electrodes on the substrate crossing at a plurality of intersection points extending across the substrate.

[0226] For example, applying a mesh electrode may include applying a plurality of main lines and applying a plurality of interconnecting lines. Applying electrodes (e.g., main lines and / or interconnecting lines) may be accomplished by patterning, for example, after deposition of a conductive material (e.g., using thin film techniques such as spin coating, flexible printing, slit coating, etc.), using, for example, photolithography with an etching process, laser patterning. For example, the electrode may be applied in the following manner: by coating a layer of a conductive material (e.g., metal), and partially removing the coating, thereby retaining the electrode. Application may be accomplished using direct printing. A mesh electrode may also be created by directly patterning a conductive photoresist by conventional photolithography processes or direct laser writing, etc.

[0227] The method of manufacturing may also include aligning the current control component at the intersection between two mesh electrodes (e.g., at the intersection between the main line and the interconnection line). For example, by patterning isolated blocks or isolated islands on the main line and / or the interconnection line. The interconnection conductive lines can be obtained by similar production techniques as used for patterning the electrode mesh.

[0228] There are many ways to modify or alter this method of manufacturing. Given here are examples.

[0229] Figure 5a to Figure 5e An example of one embodiment of manufacturing a substrate is schematically shown.

[0230] Figure 5a It is shown that a substrate is provided. For example, the substrate can be a plastic substrate or a glass substrate. Figure 5b and Figure 5c In a process, a plurality of interconnect lines are patterned on a substrate. Figure 5b shows the deposition of a conductive layer for patterning on a substrate, and Figure 5c The result after patterning is shown. In this embodiment, the interconnects are applied to the substrate before the main lines. In this embodiment, after the patterning step, the interconnects are insulated from each other. In this embodiment, the interconnects are patterned by a photolithography process and / or an etching process. The interconnects can be applied by direct printing in the desired pattern (e.g., by techniques such as inkjet printing, screen printing, etc.). In order to increase the resolution of the printing process, additional local lithography or dry etching can be performed after printing to thin the lines.

[0231] exist Figure 5d In the embodiment, the substrate is coated with a dielectric layer. Holes are created in the dielectric to form vias. In this embodiment, the interconnects are created underneath the interdigitated pattern and are separated from the mesh electrodes by a dielectric layer. Figure 5e A plurality of main lines applying a plurality of mesh electrodes (in this example, two mesh electrodes) are shown. The plurality of main lines of the plurality of electrodes are arranged alternately with each other on the substrate. Note that the main lines are connected to the Figure 5c The interconnection lines applied in the substrate are connected by vias to the applied main lines to the plurality of mesh electrodes. In a process such as this, all the main lines are in the same plane parallel to the substrate, while the interconnection lines are in different planes.

[0232] Advantageously, when the substrate is used in a light modulator, all of the main lines will be in contact with the optical layer fluid, while none of the interconnects will be in contact with the optical layer fluid. Figure 5a to Figure 5e A disadvantage of the illustrated process is that the dielectric layer is retained everywhere across the surface. This ubiquitous dielectric layer can alter the optical properties of the device. The disadvantage of retaining the dielectric layer can be addressed by additional patterning of the layer, but this adds complexity.

[0233] This can be avoided by using an alternative manufacturing process that may still use photolithography but does not leave dielectric layers everywhere and does not require vias to make connections. Figure 6a to Figure 6gAn example of one embodiment of manufacturing a substrate is schematically shown.

[0234] Figure 6a Providing a substrate is shown. Figure 6b The coating of the substrate by a first conductive layer is shown. Figure 6c The result is shown after patterning the first conductive layer to form the interconnects. In this embodiment, the interconnects are applied to the substrate before the main lines. Figure 5c After this patterning process, the interconnects are not insulated from each other. The interconnects are patterned by removing conductive material above and below the interconnects. However, at the ends of the interconnects, Figure 6b The conductive material of the electrode is not removed. Instead of using vias, the latter material will be used to connect to the mesh electrode later. In this embodiment, the interconnection lines are patterned by a photolithography process and / or an etching process.

[0235] Figure 6d The dielectric layer is patterned to obtain Figure 6c The isolation block shown in Figure 1 is located above the interconnect line. Figure 6e Alternatively, the dielectric layer may be deposited locally. The remaining dielectric is only used to cover the area of ​​the interconnect.

[0236] Figure 6f The deposition of a second metal layer covering the entire substrate is shown. Figure 6g In the example, the substrate is patterned to expose the interdigitated main lines. Note that the latter patterning removes Figure 6f A portion of the coating shown in FIG. Figure 6b A portion of the coating is shown. Figure 6g The results of patterning are shown in Figure 1. Most of the main lines consist of two metal layers: one on Figure 6b was deposited in the Figure 6f A single layer is used only where the main lines are located over the isolated blocks.

[0237] Figures 7a to 7c An example of one embodiment of manufacturing a substrate is schematically shown. Figure 7a It is shown that a plurality of main lines of at least two mesh electrodes are printed or patterned on a substrate.

[0238] exist Figure 7b In , the dielectric material is printed on the main lines. Figure 7c Printing of conductive material on dielectric is shown, as well as connecting two main lines of the same mesh electrode. In one embodiment, patterning of the main lines is combined with direct printing of dielectric blocks and interconnect lines.

[0239] In one embodiment, the dielectric can be printed black, which can then be used as an optical mask to pattern a thick resist on top by photolithography. This thick resist pattern can be used as spacers when the substrate is combined with a second substrate in a light modulator.

[0240] The dielectric itself can also be used as a spacer, for example by making the dielectric thick enough. This can be achieved by ensuring that electrodes from another substrate in the light modulator are not in the same position. However, they can be in the same position, for example if an insulator is arranged between the substrates.

[0241] Note that Figures 7a to 7c In an embodiment of the present invention, the plurality of main lines of the mesh electrode are located in the same plane parallel to the substrate.

[0242] Figure 8a An example of an embodiment of a crossover point is schematically shown. For example, Figure 8a The intersection of Figure 6a to Figure 6g The illustrated process is created. Figure 8a The lower level is schematically shown in Figure 8b middle.

[0243] Figure 8a and Figure 8b 821, 822, and 823. Main lines 821 and 823 belong to the same first mesh electrode. Main line 822 belongs to a different second mesh electrode. Main lines 821 and 823 are connected by interconnection line 831. Interconnection line 831 extends below main line 821, as shown in FIG. Figure 8b The dielectric 851 is Figure 8b 851. Preferably, the dielectric 851 is transparent. Note that the main lines 821 to 823 include metal on two layers: a lower level 812 and an upper level 811, except when the main lines run above the dielectric, only the upper level 811 is used, or except when the main lines run below the dielectric, only the lower level 812 is used. This construction avoids the use of vias to connect the main lines to the interconnect lines. The lower level 812 also Figure 8b is schematically shown in FIG.

[0244] Figure 8c to Figure 8e An example of one embodiment of manufacturing a crossover point is schematically shown. Figure 8c Shown in FIG. 8 are three main lines: main lines 842, 843 and 844. On main line 843, isolation blocks 851 are applied, for example, by patterning or direct printing. Figure 8d8, a connection bridge 852 is applied on top of the isolation block. The connection bridge 852 is one embodiment of an interconnect line.

[0245] The connecting bridge electrically connects two main lines of the same mesh electrode, i.e. it is a conductive bridge. The connecting bridge is insulated from other meshes on this substrate or on another substrate. If the connecting bridge is connected to another mesh electrode, a short circuit may occur. The conductive bridge is preferably made of a conductive material (in particular, a metal trace), but can also be made of other materials (e.g., a semiconductor material).

[0246] Optionally, in Figure 8e In the embodiment of the present invention, additional components can be arranged on top of the connecting bridge. For example, a spacer 853 can be applied. The spacer keeps a certain distance from the other substrate in the light modulator. For example, two substrates can be arranged in the light modulator so that the spacer contacts the two substrates.

[0247] The spacer may include a current control component configured to control the current between the first mesh electrode on the first substrate and the second mesh electrode on the second substrate. The spacer may be a dielectric that blocks the current. For example, the current control component may be arranged to allow the current to pass when the voltage difference exceeds a threshold value, and to block the current when the voltage difference does not exceed a threshold value. For example, the spacer may include a Zener diode. The number of spacers with current control function may be limited to one or more or all spacers.

[0248] Figure 8e The spacer 853 is shown arranged at the intersection; it is arranged at the location where two mesh electrodes cross each other; in this example, the interconnection between the main lines 842 and 844 of the same mesh electrode crosses the main line 843 of a different electrode. Additionally or alternatively, the spacer may be arranged at a different location on the substrate, such as not at the intersection.

[0249] In one embodiment, one or more spacers are arranged between the first substrate and the second substrate of the light modulator, wherein the spacer is electrically connected to the mesh electrode on the first substrate, but is not electrically connected to the mesh electrode on the second substrate. On the second substrate, the spacer can be connected to the controller. In particular, at least one such connection spacer can be used for each mesh electrode on the first substrate. In this way, all mesh electrodes can be connected from one side of the light modulator (e.g., from one side of the light modulator). The connection spacer is conductive and preferably transparent. It can be constructed as a conductive column.

[0250] For example, in one embodiment, the first mesh electrode on the first substrate can be electrically connected to a conductive spacer, for example, by placing the spacer on top of the first mesh electrode, or by connecting the conductive spacer and the mesh electrode, for example, by a metal trace. The conductive spacer can then be connected to a connection point at the second substrate. For example, the conductive spacer can be connected to a through hole arranged in the second mesh, for example, the through hole can be opposite to the conductive spacer. For example, the conductive spacer can be connected to other electrodes (e.g., metal). The connection point is then connected to a controller, for example, for controlling the potential on the mesh electrode of the first substrate. This enables the electrode mesh of the two substrates to be powered from one side of the optical modulator.

[0251] If there are more than two substrates (e.g., three or more substrates) stacked on top of each other. The mesh electrodes in the first substrate can be connected to the second substrate through a conductive spacer, which in turn is connected to the third substrate through a conductive spacer, and so on to the final substrate. Thus, the mesh electrodes on the substrates can be connected to the connection points at the final substrate through one or more conductive spacers arranged between the substrates. This allows all mesh electrodes in the stack to be controlled from one side of the light modulator.

[0252] Providing spacers between substrates in an optical modulator (such as an optical modulator used in a dynamic glass) is also advantageous for interdigitated electrodes that are not mesh electrodes. One embodiment of such a dynamic glass is a dynamic glass including an optical modulator, wherein the optical modulator includes: a first substrate and a second substrate facing each other; a plurality of staggered electrodes extending across the first substrate and across the second substrate in a two-dimensional pattern; an optical layer, located between the first substrate and the second substrate, the optical layer including a fluid containing particles, wherein the particles are charged or can be charged. As with the mesh electrode, the controller may be connected or can be connected to the electrodes on the substrate. The spacer may be arranged on the first substrate and / or the second substrate so that the substrates are spaced apart from each other. The conductive spacer may be connected to an electrode on one substrate and insulated from an electrode on the opposite substrate, wherein the spacer may be connected to the controller via a connection point (e.g., via another electrode on the opposite substrate (including the back side of the opposite substrate), a through hole, etc.). In one embodiment, the connection point with the electrode on the substrate (e.g., the connection point with the electrode on the substrate) may be arranged on the back side of the substrate. The connection point may be arranged near the edge of the optical modulator. Connection points to the electrodes may also be provided on the opposing substrate, for example connected via spacers. In one embodiment, all electrodes in the light modulator may be controlled from the same side of the substrate.

[0253] Semiconductor spacers with non-mesh electrodes may also be used, for example, the spacers may be connected to electrodes on a first substrate and electrodes on a second substrate, wherein the spacers include semiconductor materials such as Zener diodes (e.g., unidirectional Zener diodes or bidirectional Zener diodes).

[0254] Figure 9a An example of an embodiment of a mesh electrode 901 is schematically shown. The two-dimensional pattern of the mesh electrode across the substrate comprises a regular hexagonal pattern. Advantageously, the pattern fills the substrate. Such a substrate is also referred to as a tiling (meaning that a tile is regularly repeated on the substrate). Instead of the hexagonal tiling shown, for example, a triangular tiling, a square tiling, etc. can be used. Note that Figure 9a The mesh electrode shown in FIG. 1 is located in one plane as a whole, but other mesh electrodes combined with the mesh electrode on the same substrate may be located in different planes. Figure 9a The hexagonal pattern shown in can be considered as a combination of main lines and interconnect lines. Figure 9b As shown in , the pattern can be seen as a number of main lines in the form of a regular zigzag pattern; Figure 9b Shown in FIG. 9 are main lines 902 and 903. Interconnection lines are applied between the main lines so that the main lines are formed into a mesh-like electrode. Figure 9b Shown in FIG. 1 are three interconnects, one of which has the number 904 .

[0255] Fig.9c An example of an embodiment of a substrate is schematically shown. Two mesh electrodes are applied to the substrate: a mesh electrode 905 having a hexagonal pattern and a mesh electrode 906. For example, in order to manufacture Fig.9c A substrate of the type shown in FIG. 1 may be provided with a first mesh electrode on the substrate, and then a current control component 907 (e.g., a dielectric and / or a diode) may be applied on the first mesh electrode, and finally a second mesh electrode may be applied on the substrate, the second mesh electrode being insulated from the first mesh electrode by the current control component. The mesh electrode and / or the dielectric may be applied by patterning and / or direct printing. Note that relatively little dielectric is required compared to the area of ​​the mesh electrode.

[0256] The mesh electrode may have a period with which the pattern repeats. For example, the period may be a vector indicating the unit repetition of the mesh electrode. The second mesh electrode may be offset by half a period relative to the first mesh electrode. If there are more than two (e.g., n, where n may be greater than 2) mesh electrodes, mesh electrode k may be offset by (kl) / n periods relative to the first mesh electrode; here, the mesh electrodes are numbered from 1 to n.

[0257] When using include Figure 9a When the regular type of non-linear mesh electrodes is shown, more than two mesh electrodes may be applied. For example, Figure 9d to Figure 9h An example of one embodiment of manufacturing a substrate is schematically shown,

[0258] For example, to make Figure 9h A first mesh electrode (such as Figure 9d ), and then applying a current control component (e.g., a dielectric and / or a diode) to the first mesh electrode (e.g., Fig.9e Then a second mesh electrode is applied, such as Figure 9f The second mesh electrode is insulated from the first mesh electrode by the current control component. Next, as Figure 9g As shown in , a second set of current control components is applied, and a third mesh electrode is applied on top of the second set of current control components. The mesh electrode and / or the dielectric may be applied by patterning and / or direct printing.

[0259] The three mesh electrodes are offset relative to each other so that they can establish an electric field on the substrate as needed to control, for example, a light modulator. As an example, Figure 9f The mesh electrode can be relative to Figure 9d The mesh electrodes are offset by 12.5 microns in the horizontal direction and 25 microns in the vertical direction.

[0260] A substrate having 3 or more mesh electrodes can be used in an optical modulator, such as a dynamic glass for a 2+3 configuration or a 3+3 configuration, etc. That is, a substrate having 2 mesh electrodes can be arranged opposite to a substrate having 3 mesh electrodes (2+3), a substrate having 3 mesh electrodes can be arranged opposite to a substrate having 3 mesh electrodes (3+3), and so on.

[0261] A strip of electrically connected foil may be attached to at least one edge of the substrate. The strip includes a conductor connected to the mesh electrode on the substrate. The strip may be cut, possibly together with the substrate. A connector may be applied to the remainder of the strip, thereby connecting the mesh electrode to the controller through the conductor of the foil, through the connector. In one embodiment, the strip of foil may be applied to at least two edges. For example, two edges may share a common corner of the substrate. For example, the two edges may be opposite edges of the substrate. For example, the two opposite edges may be orthogonal to the main line. For example, the two opposite edges may be parallel to the main line. In one embodiment, the strip of foil is applied to all edges of the substrate.

[0262] Figure 10a to Figure 10bAn example of an embodiment of a substrate is schematically shown. Shown are a first mesh electrode 1210, a second mesh electrode 1211 and a dielectric 1212, and surrounding the mesh electrodes is an electrical connection foil 1213. There are many ways to connect the mesh electrode on the substrate to a controller (e.g., a controller on a PCB). For example, the mesh electrode can be connected via a cable assembly, a PCB mounted connector, etc., and using foil 1213 has the added advantage that it can be cut to support different connection points.

[0263] For example, foil 1213 may include a conductor connected to the mesh electrode. Foil 1213 itself is typically an isolator. For example, the conductor may be an etched copper conductor. Foil 1213 is made of a polyimide material. Foil 1213 may include a flexible printed circuit (FPC). For example, the foil may be a polyimide interconnect foil to connect a substrate (e.g., glass) to a circuit board. Note that foil 1213 is not present behind the mesh electrode. Typically, only the end of the foil is glued to the substrate and aligned with the electrode pattern. Foil 1213 connects the substrate to the PCB. For example, a floating plastic foil.

[0264] The foil 1213 may be present only to allow the substrate to be mounted. The substrate itself may be a glass substrate or a plastic substrate. The type of plastic substrate may be the same or different from the foil 1213. The foil not used to connect the mesh electrode may be cut away.

[0265] The foil may be applied to the mesh electrode and substrate using an adhesive. Typically, the adhesive is configured to conduct electricity in only one direction, for example vertically but not laterally; for example, the adhesive may be doped with gold particles. The adhesive may be applied between the electrode pattern on the substrate and the foil.

[0266] Fig.10a A zoomed-out picture is shown, and Fig.10b Magnified details are shown. Mesh electrode 1210 and mesh electrode 1211 each include multiple main lines connected together by multiple interconnect lines. When the interconnect lines cross the main lines, dielectric 1212 is applied between them. Note that the foil supports the connecting lines. On the left and right sides, the connecting lines are connected to the first two main lines from the edge of the substrate, while on the top and bottom, the connecting lines are connected to all the main lines. Fig.10b The numbers 1210 and 1211 in indicate the connection lines of each mesh electrode. The connection lines at the left or right side, or at the top or bottom are optional as long as the two mesh electrodes remain connectable from the outside of the substrate.

[0267] The advantage of this embodiment is that it can be cut. Fig.10cIn the figure, a cut line 1214 of a shape is indicated. The actual shape is arbitrary, as long as the connection points of the substrate maintain access to at least one main line of each mesh electrode. Even holes can be cut in the shape. In this embodiment, all foils and all connection lines are cut, except for the strip at the bottom. The strip contains the connection lines for each mesh electrode. For example, connectors can be applied to the strip. Fig.10d An example of an embodiment of cutting a substrate is schematically shown. Note that any non-rectangular shape can be obtained in this way. The cutting method is advantageous because it can support windows of arbitrary shapes. For example, the cutting method can be used to cut dynamic glass for automobiles. If the substrate is flexible, the method can also support any curves in the dynamic glass.

[0268] exist Figures 10a to 10d In the illustrated embodiment, the substrate may be assembled into the dynamic glass after cutting is performed on the substrate. However, this is not required. The substrate may be combined with one or more other substrates in a light modulator (e.g., for the dynamic glass). The two substrates may be cut simultaneously. For example, they may be cut using a laser or the like. During or after cutting, the optical layers in the assembled light modulator may be sealed, for example, by melting or gluing.

[0269] Figures 10a to 10c The substrate allows sub-segments to be cut from the substrate. If the cut pane shares a portion with the edge of the initial substrate, the electrodes on the pane can be easily connected to a controller. Arbitrary segmentation of the substrate with easy connectivity is also possible, for example using transparent contacts arranged on the outer surfaces of two (or more) substrates. These transparent contacts can be applied during or after the manufacture of the mother substrate and can be conductively connected to the electrodes through through holes in the substrate. If the contacts are formed during the manufacture of the mother substrate, they can be positioned with regular offsets from one part of the mesh electrode to the next. This allows the final modulator to have an almost unlimited number of sizes.

[0270] Additional vias connecting each mesh electrode can be created between the mesh electrode and the other side of the substrate. The substrate / product can then be cut at any location and still be able to interconnect it. The density of the vias will dictate the minimum possible cutting step size.

[0271] Fig.11aAn example of an embodiment of a substrate 202 is schematically shown. The substrate 202 (e.g., a glass substrate or a plastic substrate, etc.) is provided with a first mesh electrode 281 and a second mesh electrode 282. In this example, the main lines of the mesh electrodes 281 and 282 are arranged on the same side of the substrate. The two mesh electrodes are interdigitated. Interconnection lines are provided between the main lines of the same substrate. One of the interconnection lines is provided with a reference number: interconnection line 286. At the position where the main line and the interconnection line cross each other, a dielectric 283 is arranged between them. The dielectric 283 can be replaced by different types of current control components, as explained herein. Although two mesh electrodes are shown, there may be more mesh electrodes. If the substrate is integrated into an optical modulator, the surface to which the main lines are applied will then be in fluid contact. For example, as Fig.11a The two substrates shown can be arranged opposite each other with their mesh electrodes facing each other. In this embodiment, all mesh electrodes including interconnects are applied to the same side of the substrate; this is not necessary, for example, some or all of the interconnects can also extend through the back side.

[0272] Fig.11a Each mesh electrode in the embodiment is provided with a plurality of through holes, which connect the mesh electrode to the other side of the substrate. If the substrate 202 is cut, the controller can be connected to the through holes of each mesh electrode. This method has the advantage that even if the middle part of the substrate is cut off, it does not share a part of the edge of the substrate 202, it can be connected. In the embodiment shown, some through holes are connected to the interconnection lines and some through holes are not connected.

[0273] For example, it is assumed that the substrate 202 is cut along the cutting line 287, so that in this example, the substrate 202 is cut into a left portion and a right portion. The left portion can also be connected through the side opposite to the mesh electrode, such as at the through hole 284.1 for the first mesh electrode and the through hole 285.1 for the second mesh electrode. The right portion can be connected to the side opposite to the mesh electrode, such as at the through hole 284.2 for the first mesh electrode and the through hole 285.2 for the second mesh electrode.

[0274] In one embodiment, the through holes extend across the substrate in a random pattern, a regular pattern and / or a predetermined pattern. For example, the density of through holes per mesh electrode is above a minimum threshold. The density of through holes will indicate the minimum cutting step that can be considered. For example, if there is one through hole per centimeter on average along the main line, a very small pane can be cut from the substrate, about one centimeter plus two times the cutting loss. Alternatively, the through holes are set at determined positions, for example depending on the type of pane to be cut from the substrate. This has the advantage that far fewer through holes are required, although this may require higher cutting accuracy.

[0275] Fig.11a The distance 288 between consecutive through holes of the mesh electrode 281 is shown. The maximum distance between consecutive through holes of the mesh electrode is related to the size of the smaller substrate that can be cut from the mother substrate (e.g., substrate 202). In one embodiment, the through holes are arranged on the main line, and the maximum distance is the maximum distance measured along the main line. For example, the maximum distance can be at most 10 cm, at most 1 cm, at most 1 mm, etc.

[0276] The through hole can be created, for example, by drilling a hole in the substrate and filling the hole with a conductive material. The substrate can also be made of a conductive material line separated from the dielectric, so that the electrode line of the mesh electrode is as thick as the substrate. Another method is to disperse conductive particles in the polymer. Contact can be made by ACF bonding, for example, by pressurizing the substrate / doped polymer to ensure the connection between the patterned mesh electrodes on one side of the substrate to the other side. For example, the connection can be made by laser welding. For example, laser welding can be used to create a track from a through hole terminating at the back side of the substrate to the edge of the substrate.

[0277] A substrate with multiple through holes can be combined with foil connections at the substrate edge, e.g. Figures 10a to 10d ; however, this is not required.

[0278] For example, in one embodiment, the mother substrate can be much larger than the pane used in the final product. For example, the size of the mother substrate can be such as 6m×6m, or even larger, such as 6m×30m, etc. Depending on the application, the pane cut out from the mother substrate may be much smaller, such as 30cm×30cm. In this manufacturing method, some panes may not share an edge with the mother substrate. Advantageously, the mesh electrodes located in the cut portion of the substrate are connected from two points close to each other, such as at the same point on the same edge of the cut pane. In one embodiment, the spacing of the through holes can be as small as one through hole per millimeter. The through holes can be arranged in a wide array, but can also be precisely arranged at the desired position.

[0279] Fig.11b and Fig.11c A 3d rendering of an example of one embodiment of a substrate is schematically shown. Fig.11b and Fig.11c The substrate shown in Fig.11a The types shown in Fig.11c In , the mesh electrode is located on the top surface of the substrate. Fig.11b In optical modulators, the mesh electrode is located on the bottom surface of the substrate. In optical modulators, the optically active layer can be inserted between two layers. Particles in an optical fluid can be controlled by applying a voltage on the mesh substrate, which is connected through the side of the substrate that is not in contact with the fluid.

[0280] Fig.11d An example of one embodiment of the substrate 203 is schematically shown. Fig.11d An example substrate having multiple mesh electrodes is shown. In this embodiment, three mesh electrodes are used: mesh electrodes 291, 292, and 293. The mesh electrode may have multiple main lines and multiple interconnecting lines. For each mesh electrode, one main line is shown. The interconnecting lines are schematically indicated at 296. Figures 11a to 11c In the example, the mesh electrode is provided with through holes, which connect the mesh electrode from one side of the substrate to which the mesh electrode is applied to the other side. The mesh electrode can be connected through one of these through holes. The through holes are indicated with small solid circles.

[0281] The vias are arranged in groups of vias across the substrate. Each mesh electrode is connected to one via in each group. Two such groups are shown in FIG. Fig.11d 294. The distance between two vias in a group is less than the smaller spacing distance 294. The groups themselves are spaced apart by at least the larger spacing distance 295. In one embodiment, the distance is measured by the projection in the direction along the main line. In one embodiment, the Euclidean distance is used on the substrate.

[0282] Additional through holes may be present in the substrate for other purposes.

[0283] Fig.11e An example of one implementation of the substrate 204 is schematically shown. Fig.11e Shown in is the back side of the substrate opposite to the side with the mesh electrodes. Shown are groups 297. Each group has a through hole for each mesh electrode. Within a group, the through holes are close to each other. The distance between groups is much larger. For example, the groups can be regularly spaced across the substrate. Fig.11e In , regular hexagonal spacing is used, but other regular spacings are possible.

[0284] For example, the lower spacing limit can be 1 mm. Connections to all substrates can be established within a distance of 1 mm. If the through holes used are close to each other, the connection is convenient. For example, a single connector can be used. On the other hand, a larger group spacing means that the total number of through holes required is less. This reduces the optical impact of the spacers and reduces the complexity of manufacturing.

[0285] The distance between one group 297 and the next group can be at least the upper limit, and the distance between two through holes in a group 297 can be at most the lower limit. The lower spacing limit is less than the upper spacing limit. For example, the upper spacing limit can be at least 10 times the lower spacing limit.

[0286] Fig.11dand Fig.11e The number of mesh electrodes in may be higher or lower than three. For example, there may be two mesh electrodes, in which case pairs of through holes are distributed across the substrate.

[0287] Fig.11f An example of one embodiment of the substrate 205 is schematically shown. Fig.11f Shown in FIG is the back side of the substrate opposite to the side with the mesh electrode and opposite to the second substrate. Shown are groups of connecting through holes. Fig.11f In the example, the through holes indicated by the small black circles are connected to the mesh electrodes on the substrate shown. In this example, there are three mesh electrodes on the substrate 205, but there may also be two mesh electrodes. Fig.11f , the through holes indicated by the small black crosses are connected to the mesh electrodes on the substrate opposite to the substrate shown through the connecting substrate, as discussed herein. In this example, there are three mesh electrodes on the substrate opposite to the substrate 205, but there may be two mesh electrodes. In this light modulator, there are two substrates, but there may be more substrates.

[0288] Each group has a through hole for each mesh electrode in the light modulator. Within a group, the through holes are close to each other. The distance between groups is much larger. For example, the groups can be regularly spaced across the substrate. Fig.11f In , regular square spacing is used, but other regular spacings are possible.

[0289] A through hole in a group (e.g., Fig.11d , Fig.11e and Fig.11f The connection area on the substrate is formed by connecting the two through-holes (as shown in ). The connection of this connection area makes the distance to the power supply equal, thereby minimizing the potential difference between two points opposite to each other on two continuous main lines of the two mesh electrodes. The distance between the through-holes can be very small, for example within 10cm, 5cm, 1cm, or even smaller. As a result, the potential difference between two relative points on the two main lines can be minimized because the resistance of the relative points is approximately equal, for example within 10%, 5%, 1% or less. If there are connection areas on multiple substrates, they are preferably opposite to each other. The mesh electrode can be powered from multiple connection areas. In addition, in that case, the connection area is preferably small and preferably aligned with the connection area on the opposite substrate. One way to align the connection area is to use a connection spacer.

[0290] Fig.12a One embodiment of a light modulator 10 that may be applied in dynamic glass is schematically shown.

[0291] Reference is made to patent application PCT / EP2020 / 052379, which is incorporated herein by reference; this application comprises advantageous designs for light modulators, which can be further improved, for example, by including mesh electrodes as explained herein.

[0292] The optical modulator 10 can be electrically switched between a transparent state and a non-transparent state and vice versa, or between a reflective state and a non-reflective state and vice versa. The optical modulator 10 comprises a first substrate 11 and a second substrate 12 arranged opposite to each other. At least two electrodes are applied on the inner side of the first substrate 11: electrodes 14a, 14b are shown. These at least two electrodes are collectively referred to as electrodes 13. At least two electrodes are applied on the inner side of the second substrate 12: electrodes 15a, 15b are shown. These at least two electrodes are collectively referred to as electrodes 14.

[0293] Advantageously, according to one embodiment, the electrodes 14a, 14b and electrodes 15a, 15b are mesh electrodes. Fig.12a Two interconnects are shown, although in practice there may be many more.

[0294] Fluid 15 is disposed between the substrates. The fluid includes particles 30 (e.g., nanoparticles and / or microparticles), wherein the particles are charged or can be charged. For example, the particles can inherently carry a charge on their surface. For example, the particles can be surrounded by charged molecules.

[0295] The electrodes are arranged to drive the particles 30 towards or away from the electrodes depending on the applied electric field. The optical properties of the light modulator, in particular transparency or reflectivity, depend on the position of the particles 30 in the fluid. For example, connections may be provided for applying an electromagnetic field to the electrodes.

[0296] The controller 16 is configured to apply an electric potential to the mesh electrodes 13a, 13b, 14a and 14b to obtain an electromagnetic field between the plurality of mesh electrodes. In this way, the electrophoretic movement of particles toward one of the plurality of mesh electrodes is provided, or the electrophoretic movement of particles from one of the plurality of mesh electrodes is provided. This in turn leads to the modulation of the optical properties of the light modulator. The controller may include, for example, a microprocessor or a state machine, and may be configured to generate a waveform for application to the mesh electrode. For example, the controller may include an amplifier, which may be connected to or connected to a power supply for amplifying the waveform. The controller may be implemented as a single integrated device (e.g., a microchip), or may be distributed on a plurality of sub-controllers, such as being implemented as a plurality of microchips. A plurality of sub-controllers may communicate with each other, for example, using wired communication or wireless communication. For example, a sub-controller may be configured to control one of a plurality of substrates, or to control one of a plurality of nets, or to control a section in a light modulator, and so on.

[0297] The controller 16 may be located at a plurality of locations. For example, the controller 16 and / or the sub-controller (if present) may be located outside the light modulator. For example, the controller may be connected to the mesh electrode by a wire (e.g., a cable). The controller 16 may also be fully or partially integrated in the light modulator. For example, the controller may be mounted between two substrates, on glass, or as a printed circuit, etc. For example, each substrate may include a controller for controlling the mesh electrodes on the substrate. The sub-controller may optionally be connected to a main controller located outside the light modulator.

[0298] In one embodiment, except for the electrodes, substrates 11 and 12 can be optically transparent, typically >95% transparent at the relevant wavelength, such as >99% transparent. Taking the electrodes into account, the transparency will be much lower, such as 70%. The term "optical" can refer to wavelengths visible to the human eye (about 380nm to about 750nm) (where applicable), and can refer to a wider range of wavelengths (including infrared (about 750nm to 1pm) and ultraviolet (about 10nm to 380nm) and their sub-options) (where applicable). In an exemplary embodiment of the light modulator, the substrate material is selected from glass and polymer.

[0299] In another embodiment, the substrates (such as the bottom substrate 12) may be reflective or partially reflective, while the top substrate 11 is transparent. The optical properties of the light modulator (particularly the reflectivity) depend on the position of the particles 30 in the fluid. When the panel is in the open state (vertical drive), the particles will mostly be located between the opposing electrodes of the two substrates, so that the incident light can travel relatively unimpeded through the transparent top substrate and the optical layer, and be reflected or partially reflected on the bottom substrate.

[0300] The distance between the first substrate and the second substrate is typically less than 30 μm, such as 15 μm. In an exemplary embodiment of the light modulator, the distance between the first substrate and the second substrate is less than 500 μm, preferably less than 200 μm, preferably less than 100 μm, even more preferably less than 50 μm, such as less than 30 μm.

[0301] In one embodiment, the modulator may be disposed in a flexible polymer and the rest of the device may be disposed in glass. The glass may be rigid glass or flexible glass. A protective layer may be disposed on the substrate if desired. If more than one color is provided, more than one layer of flexible polymer may be provided. The polymer may be polyethylene naphthalate (PEN), polyethylene terephthalate (PET) (optionally with a SiN layer), polyethylene (PE), etc. In another embodiment, the device may be disposed in at least one flexible polymer. In this way, the modulator may be attached to any surface, for example by using an adhesive.

[0302] The particles 30 may be adapted to absorb light, thereby preventing certain wavelengths from traveling through. The particles 30 may reflect light; for example, the reflection may be specular, diffuse, or something in between. The particles may absorb some wavelengths and reflect other wavelengths. The particles may additionally or alternatively emit light, for example using phosphorescence, fluorescence, etc. Even the fluid may emit light, the emissivity of the light being modulated by changing the position of the particles.

[0303] In an exemplary embodiment of the light modulator, the size of the nanoparticles is 20nm to 1000nm, preferably 20nm to 300nm, more preferably less than 200nm. In an exemplary embodiment of the light modulator, the nanoparticles / microparticles may include a pigment coating, and preferably include a core. In an exemplary embodiment of the light modulator, the coating of the particles is made of a material selected from a conductive material and a semiconductive material.

[0304] In an exemplary embodiment of the optical modulator, the particles are suitable for absorbing light with a wavelength of 10nm to 1mm, such as 400nm to 800nm, 700nm to 1μm and 10nm to 400nm, and / or suitable for absorbing a portion of light (filter) in the wavelength range of 10nm to 1mm, and combinations of the above.

[0305] In an exemplary embodiment of the light modulator, the particles are charged or can be charged. For example, the charge on the particles can be 0.1e to 10e (5*10 -7 to 0.1C / m2).

[0306] In an exemplary embodiment of the light modulator, the fluid is present in an amount of 1 g / m2 to 1000 g / m2, preferably 2 g / m2 to 75 g / m2, more preferably 20 g / m2 to 50 g / m2, such as 30 g / m2 to 40 g / m2. A great advantage is that with the arrangement of the invention, less fluid can be used, and also less particles can be used.

[0307] In an exemplary embodiment of the light modulator, the particles are present in an amount of 0.01 g / m2 to 70 g / m2, preferably 0.02 g / m2 to 10 g / m2, such as 0.1 g / m2 to 3 g / m2.

[0308] In an exemplary embodiment of the light modulator, the particles have a color selected from cyan, magenta, and yellow, and selected from black and white, and selected from combinations of the foregoing colors.

[0309] In an exemplary embodiment of the light modulator, the fluid includes one or more of a surfactant, an emulsifier, a polar compound, and a compound capable of forming hydrogen bonds.

[0310] The fluid 15 can be a polar fluid having a dielectric constant less than 15. For example, the dielectric constant can be measured at one frequency. For example, the dielectric constant is less than 15 at a frequency of 1 kHz. Alternatively, the dielectric constant can be measured at a different frequency (e.g., at 60 Hz or above). Note that for each frequency below 10 GHz, the dielectric constant of water is 80. The advantage of a lower dielectric constant (e.g., 15 or less) is that it increases the ability of the liquid to maintain high electric fields without decomposing, while reducing the conductivity of the liquid at low frequencies (particularly at frequencies at which the optical modulator can be operated).

[0311] In an exemplary embodiment of the light modulator, the fluid has a relative permittivity εr smaller than 100, preferably smaller than 10, such as smaller than 5. In an exemplary embodiment of the light modulator, the fluid 15 has a dynamic viscosity higher than 10 mPa.s.

[0312] Electrodes 14a, 14b and electrodes 15a, 15b are in fluid contact with the fluid. The fluid may be in contact with the electrodes directly or indirectly, for example, the fluid may be in contact with the electrodes such as through a porous layer. In one embodiment, the electrodes cover about 1% to 30% of the substrate surface. In one embodiment, the electrodes include a conductive material with a resistivity of less than 100 nΩm (at 273K; for comparison, the typically used ITO has 105 nΩm), which is similar to a conductivity of >1*10 at 20°C. 7 S / m. In one embodiment of the light modulator, the electrodes include copper, silver, gold, aluminum, graphene, titanium, indium and combinations thereof, preferably copper. The electrodes may be embedded in the polymer substrate in the form of microwires; for example, copper microwires.

[0313] A connection portion is used to apply an electromagnetic field to an electrode, wherein the electromagnetic field applied to the electrode causes nanoparticles and microparticles to move from a first electrode to a second electrode, and from the second electrode to the first electrode. A connection portion for applying an electromagnetic field to an electrode may be provided. For example, in an exemplary embodiment of the optical modulator, the current is between -100μA and +100μA, preferably between -30μA and +30μA, and more preferably between -25μA and +25μA. For example, a power supply may be electrically connected to at least two electrodes. The power supply may be adapted to provide waveform power. At least one of the amplitude, frequency, and phase may be adapted to provide different states in the optical modulator. For example, multiple aspects of the power supply may be adapted by a controller.

[0314] The light modulator 10 may comprise one or more segments, a segment being a single optically switchable entity, the size of which may be varied.The substrate at least partially encloses a volume (which may be a segment).

[0315] The device may comprise a drive circuit which changes the appearance of the (individual) segments by applying an electromagnetic field. Thus, the appearance of the light modulator and one or more parts thereof may also be changed. For example, the segments may have a size of at least 1 mm. 2 The present design allows stacking to allow for more colors; for example, for full color applications, a stack of two or three modulators can provide most or all colors, respectively.

[0316] Having one or more segments allows the light modulator to be controlled locally; this is advantageous for some applications, but it is not necessary. For smart glass, the light modulator can be used with or without segments. For example, when applied to smart glass, transparency or reflectivity can be controlled locally, such as blocking sun spots without reducing the transparency or reflectivity of the entire window. The segments can be relatively large, such as having a diameter of at least 1 mm or at least 1 cm, etc.

[0317] In an exemplary embodiment of the light modulator, the substrates (11, 12) are aligned, and / or the electrodes (13, 14) are aligned. For example, the electrodes 14a, 14b and the electrodes 15a, 15b can be aligned relative to each other. In the aligned substrates, the electrodes on different substrates are behind each other when viewed from a direction orthogonal to the substrates. When the light modulator is disassembled and both substrates are arranged with the electrodes facing upward, the electrode patterns are mirror images of each other.

[0318] Aligning the substrates may increase the maximum transparency or maximum reflectivity of the light modulator, on the other hand, when the light modulator is selected for more criteria than a transparency range or a reflectivity range, it may be better to not align or not fully align the two substrates. The light modulators may be stacked. For example, two stacked light modulators may be made of three substrates, wherein the middle substrate has electrodes on both of its surfaces. In one embodiment of the light modulator, optionally at least one substrate 11, 12 of the first light modulator is the same as the substrate 11, 12 of at least one second light modulator. Likewise, for stacked modulators, alignment may increase the maximum transparency or maximum reflectivity, but may be detrimental to other considerations (e.g., diffraction).

[0319] Figure 12b An example of an embodiment of an optical modulator 40 is schematically shown. The optical modulator 40 is similar to the optical modulator 10, except that it includes multiple optical layers; in the example shown, two optical layers. There may also be more than two optical layers. Each optical layer is arranged between two substrates. The optical modulator 40 may be viewed as Fig.12a As shown, light modulator 40 includes three substrates: a first substrate 41, a second substrate 42, and a third substrate 43. Between substrates 41 and 42 is an optical layer, and between substrates 42 and 43 is an optical layer. The optical layer can be similar to the optical layer in light modulator 10. Controller 46 can be similar to controller 16. For example, controller 46 can be configured to control the potential and / or current on the electrodes of the substrates. For example, in Figure 12b In the embodiment, the controller 46 can be electrically connected to at least (4 times 2 equals) 8 electrodes. Similar to the controller 16, the controller 46 can also be embodied as a plurality of sub-controllers.

[0320] Interestingly, the particles in multiple optical layers can be different, so that multiple layers can be used to control more optical properties of the light modulator. For example, particles in different optical layers can absorb or reflect different wavelengths, for example, can have different colors. This can be used to create different colors and / or different color intensities on the panel via the controller 46. For example, a four-substrate panel can have three optical layers, each with a different color particle, such as cyan, yellow, and magenta. By controlling the transparency or reflectivity of different colors, a wide color spectrum can be created.

[0321] The surface of one substrate facing the other substrate may be provided with two or more patterns, such as in one embodiment. For example, the outer substrates 41 and 43 may receive electrodes only on the inner side, while the inner substrate (eg, substrate 42) may have electrodes on both sides.

[0322] Substrate 41 and substrate 42 may be collectively considered as one embodiment of a light modulator. Likewise, substrate 42 and substrate 43 may be collectively considered as one embodiment of a light modulator.

[0323] Fig.12c An example of an embodiment of a car 20 with a dynamic glass window 21 is schematically shown. This is a particularly advantageous embodiment because the level of incident light can change frequently and rapidly during driving. Using dynamic glass in a car has the advantage that the light level can be maintained at a constant level by adjusting the transparency of the window. In addition, the reduced diffraction effect increases safety because it reduces driver distraction. The car 20 may include a controller configured to control the transparency or reflectivity of the window 21.

[0324] Dynamic glass can also be used in other glass applications, especially where the amount of incident light is variable, such as buildings, offices, houses, greenhouses, skylights. Skylights are windows placed in the ceiling to allow sunlight to enter a room.

[0325] Figure 13a to Figure 13b A side view of an embodiment of a light modulator in use is schematically shown. Applying an electric field to electrodes on a substrate causes electric forces on the particles. Using this effect, the particles can be moved back and forth so that different transparency or reflectivity states can be generated in the light modulator. The controller can control the electric field, such as its amplitude, frequency and phase. In one embodiment, the controller is connected to at least four electrodes: two for each substrate. However, more electrodes can be used and connected to the controller; for example, more than two electrodes can be used for the substrate to better fine-tune the grayscale and drive to a non-transparent state or a non-reflective state. Multiple electrodes can also be used to support multiple sections on a substrate.

[0326] Fig.13a The light modulator is shown without an applied electric field. Fig.13a In the present invention, no electric force is applied to the particles 30 suspended in the fluid 15.

[0327] exist Fig.13a In the configuration shown, the conductive electrode pattern arranged on the top substrate is completely or substantially aligned with the conductive electrode pattern on the bottom substrate. The conductive electrode pattern may be deposited on a transparent or (partially) reflective glass substrate, or may be embedded in a plastic substrate, etc.

[0328] The alignment between the top electrode pattern and the bottom electrode pattern helps to achieve a wider range of transparency levels or reflectivity levels. However, alignment is not required because similar effects can be obtained without alignment. In the case of misalignment, a range of transparency or reflectivity is also obtained.

[0329] Note that in these embodiments, references to top and bottom substrates refer to the substrates that are higher or lower on the page. The same substrates may also be referred to as front and back substrates, for example, because in glass applications, the substrates are aligned vertically, not horizontally.

[0330] Fig.13b An optical modulator is shown, where a potential +V1 is applied to each micro-wire electrode on the top substrate, as in Example P1, and a negative voltage such as -V1 is applied to each micro-wire electrode on the bottom substrate. Fig.13b , indicated by the first '+' or the first '-' drawn in the electrode. Thus, in this case, the same positive potential is applied to all electrodes 13, and the same negative potential is applied to electrode 14. The difference in potential causes the negatively charged particles to flow to the vicinity of the electrode of the top substrate, where the particles will be substantially aligned with the top electrode. As a result, if both the top substrate and the bottom substrate are transparent, the reflectivity of the light modulator 10 increases. Similarly, if, for example, the top substrate is transparent and the bottom is substantially reflective, the reflectivity of the light modulator 10 will increase. If the solution contains positively charged particles, they will flow to the vicinity of the electrode of the bottom substrate, where those particles will be substantially aligned with the bottom electrode.

[0331] When in the second instance P2 of the on state, the voltages of the top and bottom electrodes are reversed relative to the instance of P1, and similar transparency or reflectivity can be achieved. In instance P2, the voltage of each electrode of the top substrate is now provided with a negative potential -V1, while the voltage of the alignment electrode of the bottom substrate is provided with a positive potential. This Fig.13b This is indicated by a second '+' or a second '-' drawn in the electrode. This state is similar to Fig.13b , but the top substrate and the bottom substrate are reversed. Also, in this configuration, the transparency or reflectivity of the light modulator 10 is high.

[0332] Interestingly, by using electrodes at the top substrate (e.g. Fig.13b The positive potential of the electrode 13 (shown in FIG. 1 ) (and the negative potential on the electrode 14) is related to the electrode at the bottom substrate (e.g., Fig.13b By switching between positive potentials of electrodes 14 shown in FIG. 14 ), transparency or reflectivity can be maintained while reducing corrosion damage to the electrodes. Such an alternating electric field can be achieved by applying an alternating potential to the top and bottom electrodes. The alternating electric field is indicated in FIG. 12 by the '+ / -' or '- / +' drawn in the electrodes, showing how the potential on the electrodes alternates between different voltages. The alternating potential on the electrodes can be obtained, for example, from an alternating current (AC).

[0333] Applying a waveform is optional, but it is a useful measure to increase the life of the optical modulator by reducing corrosion. When copper electrodes are used, for example, corrosion may form because copper ions dissolve in the ionic fluid at one substrate and flow to the electrode on the opposite substrate and deposit there. By applying a waveform, the direction of copper ion transport is frequently reversed, thereby reducing corrosion damage. Between two instances P1 and P2, the corrosion current between the two substrates is balanced or substantially (e.g., >95%) balanced, for example, as the corrosion rate of the electrode of the top substrate occurs, between each instance time P1, there is a balanced copper deposition on the bottom electrode, and vice versa in instance P2. Therefore, particles are continuously converted or migrated between the top electrode and the bottom electrode, and the optical modulator or smart window is always in the on state, and the dynamic electrolysis current between the top electrode and the bottom electrode is constant, so there is no net loss or a negligible net loss of electrode material on the top substrate and the bottom substrate.

[0334] Fig.13c shows how a reduced transparency state or reflectivity state can be obtained. An alternating voltage is applied to the same substrate. For example, in one embodiment, a potential of +V2 is applied to the first electrode, and the next adjacent electrode has an opposite potential of -V2, etc. Fig.13c This is shown in Fig.13c This is indicated by the first '+' or the first '-' drawn in the electrode. This can be obtained by applying a potential +V2 to electrode 14a and an opposite potential -V2 to electrode 14b. On the opposite substrate, a potential +V2 may be applied to electrode 15a and an opposite potential -V2 to electrode 15b. For example, the electrodes may be arranged so that the electrodes on the substrates are aligned; an electrode on the top substrate has an opposite electrode to that on the bottom substrate, and vice versa. Similar transparency or reflectivity can be achieved when, in the second example, the voltage of the top electrode and the voltage of the bottom electrode are reversed. This is in Fig.13c Indicated by a second '+' or a second '-' drawn in the electrode. Figure 2c In the embodiment, the potential on the electrodes may alternate between positive and negative, as indicated by '+ / -' and '- / +' indicated on the electrodes.

[0335] For example, to reduce transparency or reflectivity, opposing electrodes may receive the same potential, while adjacent electrodes receive opposing potentials. Fig.13c An embodiment is shown in which four electrodes are indicated by reference numerals 14a, 14b, 15a and 15b, and the remaining electrodes continue to alternate.

[0336] By using this AC drive cycle between the top and bottom substrates, diagonal and lateral electric fields are generated between the two substrates to cause a random diffusion of particles, thereby producing an off state of the light modulator. As a result of this configuration, the particles migrate diagonally and laterally between the top and bottom substrates, and the diffusion of particles into the visible aperture of the light modulator contributes to the off, non-transparent state of the light modulator.

[0337] against Fig.13b In the transparent state shown in FIG, a waveform may be applied to the electrodes such that Fig.13b The electrode shown with a positive potential becomes a negative potential, and vice versa. Fig.13b In the embodiment, applying, for example, a waveform between electrodes 14a and 14b and between electrodes 15a and 15b can reduce corrosion damage to the electrodes.

[0338] By using the combination of Figure 5, Figures 6a to 6d An AC drive cycle can be implemented in an interdigitated line configuration of the top electrode and bottom electrode configuration shown in the plan view of FIG.

[0339] Fig.13b and Fig.13c The degree of increase or decrease in transparency or reflectivity in the image depends on the voltage difference and the frequency difference. By changing the voltage difference, the amount of increase or decrease in transparency or reflectivity can be controlled, respectively. For example, a curve representing transparency relative to voltage can be determined (e.g., measured). In order to obtain a specific transmittance level (e.g., a specific transparency, such as a specific grayscale level), a corresponding voltage (e.g., an AC voltage) can be applied. By inserting a transparent state signal or a non-transparent state signal, a level between transparency and non-transparency can be obtained. Similarly, a curve representing light reflection relative to voltage can be determined (e.g., measured). In order to obtain a specific reflectivity level, a corresponding voltage (e.g., an AC voltage) can be applied. By inserting a reflective state signal or a non-reflective state signal, a level between reflection and non-reflection can be obtained.

[0340] Fig.14a An example of an embodiment of a method 1310 of manufacturing a substrate is schematically shown. The substrate is used in a light modulator, such as in a dynamic glass. The method 1310 includes:

[0341] - providing (1311) a substrate,

[0342] - applying (1312) a first mesh electrode of a plurality of mesh electrodes on the substrate,

[0343] - applying (1313) a second mesh electrode of the plurality of mesh electrodes, the second mesh electrode being interlaced with the first mesh electrode, and

[0344] - creating (1314) a plurality of intersection points across the substrate at locations where a first mesh electrode and a second mesh electrode of the plurality of mesh electrodes intersect on the substrate.

[0345] A plurality of staggered mesh electrodes extend across the substrate in a two-dimensional pattern. A plurality of intersections may be created during application of the mesh electrodes. At the intersections, a dielectric or other current control component may be applied to control the current flowing between the first mesh electrode and the second mesh electrode.

[0346] Although in some embodiments, the mesh electrode is applied without interruption. However, the mesh electrode need not be applied all at once; the mesh electrode can be applied in parts. For example, the mesh electrode can be constructed from multiple main lines and interconnects. For example, Fig.14b An embodiment of a mesh electrode constructed from main lines and interconnecting lines is shown. Method 1320 includes:

[0347] - applying (1321) a plurality of main lines of a plurality of mesh electrodes to a substrate, the plurality of main lines of the plurality of electrodes being arranged alternately relative to each other on the substrate,

[0348] - Applying (1322) a plurality of interconnecting lines electrically connected to a plurality of main lines on a substrate, wherein electrodes of the plurality of electrodes include a plurality of interconnecting parts electrically connecting the main lines of the mesh electrode together, wherein the plurality of main lines of the electrode are connected to other main lines via the plurality of interconnecting parts.

[0349] The mesh electrodes and / or main lines and / or interconnecting lines and / or current control components may be applied by patterning.Direct printing may also be used, in particular for interconnecting lines and current control components such as dielectrics.

[0350] According to one embodiment, the light modulator can be manufactured from two or more substrates. For example, Fig.14c An embodiment is shown in which a light modulator is constructed from a substrate according to an embodiment. Method 1330 includes:

[0351] - providing (1331) a first substrate and a second substrate facing each other, the plurality of staggered mesh electrodes extending across the first substrate and across the second substrate in a two-dimensional pattern, two mesh electrodes of the plurality of mesh electrodes on the substrates crossing at a plurality of intersection points throughout the substrates,

[0352] - arranging (1332) an optical layer between the first substrate and the second substrate, the optical layer comprising a fluid containing particles, wherein the particles are charged or capable of being charged,

[0353] - cutting (1333) a shape from the assembled first substrate, second substrate and optical layer, and

[0354] - Close (1334) the edges of the cut shape.

[0355] The cutting shape is optional. For example, the light modulator can be directly manufactured into the desired shape. However, cutting enables the light modulator to be constructed according to a default configuration, after which its shape can be modified. After or during cutting the light modulator, its edges can be closed, thereby retaining the fluid in the optical layer.

[0356] The light modulator using the substrate according to one embodiment is advantageously used in dynamic glass. For example, Fig.14d An embodiment is shown in which dynamic glass is manipulated to produce dynamic optical properties. Method 1340 includes:

[0357] - providing (1341) a light modulator according to an embodiment, and

[0358] - selecting (1342) an alternating current or an alternating voltage and applying said alternating current or voltage to the electrodes to obtain an electromagnetic field between the electrodes, thereby providing electrophoretic movement of the particles towards or from the electrodes, resulting in modulation of the optical properties of the light modulator.

[0359] For example, a controller may be connected to a plurality of mesh electrodes on a substrate. The controller may be configured to select an AC current or AC voltage based on user input (e.g., input indicating a desired optical property (e.g., desired transparency)), a program indicating a desired optical property such as a time of day, a sensor input (e.g., a sensor in a light modulator, such as a sensor for incident light, ambient light (e.g., incident sunlight, such as indoor ambient light, etc.), such as a sensor for current on a mesh electrode). For example, a software program executed by the controller may select (e.g., look up or calculate) an appropriate drive signal to drive the light modulator to approach a new state and / or maintain a current state. The selected drive signal may be applied by a current controller or a voltage controller, etc.

[0360] Many different ways of performing the method are possible, as will be apparent to those skilled in the art. For example, the order of steps may be performed in the order shown, but the order of steps may be changed, or some steps may be performed in parallel. In addition, other method steps may be inserted between steps. The inserted steps may represent improvements to the method such as described herein, or may be unrelated to the method. For example, some steps may be performed at least partially in parallel. In addition, a given step may not be fully completed before starting the next step.

[0361] The electrodes may be driven using a signal having a selected maximum amplitude corresponding to one of a plurality of transparency levels or reflectivity levels in the light modulator. The signal may be an alternating current or an alternating voltage.

[0362] The embodiment of the method can be performed using software, and the software includes instructions, and the instructions are used to cause the processor system to perform a driving method such as method 1340. The software may only include those steps taken by a specific sub-entity of the system. The software can be stored in a suitable storage medium (such as, a hard disk, a floppy disk, a memory, an optical disk, etc.). The software can be sent as a signal wired or wirelessly or using a data network (for example, the Internet). The software can be downloaded and / or used remotely on a server. The embodiment of the method can be performed using a bit stream, and the bit stream is arranged to configure a programmable logic (for example, a field programmable gate array (FPGA)) to perform the method.

[0363] It will be understood that the subject matter of the present disclosure also extends to a computer program suitable for implementing the subject matter of the present disclosure, particularly a computer program on or in a carrier. The program can be in the form of source code, object code, code intermediate source, and object code such as partial compilation, or any other form suitable for implementing an embodiment of the method. An embodiment related to a computer program product includes computer executable instructions corresponding to each processing step of at least one method described. These instructions can be subdivided into subroutines and / or stored in one or more files, which can be linked statically or dynamically. Another embodiment related to a computer program product includes computer executable instructions corresponding to at least one of each device, unit, and / or component in the system and / or product described.

[0364] Fig.15a A computer readable medium 1000 and 1001 having a writable portion 1010 is shown, the writable portion 1010 including a computer program 1020 including instructions for causing a processor system to perform a light modulator method according to one embodiment. For example, the processor system may be connected to a light modulator. The computer program 1020 may be included on the computer readable medium 1000 as a physical mark or by magnetization of the computer readable medium 1000. However, any other suitable embodiments may also be envisioned. In addition, it will be understood that although the computer readable medium 1000 is shown as an optical disk, the computer readable medium 1000 may be any suitable computer readable medium, such as a hard disk, solid state memory, flash memory, etc., and may be non-recordable or recordable. For example, the computer readable medium may be an electronic memory such as an electronic memory device, such as an electronic memory card as shown at 1001. The computer program 1020 includes instructions for causing a processor system to perform the light modulator method.

[0365] Fig.15b A processor system 1140 for a controller of an optical modulator is schematically shown according to one embodiment. The processor system includes one or more integrated circuits 1110. Fig.15b The architecture of one or more integrated circuits 1110 is schematically shown in FIG. The circuit 1110 includes a processing unit 1120 (e.g., a CPU) for running a computer program component to execute a method according to an embodiment and / or a module or unit implementing it. The circuit 1110 includes a memory 1122 for storing programming codes, data, etc. A portion of the memory 1122 may be read-only. The circuit 1110 may include a communication element 1126, such as an antenna, a connector, or both or the like. The circuit 1110 may include an application specific integrated circuit 1124 for performing some or all of the processing defined in the method. The processor 1120, the memory 1122, the application specific integrated circuit 1124, and the communication element 1126 may be connected to each other via an interconnect 1130 (e.g., a bus). The processor system 1110 may be arranged for contact communication and / or contactless communication, using an antenna and / or a connector, respectively.

[0366] For example, in one embodiment, the processor system 1140, for example, a device may include a processor circuit and a memory circuit, and the processor is arranged to execute software stored in the memory circuit. For example, the processor circuit may be an Intel Core i7 processor, an ARM Cortex-R8, etc. In one embodiment, the processor circuit may be an ARM Cortex M0. The memory circuit may be a ROM circuit, or a non-volatile memory such as a flash memory. The memory circuit may be a volatile memory such as an SRAM memory. In the latter case, the device may include a non-volatile software interface (e.g., a hard disk, a network interface, etc.), which is arranged to provide software.

[0367] A controller for the light modulator (eg, controlling the voltage applied to the electrodes) may include a processor circuit, but may also or instead include a state machine.

[0368] The following numbered clauses include contemplated and non-limiting embodiments:

[0369] 1. Dynamic glass, the dynamic glass comprising a light modulator, the light modulator comprising:

[0370] a first substrate and a second substrate, the first substrate and the second substrate facing each other, a plurality of staggered mesh electrodes extending across the first substrate and across the second substrate in a two-dimensional pattern, two mesh electrodes of the plurality of mesh electrodes on the substrates crossing at a plurality of intersections throughout the substrates,

[0371] - an optical layer, said optical layer being located between said first substrate and said second substrate, said optical layer comprising a fluid containing particles, wherein said particles are charged or capable of being charged;

[0372] - A controller configured to apply an electric potential to the plurality of mesh electrodes to obtain an electromagnetic field between the plurality of mesh electrodes, thereby providing the particles with electrophoretic movement toward or from one of the plurality of mesh electrodes, resulting in modulation of the optical properties of the light modulator.

[0373] 2. The dynamic glass according to clause 1, wherein the controller is electrically connected from the connection area on the substrate to a plurality of mesh electrodes on one or more substrates, thereby minimizing the potential difference between the plurality of mesh electrodes.

[0374] 3. The dynamic glass according to any of the preceding clauses, wherein each of the at least two mesh electrodes on the substrate comprises a plurality of main lines extending across the substrate in a first direction, the plurality of main lines of the at least two mesh electrodes being arranged alternately relative to each other on the substrate, each of the at least two mesh electrodes comprising:

[0375] - a plurality of interconnection lines electrically connecting the main lines of the mesh electrode together, the plurality of main lines of the mesh electrode being connected to another main line of the mesh electrode through a plurality of interconnections, the interconnection lines crossing another mesh electrode to form a cross point.

[0376] 4. The dynamic glass according to clause 3, wherein:

[0377] - a number of the main lines in the electrodes comprise at least two interconnected lines, wherein the number is at least 2, at least 10, at least half of the number of the main lines, at least 90% of the main lines, or substantially all of the main lines, and / or

[0378] - the main line is connected to at least 2, at least 4, at least 8 or at least 16 interconnecting lines, and / or

[0379] - The main line is connected to the interconnection within a distance from the edge of the substrate which is less than 10% of the length of the main line.

[0380] 5. The dynamic glass according to any of the preceding clauses, wherein the plurality of intersections are randomly distributed across the substrate.

[0381] 6. The dynamic glass according to any one of clauses 3 to 5, wherein one or more of the main lines and / or interconnecting lines are straight, or wavy.

[0382] 7. The dynamic glass according to any of the preceding clauses, wherein the two-dimensional pattern of mesh electrodes across the substrate comprises any of regular triangular tilings, square tilings or hexagonal tilings.

[0383] 8. The dynamic glass according to any of the preceding clauses, wherein the substrate is cut into a non-rectangular shape.

[0384] 9. The dynamic glass according to any of the preceding clauses, wherein the substrate comprises current control components located at the intersections, wherein:

[0385] - the current control means comprises a dielectric at the intersection, so that two crossed mesh electrodes on the substrate are electrically insulated from each other at the intersection, or

[0386] The current control component is configured to enable current to flow between the first mesh electrode and the second mesh electrode on the substrate at the intersection for a high threshold of positive voltage and negative voltage, and otherwise block current flow between the first mesh electrode and the second mesh electrode.

[0387] 10. The dynamic glass according to any one of the preceding clauses, comprising a current control component located between a first mesh electrode on a first substrate and a second mesh electrode on a second substrate, the current control component controlling the current between the first mesh electrode and the second mesh electrode.

[0388] 11. The dynamic glass according to clause 10, wherein the current control component

[0389] - a spacer, which separates the first substrate and the second substrate from each other, and / or

[0390] -Located on top of the intersection.

[0391] 12. The dynamic glass according to any one of the preceding clauses, wherein

[0392] - at least three mesh electrodes are applied to at least one of the first and second substrates, or

[0393] - At least three mesh electrodes are applied to both the first substrate and the second substrate.

[0394] 13. Dynamic glass according to any of the preceding clauses, wherein the mesh electrode on the first substrate and / or the second substrate is arranged on a first side of the substrate and includes a plurality of through holes connecting the mesh electrode to a second side of the substrate, and the through holes can be connected to the controller.

[0395] 14. A dynamic glass according to claim 13, wherein the through holes are arranged across the substrate in multiple groups of through holes, each mesh electrode on the substrate is connected to a through hole in a group of through holes, the distance between the through holes in a group of through holes is at most the lower spacing limit, and the distance between the through holes in the group is at least the upper spacing limit.

[0396] 15. The dynamic glass according to any of the preceding clauses, wherein one or more mesh electrodes on the first substrate are connected to connection points on the second substrate through conductive spacers, and from the connection points to the controller.

[0397] 16. The dynamic glass according to any of the preceding clauses, having a transparent state and a non-transparent state, or having a reflective state and a non-reflective state, the light modulator being configured to:

[0398] - switching to a non-transparent state or switching to a non-reflective state by establishing an alternating voltage on at least one of the first substrate and the second substrate, applying an alternating current between at least the first mesh electrode and the second mesh electrode on the first substrate and / or applying an alternating current between the first mesh electrode and the second mesh electrode on the second substrate;

[0399] -Switching to a transparent state or switching to a reflective state by establishing an AC voltage between the first substrate and the second substrate, applying an AC current between a first mesh electrode on the first substrate and a first mesh electrode on the second substrate, and / or applying an AC current between a second mesh electrode on the first substrate and a second mesh electrode on the second substrate.

[0400] 17. An optical modulator, comprising:

[0401] a first substrate and a second substrate, the first substrate and the second substrate facing each other, a plurality of staggered mesh electrodes extending across the first substrate and across the second substrate in a two-dimensional pattern, two mesh electrodes of the plurality of mesh electrodes on the substrates crossing at a plurality of intersections throughout the substrates,

[0402] - an optical layer, said optical layer being located between said first substrate and said second substrate, said optical layer comprising a fluid containing particles, wherein said particles are charged or capable of being charged;

[0403] - A controller configured to apply an electric potential to the plurality of mesh electrodes to obtain an electric field between the plurality of mesh electrodes, thereby providing the particles with electrophoretic movement toward or from one of the plurality of mesh electrodes, resulting in modulation of the optical properties of the light modulator.

[0404] 18. A substrate for use in an optical modulator, wherein a plurality of interlaced mesh electrodes extend across the substrate in a two-dimensional pattern, two mesh electrodes among the plurality of mesh electrodes on the substrate intersect at a plurality of intersection points throughout the substrate, and the plurality of mesh electrodes are configured to apply an electric potential to the plurality of mesh electrodes to obtain an electromagnetic field between the plurality of mesh electrodes, thereby providing electrophoretic motion for particles.

[0405] 19. A method of manufacturing a substrate for use in an optical modulator,

[0406] - providing a substrate and applying a plurality of staggered mesh electrodes on the substrate, the plurality of staggered mesh electrodes extending across the substrate in a two-dimensional pattern, two mesh electrodes of the plurality of mesh electrodes on the substrate crossing at a plurality of intersection points throughout the substrate.

[0407] 20. The method for manufacturing a substrate according to clause 19,

[0408] - the plurality of mesh electrodes each comprises a plurality of main lines, the method comprising applying the plurality of main lines of the plurality of mesh electrodes to the substrate, the plurality of main lines of the plurality of electrodes being arranged alternately relative to each other on the substrate,

[0409] - applying a plurality of interconnection lines electrically connected to the plurality of main lines on the substrate, the mesh electrode among the plurality of electrodes comprising a plurality of interconnection parts electrically connecting the main lines of the mesh electrode together, wherein the plurality of main lines of the electrode are connected to other main lines through the plurality of interconnection parts.

[0410] 21. A method for manufacturing a substrate according to clause 20, comprising:

[0411] - patterning a plurality of conductive interconnects on the substrate and coating the substrate with a dielectric before applying the plurality of main lines, and

[0412] - connecting the plurality of conductive main lines of the mesh electrode to the conductive interconnects.

[0413] 22. A method for manufacturing a substrate according to clause 20, comprising:

[0414] - applying current control means on said plurality of conductive main lines,

[0415] - applying a plurality of interconnecting lines on top of the current control component, connecting the plurality of conductive main lines into a plurality of interlaced mesh electrodes on the substrate.

[0416] 23. A method for manufacturing a substrate according to clause 19, comprising:

[0417] - applying a first mesh electrode on said substrate,

[0418] - applying a current control means to said first mesh electrode,

[0419] - applying a second mesh electrode on the substrate, the second mesh electrode being insulated from the first mesh electrode by galvanic means.

[0420] 24. A method for manufacturing a substrate according to clause 19, comprising:

[0421] - coating the substrate with a first conductive layer and patterning the first conductive layer to form interconnects,

[0422] - coating the substrate by dielectric deposition and patterning to form isolation blocks on top of the interconnects,

[0423] - coating the substrate with a second conductive layer, and

[0424] - patterning the first conductive layer and the second conductive layer to form a plurality of mesh electrodes.

[0425] 25. A method of manufacturing a substrate according to clause 19, the substrate being used in a light modulator, the method comprising

[0426] - Cutting a shape from the substrate.

[0427] 26. A method of manufacturing an optical modulator, comprising:

[0428] -supply:

[0429] a first substrate and a second substrate, the first substrate and the second substrate facing each other, a plurality of staggered mesh electrodes extending across the first substrate and across the second substrate in a two-dimensional pattern, two mesh electrodes of the plurality of mesh electrodes on the substrates crossing at a plurality of intersections throughout the substrates,

[0430] an optical layer, the optical layer being located between the first and second substrates, the optical layer comprising a fluid containing particles, wherein the particles are charged or capable of being charged, and

[0431] - cutting a shape from the assembled first substrate, second substrate and optical layer, and

[0432] - Close the edges of the cut shape.

[0433] 27. A method of manufacturing a light modulator according to any one of clauses 19 to 26, comprising:

[0434] - Providing electrical connectors for the two mesh electrodes on the substrate at the connection area.

[0435] 28. A method of manufacturing a light modulator according to clause 25 or 26, wherein cutting a shape comprises cutting a hole in the component.

[0436] 29. Dynamic glass methods, including:

[0437] -Provide an optical modulator, comprising:

[0438] - a first substrate and a second substrate, the first substrate and the second substrate facing each other, a plurality of staggered mesh electrodes extending across the first substrate and across the second substrate in a two-dimensional pattern, two mesh electrodes of the plurality of mesh electrodes on the substrates crossing at a plurality of intersections throughout the substrates,

[0439] - an optical layer, said optical layer being located between said first substrate and said second substrate, said optical layer comprising a fluid containing particles, wherein said particles are charged or capable of being charged;

[0440] - a controller configured to apply an electric potential to the plurality of mesh electrodes to obtain an electric field between the plurality of mesh electrodes, thereby providing the particles with electrophoretic movement toward or from one of the plurality of mesh electrodes, resulting in modulation of an optical property of the light modulator;

[0441] - An alternating current or an alternating voltage is selected and applied to the electrodes to obtain an electromagnetic field between the electrodes, thereby providing the particles with electrophoretic motion towards or from the electrodes, resulting in modulation of the optical properties of the light modulator.

[0442] 30. A transitory or non-transitory computer-readable medium comprising data representing instructions which, when executed by a processor system, cause the processor system to perform the method according to clause 29.

[0443] It should be noted that the above-mentioned embodiments illustrate rather than limit the disclosed subject matter, and that those skilled in the art will be able to design many alternative embodiments.

[0444] In the claims, any reference numerals placed in brackets shall not be interpreted as limiting the claims. The use of the verb "comprise" and its variants does not exclude the presence of elements or steps other than those stated in the claims. The article "a" or "an" in front of an element does not exclude the presence of multiple such elements. When an expression such as "at least one" is placed before a list of elements, it means selecting all elements or any subset thereof from the list. For example, the expression "at least one of A, B, and C" should be understood to include only A, only B, only C, both A and B, both A and C, both B and C, or all of A, B, and C. The subject matter of the present disclosure can be implemented by hardware including several different elements, and by a suitably programmed computer. In a device claim that lists several parts, several of these parts can be implemented by the same hardware item. The mere fact that certain measures are recorded in mutually different dependent claims does not indicate that the combination of these measures cannot be used to exert advantages.

[0445] In the claims, the signs in parentheses refer to the reference symbols in the drawings of the exemplary embodiments or the formula of the embodiments, thereby improving the intelligibility of the claims. These signs should not be interpreted as limiting the claims.

Claims

1. A substrate (200), used in an electrophoretic light modulator, comprising: - a plurality of staggered mesh electrodes (210, 230), the plurality of staggered mesh electrodes (210, 230) extending across the substrate in a two-dimensional pattern, at least two of the plurality of mesh electrodes on the substrate intersecting at a plurality of intersection points (251) throughout the substrate, wherein the at least two mesh electrodes on the substrate each comprise a plurality of main lines extending across the substrate in a first direction, the plurality of main lines of the at least two mesh electrodes being arranged alternately relative to each other on the substrate, each of the at least two mesh electrodes comprising: - A plurality of interconnecting lines (221-223), wherein the plurality of interconnecting lines electrically connect the plurality of main lines of the mesh electrode together, the plurality of main lines of the mesh electrode are connected through the plurality of interconnecting lines, the plurality of interconnecting lines of the mesh electrode intersect with another mesh electrode on the substrate to form a plurality of intersections, and the plurality of mesh electrodes are configured to apply an electric potential to the plurality of mesh electrodes to obtain an electric field between the plurality of mesh electrodes, thereby providing electrophoretic movement of particles.

2. An electrophoretic light modulator, comprising: - a first substrate and a second substrate, the first substrate and the second substrate being the substrates according to claim 1, the first substrate and the second substrate facing each other, - an optical layer, located between the first substrate and the second substrate, the optical layer comprising a fluid containing particles, wherein the particles are charged or capable of being charged; - A controller configured to apply an electric potential to the plurality of mesh electrodes to obtain an electric field between the plurality of mesh electrodes, thereby providing electrophoretic movement of the particles toward one of the plurality of mesh electrodes or providing electrophoretic movement of the particles from one of the plurality of mesh electrodes, resulting in modulation of the optical properties of the electrophoretic light modulator.

3. An electrophoretic optical modulator according to claim 2, wherein the controller is electrically connected from a connection area on the substrate to a plurality of mesh electrodes on one or more of the first substrate and the second substrate, thereby minimizing the potential difference between the plurality of mesh electrodes.

4. The electrophoretic light modulator according to claim 2, wherein: - at least two of the plurality of main lines include at least two of the plurality of interconnecting lines, and / or - one of the plurality of main lines is connected to at least 2 interconnecting lines, and / or - one of the plurality of main lines is connected to the interconnection line within a distance from the edge of the corresponding substrate, the distance being less than 10% of the length of the main line.

5. The electrophoretic light modulator of claim 2, wherein the plurality of cross-points are randomly distributed across the first substrate and / or the second substrate. 6 . The electrophoretic light modulator according to claim 2 , wherein one or more of the plurality of main lines and / or the plurality of interconnection lines are straight or wavy.

7. The electrophoretic light modulator of claim 2, wherein the two-dimensional pattern of a mesh electrode among the plurality of mesh electrodes across the first substrate and / or the second substrate comprises regular triangular tiling, square tiling or hexagonal tiling.

8. The electrophoretic light modulator of claim 2, wherein the first substrate and the second substrate are cut into non-rectangular shapes.

9. The electrophoretic light modulator of claim 2, wherein the first substrate and / or the second substrate comprises a current control component located at one of the plurality of intersections, wherein: - the current control means comprises a dielectric at the intersection, so that at least two mesh electrodes on the corresponding substrate are electrically insulated from each other at the intersection, or The current control component is configured to enable current to flow between at least two mesh electrodes on the corresponding substrate at the intersection for a high threshold of positive voltage and negative voltage, and otherwise block current flow between the at least two mesh electrodes.

10. The electrophoretic optical modulator according to claim 2 comprises a current control component between a first mesh electrode of the at least two mesh electrodes on the first substrate and a second mesh electrode of the at least two mesh electrodes on the second substrate, wherein the current control component controls the current between the first mesh electrode and the second mesh electrode.

11. The electrophoretic light modulator according to claim 10, wherein the current control component: - a spacer, which separates the first substrate and the second substrate from each other, and / or - located on top of one of the plurality of intersections.

12. The electrophoretic light modulator of claim 2, wherein: - at least three mesh electrodes are applied to at least one of the first substrate and the second substrate, or - At least three mesh electrodes are applied to both the first substrate and the second substrate.

13. An electrophoretic optical modulator according to claim 2, wherein at least two mesh electrodes on the first substrate and / or the second substrate are arranged on the first side of the corresponding substrate, and include a plurality of through holes connecting the at least two mesh electrodes to the second side of the corresponding substrate, and the through holes can be connected to the controller.

14. An electrophoretic optical modulator according to claim 13, wherein the through holes are arranged in multiple groups of through holes across the corresponding substrate, each of the at least two mesh electrodes on the corresponding substrate is connected to a through hole in a group of through holes, the distance between the through holes in the group of through holes is at most the lower spacing limit, and the distance between the through holes in the group is at least the upper spacing limit.

15. The electrophoretic light modulator of claim 2, wherein one or more of the at least two mesh electrodes on the first substrate are connected to connection points on the second substrate through conductive spacers, and are connected from the connection points to the controller.

16. The electrophoretic light modulator according to claim 2, having a transparent state and a non-transparent state, or having a reflective state and a non-reflective state, wherein the electrophoretic light modulator is configured as: - switching to a non-transparent state or switching to a non-reflective state by establishing an alternating voltage on at least one of the first substrate and the second substrate, applying an alternating current between at least a first mesh electrode and a second mesh electrode among the plurality of mesh electrodes on the first substrate, and / or applying an alternating current between a first mesh electrode and a second mesh electrode among the plurality of mesh electrodes on the second substrate; -Switching to a transparent state or switching to a reflective state by establishing an AC voltage between the first substrate and the second substrate, applying an AC current between a first mesh electrode among the multiple mesh electrodes on the first substrate and a first mesh electrode among the multiple mesh electrodes on the second substrate, and / or applying an AC current between a second mesh electrode among the multiple mesh electrodes on the first substrate and a second mesh electrode among the multiple mesh electrodes on the second substrate.

17. Dynamic glass comprising an electrophoretic light modulator according to any one of claims 2-16.

18. A method for manufacturing a substrate (200) for use in an electrophoretic light modulator, the method comprising: - providing a substrate and applying a plurality of staggered mesh electrodes (210, 230) on the substrate, the plurality of staggered mesh electrodes extending across the substrate in a two-dimensional pattern, at least two of the plurality of mesh electrodes on the substrate intersecting at a plurality of intersection points (251) throughout the substrate, wherein the at least two mesh electrodes on the substrate each comprise a plurality of main lines extending across the substrate in a first direction, the plurality of main lines of the at least two mesh electrodes being arranged alternately relative to each other on the substrate, each of the at least two mesh electrodes comprising: - A plurality of interconnecting lines (221-223), wherein the plurality of interconnecting lines electrically connect the plurality of main lines of the mesh electrode together, the plurality of main lines of the mesh electrode are connected through the plurality of interconnecting lines, the plurality of interconnecting lines of the mesh electrode intersect with another mesh electrode on the substrate to form a plurality of intersections, and the plurality of mesh electrodes are configured to apply an electric potential to the plurality of mesh electrodes to obtain an electric field between the plurality of mesh electrodes, thereby providing electrophoretic movement of particles.

19. The method for manufacturing a substrate according to claim 18, comprising: - patterning a plurality of conductive interconnecting lines on the substrate and coating the substrate with a dielectric before applying the plurality of main lines, and - connecting the plurality of conductive main lines of the mesh electrode to the conductive interconnecting lines.

20. The method for manufacturing a substrate according to claim 18, comprising: - applying current control means on said plurality of conductive main lines, - applying a plurality of interconnecting lines on top of the current control component, connecting the plurality of conductive main lines into a plurality of interlaced mesh electrodes on the substrate.

21. The method for manufacturing a substrate according to claim 18, comprising: - applying a first mesh electrode on said substrate, - applying a current control means to said first mesh electrode, - applying a second mesh electrode on the substrate, the second mesh electrode being insulated from the first mesh electrode by galvanic means.

22. The method for manufacturing a substrate according to claim 18, comprising: - coating the substrate with a first conductive layer and patterning the first conductive layer to form a plurality of interconnect lines, - coating the substrate by dielectric deposition and patterning to form isolation blocks on top of a plurality of interconnect lines, - coating the substrate with a second conductive layer, and - patterning the first conductive layer and the second conductive layer to form a plurality of mesh electrodes.

23. The method of manufacturing a substrate according to claim 18, wherein the substrate is used in an electrophoretic light modulator, the method comprising: - Cutting a shape from the substrate.

24. A method for manufacturing an electrophoretic light modulator, comprising: -supply: a first substrate and a second substrate, the first substrate and the second substrate being the substrates according to claim 1, the first substrate and the second substrate facing each other, and - an optical layer, said optical layer being located between said first and second substrates, said optical layer comprising a fluid containing particles, wherein said particles are charged or capable of being charged.

25. The method of manufacturing an electrophoretic light modulator according to claim 24, comprising: - providing electrical connectors for at least two mesh electrodes on the first substrate and / or the second substrate at the connection area.

26. The method for manufacturing an electrophoretic light modulator according to claim 24 or 25, comprising: - cutting a shape from the assembled first substrate, second substrate and optical layer, wherein a shape is cut, and - Close the edges of the cut shape.

27. The method of manufacturing an electrophoretic light modulator of claim 26, wherein cutting the shape comprises cutting a hole in the assembled first substrate, second substrate, and optical layer.

28. Dynamic glass methods, including: - providing an electrophoretic light modulator according to any one of claims 2 to 16; - Selecting an alternating current or an alternating voltage, and applying the alternating current or the alternating voltage to a plurality of mesh electrodes to obtain an electric field between the plurality of mesh electrodes, thereby providing electrophoretic movement of the particles toward the electrodes or providing electrophoretic movement of the particles from the electrodes, resulting in modulation of the optical properties of the electrophoretic light modulator.

29. A transitory or non-transitory computer readable medium comprising data representing instructions which, when executed by a processor system, cause the processor system to perform the dynamic glass method of claim 28.

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