Factory interface robot for use with integrated load lock mechanism

Abstract

A factory interface for an electronic device manufacturing system may include a load lock mechanism disposed within an interior space of the factory interface and a factory interface robot disposed within the interior space of the factory interface. The factory interface robot may be configured to transfer substrates between a first set of substrate carriers and a first load lock mechanism. The factory interface robot may include a vertical tower, a plurality of linkages, and an end effector.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to systems and methods for enabling multiple factory interface robots to interact with a load lock mechanism integrated into a factory interface footprint.

[0002] background

[0003] An electronic device manufacturing system may include one or more tools or components for transporting and manufacturing substrates. Such tools or components may include a factory interface connected to a load lock mechanism and / or a transfer chamber. In some cases, the load lock mechanism is located between the transfer chamber and the factory interface. However, due to the large operating floor space used by the manufacturing system, such a configuration may be inefficient. For example, such a configuration may have a long width and / or length and a large portion of unused space. Therefore, improved electronic device manufacturing systems, apparatus, and methods for transporting and manufacturing substrates with increased floor space efficiency are sought.

[0004] Overview

[0005] Some embodiments described herein encompass a factory interface for an electronic device manufacturing system. The factory interface includes a first load lock mechanism disposed within an interior space of the factory interface and a first factory interface robot disposed within the interior space of the factory interface. The first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock mechanism. The factory interface robot includes a vertical tower, a plurality of linkages, and an end effector.

[0006] In some embodiments, a factory interface robot includes a vertical tower configured to enable a plurality of robot links to traverse along a z-axis. A plurality of links are coupled to the vertical tower and configured to move an end effector along an x-axis and a y-axis. The end effector is coupled to the plurality of links and configured to handle a substrate, wherein the factory interface robot and the load lock mechanism are disposed within an interior space of the factory interface.

[0007] In some embodiments, a method for transferring a substrate from a first factory interface robot to a second factory interface robot includes retrieving the substrate from a substrate carrier using an end effector of the first factory interface robot. The method further includes adjusting a vertical position of the end effector using a vertical drive mechanism of the factory interface robot. The method further includes transferring the substrate from the first factory interface robot to the second factory interface robot, wherein the first factory interface robot and the second factory interface robot are disposed within a factory interface.

[0008] Brief description of the attached figure

[0009] The present disclosure is illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like reference numerals represent like elements. It should be noted that different references to "a" or "an" in this disclosure are not necessarily references to the same embodiment, and such references mean at least one.

[0010] Figure 1A FIG. 1 is a top view schematically illustrating an example electronic device manufacturing system according to aspects of the present disclosure.

[0011] Figure 1B is a schematic elevation view of an example electronic device manufacturing system according to aspects of the present disclosure.

[0012] Figure 1C FIG2 is a schematic side view of an example electronic device manufacturing system according to aspects of the present disclosure.

[0013] Figure 1D FIG. 1 is another schematic diagram illustrating an electronic device manufacturing system according to aspects of the present disclosure.

[0014] Figure 2A is an isometric view of an electronic device manufacturing system according to aspects of the present disclosure.

[0015] Figure 2B An isometric view of a factory interface focused on the front of the factory interface, according to aspects of the present disclosure.

[0016] Figure 2C Another isometric view of a factory interface focused on the back of the factory interface, in accordance with aspects of the present disclosure.

[0017] Figure 2D A side view of a factory interface focused on the back of the factory interface according to aspects of the present disclosure.

[0018] Figure 2E is a front view of a factory interface according to aspects of the present disclosure.

[0019] Figure 2F is a top view of a factory interface according to aspects of the present disclosure.

[0020] Figure 3 is an illustration of a handoff between two factory interface robots according to aspects of the present disclosure.

[0021] Figure 4A FIG. 1 is a top view schematically illustrating another example electronic device manufacturing system according to aspects of the present disclosure.

[0022] Figure 4B FIG. 1 is a schematic side view of another example electronic device manufacturing system according to aspects of the present disclosure.

[0023] Figure 5A FIG. 1 is a top view of another example electronic device manufacturing system according to aspects of the present disclosure.

[0024] Figure 5B FIG. 1 is a schematic elevation view of another example electronic device manufacturing system according to aspects of the present disclosure.

[0025] Figure 6A is a schematic elevation view of an example loadport according to aspects of the present disclosure.

[0026] Figure 6B is a schematic side view of an example loadport according to aspects of the present disclosure.

[0027] Figure 7 is a front schematic diagram of an example door mechanism according to aspects of the present disclosure.

[0028] Figure 8 is a perspective view of a factory interface robot according to aspects of the present disclosure.

[0029] Figures 9A to 9C A top view of a factory interface robot retrieving substrates from different substrate carriers according to aspects of the present disclosure.

[0030] Figure 10A is a top view of a factory interface robot in a passing position according to aspects of the present disclosure.

[0031] Figure 10B is a top view of a factory interface robot retrieving a substrate from a load lock mechanism according to aspects of the present disclosure.

[0032] Figure 11 A method for transferring a substrate from a substrate carrier to a factory interface is provided in accordance with an embodiment of the present disclosure.

[0033] Figure 12 A method for transferring a substrate from a first factory interface robot to a second factory interface robot is provided in accordance with an embodiment of the present disclosure.

[0034] Detailed description of implementation methods

[0035] Embodiments described herein relate to systems and methods that enable a factory interface robot to interact with a load lock mechanism integrated into the factory interface footprint. Embodiments encompass various designs for the factory interface and load lock mechanism that reduce the overall footprint of an electronic device manufacturing system. Embodiments further encompass designs for a shortened loadport that reduces the vertical space consumed by the electronic device manufacturing system, as well as factory interface robots configured to interact with the integrated load lock mechanism and shortened loadport.

[0036] The floor space of an electronic device fabrication facility (fab) is a significant cost, and any reduction in the floor space of an electronic device manufacturing system can reduce the cost of ownership of those electronic device manufacturing systems. Reducing the system's footprint also allows owners to install more systems within a limited fab space, which in turn allows for the processing of more wafers. Thus, embodiments described herein provide a factory interface, load lock mechanism, load port, and factory interface robot that reduce the floor space and overall cost of ownership of an electronic device manufacturing system.

[0037] In some embodiments, the load lock mechanism is integrated into the interior of the factory interface, thereby reducing the floor space traditionally dedicated to the load lock mechanism. In some embodiments, the factory interface is divided into two smaller factory interfaces (e.g., a left and a right factory interface), wherein one or more load lock mechanisms are located between the two smaller factory interfaces. Each of the two smaller factory interfaces may include a factory interface robot that is configured to position a substrate from a substrate carrier (coupled to a load port) to a load lock mechanism, and vice versa. The factory interface robot may include a vertical tower that is constructed and configured to enable multiple robot links (e.g., arms) to traverse in the Z direction (e.g., vertically up and down). For example, the vertical tower may include a vertical drive mechanism that is configured to provide linear movement along the Z axis to the robot link. A proximal link of the robot link may be coupled to the vertical drive mechanism, and a distal link of the robot link may be coupled to an end effector that is configured to handle a specific object, such as a substrate (e.g., a wafer). The robot linkage may include a link and joint configuration that enables the linkage to move the end effector along the x-axis and y-axis (similar to a SCARA robot). This combination of a vertical drive mechanism and a link and joint configuration enables the factory interface robot to operate in a compact space while retaining the ability to move the end effector in three dimensions. In such a configuration, the combined footprint of the load lock mechanism plus the factory interface is reduced compared to a conventional load lock mechanism and factory interface configuration, further enabling the factory interface robot to operate efficiently in the space reduced by the inclusion of the load lock mechanism without increasing the overall size of the factory interface.

[0038] In some embodiments, the load ports of the factory interface each include an actuator (e.g., a pneumatic mechanism, an electromechanically driven actuator, or the like) for opening a load port door, which can reduce the overall height of the load port compared to conventional load ports. In some embodiments, the reduction in the vertical space occupied by the load port allows auxiliary components to be integrated into the vertical space. The auxiliary components can include substrate storage containers, metering equipment, servers, air conditioning units, etc. For example, the load port can be mounted on a wall of the factory interface. Due to the compact size of the wall-mounted load port, at least one auxiliary component (e.g., a substrate storage container, metering equipment, servers, air conditioning units, etc.) can be located below the load port. In addition, the load port can be mounted on a horizontal plane that is similar to the horizontal plane of the load lock mechanism used to transfer substrates to the processing chamber for processing. Therefore, mounting the load port on a horizontal plane similar to the horizontal plane of the load lock mechanism eliminates or reduces excessive movement (e.g., vertical movement) of the factory interface robot to transfer substrates from the substrate carrier to the load lock mechanism. Therefore, in this configuration, the overall footprint of the electronic device manufacturing system is further reduced by combining the space occupied by the load port and auxiliary components as compared to conventional load ports and auxiliary components.

[0039] By providing a system that integrates the load lock mechanism and factory interface into a single space, while reducing the size of the load port and factory interface robots, electronic device manufacturing systems achieve greater floor space efficiency. Specifically, existing electronic device manufacturing system designs position the load lock mechanism between the transfer chamber and the factory interface, resulting in a long manufacturing system profile. In some embodiments of the present disclosure, the load lock mechanism and factory interface are integrated into a single space, with one or more factory interface robots positioned within the space and flanking the load lock mechanism. As a result, the manufacturing system has a reduced depth.

[0040] Integrating a load lock mechanism into a factory interface can result in a traditional factory interface robot lacking sufficient space to operate. This is because traditional factory interface robots use linkages and joints to position the end effector in the z-direction, which requires space that may not be available with an integrated load lock mechanism. In some embodiments of the present disclosure, the factory interface robot includes a vertical tower with a vertical drive mechanism configured to provide linear movement in the z-direction to the linkages, thereby enabling the factory interface robot to operate in the reduced space provided by the integrated load lock mechanism.

[0041] Furthermore, existing electronic device manufacturing systems position loadports vertically from the floor up along one side of the factory interface, which takes up most or all of the available vertical space. In some embodiments of the present disclosure, the loadport is shortened (e.g., by two feet) and wall-mounted (rather than floor-standing), allowing for the placement of one or more auxiliary components below the loadport and integrating the loadport and auxiliary components into a single space. Thus, the manufacturing system of the present disclosure has a reduced footprint, allowing for additional throughput per square meter of space, all of which can increase overall system output and / or costs (e.g., manufacturing costs, material costs, packaging costs, shipping costs, etc.).

[0042] Figures 1A to 1D An electronic device manufacturing system 100 is depicted having two factory interface robots 126A- 126B configured to interact with respective load lock mechanisms 120A- 120B, wherein the load lock mechanisms 120A- 120B are integrated into the space of the factory interface 106 . Figure 1A FIG1 is a top view schematic diagram of an example electronic device manufacturing system 100 according to aspects of the present disclosure.

[0043] Figure 1B FIG1 is a schematic elevation view of an example electronic device manufacturing system 100 according to aspects of the present disclosure.

[0044] Figure 1C and Figure 1D FIG. 1 is a side view schematic diagram of an exemplary electronic device manufacturing system 100 according to aspects of the present disclosure. It should be noted that Figures 1A to 1D This is for illustrative purposes only, and different components may be positioned differently relative to each view.

[0045] Figures 2A to 2F An electronic device manufacturing system 200 is depicted that similarly has two factory interface robots 126A-126B configured to interact with respective load lock mechanisms 120A-120B, wherein the load lock mechanisms 120A-120B are integrated into the space of the factory interface 106. The electronic device manufacturing system 200 may be similar or identical to the electronic device manufacturing system 100. Specifically, Figures 1A to 1D Various block diagrams of the electronic device manufacturing system 100 are shown. Figures 2A to 2F Different computer aided design (CAD) views of the electronic device manufacturing system 200 are illustrated. Figure 2A is an isometric view of an electronic device manufacturing system 200 according to aspects of the present disclosure. Figure 2B An isometric view of a plant interface focused on the front of the plant interface 106 , in accordance with aspects of the present disclosure. Figure 2C Another isometric view of the factory interface 106 focused on the back of the factory interface 106 , in accordance with aspects of the present disclosure. Figure 2D FIG. 1 is a side view of the factory interface 106 with focus on the back of the factory interface 106 . Figure 2E is a front view of the factory interface 106 , according to aspects of the present disclosure. Figure 2F FIG. 1 is a top view of the factory interface 106 according to aspects of the present disclosure. It should be noted that Figures 2A to 2F This is for illustrative purposes only, and different components may be positioned differently relative to each view.

[0046] Electronic device manufacturing systems 100 and 200 (each also referred to as an electronic processing system) are configured to perform one or more processes on a substrate 102. Substrate 102 can be any suitable rigid, fixed-size planar article, such as a silicon-containing disk or wafer, a patterned wafer, a glass plate, etc., suitable for fabricating electronic devices or circuit components thereon.

[0047] The electronic device manufacturing systems 100 and 200 include a processing tool (e.g., a mainframe) 104 and a factory interface 106 coupled to the processing tool 104. The processing tool 104 includes a housing 108 having a transfer chamber 110 therein. The transfer chamber 110 includes one or more processing chambers (also referred to as process chambers) 114, 116, and 118 disposed therearound and coupled thereto. The processing chambers 114, 116, and 118 can be coupled to the transfer chamber 110 via respective ports (such as slit valves).

[0048] The processing chambers 114, 116, and 118 can be adapted to perform any number of processes on the substrate 102. The same or different substrate processes can be performed in each of the processing chambers 114, 116, and 118. Examples of substrate processes include atomic layer deposition (ALD), physical vapor deposition (PVD), chemical vapor deposition (CVD), etching, annealing, curing, pre-cleaning, metal or metal oxide removal, and the like. In one example, a PVD process is performed in one or both of the processing chambers 114, an etching process is performed in one or both of the processing chambers 116, and an annealing process is performed in one or both of the processing chambers 118. Other processes can be performed on the substrates therein. The processing chambers 114, 116, and 118 can each include a substrate support assembly. The substrate support assembly can be configured to hold the substrate in place while the substrate process is performed.

[0049] The transfer chamber 110 also includes a transfer chamber robot 112. The transfer chamber robot 112 may include one or more arms, wherein each arm includes one or more end effectors located at the end of each arm. The end effectors may be configured to handle specific objects, such as wafers. Alternatively or additionally, the end effectors may be configured to handle objects, such as process accessory rings. In some embodiments, the transfer chamber robot 112 is a selective compliance assembly robot arm (SCARA) robot, such as a 2-link SCARA robot, a 3-link SCARA robot, a 4-link SCARA robot, or the like.

[0050] The load lock mechanisms 120A-120B can be coupled to the housing 108 and the transfer chamber 110. The load lock mechanisms 120A-120B can be disposed within an interior space of the factory interface 106 and can be configured to interface with the transfer chamber 110 and the factory interface 106. In some embodiments, the load lock mechanisms 120A-120B can have an environmentally controlled atmosphere that changes from a vacuum environment (where substrates are transferred to and from the transfer chamber 110) to an inert gas environment at or near atmospheric pressure (where substrates are transferred to and from the interior space of the factory interface 106, which is located external to the load lock mechanisms). In some embodiments, such as Figure 1B and Figure 1C As shown, each of the load lock mechanisms 120A-120B is a stacked load lock mechanism having one or more (e.g., a pair) of upper internal chambers and one or more (e.g., a pair) of lower internal chambers, the lower internal chambers being located at different vertical heights (e.g., one above the other). In some embodiments, the one or more upper internal chambers are configured to receive processed substrates from the transfer chamber 110 for removal from the processing tool 104, while the one or more lower internal chambers are configured to receive substrates from the factory interface 106 for processing in the processing tool 104, and vice versa. In some embodiments, as Figure 1D As shown, each of the load lock mechanisms 120A-120B is a batch load lock mechanism that can be configured to hold and / or transfer a plurality of substrates (e.g., 25 substrates). In some embodiments, the load lock mechanisms 120A-120B are configured to perform a substrate process (e.g., etching or pre-cleaning) on ​​one or more substrates 102 received therein. Accordingly, the load lock mechanisms 120A-120B can include one or more heating elements for heating the substrates and / or cooling elements for cooling the substrates.

[0051] The factory interface 106 can be any suitable housing, such as an Equipment Front End Module (EFEM). The factory interface 106 can be configured to receive substrates 102 from substrate carriers 122A to 122F (e.g., Front Opening Unified Pods (FOUPs)) docked at respective load ports 124 of the factory interface 106. In a first example, as Figure 1A As shown, the factory interface 106 may include four loading ports 124, which may be located at one or more heights on the front side of the factory interface 106. In a second example, as shown in FIG. Figure 1B 、 Figure 2A 、 Figure 2B 、 Figure 2E and Figure 2F As shown, the factory interface 106 may include six loadports 124, which may be located at one or more elevations on the front side of the factory interface 106. The factory interface 106 may be configured with any number of loadports 124, which may be located on one or more sides of the factory interface 106 and at the same or different elevations.

[0052] like Figure 1B 、 Figure 2A 、 Figure 2B and Figure 2E As shown, the loading port 124 can be located at different heights along the wall of the factory interface 106. Elevating the loading port 124 allows one or more auxiliary components 150 to be placed at the bottom of the factory interface 106. The auxiliary components 150 will be explained in more detail below. In some embodiments, as shown in FIG. Figure 1B 、 Figure 2A 、 Figure 2B and Figure 2EAs shown, one or more load ports 124 may be located at or near the bottom of the factory interface on the front side of the factory interface 106, while one or more other load ports 124 may be located at a higher elevation (e.g., approximately two meters above the ground). In some embodiments, one or more substrate carrier elevators 113 may be configured to elevate substrate carriers 122A-122F. In some embodiments, the substrate carrier elevators 113 may elevate one or more substrate carriers 122A-122F to an overhead automation component (not shown). The overhead automation component may transport the one or more substrate carriers 122A-122F to the one or more elevated load ports 124. Additionally, the overhead automation component may remove the one or more substrate carriers 112A-112F from the one or more elevated load ports 124. In one example, a factory operator may load the substrate carriers 122A-122F onto the substrate carrier elevator 113, engage the elevator to lift the substrate carriers 122A-122F to the overhead automation component, engage the overhead automation component to transport the substrate carriers 122A-122F to the load port 124, then engage the overhead automation component to remove the substrate carriers 122A-122F from the load port after they are empty, and engage the elevator to lower the substrate carriers 122A-122F.

[0053] In some embodiments, at least one loadport 124 may be located at a lower elevation, accessible to a factory operator who can manually load one or more substrate carriers 112A-112F into the loadport 124. One or more additional loadports 124 may be located at a higher elevation, allowing the factory operator to engage the substrate carrier elevator 113 and overhead automation components to load one or more substrate carriers 112A-112F into the elevated loadports 124. Such a configuration may allow for additional space at the bottom of the front side of the factory interface, so that components placed in this space do not increase the operational footprint of the electronic device manufacturing system 100. For example, in some embodiments, the auxiliary components 150 may be replaced with loadports 124. For example, four or six loadports 124 may be located at or near the bottom of the factory interface on the front side of the factory interface 106. In some other embodiments, one or more loadports 124 may be mounted on the sidewalls of the factory interface 106.

[0054] According to aspects of the present disclosure, one or more load ports 124 may be designed to occupy minimal vertical space on the factory interface 106. These load ports will be referred to as Figures 6A to 6B and Figure 7In some embodiments, the load port 124 may be located at different heights along the wall of the factory interface 106. As described above, elevating the load port 124 allows one or more auxiliary components 150 to be placed at the bottom of the factory interface 106, below the load port 124.

[0055] The factory interface robots 126A-126B can be configured to transfer substrates 102 between substrate carriers (also referred to as containers) 122A-122F and the load lock mechanisms 120A-120B. In one embodiment, the factory interface 106 includes two or more factory interface robots. For example, the factory interface 106 can include a first factory interface robot 126A disposed within the factory interface on a first side (e.g., the left side) of the factory interface 106 and a second factory interface robot 126B disposed within the factory interface on a second side (e.g., the right side) of the factory interface 106. In one embodiment, the first and second load lock mechanisms 120A, 120B are disposed within the factory interface 106 between the first and second factory interface robots 126A, 126B, with the load lock mechanism 120A being closer to the factory interface robot 126A and the load lock mechanism 120B being closer to the factory interface robot 126B.

[0056] In one example, the factory interface robot 126A can be configured to transfer substrates 102 between a first set of substrate carriers (e.g., substrate carriers 122A-122B, 122E) and the load lock mechanism 120A. In another example, the factory interface robot 126B can be configured to transfer substrates 102 between a second set of substrate carriers (e.g., substrate carriers 122C-122D, 122F) and the load lock mechanism 120B. However, it should be noted that the factory interface robots 126A-126B can be configured to transfer substrates 102 between any of the substrate carriers 122A-122F and the load lock mechanisms 120A-120B. In other and / or similar embodiments, the factory interface 106 is configured to receive replacement parts from a replacement part storage container, and the factory interface robots 126A-126B are configured to transfer such replacement parts to and from one or more of the load lock mechanisms 120A-120B. In some embodiments, the factory interface robot 126A cannot access the load lock mechanism 120B, and the factory interface robot 128B cannot access the load lock mechanism 120A.

[0057] The factory interface robots 126A to 126B may include one or more robotic arms, and each robotic arm may be or include a SCARA robot, a mast robot, a lift (e.g., scissor lift) robot, or any combination thereof. In some embodiments, the factory interface robots 126A to 126B have more linkages and / or more degrees of freedom than the transfer chamber robot 112. Each of the factory interface robots 126A to 126B may include an actuator or assembly that can adjust the height of one or more robotic arms of the respective factory interface robots 126A to 126B so that the factory interface robots 126A to 126B can reach carriers connected to load ports at different heights. The factory interface robots 126A to 126B may each include one or more end effectors located at the end of each robotic arm. The end effectors may be configured to pick up and handle specific objects, such as wafers. Alternatively or additionally, the end effectors may be configured to handle objects such as process part rings. Any conventional robot type may be used for the factory interface robots 126A to 126B. The transfers may be made in any order or direction. Figure 8 and Figures 9A to 9C The factory interface robots 126A-126B are discussed in more detail.

[0058] In some embodiments, the factory interface 106 can be maintained in a non-reactive gas environment, such as at a slightly positive pressure (using, for example, nitrogen as the non-reactive gas). In an embodiment, the factory interface 106 includes an environmental control system having one or more inert gas delivery lines, one or more exhaust lines, and one or more sensors that can be used to measure one or more of humidity, O2 levels, temperature, pressure, gas flow rate, and / or other parameters. The environmental control system can regulate the gas flowing into the factory interface and / or the gas rate and / or the gas rate exhausted from the factory interface based on one or more measured parameters. In an embodiment, the factory interface further includes a recirculation system that can filter the gas exhausted from the factory interface and recirculate the filtered gas back into the interior of the factory interface.

[0059] Each load lock mechanism 120A-120B may include one or more slit valves and / or doors that are configured to open when a substrate is received into and / or released from the factory interface robot 126A-126B and the transfer chamber robot 112. The slit valves and / or doors may be used to maintain a vacuum environment, a clean environment, and / or a temperature controlled environment. For example, the slit valves and / or doors may be used to maintain a vacuum environment within the transfer chamber 110 and an inert gas environment within the factory interface 106. The load lock mechanism 120A may include one (e.g., Figure 1D as shown) or multiple (as shown Figure 1CThe load lock mechanism 120B may include one or more side doors 128B that may allow access to the factory interface robot 126B. The load lock mechanisms 120A-120B may include one or more front doors (not shown) that allow access to the transfer chamber robot 112.

[0060] As shown, in one embodiment, side door 128A is generally perpendicular to the back of factory interface 106 and also generally perpendicular to door 130. Similarly, in one embodiment, side door 128B is generally perpendicular to the back of factory interface 106 and also generally perpendicular to door 130. Side door 128A may face in a direction opposite to side door 128B. Although not shown, one or more additional side doors may be included in the load lock mechanisms 120A, 120B, wherein the one or more additional side doors are located between and separate the load lock mechanisms 120A and 120B. For example, the additional side door of the load lock mechanism 120B may be located on the opposite side of side door 128B and may be opened to allow the factory interface robot 126B to place a substrate in the load lock mechanism 120A, allow the factory interface robot 126A to place a substrate into the load lock mechanism 120B, and / or allow for the transfer of substrates between the factory interface robot 126A and the factory interface robot 126B.

[0061] In some embodiments, when removing substrates from and / or placing substrates into containers 122A-122F, the factory interface robots 126A-126B may orient the end effectors in a first direction, where the first direction is directed toward and generally perpendicular to the front side of the factory interface. In embodiments, when retrieving substrates from and / or placing substrates into the load lock mechanism 120A, the factory interface robot 126A may orient one or more end effectors in a second direction, where the second direction may be generally perpendicular to the first direction. Similarly, when retrieving substrates from and / or placing substrates into the load lock mechanism 120B, the factory interface robot 126B may orient one or more end effectors in a third direction, where the third direction may be generally perpendicular to the first direction. In embodiments, the third direction may be approximately 180 degrees from the second direction.

[0062] In some embodiments, the transfer chamber 110, the processing chambers 114, 116, and 118, and / or the load lock mechanisms 120A to 120B are maintained at a vacuum level. The electronic device manufacturing system 100 may include one or more vacuum ports coupled to one or more stations of the electronic device manufacturing system 100. For example, a vacuum port 130 may be coupled to the load lock mechanisms 120A to 120B and disposed between the load lock mechanisms 120A to 120B and the transfer chamber 110. In some embodiments, additional vacuum ports may be used. For example, another vacuum port (not shown) may couple the factory interface 106 to the load lock mechanisms 120A to 120B. In some embodiments, a factory operator may access the load lock mechanisms 120A to 120B for maintenance or repair without closing the factory interface 106. This will be discussed in further detail below.

[0063] In some embodiments, one or more utility lines (not shown) are configured to provide utilities to the factory interface 106. The utility lines may include a power utility line configured to provide power to the factory interface 106, an air utility line (e.g., a clean dry air (CDA) utility line) configured to supply air to the factory interface 106, a vacuum utility line configured to provide a vacuum to the vacuum port 130 and / or an internal chamber of the factory interface 106, and / or a nitrogen utility line configured to provide nitrogen to the factory interface 106.

[0064] One or more utility cables can be configured to protect one or more utility lines. For example, each utility line can be encapsulated in a utility cable. Multiple utility lines can be encapsulated in the same utility cable, and / or utility lines can be included in a separate utility cable. The first end of each utility cable can be installed to the outlet of a utility source (e.g., a power source, an air source, a vacuum pump, a nitrogen source, etc.). In some embodiments, the outlet of the utility power source is connected to the floor (or wall) of the electronic device manufacturing system 100. In this way, the first end of each utility cable can be installed to the ground of the fab (e.g., the ground where the factory interface 106 is installed). The second end of each utility cable can be installed to the inlet of the factory interface 106. In some embodiments, the inlet is located at the bottom of the factory interface 106. In this way, the second end of each utility cable is installed to the bottom of the factory interface 106.

[0065] The electronic device manufacturing system 100 may further include a system controller 140. The system controller 140 may be and / or include a computing device, such as a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc. The system controller 140 may include one or more processing devices, which may be general-purpose processing devices, such as a microprocessor, a central processing unit, etc. More specifically, the processing device may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that implements other instruction sets or a processor that implements a combination of instruction sets. The processing device may also be one or more special-purpose processing devices, such as an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. The system controller 140 may include data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, a network interface, and / or other components. The system controller 128 may execute instructions to perform any one or more of the methods and / or embodiments described herein. The instructions may be stored on a computer-readable storage medium, which may include main memory, static memory, secondary storage, and / or a processing device (during execution of the instructions). The system controller 140 may include an environmental controller configured to control the environment (e.g., pressure, humidity level, vacuum level, etc.) within the factory interface 106. In an embodiment, execution of the instructions by the system controller 140 causes the system controller to perform Figure 11 and Figure 12 The system controller 140 may also be configured to allow a human operator to input and display data, operating commands, and the like.

[0066] Reference Figure 1A to Figure 1B In some embodiments, the factory interface robot 126A is configured to transfer one or more substrates to the factory interface robot 126B and vice versa using the pass-through areas 115A, 115B, 115C. Figure 1AAs shown, the pass-through area 115A can be disposed between the front side of the factory interface and the forward-facing side of the load lock mechanism. In a second example, the pass-through area 115B can be a through hole or open space disposed within the interior space of the factory interface 106, above the load lock mechanisms 120A to 120B. In a third example, the pass-through area 115C can be an open space or through hole disposed within the interior space of the factory interface 106, located between a pair of upper interior chambers and a pair of lower interior chambers of the load lock mechanisms 120A to 120B (e.g., wherein the load lock mechanisms 120A to 120B are stacked load lock mechanisms). In a fourth example, the pass-through area 115D can be an open space or through hole disposed within the interior space of the factory interface 106, located below the load lock mechanisms 120A to 120B. In an embodiment, the factory interface robot 126A can be configured to transfer one or more substrates to the factory interface robot 126B via one or more pass-through areas 115A to 115D.

[0067] In some embodiments, the factory interface robot 126A may hand over a substrate to the factory interface robot 126B and vice versa. Figure 3 As shown, substrates 302A-302B can be transferred between factory interface robots 126A-126B (not shown) using pass-through area 310. In some embodiments, factory interface robot 126A can place substrates on a rack in any one of pass-through areas 115A-115D included in the factory interface, and factory interface robot 126B can retrieve substrates from the rack.

[0068] refer to Figures 1B to 1D 、 Figures 2A to 2B and Figures 2D to 2E , the factory interface 106 may include one or more auxiliary components 150 that are accessible by the factory interface robot and are part of the factory interface microenvironment. The auxiliary components 150 may include substrate wafer storage stations, metrology stations, cooling stations, servers, etc. For example, substrate storage containers may store substrates and / or substrate carriers (e.g., FOUPs). Metrology equipment may be used to determine characteristic data of products produced by the electronic device manufacturing system 100. In some embodiments, the factory interface 106 may include an upper compartment 160, such as Figure 1B and Figures 2A to 2E The upper compartment 160 may house electronic systems (eg, servers, air conditioning units, etc.), utility cables, the system controller 140, or other components.

[0069] The factory interface 106 may include one or more access doors 134, 136 that can be used to inspect or perform maintenance on the load lock mechanisms 120A-120B, the factory interface robots 126A-126B, or other components. In some embodiments, the factory interface may include a side access door 134. In some embodiments, the factory interface 106 may include a front access door 136. The load lock mechanisms 120A-120B may be isolated from the clean environment created by the factory interface 106 by side doors 128A-128B. This allows factory operators to access the load lock mechanisms 120A-120B without shutting down the clean environment created by the factory interface 106.

[0070] exist Figure 1A 、 Figure 1C and Figure 1D In the illustrated embodiment, there is open space (e.g., through area 115A) between the front of the factory interface and the front of the load lock mechanisms 120A-120B. In an alternative embodiment, the load lock mechanisms 120A, 120B may extend all the way to the front of the factory interface 106. In such an embodiment, the load lock mechanisms may be accessed without exposing the interior of the factory interface 106 to the external environment. In one embodiment, the load lock mechanisms 120A, 120B include an additional access door (not shown) located on the opposite side of the load lock mechanism from door 130. Such an access door may be opened when doors 130, 128A, 128B are closed to enable maintenance and service of the load lock mechanisms 120A-120B without exposing the interior of the factory interface 106 to the external environment.

[0071] In some embodiments, as Figure 1B 、 Figures 2A to 2B and Figure 2E As shown, the factory interface 106 can include a lower access area 170. Below the access area 170 can be a passageway that allows factory operators to provide maintenance to the factory interface 106, the load lock mechanisms 120A-120B, the factory interface robots 126A-126B, the transfer chamber 108, and / or other components of the electronic device manufacturing system 100. In some embodiments where the factory interface includes a lower access area 170, the load lock mechanisms 120A, 120B include maintenance access doors located on the underside of the load lock mechanisms 120B, 120A that are accessible from the lower access area 170.

[0072] In the illustrative example, the factory interface 106 includes multiple sides, including a back, front, right, and left side configured to face the transfer chamber 110 of the electronic device manufacturing system 100. A first factory interface robot (e.g., factory interface robot 126A) is positioned within the interior space near the left side, and a second factory interface robot (e.g., factory interface robot 126B) is positioned within the interior space near the right side. A first load lock mechanism (e.g., load lock mechanism 120A) and a second load lock mechanism (e.g., load lock mechanism 120B) are positioned near the back side between the first factory interface robot and the second factory interface robot, such that the first load lock mechanism is closer to the first factory interface robot than the second load lock mechanism, and the second load lock mechanism is closer to the second factory interface robot than the first load lock mechanism. The factory interface 106 includes a first set of load ports (e.g., one or more of the load ports 122) for receiving a first set of substrate carriers (e.g., one or more of the substrate carriers 122A-122F), wherein the first set of load ports is located at a first portion of the front side near the left side. The factory interface 106 also includes a second set of loadports (e.g., one or more of the loadports 122) for receiving a second set of substrate carriers (e.g., one or more of the substrate carriers 122A-122F), wherein the second set of loadports is located in a second portion of the front side, near the right side. The factory interface 106 may include at least one of a substrate storage container or a metrology device located below the loadports 122 of the first set of loadports. The plurality of sides may include a rear side, a right side, and a left side configured to face the transfer chamber 110, wherein the first factory interface robot is positioned within the interior space near the left side, and the first load lock mechanism is positioned adjacent to the rear side and between the first factory interface robot and the right side. The first load lock mechanism may include a first door (e.g., side door 128A) and a second door, the first door being substantially perpendicular to the rear side and accessible by the first factory interface robot, and the second door being substantially parallel to the rear side and accessible by the transfer chamber robot 112.

[0073] Figure 4A FIG4 is a top view of an electronic device manufacturing system 400 according to one embodiment of the present disclosure, including a processing tool 404 and a factory interface 406 coupled to the processing tool 404. The components and functions of the processing tool 404 and the factory interface 406 may be similar to those of the processing tool 104 and the factory interface 406, respectively. Figures 4A to 4B Describes something similar to reference Figures 1A to 1D The example electronic device manufacturing system 400 is depicted, but where the factory interface 406 includes a raised portion 410 located on a front side of the factory interface 106 . Figure 4A FIG4 is a top view schematic diagram of an example electronic device manufacturing system 400 according to aspects of the present disclosure. Figure 4B4 is a schematic side view of an exemplary electronic device manufacturing system 400 according to aspects of the present disclosure. A raised portion 410 can provide additional space within the factory interface 406. The raised portion 410 can extend any length away from the load lock mechanisms 120A-120B and can have a top portion (e.g., a top plate) whose height is independent of the height of the rest of the factory interface 406. For example, the top of the raised portion 410 can be one meter, two meters, the same height as the top of the factory interface 406, a height higher than the top of the factory interface 404, or some other height. In some embodiments, the raised portion 410 can extend to the ends of the substrate carriers 122A-122D so as not to increase the operational footprint of the factory interface 406. Thus, in embodiments, the front surface of the raised portion 410 can be substantially flush with the front of the carriers 122A-122F. In some embodiments, the raised portion 410 provides additional space for the factory interface 406 to accommodate various components such as, but not limited to, substrate storage containers, metrology equipment, servers, air conditioning units, etc. The raised portion 410 can share the clean environment of the factory interface 406 .

[0074] In some embodiments, the factory interface robot 126A can be configured to transfer one or more substrates to the factory interface robot 126B, and vice versa, using the pass-through area 115 disposed within the raised portion 410. For example, the factory interface robot 126A can hand over a substrate to the factory interface robot 126B using the pass-through area disposed within the raised portion 410. In another example, the factory interface robot 126A can place a substrate on a rack disposed within the pass-through area within the raised portion 410, and the factory interface robot 126B can retrieve the substrate from the rack.

[0075] In some embodiments, the load lock mechanism is not included within the factory interface. In such embodiments, the factory interface can be divided into two or more factory interfaces (e.g., a left factory interface and a right factory interface). The load lock mechanism can then be positioned between the left and right factory interfaces. This can reduce the total combined footprint of the factory interface and the load lock mechanism in the same manner as in the above-described embodiments.

[0076] In the illustrative example, the front side of the factory interface 406 may include a center portion (e.g., raised portion 410), a left front portion, and a right front portion, wherein the center portion protrudes from the left front portion, the right front portion, and the rear side, wherein a first load port (e.g., one of the load ports 122) is located at a first position on the left front portion, and a second load port (e.g., another of the load ports 122) is located at a second position on the right front portion. A through-hole disposed at the center portion within the interior space of the factory interface 406 may be used by a first factory interface robot (e.g., factory interface robot 126A) configured to transfer a substrate to a second factory interface robot (e.g., factory interface robot 126B) via the through-hole.

[0077] Figures 5A to 5B An electronic device manufacturing system 300 is depicted in which a first load lock mechanism (e.g., load lock mechanism 120A) is connected to a first factory interface (e.g., factory interface 506A) and a second load lock mechanism (e.g., load lock mechanism 120B) is connected to a second factory interface (e.g., factory interface 506B). Figure 5A FIG. 5 is a top view schematic diagram of an example electronic device manufacturing system 500 according to aspects of the present disclosure. Figure 5B is a schematic elevation view of an example electronic device manufacturing system 500 according to aspects of the present disclosure.

[0078] The electronic device manufacturing system 500 includes a processing tool 504, load lock mechanisms 520A-520B coupled to the processing tool 504, and factory interfaces 506A-506B, wherein the factory interface 506A is coupled to the load lock mechanism 520A, and the factory interface 506B is coupled to the load lock mechanism 520B. The components and functions of the processing tool 504, the load lock mechanisms 520A-520B, and the factory interfaces 506A-506B may be similar to those of the processing tool 104, the load lock mechanisms 120A-120B, and the factory interface 106, respectively.

[0079] The load lock mechanisms 520A-520B can be connected to the housing 108 and the transfer chamber 110. The load lock mechanisms 520A-520B can be configured to interface with the transfer chamber 110 and the factory interfaces 506A-506B. In some embodiments, the load lock mechanisms 520A-520B can have an environmentally controlled atmosphere that changes from a vacuum environment (where substrates are transferred to and from the transfer chamber 110) to an inert gas environment at or near atmospheric pressure (where substrates are transferred to and from the factory interfaces 506A-506B). In some embodiments, the load lock mechanisms 520A-520B are each stacked load lock mechanisms having a pair of upper and lower internal chambers located at different vertical levels (e.g., one above the other). In some embodiments, each of the load lock mechanisms 520A-520B is a batch load lock mechanism. More or fewer load lock mechanisms than shown may be used.

[0080] Similar to the factory interface 106, each factory interface 506A-506B can be any suitable housing, such as an Equipment Front End Module (EFEM). The factory interface 506A can be configured to receive substrates 102 from substrate carriers 122A-122B docked at respective load ports 124 of the factory interface 506A. Note that while two substrate carriers 122A-122B are illustrated, more or fewer substrate carriers can be connected to the factory interface 506A. The factory interface 506B can be configured to receive substrates 102 from substrate carriers 122C-122D docked at respective load ports 124 of the factory interface 506B. Note that while two substrate carriers 122C-122D are illustrated, more or fewer substrate carriers can be connected to the factory interface 506B. The load ports 124 and attached substrate carriers can be located at different heights along the wall of the factory interface 106. The lift load port 124 allows one or more auxiliary components (not shown) to be placed at the bottom of the factory interface 106 and / or allows multiple substrate carriers to be stacked vertically.

[0081] The factory interface robots 526A-526B may be similar to the factory interface robots 126A-126B, respectively, and may be configured to transfer substrates 102 between the substrate carriers 122A-122D and the load lock mechanisms 520A-520B. For example, the factory interface robot 526A may be configured to transfer substrates 102 between the substrate carriers 122A-122B and the load lock mechanism 520A, and the factory interface robot 526B may be configured to transfer substrates between the substrate carriers 122C-122D and the load lock mechanism 520B. In one embodiment, the factory interface 506A includes one or more factory interface robots, and the factory interface 506B includes one or more factory interface robots. For example, the factory interface 506A may include a first factory interface robot 526A disposed within the factory interface 506A, and the factory interface 506B may include a second factory interface robot 526B disposed within the factory interface 506B. In one embodiment, the first and second load lock mechanisms 520A, 520B are disposed between the first and second factory interface robots 526A, 526B, with the load lock mechanism 520A being closer to the factory interface robot 526A and the load lock mechanism 520B being closer to the factory interface robot 526B.

[0082] A first vacuum port (not shown) can couple the factory interface 506A to the load lock 520A, and a second vacuum port can couple the factory interface 506B to the load lock 520B. The atmosphere of each load lock 520A-520B can be regulated independently of the atmosphere of the other load locks 520A-520B. This allows factory operators to access one load lock and factory interface for maintenance or repair while the other load lock and factory interface remain operational.

[0083] The factory interface 106 may include one or more auxiliary components 150. The auxiliary components 150 may include substrate storage containers, metrology equipment, servers, air conditioning units, etc. The substrate storage containers may store substrates and / or substrate carriers (e.g., FOUPs). The metrology equipment may be used to determine characteristic data of products produced by the electronic device manufacturing system 100.

[0084] In some embodiments, the factory interface 506A may include an upper compartment 560A, such as Figure 5B As shown, the factory interface 506B may include an upper compartment 560B, and the load lock mechanisms 520A-520B may include a middle compartment 580 and a lower compartment 570. Each of these compartments may house one or more electronic systems (e.g., servers, air conditioning units, etc.), utility cables, the system controller 140, or other components.

[0085] As shown, in one embodiment, side door 128A is generally perpendicular to the back of factory interface 506A and also generally perpendicular to door 150. Similarly, in one embodiment, side door 128B is generally perpendicular to the back of factory interface 506B and also generally perpendicular to door 150. Side door 128A may face in a direction opposite to side door 128B. Although not shown, one or more additional side doors may be included in the load lock mechanisms 520A-520B, wherein the one or more additional side doors are located between and separate the load lock mechanisms 520A-520B. For example, the additional side door of the load lock mechanism 520B may be located on the opposite side of side door 528B and may be opened to allow the factory interface robot 526B to place a substrate in the load lock mechanism 520A, allow the factory interface robot 526A to place a substrate into the load lock mechanism 520B, and / or allow for the transfer of substrates between the factory interface robot 526A and the factory interface robot 526B.

[0086] In embodiments, when removing substrates from and / or placing substrates into containers 122A-122D, the factory interface robots 526A-526B may orient the end effectors in a first direction, which is directed toward and generally perpendicular to the front side of the factory interface. In embodiments, when removing substrates from and / or placing substrates into the load lock mechanism 520A, the factory interface robot 526A may orient one or more end effectors in a second direction, which may be generally perpendicular to the first direction. Similarly, when retrieving substrates from and / or placing substrates into the load lock mechanism 520B, the factory interface robot 526B may orient one or more end effectors in a third direction, which may be generally perpendicular to the first direction. In embodiments, the third direction may be approximately 180 degrees from the second direction.

[0087] The load lock mechanisms 520A-520B can be accessed without exposing the interior of the factory interfaces 506A-506B to the external environment. In one embodiment, the load lock mechanisms 520A, 520B include additional access doors (not shown) located on the opposite side of the load lock mechanisms from the door 150. Such access doors can be opened when the doors 150, 128A, 128B are closed to enable maintenance and service to the load lock mechanisms 520A-520B without exposing the interior of the factory interfaces 506A-506B to the external environment.

[0088] Reference Figure 5BIn some embodiments, the factory interface robot 526A can be configured to transfer one or more substrates to the factory interface robot 526B, and vice versa, using a pass-through area 515. In one example, the pass-through area 515 can be a through-hole between a pair of upper and lower interior chambers of the load lock mechanisms 520A-520B (e.g., where the load lock mechanisms 120A-120B are stacked load lock mechanisms). In some embodiments, the pass-through area 515 can be part of an environmentally controlled atmosphere that changes from a vacuum environment (where substrates are transferred to and from the transfer chamber 110) to an inert gas environment at or near atmospheric pressure (where substrates are transferred to and from the interior of the factory interface 106). For example, the pass-through area 515 can be part of the environmentally controlled area of ​​one or more load lock mechanisms, or can have its own separate environmentally controlled area. In one embodiment, the pass-through area 515 is located between the upper and lower interior chambers, the pass-through area is contained within a housing containing a load lock mechanism and includes a slit valve that can be used to seal the pass-through area 515 from the factory interface environment. Alternatively, the pass-through area 515 can be exposed to the factory interface environment and / or portions thereof. Alternatively, or additionally, through-holes can be located above and / or below the load lock mechanism and can provide a pass-through area between the factory interfaces 506A and 506B. In some embodiments, one or both of the through-holes located above and / or below the load lock mechanism can be part of the environmentally controlled atmosphere of one or more load lock mechanisms. The factory interface robot 526A can be configured to transfer one or more substrates to the factory interface robot 526B, and vice versa, via any of the pass-through areas. In some embodiments, the factory interface robot 526A can hand off substrates to the factory interface robot 526B. In some embodiments, the factory interface robot 526A can place substrates on racks in the pass-through area, and the factory interface robot 526B can retrieve substrates from the racks.

[0089] In the illustrative example, the electronic device manufacturing system 500 includes a transfer chamber 110, a plurality of processing chambers connected to the transfer chambers 114, 116, and 118, a first load lock mechanism (e.g., load lock mechanism 520A) having a first side and a second side, the second side being substantially perpendicular to the first side of the first load lock mechanism, wherein the first side of the first load lock mechanism is connected to the transfer chamber 110. Furthermore, the electronic device manufacturing system 500 includes a second load lock mechanism (e.g., load lock mechanism 520B) having a first side and a second side, the second side being substantially perpendicular to the first side of the second load lock mechanism, wherein the first side of the second load lock mechanism is connected to the transfer chamber 110. A first factory interface 506A is connected to the second side of the first load lock mechanism, and a second factory interface 506B is connected to the second side of the second load lock mechanism. The first factory interface 506A may include a first atmospheric environment, and the second factory interface 506B may include a second atmospheric environment.

[0090] Figures 6A to 6B An exemplary loadport 600 is depicted according to one embodiment of the present disclosure, including an indicator light 610, a loadport controller 615, a pneumatic controller 620, a purge kit 625, and a platform 640. The components and functionality of the loadport 600 may be similar to the loadport 124. Figure 6A FIG. 6 is a front view of an example loadport 600 according to one embodiment of the present disclosure. Figure 6B FIG. 6 is a schematic side view of an example loadport 600 according to one embodiment of the present disclosure.

[0091] like Figure 6A As shown, the load port door 605 can be positioned in a closed position 630 to secure to the transfer opening to maintain the environmentally controlled atmosphere in the factory interface 106. The load port door 605 can be positioned in an open position 635 using a door mechanism, as will be shown in FIG. Figure 7 600 and the factory interface 106. When in the open position 635, the transfer opening in the load port 600 enables transfer of substrates (e.g., wafers) between a substrate carrier 122 coupled to the load port 600 and the factory interface 106 using the factory interface robot 126. In some embodiments, the load port door 605 can be coupled to a substrate carrier door. As such, in response to the load port door 605 being positioned in the open position 635, the load port door 615 can remove the substrate carrier door from the substrate carrier. Thus, in response to the load port door 605 being positioned in the closed position 630, the load port door 615 can attach the substrate carrier door to the substrate carrier.

[0092] The load port 600 can be designed to occupy a minimal amount of vertical space on the factory interface 106. In some embodiments, the height of the load port 600 can be related to the vertical space occupied by the load port door 605 in the open position 630 and the closed position 635. In particular, the height of the load port 600 can be approximately twice the height of the load port door 605. As an illustrative example, the load port door 605 can have a height of approximately 315 mm. Thus, the load port 600 can have a height of approximately 650 mm or less, which is approximately twice the height of the load port door 605 and significantly less than the height of conventional load ports of over 1,300 mm. Figure 6B As shown in the exemplary embodiment of FIG, the load port 600 may have a width of about 450 mm or less. The load port 600 may comply with SEMI (Semiconductor Equipment and Materials International) standards and requirements.

[0093] The indicator light 610 may indicate whether the loadport door 605 is in the closed position 635 or the open position 630. For example, the indicator light 610 may turn on in response to the loadport door 605 being in the open position 630 and turn off in response to the loadport door 605 being in the closed position 630. In other embodiments, the indicator light 610 may indicate whether the substrate carrier 122 is properly secured to the loadport 600.

[0094] The loadport controller 615 can be and / or include a computing device, such as a programmable logic controller (PLC), a microcontroller, or the like. The loadport controller 615 can include one or more processing devices, which can be general-purpose processing devices, such as a microprocessor, a central processing unit, or the like. The loadport controller 615 can include data storage devices (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, a network interface, and / or other components. The loadport controller 615 can execute instructions to perform any one or more of the methods and / or embodiments described herein. For example, the loadport controller 615 can operate the loadport door (e.g., position the loadport door 605 to the open position 635, position the loadport door 605 to the closed position 630), turn the indicator light 610 on and off, activate and deactivate the pneumatic controller 620, the purge kit 625, the particle trap mechanism 650, and / or communicate therewith. The instructions can be stored on a computer-readable storage medium, which can include main memory, static memory, auxiliary memory, and / or a processing device (during execution of the instructions). In an embodiment, the execution of the instructions by the load port controller 615 may be performed at least in part by Figure 11The load port controller 615 may also be configured to allow a human operator or the system controller 140 to input and display data, operating commands, etc. In some embodiments, the load port controller 615 may include a radio frequency identification (RFID) system to perform automatic lot identification during the substrate loading and unloading process.

[0095] The pneumatic controller 620 can operate a pneumatic device or similar mechanism by using a pressure differential and / or a flow differential to push a flexible diaphragm connected to a mechanical valve or similar device to operate a switch, open or close a valve, move a damper, etc. For example, the pneumatic controller 620 can use compressed air or gas to operate the pneumatic device. The pneumatic device can be coupled to the load lock mechanism door 605. The pneumatic controller 620 can receive instructions from the load port controller 615 and / or be operated by the load port controller 615. For example, the load port controller 615 can command the pneumatic controller 620 to position the load port door 605 to the open position 635 and to the closed position 630.

[0096] The purge kit 625 allows the substrate carrier 122 to be purged with nitrogen (N2) or any other suitable inert gas (e.g., argon) while the electronic device manufacturing system 100 is processing the substrate carrier 122. The purge kit 625 may include one or more inter-substrate purge nozzle arrays, one or more curtain nozzle arrays, etc. The combination of gas flows from the nozzle arrays may be controlled by the load port controller 615 to achieve optimal purge of the substrate carrier 122. The platform 640 may protrude horizontally from the load port 600 and may support the placement of the substrate carrier 122.

[0097] The loadport 600 may have one or more sets of mounting holes to couple the loadport 600 to the factory interface 106. As an illustrative example, the loadport 600 may include two sets of mounting holes. For example, a first pair of mounting holes may be located at the front upper corners of the loadport 600, and a second pair of mounting holes may be located at the front lower corners of the loadport 600. In contrast, conventional loadports require three sets of mounting holes (a top set, a middle set, and a bottom set). As a result, fewer fasteners (e.g., bolts, screws, rivets, etc.) may be used to couple the loadport 600 to the wall of the factory interface 106. In some embodiments, one or more mounting brackets may be used to mount the loadport 600 to the wall of the factory interface 106. Mounting the loadport 600 may comply with SEMI standards and requirements.

[0098] like Figure 6BAs shown, the load port 600 may include a particle capture mechanism 650. The particle capture mechanism 650 may be any type of component or mechanism designed to capture particles (e.g., dust particles) generated by the movement of the load port door 605, the purge kit 625, etc. Thus, the particle capture mechanism 650 may prevent particles from the substrate carrier 122 from contaminating the factory interface 106. In some embodiments, the particle capture mechanism 650 may be positioned at or around a lower lip of the load port 600 opening. In some embodiments, the particle capture mechanism 650 may include an exhaust system. The exhaust system may direct the collected particles out of the factory interface 106 into a collection mechanism, etc.

[0099] Figure 7 FIG2 is a front view of an example door mechanism 700 according to an embodiment of the present disclosure. The door mechanism 700 can position the load port door 605 to an open position 635 and to a closed position 630. The door mechanism 700 can include an actuator 705 and a leg 710.

[0100] The actuator 705 can include one or more pneumatic devices, electromechanical drives, or similar mechanisms, wherein the pneumatic devices can use compressed air or gas to vertically slide the actuator 705 along a rod 715. The actuator 705 can be coupled to the load port door 605. In some embodiments, the pneumatic devices can slide the actuator 705 upward along the rod 715 to position the load port door 605 to the closed position 630, and can slide the actuator 705 downward along the rod 715 to position the load port door 605 to the open position 635. In some embodiments, the actuator 705 can include components that can swing the load port door 605 open (e.g., move it in an arcuate motion) from the closed portion 630 to the open position 635, and vice versa.

[0101] The pneumatic controller 620 can operate a pneumatic device by using a pressure differential and / or a flow differential to push a flexible diaphragm connected to a mechanical valve and the like to operate a switch, open or close a valve, move a damper, etc. For example, the pneumatic controller 620 can use compressed air or gas to operate the pneumatic device. The pneumatic device can be coupled to the load port door 605. The pneumatic controller 620 can receive instructions from the load port controller 615 and / or be operated by the load port controller 615. For example, the load port controller 615 can command the pneumatic controller 620 to position the load port door 605 to an open position 635 and a closed position 630.

[0102] The legs 710 may be any type of structure, such as a rack or bracket, to support movement or handling of the load port when the load port is not coupled to a factory interface. In some embodiments, the legs 710 may be optional and removable components.

[0103] In other embodiments, the load port door may be coupled to a pivot mechanism. The pivot mechanism may be attached to at least one side of the front of the load port. Once the load port is connected to the factory interface (e.g., factory interface 106), a factory interface robot (e.g., factory interface robot 126) or an actuator may detach the load port door by moving the load port door horizontally and / or vertically and / or rotating the load port door around the axis of the pivot mechanism, and position the load port door from a closed position to an open position. In embodiments, the axis may be a vertical axis or a horizontal axis. As an illustrative example, the factory interface robot or actuator may rotate the door approximately 90 degrees around the axis of the pivot mechanism. Thus, the pivot mechanism gives the load port a total height that is approximately the height of the load port door and a total width that is approximately the width of the load port. In one example, the door may translate vertically and / or horizontally to clear a path in front of the load port opening. As described above, the vertical and / or horizontal translation may be accompanied by rotation.

[0104] Figure 8 FIG2 is a perspective view of a factory interface robot 800 according to an embodiment of the present disclosure. In some embodiments, the factory interface robot 800 can be similar to the factory interface robots 126A-126B and can be located within a factory interface (e.g., the factory interface 106). The factory interface robot 800 can include a vertical tower 810, a linkage 812, and an end effector 814.

[0105] The vertical tower 810 can be a structure configured to enable the link 812 to traverse in the Z-direction (e.g., vertically up and down). The vertical tower 810 can include a vertical drive mechanism configured to provide linear movement along the z-axis to the link 812. For example, one or more links of the link 812 can be configured to be coupled to the vertical drive mechanism. In some embodiments, the vertical drive mechanism can include a belt assembly, a chain assembly, a linear drive assembly, a slide assembly, an actuator assembly, a piston assembly, any combination thereof, or any other assembly or mechanism capable of enabling the link 812 to traverse the Z-axis independently. In some embodiments, the vertical tower 810 can be coupled to a base configured to enable lateral movement of the factory interface robot 800. The base can include a horizontal drive mechanism, such as a belt assembly, a chain assembly, a linear drive assembly, a slide assembly, an actuator assembly, a piston assembly, any combination thereof, or any other assembly or mechanism capable of traversing the factory interface robot 800 laterally within the factory interface.

[0106] Link 812 may include one or more robotic links (eg, arms) coupled to each other via joints. The proximal link of link 812 (eg, Figures 9A to 9C The illustrated link 812A, which will be explained in more detail below) can be coupled to the vertical drive mechanism, while the remote link of the link 812 (e.g., Figures 9A to 9C812C) can be coupled to an end effector 814. In some embodiments, the factory interface robot 800 may include two or more end effectors coupled to a remote link. In some embodiments, one or more additional links (e.g., an intermediate link 812B) can connect the proximal link 812A to the remote link 812C. In some embodiments, the proximal link can be fixed (e.g., can only move vertically along the z-axis, but not along the x-axis or y-axis). The link and joint configuration can enable the link 812 to traverse the end effector 814 along the x-axis and y-axis. In some embodiments, the link 812 can be similar to a SCARA robot. The combination of the vertical drive mechanism and the link and joint configuration enables the factory interface robot 800 to operate in three dimensions. For example, the vertical drive mechanism may first raise or lower the connecting rod 812 and the end effector 814 to a desired height (e.g., the level of the loading lock mechanism, the level of the loading port, etc.), and the connecting rod 812 may position the end effector 814 at a desired position along the level.

[0107] Figures 9A to 9C FIG2 is a top view of a factory interface robot 800 that retrieves substrates from different substrate carriers 922A-922C, according to an embodiment of the present disclosure. The factory interface robot 800 includes linkages 812A-812C connecting a vertical tower 810 to an end effector 814. The vertical tower can position the linkages 812A-812C and the end effector 814 at a predetermined height for retrieving substrates from the substrate carriers 922A-922C. The substrate carriers 922A-922C can be similar to or identical to the substrate carrier 122. Figure 9A The factory interface robot 800 is shown retrieving a substrate 102 from the leftmost substrate carrier 922A. Specifically, the proximal link 812 is fixed, while the intermediate link 812B and the distal link 812C are positioned so that the end effector 814 can retrieve the substrate 102 from the leftmost substrate carrier 922A. Figure 9B The factory interface robot 800 is shown retrieving a substrate 102 from a central substrate carrier 922B. Specifically, the proximal link 812 is fixed, while the intermediate link 812B and the distal link 812C are positioned to enable the end effector 814 to retrieve the substrate 102 from the central substrate carrier 922B. Figure 9CThe figure shows the factory interface robot 800 retrieving a substrate 102 from the rightmost substrate carrier 922C. Specifically, the proximal link 812 is fixed, while the intermediate link 812B and the distal link 812C are positioned so that the end effector 814 can retrieve the substrate 102 from the rightmost substrate carrier 922C. Thus, as shown, due to the inclusion of a load lock mechanism within the factory interface, the combination of the z-direction motion enabled by the vertical tower 810 and the horizontal motion enabled by the links 812A to 812C enables the factory interface robot to retrieve substrates 102 from multiple substrate carriers in a compact environment.

[0108] Figure 10A 812C and the end effector 814 are positioned at a predetermined height to enable the factory interface robot 800 to transfer a substrate to another factory interface robot. As shown, the proximal link 812 is fixed, while the intermediate link 812B and the remote link 812C are positioned so that the end effector 814 can transfer the substrate 102 from the factory interface robot 800 to another factory interface robot. Thus, as shown, the combination of the z-direction motion achieved by the vertical tower 810 and the horizontal motion achieved by the links 812A-812C enables the factory interface robot to perform a pass-through operation within the factory interface.

[0109] Figure 10B FIG2 is a top view of a factory interface robot 800 retrieving a substrate from a load lock mechanism 1020B, according to an embodiment of the present disclosure. A vertical tower can position links 812A-812C and end effector 814 at a predetermined height to enable the factory interface robot 800 to retrieve (or position) one or more substrates from the load lock mechanism 1020B. As shown, the proximal link 812 is fixed, while the intermediate link 812B and the remote link 812C are positioned to enable the end effector 814 to retrieve (or position) one or more substrates from the load lock mechanism 1020B. Thus, as shown, the combination of z-direction motion achieved by the vertical tower 810 and horizontal motion achieved by the links 812A-812C enables the factory interface robot 800 to retrieve or position substrates into or from a load lock mechanism within the factory interface.

[0110] Figure 11In accordance with an embodiment of the present disclosure, a method for transferring a substrate from a substrate carrier to a factory interface is provided. At block 1110, a load port receives a substrate carrier. In one example, the substrate carrier is a FOUP. In some embodiments, the load port includes a frame adapted to connect the load port to the factory interface. The frame includes a transfer opening through which one or more substrates can be transferred between the substrate carrier and the factory interface. The load port also includes an actuator coupled to the frame and a load port door coupled to the actuator. The load port door can be configured to seal the transfer opening. The actuator is capable of positioning the load port door from a closed position to an open position and from an open position to a closed position.

[0111] At block 1120, the load port door is positioned from a closed position to an open position via a door mechanism, for example, operated by a load port controller. At block 1130, a factory interface robot positioned within the factory interface retrieves a substrate from the substrate carrier. In some embodiments, the load port controller may engage a purge kit to purge the substrate carrier with an inert gas before positioning the load port door from the closed position to the open position. In some embodiments, the factory interface robot may engage a vertical drive mechanism to position the end effector to a horizontal plane associated with the load port.

[0112] Figure 12 According to an embodiment of the present disclosure, a method for transferring a substrate from a first factory interface robot to a second factory interface robot is provided. At block 1210, the first factory robot retrieves a substrate from a substrate carrier. In one example, the substrate carrier is a FOUP. At block 1220, the first factory interface robot transfers the substrate to the second factory robot. In one example, the first factory robot and the second factory robot are positioned within the factory interface. In another example, the first factory robot is positioned within the first factory interface, and the second factory robot is positioned within the second factory interface. The first factory robot and / or the second factory robot may engage their respective vertical drive mechanisms to adjust the height of the end effector to a predetermined position associated with retrieving, transferring, or delivering the substrate. The first factory interface robot may be configured to transfer the substrate to the second factory interface robot using a pass-through area. In a first example, the pass-through area may be positioned between a front side of the factory interface and a forward side of a load lock mechanism. In a second example, the pass-through area may be a through-hole or open space within the interior space of the factory interface above one or more load lock mechanisms. In a third example, the pass-through region may be an open space or through-hole disposed between a pair of upper internal chambers and a pair of lower internal chambers of a load lock mechanism (e.g., where the load lock mechanisms are stacked load lock mechanisms). In a fourth example, the pass-through region may be an open space or through-hole disposed below one or more load lock mechanisms. The first factory interface robot may be configured to transfer the substrate to the second factory interface robot via the pass-through region.

[0113] At block 1230, the second factory interface robot places the substrate within a load lock mechanism within the factory interface. The first factory interface robot is unable to access the load lock mechanism. In one example, the second factory robot may retrieve the substrate from the load lock mechanism disposed within the factory interface. The second factory robot may then transfer the substrate to the first factory robot. The second factory interface robot may be configured to transfer the substrate to the first factory interface robot using a pass-through area. The first factory robot may then place the substrate within a substrate carrier.

[0114] The foregoing description sets forth many specific details, such as examples of specific systems, components, methods, etc., in order to better understand several embodiments of the present disclosure. However, it will be apparent to those skilled in the art that at least some embodiments of the present disclosure may be practiced without these specific details. In other cases, well-known components or methods are not described in detail, or are presented in a simple block diagram format to avoid unnecessary confusion of the present disclosure. Therefore, the specific details set forth are merely exemplary. Specific embodiments may differ from these exemplary details and are still considered to be within the scope of the present disclosure.

[0115] References in this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places in this specification do not necessarily refer to the same embodiment. In addition, the term "or" is intended to be inclusive, not exclusive. When the terms "about" or "approximately" are used herein, this means that the nominal value given is accurate to within ±10%.

[0116] Although the operations of the methods herein are shown and described in a particular order, the order of operations of each method may be changed so that certain operations are performed in a reverse order or so that certain operations are performed at least partially simultaneously with other operations. In another embodiment, instructions or sub-operations of different operations may be performed in an intermittent and / or alternating manner.

[0117] It should be understood that the above description is intended to be illustrative, not restrictive. Many other embodiments will be apparent to those skilled in the art upon reading and understanding the above description. Therefore, the scope of this disclosure should be determined with reference to the appended claims and all equivalents to which such claims are entitled.

Claims

1. A factory interface for an electronic device manufacturing system, the factory interface comprising: a first loading lock mechanism disposed within the interior space of the factory interface; and A first factory interface robot is disposed in the interior space of the factory interface, wherein: the first factory interface robot being configured to transfer substrates between a first set of substrate carriers and the first load lock mechanism; and The factory interface robot includes a vertical tower, a plurality of links, and an end effector, wherein the vertical tower includes a vertical drive mechanism configured to provide linear movement in a z-axis to the plurality of links, and a proximal link of the plurality of links is coupled to the vertical drive mechanism, and A through area is provided within the interior space of the factory interface and is located above or below the first load lock mechanism, wherein the first factory interface robot is configured to transfer the substrate to the second factory interface robot via the through area.

2. The factory interface of claim 1, wherein a remote link of the plurality of links is coupled to the end effector.

3. The factory interface of claim 1 , further comprising: a second loading lock mechanism disposed within the interior space of the factory interface; and A second factory interface robot is configured to transfer substrates between a second set of substrate carriers and the second load lock mechanism.

4. The factory interface of claim 3, wherein the first load lock mechanism is closer to the first factory interface robot than the second load lock mechanism, and the second load lock mechanism is closer to the second factory interface robot than the first load lock mechanism.

5. The factory interface of claim 3 , further comprising: a first set of loadports for receiving the first set of substrate carriers, wherein the first set of loadports are positioned to be accessible by a first factory interface robot; and A second set of loadports is configured to receive the second set of substrate carriers, wherein the second set of loadports is positioned to be accessible by a second factory interface robot.

6. The factory interface of claim 5, wherein each loadport in the first set of loadports and the second set of loadports comprises: a transfer opening through which one or more substrates can be transferred between the substrate carrier and the factory interface; an actuator coupled to the frame; and a load port door coupled to the actuator and configured to seal the transfer opening, wherein: The load port door comprises a first height; The loadport comprises a second height; and The second height is approximately twice the first height.

7. The factory interface of claim 5, further comprising: At least one of a substrate storage container, a metrology device, a server, or an air conditioning unit is located below a loadport of the first set of loadports.

8. The factory interface of claim 3, wherein the factory interface further comprises: The interior space is defined by a bottom, a top and multiple sides, wherein the multiple sides include a back side, a front side, a right side and a left side configured to face the transfer chamber of the electronic device manufacturing system, wherein the first factory interface robot is arranged in the interior space near the left side, wherein the second factory interface robot is arranged in the interior space near the right side, and wherein the first loading locking mechanism and the second loading locking mechanism are adjacent to the back side and arranged between the first factory interface robot and the second factory interface robot, so that the first loading locking mechanism is closer to the first factory interface robot than the second loading locking mechanism, and the second loading locking mechanism is closer to the second factory interface robot than the first loading locking mechanism.

9. A factory interface robot comprising: a vertical tower configured to enable the plurality of links to traverse in the z-axis; the plurality of links coupled to the vertical tower and configured to move the terminal effector along an x-axis and a y-axis; a vertical drive mechanism configured to provide linear movement in the z-axis to the plurality of links, with a proximal link of the plurality of links coupled to the vertical drive mechanism; and the end effector coupled to the plurality of links and configured to handle a substrate, wherein the factory interface robot and the load lock mechanism are disposed within an interior space of the factory interface, The substrate is transferred via a through hole, which is arranged in an internal space of the factory interface and is located above or below the loading lock mechanism.

10. The factory interface robot of claim 9, wherein the factory interface robot is configured to transfer substrates between a substrate carrier and the load lock mechanism.

11. The factory interface robot of claim 10, wherein the factory interface comprises a load port for receiving the substrate carrier, wherein the load port is positioned to be accessible by the factory interface robot.

12. The factory interface robot according to claim 9, wherein: The proximal link is in a fixed lateral position.

13. The factory interface robot of claim 9, wherein a remote link of the plurality of links is coupled to the end effector.

14. A method for transferring a substrate from a first factory interface robot to a second factory interface robot, comprising the steps of: retrieving a substrate from a substrate carrier by an end effector of the first factory interface robot; adjusting a vertical position of the end effector by a vertical drive mechanism of the first factory interface robot, wherein the vertical drive mechanism is configured to provide linear movement in a z-axis to a plurality of links, and a proximal link of the plurality of links is coupled to the vertical drive mechanism; and The substrate is transferred from the first factory interface robot to the second factory interface robot, wherein the first factory interface robot and the second factory interface robot are disposed within a factory interface.

15. The method of claim 14, further comprising placing the substrate within a load lock mechanism disposed within the factory interface via the second factory interface robot, wherein the load lock mechanism is inaccessible to the first factory interface robot. 16 . The method of claim 15 , wherein the substrate is transferred over or under the load lock mechanism via a through hole provided in an inner space of the factory interface.

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