Bonding apparatus air purification module

Abstract

The application provides a bonding equipment air purification module, which has two symmetrical inverted L-shaped folding plates distributed on the left lower side and the right lower side inside the module to separate the whole module into a main chamber, a left lower chamber and a right lower chamber. The left lower chamber and the right lower chamber are used for accommodating electric cabinets, and the main chamber is used for accommodating the bonding equipment. The inverted L-shaped folding plate comprises a horizontal porous plate and a vertical side plate. There is a gap between the side of the bonding equipment and the vertical side plate. The bonding equipment air purification module is additionally provided with a first flow guide plate and a second flow guide device. One side of the first flow guide plate is fixed on the edge of the horizontal porous plate, and the other side is abutted against the side wall of the bonding equipment. The first flow guide plate is at an angle with the horizontal porous plate and is obliquely arranged above the gap. The second flow guide device is fixed on the horizontal porous plate to guide the purified gas to the left lower chamber or the right lower chamber, and the side of the second flow guide device is attached to the side wall of the bonding equipment air purification module.

Description

Technical Field

[0001] This invention relates to semiconductor devices, and more particularly to an air purification module for improving airflow uniformity in bonding devices. Background Technology

[0002] Semiconductor equipment, especially bonding equipment, demands extremely high measurement precision. Existing bonding equipment commonly uses flow equalization devices such as FFUs (Fan Filter Units) to generate downward airflow to purify the air inside the bonding equipment. Due to the internal structural characteristics of the bonding equipment, uneven airflow and localized eddies can occur, which can interfere with the precision measurements of the machine.

[0003] Therefore, there is an urgent need for an air purification solution for bonding equipment to improve the uniformity of the airflow field inside the bonding equipment. Summary of the Invention

[0004] To improve the measurement accuracy of the machine tool, this invention proposes an air purification module for bonding equipment.

[0005] The bonding device's air purification module has two symmetrically distributed inverted L-shaped folding plates on the lower left and lower right sides, which divide the entire module's interior into the main cavity, the lower left chamber, and the lower right chamber.

[0006] The lower left chamber and the lower right chamber are used to house the electrical cabinet, and the main chamber is used to house the bonding equipment.

[0007] The inverted L-shaped folding plate includes a horizontal perforated plate and a vertical side plate.

[0008] There is a gap between the side of the bonding device and the vertical side plate.

[0009] The bonding device's air purification module also includes a first guide plate and a second guide device.

[0010] One side of the first guide plate is fixed to the edge of the horizontal perforated plate, and the other side rests against the side wall of the bonding device; the first guide plate is at an angle to the horizontal perforated plate and obliquely covers the gap.

[0011] The second flow guiding device is fixed on the horizontal porous plate to guide the purified gas to the lower left chamber or the lower right chamber, and the side of the second flow guiding device is attached to the side wall of the bonding equipment air purification module.

[0012] In one embodiment, the second flow guiding device includes a side plate and a plurality of vertically arranged flow guiding plates. The plurality of flow guiding plates are identical in shape and are arranged at equal intervals along the longitudinal direction. The interval between the flow guiding plates allows purified gas to pass through the holes in the horizontal perforated plate into the electrical cabinet.

[0013] In one embodiment, the longitudinal cross-sectional shape of the second flow guiding device is the same as the shape of the flow guiding plate. The shape of the flow guiding plate is similar to a right triangle, with one of its two right-angled sides fixed to the horizontal perforated plate and the other fixed to the side plate. The difference between the shape of the flow guiding plate and the right triangle is that the right angle is replaced by two sides with an obtuse angle.

[0014] In one embodiment, the lower left chamber is formed by the left side wall of the bonding device air purification module and the inverted L-shaped folding plate located on the lower left side; the lower right chamber is formed by the right side wall of the bonding device air purification module and the inverted L-shaped folding plate located on the lower right side.

[0015] In one embodiment, the bonding device air purification module has an air inlet at the top, and a fan filter unit is provided above the air inlet to generate the purified gas.

[0016] In one embodiment, the bottom of the bonding device air purification module is provided with an air outlet, and an exhaust device is provided below the air outlet to generate negative pressure.

[0017] In one embodiment, the air outlet is located at the bottom of the lower left chamber and the lower right chamber.

[0018] In one embodiment, the angle is greater than zero degrees and less than ninety degrees.

[0019] In one embodiment, when the purified gas is blown into the air purification module of the bonding device, the purified gas cannot enter the gap.

[0020] In one embodiment, the electrical cabinet has a plurality of electrical components that provide the functional requirements for the bonding equipment.

[0021] This invention solves the problem of large velocity gradient changes between the bonding equipment and the frame by tilting a first guide plate above the gap and connecting a second guide device above the perforated plate. It also reduces the occurrence of airflow vortices at the plane perpendicular to the airflow direction of the bonding equipment and increases negative pressure at the lower outlet of the bonding equipment to effectively improve the uniformity of the airflow field below the perforated plate. Attached Figure Description

[0022] The above-described invention and the following detailed description will be better understood when read in conjunction with the accompanying drawings. It should be noted that the drawings are merely examples of the claimed invention. In the drawings, the same reference numerals represent the same or similar elements.

[0023] Figure 1 An air purification module for a bonding device according to an embodiment of the present invention is shown;

[0024] Figure 2 This diagram shows a partial enlarged view of an air purification module of a bonding device according to an embodiment of the present invention;

[0025] Figure 3 A schematic diagram of the structure of a second flow guiding device according to an embodiment of the present invention is shown. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0029] It is understood that although terms such as “first,” “second,” “third,” etc., may be used here to describe various pipes, channels, components, areas, layers, and / or parts, these components, areas, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different pipes, channels, components, areas, layers, and / or parts.

[0030] The following detailed description of the features and advantages of the present invention is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly. Furthermore, based on the specification, claims and drawings disclosed herein, those skilled in the art can easily understand the related objects and advantages of the present invention.

[0031] The existing air purification modules have a gap between the perforated plate and the bonding equipment, resulting in a large velocity gradient and eddies in the airflow field, leading to uneven airflow velocity distribution. Furthermore, the lower outlet of the existing bonding equipment is mostly at normal ambient pressure, which can cause turbulence when there are many components below the perforated plate. This invention aims to solve the problem of large velocity gradient changes between the bonding equipment and the frame, reduce airflow eddies in the plane perpendicular to the airflow direction, and effectively improve the uniformity of the airflow field below the perforated plate by adding negative pressure at the lower outlet of the frame.

[0032] Figure 1 An air purification module for a bonding device according to an embodiment of the present invention is shown.

[0033] The air purification module has an air inlet 101 on top. Above the air inlet 101 is a fan filter unit (FFU) (not shown), which is used to generate purified gas.

[0034] The air purification module of the bonding device has two inverted L-shaped folds on the lower part of its interior, which divide the entire module into a main chamber, a lower left chamber, and a lower right chamber.

[0035] The lower left chamber is enclosed by the left side wall of the bonding equipment air purification module and the inverted L-shaped folding plate on the lower left side. The lower right chamber is enclosed by the right side wall of the bonding equipment air purification module and the inverted L-shaped folding plate on the lower right side. The lower left and lower right chambers are used to house the electrical cabinet 103. The main chamber is used to house the bonding equipment 102.

[0036] The inverted L-shaped folding plate includes a horizontal perforated plate 104 and a vertical side plate 105.

[0037] There is a gap 106 between the side and the vertical side plate of the bonding device 102. In the prior art, due to the presence of the gap 106, the wind speed change gradient in the flow field is large and eddies exist, resulting in uneven wind speed distribution in the airflow field.

[0038] The bonding equipment's air purification module contains two first guide plates 107, one on the left and one on the right. One side of each first guide plate 107 is fixed to the edge of a horizontal perforated plate 104, and the other side rests against the side wall of the bonding equipment 102. The first guide plate 107 forms an angle with the horizontal perforated plate 104, obliquely covering the gap 106. When purified gas is blown into the bonding equipment's air purification module, the purified gas cannot enter the gap 106. In one embodiment, this angle is greater than zero degrees and less than ninety degrees.

[0039] The air purification frame is also equipped with two second flow guiding devices 108, which are mounted on a horizontal perforated plate 104 to guide the purified gas to the lower left or lower right chamber. The side of the second flow guiding device 108 is attached to the side wall of the air purification module of the bonding equipment.

[0040] The air purification module of the bonding device has an air outlet 109 at its bottom. In one embodiment, the air outlet 109 is located at the bottom of the lower left chamber and the lower right chamber.

[0041] The air purification module of the bonding device has an exhaust device (not shown) below the air outlet 109 to generate negative pressure. The lower outlet of existing devices is mostly at normal ambient pressure. When there are many components in the space below the perforated plate, the airflow field will be turbulent. Increasing the negative pressure at the lower outlet of the device can effectively improve the uniformity of the airflow field below the perforated plate.

[0042] Figure 2 An enlarged view of a portion of the air purification module of a bonding device according to an embodiment of the present invention is shown.

[0043] The longitudinal section of the second flow guiding device 108 is as follows: Figure 2 As shown, the longitudinal section resembles a right triangle, but the right angle is replaced by two sides 111 and 112 with an obtuse angle. This is done to solve the problem of airflow vortices in the right-angle region.

[0044] The electrical cabinet has multiple electrical components 110 that provide functionality for the bonding equipment 102. These electrical components 110 include, but are not limited to, power adapters, power supplies, motor drivers, valve islands, and other devices.

[0045] Figure 3 A schematic diagram of a second flow guiding device according to an embodiment of the present invention is shown. The second flow guiding device adopts a combined longitudinal and transverse approach. Multiple longitudinal flow guiding plates ensure uniform longitudinal airflow, while the transverse approach uses two inclined sections to transition into right-angled regions prone to vortex formation. Specifically, the second flow guiding device 108 includes a side plate and multiple vertically arranged flow guiding plates 301. These flow guiding plates 301 are identical in shape and arranged at equal intervals along the longitudinal direction. The spacing between the flow guiding plates allows purified gas to pass through the holes in the perforated plate into the electrical cabinet.

[0046] Combination Figure 2 and Figure 3 As shown, the longitudinal cross-sectional shape of the second flow guiding device 108 is the same as the shape of each flow guiding plate. Each flow guiding plate 301 is shaped like a right triangle, with one of the two right-angled sides fixed to the horizontal perforated plate and the other fixed to the side plate. The difference between the shape of the flow guiding plate 301 and the triangle is that the right angle is replaced by two sides with an obtuse angle.

[0047] This invention proposes an air purification module for bonding equipment. The air purification module has two inverted L-shaped folding plates symmetrically distributed on the lower left and lower right sides, dividing the entire module interior into a main chamber, a lower left chamber, and a lower right chamber.

[0048] The lower left chamber and the lower right chamber are used to house the electrical cabinet, and the main chamber is used to house the bonding equipment.

[0049] The inverted L-shaped folding plate includes a horizontal perforated plate and a vertical side plate.

[0050] There is a gap between the side of the bonding device and the vertical side plate.

[0051] The bonding device's air purification module also includes a first guide plate and a second guide device.

[0052] One side of the first guide plate is fixed to the edge of the horizontal perforated plate, and the other side rests against the side wall of the bonding device; the first guide plate is at an angle to the horizontal perforated plate and obliquely covers the gap.

[0053] The second flow guiding device is fixed on the horizontal porous plate to guide the purified gas to the lower left chamber or the lower right chamber, and the side of the second flow guiding device is attached to the side wall of the bonding equipment air purification module.

[0054] In one embodiment, the second flow guiding device includes a side plate and a plurality of vertically arranged flow guiding plates. The plurality of flow guiding plates are identical in shape and are arranged at equal intervals along the longitudinal direction. The interval between the flow guiding plates allows purified gas to pass through the holes in the horizontal perforated plate into the electrical cabinet.

[0055] In one embodiment, the longitudinal cross-sectional shape of the second flow guiding device is the same as the shape of the flow guiding plate. The shape of the flow guiding plate is similar to a right triangle, with one of its two right-angled sides fixed to the horizontal perforated plate and the other fixed to the side plate. The difference between the shape of the flow guiding plate and the right triangle is that the right angle is replaced by two sides with an obtuse angle.

[0056] In one embodiment, the lower left chamber is formed by the left side wall of the bonding device air purification module and the inverted L-shaped folding plate located on the lower left side; the lower right chamber is formed by the right side wall of the bonding device air purification module and the inverted L-shaped folding plate located on the lower right side.

[0057] In one embodiment, the bonding device air purification module has an air inlet at the top, and a fan filter unit is provided above the air inlet to generate the purified gas.

[0058] In one embodiment, the bottom of the bonding device air purification module is provided with an air outlet, and an exhaust device is provided below the air outlet to generate negative pressure.

[0059] In one embodiment, the air outlet is located at the bottom of the lower left chamber and the lower right chamber.

[0060] In one embodiment, the angle is greater than zero degrees and less than ninety degrees.

[0061] In one embodiment, when the purified gas is blown into the air purification module of the bonding device, the purified gas cannot enter the gap.

[0062] In one embodiment, the electrical cabinet has a plurality of electrical components that provide the functional requirements for the bonding equipment.

[0063] This invention solves the problem of large velocity gradient changes between the bonding equipment and the frame by tilting a first guide plate above the gap and connecting a second guide device above the perforated plate, thus reducing the occurrence of airflow vortices at the plane perpendicular to the airflow direction of the bonding equipment. Furthermore, adding negative pressure at the lower outlet of the bonding equipment effectively improves the uniformity of the airflow field below the perforated plate.

[0064] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0065] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0066] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0067] The terminology and expressions used herein are for descriptive purposes only, and the invention should not be limited to these terms and expressions. The use of these terms and expressions does not imply the exclusion of any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various modifications that may exist should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.

[0068] Similarly, it should be noted that although the present invention has been described with reference to the specific embodiments described above, those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, any changes or modifications to the above embodiments within the scope of the essential spirit of the present invention will fall within the scope of the claims of this application.

Claims

1. An air purification module for a bonding device, characterized in that, The bonding device air purification module has two inverted L-shaped folding plates symmetrically distributed on the lower left and lower right sides to divide the entire module into a main chamber, a lower left chamber, and a lower right chamber. The lower left chamber and the lower right chamber are used to house the electrical cabinet, and the main chamber is used to house the bonding equipment. The inverted L-shaped folding plate includes a horizontal perforated plate and a vertical side plate; There is a gap between the side of the bonding device and the vertical side plate; The bonding equipment air purification module is also equipped with a first guide plate and a second guide device. One side of the first guide plate is fixed to the edge of the horizontal porous plate, and the other side rests against the side wall of the bonding device; the first guide plate is at an angle to the horizontal porous plate and obliquely covers the gap. The second flow guiding device is fixed on the horizontal porous plate to guide the purified gas to the lower left chamber or the lower right chamber, and the side of the second flow guiding device is attached to the side wall of the bonding equipment air purification module.

2. The air purification module for the bonding equipment as described in claim 1, characterized in that, The second flow guiding device includes a side plate and multiple vertically arranged flow guiding plates. The multiple flow guiding plates are identical in shape and are arranged at equal intervals along the longitudinal direction. The interval between the flow guiding plates allows the purified gas to pass through the holes in the horizontal perforated plate into the electrical cabinet.

3. The air purification module for the bonding equipment as described in claim 2, characterized in that, The longitudinal cross-sectional shape of the second flow guiding device is the same as that of the flow guiding plate. The flow guiding plate is similar to a right triangle, with one of its two right-angled sides fixed to the horizontal perforated plate and the other fixed to the side plate. The difference between the shape of the flow guiding plate and the right triangle is that the right angle is replaced by two sides with an obtuse angle.

4. The air purification module for the bonding equipment as described in claim 1, characterized in that, The lower left chamber is formed by the left side wall of the bonding equipment air purification module and the inverted L-shaped folding plate located on the lower left side; the lower right chamber is formed by the right side wall of the bonding equipment air purification module and the inverted L-shaped folding plate located on the lower right side.

5. The air purification module for the bonding equipment as described in claim 1, characterized in that, The bonding device air purification module has an air inlet at the top, and a fan filter unit is located above the air inlet to generate the purified gas.

6. The air purification module for the bonding equipment as described in claim 1, characterized in that, The bonding device air purification module has an air outlet at its bottom, and an exhaust device is located below the air outlet to generate negative pressure.

7. The air purification module for the bonding equipment as described in claim 6, characterized in that, The air outlet is located at the bottom of the lower left chamber and the lower right chamber.

8. The air purification module for the bonding equipment as described in claim 1, characterized in that, The angle is in the range of greater than zero degrees and less than ninety degrees.

9. The air purification module for the bonding equipment as described in claim 1, characterized in that, When the purified gas is blown into the air purification module of the bonding device, the purified gas cannot enter the gap.

10. The air purification module for the bonding equipment as described in claim 1, characterized in that, The electrical cabinet has multiple electrical components that provide the functional requirements for the bonding equipment.

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