Preparation method and system of high-purity fused silica micro powder for chip packaging

Abstract

This invention relates to the field of silicon micropowder technology, and discloses a method and system for preparing high-purity fused silicon micropowder for chip packaging. The system includes a preparation chamber with an inlet at the top and an outlet on one side wall. A feeding track is located within the preparation chamber, similar to the inlet. A rectangular loop frame is fixedly connected to the inner wall of the preparation chamber. In this invention, a high-purity fused silica block is placed into the preparation chamber through the inlet. The block enters the protrusion formed by the rectangular loop frame and the rectangular groove via the feeding track. A motor is then started, driving a transmission mechanism. This mechanism drives a slide rail, which in turn moves a sliding mechanism via a telescopic rod. The sliding mechanism then drives a limiting plate to rise and limit the high-purity fused silica block, causing it to adhere to a grinding disc for powder preparation. This method is practical and suitable for widespread application.

Description

Technical Field

[0001] This invention belongs to the field of silicon micropowder technology, specifically, it relates to a method and system for preparing high-purity molten silicon micropowder for chip packaging. Background Technology

[0002] Fused silica micropowder is an amorphous SiO2 formed by melting and cooling natural quartz (SiO2) at high temperatures. It is then processed through multiple steps including crushing, ball milling (or vibration / air jet milling), flotation, acid washing purification, and high-purity water treatment. It possesses not only excellent physical properties but also superior chemical properties: it does not chemically react with organic components, exhibits certain mechanical strength, good thermal stability and thermal shock resistance, a low coefficient of thermal expansion, and a high specific surface area. In the field of functional silica fillers, fused silica micropowder has unique advantages. Its main component is SiO2, which has an amorphous structure, ultrafine particles, and a large specific surface area.

[0003] However, during the manufacturing of existing fused silica micropowder, gaps may occur between the high-purity fused silica block and the grinding disc during the grinding process, resulting in low grinding efficiency of the high-purity fused silica block.

[0004] In view of this, the present invention is proposed. Summary of the Invention

[0005] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by the present invention is as follows:

[0006] A high-purity fused silicon micropowder preparation system for chip packaging includes a preparation chamber with an inlet at the top and an outlet on one side wall. A feeding track is located below the inlet within the preparation chamber's interior. A rectangular loop frame is fixedly connected to the inner wall of the preparation chamber. A rectangular groove is formed within the rectangular loop frame, and a grinding disc is located within the groove. Electromagnets are positioned on opposite side walls below the rectangular loop frame. A limit mechanism is located within the rectangular groove, and a transmission mechanism is located within the preparation chamber to drive the limit mechanism to move. By placing the high-purity fused silica block into the inner cavity of the preparation box through the feed inlet, the high-purity fused silica block can enter the boss formed by the rectangular loop frame and the rectangular groove from the feeding track. At this time, by starting the motor, the transmission mechanism is driven to run. The transmission mechanism drives the rack to move. When the rack moves, it can drive the sliding mechanism to move through the telescopic rod. The sliding mechanism can drive the limiting plate to rise and limit the high-purity fused silica block, and drive the high-purity fused silica block to fit with the grinding disc to make powder.

[0007] In a preferred embodiment of the present invention, the transmission mechanism includes a motor, a rotating rod fixedly mounted at the output end of the motor, the rotating rod movably passing through one side wall of the preparation chamber, a grinding disc fixedly connected in the middle of the rotating rod, and the other end of the rotating rod movably connected to the inner wall of the preparation chamber. The installation position and components of the transmission mechanism are thus determined.

[0008] In a preferred embodiment of the present invention, the transmission mechanism further includes two half-gears, which are fixedly mounted on the rotating rod. Both half-gears are located on the inner wall of the preparation chamber opposite to the grinding disc, and racks are meshed below each half-gear. This determines the installation position and components of the transmission mechanism.

[0009] In a preferred embodiment of the present invention, the inner wall of the preparation box is provided with two mutually symmetrical slide rails. Each of the two slide rails is equipped with a rack, and each rack has a telescopic rod at its bottom. The other end of each telescopic rod is mounted on a sliding mechanism. This determines the installation position and components of the slide rails.

[0010] In a preferred embodiment of the present invention, the limiting mechanism includes a connecting rod, a limiting plate fixedly installed in the middle of the connecting rod, and both ends of the connecting rod connected to a sliding mechanism. The limiting plate movably passes through a rectangular groove. This determines the installation position and components of the limiting mechanism.

[0011] In a preferred embodiment of the present invention, the sliding mechanism includes two inclined slide grooves, which are symmetrical to each other. A slider is slidably mounted inside the inner cavity of each of the two inclined slide grooves. A connecting rod is fixedly mounted at one opposite end of each slider, and a telescopic rod is fixedly mounted above each slider. This determines the installation position and components of the sliding mechanism.

[0012] A method for preparing high-purity fused silica micropowder for chip packaging includes the following steps: placing a high-purity fused silica block into the inner cavity of the preparation chamber through the feed inlet; the high-purity fused silica block enters the protrusion formed by the rectangular loop frame and the rectangular groove from the feeding track; at this time, the motor is started, and the motor drives the rotating rod to rotate, which drives the grinding disc and the half gear to rotate; because a rack is meshed below the half gear, the rack can move back and forth with the assistance of the slide rail; when the rack moves, it drives the sliding mechanism to move through the telescopic rod; when the slider in the sliding mechanism moves, it drives the limiting plate to rise to limit the high-purity fused silica block, and drives the high-purity fused silica block to adhere to the grinding disc for powder preparation.

[0013] Compared with the prior art, the present invention has the following advantages:

[0014] In this invention, a high-purity fused silica block is placed into the inner cavity of the preparation chamber through the feed inlet. The high-purity fused silica block can enter the protrusion formed by the rectangular loop frame and the rectangular groove from the feeding track. At this time, the motor is started to drive the transmission mechanism to run. The transmission mechanism drives the rack to move. When the rack moves, it can drive the sliding mechanism to move through the telescopic rod. The sliding mechanism can drive the limiting plate to rise and limit the high-purity fused silica block, and drive the high-purity fused silica block to adhere to the grinding disc for powder making.

[0015] The specific embodiments of the present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0016] In the attached diagram:

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a cross-sectional view (I) of the present invention.

[0019] Figure 3 This is a cross-sectional view (II) of the present invention.

[0020] In the diagram: 1. Preparation box; 2. Feed inlet; 3. Motor; 4. Discharge outlet; 5. Feeding track; 6. Grinding disc; 7. Rotating rod; 8. Rectangular loop frame; 9. Rectangular groove; 10. Limiting plate; 11. Electromagnet; 12. Connecting rod; 13. Slider; 14. Inclined slide; 15. Telescopic rod; 16. Rack; 17. Half gear; 18. Slide rail. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention.

[0022] like Figures 1 to 3As shown, the high-purity fused silicon micropowder preparation system for chip packaging includes a preparation box 1, an inlet 2 at the top of the preparation box 1, an outlet 4 on one side wall of the preparation box 1, a feeding track 5 below the inlet 2 in the inner cavity of the preparation box 1, a rectangular loop frame 8 in the inner cavity of the preparation box 1, the rectangular loop frame 8 being fixedly connected to the inner wall of the preparation box 1, a rectangular groove 9 in the rectangular loop frame 8, a grinding disc 6 in the inner cavity of the rectangular groove 9, electromagnets 11 on opposite side walls below the rectangular loop frame 8, a limit mechanism in the inner cavity of the rectangular groove 9, and a transmission mechanism in the inner cavity of the preparation box 1 for driving the limit mechanism to move. By placing the high-purity fused silica block from the feed inlet 2 into the inner cavity of the preparation box 1, the high-purity fused silica block can enter the boss formed by the rectangular loop frame 8 and the rectangular groove 9 from the feeding track 5. At this time, by starting the motor 3, the transmission mechanism is driven to run. The transmission mechanism drives the rack 16 to move. When the rack 16 moves, it can drive the sliding mechanism to move through the telescopic rod 15. The sliding mechanism can drive the limiting plate 10 to rise and limit the high-purity fused silica block, and drive the high-purity fused silica block to adhere to the grinding disc 6 to make powder.

[0023] The transmission mechanism includes a motor 3, with a rotating rod 7 fixedly mounted at the output end of the motor 3. The rotating rod 7 movably passes through one side wall of the preparation chamber 1, with a grinding disc 6 fixedly connected in the middle of the rotating rod 7, and the other end of the rotating rod 7 movably connected to the inner wall of the preparation chamber 1. In this setup, the installation position and components of the transmission mechanism are determined.

[0024] The transmission mechanism also includes two half-gears 17, which are fixedly mounted on the rotating rod 7. Both half-gears 17 are located on the inner wall of the preparation box 1, opposite to the grinding disc 6. Racks 16 are meshed below each half-gear 17. In this configuration, the installation position and components of the transmission mechanism are determined.

[0025] The inner wall of the preparation box 1 is provided with two symmetrical slide rails 18. Each slide rail 18 is equipped with a rack 16, and each rack 16 has a telescopic rod 15 at its bottom. The other end of each telescopic rod 15 is attached to a sliding mechanism. In this design, the installation position and components of the slide rails 18 are determined.

[0026] The limiting mechanism includes a connecting rod 12, with a limiting plate 10 fixedly installed in the middle of the connecting rod 12. Both ends of the connecting rod 12 are connected to a sliding mechanism, and the limiting plate 10 movably passes through the rectangular groove 9. In this design, the installation position and components of the limiting mechanism are defined.

[0027] The sliding mechanism includes two inclined slide grooves 14, which are symmetrical to each other. Slider blocks 13 are slidably mounted inside the inner cavities of the two inclined slide grooves 14. Connecting rods 12 are fixedly mounted at opposite ends of the two sliders 13, and telescopic rods 15 are fixedly mounted above the two sliders 13. In this configuration, the installation position and components of the sliding mechanism are determined.

[0028] The implementation principle of the high-purity fused silica micropowder preparation system for chip packaging in this embodiment is as follows: First, a high-purity fused silica block is placed into the inner cavity of the preparation chamber 1 through the feed inlet 2. The high-purity fused silica block can enter the protrusion formed by the rectangular loop frame 8 and the rectangular groove 9 from the feeding track 5. At this time, the motor 3 is started, and the motor 3 can drive the rotating rod 7 to rotate. The rotating rod 7 can drive the grinding disc 6 and the half gear 17 to rotate. Because the rack 16 is meshed below the half gear 17, it can drive the rack 16 to move back and forth with the assistance of the slide rail 18. When the rack 16 moves, it can drive the sliding mechanism to move through the telescopic rod 15. When the slider 13 in the sliding mechanism moves, it can drive the limiting plate 10 to rise and limit the high-purity fused silica block, driving the high-purity fused silica block to adhere to the grinding disc 6 for powder preparation. The above embodiments only express some implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept, and these all fall within the scope of protection of this invention. Therefore, the scope of protection of this invention should be determined by the appended claims. The embodiments to be protected in this application include:

[0029] A high-purity fused silicon micropowder preparation system for chip packaging includes a preparation chamber with an inlet at the top and an outlet on one side wall. A feeding track is located below the inlet within the preparation chamber's interior. A rectangular loop frame is fixedly connected to the inner wall of the preparation chamber. A rectangular groove is formed within the rectangular loop frame, and a grinding disc is located within the groove. Electromagnets are positioned on opposite side walls below the rectangular loop frame. A limit mechanism is located within the rectangular groove, and a transmission mechanism is located within the preparation chamber to drive the limit mechanism to move. By placing the high-purity fused silica block into the inner cavity of the preparation box through the feed inlet, the high-purity fused silica block can enter the boss formed by the rectangular loop frame and the rectangular groove from the feeding track. At this time, by starting the motor, the transmission mechanism is driven to run. The transmission mechanism drives the rack to move. When the rack moves, it can drive the sliding mechanism to move through the telescopic rod. The sliding mechanism can drive the limiting plate to rise and limit the high-purity fused silica block, and drive the high-purity fused silica block to fit with the grinding disc to make powder.

[0030] Preferably, the transmission mechanism includes a motor, with a rotating rod fixedly mounted at the motor's output end. The rotating rod movably passes through one side wall of the preparation chamber, a grinding disc is fixedly connected to the middle of the rotating rod, and the other end of the rotating rod is movably connected to the inner wall of the preparation chamber. This determines the installation position and components of the transmission mechanism.

[0031] Preferably, the transmission mechanism further includes two half-gears, which are fixedly mounted on the rotating rod. Both half-gears are located on the inner wall of the preparation chamber opposite to the grinding disc, and racks are meshed below each half-gear. This determines the installation position and components of the transmission mechanism.

[0032] Preferably, the inner wall of the preparation box is provided with two symmetrical slide rails, each slide rail is equipped with a rack, and each rack has a telescopic rod at its bottom. The other end of each telescopic rod is attached to a sliding mechanism. This determines the installation position and components of the slide rails.

[0033] Preferably, the limiting mechanism includes a connecting rod, a limiting plate fixedly installed in the middle of the connecting rod, and both ends of the connecting rod connected to a sliding mechanism. The limiting plate movably passes through the rectangular groove. This determines the installation position and components of the limiting mechanism.

[0034] Preferably, the sliding mechanism includes two inclined slide grooves, which are symmetrical to each other. A slider is slidably mounted inside the inner cavity of each of the two inclined slide grooves. A connecting rod is fixedly mounted at one opposite end of each slider, and a telescopic rod is fixedly mounted above each slider. The above embodiments only illustrate some implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the appended claims.

[0035] A method for preparing high-purity fused silica micropowder for chip packaging includes the following steps: placing a high-purity fused silica block into the inner cavity of the preparation chamber through the feed inlet; the high-purity fused silica block enters the protrusion formed by the rectangular loop frame and the rectangular groove from the feeding track; at this time, the motor is started, and the motor drives the rotating rod to rotate, which drives the grinding disc and the half gear to rotate; because a rack is meshed below the half gear, the rack can move back and forth with the assistance of the slide rail; when the rack moves, it drives the sliding mechanism to move through the telescopic rod; when the slider in the sliding mechanism moves, it drives the limiting plate to rise to limit the high-purity fused silica block, and drives the high-purity fused silica block to adhere to the grinding disc for powder preparation.

[0036] The embodiments described above are merely partial examples of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A high-purity molten silicon micropowder preparation system for chip packaging, comprising a preparation chamber (1), characterized in that, The preparation box (1) has a feed inlet (2) at the top and a discharge outlet (4) on one side wall. The preparation box (1) has a feeding track (5) below the feed inlet (2) in its inner cavity. The preparation box (1) has a rectangular loop frame (8) in its inner cavity. The rectangular loop frame (8) is fixedly connected to the inner wall of the preparation box (1). The rectangular loop frame (8) has a rectangular groove (9) in its inner cavity. The rectangular groove (9) has a grinding disc (6) in its inner cavity. Electromagnets (11) are provided on the opposite side walls below the rectangular loop frame (8). The rectangular groove (9) has a limiting mechanism in its inner cavity. The preparation box (1) has a transmission mechanism in its inner cavity. The transmission mechanism is used to drive the limiting mechanism to move. The transmission mechanism includes a motor (3), and a rotating rod (7) is fixedly installed at the output end of the motor (3). The rotating rod (7) is movably inserted through one side wall of the preparation box (1). A grinding disc (6) is fixedly connected in the middle of the rotating rod (7), and the other end of the rotating rod (7) is movably connected to the inner wall of the preparation box (1). The transmission mechanism also includes two half gears (17), each half gear (17) having one tooth. The two half gears (17) are fixedly installed on the rotating rod (7). Both half gears (17) are located on the inner wall of the preparation box (1) and on the side opposite to the grinding disc (6). Racks (16) are meshed and installed below each of the two half gears (17). The inner wall of the preparation box (1) is provided with two mutually symmetrical slide rails (18), each of the two slide rails (18) is equipped with a rack (16), and each of the two racks (16) is provided with a telescopic rod (15) at the bottom, and the other end of each of the two telescopic rods (15) is provided on a sliding mechanism; The limiting mechanism includes a connecting rod (12), a limiting plate (10) is fixedly installed in the middle of the connecting rod (12), the two ends of the connecting rod (12) are respectively connected to the sliding mechanism, and the limiting plate (10) movably passes through the rectangular groove (9); The sliding mechanism includes two inclined slide grooves (14), which are symmetrical to each other. A slider (13) is slidably installed in the inner cavity of the two inclined slide grooves (14). A connecting rod (12) is fixedly installed at one end of the two sliders (13) opposite to each other. A telescopic rod (15) is fixedly installed above the two sliders (13).

2. A method for preparing high-purity fused silica micropowder for chip packaging, said preparation method being based on the high-purity fused silica micropowder preparation system for chip packaging as described in claim 1, characterized in that, The process includes the following steps: placing a high-purity fused silica block into the preparation chamber through the feed inlet; the high-purity fused silica block entering the boss formed by the rectangular loop frame and rectangular groove from the feeding track; starting the motor, which drives the rotating rod to rotate; the rotating rod drives the grinding disc and the half gear to rotate; because a rack is meshed below the half gear, the rack can move back and forth with the assistance of the slide rail; when the rack moves, it drives the sliding mechanism to move through the telescopic rod; when the slider in the sliding mechanism moves, it drives the limiting plate to rise and limit the high-purity fused silica block, driving the high-purity fused silica block to adhere to the grinding disc for powder preparation.

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