A wafer surface scratch defect detection method, device, medium and system

By identifying and merging connected domains on the wafer surface, the problem of low efficiency and poor accuracy in detecting scratch defects on the wafer surface in existing technologies has been solved, achieving efficient and accurate defect identification.

CN117350988BActive Publication Date: 2026-05-29XIAN ENA TESTING TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
XIAN ENA TESTING TECH CO LTD
Filing Date
2023-10-27
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing methods for detecting surface scratches on wafers rely on manual observation, which results in low detection efficiency, high labor costs, and susceptibility to subjective factors of inspectors, making it difficult to accurately identify minor scratches.

Method used

By acquiring images of the wafer region of interest based on multiple original images, the connected domains are identified and divided into first and second connected domains. The defect region to be tested is generated by merging the connected domain feature values ​​and distance and orientation differences, and the defect type is identified.

Benefits of technology

It improves the accuracy of identifying scratch defects on wafer surfaces, reduces manual intervention, and improves detection efficiency and accuracy.

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Abstract

The present disclosure discloses a wafer surface scratch defect detection method, device, medium and system, which belongs to the technical field of semiconductor manufacturing and comprises the following steps: based on a plurality of original images of a wafer to be detected, an image of a wafer region of interest of the wafer to be detected is obtained, and a plurality of connected domains are segmented; the plurality of connected domains are divided into first connected domains or second connected domains; for the first connected domains, the types of defects in the first connected domains are identified according to the characteristic values of the connected domains; for the second connected domains, corresponding third connected domains are determined, and the second connected domains and the corresponding third connected domains are merged to generate corresponding defect regions to be detected; and the types of defects are identified according to the characteristic values of the defect regions to be detected. The first connected domains and the second connected domains with discontinuous possibilities are identified in the connected domains in the wafer surface image to be detected, and the second connected domains after merging form the final defect regions to be detected; and the types of defects are identified based on the finally determined defect regions to be detected, thereby improving the scratch defect identification accuracy.
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