An electronic device, a server, and a server system

Abstract

An electronic device, a server and a server system, the device comprising a shell, a circuit board, a cooling liquid pipeline and at least one spraying device; the circuit board, the cooling liquid pipeline and the at least one spraying device are located in the shell, and the shell is provided with a liquid inlet and a power supply port; the circuit board is provided with at least one electronic device and a power supply module, the power supply module is used for supplying power to the at least one electronic device; the cooling liquid pipeline is communicated with the liquid inlet and the at least one spraying device, and is used for inputting cooling liquid to the at least one spraying device; the cooling liquid pipeline is also communicated with the power supply port and the power supply module, and is used for supplying power to the power supply module; the at least one spraying device is used for spraying the cooling liquid to the electronic device. The cooling liquid pipeline, as a carrier of the cooling liquid, also serves as a power supply circuit of the electronic device, can meet the heat dissipation demand of high-power chips and high-density cabinets, and also improves the server power supply bottleneck problem.

Description

Technical Field

[0001] This invention relates to the field of servers, and more particularly to an electronic device, a server, and a server system. Background Technology

[0002] With the rise of big data, cloud computing, and artificial intelligence (AI), the computing demands on data centers and servers are increasing, leading to a continuous rise in the power density inside servers. The power of various processor chips (X Processing Unit, XPU) has reached 300-500W or even higher, and the current density of printed circuit boards (PCBs) is approaching its limit, posing a huge challenge to server power supply. Summary of the Invention

[0003] This invention provides an electronic device, server, and server system that simplifies circuit structure, saves space, and improves power supply capacity, meeting the power supply requirements of high-power chips and high-density cabinets.

[0004] In a first aspect, an electronic device is provided, comprising a housing, a circuit board, coolant pipes, and at least one spraying device. The circuit board, coolant pipes, and at least one spraying device are located within the housing, and the housing is provided with a liquid inlet and a power port. At least one electronic device and a power module are disposed on the circuit board, the power module being used to supply power to the at least one electronic device. The coolant pipes are connected to the liquid inlet and the at least one spraying device, and are used to input coolant into the at least one spraying device. The coolant pipes are also connected to the power port and the power module, and are used to supply power to the power module. At least one spraying device is used to spray coolant onto the electronic device. Using coolant pipes directly connected to the PCB to supply power to each electronic device can meet the power supply requirements of high-power electronic devices on the PCB, not only reducing the complexity of the power supply end but also shortening the length of the power supply lines on the PCB, thereby saving PCB manufacturing costs. Furthermore, by delivering coolant through coolant pipes and using direct spraying to cool the surface of high-heat-generating XPUs or memory chips, the use of expensive fluorinated liquid can also be saved.

[0005] In one possible implementation, the coolant conduit includes a conductive section that is connected to the power module. This connection between the coolant conduit and the power module via the conductive section can meet the high-power supply requirements of the power module.

[0006] In one possible implementation, the conductive part is directly connected to the power module. The coolant pipe is connected to the power module via the conductive part, which can meet the high-power supply requirements of the power module.

[0007] In one possible implementation, the conductive part is connected to the conductive lines on the circuit board, and the conductive lines are connected to the power module. The coolant pipes are connected to the conductive lines on the circuit board via the conductive part, allowing direct power supply to the electronic devices on the circuit board. This not only meets the ever-increasing power demands of the electronic devices but also shortens the length of the conductive lines on the circuit board, saving on circuit board manufacturing costs.

[0008] In one possible implementation, the power module is used to step down the voltage in the coolant pipes to a voltage suitable for the electronic devices. By stepping down the voltage with the power module, the power supply requirements of different electronic devices can be met, while also allowing for individual power supply control of each electronic device.

[0009] In one possible implementation, the circuit board includes multiple electronic devices, and the power module divides the voltage from the coolant pipes into multiple voltage streams to power these devices. The multiple low-voltage power supplies branching off from the power module individually power the various electronic devices, satisfying their different power requirements while also allowing for individual power control of each device.

[0010] In one possible implementation, the circuit board includes multiple electronic devices and multiple power modules; the multiple power modules supply power to the multiple electronic devices respectively; the coolant pipe includes multiple conductive parts, wherein the multiple conductive parts are connected to the multiple power modules one by one.

[0011] In one possible implementation, the coolant pipes are made of a conductive metallic material. Coolant pipes made of conductive metallic materials not only have good electrical and thermal conductivity but also meet the requirements for high-current power supply.

[0012] In one possible implementation, an insulating joint is provided between the inlet pipe and the coolant pipe to improve power supply safety.

[0013] In one possible implementation, a coolant outlet is also included, disposed on the housing, for discharging coolant to the outside of the housing. The coolant is discharged from the outlet into the circulating heat exchange system, improving coolant utilization while reducing coolant loss and lowering costs.

[0014] In one possible implementation, an exhaust port is also included, disposed on the housing, for discharging gaseous coolant to the outside of the housing. The coolant enters the coolant pipe through the inlet and is sprayed onto the surface of the XPU or memory chip from at least one spray device. The evaporated gaseous coolant is discharged from the housing through the exhaust port and enters the circulating heat exchange system, improving the utilization rate of the coolant.

[0015] In one possible implementation, a condenser is also included, disposed inside the housing, for condensing the gaseous coolant. By incorporating a condenser, the gaseous coolant can be condensed into a liquid coolant inside the housing for reuse, reducing the external heat exchange pressure of the circulating heat exchange system and improving the efficiency of the entire heat exchange process.

[0016] On the other hand, a server is provided, including at least one electronic device as described above. The server can power multiple electronic devices simultaneously, meeting the power supply needs of multiple electronic devices.

[0017] On another front, a server system is provided, including a circulating heat exchange system and at least one electronic device as described above. The circulating heat exchange system is connected to the coolant pipes of the electronic device, providing flowing coolant to the electronic device. This server system can simultaneously provide heat dissipation and power to multiple electronic devices, and manages the cooling capacity of multiple electronic devices through a cooling capacity distribution unit, thereby meeting the power supply and heat dissipation needs of a computing cluster with multiple electronic devices. Attached Figure Description

[0018] Figure 1 A schematic diagram of an electronic device structure provided in an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of another electronic device structure provided in an embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of a third electronic device structure provided in an embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of a fourth electronic device structure provided in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the fifth electronic device structure provided in an embodiment of the present invention;

[0023] Figure 6 This is a schematic diagram of the sixth electronic device structure provided in an embodiment of the present invention;

[0024] Figure 7 This is a schematic diagram of the XPU and heat sink assembly structure provided in an embodiment of the present invention;

[0025] Figure 8 This is a schematic diagram of the structure of a server system provided in an embodiment of the present invention. Detailed Implementation

[0026] In a typical application scenario, the computing demands of data centers are increasing, and the power consumption of each processing unit (XPU) on the PCB is constantly rising. The power supply capacity of a single PCB is approaching its limit, creating a power supply bottleneck. Consequently, the heat generated by the XPU is also increasing. Due to the requirements for energy conservation and environmental protection in recent years, new data centers have strengthened the control of Power Usage Efficiency (PUE). To reduce PUE, this application proposes a liquid-cooled power supply method that simplifies the circuit structure, saves space, and improves power supply capacity, making it an effective method to solve the above problems.

[0027] Figure 1 This is a schematic diagram of an electronic device structure provided by an embodiment of the present invention. This embodiment employs a fully immersion liquid cooling method. Figure 1 As shown, this application proposes an electronic device, which includes at least one PCB board 2 on which at least one electronic component is disposed. The electronic component requires power from the PCB board 2 during operation and also generates heat during operation. For example, as... Figure 1 As shown, device 1 can be an XPU, and device 4 can be memory. The electronic device also includes a housing 10, a circuit board (i.e., PCB board 2), a coolant pipe 7, and at least one spray device 8; the circuit board, coolant pipe 7, and at least one spray device 8 are located inside the housing 10, and the housing 10 is provided with a liquid inlet 6 and a power port 5; a liquid inlet pipe is connected to the coolant pipe 7 at the liquid inlet 6. The power supply terminal supplies power to the electronic device through the power port 5. At least one electronic device and a power module 12 are provided on the circuit board, and the power module 12 is used to supply power to at least one electronic device; the coolant pipe 7 is connected to the liquid inlet 6 and at least one spray device 8, and is used to input coolant to at least one spray device 8; the coolant pipe 7 is also connected to the power connection component 19 and the power module 12, and is used to supply power to the power module 12; at least one spray device 8 is used to spray coolant onto the electronic device.

[0028] The coolant conduit 7 is made of a conductive metallic material, exemplarily copper. The coolant conduit 7 is electrically connected to the PCB board 2 via a conductive part 3. The coolant conduit 7 serves as a flow carrier for the coolant. The conductive part 3 can be a metal wire used to achieve the electrical connection between the coolant conduit 7 and the PCB board 2. Exemplarily, it can be part of the coolant conduit 7 or a separate structure. The power module 12 is connected to the circuit board and can be used in conjunction with the conductive part 3 to convert the voltage supplied by the power supply terminal, splitting it into multiple low-voltage circuits to power different electronic devices, thus meeting the voltage requirements of different electronic devices.

[0029] At least one spray device 8 is installed on the coolant pipe 7. The spray device 8 can be a spray head or a nozzle, used to spray the coolant inside the coolant pipe 7. The coolant pipe 7 can be connected to the circulating heat exchange system through the inlet 6 and the outlet 11 to provide a continuous supply of coolant. The coolant pipe can also be electrically connected to an external power supply terminal through the power connection component 19 to supply power to the PCB board 2. An insulating joint 13 can be installed at the electrical connection between the inlet 6 and the coolant pipe 7 to improve power supply safety. The coolant enters the coolant pipe 7 from the circulating heat exchange system and is then sprayed onto the vicinity of the surface of the XPU4 or memory chip 1 through the spray device 8, accelerating the coolant flow, absorbing heat, and achieving the purpose of cooling the electronic equipment. While acting as a coolant carrier, the coolant pipe 7 also supplies power to the PCB board 2 through the conductive part 3.

[0030] Optionally, the coolant pipe 7 can be connected to the PCB board 2 via multiple conductive parts 3 and multiple power modules 12. The multiple power modules 12 can be arranged at different locations on the PCB board 2, and the multiple conductive parts 3 can be arranged at different parts on the coolant pipe 7. Each power module 12 is connected to one of the multiple conductive parts 3 in a one-to-one correspondence, so that power can be supplied to each module through multiple lines, thus meeting the power supply requirements of different modules on the PCB board 2. Figure 2 This is a schematic diagram of another electronic device structure provided in an embodiment of the present invention. For example... Figure 2 As shown, power module 121 is located near electronic device 1 to power the XPU module, and power module 122 is located near electronic device 4 to power the memory module. Conductor 31 is connected to power module 121, and conductor 32 is connected to power module 122. Coolant pipe 7 supplies power to power module 121 and power module 122 through conductors 31 and 32, respectively.

[0031] In this embodiment, the coolant pipe 7 is directly connected to the PCB board 2 to supply power to each electronic component, which can meet the power supply requirements of high-power electronic components on the PCB board 2. This not only reduces the complexity of the power supply end, but also shortens the length of the power supply lines on the PCB board 2, thereby saving the manufacturing cost of the PCB board 2.

[0032] The conductive part 3 can be a metal conductive strip, preferably a solid copper conductive strip. The metal conductive strip has a certain rigidity, which, while meeting the requirements of high-current power supply, can provide support for the coolant pipe 7. During operation, when coolant flows through the coolant pipe 7, it will cause the pipe to sway. The rigid metal conductive strip supports the coolant pipe 7, improving its stability. The solid copper conductive strip not only has good electrical and thermal conductivity but also meets the requirements of high-current power supply.

[0033] Figure 3 This is a schematic diagram of a third electronic device structure provided in an embodiment of the present invention. Figure 3 As shown, in one connection method, the conductive part 3 can be directly electrically connected to the conductive lines on the PCB board 2, and the power supply end directly supplies power to the PCB board 2 through the coolant pipe 7 and the conductive part 3. The current supplied by the power supply end flows into the power module through the conductive lines on the PCB board 2, and then supplies power to the electronic devices on the PCB board 2 through the power module 12. Specifically, the power module 12 can output multiple low-voltage power supplies to supply power to different electronic devices respectively, so as to control the power supply of each electronic device separately.

[0034] Optionally, the electronic device may include multiple conductive parts 3. The coolant pipe 7 can be electrically connected to the conductive lines on the PCB board 2 through the multiple conductive parts 3, and then power is supplied to the electronic devices on the PCB board 2 through a power module 12. Optionally, the electronic device may include multiple power modules 12. The coolant pipe 7 can be electrically connected to the conductive lines on the PCB board 2 through the multiple conductive parts 3, and then power is supplied to each module through multiple power modules 12 via multiple lines, which can meet the power supply requirements of different modules on the PCB board 2. Optionally, the electronic device may also include multiple conductive parts 3 and multiple power modules 12. The coolant pipe 7 can be electrically connected to the conductive lines on the PCB board 2 through the multiple conductive parts 3, and then power is supplied to each module through multiple power modules 12 via multiple lines. The correspondence between the multiple conductive parts 3 and the multiple power modules 12 can be flexibly set according to actual needs, and this application does not impose any restrictions.

[0035] Figure 4 This is a schematic diagram of a fourth electronic device structure provided in an embodiment of the present invention. Figure 4 As shown, this embodiment employs a non-fully immersion liquid cooling method. The coolant pipe 7, conductive part 3, and at least one spray device 8 are housed within the casing 10. The inlet 6 is connected to the coolant pipe 7, and the outlet 9 is located above the inlet 6. An insulating joint 13 is provided between the inlet 6 and the coolant pipe 7, which can be fitted onto the coolant pipe 7 to improve power supply safety. The coolant enters the coolant pipe 7 through the inlet 6 and is sprayed onto the surface of the electronic devices from at least one spray device 8. The evaporated gaseous coolant exits the casing 10 through the outlet 9 and enters the circulating heat exchange system. Typically, after absorbing heat and evaporating, the liquid coolant will float upwards in a gaseous state. The outlet 9, located above the inlet 6, facilitates the expulsion of gas from the casing 10.

[0036] Optionally, the housing 10 may also be provided with a liquid outlet 11, located below the liquid inlet 6, for discharging coolant from the interior of the housing 10 to the circulating heat exchange system. In this embodiment, the bottom of the housing 10 can be used to collect unevaporated liquid coolant 14, which can be discharged from the liquid outlet 11 and returned to the circulating heat exchange system for recycling, saving costs. In this embodiment, the conductive part 3 can be connected to the power module 12 provided on the PCB board 2, and the power module 12 controls the power supply to other electronic components on the PCB board 2.

[0037] In this embodiment, the housing 10 of the liquid-cooled power supply device is used to prevent the vapor coolant from drifting into the outside air and to provide flow space for the vapor coolant so that it can be discharged through the exhaust port 9, condensed, and recycled back to the circulating heat exchange system. Additionally, the bottom of the housing 10 can be used to collect unevaporated liquid coolant 14, which can be returned to the circulating heat exchange system for recycling, thus reducing coolant loss.

[0038] Figure 5 This is a schematic diagram of the fifth electronic device structure provided in an embodiment of the present invention. Figure 5 As shown, the conductive part 3 can be connected to the power module 12 mounted on the PCB board 2, and the power module 12 controls the power supply to other electronic components on the PCB board 2. In this embodiment, the power module 12 can convert the voltage provided by the power supply terminal, splitting it into multiple low-voltage circuits to power different electronic components, thereby meeting the voltage requirements of different electronic components. Specifically, the power supply method can be... Figure 1 The power supply methods shown are similar and will not be described in detail here.

[0039] By employing the above method, which uses coolant pipes directly connected to the PCB to supply power to various electronic components, the bottleneck of power supply technology where the current density of the PCB board is close to its upper limit can be overcome, thereby meeting the power supply requirements of high-power electronic components. This power supply method not only reduces the complexity of the power supply end but also significantly shortens the length of the power supply lines on the PCB board, reducing PCB manufacturing costs.

[0040] like Figure 4 As shown, this embodiment also employs a non-fully immersion liquid cooling method. The conductive part 3 can be directly electrically connected to the conductive lines on the PCB board 2, and the power supply end directly supplies power to the PCB board 2 through the coolant pipe 7 and the conductive part 3. In this embodiment, a power module can also be provided on the PCB board 2. The current supplied by the power supply end flows into the power module through the conductive lines on the PCB board 2, and then the power module controls the power supply to other electronic components on the PCB board 2. Specifically, the power supply method can be the same as... Figure 2 The power supply methods shown are similar and will not be described in detail here.

[0041] In this embodiment, coolant is delivered through coolant pipe 7 and direct injection is used to cool the surface of the XPU4 or memory chip 1, which generates a lot of heat. This solution can save on the amount of expensive fluorinated liquid used.

[0042] Figure 6 This is a schematic diagram of the sixth electronic device structure provided in an embodiment of the present invention. Figure 2 The electronic devices shown are different, such as Figure 6 As shown, the liquid-cooled power supply device may further include a condenser 15. The condenser 15 is disposed inside the housing 10 and includes a condenser tube and a heat exchange power circulation device. The heat exchange power circulation device is connected to the interior of the condenser tube and circulates the condensing medium into the condenser tube. In this embodiment, the evaporated vapor coolant can condense on the outer wall of the condenser tube.

[0043] and Figure 2 and Figure 3 The power supply method shown is similar. The conductive part 3 can be connected to the power module set on the PCB board 2. The power module controls the power supply to other electronic devices on the PCB board 2. Alternatively, the conductive part 3 can be directly connected to the conductive lines on the PCB board 2. The power supply end directly supplies power to the PCB board 2 through the coolant pipe 7 and the conductive part 3. The current provided by the power supply end flows into the power module through the conductive lines on the PCB board 2, and then the power module controls the power supply to other electronic devices on the PCB board 2. This will not be described in detail here.

[0044] Optionally, the electronic components may also include an XPU and a heat sink. Figure 7 This is a schematic diagram of the XPU and heatsink assembly structure provided in an embodiment of the present invention. Figure 7 As shown, the XPU4 can be directly soldered onto the PCB board 2 using solder balls, or installed in the socket slot of the PCB board 2. In this case, the heatsink 17 covers the outer surface of the XPU4. The heatsink 17 is typically made of pure copper with high thermal conductivity, and the heatsink 17 and the cover 18 on the XPU4 are connected by a flexible thermally conductive material 16 (such as thermal grease). In a liquid-cooled environment, the heatsink 17 and the PCB form a sealed cavity, preventing coolant from entering the interior of the heatsink 17 and ensuring that the coolant does not directly contact the XPU4. The spray device 8 sprays coolant directly onto the surface of the heatsink 17, thus dissipating heat.

[0045] Optionally, the end of the coolant pipe 7 that is not connected to the circulating heat exchange system can be closed. This can prevent the coolant from flowing out of the other end without participating in heat exchange while flowing in the coolant pipe 7, thereby increasing the utilization rate of the coolant.

[0046] In some examples, fluorinated liquids with a boiling point of 30–70°C can be used as coolants. In a typical example, a fluorinated liquid with a boiling point of 50°C is chosen as the coolant. Fluorinated liquids are insulating liquids, chemically stable, insoluble in water and oil, and have a low boiling point, making them ideal cooling media for server heat dissipation. Choosing a fluorinated liquid with a boiling point of 30–70°C allows for easy transition from the liquid phase to the gas phase, rapidly absorbing heat and resulting in better heat exchange efficiency.

[0047] In some embodiments, the power supply terminal provides a DC input of 48V or 12V to the PCB. It should be noted that the power supply voltage can also be set according to the actual needs of the power supply terminal, including but not limited to 48V or 12V DC.

[0048] This application also proposes a server including at least one electronic device as described above. A server composed of multiple electronic devices can meet the ever-increasing computing demands.

[0049] This application also proposes a server system, including a circulating heat exchange system and at least one electronic device as described above. The circulating heat exchange system is connected to the coolant pipe 7 of the electronic device, providing flowing coolant to the electronic device. An insulating joint 13 may be provided between the circulating heat exchange system and the coolant pipe 7 to improve the power supply safety of the server.

[0050] Figure 8 This is a schematic diagram of the structure of a server system provided in an embodiment of the present invention. Figure 8 As shown, this application also proposes a server system, including: a power supply copper busbar, a coolant distribution unit (CDU), and multiple liquid-cooled power supply devices as described above. Multiple power supply terminals are connected to the power supply copper busbar, supplying power to the multiple liquid-cooled power supply devices via the power supply copper busbar. Multiple circulating heat exchange systems are connected to the CDU, distributing cooling capacity to the multiple liquid-cooled power supply devices through the CDU. It should be noted that the CDU may include pumps, plate heat exchangers, etc. The CDU provides the power for the circulating flow on the equipment side and the flow rate required by the liquid-cooled power supply devices, while the plate heat exchanger isolates and exchanges heat between the liquids on the server room side and the equipment side. The CDU can provide working fluid water at a certain temperature to the liquid-cooled power supply devices.

[0051] In the embodiments of this application, the liquid-cooled power supply system, which consists of an electric copper busbar, a CDU, and multiple liquid-cooled power supply devices as described above, can simultaneously provide heat dissipation and power supply for multiple electronic devices. By managing the cooling capacity of multiple electronic devices through the CDU, it can meet the power supply and heat dissipation needs of a computing cluster with multiple electronic devices, and is conducive to energy saving and reducing PUE.

[0052] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An electronic device, comprising: The electronic device includes a housing, a circuit board, coolant pipes, and at least one spray device; The circuit board, the coolant pipe, and the at least one spray device are located inside the housing, and the housing is provided with a liquid inlet and a power outlet; The circuit board is provided with at least one electronic device and at least one power module. The power module is used to convert the voltage provided by the power supply terminal and provide low voltage power to the at least one electronic device. The coolant pipe is connected to the inlet and the at least one spray device, and is used to input coolant into the at least one spray device; the coolant pipe is also connected to the power port and the power module, and is used to supply power to the power module; the coolant pipe includes a conductive part, and the coolant pipe is connected to the power module through the conductive part, the conductive part being a wire, a conductive strip, or a conductive pipe; an insulating joint is provided between the coolant pipe and the inlet; The coolant pipe is connected to the circuit board through multiple conductive parts and multiple power modules. The multiple power modules are arranged at different positions on the circuit board, and the multiple conductive parts are arranged at different parts on the coolant pipe. The multiple power modules and the multiple conductive parts are connected one-to-one. The at least one spray device is used to spray coolant onto the electronic device.

2. The electronic device of claim 1, wherein, The conductive part is directly connected to the power module.

3. The electronic device of claim 1, wherein, The conductive part is connected to the conductive line on the circuit board, and the conductive line is connected to the power module.

4. The electronic device as described in claims 1-3, characterized in that, The power module is used to reduce the voltage of the coolant pipe to a voltage suitable for the electronic devices.

5. The electronic device as described in claims 1-4, characterized in that, The circuit board includes multiple electronic components, and the power module divides the voltage of the coolant pipe into multiple voltage channels to power the multiple electronic components.

6. The electronic device as claimed in claim 5, characterized in that, The circuit board includes multiple electronic components and multiple power modules; The multiple power modules provide power to the multiple electronic devices respectively.

7. The electronic device as described in claims 1-6, characterized in that, The coolant pipes are made of a conductive metallic material.

8. The electronic device as described in claims 1-7, characterized in that, It also includes a liquid outlet, which is disposed on the housing and is used to output coolant to the outside of the housing.

9. The electronic device as described in claims 1-8, characterized in that, It also includes an exhaust port, which is disposed on the housing and is used to output gaseous coolant to the outside of the housing.

10. The electronic device as described in claims 1-9, characterized in that, It also includes a condenser, which is disposed inside the housing and is used to condense gaseous coolant.

11. A server, characterized in that, It includes at least one electronic device as described in any one of claims 1-10.

12. A server system, characterized in that, It includes a circulating heat exchange system and at least one electronic device as described in any one of claims 1-10, wherein the circulating heat exchange system is connected to a coolant conduit of the electronic device to provide flowing coolant to the electronic device.

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