Valve module for a vacuum pumping system
By using valve modules to control fluid flow in semiconductor processing tools, the pressure fluctuation problem caused by evacuation events in multi-chamber systems is solved, resulting in more stable gas management and a simplified installation process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- EDWARDS LTD
- Filing Date
- 2022-04-28
- Publication Date
- 2026-07-24
AI Technical Summary
In semiconductor processing tools, when multiple chambers are fluidly connected to a common manifold, performing a evacuation event can cause gas pressure fluctuations and unstable conditions in other chambers.
The system employs a valve module, which includes multiple inlets, pressure sensors, multi-branched conduits, fluid line manifolds, and valve controllers. The pressure sensors measure the pressure at each inlet, and the valve controllers control the opening and closing of the valves to ensure that fluid flows to different fluid line manifolds, thereby reducing or eliminating pressure fluctuations.
It effectively reduces or eliminates the adverse effects of air extraction events on other chambers, enables automatic detection and control of air extraction events, simplifies installation, and improves system stability and maintainability.
Smart Images
Figure CN117377826B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to valve modules for use with vacuum pumping systems, including but not limited to vacuum systems for pumping fluids from semiconductor processing tools. Background Technology
[0002] Semiconductor manufacturing plants produce integrated circuit chips. During the manufacture of these devices, wafers are processed through multiple different processing stations, including stations where the wafers undergo processes such as chemical vapor deposition, physical vapor deposition, implantation, etching, and photolithography. Many of these processes involve the use of gaseous environments and often require the use of high vacuum and reduced gas pressure.
[0003] Vacuum pumps are used to provide these reduced gas pressures within the processing chamber, to provide chamber exhaust, and to maintain the flow of process gases. Summary of the Invention
[0004] When the chamber pressure of a semiconductor processing tool is not at a working vacuum, for example after the gas chamber has been vented to atmospheric pressure to enable servicing or maintenance, a so-called "pump-down event" is performed to establish the required reduced gas pressure within the chamber. A pump-down event involves pumping gas from the chamber to reduce the pressure therein to the desired level.
[0005] Vacuum and depletion systems can be used to simultaneously pump gases from multiple gas chambers of a semiconductor processing tool via a common pump and a common manifold. The inventors of this invention have recognized that in such systems, because multiple chambers are fluidly connected to a common manifold, performing a pumping event on one of these chambers can affect the conditions in the other chambers. For example, a pumping event performed on one chamber may cause undesirable fluctuations in altitude in other chambers connected to the same manifold.
[0006] An aspect of the present invention provides a valve module for controlling fluid from multiple chambers of a semiconductor processing tool, thereby reducing or eliminating these defects.
[0007] In a first aspect, a valve module for a vacuum pumping system is provided. The valve module includes: a plurality of inlets, each configured to receive pumped fluid; a plurality of pressure sensors, each configured to measure the pressure of the fluid associated with a corresponding inlet; a first fluid line manifold; a second fluid line manifold; a plurality of branched conduits, wherein each branched conduit fluidly connects a corresponding inlet to both the first and second fluid line manifolds; a plurality of valves, wherein one or more corresponding valves are disposed in a corresponding branched conduit; and a valve controller operatively coupled to the plurality of pressure sensors and the plurality of valves; wherein the controller is configured to control the plurality of valves based on pressure measurements received from the plurality of pressure sensors, such that each of the one or more valves disposed in the corresponding branched conduit selectively directs fluid flow through the branched conduit to either only the first fluid line manifold or only the second fluid line manifold.
[0008] Each of the multi-branched conduits may include a first branch and a second branch, the first branch being fluidly connected to a first fluid line manifold and the second branch being fluidly connected to a second fluid line manifold. Each of one or more valves disposed in a respective multi-branched conduit may include a first valve disposed in the first branch of the multi-branched conduit and a second valve disposed in the second branch of the multi-branched conduit.
[0009] Multiple pressure sensors may include a first pressure sensor configured to measure the pressure of fluid associated with a first inlet among a plurality of inlets, the first inlet being the inlet of a first multi-branch conduit among a plurality of multi-branch conduits. A valve controller may be configured to control one or more valves disposed in the first multi-branch conduit to direct fluid flow through the first multi-branch conduit to a second fluid line manifold in response to a pressure measurement received from the first pressure sensor satisfying one or more first criteria. The one or more first criteria may consist of one or more standards selected from a group of standards comprising: the measured pressure exceeding a first threshold; the measured pressure exceeding the first threshold for at least a first time period; the rate of increase of the measured pressure exceeding a second threshold; and the rate of increase of the measured pressure exceeding the second threshold for at least a second time period. The valve controller may be configured to control one or more valves disposed in the first multi-branch conduit to direct fluid flow through the first multi-branch conduit to a first fluid line manifold in response to a pressure measurement received from the first pressure sensor satisfying one or more second criteria. The one or more second criteria may consist of one or more criteria selected from a set of criteria consisting of: the measured pressure is less than or equal to a third threshold; the measured pressure is less than the third threshold for at least a third time period; the rate of decrease of the measured pressure exceeds a fourth threshold; the rate of decrease of the measured pressure exceeds the fourth threshold for at least a fourth time period; and a predetermined time period has elapsed.
[0010] At least the plurality of inlets, the first fluid line manifold, the second fluid line manifold, the plurality of multi-branched conduits, the plurality of valves, and the valve controller can be configured as a single integrated unit and housed in a frame.
[0011] The valve module may also include a plurality of additional valves, wherein for each of the plurality of valves, a corresponding pair of additional valves are disposed on both sides of the valve. The additional valves may be manually operated valves.
[0012] The valve module may also include a gas inlet for receiving gas for purging one or more multi-branched conduits and / or actuating one or more valves in the valves.
[0013] In another aspect, a system is provided comprising: a semiconductor processing tool including a plurality of processing chambers; a valve module according to any of the foregoing aspects, wherein each of the plurality of inlets is fluidly coupled to a corresponding processing chamber among the plurality of processing chambers; and one or more vacuum pumps operatively coupled to a first fluid line manifold and a second fluid line manifold.
[0014] The system may also include a cooling device for supplying cooling fluid to one or more of the processing chambers, wherein a valve module is disposed on top of the cooling device.
[0015] In another aspect, a method is provided for a valve module for a vacuum pumping system, the valve module comprising: receiving a corresponding pumped fluid at each of a plurality of inlets, each inlet being an inlet to a corresponding branch conduit of a plurality of branch conduits, each branch conduit fluidly connecting the corresponding inlet to both a first fluid line manifold and a second fluid line manifold; measuring the pressure of a corresponding fluid in the pumped fluid by one or more pressure sensors of a plurality of pressure sensors; and controlling one or more valves of a plurality of valves disposed in a first branch conduit of the plurality of branch conduits by a controller based on one or more measured pressures; wherein controlling the one or more valves selectively directs fluid flow through the first branch conduit to either only the first fluid line manifold or only the second fluid line manifold.
[0016] The method may further include measuring the pressure of fluid pumped in a first bifurcation conduit using a first pressure sensor among a plurality of pressure sensors, and controlling one or more valves disposed in the first bifurcation conduit to direct fluid flow through the first bifurcation conduit to a second fluid line manifold and to prevent fluid flow through the first bifurcation conduit to the first fluid line manifold in response to the pressure measurement received from the first pressure sensor meeting one or more second criteria. The method may further include, thereafter, controlling one or more valves disposed in the first bifurcation conduit to prevent fluid flow through the first bifurcation conduit to the second fluid line manifold in response to the pressure measurement received from the first pressure sensor meeting one or more second criteria, and subsequently directing fluid flow through the first bifurcation conduit to the first fluid line manifold. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of semiconductor manufacturing equipment (not drawn to scale);
[0018] Figure 2 This is a schematic diagram (not drawn to scale) showing a perspective view of a valve module in a semiconductor manufacturing equipment.
[0019] Figure 3 This is a process flow diagram illustrating certain steps of the gas pumping process in semiconductor manufacturing equipment; and
[0020] Figure 4 This is a schematic diagram (not drawn to scale) showing a system in which two valve modules are mounted on top of multiple cooling units. Detailed Implementation
[0021] Figure 1 This is a schematic diagram (not drawn to scale) of a semiconductor manufacturing apparatus 100 according to an embodiment.
[0022] Semiconductor manufacturing equipment 100 includes semiconductor processing tools 102, valve module 104 and multiple vacuum pumps 106.
[0023] Semiconductor processing tool 102 includes multiple processing chambers 108 in which semiconductor wafers undergo corresponding processes. Examples of such processes include, but are not limited to, chemical vapor deposition, physical vapor deposition, implantation, etching, and photolithography.
[0024] Multiple vacuum pumps 106 are configured to pump fluid (i.e., process gas) out of the processing chamber 108 of the semiconductor processing tool 102 via valve module 104.
[0025] Valve module 104 includes multiple inlets 110, multiple multi-branched conduits 112, a first fluid line manifold 114, and a second fluid line manifold 116.
[0026] Each of the inlets 110 is fluidly connected to the corresponding processing chamber 108 so that pumped fluid can be received from the processing chamber 108.
[0027] Each multi-branched conduit 112 fluidly connects a corresponding inlet 110 to both the first fluid manifold 114 and the second fluid manifold 116. More specifically, in this embodiment, the multi-branched conduit 112 is a bi-branched conduit including a corresponding first branch 118 and a second branch 120. The first branch 118 of each multi-branched conduit 112 fluidly connects the corresponding inlet 110 to the first fluid manifold 114. The second branch 120 of each multi-branched conduit 112 fluidly connects the corresponding inlet 110 to the second fluid manifold 116.
[0028] Valve module 104 also includes a plurality of pressure sensors 122. Each pressure sensor 122 is operatively coupled to a corresponding inlet 110, or to a corresponding multi-branched conduit 112 at or near inlet 110.
[0029] Each pressure sensor 122 is configured to measure the pressure associated with the corresponding processing chamber 108. Specifically, each pressure sensor 122 is configured to measure the pressure of the process gas being pumped out of the corresponding processing chamber 108. Preferably, the pressure sensor 122 is positioned as close as possible to the outlet of the processing chamber 108.
[0030] Valve module 104 also includes a plurality of gate valves, and more specifically a plurality of first gate valves 124 and a plurality of second gate valves 126. In this embodiment, the first gate valves 124 and the second gate valves 126 are pneumatic valves.
[0031] Each of the first gate valves 124 is disposed on a corresponding branch of the first branch 118 and is configured to control the flow of fluid passing through it.
[0032] Each of the second gate valves 126 is disposed on a corresponding branch of the second branch 120 and is configured to control the flow of fluid passing through it.
[0033] Valve module 104 also includes valve controller 128.
[0034] Valve controller 128 is operatively coupled to each of a plurality of pressure sensors 122 via a wired or wireless connection (not shown), such that pressure measurements obtained by the plurality of pressure sensors 122 can be received by valve controller 128.
[0035] The valve controller 128 is also operably connected via corresponding pneumatic lines (not shown) to each of the first gate valves 124 and each of the second gate valves 126.
[0036] For reference Figure 3 As described in more detail later below, valve controller 128 is configured to control the operation of first and second gate valves 124, 126 based on pressure measurements received from pressure sensor 122. Valve controller 128 is configured to control the operation of the first and second gate valves 124, 126 by transmitting pneumatic fluid to the first and second gate valves 124, 126 via pneumatic lines.
[0037] Valve module 104 also includes a plurality of manual valves (i.e., valves configured to be manually operated by a human operator), and more specifically includes a plurality of first manual valves 130, a plurality of second manual valves 132 and a plurality of third manual valves 134.
[0038] In this embodiment, each first manual valve 130 is disposed on a corresponding multi-branched conduit 112 and between the pressure sensor 122 of the multi-branched conduit 112 and the point where the multi-branched conduit 112 branches.
[0039] In this embodiment, each second manual valve 132 is disposed on a corresponding first branch 118 of the multi-branched conduit 112 and between the first gate valve 124 of the multi-branched conduit 112 and the first fluid line manifold 114.
[0040] In this embodiment, each third manual valve 134 is disposed on a corresponding second branch 120 of the multi-branched conduit 112 and between the second gate valve 126 and the second fluid line manifold 116 of the multi-branched conduit 112.
[0041] Therefore, in this embodiment, each of the first and second gate valves 124, 126 is disposed between a corresponding pair of manual valves 130-134. Specifically, each first gate valve 124 is disposed between the first manual valve 130 and the second manual valve 132. Moreover, each second gate valve 126 is disposed between the first manual valve 130 and the third manual valve 134.
[0042] In this embodiment, the first fluid line manifold 114 is a manifold through which process gas is pumped from the processing chamber 108 in which semiconductor manufacturing processes are performed. The first fluid line manifold 114 can be considered as a "process gas line". The second fluid line manifold 116 can be considered as a "vacuum gas line". The dimensions of fluid line manifolds 114 and 116 are adapted to gas flow and vacuum requirements.
[0043] A evacuation event can be performed to vent gas from one or more processing chambers 108, which may be at atmospheric pressure, in order to reduce the pressure therein to a level suitable for semiconductor manufacturing processes. For convenience, the gas vented from the gas chamber during evacuation is referred to hereinafter as evacuation gas. In this embodiment, the second fluid line manifold 116 is the manifold through which the evacuation gas is pumped from the processing chambers 108.
[0044] The apparatus including valve controller 128 for implementing the above arrangement and performing the method steps described below can be provided by configuring or adapting any suitable device and / or providing additional modules, such as one or more computers or other processing devices or processors. The apparatus may include a computer, a computer network, or one or more processors for implementing instructions and using data, including instructions and data in the form of computer programs or multiple computer programs stored in or on machine-readable storage media such as computer memory, computer disk, ROM, PROM, etc., or any combination of such or other storage media.
[0045] Figure 2 This is a schematic diagram not drawn to scale, showing a perspective view of valve module 104.
[0046] In this embodiment, certain components of valve module 104, including, for example, at least inlet 110, multi-branch conduit 112, first fluid line manifold 114, second fluid line manifold 116, gate valves 124, 126, valve controller 128, and manual valves 130, 132, 134, are configured or arranged into a single integrated unit, hereinafter referred to as the "first integrated unit". These components are housed in a common frame 200. Frame 200 may be made of steel.
[0047] In some embodiments, pressure sensor 122 is also included in the first integrated unit and may be housed in frame 200. However, in some embodiments, pressure sensor 122 is separate from the first integrated unit. For example, pressure sensor 122 may be configured or arranged as a separate second integrated unit, which may be coupled to the first integrated unit, for example, to the top of the first integrated unit. The second integrated unit including pressure sensor 122 may be coupled between processing chamber 108 and inlet 110 of the first integrated unit.
[0048] Figure 3 This is a process flow diagram showing certain steps of a process 300 in which gas is pumped in a semiconductor manufacturing apparatus 100.
[0049] It should be noted that Figure 3 Some of the process steps depicted in the flowchart and described below may be omitted, or these process steps may be replaced with steps different from those presented below. Figure 3 The processes are executed in the order shown. Furthermore, although all process steps have been depicted as discrete time-sequential steps for convenience and ease of understanding, some of these process steps may actually be performed simultaneously or at least overlap in time to some extent.
[0050] At step s302, a semiconductor manufacturing process is performed in processing chamber 108. These semiconductor manufacturing processes generate process gases.
[0051] In this embodiment, at this stage, the first gate valve 124 is open and the second gate valve 126 is closed. Furthermore, all manual valves 130-134 are open.
[0052] At step s304, the vacuum pump 106 connected to the first fluid line manifold 114 pumps the generated process gas out of the processing chamber 108 via the valve module 104. Specifically, in this embodiment, the process gas is pumped from each processing chamber 108 and sequentially passes through an inlet 110 connected thereto, a first branch 118 of a multi-branched conduit 112 connected thereto (including through a first gate valve 124 disposed on the first branch), and the first fluid line manifold 114.
[0053] At step s306, pressure sensor 122 measures the pressure associated with processing chamber 108. Specifically, each pressure sensor 122 measures the pressure of the process gas being pumped through the corresponding inlet 110. In this embodiment, pressure sensor 122 measures pressure substantially continuously.
[0054] At step s308, pressure sensor 122 sends the measured pressure value to valve controller 128. Valve controller 128 processes the received measured pressure values substantially continuously.
[0055] At step s310, one of the processing chambers 108 (hereinafter referred to as "first processing chamber 108" for convenience) is closed for inspection, repair, maintenance, or repair. In this embodiment, closing the first processing chamber 108 includes stopping the pumping of gas from the first processing chamber 108. In this embodiment, this can be achieved by an operator closing an isolation valve in the inlet 110 associated with the first processing chamber 108. In this embodiment, closing the first processing chamber 108 also includes increasing the pressure in the first processing chamber 108 to approximately atmospheric pressure. This can be achieved by opening a valve connected to the first processing chamber 108, thereby allowing air to enter the first processing chamber 108.
[0056] At step s312, a human operator performs inspection, repair, maintenance or repair operations on the first processing chamber 108.
[0057] After inspection, repair, maintenance or maintenance operations, a low gas pressure environment is re-established in the first processing chamber 108 so that semiconductor manufacturing processes can be performed therein.
[0058] Therefore, at step s314, the isolation valve associated with the first processing chamber 108 is reopened, thereby allowing gas to be pumped from the first processing chamber 108.
[0059] The pumping of gas from the first processing chamber 108 at step s314 is a evacuation event.
[0060] At step s316, the valve controller 128, which processes the measured pressure value received from the pressure sensor 122, determines that a pumping event has occurred.
[0061] Specifically, in this embodiment, the valve controller 128 determines that a venting event is occurring in the first processing chamber 108 in response to a measured pressure associated with the first processing chamber 108 exceeding a first threshold and / or a calculated rate of increase of the measured pressure associated with the first processing chamber 108 exceeding a second threshold.
[0062] The first threshold can be any appropriate threshold. The second threshold can be any appropriate threshold.
[0063] In some embodiments, valve controller 128 determines that a venting event is occurring in the first processing chamber 108 in response to a measured pressure associated with the first processing chamber 108 exceeding a first threshold for at least a first time period. The first time period can be any suitable time period.
[0064] In some embodiments, valve controller 128 determines that a evacuation event is occurring in the first processing chamber 108 in response to a calculated rate of increase of the measured pressure associated with the first processing chamber 108 exceeding a second threshold for at least a second time period. The second time period can be any suitable time period.
[0065] At step s318, in response to the detection of a evacuation event in the first processing chamber 108, the valve controller 128 controls the first gate valve 124 associated with the first processing chamber 108 to close. Therefore, the gas flow from the first processing chamber 108 to the first fluid line manifold 114 is prevented or blocked.
[0066] In this embodiment, valve controller 128 delivers pneumatic fluid (e.g., nitrogen) to first gate valve 124, thereby controlling first gate valve 124.
[0067] At step s320, after closing the first gate valve 124, the valve controller 128 controls the second gate valve 126 associated with the first processing chamber 108 to open. This allows gas flow from the first processing chamber 108 to the second fluid line manifold 116.
[0068] In this embodiment, valve controller 128 delivers pneumatic fluid to second gate valve 126, thereby controlling second gate valve 126.
[0069] At step s322, the vacuum pump 106, connected to the second fluid line manifold 116, pumps the extraction gas out of the first processing chamber 108 via the valve module 104. Specifically, in this embodiment, the extraction gas is pumped from the first processing chamber 108 and sequentially passes through the inlet 110 connected thereto, the second branch 120 of the multi-branched conduit 112 connected thereto (including through the open second gate valve 126 provided on the second branch), and the second fluid line manifold 116.
[0070] Therefore, the extraction gas is pumped out of the first processing chamber 108, thereby establishing a low gas pressure or vacuum environment in the first processing chamber.
[0071] At step s324, the valve controller 128, which processes the measured pressure value received from the pressure sensor 122, determines that the evacuation event has ended.
[0072] Specifically, in this embodiment, the valve controller 128 determines that the evacuation event of the first processing chamber 108 has ended in response to a measured pressure associated with the first processing chamber 108 being less than or equal to a third threshold and / or a calculated reduction rate of the measured pressure associated with the first processing chamber 108 being greater than or equal to a second or fourth value. Alternatively, the evacuation event is terminated after a predetermined period of time has elapsed.
[0073] The third threshold can be any suitable threshold. In some embodiments, the third threshold is equal to or less than the first threshold.
[0074] The fourth threshold can be any suitable threshold. In some embodiments, the fourth threshold is equal to or less than the second threshold.
[0075] In some embodiments, valve controller 128 determines that the evacuation event of the first processing chamber 108 has ended in response to a measured pressure associated with the first processing chamber 108 being less than or equal to a third threshold for at least a third time period. The third time period can be any suitable time period.
[0076] In some embodiments, the valve controller 128 determines that the evacuation event of the first processing chamber 108 has ended in response to a calculated rate of decrease of the pressure measured and associated with the first processing chamber 108 being greater than or equal to a fourth threshold for at least a fourth time period. The fourth time period can be any suitable time period.
[0077] At step s326, in response to the detection that the evacuation event of the first processing chamber 108 has ended, the valve controller 128 controls the second gate valve 126 associated with the first processing chamber 108 to close. Therefore, the gas flow from the first processing chamber 108 to the second fluid line manifold 116 is prevented or blocked.
[0078] At step s328, after the second gate valve 126 is closed, the valve controller 128 controls the first gate valve 124 associated with the first processing chamber 108 to open. This allows gas flow from the first processing chamber 108 to the first fluid line manifold 114.
[0079] At step s330, semiconductor manufacturing processes can be performed in the first processing chamber 108. These semiconductor manufacturing processes generate process gases.
[0080] At step s332, the vacuum pump 106 connected to the first fluid line manifold 114 pumps the generated process gas out of the first process chamber 108 via the valve module 104.
[0081] Therefore, a process 300 for pumping gas in a semiconductor manufacturing apparatus 100 is provided.
[0082] The systems and methods described above advantageously and often reduce or eliminate evacuation events that adversely affect conditions within parallel gas chambers. This is typically achieved by pumping the evacuated gas into a separate manifold, distinct from the manifold into which the process gas is pumped.
[0083] Advantageously, the evacuation event and its termination are often automatically detected and mitigated.
[0084] Advantageously, the valve module described above can be integrated in-line with a horizontal manifold that connects semiconductor processing tools to a vacuum pump.
[0085] Advantageously, the aforementioned valve modules tend to be robust. Vacuum modules can be fully assembled, leak-checked, and pre-tested, for example, off-site before delivery to semiconductor manufacturing equipment, or on-site upon delivery. This often simplifies the installation process and reduces installation time.
[0086] Advantageously, the valve modules described above are often modular and scalable.
[0087] Advantageously, components in the gas flow of a valve module are often easy to maintain, repair, or replace. For example, by closing the manual valves upstream and downstream of each gate valve, the gate valve can be isolated from the fluid flow, thus allowing a human operator to maintain, repair, or replace the gate valve.
[0088] Advantageously, the system's status and operating conditions can often be easily monitored, for example, via the human-machine interface of the valve module or remotely.
[0089] Advantageously, each valve module in the system can often be easily controlled by the system controller, for example, by using a communication protocol such as EtherCAT or Ethernet.
[0090] Advantageously, the valve module described above allows for a variety of installation options. For example, the valve module can be suspended from the ceiling of a semiconductor manufacturing equipment, offering the benefit of not occupying floor space. Alternatively, the valve module can be installed in a floor-mounted frame or on top of other equipment.
[0091] What will now be described is an embodiment in which the valve module is mounted on top of other equipment, particularly on top of a cooling device for controlling the temperature of the processing chamber of a semiconductor processing tool.
[0092] Figure 4 This is a schematic diagram (not drawn to scale) of system 400, in which two valve modules 104 are mounted on top of multiple cooling units 402. The cooling units 402 are commonly referred to as "cooler racks" or "coolers".
[0093] System 400 includes six cooling devices 402, two valve modules 104, a power supply 404, and a pneumatic power source 406.
[0094] In this embodiment, the valve module 104 can be compared with the above-mentioned reference. Figure 1 and Figure 2 The valve modules described are essentially the same. Each valve module 104 is configured to receive a corresponding plurality of pumped fluid flows from a processing chamber 108 in fluid connection with it.
[0095] Each cooling device 402 is fluidly connected to a corresponding processing chamber 108. Each cooling device 402 is configured to supply a flow of cooling fluid to the corresponding processing chamber 108 to which it is connected. The cooling fluid can be used in the processing chamber 108 for temperature control.
[0096] In this embodiment, the valve module 104 and the cooling device 402 are arranged in a stacked configuration. More specifically, each valve module is positioned on top of three cooling devices in the cooling device 402, which are themselves positioned adjacent to each other, for example, in a side-by-side configuration.
[0097] Advantageously, stacked arrangements within semiconductor manufacturing equipment provide a reduced footprint.
[0098] Furthermore, a stacked arrangement often facilitates the connection of the cooling unit 402 and valve module 104 to the processing chamber 108. For example, a stacked arrangement often allows the cooling unit 402 and / or valve module 104 to be positioned closer to the processing chamber 108, thereby reducing conduit length and thus reducing installation time and difficulty. In addition, due to the reduced conduit length, the possibility of leakage or damage to the conduit can be reduced.
[0099] In this embodiment, power supply 404 is electrically connected to each of cooling device 402 and valve module 104. Power supply 404 is configured to supply power to each of cooling device 402 and valve module 104. Therefore, power supply 404 can be considered as a common power source.
[0100] Advantageously, the use of a common power supply for the cooling unit 402 and the valve module 104 facilitates installation and often provides reduced footprint and wiring.
[0101] In this embodiment, a pneumatic source 406 is fluidly connected to each of the cooling device 402 and the valve module 104 via one or more conduits. The pneumatic source 406 is configured to supply pneumatic fluid to each of the cooling device 402 and the valve module 104. Therefore, the pneumatic source 406 can be considered a common pneumatic source. The pneumatic fluid can be any suitable type of gas, including but not limited to nitrogen or CDA (clean dry air).
[0102] Advantageously, the use of a common pneumatic source 406 for the cooling device 402 and valve module 104 facilitates installation and often provides a reduced footprint and pneumatic fluid conduit length.
[0103] In this embodiment, pneumatic fluid received from pneumatic source 406 in valve module 104 can be used to actuate the valves of valve module 104. More specifically, valve controller 128 of valve module 104 can be configured to deliver pneumatic fluid via corresponding pneumatic lines to each of the first gate valve 124 and the second gate valve 126, thereby actuating the first gate valve 124 and the second gate valve 126. Therefore, the pneumatic fluid can be considered a "valve control fluid".
[0104] In this embodiment, pneumatic fluid received from pneumatic source 406 in valve module 104 can be used to perform a purging process to purge a portion of one or more of the multi-branch conduits 112. More specifically, a manual operator can deliver pneumatic fluid to each of the multi-branch conduits 112 via a corresponding purging port in each of the multi-branch conduits 112. The pneumatic fluid can be forced through at least a portion of the multi-branch conduit 112, thereby purging at least a portion of the multi-branch conduit 112. The pneumatic fluid can exit the multi-branch conduit 112 via a first fluid line manifold 114 and / or a second fluid line manifold 116. Therefore, the pneumatic fluid can be considered a "purging fluid". Purging can typically be performed before maintaining or servicing valve module 104, such as replacing the first gate valve 124 and / or the second gate valve 126. Advantageously, by closing the first manual valve 130, the second manual valve 132 and the third manual valve 134, the first gate valve 124 and / or the second gate valve 126 can be isolated from the rest of the system.
[0105] In this embodiment, the purge port in valve module 104 can be used to perform a leak test on one or more of the multi-branched conduits 112. More specifically, valve module 104 may further include means for detecting leaks from the multi-branched conduits 112 using the purge port, or a human operator may use appropriate sensing equipment attached to the purge port to detect the presence of a leak.
[0106] exist Figure 4 In the embodiment shown, there are six cooling devices 402 and two valve modules 104. However, in other embodiments, the system may include a different number of cooling devices and / or a different number of valve modules.
[0107] exist Figure 4 In the illustrated embodiment, each of the valve modules 104 is mounted on top of three cooling devices 402. However, in other embodiments, one or more of the valve modules may be mounted on top of a different number of cooling devices. In some embodiments, one or more cooling devices are mounted on top of one or more valve modules or other equipment.
[0108] In the above embodiments, the valve module is implemented in a semiconductor manufacturing apparatus to guide pumped process gases. However, in other embodiments, the valve module may be implemented in different systems and used to guide different types of fluids.
[0109] In the above embodiments, a single semiconductor processing tool comprises six gas chambers. However, in other embodiments, more than one semiconductor processing tool exists. One or more semiconductor processing tools may include different numbers of gas chambers besides six.
[0110] In the above embodiments, there is a single valve module, or in Figure 4 In this embodiment, there are two valve modules. However, in other embodiments, there may be a different number of valve modules.
[0111] In the above embodiments, the valve module includes six inlets and six multi-branched conduits. However, in other embodiments, the valve module includes a different number of inlets and multi-branched conduits than six.
[0112] In the above embodiments, each multi-branched conduit includes two gate valves, one on each branch. However, in other embodiments, the multi-branched conduit includes a different number of gate valves in addition to two. In some embodiments, the multi-branched conduit includes a single valve (e.g., a three-way valve) operable to direct fluid flow along selected branches on the multi-branched conduit. In some embodiments, multiple gate valves are arranged along each branch. In some embodiments, the multi-branched conduit includes more than two branches, each branch may include one or more corresponding gate valves.
[0113] In the above embodiments, each multi-branched conduit includes three manual valves. However, in other embodiments, the multi-branched conduit includes a different number of manual valves in addition to three. For example, in some embodiments, the manual valves may be omitted. In some embodiments, the multi-branched conduit includes more than three manual valves arranged along the multi-branched conduit in any suitable manner.
[0114] Figure Labels
[0115] 100-Semiconductor Manufacturing Equipment
[0116] 102-Machining Tools
[0117] 104-Valve Module
[0118] 106-Vacuum Pump
[0119] 108-Processing Room
[0120] 110-Entrance
[0121] 112-Multi-branched catheter
[0122] 114-First fluid line manifold
[0123] 116-Second fluid line manifold
[0124] 118 - First Branch
[0125] 120 - Second Branch
[0126] 122-Pressure Sensor
[0127] 124-First Gate Valve
[0128] 126-Second Gate Valve
[0129] 128-Valve Controller
[0130] 130 - First manual valve
[0131] 132-Second manual valve
[0132] 134 - Third manual valve
[0133] 200-Frame
[0134] 300-Process
[0135] S302-S332-Steps
[0136] 400-system
[0137] 402-Cooling device
[0138] 404 Power Supply
[0139] 406-Pneumatic Source
Claims
1. A valve module for a vacuum pumping system, the valve module comprising: Multiple inlets, each of which is configured to receive pumped fluid; Multiple pressure sensors, each of which is configured to measure the pressure of fluid associated with a corresponding inlet of the multiple inlets; First fluid pipeline manifold; Second fluid line manifold; Multiple multi-branched conduits, wherein each multi-branched conduit fluidly connects a corresponding inlet to both the first fluid line manifold and the second fluid line manifold, and includes a first branch and a second branch, the first branch being fluidly connected to the first fluid line manifold and the second branch being fluidly connected to the second fluid line manifold; A plurality of valves, wherein one or more valves of the plurality of valves are disposed in a corresponding multi-branched conduit of the plurality of multi-branched conduits, and each of the one or more valves disposed in the corresponding multi-branched conduit includes a first valve disposed in a first branch of the multi-branched conduit and a second valve disposed in a second branch of the multi-branched conduit; and A valve controller, operatively connected to the plurality of pressure sensors and the plurality of valves; wherein The valve controller is configured to control the plurality of valves based on pressure measurements received from the plurality of pressure sensors, such that each of one or more valves disposed in a respective multi-branched conduit can selectively direct fluid flow through the multi-branched conduit to either the first fluid line manifold only or the second fluid line manifold only.
2. The valve module according to claim 1, wherein: The plurality of pressure sensors include a first pressure sensor configured to measure the pressure of fluid associated with a first inlet of the plurality of inlets, the first inlet being the inlet of a first multi-branched conduit of the plurality of multi-branched conduits; as well as The valve controller is configured to control one or more valves disposed in the first multi-branch conduit in response to a pressure measurement received from the first pressure sensor satisfying one or more first criteria, so as to guide fluid flow through the first multi-branch conduit to the second fluid line manifold.
3. The valve module according to claim 2, wherein, The one or more first criteria consist of one or more criteria selected from a set of criteria consisting of: the measured pressure exceeding a first threshold; the measured pressure exceeding the first threshold for at least a first time period; the rate of increase of the measured pressure exceeding a second threshold; and the rate of increase of the measured pressure exceeding the second threshold for at least a second time period.
4. The valve module according to claim 3, wherein, The valve controller is configured to control one or more valves disposed in the first multi-branch conduit in response to a pressure measurement received from the first pressure sensor satisfying one or more second criteria, to guide fluid flow through the first multi-branch conduit to the first fluid line manifold.
5. The valve module according to claim 4, wherein, The one or more second criteria consist of one or more criteria selected from a set of criteria consisting of: the measured pressure is less than or equal to a third threshold; the measured pressure is less than the third threshold for at least a third time period; the rate of decrease of the measured pressure exceeds a fourth threshold; the rate of decrease of the measured pressure exceeds the fourth threshold for at least a fourth time period; and a predetermined time period has elapsed.
6. The valve module according to any one of claims 1 to 5, wherein, At least the plurality of inlets, the first fluid line manifold, the second fluid line manifold, the plurality of multi-branched conduits, the plurality of valves, and the valve controller are configured as a single integrated unit and housed in a frame.
7. The valve module according to any one of claims 1 to 5, further comprising a plurality of additional valves, wherein, For each of the plurality of valves, a corresponding pair of additional valves are disposed on both sides of the valve.
8. The valve module according to claim 7, wherein, The other valve is a manually operated valve.
9. The valve module according to any one of claims 1 to 5, further comprising a gas inlet for receiving gas for purging one or more of the multi-branched conduits and / or actuating one or more of the valves.
10. A system for semiconductor processing, comprising: Semiconductor processing tools, which include multiple processing chambers; The valve module according to any one of claims 1 to 9, wherein each of the plurality of inlets is fluidly connected to a corresponding processing chamber among the plurality of processing chambers; as well as One or more vacuum pumps are operatively connected to the first fluid line manifold and the second fluid line manifold.
11. The system of claim 10, further comprising a cooling device for supplying cooling fluid to one or more of the processing chambers, wherein, The valve module is located on top of the cooling device.
12. A method for controlling a vacuum pumping system using a valve module according to any one of claims 1 to 9, the method comprising: The pumped fluid is received at each of the multiple inlets, each inlet being an inlet to a corresponding multi-branched conduit among the multiple multi-branched conduits, each multi-branched conduit including a first branch and a second branch, the first branch being fluidly connected to the first fluid line manifold, and the second branch being fluidly connected to the second fluid line manifold, such that each multi-branched conduit fluidly connects the corresponding inlet to both the first fluid line manifold and the second fluid line manifold. The pressure of a particular fluid in the pumped fluid is measured by one or more pressure sensors from a plurality of pressure sensors. as well as The controller controls one or more valves among a plurality of valves based on one or more measured pressures, the one or more valves including a first valve disposed in a first branch of a first multi-branched conduit and a second valve disposed in a second branch of the first multi-branched conduit; The control of one or more valves enables selective guidance of fluid flow through the first multi-branched conduit to either the first fluid line manifold only or the second fluid line manifold only.
13. The method of claim 12, further comprising: The pressure of the fluid pumped in the first multi-branched conduit is measured by the first pressure sensor among multiple pressure sensors. as well as In response to a pressure measurement result received from the first pressure sensor satisfying one or more first criteria, one or more valves disposed in the first multi-branch conduit are controlled to guide fluid flow through the first multi-branch conduit to the second fluid line manifold and to prevent fluid flow through the first multi-branch conduit to the first fluid line manifold.
14. The method of claim 13, further comprising, thereafter, in response to a pressure measurement received from the first pressure sensor satisfying one or more second criteria, controlling one or more valves disposed in the first multi-branch conduit to prevent fluid flow through the first multi-branch conduit to the second fluid line manifold, and subsequently directing fluid flow through the first multi-branch conduit to the first fluid line manifold.