Fluid routing for vacuum pumping systems
By designing a fluid routing module and valve controller, the impact of cavitation events when connecting chambers and turbopumps in semiconductor manufacturing was resolved, achieving robust fluid routing and simplified installation and maintenance, while reducing adverse effects on parallel chambers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- EDWARDS LTD
- Filing Date
- 2022-05-06
- Publication Date
- 2026-07-24
AI Technical Summary
In semiconductor manufacturing, when multiple chambers and turbopumps are connected through a common manifold, performing a evacuation event can cause undesirable fluctuations in the conditions of other chambers.
A fluid routing module is employed, including first and second fluid inlets, outlets, fluid lines, a vacuum pump, and valves. Fluid flow is selectively guided by valve controllers, and restrictors and bypass lines are used to reduce the impact of evacuation events on other chambers.
It effectively reduces or eliminates the adverse effects of cavitation events on parallel chambers and turbo pumps, achieves robust fluid routing, simplifies installation and maintenance, and supports automatic detection and monitoring.
Smart Images
Figure CN117396675B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to fluid routing for vacuum pumping systems, including but not limited to vacuum systems for pumping fluids from semiconductor processing tools. Background Technology
[0002] Semiconductor manufacturing plants produce integrated circuit chips. In manufacturing these devices, wafers are processed through multiple different stations, including stations that undergo processes such as chemical vapor deposition, physical vapor deposition, implantation, etching, and photolithography. Many of these processes involve the use of gaseous environments and typically require high vacuum and reduced gas pressure.
[0003] Vacuum pumps are used to provide these reduced gas pressures in the processing chamber, to evacuate the chamber, and to maintain the flow of process gases. Summary of the Invention
[0004] When the pressure inside the chamber of a semiconductor processing tool is not at a working vacuum, such as after the processing chamber has been ventilated to atmospheric pressure to enable maintenance or servicing, a so-called "evacuation event" is performed to establish the required reduced gas pressure within the chamber. An evacuation event involves pumping gas from the chamber to reduce its pressure to the desired level.
[0005] Similarly, when the pressure in the pumping chamber of a vacuum pump (e.g., a turbopump) is at atmospheric pressure, such as after the vacuum pump has been shut down to allow for maintenance or upkeep, a evacuation event is performed to establish a reduced gas pressure in the pumping chamber of the vacuum pump.
[0006] Vacuum and evacuation systems can be used to simultaneously pump gases from multiple processing chambers of a semiconductor processing tool via a common pump and a common manifold. The inventors have recognized that in such systems, because multiple chambers and / or multiple turbopumps can be fluidly connected to the common manifold, performing a evacuation event on one of those chambers and / or turbopumps can affect conditions in the other chambers within those chambers. For example, a evacuation event performed on one chamber can cause highly undesirable fluctuations in other chambers connected to the same manifold.
[0007] An aspect of the present invention provides a valve module for controlling fluid from multiple chambers of a semiconductor processing tool, thereby reducing or eliminating these defects.
[0008] In a first aspect, a fluid routing module for a vacuum pumping system is provided, the fluid routing module comprising: a first fluid inlet; a second fluid inlet; a fluid outlet; a first fluid line connected between the first fluid inlet and the fluid outlet; a second fluid line connected between the second fluid inlet and the fluid outlet; a first limiter configured to restrict fluid flow therethrough, the first limiter being disposed along the first fluid line; a vacuum pump disposed along the second fluid line; and one or more valves configured to selectively direct fluid flow through the first fluid line or the second fluid line.
[0009] The one or more valves may include a first valve and a second valve, wherein the first valve may be disposed along the first fluid line. The second valve may be disposed along the first fluid line.
[0010] The fluid routing module may include: a second restrictor configured to restrict fluid flow therethrough, the second restrictor being disposed along the second fluid line; a bypass line disposed in parallel with the second restrictor, thereby allowing fluid flow to bypass the second restrictor; and one or more additional valves configured to selectively direct fluid flow through the second restrictor or the bypass line. The second restrictor and the bypass line may be disposed along the second fluid line between the vacuum pump and the fluid outlet. The one or more additional valves may include a three-way valve disposed between the vacuum pump and the second restrictor and the bypass line.
[0011] A vacuum pump can be a turbopump.
[0012] The fluid routing module may also include a valve controller configured to control the operation of one or more valves.
[0013] The fluid routing module may further include: one or more additional first fluid inlets; one or more additional second fluid inlets; one or more additional fluid outlets; one or more additional first fluid lines, each additional first fluid line connected between a corresponding additional first fluid inlet and an additional fluid outlet; one or more additional second fluid lines, each additional second fluid line connected between a corresponding second fluid inlet and an additional fluid outlet; one or more additional first restrictors configured to restrict fluid flow therethrough, each additional first restrictor disposed along a corresponding additional first fluid line; one or more additional vacuum pumps, each additional vacuum pump disposed along a corresponding additional second fluid line; and one or more additional valves configured to selectively direct fluid flow through the additional first fluid line or the additional second fluid line.
[0014] The fluid routing module may also include a fluid line manifold. Fluid outlets and / or one or more additional fluid outlets may be fluidly connected to the fluid line manifold.
[0015] In another aspect, a system is provided comprising: a semiconductor processing tool including a processing chamber; a fluid routing module according to any of the foregoing aspects, wherein a first fluid inlet and a second fluid inlet are fluidly coupled to the processing chamber; and a pump operatively coupled to a fluid outlet.
[0016] The semiconductor processing tool may also include one or more additional processing chambers. The system may also include one or more additional fluid routing modules, each additional fluid routing module being a fluid routing module according to any of the foregoing aspects, wherein a first fluid inlet and a second fluid inlet of each additional fluid routing module are fluidly coupled to a corresponding additional processing chamber. The system may also include a fluid line manifold, wherein the fluid outlets of the fluid routing modules and each of the fluid routing modules are fluidly coupled to the fluid line manifold. A pump may be operatively coupled to the fluid line manifold.
[0017] In another aspect, a method is provided for operating a fluid routing module for a vacuum pumping system. The fluid routing module is the fluid routing module according to the foregoing aspect. The method includes: controlling one or more valves to direct fluid flow through a first fluid line and prevent or block fluid flow through a second fluid line; and controlling the one or more valves to allow fluid flow through the second fluid line and prevent or block fluid flow through the first fluid line in response to satisfying one or more conditions; and pumping the fluid through the second fluid line via the vacuum pump.
[0018] The one or more conditions may include the following condition: the pressure in the chamber fluidly connected to the first fluid input and the second fluid inlet is lower than a first threshold pressure.
[0019] The method may further include: controlling the one or more additional valves to direct fluid flow through the second restrictor and prevent or block fluid flow through the bypass line; and controlling the one or more additional valves to allow fluid flow through the bypass line and prevent or block fluid flow through the second restrictor in response to satisfying one or more additional conditions. The one or more additional conditions may include the condition that the pressure in the pumping chamber of the vacuum pump is below a second threshold pressure. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of a semiconductor manufacturing facility (not drawn to scale);
[0021] Figure 2 This is a schematic diagram (not drawn to scale) showing further details of the pumping module of a semiconductor manufacturing facility; and
[0022] Figure 3 This is a process flow diagram illustrating certain steps of the process of pumping gas in a semiconductor manufacturing facility, including evacuation events. Detailed Implementation
[0023] Figure 1 This is a schematic diagram (not drawn to scale) of a semiconductor manufacturing facility 100 according to an embodiment.
[0024] The semiconductor manufacturing facility 100 includes a semiconductor processing tool 102, a fluid routing module 104, and a vacuum pump 106.
[0025] Semiconductor processing tool 102 includes a plurality of processing chambers 108 in which semiconductor wafers undergo corresponding processing. Examples of such processing include, but are not limited to, chemical vapor deposition, physical vapor deposition, implantation, etching, and photolithography.
[0026] The vacuum pump 106 is configured to pump fluid (i.e., process gas) out of the processing chamber 108 of the semiconductor processing tool 102 via the fluid routing module 104.
[0027] The fluid routing module 104 includes multiple inlets (specifically multiple first inlets 110a and multiple second inlets 110b), multiple pumping modules 112, multiple pumping module outlets 114, and fluid line manifolds 116.
[0028] A corresponding pair of first and second inlets 110a, 110b are fluidly connected between the respective processing chamber 108 and the respective pumping module 112, such that fluid can flow from the processing chamber 108 to the pumping module 112 via either or both of these first and second inlets 110a, 110b.
[0029] See below for reference. Figure 2 The pumping module 112 is described in more detail.
[0030] Each pumping module 112 is fluidly connected to the fluid line manifold 116 via a corresponding pumping module outlet 114, allowing fluid to flow from the pumping module 112 to the fluid line manifold 116.
[0031] The fluid line manifold 116 is fluidly connected between the outlets 114 of the multiple pumping modules and the vacuum pump 106.
[0032] The fluid routing module 104 also includes a valve controller 118.
[0033] Valve controller 118 is operatively coupled to each of the plurality of valves included in pumping module 112 via corresponding pneumatic lines and / or electrical connections (not shown). See below. Figure 2 These valves will be described in more detail. See the reference below for further details. Figure 3 In more detail, valve controller 118 is configured to control the operation of valves of pumping module 112, for example by transmitting pneumatic fluid there via pneumatic lines.
[0034] Figure 2 This is a schematic diagram (not drawn to scale) showing further details of the pumping module 112. In this embodiment, the pumping modules 112 of the fluid routing module 104 are substantially identical to each other.
[0035] In this embodiment, the first inlet 110a and the second inlet 110b are fluid inlets of the pumping module 112. Furthermore, the pumping module outlet 114 is the fluid outlet of the pumping module 112.
[0036] The pumping module 112 includes a first fluid line 200 connected between a first inlet 110a and a pumping module outlet 114, and a second fluid line 202 connected between a second inlet 110b and a pumping module outlet 114.
[0037] The pumping module 112 also includes a first restrictor 204 and a first valve 206, both disposed along the first fluid line 200. The first restrictor 204 is disposed between the first inlet 110a and the first valve 206. The first valve 206 is disposed between the first restrictor 204 and the pumping module outlet 114.
[0038] The first limiter 204 is configured to restrict the flow of fluid through it.
[0039] The first valve 206 is configured to control the flow of fluid through it. In particular, in this embodiment, the first valve 206 is configured to be controlled by a valve controller 118 to selectively allow or block the flow of fluid through it.
[0040] The pumping module 112 also includes an automatic pressure control (APC) module 208, a turbo pump 210, a second valve 212, a third valve 214, a second limiter 216, and a bypass conduit or line 218.
[0041] APC module 208, turbine pump 210, second valve 212, third valve 214, second restrictor 216, and bypass line 218 are arranged along second fluid line 202. APC module 208 is arranged between second inlet 110b and turbine pump 210. Turbine pump 210 is arranged between APC module 208 and third valve 214. Third valve 214 is arranged between turbine pump 210 and second restrictor 216. Second restrictor 216 is arranged between third valve 214 and second valve 212. Bypass line 218 is also arranged between third valve 214 and second valve 212, and is connected in parallel with second restrictor 216. Second valve 212 is arranged between second restrictor 216 (and bypass line 218) and pump module outlet 114.
[0042] APC module 208 is configured to control fluid flow therethrough. APC module 208 may include a movable valve with a controller. The valve of APC module 208 may include a movable pendulum, which may be controlled by the controller of APC module 208 to increase or decrease the size of an orifice in the chamber exhaust path. APC module 208 may receive a pressure setpoint and actual pressure readings within the processing chamber 108. The controller of APC module 208 may then control the pendulum according to a control algorithm until the actual pressure measurement matches the setpoint. In some embodiments, the valve of APC module 208 may be controlled by valve controller 118.
[0043] Turbo pump 210 is connected to the corresponding processing chamber 108 via a second inlet 110b. Turbo pump 210 is configured to pump exhaust gas from processing chamber 108 through a second fluid line 202 and discharge it from pump module outlet 114.
[0044] In this embodiment, the third valve 214 is a three-way valve arranged to receive fluid flow from the turbine pump 210 and selectively direct the fluid flow through the second limiter 216 or the bypass line 218. The third valve 214 is controlled by the valve controller 118.
[0045] The second limiter 216 is configured to restrict the flow of fluid through it.
[0046] The bypass line 218 is connected in parallel with the second restrictor 216 and is arranged to allow fluid flow to bypass the second restrictor 216. The bypass line 218 allows fluid flow to bypass the second restrictor 216 and to flow relatively unrestricted between the third valve 214 and the second valve 212.
[0047] The second valve 212 is configured to control the flow of fluid through it. In particular, in this embodiment, the second valve 212 is configured to be controlled by the valve controller 118 to selectively allow or prevent the flow of fluid through it.
[0048] The apparatus including valve controller 118 for implementing the above arrangement and performing the method steps described below can be provided by constructing or adapting any suitable device (e.g., one or more computers or other processing devices or processors) and / or providing additional modules. The apparatus may include a computer, computer network, or one or more processors for implementing instructions and using data, including instructions and data in the form of one or more computer programs, stored in or on a machine-readable storage medium such as computer memory, computer disk, ROM, PROM, etc., or any combination of such or other storage media.
[0049] The system described above can undergo a evacuation event to discharge gas from one or more of the processing chambers 108 (which may be at atmospheric pressure) to reduce the pressure within them to a level suitable for semiconductor manufacturing processes. An evacuation event can also be performed to discharge gas from the pumping chamber of one or more turbopumps in the pumping module.
[0050] Figure 3 This is a process flow diagram illustrating certain steps of the process 300 for pumping gas in a semiconductor manufacturing facility 100, including evacuation events.
[0051] It should be noted that Figure 3 Certain process steps depicted in the flowchart and described below may be omitted, or these process steps may be presented differently from those shown below. Figure 3 The processes are executed in the order shown. Furthermore, although all process steps have been depicted as discrete, time-sequential steps for convenience and ease of understanding, some of these process steps may actually be executed simultaneously or at least overlap in time to some extent.
[0052] In step s302, a semiconductor manufacturing process is performed in the processing chamber 108. These semiconductor manufacturing processes generate process gases.
[0053] In this embodiment, at this stage, for each pumping module 112, the first valve 206 is closed, the second valve 212 is open, and the third valve 214 is configured to guide the process gas flow via the bypass line 218. Therefore, in step s302, the vacuum pump 106 pumps the process gas from the processing chamber 108 through the relatively unrestricted second fluid line 202 of the pumping module 112 and into the fluid line manifold 116.
[0054] In step s304, one of the processing chambers 108 (hereinafter referred to as "first processing chamber 108" for convenience) is closed for inspection, maintenance, repair, or servicing. In this embodiment, closing the first processing chamber 108 includes stopping the pumping of gas from the first processing chamber 108. In this embodiment, this is achieved by closing the first valve 206 and the second valve 212 of the pumping module 112 associated with the first processing chamber 108. The turbopump 210 of the pumping module 112 associated with the first processing chamber 108 is also shut down. In this embodiment, closing the first processing chamber 108 also includes increasing the pressure in the first processing chamber 108 to approximately atmospheric pressure. This can be achieved by opening the valves coupled to the first processing chamber 108 to allow air to enter the first processing chamber 108. Furthermore, in this embodiment, the pressure in the pumping chamber of the turbopump 210 of the pumping module 112 associated with the first processing chamber 108 is also increased to approximately atmospheric pressure.
[0055] In step s306, the operator performs inspection, maintenance, repair, or servicing operations on the first processing chamber 108. Alternatively or additionally, inspection, maintenance, repair, or servicing may be performed on one or more components of the pumping module 112 associated with the first processing chamber 108.
[0056] After inspection, maintenance, repair or servicing operations, a low gas pressure environment will be re-established in the first processing chamber 108 so that semiconductor manufacturing processes can be performed therein.
[0057] Therefore, in step s308, the first valve 206 of the pumping module 112 associated with the first processing chamber 108 is opened by the valve controller 118.
[0058] In step s310, with the first valve 206 open, the vacuum pump 106 pumps gas from the first processing chamber 108 to the fluid line manifold 116 along the first fluid line 200.
[0059] Therefore, the first processing chamber 108 is "evacuated". This airflow from the first processing chamber 108 is restricted by a first restrictor 204 positioned along the first fluid line 200. Advantageously, this flow restriction of the first restrictor 204 tends to reduce or eliminate the evacuation of the first processing chamber 108, which adversely affects the conditions within the parallel processing chambers 108.
[0060] In step s312, in response to the completion of evacuation of the first processing chamber 108, valve controller 118 closes the first valve 206 of the pumping module 112 associated with the first processing chamber 108. Furthermore, valve controller 118 opens the second valve 212 of the pumping module 112 associated with the first processing chamber 108. Additionally, valve controller 118 controls the third valve 214 of the pumping module 112 associated with the first processing chamber 108, such that the third valve 214 directs fluid flow through the second restrictor 216 instead of through the bypass line 218.
[0061] In some embodiments, in step s312, the valve controller 118 may also control the APC module 208 to prevent or block fluid flow through it.
[0062] The completion of evacuation of the first processing chamber 108 can be detected by any suitable device. For example, valve controller 118 may determine that evacuation of the first processing chamber 108 has been completed in response to a measurement of the pressure within the first processing chamber 108 being at or below a first threshold and / or a calculated rate of decrease of the measured pressure associated with the first processing chamber 108 being at or below a second threshold. The first threshold can be any suitable threshold. The second threshold can be any suitable threshold.
[0063] In step s314, with the second valve 206 open and the third valve 214 guiding fluid flow through the second restrictor 216, the vacuum pump 106 pumps gas from the pumping chamber of the turbo pump 210 to the fluid line manifold 116 along the second fluid line 202.
[0064] Therefore, the pumping chamber of turbopump 210 is "evacuated". This airflow from the pumping chamber of turbopump 210 is restricted by a second restrictor 216 positioned along the second fluid line 202. Advantageously, this flow restriction of the second restrictor 216 tends to reduce or eliminate evacuation of the pumping chamber of turbopump 210, which adversely affects the conditions within the parallel processing chamber 108.
[0065] In step s316, in response to the completion of evacuation of the pumping chamber of the turbine pump 210, the valve controller 118 controls the third valve 214 of the pumping module 112 associated with the first processing chamber 108, such that the third valve 214 directs fluid flow through the bypass line 218 instead of the second limiter 216.
[0066] In some embodiments, in step s316, valve controller 118 may also control APC module 208 to allow fluid flow through it.
[0067] The completion of evacuation of the pumping chamber of turbopump 210 can be detected by any suitable device. For example, valve controller 118 can determine that evacuation of the pumping chamber of turbopump 210 has been completed in response to a measurement of the pressure in the pumping chamber of turbopump 210 being at or below a third threshold and / or a calculated rate of decrease of the measured pressure associated with the pumping chamber of turbopump 210 being at or below a fourth threshold. The third threshold can be any suitable threshold. The fourth threshold can be any suitable threshold.
[0068] In step s318, after the third valve 214 of the pumping module 112 associated with the first processing chamber 108 is controlled to direct fluid flow through the bypass line 218, semiconductor manufacturing processes can be performed in the first processing chamber 108. These semiconductor manufacturing processes generate process gases.
[0069] In step s320, vacuum pump 106 pumps gas from the first processing chamber 108 through a relatively unrestricted second fluid line 202 associated with pumping module 112 and into fluid line manifold 116.
[0070] Therefore, a process 300 for pumping gas in a semiconductor manufacturing facility 100 is provided.
[0071] The systems and methods described above advantageously tend to reduce or eliminate evacuation events that adversely affect conditions within parallel processing chambers. This is preferably achieved by pumping evacuation gas via a restrictor (i.e., a restricted pipe or a reduced-diameter orifice).
[0072] Advantageously, evacuation events and their termination tend to be automatically detected and mitigated.
[0073] Advantageously, the fluid routing module described above can be integrated in-line with a horizontal manifold that connects semiconductor processing tools to a vacuum pump.
[0074] Advantageously, the aforementioned fluid routing modules tend to be robust. Vacuum modules can be fully assembled, leak-checked, and pre-tested, for example, off-site before delivery to the semiconductor manufacturing facility, or on-site upon delivery. This tends to simplify the installation process and reduce installation time.
[0075] Advantageously, the fluid routing modules described above tend to be modular and scalable.
[0076] Advantageously, the components in the airflow of the fluid routing module tend to be easy to maintain, repair, or replace.
[0077] Advantageously, the system's status and operating conditions tend to be easily monitored, for example, via the human-machine interface of the valve module or remotely.
[0078] Advantageously, each fluid routing module in the system tends to be easily controllable by the system controller, for example, using communication protocols such as EtherCAT or Ethernet.
[0079] Advantageously, the fluid routing module described above allows for a variety of installation options. For example, the fluid routing module can be suspended from the ceiling of a semiconductor manufacturing facility, providing the benefit of not occupying floor space. Alternatively, the fluid routing module can be installed in a floor-standing rack or mounted on top of other equipment.
[0080] In the above embodiments, a fluid routing module is implemented in a semiconductor manufacturing facility to guide the pumped process gas. However, in other embodiments, the fluid routing module may be implemented in different systems and used to guide different types of fluids.
[0081] In the above embodiments, a single semiconductor processing tool comprises six processing chambers. However, in other embodiments, more than one semiconductor processing tool exists. One or more of the semiconductor processing tools may include different numbers of processing chambers in addition to six.
[0082] In the above embodiments, a single fluid routing module includes six pumping modules. However, in other embodiments, a different number of fluid routing modules may exist, i.e., multiple fluid routing modules. In some embodiments, one or more of the fluid routing modules may include a different number of pumping modules in addition to six.
[0083] In the above embodiments, the pumping module includes two inlets connected to a single outlet. However, in other embodiments, one or more of the pumping modules include a different number of inlets (other than two) and a different number of outlets (other than one).
[0084] In the above embodiments, each pumping module includes a first valve, a second valve, and a third valve configured to provide the functions described above. However, in other embodiments, one or more of the pumping modules may include different arrangements or configurations of the valves providing the functions described above. For example, in some embodiments, the first and second valves of one or more of the pumping modules may be replaced by a three-way valve located at the junction of the first fluid line, the second fluid line, and the pumping module outlet. This three-way valve may be configured to direct fluid from one of the first fluid line and the second fluid line to the pumping module outlet and prevent or block fluid from flowing into the pumping module outlet from the other of the first fluid line and the second fluid line. Furthermore, for example, in some embodiments, the third valve may be replaced by one or more valves disposed along a bypass line.
[0085] In some embodiments, the APC module may be omitted or replaced by one or more valves.
[0086] Figure Labels
[0087] 100-Semiconductor Manufacturing Facilities
[0088] 102-Processing Tools
[0089] 104-Fluid Routing Module
[0090] 106-Vacuum Pump
[0091] 108-Processing Chamber
[0092] 110a - First Entrance
[0093] 110b - Second Entrance
[0094] 112-Pumping Module
[0095] 114-Pumping Module Outlet
[0096] 116-Fluid Piping Manifold
[0097] 118-Valve Controller
[0098] 200-First Fluid Pipeline
[0099] 202-Second Fluid Pipeline
[0100] 204 - First Limiter
[0101] 206-First Valve
[0102] 208-Automatic Pressure Control Module
[0103] 210-Turbine Pump
[0104] 212-Second Valve
[0105] 214-Third Valve
[0106] 216-Second Limiter
[0107] 218 - Bypass conduit or pipeline
[0108] 300 – Process
[0109] S302-S320-Steps
Claims
1. A fluid routing module for a vacuum pumping system, the fluid routing module comprising: First fluid inlet; Second fluid inlet; Fluid outlet; A first fluid line is connected between the first fluid inlet and the fluid outlet; A second fluid line is connected between the second fluid inlet and the fluid outlet; A first limiter, configured to restrict fluid flow therethrough, is disposed along the first fluid line; A vacuum pump is disposed along the second fluid line; One or more valves, the one or more valves being configured to selectively direct fluid flow through the first fluid line or the second fluid line; A second limiter, configured to restrict fluid flow therethrough, is disposed along the second fluid line; A bypass line, which is arranged in parallel with the second restrictor, thereby allowing fluid flow to bypass the second restrictor; as well as One or more additional valves, which are configured to selectively direct fluid flow through the second restrictor or the bypass line.
2. The fluid routing module as described in claim 1, wherein: The one or more valves include: First valve; and Second valve; The first valve is disposed along the first fluid line; and The second valve is disposed along the second fluid line.
3. The fluid routing module as described in claim 1, wherein, The second limiter and the bypass line are disposed between the vacuum pump and the fluid outlet along the second fluid line.
4. The fluid routing module as described in claim 3, wherein, The one or more additional valves include a three-way valve disposed between the vacuum pump and the second limiter and the bypass line.
5. The fluid routing module as described in any one of claims 1 to 4, wherein, The vacuum pump is a turbopump.
6. The fluid routing module of any one of claims 1 to 4, further comprising a valve controller configured to control the operation of the one or more valves.
7. The fluid routing module as described in any one of claims 1 to 4, further comprising: One or more additional first fluid inlets; One or more additional second fluid inlets; One or more additional fluid outlets; One or more additional first fluid lines, each additional first fluid line being connected between a corresponding additional first fluid inlet and an additional fluid outlet; One or more additional second fluid lines, each additional second fluid line being connected between a corresponding additional second fluid inlet and an additional fluid outlet; One or more additional first restrictors are configured to restrict the flow of fluid through them, each additional first restrictor being disposed along a corresponding additional first fluid line; One or more additional vacuum pumps, each additional vacuum pump being arranged along a corresponding additional second fluid line; as well as One or more additional valves, the one or more additional valves being configured to selectively direct fluid flow through an additional first fluid line or an additional second fluid line.
8. The fluid routing module as described in claim 7, further comprising a fluid pipeline manifold, wherein, The fluid outlet and the one or more additional fluid outlets are fluidly connected to the fluid line manifold.
9. A vacuum pumping system, comprising: A semiconductor processing tool, the semiconductor processing tool including a processing chamber; The fluid routing module as described in any one of claims 1 to 8, wherein the first fluid inlet and the second fluid inlet are fluidly connected to the processing chamber; as well as A pump, which is operatively connected to the fluid outlet.
10. The vacuum pumping system as claimed in claim 9, wherein: The semiconductor processing tool also includes one or more additional processing chambers; The vacuum pumping system further includes one or more additional fluid routing modules, each additional fluid routing module being a fluid routing module according to any one of claims 1 to 8, wherein the first fluid inlet and the second fluid inlet of each additional fluid routing module are fluidly connected to a corresponding additional processing chamber; The vacuum pumping system further includes a fluid manifold, wherein the fluid outlet of the fluid routing module and each fluid in the fluid routing module are fluidly connected to the fluid manifold; and The pump is operatively connected to the fluid line manifold.
11. A method for operating a fluid routing module for a vacuum pumping system, said fluid routing module being the fluid routing module according to any one of claims 1 to 8, the method comprising: Control the one or more valves to direct fluid flow through the first fluid line and prevent or block fluid flow through the second fluid line; as well as In response to the fulfillment of one or more conditions, the one or more valves are controlled to allow fluid flow through the second fluid line and prevent or block fluid flow through the first fluid line, and the fluid is pumped through the second fluid line by the vacuum pump.
12. The method of claim 11, wherein, The one or more conditions include the condition that the pressure in the chamber fluidly connected to the first fluid inlet and the second fluid inlet is lower than a first threshold pressure.
13. The method of claim 12, wherein: The method further includes: Controlling the one or more additional valves to direct fluid flow through the second restrictor and prevent or block fluid flow through the bypass line; and In response to the fulfillment of one or more additional conditions, the one or more additional valves are controlled to allow fluid flow through the bypass line and to prevent or block fluid flow through the second restrictor.
14. The method of claim 13, wherein, The one or more additional conditions include the condition that the pressure in the pumping chamber of the vacuum pump is below the second threshold pressure.