A high-precision object positioning device and method based on a Dtof chip

Abstract

This invention provides a high-precision object positioning device and method based on a DOF chip. The positioning device includes a DOF chip for acquiring point cloud data of the field of view; an electrically controlled variable field-of-view lens, positioned directly in front of and fixed relative to the DOF chip, for adjusting the field of view of the DOF chip; an electrically controlled micro-displacement stage, supporting the DOF chip and the electrically controlled variable field-of-view lens, for adjusting their positions on the stage; and a core controller connected to the DOF chip, the electrically controlled variable field-of-view lens, and the electrically controlled micro-displacement stage. The core controller acquires the point cloud data from the DOF chip, sends control commands to the electrically controlled variable field-of-view lens to adjust the field of view of the DOF chip, and sends control commands to the electrically controlled micro-displacement stage to adjust the positions of the DOF chip and the electrically controlled variable field-of-view lens on the stage. This invention achieves high-precision positioning of the target object.

Description

Technical Field

[0001] This invention relates to the field of object tracking and positioning technology, and in particular to a high-precision object positioning device and method based on a Dtof chip. Background Technology

[0002] Tracking objects within a certain area typically uses a single image sensor, but this has the drawback of being unable to perceive the distance between the object and the measurement point. Binocular image sensors can be used for object tracking, calculating the distance between the object and the measurement point, but these sensors are highly complex, computationally intensive, and have high structural requirements, limiting their applicability. When using existing solid-state, semi-solid-state, and mechanical lidar for object tracking, insufficient resolution leads to inaccurate tracking over a large area, affecting the accuracy of the measurement results.

[0003] Therefore, it is necessary to provide a high-precision object positioning device and method based on a Dtof chip to effectively solve the above problems. Summary of the Invention

[0004] This invention provides a high-precision object positioning device and method based on a Dtof chip, which enables high-precision positioning of target objects.

[0005] This invention provides a high-precision object positioning device based on a Dtof chip, comprising:

[0006] Dtof chip, the Dtof chip is used to acquire point cloud data of the field of view;

[0007] An electronically controlled variable field-of-view lens is positioned directly in front of the Dtof chip and fixed relative to the Dtof chip to adjust the field of view of the Dtof chip.

[0008] An electrically controlled micro-displacement stage carries the Dtof chip and the electrically controlled variable field of view lens, and is used to adjust the position of the Dtof chip and the electrically controlled variable field of view lens on the electrically controlled micro-displacement stage;

[0009] The core controller is connected to the Dtof chip, the electronically controlled variable field-of-view lens, and the electronically controlled micro-displacement stage. The core controller acquires the point cloud data of the Dtof chip, sends control commands to the electronically controlled variable field-of-view lens to adjust the field of view of the Dtof chip, and sends control commands to the electronically controlled micro-displacement stage to adjust the positions of the Dtof chip and the electronically controlled variable field-of-view lens on the electronically controlled micro-displacement stage.

[0010] Preferably, the device further includes a laser emitter that emits a laser in the direction of the Dtof chip's field of view, and the laser emitted by the laser emitter completely covers the field of view of the Dtof chip.

[0011] Preferably, the Dtof chip is an image sensing chip with a 16x16 array of 256 pixels.

[0012] Based on the same concept, embodiments of the present invention also provide a high-precision object localization method based on a Dtof chip, comprising the following steps:

[0013] Deploy an electronically controlled micro-displacement stage, a Dtof chip, an electronically controlled variable field of view lens, a laser emitter, and a core controller, with the Dtof chip positioned in the first position;

[0014] Control the electronically controlled variable field of view lens to change the field of view so that the field of view of the Dtof chip is the first field of view;

[0015] The laser emitter and the core controller are activated, and the core controller obtains the first point cloud at the first field of view through the Dtof chip;

[0016] Filter the first point cloud to obtain the target pixel and record the point cloud coordinates of the target pixel;

[0017] Based on the point cloud coordinates of the target object's pixels, the moving direction and moving distance of the Dtof chip and the electronically controlled variable field of view lens on the electronically controlled micro-displacement stage are calculated, so that the Dtof chip moves to a second position facing the target object.

[0018] The electronically controlled variable field-of-view lens is controlled to change the field of view so that the viewing angle of the Dtof chip is the second field of view;

[0019] The core controller obtains the second point cloud at the second field of view through the Dtof chip;

[0020] The second point cloud is filtered to obtain the pixel point that is closest to the target object and the Dtof chip, thus obtaining the closest distance between the target object and the Dtof chip.

[0021] Preferably, the core controller acquires a first point cloud at a first field of view and acquires first point cloud data, the first point cloud data including distance information and point cloud coordinate information of 256 pixels; the positioning method includes:

[0022] Extract the distance information of 256 pixels from the first point cloud data, take the nearest pixel as the target pixel, and record the point cloud coordinate information of the target pixel;

[0023] The target object pixels are represented as follows:

[0024] D 1min =min(D 1x (x∈(0, 255))

[0025] I = I x (D 1min )

[0026] J = J x (D 1min );

[0027] Where x represents a pixel; D 1x D represents the distance between pixels in the first point cloud data. 1min The shortest distance between pixels in the first point cloud data; I x (D 1min J represents the x-coordinate of the point cloud of the shortest distance pixel. x (D 1min ) represents the ordinate of the point cloud of the shortest distance pixel; I represents the abscissa of the point cloud of the target pixel; and J represents the ordinate of the point cloud of the target pixel.

[0028] Preferably, the Dtof chip is an image sensing chip with a 16x16 array of 256 pixels; when the Dtof chip is in the first position, the center of the Dtof chip corresponds to the center of the point cloud, and is located in the middle of four points with point cloud coordinates (7, 7), (7, 8), (8, 7), and (8, 8) in the first point cloud. The electrically controlled micro-displacement stage is rectangular, and the positioning method includes: calculating the moving distance of the Dtof chip on the electrically controlled micro-displacement stage based on the position of the point cloud coordinates corresponding to the first position and the position of the target pixel. The moving distance of the Dtof chip is calculated by the following formula:

[0029]

[0030]

[0031] Where, ΔI D Let K be the lateral displacement distance, K be the side length of the side of the electronically controlled micro-displacement stage facing the Dtof chip, and I be the x-coordinate of the point cloud of the target pixel; if ΔI D If the value is negative, it moves in the direction of decreasing coordinate value. If ΔI D If the value is positive, it moves in the direction that increases the coordinate value;

[0032] ΔJ D Let K be the longitudinal displacement distance, K be the side length of the side of the electronically controlled micro-displacement stage facing the Dtof chip, and J be the point cloud ordinate of the target pixel; if ΔJ DIf the value is negative, it moves in the direction of decreasing coordinate value. If ΔJ D If the value is positive, the movement will be in the direction of increasing coordinate value.

[0033] Preferably, the first field of view includes all areas that the target object may reach, that is, the first field of view is greater than the minimum scene field of view, which is calculated by the following formula:

[0034]

[0035] Where θ1 is the minimum scene field of view, d is the farthest distance between the target object and the measurement point where the Dtof chip is located, and R is the maximum radius of the target object's movement.

[0036] Preferably, the second field of view includes the target object, that is, the second field of view is greater than the minimum target object field of view, which is calculated by the following formula:

[0037]

[0038] Where θ2 is the minimum field of view of the target object, d is the farthest distance between the target object and the measurement point where the Dtof chip is located, and r is the maximum radius of the target object.

[0039] Preferably, the core controller acquires a second point cloud at a second field of view and acquires second point cloud data, the second point cloud data including distance information and point cloud coordinate information of 256 pixels; the positioning method includes:

[0040] Distance information of 256 pixels in the second point cloud data is extracted to obtain the closest distance between the target object and the Dtof chip.

[0041] Preferably, the positioning method includes:

[0042] The electrically controlled micro-displacement stage is installed, and the Dtof chip is placed at the first position of the electrically controlled micro-displacement stage, the first position being the center of the electrically controlled micro-displacement stage.

[0043] Compared with the prior art, the technical solution of the embodiments of the present invention has the following beneficial effects:

[0044] This invention provides a high-precision object positioning device and method based on a Dtof chip. The Dtof chip, together with an electrically controlled variable field-of-view lens and an electrically controlled micro-displacement stage, obtains the approximate position of the target object through a first large-angle measurement. Based on the approximate position, the Dtof chip and the adjustable field-of-view lens are adjusted for a second measurement to obtain a high-precision point cloud within the desired range, thereby obtaining the ideal distance, position and other information of the target object. This achieves high-resolution point cloud measurement at low cost.

[0045] Furthermore, a first field of view is set according to the usage scenario to capture the target object and obtain its approximate position. A second field of view is set according to the usage scenario and the size of the target object to achieve high-resolution point cloud measurement of the target object, thereby achieving precise positioning of the target object and improving measurement accuracy.

[0046] Furthermore, the Dtof chip and the electronically controlled variable field of view lens are adjusted by using an electronically controlled micro-displacement stage. Based on the approximate position of the target object, the Dtof chip is adjusted to face the target object, making it possible to acquire high-resolution point cloud data of the target object from a small field of view. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention, but not all embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 This is a schematic diagram of a high-precision object positioning device based on a Dtof chip according to an embodiment of the present invention;

[0049] Figure 2 This is a flowchart of a high-precision object localization method based on a Dtof chip according to an embodiment of the present invention;

[0050] Figure 3 This is a schematic diagram of a first point cloud according to an embodiment of the present invention;

[0051] Figure 4 This is a schematic diagram comparing a first point cloud and a second point cloud according to an embodiment of the present invention.

[0052] In the picture:

[0053] 1. Core controller; 2. Electrically controlled micro-displacement stage; 3. DOF chip; 4. Electrically controlled variable field of view lens; 5. Laser emitter; 6. First position; 7. Second position. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0055] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0056] It should be noted that the axial, radial, and circumferential directions mentioned in the embodiments of the present invention refer to the axial, radial, and circumferential directions of the code disk, respectively.

[0057] To address the problems existing in the prior art, this invention provides a high-precision object positioning device and method based on a Dtof chip, enabling high-precision positioning of target objects.

[0058] Figure 1 This is a schematic diagram of a high-precision object positioning device based on a Dtof chip according to an embodiment of the present invention; Figure 2 This is a flowchart of a high-precision object localization method based on a Dtof chip according to an embodiment of the present invention; Figure 3 This is a schematic diagram of a first point cloud according to an embodiment of the present invention; Figure 4 This is a schematic diagram comparing a first point cloud and a second point cloud according to an embodiment of the present invention.

[0059] Now see Figures 1 to 4 This invention provides a high-precision object positioning device based on a Dtof chip, comprising:

[0060] Dtof (Direct Time of Flight) chip 3 is used to acquire point cloud data of the field of view;

[0061] An electronically controlled variable field of view lens 4 is positioned directly in front of the Dtof chip 3 and is fixed relative to the Dtof chip 3 to adjust the field of view of the Dtof chip 3.

[0062] The electrically controlled micro-displacement stage 2 carries the Dtof chip 2 and the electrically controlled variable field of view lens 4, and is used to adjust the position of the Dtof chip 3 and the electrically controlled variable field of view lens 4 on the electrically controlled micro-displacement stage 2.

[0063] The core controller 1 is connected to the Dtof chip 3, the electrically controlled variable field of view lens 4, and the electrically controlled micro-displacement stage 2. The core controller 1 acquires the point cloud data of the Dtof chip 3, sends control commands to the electrically controlled variable field of view lens 4 to adjust the field of view of the Dtof chip 3, and sends control commands to the electrically controlled micro-displacement stage 2 to adjust the positions of the Dtof chip 3 and the electrically controlled variable field of view lens 4 on the electrically controlled micro-displacement stage 2.

[0064] In some embodiments, a laser emitter 5 is also included, which emits a laser in the direction of the field of view of the Dtof chip 3. The laser emitted by the laser emitter 5 completely covers the field of view of the Dtof chip 3, and the laser emitter 5 provides an illumination source.

[0065] In some embodiments, the Dtof chip 3 is an image sensing chip with a 16x16 array of 256 pixels. The Dtof chip 3 measures distance by directly measuring the time of flight of the laser reflected back.

[0066] Please see Figure 2 This invention also provides a high-precision object localization method based on a Dtof chip, comprising the following steps:

[0067] S1: Deploy the electronically controlled micro-displacement, 2, Dtof chip, 3, electronically controlled variable field of view lens, 4, laser emitter, and core controller 1, and set the Dtof chip 3 in the first position 6;

[0068] S2: Control the electronically controlled variable field of view lens 4 to change the field of view, so that the field of view of the Dtof chip 3 is the first field of view α;

[0069] S3: Turn on the laser emitter 5 and the core controller 1. The core controller 1 obtains the first point cloud at the first field of view α through the Dtof chip 3.

[0070] S4: Filter the first point cloud, obtain the target pixel, and record the point cloud coordinates of the target pixel;

[0071] S5: Based on the point cloud coordinates of the target object's pixels, calculate the moving direction and moving distance of the Dtof chip 3 and the electronically controlled variable field of view lens 4 on the electronically controlled micro-displacement stage 2, so that the Dtof chip 3 moves to the second position 7 facing the target object.

[0072] S6: Control the electronically controlled variable field of view lens 4 to change the field of view, so that the viewing angle of the Dtof chip 3 is the second field of view β;

[0073] S7: Core controller 1 obtains the second point cloud at the second field of view β through Dtof chip 3;

[0074] S8: Filter the second point cloud to obtain the pixel closest to the target object and the Dtof chip 3, and obtain the closest distance between the target object and the Dtof chip 3.

[0075] In practice, the application scenario is set up in a relatively open space, with only the target object closest to the measurement point. Therefore, the judgment can be made based on distance, without the need to distinguish between interfering objects or to distinguish between interfering objects according to the needs of the scenario. The distinction between interfering objects adopts existing technology, which will not be elaborated here.

[0076] In specific implementation, the core controller 1 acquires the first point cloud at the first field of view α, and acquires the first point cloud data, which includes distance information and point cloud coordinate information of 256 pixels; the positioning method includes:

[0077] Extract the distance information of 256 pixels from the first point cloud data, take the nearest pixel as the target pixel, and record the point cloud coordinate information of the target pixel;

[0078] The target object pixels are represented as:

[0079] D 1min =min(D 1x (x∈(0, 255))

[0080] I = I x (D 1min )

[0081] J = J x (D 1min );

[0082] Where x represents a pixel; D 1x D represents the distance between pixels in the first point cloud data. 1min The shortest distance between pixels in the first point cloud data; I x (D 1min J represents the x-coordinate of the point cloud of the shortest distance pixel. x (D 1min ) represents the ordinate of the point cloud of the shortest distance pixel; I represents the abscissa of the point cloud of the target pixel; and J represents the ordinate of the point cloud of the target pixel.

[0083] In some embodiments, the Dtof chip 3 is an image sensing chip with a 16x16 array of 256 pixels. When the Dtof chip 3 is located at the first position 6, the center of the Dtof chip 3 corresponds to the center of the point cloud, and is located in the middle of the four points with point cloud coordinates (7, 7), (7, 8), (8, 7), and (8, 8) in the first point cloud. The electronically controlled micro-displacement stage 2 is rectangular. The positioning method includes: calculating the moving distance of the Dtof chip 3 on the electronically controlled micro-displacement stage 2 based on the position of the point cloud coordinates corresponding to the first position 6 and the position of the target pixel. The moving distance of the Dtof chip 3 is calculated by the following formula:

[0084]

[0085]

[0086] Where, ΔI DLet K be the lateral displacement distance, K be the side length of the side of the electrically controlled micro-displacement stage 2 facing the Dtof chip 3, and I be the x-coordinate of the point cloud of the target pixel; if ΔI D If the value is negative, it moves in the direction of decreasing coordinate value. If ΔI D If the value is positive, it moves in the direction that increases the coordinate value;

[0087] ΔJ D Let K be the longitudinal displacement distance, K be the side length of the side of the electrically controlled micro-displacement stage 2 facing the Dtof chip 3, and J be the point cloud ordinate of the target pixel; if ΔJ D If the value is negative, it moves in the direction of decreasing coordinate value. If ΔJ D If the value is positive, the movement will be in the direction of increasing coordinate value.

[0088] In some embodiments, the first field of view α includes all areas that the target object may reach; that is, the first field of view α is greater than the minimum scene field of view, which is calculated by the following formula:

[0089]

[0090] Where θ1 is the minimum scene field of view, d is the farthest distance between the target object and the measurement point where the Dtof chip 3 is located, and R is the maximum radius of the target object's movement.

[0091] like Figure 3 As shown, in the specific implementation, the farthest distance d between the target object and the measurement point where the Dtof chip 3 is located in the preset usage scenario is 5m, and the maximum radius R of the target object's movement is 2.5m; the minimum scene field of view θ1 is calculated to be 53°, and the first field of view α can be set to 60°.

[0092] Since the Dtof chip 3 is a 16x16 rectangle with a resolution, the image is rectangular, and its image side length L1 = 2*tan(α / 2)*d, the calculated L1 is about 5.77m. At this time, the pixel resolution 11 = L1 / 16, the calculated value is about 40cm. It can be seen that the resolution of the first point cloud is low and cannot meet the requirements for accurate measurement.

[0093] In some embodiments, the second field of view β includes the target object, that is, the second field of view β is greater than the minimum target object field of view, which is calculated by the following formula:

[0094]

[0095] Where θ2 is the minimum field of view of the target object, d is the farthest distance between the target object and the measurement point where the Dtof chip 3 is located, and r is the maximum radius of the target object.

[0096] like Figure 4As shown, in the specific implementation, the farthest distance d between the target object and the measurement point where the Dtof chip 3 is located in the preset usage scenario is 5m, and the maximum radius r of the target object is 0.4m; the calculated minimum scene field of view θ2 is 9°, and the second field of view β can be set to 10°.

[0097] Since the Dtof chip 3 is a 16x16 rectangle with a resolution, the image is rectangular, and its imaging side length L2 = 2*tan(β / 2)*d. The calculated L2 is about 0.87m. At this time, the pixel resolution l2 = L2 / 16, which is about 5cm. It can be seen that the second point cloud has a high resolution, which can meet the requirements for accurate measurement of the target object.

[0098] In some embodiments, the core controller 1 acquires a second point cloud at a second field of view β, and acquires second point cloud data, the second point cloud data including distance information and point cloud coordinate information of 256 pixels; the positioning method includes:

[0099] Distance information of 256 pixels in the second point cloud data is extracted to obtain the closest distance between the target object and the Dtof chip 3.

[0100] In some embodiments, the positioning method includes:

[0101] Install the electrically controlled micro-displacement stage 2, and set the Dtof chip 3 at the first position 6 of the electrically controlled micro-displacement stage 2. The first position 6 is the center of the electrically controlled micro-displacement stage 2.

[0102] In summary, the embodiments of the present invention provide a high-precision object positioning device and method based on a Dtof chip. The Dtof chip 3, together with an electrically controlled variable field-of-view lens 4 and an electrically controlled micro-displacement stage 2, obtains the approximate position of the target object through a first large-angle measurement. Based on the approximate position, the Dtof chip 3 and the adjustable field-of-view lens 4 are adjusted, and a second measurement is performed to obtain a high-precision point cloud within the desired range, thereby obtaining the ideal distance, position and other information of the target object. This achieves high-resolution point cloud measurement at low cost.

[0103] Furthermore, a first field of view α is set according to the usage scenario to capture the target object and obtain its approximate position. A second field of view β is set according to the usage scenario and the size of the target object to achieve high-resolution point cloud measurement of the target object, thereby achieving precise positioning of the target object and improving measurement accuracy.

[0104] Furthermore, the Dtof chip 3 and the electronically controlled variable field of view lens 4 are adjusted by the electronically controlled micro-displacement stage 2. Based on the approximate position of the target object, the Dtof chip 3 is adjusted to face the target object, making it possible to obtain high-resolution point cloud data of the target object from a small angle.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-precision object positioning device based on a Dtof chip, characterized in that, include: Dtof chip, the Dtof chip is used to acquire point cloud data of the field of view; An electronically controlled variable field-of-view lens is positioned directly in front of the Dtof chip and fixed relative to the Dtof chip to adjust the field of view of the Dtof chip. An electrically controlled micro-displacement stage carries the Dtof chip and the electrically controlled variable field of view lens, and is used to adjust the position of the Dtof chip and the electrically controlled variable field of view lens on the electrically controlled micro-displacement stage; The core controller is connected to the Dtof chip, the electronically controlled variable field of view lens, and the electronically controlled micro-displacement stage. The core controller acquires the point cloud data of the Dtof chip, sends control commands to the electronically controlled variable field of view lens to adjust the field of view of the Dtof chip, and sends control commands to the electronically controlled micro-displacement stage to adjust the positions of the Dtof chip and the electronically controlled variable field of view lens on the electronically controlled micro-displacement stage. The positioning method using the aforementioned positioning device includes the following steps: Deploy an electronically controlled micro-displacement stage, a Dtof chip, an electronically controlled variable field of view lens, a laser emitter, and a core controller, with the Dtof chip positioned in the first position; Control the electronically controlled variable field of view lens to change the field of view so that the field of view of the Dtof chip is the first field of view; The laser emitter and the core controller are activated, and the core controller obtains the first point cloud at the first field of view through the Dtof chip; Filter the first point cloud to obtain the target pixel and record the point cloud coordinates of the target pixel; Based on the point cloud coordinates of the target object's pixels, the moving direction and moving distance of the Dtof chip and the electronically controlled variable field of view lens on the electronically controlled micro-displacement stage are calculated, so that the Dtof chip moves to a second position facing the target object. The electronically controlled variable field-of-view lens is controlled to change the field of view so that the viewing angle of the Dtof chip is the second field of view; The core controller obtains the second point cloud at the second field of view through the Dtof chip; The second point cloud is filtered to obtain the pixel point that is closest to the target object and the Dtof chip, thus obtaining the closest distance between the target object and the Dtof chip.

2. The high-precision object positioning device based on a Dtof chip according to claim 1, characterized in that, It also includes a laser emitter that emits a laser in the direction of the field of view of the Dtof chip, and the laser emitted by the laser emitter completely covers the field of view of the Dtof chip.

3. The high-precision object positioning device based on the Dtof chip according to claim 1, characterized in that, The Dtof chip is an image sensing chip with a 16x16 array of 256 pixels.

4. A high-precision object localization method based on a Dtof chip, characterized in that, The method, employing the positioning device as described in any one of claims 1-3, comprises the following steps: The core controller acquires a first point cloud at a first field of view and acquires first point cloud data, the first point cloud data including distance information and point cloud coordinate information of 256 pixels; the positioning method includes: Extract the distance information of 256 pixels from the first point cloud data, take the nearest pixel as the target pixel, and record the point cloud coordinate information of the target pixel; The target object pixels are represented as follows: D 1min = min(D) 1x ) I = I x (D 1min ) J = J x (D 1min ); Where x represents a pixel; D 1x D represents the distance between pixels in the first point cloud data. 1min The shortest distance between pixels in the first point cloud data; I x (D 1min J represents the x-coordinate of the point cloud of the shortest distance pixel. x (D 1min ) represents the ordinate of the point cloud of the shortest distance pixel; I represents the abscissa of the point cloud of the target pixel; and J represents the ordinate of the point cloud of the target pixel.

5. The high-precision object positioning method based on a Dtof chip according to claim 4, characterized in that, The Dtof chip is an image sensing chip with a 16x16 array of 256 pixels. When the Dtof chip is in the first position, its center corresponds to the center of the point cloud, located in the middle of four points with point cloud coordinates (7, 7), (7, 8), (8, 7), and (8, 8). The electronically controlled micro-displacement stage is rectangular. The positioning method includes: calculating the movement distance of the Dtof chip on the electronically controlled micro-displacement stage based on the point cloud coordinates corresponding to the first position and the position of the target pixel. The movement distance of the Dtof chip is calculated using the following formula: ; ; in, This represents the lateral displacement distance. Let I be the side length of the side of the electrically controlled micro-displacement stage facing the Dtof chip, and let I be the x-coordinate of the point cloud of the target pixel; if If the value is negative, it moves in the direction of decreasing coordinate value. If the value is positive, it moves in the direction that increases the coordinate value; This represents the longitudinal displacement distance. Let J be the side length of the side of the electrically controlled micro-displacement stage facing the Dtof chip, and J be the point cloud ordinate of the target pixel; if If the value is negative, it moves in the direction of decreasing coordinate value. If the value is positive, the movement will be in the direction of increasing coordinate value.

6. The high-precision object positioning method based on a Dtof chip according to claim 4, characterized in that, The first field of view includes all areas that the target object may reach; that is, the first field of view is greater than the minimum scene field of view, which is calculated using the following formula: ， in, d is the minimum scene field of view, d is the farthest distance between the target object and the measurement point where the Dtof chip is located, and z is the maximum radius of the target object's movement.

7. The high-precision object positioning method based on a Dtof chip according to claim 4, characterized in that, The second field of view includes the target object, meaning the second field of view is greater than the minimum target object field of view, which is calculated using the following formula: ， in, d is the minimum field of view of the target object, d is the farthest distance between the target object and the measurement point where the Dtof chip is located, and r is the maximum radius of the target object.

8. The high-precision object positioning method based on a Dtof chip according to claim 4, characterized in that, The core controller acquires the second point cloud at the second field of view and obtains the second point cloud data, which includes distance information and point cloud coordinate information of 256 pixels; the positioning method includes: Distance information of 256 pixels in the second point cloud data is extracted to obtain the closest distance between the target object and the Dtof chip.

9. The high-precision object positioning method based on a Dtof chip according to claim 4, characterized in that, The positioning method includes: The electrically controlled micro-displacement stage is installed, and the Dtof chip is placed at the first position of the electrically controlled micro-displacement stage, the first position being the center of the electrically controlled micro-displacement stage.

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