Attaching method and attaching device
By first stretching the adhesive layer to expel air bubbles in the laminated structure before bonding, the problem of air bubble formation in the laminated structure is solved, improving the bonding effect and product performance.
Patent Information
- Application Number
- CN202210821144.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-07-13
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2042-07-13
AI Technical Summary
During the lamination process of layered structures, air bubbles are formed due to the incorporation of air during the application of adhesive and pressure, which affects the lamination effect and product performance, especially in curved products where air bubbles are difficult to expel.
In a laminated structure, an adhesive layer is first applied to the surface of one layer, and then the adhesive layer is stretched in a direction away from the layer to remove air bubbles. The second layer is then brought into contact with the adhesive layer and pressed together, using the adhesive layer to eliminate air bubbles and achieve bonding.
It effectively reduces or eliminates air bubbles during the bonding process, improving bonding effect and product performance, especially for curved products.
Smart Images
Figure CN117429158B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of product bonding, and in particular to a bonding method and a curved surface bonding device. BACKGROUND
[0002] In some laminated structures, two adjacent layer structures are usually bonded by means of gluing and pressing. When the bonding work is carried out in an atmospheric environment, air is mixed in the gluing process and the pressing process, so that air bubbles are formed between the two adjacent layer structures, thereby affecting the bonding effect. SUMMARY
[0003] Therefore, it is necessary to provide a bonding method for the problem of air bubbles easily formed in the bonding process of a laminated structure.
[0004] According to an aspect of the present application, a bonding method is provided for bonding of a laminated structure, the laminated structure comprising a first layer structure and a second layer structure laminated along a first direction, the bonding method comprising the following steps: disposing a glue layer on one side surface of the first layer structure along the first direction; and stretching the glue layer along a direction away from the first layer structure, so that air bubbles in the glue layer are discharged out of the glue layer during the stretching process.
[0005] In some embodiments, the stretching of the glue layer along a direction away from the first layer structure, so that air bubbles in the glue layer are discharged out of the glue layer during the stretching process comprises: contacting one side surface of the second layer structure with the glue layer; and pulling the second layer structure along a direction away from the first layer structure.
[0006] In some embodiments, the pulling of the second layer structure along a direction away from the first layer structure comprises: pulling the second layer structure along the first direction.
[0007] In some embodiments, during the pulling of the second layer structure along the first direction, the glue layer is connected between the first layer structure and the second layer structure, and the glue layer is not broken.
[0008] In some embodiments, the first layer structure has a first surface that is concave, the second layer structure has a second surface that is convex, and the shape of the first surface matches the shape of the second surface; the disposing of the glue layer on one side surface of the first layer structure along the first direction comprises: disposing the glue layer at the inner concave part of the first surface; and the contacting of one side surface of the second layer structure with the glue layer comprises: contacting the outer convex part of the second surface with the glue layer.
[0009] In some embodiments, the stretching the glue layer in a direction away from the first layer structure to cause the air bubbles in the glue layer to be expelled out of the glue layer during the stretching comprises stretching the glue layer one or more times in a direction away from the first layer structure.
[0010] According to another aspect of the present application, there is provided a laminating device for laminating a laminated structure, the laminated structure comprising a first layer structure and a second layer structure laminated along a first direction, the laminating device comprising: a first laminating member for fixing the first layer structure; a glue dispensing mechanism movably arranged beside the first laminating member and configured to dispense a glue layer on a side surface of the first layer structure along the first direction; and a second laminating member movably arranged on a side of the first layer structure along the first direction, the second laminating member configured to stretch the glue layer in a direction away from the first layer structure to cause the air bubbles in the glue layer to be expelled out of the glue layer during the stretching.
[0011] In some embodiments, the second laminating member is configured to bring the second layer structure into contact with the glue layer and to pull the second layer structure in a direction away from the first layer structure after the second layer structure is brought into contact with the glue layer.
[0012] In some embodiments, the laminating device further comprises a negative pressure mechanism; the first laminating member comprises a first suction surface provided with first suction holes in communication with the negative pressure mechanism to fix the first layer structure by suction; and the second laminating member comprises a second suction surface provided with second suction holes in communication with the negative pressure mechanism to fix the second layer structure by suction.
[0013] In some embodiments, the first suction surface is curved to match the surface of the first layer structure; and the second suction surface is curved to match the surface of the second layer structure.
[0014] The laminating method provided by the embodiments of the present application can reduce or eliminate the air bubbles formed in the laminating process of the laminated structure by stretching the glue layer after the glue layer is disposed on the surface of the first layer structure to cause the air bubbles in the glue layer to be expelled out of the glue layer during the stretching, and then pressing the second layer structure against the glue layer to realize the lamination between the first layer structure and the second layer structure, thereby improving the lamination effect. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 A flowchart of the laminating method in an embodiment of the present application is shown;
[0016] Figure 2 A flowchart of the laminating method in an embodiment of the present application is shown;
[0017] Figure 3 This diagram illustrates the first state of the bonding process in an embodiment of the bonding method of this application.
[0018] Figure 4 It shows Figure 3 A schematic diagram of the second state of the bonding process in the bonding method;
[0019] Figure 5 It shows Figure 3 A schematic diagram of the third state of the bonding process in the bonding method;
[0020] Figure 6 It shows Figure 3 A schematic diagram of the fourth state of the bonding process in the bonding method;
[0021] Figure 7 It shows Figure 3 A schematic diagram of the fifth state of the bonding process in the bonding method;
[0022] Figure 8 It shows Figure 3 A schematic diagram of the sixth state of the bonding process in the bonding method.
[0023] Explanation of icon numbers:
[0024] X: First direction 31: Bubble
[0025] 10: First layer structure; 40: First bonding component
[0026] 11: First surface; 41: First adsorption surface
[0027] 20: Second layer structure; 50: Second bonding component
[0028] 21: Second surface; 51: Second adsorption surface
[0029] 30: Adhesive layer; 60: Dispensing mechanism Detailed Implementation
[0030] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0032] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.
[0033] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0034] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.
[0035] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0036] In some optical modules, lens assemblies consisting of multiple lenses are used. For two adjacent lenses in a lens assembly, the bonding process involves applying adhesive and applying pressure. Specifically, adhesive is first applied to one side of one lens, then the other lens is placed on top of the adhesive, and pressure is applied to disperse the adhesive under the pressure of the lenses, thereby forming a uniform adhesive layer between the two lenses, thus bonding the two lenses together.
[0037] When bonding is performed in an atmospheric environment, some air is inevitably introduced during the application of adhesive and the covering of lenses. This air remains in the adhesive layer or between the adhesive layer and the lens, forming air bubbles that affect the bonding effect of the lens and the performance of the optical module.
[0038] Although some air bubbles may diffuse along with the flow of adhesive during the process of being squeezed and dispersed, some bubbles still cannot diffuse out before the adhesive cures. This is especially true for curved products, where a recessed structure forms between adjacent curved layers, making it more difficult for air bubbles to diffuse out of the adhesive layer. As a result, a large number of air bubbles cannot be expelled, severely affecting the bonding effect and product performance.
[0039] To address the aforementioned issues, this application provides a bonding method for joining two layered structures. After applying adhesive to the surface of one layered structure and before covering the other layered structure with adhesive, the adhesive is stretched in a direction away from the first layered structure. This increases the exposed surface area of the adhesive, thereby increasing the total area available for air bubbles to escape. Furthermore, the stretching action accelerates the diffusion of air bubbles, allowing air bubbles inside the adhesive to be expelled during the stretching process. Based on this, the amount of air bubbles in the laminated structure is significantly reduced, thereby improving the bonding effect and enhancing product performance.
[0040] Figure 1 A flowchart of a bonding method according to an embodiment of this application is shown.
[0041] See Figure 1 An embodiment of this application provides a bonding method for bonding a laminated structure, the laminated structure including a first layer structure 10 and a second layer structure 20 laminated along a first direction X, characterized in that the bonding method includes the following steps:
[0042] Step S1, setting a glue layer 30 on one side surface of the first layer structure 10 along a first direction X;
[0043] Step S2, stretching the glue layer 30 along a direction away from the first layer structure 10, so that the air bubbles 31 in the glue layer 30 are discharged out of the glue layer 30 in the stretching process.
[0044] It can be understood that after the glue layer 30 is stretched along the direction away from the first layer structure 10, the lamination method further comprises attaching the second layer structure 20 to the side of the glue layer 30 away from the first layer structure 10, and applying pressure to the second layer structure 20 to make the second layer structure 20 close to the first layer structure 10, so as to bond the first layer structure 10 and the second layer structure 20 by the glue layer 30. Wherein, the first layer structure 10 and the second layer structure 20 are planar structures or curved surface structures, and the shapes of the first layer structure 10 and the second layer structure 20 are the same or different. The first layer structure 10 has a first lamination surface, and the second layer structure 20 has a second lamination surface, and the shape of the first lamination surface matches the shape of the second lamination surface. When the first lamination surface is a plane, the first direction X is perpendicular to the first lamination surface; when the first lamination surface is a curved surface, the first direction X is perpendicular to the tangent plane of the center of the first lamination surface. For example, the first layer structure 10 and the second layer structure 20 are both curved surface lenses, and the inner concave surface of the first layer structure 10 is attached to the outer convex surface of the second layer structure 20.
[0045] The lamination method provided by the embodiment of the application, by stretching the glue layer 30 after setting the glue layer 30 on the surface of the first layer structure 10, so that the air bubbles 31 in the glue layer 30 are discharged out of the glue layer 30 in the stretching process, and then pressing the second layer structure 20 and the glue layer 30 to realize the lamination between the first layer structure 10 and the second layer structure 20, since the air bubbles 31 generated in the dispensing process are reduced or eliminated, the air bubbles 31 formed in the entire lamination process of the laminated structure can be reduced or eliminated, and the lamination effect is improved.
[0046] In the embodiment of the application, the laminated structure is not limited to including two layer structures, for example, the laminated structure includes three, four, five, six or more layer structures, and the lamination method described above can be used for lamination between two adjacent layer structures.
[0047] Figure 2 The flow chart of the lamination method in an embodiment of the application is shown. Figures 3 to 8 The state diagram corresponding to each step of the lamination method in an embodiment of the application is shown.
[0048] Referring to Figure 2 In some embodiments, stretching the glue layer 30 along a direction away from the first layer structure 10, so that the air bubbles 31 in the glue layer 30 are discharged out of the glue layer 30 in the stretching process comprises:
[0049] Step S21, contacting one side surface of the second layer structure 20 with the glue layer 30;
[0050] Step S22, pulling the second layer structure 20 in a direction away from the first layer structure 10.
[0051] Referring to Figures 3 to 6 , by contacting one side surface of the second layer structure 20 with the glue layer 30, and then by pulling the second layer structure 20 in a direction away from the first layer structure 10, the glue layer 30 is stretched, and the bubbles 31 in the glue layer 30 are removed. And since the second layer structure 20 is directly in contact with the glue layer 30, the introduction of other mechanisms to contact the glue layer 30 and incorporate new bubbles 31 is avoided, further improving the bonding efficiency and product performance.
[0052] In one embodiment, after contacting one side surface of the second layer structure 20 with the glue layer 30, the second layer structure 20 is pulled in the first direction X, so that the probability of the glue layer 30 being pulled apart is reduced, thereby reducing the probability of new bubbles 31 being incorporated after the glue layer 30 is pulled apart.
[0053] Referring to Figure 5 and Figure 6 , further, after the second layer structure 20 is in contact with the glue layer 30, during the process of the second layer structure 20 stretching the glue layer 30, the glue layer 30 always remains connected between the first layer structure 10 and the second layer structure 20, i.e. the glue layer 30 does not break during the stretching process. Taking glue with a viscosity of 4800 cPs (centipoise·second) as an example, the stretching height of 0.1 ml of glue is 15 mm-25 mm, and the stretching speed is 5 mm / s, i.e. during the process of pulling the second layer structure 20 in the first direction X, the movement speed of the second layer structure 20 in the first direction X is 5 mm / s. Based on this, the bubbles 31 in the glue can be removed during the stretching of the glue, and the glue is not broken, thereby on the one hand, the bubbles 31 generated during the dispensing process are removed, and on the other hand, new bubbles 31 are avoided during the stretching process and after the stretching is completed.
[0054] Referring to Figure 7 and Figure 8Further, after the bubbles 31 are discharged by stretching the glue, the second layer structure 20 is moved towards the first layer structure 10 at a speed of 1 mm / s during the process of covering the glue, so as to ensure that the second layer structure 20 stably drives the glue to move and further extrude the glue, so that the glue is dispersed between the first layer structure 10 and the second layer structure 20, and new bubbles 31 are avoided to be mixed in the process. Compared with the traditional bonding method, the bonding method provided by the embodiment of the application can reduce 80% of the bubbles 31.
[0055] In some embodiments, the first layer structure 10 has a first surface 11 in a concave shape, the second layer structure 20 has a second surface 21 in a convex shape, the shape of the first surface 11 matches the shape of the second surface 21; the step of arranging the glue layer 30 on one side surface of the first layer structure 10 along the first direction X includes arranging the glue layer 30 on the inner concave part of the first surface 11; the step of contacting one side surface of the second layer structure 20 with the glue layer 30 includes contacting the outer convex part of the second surface 21 with the glue layer 30. In a specific embodiment, the first surface 11 and the second surface 21 are arc surfaces, the curvatures of the two arc surfaces are the same, and the size of the first surface 11 is the same as or different from the size of the second surface 21. It can be understood that, when the first surface 11 of the first layer structure 10 is in a concave shape, the glue layer 30 is arranged on the inner concave part of the first layer structure 10, and the outer convex part of the second surface 21 is contacted with the glue layer 30, so that the glue layer 30 can be more uniformly dispersed in the space between the first layer structure 10 and the second layer structure 20.
[0056] Further, the number of times of stretching the glue layer 30 in the direction away from the first layer structure 10 can be one or more, for example, two, three, four, five or more. As a preferred, the number of times of stretching the glue layer 30 is three or four. It can be understood that, the more the number of times of stretching the glue layer 30, the greater the probability of breaking and discharging the bubbles 31, but as the number of times of stretching increases, the time consumed also increases, which reduces the work efficiency. Therefore, the number of times of stretching is limited to three or four in the embodiment of the application, so as to ensure the work efficiency and improve the bubble discharging effect.
[0057] Based on the same inventive purpose, the application further provides a bonding device for bonding a layer structure, the layer structure including a first layer structure 10 and a second layer structure 20 stacked along a first direction X. Referring to Figures 3 to 6In an embodiment of the present application, the laminating device comprises a first laminating member 40, a dispensing mechanism 60 and a second laminating member 50. The first laminating member 40 is used to fix the first layer structure 10. The dispensing mechanism 60 is movably arranged beside the first laminating member 40 and is used to arrange the glue layer 30 on one side surface of the first layer structure 10 along the first direction X. The second laminating member 50 is movably arranged on one side of the first layer structure 10 along the first direction X. The second laminating member 50 is used to stretch the glue layer 30 in a direction away from the first layer structure 10, so that the air bubbles 31 in the glue layer 30 are discharged out of the glue layer 30 during the stretching process.
[0058] Considering that the glue layer 30 is prone to flow before curing, in order to avoid the glue layer 30 from dripping off the surface of the first layer structure 10 after being arranged on the surface of the first layer structure 10, it is preferred that the first laminating member 40 bears the first layer structure 10 in a horizontal direction, so that the first layer structure 10 is placed horizontally, thereby better bearing the glue layer 30. Specifically, the first laminating member 40 can be an adsorption platform or a bearing platform with a surface shape matching that of the first layer structure 10. The adsorption platform fixes the first layer structure 10 by adsorption, or the bearing platform bears the gravity of the first layer structure 10 to stabilize the first layer structure 10 on the bearing platform. Correspondingly, the first direction X is parallel to the vertical direction, and the second layer structure 20 is located above the first layer structure 10. The second laminating member 50 stretches the glue layer 30 along the vertical direction or a direction inclined relative to the vertical direction.
[0059] The dispensing mechanism 60 can specifically arrange the glue layer 30 on the surface of the first layer structure 10 by means of a dispensing head. The position of the glue layer 30 is preferably the middle of the upper surface of the first layer structure 10, so as to facilitate stretching of the glue layer 30 and enable the glue layer 30 to be more evenly dispersed between the first layer structure 10 and the second layer structure 20 during subsequent pressure lamination.
[0060] Referring to Figures 5 to 8 The laminating device provided by the embodiment of the present application first fixes the first layer structure 10 by means of the first laminating member 40, then stretches the glue layer 30 in a direction away from the first layer structure 10 by means of the second laminating member 50 after the glue layer 30 is arranged on the surface of the first layer structure 10 by means of the dispensing mechanism 60, so that the air bubbles 31 in the glue layer 30 are discharged out of the glue layer 30 during the stretching process. Based on this, the second layer structure 20 is then laminated with the glue layer 30 to realize lamination between the first layer structure 10 and the second layer structure 20. Since the air bubbles 31 generated during dispensing are reduced or eliminated, the air bubbles 31 formed during the entire lamination process of the layered structure can be reduced or eliminated, thereby improving the lamination effect.
[0061] Further, the second adhering member 50 is configured to bring the second layer structure 20 into contact with the glue layer 30, and to pull the second layer structure 20 away from the first layer structure 10 after the second layer structure 20 contacts the glue layer 30. Specifically, the second adhering member 50 can be an adsorption platform that fixes the second layer structure 20 by means of negative pressure adsorption. The second adhering member 50 brings the second layer structure 20 into contact with the glue layer 30, and pulls the second layer structure 20 away from the first layer structure 10 after the second layer structure 20 contacts the glue layer 30, so as to stretch the glue layer 30 and expel the air bubbles 31 in the glue layer 30. Since the glue layer 30 is stretched directly by the second adhering member 50, the second adhering member 50 keeps in contact with the glue layer 30 after contacting the glue layer 30, avoiding the introduction of new air bubbles 31 due to secondary contact.
[0062] Specifically, the adhering device further comprises a negative pressure mechanism; the first adhering member 40 comprises a first adsorption surface 41, and the first adsorption surface 41 is provided with first adsorption holes (not shown in the figure) that are in communication with the negative pressure mechanism, so as to adsorb and fix the first layer structure 10; the second adhering member 50 comprises a second adsorption surface 51, and the second adsorption surface 51 is provided with second adsorption holes (not shown in the figure) that are in communication with the negative pressure mechanism, so as to adsorb and fix the second layer structure 20. The negative pressure mechanism provides suction force for the first adsorption holes and the second adsorption holes, so that the first adsorption surface 41 of the first adhering member 40 adsorbs and fixes the first layer structure 10, and the second adsorption surface 51 of the second adhering member 50 adsorbs and fixes the second layer structure 20, avoiding the movement of the first layer structure 10 and the second layer structure 20 during the processes of dispensing, stretching and pressing, so as to improve the adhering effect.
[0063] In a specific embodiment, the first layer structure 10 and the second layer structure 20 are both curved structures, the first adsorption surface 41 of the first adhering member 40 is curved to match the surface of the first layer structure 10, and the second adsorption surface 51 of the second adhering member 50 is curved to match the surface of the second layer structure 20. Based on this, the first adhering member 40 can more stably adsorb the first layer structure 10, and the second adhering member 50 can more stably adsorb the second layer structure 20, so that the adhering process of the first layer structure 10 and the second layer structure 20 is more smooth, and the adhering effect is better.
[0064] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but it should be considered that any combination of the technical features is within the scope of the present disclosure as long as the combination does not result in contradictions.
[0065] The above embodiments only express several implementation ways of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation to the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.
Claims
1. A bonding method for bonding a laminated structure, the laminated structure comprising a first layer and a second layer laminated along a first direction, characterized in that, The bonding method includes the following steps: An adhesive layer is provided on one side surface of the first layer structure along the first direction; The adhesive layer is stretched in a direction away from the first layer structure so that air bubbles in the adhesive layer are expelled from the adhesive layer during the stretching process; The step of stretching the adhesive layer in a direction away from the first layer structure to expel air bubbles from the adhesive layer during the stretching process includes: One surface of the second layer structure is brought into contact with the adhesive layer; Pull the second layer structure away from the first layer structure.
2. The bonding method according to claim 1, characterized in that, The step of pulling the second layer structure away from the first layer structure includes: Pull the second layer structure along the first direction.
3. The bonding method according to claim 2, characterized in that, During the process of pulling the second layer structure along the first direction, the adhesive layer connects the first layer structure and the second layer structure, and the adhesive layer does not break.
4. The bonding method according to claim 1, characterized in that, The first layer structure has a concave first surface, and the second layer structure has a convex second surface, wherein the shape of the first surface matches the shape of the second surface. The provision of an adhesive layer on one side surface of the first layer structure along the first direction includes: providing an adhesive layer at a recess in the first surface; The step of bringing one side surface of the second layer structure into contact with the adhesive layer includes bringing the protruding part of the second surface into contact with the adhesive layer.
5. The bonding method according to any one of claims 1 to 4, characterized in that, The step of stretching the adhesive layer in a direction away from the first layer structure to expel air bubbles from the adhesive layer during the stretching process includes: The adhesive layer is stretched once or multiple times in a direction away from the first layer structure.
6. A bonding device for bonding a laminated structure, said laminated structure comprising a first layer and a second layer laminated along a first direction, characterized in that, The bonding device includes: The first bonding component is used to fix the first layer structure; A dispensing mechanism, movably disposed beside the first bonding member, is used to apply an adhesive layer to one side surface of the first layer structure along the first direction; and The second bonding member is movably disposed on one side of the first layer structure along the first direction. The second bonding member is used to stretch the adhesive layer in a direction away from the first layer structure so that air bubbles in the adhesive layer are discharged from the adhesive layer during the stretching process. The second bonding member is configured to bring the second layer structure into contact with the adhesive layer, and after the second layer structure comes into contact with the adhesive layer, pull the second layer structure away from the first layer structure.
7. The bonding device according to claim 6, characterized in that, The bonding device also includes a negative pressure mechanism; The first bonding component includes a first adsorption surface, and the first adsorption surface is provided with a first adsorption hole communicating with the negative pressure mechanism to adsorb and fix the first layer structure; The second bonding component includes a second adsorption surface, on which a second adsorption hole communicating with the negative pressure mechanism is provided to adsorb and fix the second layer structure.
8. The bonding device according to claim 7, characterized in that, The first adsorption surface is curved to match the surface of the first layer structure; The second adsorption surface is curved to match the surface of the second layer structure.