A method for improving the efficiency of temperature control PID parameter setting and a laser device

Abstract

The present application relates to the technical field of temperature control, and provides a method for improving the efficiency of temperature control PID parameter setting and a laser device. In the present application, a reference laser device matched with an actual laser device to be set is determined, a reference temperature change difference of the reference laser device under preset conditions is obtained, and a reference PID parameter corresponding to the reference laser device is obtained, so as to obtain a temperature control reference benchmark of the actual laser device. Under the same preset conditions, an actual temperature change difference of the actual laser device is measured, a ratio of the reference temperature change difference to the actual temperature change difference is determined as a PID correction coefficient, and a final PID parameter of the actual laser device is obtained according to the PID correction coefficient and the reference PID parameter. The PID parameter setting of the actual laser device is not required to be continuously corrected and tested or excited to respond, and the laser tube in the laser device is not damaged, so that the efficiency and practicability of the temperature control PID parameter setting are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature control, in particular to a method for improving the efficiency of PID parameter setting and a laser device. BACKGROUND

[0002] In the fields of laser precision measurement, laser communication, high-resolution spectroscopy and laser cold atom experiment, the temperature of the laser needs to be kept highly stable to avoid the drift of the laser frequency. Usually, the output of the thermoelectric cooler (TEC) is adjusted by using the proportion-integration-differentiation (PID) closed-loop control algorithm to achieve effective temperature adjustment. The PID control has the advantages of simple structure, robustness to model errors and easy operation, and is more easily set and calculated than other methods in practical applications, so it is widely used in industrial process control. The TEC can realize heating and refrigeration by changing the current direction, and can be used as a cold source and a heat source in the temperature range near room temperature, and is the most precise temperature control device at present.

[0003] Because the application scenarios or experimental functions of the laser are often different, it is often necessary to achieve precise control at different temperatures on different lasers and temperature control TECs (different working temperature ranges and temperature precision). By setting the PID parameters of the output of the temperature control TEC, precise control at different temperatures is achieved. The setting of the PID parameters is a complex process, and generally requires multiple parameter adjustments and tests according to the laser and the temperature control TEC (i.e. the controlled object).

[0004] The prior art uses engineering setting method, theoretical calculation setting method and pattern recognition method to set and calculate the PID parameters. However, this kind of method needs to perform several or even dozens of complete input-output responses on the entire laser device (i.e. the laser containing the temperature control TEC), which is complex to operate and requires a lot of time and effort, seriously affecting the efficiency of the test and operation of the laser device. In order to set the PID parameters, the laser needs to be at the boundary value of its temperature or current overload in each complete response, which may cause temperature overload or current overload, resulting in damage to the laser tube in the laser, and poor practicability.

[0005] Therefore, it is urgent to overcome the defects of the prior art in the technical field. SUMMARY

[0006] The technical problem solved by the present application is to provide a method for improving the efficiency of temperature control PID parameter setting and a laser device, which solves the problems of low efficiency, poor practicability and high possibility of damaging the laser tube in the laser device in setting the temperature control PID parameter in the prior art.

[0007] The present application adopts the following technical solutions:

[0008] In a first aspect, the present application provides a method for improving the efficiency of temperature control PID parameter setting, comprising:

[0009] determining a reference laser device matched with the actual laser device to be set;

[0010] obtaining a reference temperature change difference of the reference laser device under a preset condition, and obtaining a reference PID parameter corresponding to the reference laser device;

[0011] under the same preset condition, determining an actual temperature change difference of the actual laser device, and determining a PID correction coefficient as the ratio of the reference temperature change difference to the actual temperature change difference;

[0012] obtaining a final PID parameter of the actual laser device according to the PID correction coefficient and the reference PID parameter.

[0013] Further, the actual laser device comprises an actual laser and an actual temperature control TEC.

[0014] The determination of the reference laser device matched with the actual laser device to be set comprises:

[0015] obtaining a laser device with a difference in heat dissipation parameters within a preset range from the actual laser as a reference laser;

[0016] obtaining a temperature control TEC with a difference in heat dissipation parameters within a preset range from the actual temperature control TEC as the reference temperature control TEC;

[0017] The laser device composed of the reference laser and the reference temperature control TEC is a reference laser device.

[0018] Further, the reference laser device and the actual laser device are both laser devices of modular structure, and the reference laser device and the corresponding functional module in the actual laser device have the same external size.

[0019] The difference between the overall shapes of the reference laser and the actual laser is less than a set variation interval, and the difference between the overall shapes of the reference temperature control TEC and the actual temperature control TEC is less than a set variation interval.

[0020] Further, the actual laser and the reference laser have the same package type; the actual temperature control TEC and the reference temperature control TEC have the same package type.

[0021] Further, the method for improving the efficiency of temperature control PID parameter setting further comprises:

[0022] At least one type of reference laser and at least one type of reference temperature control TEC are obtained in advance, different types of reference lasers and different types of reference temperature control TECs are combined two by two to construct at least one reference laser device;

[0023] Each reference laser device is set to obtain the corresponding reference PID parameter of each reference laser device, and each reference laser device and the corresponding reference PID parameter form a mapping relationship to construct a mapping table.

[0024] Further, the reference PID parameter corresponding to the reference laser device is obtained by:

[0025] According to the reference laser device, the mapping table is queried, and the reference PID parameter corresponding to the reference laser device is found from the mapping table.

[0026] Further, the method for improving the efficiency of temperature control PID parameter setting further comprises:

[0027] The PID control function of the reference laser device is closed, a preset control current is loaded on the reference laser device, and the temperature change difference of the reference laser device within a preset maintenance time is measured;

[0028] Each reference laser device, reference PID parameter, temperature change difference, preset control current corresponding to the temperature change difference, and preset maintenance time form a mapping relationship to construct a mapping table.

[0029] Further, the reference temperature change difference of the reference laser device under the preset condition is obtained by:

[0030] According to the reference laser device, the mapping table is queried, and the reference temperature change difference corresponding to the reference laser device, and the preset control current and the preset maintenance time corresponding to the reference temperature change difference are found from the mapping table.

[0031] Or, the PID control function of the reference laser device is closed, a preset control current is loaded on the reference laser device, and the reference temperature change difference of the reference laser device within a preset maintenance time is measured;

[0032] The preset control current and the preset maintenance time constitute a preset condition.

[0033] The actual temperature change difference of the actual laser device under the same preset condition is measured.

[0034] The preset control current is loaded on the actual laser device, and the actual temperature change difference of the actual laser device within the preset maintenance time is measured.

[0035] Further, the final PID parameter of the actual laser device is obtained according to the PID correction coefficient and the reference PID parameter, including:

[0036] The PID correction coefficient is multiplied by the reference PID parameter to obtain an actual PID parameter.

[0037] The actual PID parameter is adjusted until the difference between the actual temperature of the actual laser device and the target temperature is less than a set temperature threshold, and the final PID parameter is obtained.

[0038] In a second aspect, the present application further provides a laser device for implementing the method for improving the efficiency of PID parameter setting of temperature control according to the first aspect, and the laser device comprises:

[0039] At least one processor; and a memory connected in communication with the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the processor to execute the method for improving the efficiency of PID parameter setting of temperature control according to the first aspect.

[0040] In a third aspect, the present application further provides a non-volatile computer storage medium, and the computer storage medium stores computer executable instructions, and the computer executable instructions are executed by one or more processors to complete the method for improving the efficiency of PID parameter setting of temperature control according to the first aspect.

[0041] Compared with the prior art, the present application has at least the following beneficial effects:

[0042] The present application obtains the reference temperature change difference of the reference laser device under preset conditions, obtains the reference PID parameter corresponding to the reference laser device, and obtains the temperature control reference benchmark of the actual laser device; under the same preset conditions, the actual temperature change difference of the actual laser device is measured, the ratio of the reference temperature change difference to the actual temperature change difference is determined as a PID correction coefficient, and the final PID parameter of the actual laser device is obtained according to the PID correction coefficient and the reference PID parameter, so that the operation process of continuously correcting the test or excitation response when the actual laser device is adjusted is avoided, the operation is simplified, the laser tube in the laser device is not damaged, the accuracy and stability of temperature control of the actual laser device can be quickly realized, and the efficiency and practicability of the temperature control PID parameter adjustment are improved. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0044] Figure 1 is a whole flowchart of a method for improving the efficiency of temperature control PID parameter adjustment provided by the embodiment of the present application;

[0045] Figure 2 is a specific flowchart of step 10 of the embodiment of the present application;

[0046] Figure 3 is another specific flowchart of step 10 of the embodiment of the present application;

[0047] Figure 4 is still another specific flowchart of step 10 of the embodiment of the present application;

[0048] Figure 5 is a specific flowchart of step 20 of the embodiment of the present application;

[0049] Figure 6 is a specific flowchart of step 40 of the embodiment of the present application;

[0050] Figure 7 is a schematic diagram of the architecture of a laser device for improving the efficiency of temperature control PID parameter adjustment provided by the embodiment of the present application. DETAILED DESCRIPTION

[0051] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0052] In the description of the present application, the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and are not required to be constructed and operated in a specific orientation, therefore should not be understood as a limitation on the present application.

[0053] In the present application, the terms "first", "second" and the like are only used for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" and the like can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0054] In the present application, unless otherwise specified and limited, the term "connection" should be understood broadly, for example, "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate medium. In addition, the term "coupling" can be an electrically connected mode for signal transmission.

[0055] In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as there is no conflict.

[0056] Example 1:

[0057] In order to avoid damage to the laser tube caused by temperature overload or current overload, in the process of PID parameter setting, the temperature or control current corresponding to the laser device does not cover the full range that the laser device can support, multiple input-output responses are performed, and then the theoretical value of the PID parameter that has not responded and needs to be determined is calculated according to the specific use scene and the specific parameter selection formula algorithm, so as to solve the problem of damaging the laser tube. For example, the temperature range that the laser can support is 10℃-60℃, in order to avoid overload, in the setting process, only 10℃-50℃ is set for the PID parameter, and the PID parameter corresponding to 50℃-60℃ is calculated by the related algorithm, and finally the final setting result corresponding to 10℃-60℃ is obtained.

[0058] But in the final setting result, the part error calculated by using the correlation algorithm is larger, when the final setting result obtained by using the method is applied to the specific use scene, it still needs to use the laser to perform more times of input-output response in real time and use the correlation algorithm to calculate the data again to adjust the PID parameter, these operations further consume larger time and effort, the operation is complex, the practicability is poor, and the test and operation efficiency of the whole laser device is low.

[0059] In order to solve the problems that the efficiency of setting the temperature control PID parameter is low, the practicability is poor, and the laser tube in the laser is likely to be damaged in the prior art, such as Figure 1 As shown in FIG. 1, the embodiment 1 of the present application provides a method for improving the efficiency of setting the temperature control PID parameter, which comprises the following steps:

[0060] Step 10: determining a reference laser device matched with the actual laser device to be set.

[0061] Wherein, the actual laser device is the laser and the temperature control TEC actually needed to set the temperature control PID parameter, and the reference laser device is the reference laser and the reference temperature control TEC used for reference when setting the temperature control PID parameter of the actual laser device. The specific matching principle is described further in the following step 10.

[0062] Step 20: obtaining a reference temperature change difference of the reference laser device under a preset condition, and obtaining a reference PID parameter corresponding to the reference laser device.

[0063] Wherein, the preset condition is selected by the person skilled in the art according to the specific use scene, and the preset condition is a preset control current and a preset maintenance time. The specific operation steps are described further in the following step 20. The reference laser device is loaded with the preset control current at the beginning of the preset maintenance time, at which time the temperature of the reference laser device is T1; the preset control current changes the working temperature of the reference laser device within the preset maintenance time; at the end of the preset maintenance time, the reference laser device reaches the temperature T2, and the reference temperature change difference is the temperature change difference between T1 and T2. The reference PID parameter is the PID parameter of the reference laser device.

[0064] Step 30: determining an actual temperature change difference of the actual laser device under the same preset condition, and determining the ratio of the reference temperature change difference to the actual temperature change difference as a PID correction coefficient.

[0065] Wherein, the same preset condition refers to the same preset control current and preset maintaining time as in step 20. The actual laser device is loaded with the preset control current at the beginning of the preset maintaining time, at which time the temperature of the actual laser device is T3; the preset control current gradually increases the temperature of the actual laser device during the preset maintaining time; at the end of the preset maintaining time, the preset control current makes the actual laser device reach a temperature T4, and the actual temperature change difference is the temperature change difference between T3 and T4. The corresponding reference PID parameters are corrected by the PID correction coefficient to obtain the coefficients of the actual PID parameters of the actual laser device, and the PID correction coefficient is used to represent the temperature characteristic difference between the reference laser device and the actual laser device.

[0066] Step 40: obtaining the final PID parameters of the actual laser device according to the PID correction coefficient and the reference PID parameters.

[0067] Temperature control is essentially a balance control of the heating and heat dissipation performance of the controlled object (the output of the temperature control TEC), and the main factor for producing different temperature difference changes under the same conditions is that the heating performance of the laser and the temperature control TEC is different. The embodiment of the present application keeps the heat dissipation performance of the actual laser device containing the actual temperature control TEC and the reference laser device containing the reference temperature control TEC substantially unchanged, and adjusts the PID parameters by using the reference laser device, which is equivalent to performing a limit test within the normal working range of the reference laser device, obtaining the reference PID parameters, and setting a temperature control reference benchmark for the actual laser device. Then, only need to measure the temperature characteristic difference between the actual laser device and the reference laser device under the same temperature control conditions to obtain the PID correction coefficient representing the temperature characteristic difference. Then, use this as the adjustment coefficient of the actual PID parameters to obtain the actual PID parameters, without performing complete input-output response on the actual laser device. Finally, according to the specific use requirements of the actual laser device (such as the control accuracy and precision of the temperature), the actual PID parameters are fine-tuned to obtain the final PID parameters. The method for improving the temperature control PID parameter setting efficiency of the embodiment of the present application avoids making the actual laser device perform several or even dozens of complete input-output responses to set the PID parameters through repeated trial and error or excitation response, simplifies the operation, and ensures that the laser tube of the actual laser is not damaged at all, and improves the setting efficiency of the temperature control PID parameters.

[0068] The embodiment of the present application determines a reference laser device matched with an actual laser device to be adjusted, acquires a reference temperature change difference of the reference laser device under preset conditions, acquires a reference PID parameter corresponding to the reference laser device, and obtains a temperature control reference benchmark of the actual laser device; under the same preset conditions, an actual temperature change difference of the actual laser device is measured, a ratio of the reference temperature change difference to the actual temperature change difference is determined as a PID correction coefficient, and according to the PID correction coefficient and the reference PID parameter, a final PID parameter of the actual laser device is obtained, so that when the PID parameter of the actual laser device is adjusted, the operation process of continuously correcting the test or excitation response is avoided, the operation is simplified, the laser tube in the laser device is not damaged, the accuracy and stability of temperature control of the actual laser device can be quickly realized, and the efficiency and practicality of the temperature control PID parameter adjustment are improved.

[0069] The method for improving the efficiency of temperature control PID parameter adjustment of the embodiment of the present application is used for PID adjustment of an output parameter of a temperature control TEC in a laser device, so that the laser device is controlled by the temperature control TEC to gradually reach a desired temperature at a certain amplitude within a desired time. In order to facilitate understanding of the scheme, the laser device is introduced as follows:

[0070] The laser device includes a laser, a temperature module, and a control module. The laser is used to generate a stable frequency laser output signal. The temperature module is used to measure and control the real-time working temperature of the laser; the temperature module includes a temperature control TEC capable of ascending and descending temperature control and a thermistor used for temperature detection, and the thermistor and the temperature control TEC are connected with the control module for use. The control module is used to control the size of the control current loaded on the temperature control TEC, so that the temperature control TEC enters a heating or refrigeration state, thereby realizing control of the temperature; the control module processes the temperature data detected by the thermistor in the temperature control module, and controls the current of the temperature control TEC through calculation of the PID parameter. In an optional embodiment, the control module selects an MCU device such as an Advanced RISC Machine (ARM) or a Field Programmable Gate Array (FPGA), or a computer host or a client device connected through other communication interfaces.

[0071] In order to better illustrate the method for improving the efficiency of temperature control PID parameter adjustment of the present application, the step 10 of the method for improving the efficiency of temperature control PID parameter adjustment of the embodiment of the present application is further refined as follows. The actual laser device includes an actual laser and an actual temperature control TEC, as shown in Figure 2 The step 10 includes:

[0072] Step 101a: obtaining a laser as a reference laser whose difference in heat dissipation parameter from the actual laser is within a preset range.

[0073] wherein the heat dissipation parameter of the actual laser and the heat dissipation parameter of the reference laser are determined by a person skilled in the art according to the specific packaging type, shape, size and other specific use scenarios of the actual laser and the reference laser; the preset range tends to be zero, and the specific value is selected by a person skilled in the art, and in an optional embodiment, the preset range is ±0.001 degrees Celsius per watt (℃ / W); wherein the heat dissipation parameter is represented by thermal resistance; thermal resistance refers to the ratio between the temperature difference at both ends of an object and the power of a heat source when heat is transmitted on the object.

[0074] Since the method for improving the efficiency of PID parameter setting of the temperature control of the embodiment of the application needs to control the reference laser device and the actual laser device to be in the same condition, so that the main factor causing different temperature difference changes of the two is only the different heating performance of the laser and the temperature control TEC, in order to obtain the mapping relationship between the PID parameters of the reference laser device and the PID parameters of the actual laser device, and to achieve the purpose of simplifying the determination of the PID parameters of the actual laser device, the reference laser device is selected to make the actual laser and the reference laser, the actual temperature control TEC and the reference temperature control TEC maintain consistent heat dissipation as much as possible.

[0075] In order to maintain consistent heat dissipation as much as possible, the reference laser is selected according to the actual laser from the following several angles:

[0076] The difference between the overall shapes of the reference laser and the actual laser is less than a set change interval. Wherein the overall shape includes the size and structure of the laser, and the difference between the boundary values of the change interval tends to be zero, and the specific value is set by a person skilled in the art.

[0077] The reference laser device and the actual laser device are both laser device of modular structure, and are both composed of multiple independent functional components. In the entire laser device (including laser, temperature control TEC, etc.), modular design is implemented to ensure that the heat dissipation characteristics of the entire laser system are stable during use, so as to improve the accuracy of correcting the PID coefficient. At the same time, the replaceable design of the laser or the temperature control TEC is realized, supporting the interchange of the same type of different models of lasers, supporting the interchange of the same type of different models of temperature control TEC, to meet the needs of different laser functions and adapt to application scenarios.

[0078] The reference laser device and the corresponding functional module in the actual laser device have the same external size. The actual laser and the reference laser have the same package type. In an optional embodiment, any one of a 14-pin butterfly laser, a TO-39 package laser and a TO-56 package laser is adopted.

[0079] Step 102a: Obtain a temperature control TEC with a difference in heat dissipation parameters from the actual temperature control TEC within a preset range as the reference temperature control TEC.

[0080] The heat dissipation parameters of the actual temperature control TEC and the reference temperature control TEC are determined by a person skilled in the art according to the specific package type, shape, size and other specific use scenarios of the actual temperature control TEC and the reference temperature control TEC.

[0081] In order to maintain consistent heat dissipation as much as possible, the reference temperature control TEC is selected according to the actual temperature control TEC from the following aspects: the difference between the overall shape of the reference temperature control TEC and the actual temperature control TEC is less than a set change interval. The overall shape includes the size and structure of the temperature control TEC, and the difference between the boundary values of the change interval approaches zero, and the specific value is set by a person skilled in the art. The actual temperature control TEC and the reference temperature control TEC have the same package type.

[0082] Step 103a: The laser device composed of the reference laser and the reference temperature control TEC is a reference laser device.

[0083] In this embodiment, in order to obtain the reference PID parameter of the reference laser device, the reference laser device needs to be tuned in advance, and the reference PID parameter obtained by tuning is stored in the mapping table. When tuning the actual laser device, only table lookup operation is needed to obtain the reference PID parameter. Specifically, the method for improving the temperature control PID parameter tuning efficiency further comprises: establishing a mapping table in advance, and the process of establishing the mapping table is as shown in Figure 3 , and specifically includes:

[0084] Step 101b: Obtain at least one type of reference laser and at least one type of reference temperature control TEC in advance, combine different types of reference lasers and different types of reference temperature control TECs two by two, and construct at least one reference laser device.

[0085] For example, according to different sizes or package types, the reference lasers include reference laser 1, reference laser 2, reference laser 3, reference laser 4 and reference laser 5; according to different sizes or package types, the reference temperature control TECs include reference temperature control TEC 1, reference temperature control TEC 2, reference temperature control TEC 3, reference temperature control TEC 4 and reference temperature control TEC 5; then, the reference laser 1 + reference temperature control TEC 1 constitutes a reference laser device, the reference laser 1 + reference temperature control TEC 2 constitutes a reference laser device, the reference laser 1 + reference temperature control TEC 3 constitutes a reference laser device, and so on.

[0086] Step 102b: calibrate each reference laser device to obtain the reference PID parameters corresponding to each reference laser device, and form a mapping relationship between each reference laser device and the corresponding reference PID parameters to construct a mapping table.

[0087] In an optional embodiment, the temperature control PID parameters of all reference laser devices are calibrated in advance. Then, according to the types of the reference temperature control TECs and the reference lasers, an identification number is assigned to each reference laser device. When a certain actual laser device to be calibrated is needed to be used later, the reference PID parameters of the matched reference laser device are directly determined by querying the identification number; or, the model of the reference temperature control TEC and the model of the reference laser are directly used to constitute the model of the reference laser device, and each model of the reference laser device is stored in the form of a table or the like. Later, according to the model of the actual temperature control TEC and the model of the actual laser, the reference PID parameters of the matched reference laser device are determined by looking up the table. The specific implementation manner is selected by a person skilled in the art according to the actual use scenario.

[0088] The process of calibrating the reference PID parameters is exemplified as follows: according to a preset PID calibration method, the first PID parameter of the reference temperature control TEC is set, the corresponding preset current is loaded on the reference temperature control TEC, and after a preset time, it is judged whether the working temperature of the reference laser device is at the expected temperature; if yes, the first PID parameter is determined as the PID parameter at the expected temperature; if no, the first PID parameter is updated, and the corresponding control current is loaded on the temperature control TEC according to the updated first PID parameter again until the temperature control TEC outputs the corresponding expected temperature; the foregoing process is iterated until the PID parameter corresponding to the laser device is determined.

[0089] The preset PID setting method, the preset current, the preset time and the expected temperature are selected by a person skilled in the art according to an actual use scene, and are not limited herein. In an optional embodiment, an engineering setting method or an experience setting method is selected for rapid setting. The preset current and the preset time only need to make the reference laser device be in a normal working temperature range (including a boundary value), and the temperature of the reference laser device or the current overload on the reference temperature control TEC (i.e., the limit test is performed on the reference laser device) is allowed to realize setting of the reference PID parameter corresponding to the expected temperature.

[0090] When an actual laser device needs to be used, the reference laser device is directly selected according to the actual laser device, and then the reference PID parameter of the reference laser device is obtained, that is, the temperature control reference benchmark of the actual laser device. Based on the temperature control reference benchmark, by obtaining the PID correction coefficient representing the temperature characteristic difference between the actual laser device and the reference laser device, the temperature control PID parameter of the actual laser device can be quickly set without causing damage to the laser tube in the actual laser device by performing several or even dozens of complete input-output responses on the actual laser.

[0091] In an actual application scene, when the actual laser device is set, the reference temperature change difference of the reference laser device is obtained. Specifically, the PID control function of the reference laser device is closed, a preset control current is loaded on the reference laser device, and the reference temperature change difference of the reference laser device within a preset maintenance time is measured. Correspondingly, the PID control function of the actual laser device is closed, the preset control current is loaded on the actual laser device, and the actual temperature change difference of the actual laser device within the preset maintenance time is measured.

[0092] Of course, in order to further improve the efficiency, the reference temperature change difference can also be measured in advance, and the reference temperature change difference and the corresponding preset condition are stored in the mapping table. Subsequently, the reference temperature change difference and the corresponding preset condition can be obtained by looking up the table, and the actual temperature change difference of the actual laser device is obtained according to the preset condition.

[0093] As shown in FIG. 1, the process of constructing the mapping table further includes: Figure 4

[0094] Step 101c: The PID control function of the reference laser device is closed, a preset control current is loaded on the reference laser device, and the temperature change difference of the reference laser device within a preset maintenance time is measured.

[0095] The preset control current and the preset maintenance time are determined according to the actual situation, and are not limited herein. For example, the preset control current is 1A, and the preset maintenance time is 60s.​

[0096] Step 102c: mapping each reference laser device, reference PID parameter, temperature change difference, preset control current corresponding to the temperature change difference, and preset maintenance time to form a mapping relationship to construct a mapping table.

[0097] Since the preset control current and the preset maintenance time will change the real-time temperature of the laser device, in order to minimize the damage to the laser tube of the reference laser and reduce the cost of reference PID parameter setting, the preset control current and the preset maintenance time need to be within the normal operating temperature range of the reference laser. Before loading the preset control current on the reference temperature control TEC, the PID control function of the reference laser is turned off. The operation of the related method is prior art and will not be described here.

[0098] In order to better illustrate the method for improving the efficiency of temperature control PID parameter setting of the present application, the steps 20 of the method for improving the efficiency of temperature control PID parameter setting of the embodiment of the present application are further refined as follows: Figure 5 As shown in the step 20, the reference temperature change difference of the reference laser device under the preset condition includes:

[0099] Step 201: According to the reference laser device, the mapping table is queried, and the reference temperature change difference corresponding to the reference laser device and the preset control current and the preset maintenance time corresponding to the reference temperature change difference are found from the mapping table.

[0100] The preset control current and the preset maintenance time constitute a preset condition.

[0101] Step 202: According to the reference laser device, the mapping table is queried, and the reference PID parameter corresponding to the reference laser device is found from the mapping table.

[0102] In an optional embodiment, the reference PID parameters of a plurality of reference laser devices are pre-set and stored in the mapping table. When an actual laser device is needed, after determining the reference laser device, the corresponding reference temperature change difference corresponding to the preset control current and the preset maintenance time is directly determined by querying the mapping table.

[0103] In the step 30, the actual temperature change difference of the actual laser device under the same preset condition includes:

[0104] The PID control function of the actual laser device is turned off, the preset control current is loaded on the actual laser device, and the actual temperature change difference of the actual laser device within the preset maintenance time is measured.

[0105] For better illustrating the method for improving the efficiency of temperature control PID parameter setting, the steps 40 of the method for improving the efficiency of temperature control PID parameter setting of the embodiment of the present application are further refined as follows: Figure 6 As shown in the figure, the steps 40 include:

[0106] Step 401: multiply the PID correction coefficient by the reference PID parameter to obtain the actual PID parameter.

[0107] The embodiment of the present application takes the reference PID parameter as the benchmark, and obtains the PID correction coefficient according to the ratio of the reference temperature change difference and the actual temperature change difference . Through the PID correction coefficient, the reference PID parameter is corrected according to the temperature characteristic difference between the actual laser and the reference laser to obtain the actual PID parameter .

[0108] Step 402: adjust the actual PID parameter until the difference between the actual temperature of the actual laser device and the target temperature is less than the set temperature threshold to obtain the final PID parameter.

[0109] In actual use, due to the use requirements such as control accuracy and precision of the working temperature of the actual laser device, there is a certain deviation in the accuracy and precision of the reference PID parameter obtained in advance, so the actual PID parameter needs to be fine-tuned. This fine-tuning does not involve complete input-output response of the actual laser device, has little effect on the efficiency and operation complexity of the setting, and does not damage the laser tube.

[0110] In order to facilitate understanding of the scheme, the PID parameter setting is introduced as follows:

[0111] PID parameter setting refers to setting the proportional (kp), integral (Ti), and derivative (Td) parameters of the PID controller. The person skilled in the art needs to consider the dynamic and static performance index requirements and reasonably select the Kp, Ti, and Td parameters to obtain good control effect. The selection of PID parameters is closely related to the controlled object and process characteristics. Engineering setting method includes various PID parameter setting methods suitable for different processes and objects. In the optional embodiment, the critical proportion method in the engineering setting method is used to set the PID parameters. The specific steps of using the critical proportion method to set the PID parameters are as follows:

[0112] S1: after the controlled object is stabilized, set the integral time of the PID controller to the maximum value and set the derivative time of the PID controller to zero (at this time, the integral action and the derivative action are not enabled, and only the proportional action is enabled).

[0113] Wherein, the oscillation of the measured value produces a deviation, as long as the deviation exists, the integral action is carried out, that is, the deviation is integrated, the output continues to increase or decrease until the deviation is zero, the integral action remains unchanged, and the effect of error (i.e. deviation) adjustment is achieved. The strength of the integral action is inversely proportional to the integral time Ti, the smaller Ti is, the stronger the integral action is; the larger Ti is, the weaker the integral action is. Reducing Ti, the integral action is enhanced, the output changes faster, and the stability of the controlled object is reduced, which is easy to cause or aggravate oscillation; increasing Ti, the integral action is weakened, the output changes slower, and the stability of the controlled object is improved, but the steady-state time will be longer.

[0114] For the controlled object with hysteresis characteristics, a derivative element can be added. Both the proportional action and the integral action are to adjust to eliminate the deviation after the deviation signal is generated, while the derivative action reflects the rate of change of the deviation signal of the controlled object, that is, before the deviation occurs, an advanced control effect is generated. The strength of the derivative action is proportional to the derivative time Td, the larger Td is, the stronger the derivative action is; the smaller Td is, the weaker the derivative action is. Increasing Td, the derivative action is enhanced, the dynamic response of the controlled object is accelerated, and the time required to reach the steady state is shortened, but the stability of the controlled object is easy to be reduced. In the case of the same set value step change, the proportional action, the integral action and the derivative action are enabled for PID control. The proportional coefficient Kp and the integral time Ti are fixed, and different values of Td are taken to obtain different control effects corresponding to different Td.

[0115] S2: Use external disturbance or make a step change in the set value of the PID controller to observe the oscillation of the measured value caused thereby.

[0116] S3: Gradually reduce the proportional degree of the PID controller from large to small, and observe whether the oscillation of the measured value is divergent or attenuated, if it is attenuated, continue to reduce the proportional degree; if it is divergent, increase the proportional degree.

[0117] Wherein, the proportional degree is a representation of the proportional action, which can proportionally reflect the deviation of the system, and as soon as the deviation occurs, the proportional part immediately produces a control action to reduce the deviation. When the deviation is zero, the proportional control action is also zero, so the proportional action is based on the deviation for adjustment, that is, it is a difference adjustment. The strength of the proportional action is proportional to the proportional coefficient Kp, the smaller Kp is, the weaker the proportional action is; the larger Kp is, the stronger the proportional action is. Increasing Kp, the proportional action is enhanced, the dynamic response of the system is accelerated, and the ability to eliminate error is enhanced, but the overshoot is larger; reducing Kp, the proportional action is weakened, the dynamic response of the system is slowed down, but the stability is improved.

[0118] S4: Continuously repeat steps S2 and S3 until the measured value oscillates with a constant amplitude and period, that is, 4-5 times of equal amplitude oscillation. The proportional degree value at this time is the critical proportional degree δk.

[0119] S5: From the oscillation waveform, the time of one round trip is the critical period Tk, that is, the time from the top of the first wave to the top of the second wave. The peak-to-peak distance of the oscillation amplitude or measured value output curve is observed using a recorder, and the measured value is divided by the recording paper speed of the recorder, so that the critical period Tk can be calculated; if it is a centralized control or uses a paperless recorder, Tk can be directly obtained in the trend recording curve.

[0120] S6: The obtained PID controller parameters are calculated, and the parameters are input into the PID controller, and then the system is run again to observe the process change. In most cases, the system can be stably operated, and if the ideal control state has not been reached, the parameters can be fine-tuned.

[0121] Example 2:

[0122] As Figure 7 shown is a framework schematic diagram of a laser device for improving temperature control PID parameter setting efficiency according to an embodiment of the present application. The laser device for improving temperature control PID parameter setting efficiency according to the embodiment includes one or more processors 31 and a memory 32. Among them, Figure 7 The processor 31 is taken as an example in the embodiment.

[0123] The processor 31 and the memory 32 can be connected through a bus or other means, Figure 7 The connection through the bus is taken as an example in the embodiment.

[0124] The memory 32 is a non-volatile computer readable storage medium, which can be used to store non-volatile software programs and non-volatile computer executable programs, such as the method for improving temperature control PID parameter setting efficiency in the embodiment 1. The processor 31 executes the method for improving temperature control PID parameter setting efficiency by running the non-volatile software programs and instructions stored in the memory 32.

[0125] The memory 32 can include a high-speed random access memory, and can also include a non-volatile memory, for example, at least one magnetic disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 32 can optionally include a memory remotely arranged with respect to the processor 31, and these remote memories can be connected to the processor 31 through a network. Examples of the above-mentioned network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0126] The program instructions / modules are stored in the memory 32, and when executed by the one or more processors 31, the method for improving temperature control PID parameter setting efficiency in the above-mentioned embodiment 1 is executed, for example, the above-described Figures 1-6The various steps shown.

[0127] It is worth noting that the information interaction, execution process and the like between the modules and units in the above apparatus and system are based on the same concept as the processing method embodiments of the present application, and the specific content can be referred to the description in the method embodiments of the present application, which will not be described here.

[0128] Those skilled in the art can understand that all or part of the steps in the various embodiments of the method can be completed by instructing the relevant hardware through a program, and the program can be stored in a computer readable storage medium, which can include read only memory (ROM), random access memory (RAM), magnetic disk or optical disk, etc.

[0129] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for improving the tuning efficiency of temperature control PID parameters, characterized in that, include: Identify a reference laser device that matches the actual laser device to be tuned; The actual laser device includes an actual laser and an actual temperature control (TEC); The step of determining a reference laser device that matches the actual laser device to be tuned includes: acquiring a laser whose heat dissipation parameters differ from those of the actual laser within a preset range as a reference laser; acquiring a temperature control TEC whose heat dissipation parameters differ from those of the actual temperature control TEC within a preset range as the reference temperature control TEC; and defining a laser device composed of the reference laser and the reference temperature control TEC as a reference laser device. Obtaining the reference temperature change difference of the reference laser device under preset conditions includes: turning off the PID control function of the reference laser device, applying a preset control current to the reference laser device, and measuring the temperature change difference of the reference laser device within a preset maintenance time. Obtain the reference PID parameters corresponding to the reference laser device; Under the same preset conditions, the actual temperature change difference of the actual laser device is measured, including: turning off the PID control function of the actual laser device, applying the preset control current to the actual laser device, and measuring the actual temperature change difference of the actual laser device within the preset maintenance time. The ratio of the difference in reference temperature change to the difference in actual temperature change is determined as the PID correction coefficient; wherein, the preset control current and the preset duration constitute preset conditions; The final PID parameters of the actual laser device are obtained based on the PID correction coefficient and the reference PID parameters.

2. The method for improving the tuning efficiency of temperature control PID parameters according to claim 1, characterized in that, Both the reference laser device and the actual laser device are modular laser devices, and the corresponding functional modules in the reference laser device and the actual laser device have the same external dimensions. The difference between the overall shape of the reference laser and the actual laser is less than the set variation range; the difference between the overall shape of the reference temperature control TEC and the actual temperature control TEC is less than the set variation range.

3. The method for improving the tuning efficiency of temperature control PID parameters according to claim 1, characterized in that, The actual laser has the same package type as the reference laser; the actual temperature control TEC has the same package type as the reference temperature control TEC.

4. The method for improving the tuning efficiency of temperature control PID parameters according to claim 1, characterized in that, The method for improving the efficiency of temperature control PID parameter tuning also includes: At least one type of reference laser and at least one type of reference temperature control (TEC) are obtained in advance. Different types of reference lasers and different types of reference temperature control (TEC) are combined in pairs to construct at least one reference laser device. Each reference laser device is tuned to obtain the corresponding reference PID parameters. A mapping relationship is then established between each reference laser device and its corresponding reference PID parameters to construct a mapping table.

5. The method for improving the tuning efficiency of temperature control PID parameters according to claim 4, characterized in that, The process of obtaining the reference PID parameters corresponding to the reference laser device includes: The reference laser device is queried from the mapping table to find the reference PID parameter corresponding to the reference laser device.

6. The method for improving the tuning efficiency of temperature control PID parameters according to claim 4, characterized in that, The method for improving the efficiency of temperature control PID parameter tuning also includes: Turn off the PID control function of the reference laser device, apply a preset control current to the reference laser device, and measure the temperature change difference of the reference laser device within a preset maintenance time. A mapping relationship is established for each reference laser device, reference PID parameters, temperature change difference, preset control current and preset duration corresponding to the temperature change difference, in order to construct a mapping table.

7. The method for improving the tuning efficiency of temperature control PID parameters according to claim 6, characterized in that, The step of obtaining the reference temperature change difference of the reference laser device under preset conditions includes: The reference laser device is queried from the mapping table to find the reference temperature change difference corresponding to the reference laser device, as well as the preset control current and preset duration corresponding to the reference temperature change difference. Alternatively, the PID control function of the reference laser device can be turned off, a preset control current can be applied to the reference laser device, and the difference in reference temperature change of the reference laser device can be measured within a preset maintenance time.

8. The method for improving the tuning efficiency of temperature control PID parameters according to any one of claims 1-7, characterized in that, The process of obtaining the final PID parameters of the actual laser device based on the PID correction coefficient and the reference PID parameters includes: The actual PID parameters are obtained by multiplying the PID correction coefficient by the reference PID parameters. The actual PID parameters are adjusted until the difference between the actual temperature of the actual laser device and the target temperature is less than the set temperature threshold, thus obtaining the final PID parameters.

9. A laser device, characterized in that, The method includes at least one processor and a memory, which are connected via a data bus. The memory stores instructions that can be executed by the at least one processor. After being executed by the processor, the instructions are used to complete the method for improving the tuning efficiency of temperature control PID parameters as described in any one of claims 1-8.

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