Semiconductor temperature control system and semiconductor temperature control method

Abstract

The application relates to the technical field of semiconductors, in particular to a semiconductor temperature control system and a semiconductor temperature control method. The system comprises a main loop and a branch loop. The main loop comprises a main loop pipeline, a first valve body assembly, a first temperature detection assembly and a resistivity detection assembly arranged on the main loop pipeline. The branch loop comprises a filtering branch in communication with the main loop pipeline, and a filtering assembly, a branch pipeline temperature control assembly and a second valve body assembly arranged on the filtering branch; the branch pipeline temperature control assembly is in communication with the filtering assembly and is used for cooling the cold carrier entering the filtering assembly and heating the cold carrier flowing out of the filtering assembly; the second valve body assembly is used for regulating the flow of the cold carrier flowing into the branch pipeline temperature control assembly and regulating the flow of the heated cold carrier flowing into the main loop pipeline. The application can ensure that the temperature of the cold carrier entering the filtering assembly is lower than the working temperature of the resin, prolong the use time of the resin, reduce the replacement frequency and reduce the cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a semiconductor temperature control system and a semiconductor temperature control method. BACKGROUND

[0002] In the etching process of semiconductor production and manufacturing, its auxiliary equipment needs to provide an accurate working temperature for the etching temperature control cavity. The process has strict requirements for cleanliness and electrical insulation, which inevitably requires the cryogen used by the temperature control equipment to have extremely high purity.

[0003] In the prior art, deionized water or ethylene glycol is used as the cryogen, which is easy to chemically react with the metal material in the pipeline, thereby generating anions and cations that can affect the etching process. Generally, a filtering branch is connected in parallel to the main circulating pipeline of the equipment, and the filtering barrel with the built-in ion exchange resin continuously adsorbs the anions and cations in the cryogen to maintain a high water resistance value.

[0004] However, in the prior art, because the upper limit of the use temperature of the basic ion exchange resin (OH-) in the ion exchange resin is 60℃, when the operating temperature in the system exceeds 60°, the basic ion exchange resin will quickly lose activity, resulting in the need to frequently replace the ion exchange resin in the filtering barrel, increasing the use cost of the ion exchange resin, and at the same time, a large amount of labor is wasted. SUMMARY

[0005] The present application aims to at least solve at least one of the technical defects in the above technical problems. To this end, the present application provides a semiconductor temperature control system and a semiconductor temperature control method, which cools the cryogen entering the filtering barrel to ensure the working temperature of the resin, prolong the use time of the resin, reduce the replacement frequency, and reduce the cost.

[0006] The first aspect of the present application provides a semiconductor temperature control system.

[0007] The second aspect of the present application provides a semiconductor temperature control method.

[0008] The first aspect of the present application provides a semiconductor temperature control system, comprising:

[0009] a main circulation, comprising a main circulation pipeline, a first valve body assembly, a first temperature detection assembly and a resistivity detection assembly arranged on the main circulation pipeline;

[0010] The first valve body assembly is used to regulate the flow of the cryogen in the main circulation pipeline; the first temperature detection assembly is used to detect the first temperature of the cryogen; and the resistivity detection assembly is used to detect the actual resistivity of the cryogen.

[0011] The branch circulation comprises a filter branch communicated with the main circulation pipeline, and a filter assembly, a branch pipeline temperature control assembly and a second valve body assembly arranged on the filter branch;

[0012] The branch pipeline temperature control assembly is communicated with the filter assembly, and is used for cooling the cold carrier entering the filter assembly and heating the cold carrier flowing out of the filter assembly; and the second valve body assembly is used for regulating the flow of the cold carrier flowing into the branch pipeline temperature control assembly, and regulating the flow of the heated cold carrier flowing to the main circulation pipeline.

[0013] According to the semiconductor temperature control system provided by the application, the filter branch comprises a first branch pipeline and a second branch pipeline; and the branch pipeline temperature control assembly comprises:

[0014] A cooling unit, an inlet end of the cooling unit being communicated with the main circulation pipeline through the first branch pipeline; and an outlet end of the cooling unit being communicated with an inlet end of the filter assembly;

[0015] A heating unit, an inlet end of the heating unit being communicated with an outlet end of the filter assembly, and an outlet end of the heating unit being communicated with the main circulation pipeline through the second branch pipeline.

[0016] According to the semiconductor temperature control system provided by the application, the filter branch further comprises a third branch pipeline, the third branch pipeline being arranged between the outlet end of the cooling unit and the inlet end of the filter assembly; and the branch circulation further comprises:

[0017] A second temperature detection assembly arranged in the third branch pipeline, and used for detecting a second temperature of the cold carrier.

[0018] According to the semiconductor temperature control system provided by the application, the filter branch further comprises a fourth branch pipeline; the fourth branch pipeline is arranged between the third branch pipeline and the inlet end of the cooling unit; and the branch circulation further comprises:

[0019] A third valve body assembly arranged in the third branch pipeline and the fourth branch pipeline, and used for changing the flow direction of the cold carrier, so that the cold carrier with a second temperature lower than a temperature threshold flows to the filter assembly, and the cold carrier with a second temperature not lower than a temperature threshold flows to the inlet end of the cooling unit.

[0020] According to the semiconductor temperature control system provided by the application, the branch pipeline temperature control assembly is a semiconductor refrigeration sheet.

[0021] According to the semiconductor temperature control system provided by the application, the main circulation comprises:

[0022] A water pump arranged in the main circulation pipeline, and used for providing power for the circulation of the cold carrier.

[0023] A heater is arranged in the main circulation pipeline, an outlet end of the heater is communicated with an inlet end of the filter branch pipeline, and an inlet end of the heater is communicated with an outlet end of the water pump.

[0024] According to the semiconductor temperature control system provided by the application, the main circulation further comprises:

[0025] A second electric three-way valve, an inlet end of the second electric three-way valve is communicated with an outlet end of the water pump, and a first outlet end of the second electric three-way valve is communicated with an inlet end of the heater.

[0026] A heat exchanger, an inlet end of the heat exchanger is communicated with a second outlet end of the second electric three-way valve, and an outlet end of the heat exchanger is communicated with an inlet end of the heater.

[0027] The application further provides a semiconductor temperature control method, comprising:

[0028] Collecting a first temperature of the cold carrier in the main circulation pipeline and an actual resistivity of the cold carrier;

[0029] When the first temperature is greater than a temperature threshold value and the actual resistivity is less than a resistivity threshold value, a first valve body assembly is closed to cut off the main circulation pipeline, a second valve body assembly is opened to make the filter branch pipeline conductive, and a branch pipeline temperature control assembly starts to work to cool the cold carrier entering the filter assembly and heat the cold carrier flowing out of the filter assembly.

[0030] The semiconductor temperature control method provided by the application further comprises:

[0031] Collecting a second temperature of the cold carrier in the third branch pipeline;

[0032] According to the relationship between the second temperature and the temperature threshold value, the actual working power of the branch pipeline temperature control assembly is adjusted in real time, so that the second temperature is not greater than the temperature threshold value.

[0033] The semiconductor temperature control method provided by the application further comprises:

[0034] Collecting a second temperature of the cold carrier in the third branch pipeline;

[0035] When the second temperature is less than the temperature threshold value, the third valve body assembly is controlled to switch to a first conduction state, so that the cold carrier flows to the filter assembly.

[0036] When the second temperature is not less than the temperature threshold value, the third valve body assembly is controlled to switch to a second conduction state, so that the cold carrier flows to the inlet end of the cooling unit.

[0037] The application provides a semiconductor temperature control system and a semiconductor temperature control method. In the semiconductor temperature control system, when the cooling agent needs to be filtered, the first valve body assembly on the main circulation pipeline is closed, the second valve body assembly on the filtering branch pipeline is opened, the cooling agent in the main circulation pipeline enters the filtering branch pipeline, and then enters the filtering assembly after being cooled by the branch pipeline temperature control assembly; and the cooling agent flowing out of the filtering assembly returns to the main circulation pipeline after being heated by the branch pipeline temperature control assembly. The cooling agent entering the filtering barrel is cooled to ensure that the actual temperature of the cooling agent is lower than the working temperature of the resin, prolong the use time of the resin, reduce the replacement frequency, and reduce the cost.

[0038] In the semiconductor temperature control method, the first temperature of the cooling agent in the main circulation pipeline is compared with the temperature threshold of the resin, and the actual resistivity of the cooling agent in the main circulation pipeline is compared with the resistivity threshold, in the case that the first temperature is greater than the temperature threshold and the actual resistivity is less than the resistivity threshold, the first valve body assembly is closed to cut off the main circulation pipeline, the second valve body assembly is opened to turn on the filtering branch pipeline, and the branch pipeline temperature control assembly starts to work, so that the filtering of the cooling agent is realized, the actual resistivity of the cooling agent is less than the resistivity threshold, the actual temperature of the cooling agent entering the filtering assembly is less than the temperature threshold, the actual temperature of the cooling agent is lower than the working temperature of the resin, the use time of the resin is prolonged, the replacement frequency is reduced, and the cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0040] Figure 1 is one of the schematic diagrams of the semiconductor temperature control system provided by the application;

[0041] Figure 2 is the second schematic diagram of the semiconductor temperature control system provided by the application;

[0042] Figure 3 is the flow chart of the semiconductor temperature control method provided by the application;

[0043] Figure 4 is the structural schematic diagram of the electronic equipment provided by the application.

[0044] REFERENCE SIGNS:

[0045] 100, main circulation; 200, branch circulation;

[0046] 110, main circulation pipeline; 120, first valve body assembly; 121, second electric two-way valve; 122, third electric two-way valve; 130, first temperature detection assembly; 131, first temperature detection unit; 132, second temperature detection unit; 140, resistivity detection assembly; 150, water pump; 160, heater; 170, second electric three-way valve; 180, heat exchanger;

[0047] 210, filtration branch; 211, first branch pipeline; 212, second branch pipeline; 213, third branch pipeline; 214, fourth branch pipeline; 220, filtration assembly; 230, branch pipeline temperature control assembly; 240, second valve body assembly; 241, fourth electric two-way valve; 242, fifth electric two-way valve; 250, second temperature detection assembly; 260, first electric two-way valve; 270, third valve body assembly;

[0048] 810, processor; 820, communication interface; 830, memory; 840, communication bus. DETAILED DESCRIPTION

[0049] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below with reference to the drawings in the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0050] As shown in Figure 1 and Figure 2 The present application provides a semiconductor temperature control system, which comprises a main circulation 100 and a branch circulation 200, and the branch circulation 200 is in communication with the main circulation 100. The main circulation 100 comprises a main circulation pipeline 110, a first valve body assembly 120, a first temperature detection assembly 130 and a resistivity detection assembly 140 arranged on the main circulation pipeline 110. The first valve body assembly 120 is used for regulating the flow of the coolant in the main circulation pipeline 110. The first temperature detection assembly 130 is used for detecting the first temperature of the coolant. The resistivity detection assembly 140 is used for detecting the actual resistivity of the coolant.

[0051] The branch circulation 200 comprises a filter branch 210 communicated with the main circulation pipeline 110, and a filter assembly 220, a branch pipeline temperature control assembly 230 and a second valve body assembly 240 arranged on the filter branch 210; the branch pipeline temperature control assembly 230 is communicated with the filter assembly 220, and is used for cooling the cold carrier entering the filter assembly 220 and heating the cold carrier flowing out of the filter assembly 220; the second valve body assembly 240 is used for regulating the flow of the cold carrier flowing into the branch pipeline temperature control assembly 230, and is also used for regulating the flow of the heated cold carrier flowing into the main circulation pipeline 110.

[0052] In the semiconductor temperature control system, when the cold carrier needs to be filtered, the first valve body assembly 120 on the main circulation pipeline 110 is closed, and the second valve body assembly 240 on the filter branch 210 is opened, so that the cold carrier in the main circulation pipeline 110 enters the filter branch 210, and then enters the filter assembly 220 after being cooled by the branch pipeline temperature control assembly 230; and the cold carrier flowing out of the filter assembly 220 returns to the main circulation pipeline 110 after being heated by the branch pipeline temperature control assembly 230. The cold carrier entering the filter assembly 220 is cooled, so that the actual temperature of the cold carrier is lower than the working temperature of the resin, the use time of the resin is prolonged, the replacement frequency is reduced, and the cost is reduced.

[0053] In the specific embodiment of the present application, as shown in Figure 1 and Figure 2 , the filter branch 210 comprises a first branch pipeline 211 and a second branch pipeline 212; the branch pipeline temperature control assembly 230 comprises a cooling unit and a heating unit; the inlet end of the cooling unit is communicated with the main circulation pipeline 110 through the first branch pipeline 211; the outlet end of the cooling unit is communicated with the inlet end of the filter assembly 220; the inlet end of the heating unit is communicated with the outlet end of the filter assembly 220, and the outlet end of the heating unit is communicated with the main circulation pipeline 110 through the second branch pipeline 212.

[0054] When the cold carrier needs to be filtered, the first valve body assembly 120 is closed, and the second valve body assembly 240 is opened, so that the cold carrier enters the cooling unit through the first branch pipeline 211, the cooling unit cools the cold carrier, so that the actual temperature of the cold carrier flowing out of the cooling unit is lower than the working temperature of the resin in the filter assembly 220, the use time of the resin is prolonged, the replacement frequency is reduced, and the cost is reduced. The cold carrier cooled by the cooling unit flows into the filter assembly 220, and then flows to the heating unit after being filtered by the filter assembly 220, the heating unit heats the cold carrier, so that the temperature of the cold carrier entering the main circulation pipeline 110 is close to the process temperature required by the semiconductor preparation process, the cold carrier in the main circulation pipeline 110 does not need to be heated again, and the energy consumption is reduced.

[0055] In the specific embodiment of the present application, as shown inFigure 1 and Figure 2 As shown, the filter branch 210 also includes a third branch pipe 213, which is located at the outlet end of the cooling unit and the inlet end of the filter assembly 220. The branch circulation 200 also includes a second temperature detection component 250, which is located in the third branch pipe 213 and is used to detect the second temperature of the refrigerant. Based on the difference between the second temperature and the working temperature of the resin, that is, based on the difference between the second temperature and the temperature threshold, the working power of the cooling unit of the branch pipe temperature control component 230 is adjusted to ensure that the actual temperature of the refrigerant flowing out of the cooling unit is lower than the temperature threshold. This effectively prevents refrigerant with an actual temperature higher than the temperature threshold from entering the filter assembly 220, further improving the service life of the resin, reducing the number of replacements, and lowering costs.

[0056] In a specific embodiment of the present invention, a first electric two-way valve 260 is installed on the third branch pipe 213. The installation of the first electric two-way valve 260 facilitates the replacement of the filter assembly 220 and the branch pipe temperature control assembly 230. When the filter assembly 220 needs to be replaced, the first electric two-way valve 260 is closed, and the fourth electric two-way valve 241 of the second valve body assembly 240 is also closed, allowing the filter assembly 220 to be removed. When the branch pipe temperature control assembly 230 needs to be replaced, the first electric two-way valve 260 is closed, and the fifth electric two-way valve 242 of the second valve body assembly 240 is also closed, allowing the branch pipe temperature control assembly 230 to be removed.

[0057] In specific embodiments of the invention, such as Figure 2 As shown, the filter branch 210 also includes a fourth branch pipe 214; the fourth branch pipe 214 is located at the inlet end of the third branch pipe 213 and the cooling unit; the branch circulation 200 also includes a third valve assembly 270; the third valve assembly 270 is located at the third branch pipe 213 and the fourth branch pipe 214, and is used to change the flow direction of the refrigerant, so that the refrigerant with a second temperature below the temperature threshold flows to the filter assembly 220, and the refrigerant with a second temperature not lower than the temperature threshold flows to the inlet end of the cooling unit. Through the design of the fourth branch pipe 214 and the third valve assembly 270, the refrigerant with a second temperature below the temperature threshold can flow to the filter assembly 220, and the refrigerant with a second temperature not lower than the temperature threshold can flow to the inlet end of the cooling unit, further ensuring that the second temperature of the refrigerant entering the filter assembly 220 is lower than the temperature threshold of the resin, increasing the resin's service life, reducing the number of replacements, and lowering costs.

[0058] Understandably, the third valve body assembly 270 includes a first electrically operated three-way valve, which is installed in the third branch pipe 213. The other outlet of the first electrically operated three-way valve is connected to the inlet of the cooling unit via a fourth branch pipe 214. The flow direction of the refrigerant in the third branch pipe 213 is controlled by the first electrically operated three-way valve.

[0059] In some embodiments, the branch pipe temperature control assembly 230 is a semiconductor refrigeration sheet.

[0060] In some embodiments, as shown in FIG. 1, the inlet end of the cold end of the semiconductor refrigeration sheet is connected to the main circulation pipe 110 through the first branch pipe 211, and the outlet end of the cold end of the semiconductor refrigeration sheet is connected to the filter assembly 220 through the third branch pipe 213; the outlet end of the filter assembly 220 is connected to the inlet end of the hot end of the semiconductor refrigeration sheet, and the outlet end of the hot end of the semiconductor refrigeration sheet is connected to the main circulation pipe 110 through the second branch pipe 212. The third branch pipe 213 is provided with a second temperature detection assembly 250 and a first electric two-way valve 260. Figure 1 In some embodiments, as shown in FIG. 1, the inlet end of the cold end of the semiconductor refrigeration sheet is connected to the main circulation pipe 110 through the first branch pipe 211, and the outlet end of the cold end of the semiconductor refrigeration sheet is connected to the filter assembly 220 through the third branch pipe 213; the outlet end of the filter assembly 220 is connected to the inlet end of the hot end of the semiconductor refrigeration sheet, and the outlet end of the hot end of the semiconductor refrigeration sheet is connected to the main circulation pipe 110 through the second branch pipe 212. The third branch pipe 213 is provided with a second temperature detection assembly 250 and a first electric two-way valve 260.

[0061] Figure 2 In some embodiments, as shown in FIG. 1, the inlet end of the cold end of the semiconductor refrigeration sheet is connected to the main circulation pipe 110 through the first branch pipe 211, and the outlet end of the cold end of the semiconductor refrigeration sheet is connected to the filter assembly 220 through the third branch pipe 213; the outlet end of the filter assembly 220 is connected to the inlet end of the hot end of the semiconductor refrigeration sheet, and the outlet end of the hot end of the semiconductor refrigeration sheet is connected to the main circulation pipe 110 through the second branch pipe 212. The third branch pipe 213 is provided with a second temperature detection assembly 250 and a first electric two-way valve 260.

[0062] In some embodiments, the second valve body assembly 240 includes a fourth electric two-way valve 241 arranged on the second branch pipe 212, and a fifth electric two-way valve 242 arranged on the first branch pipe 211.

[0063] In some embodiments, the filter assembly 220 includes a filter barrel, and the filter barrel is filled with ion resin, which is used to filter the coolant so that the resistivity of the filtered coolant is less than a resistivity threshold.

[0064] In some embodiments, as shown in FIG. 1 and FIG. 2, the main circulation 100 includes a water pump 150 and a heater 160; the water pump 150 is arranged on the main circulation pipe 110 and is used to provide power for the circulation of the coolant; the heater 160 is arranged on the main circulation pipe 110, and the outlet end of the heater 160 is connected to the inlet end of the filter branch 210; the inlet end of the heater 160 is connected to the outlet end of the water pump 150. When the water pump 150 is started, the water pump 150 pumps the coolant in the main circulation pipe 110 into the heater 160, and the heater 160 heats the coolant so that the temperature of the coolant meets the temperature requirements of the semiconductor manufacturing process for the coolant. Figure 1 Figure 2 In some embodiments, as shown in FIG. 1 and FIG. 2, the main circulation 100 includes a water pump 150 and a heater 160; the water pump 150 is arranged on the main circulation pipe 110 and is used to provide power for the circulation of the coolant; the heater 160 is arranged on the main circulation pipe 110, and the outlet end of the heater 160 is connected to the inlet end of the filter branch 210; the inlet end of the heater 160 is connected to the outlet end of the water pump 150. When the water pump 150 is started, the water pump 150 pumps the coolant in the main circulation pipe 110 into the heater 160, and the heater 160 heats the coolant so that the temperature of the coolant meets the temperature requirements of the semiconductor manufacturing process for the coolant.​​

[0065] In the specific embodiment of the present application, the main circulation 100 further comprises a second electric three-way valve 170 and a heat exchanger 180; the inlet end of the second electric three-way valve 170 is in communication with the outlet end of the water pump 150, the first outlet end of the second electric three-way valve 170 is in communication with the inlet end of the heater 160; the inlet end of the heat exchanger 180 is in communication with the second outlet end of the second electric three-way valve 170; and the outlet end of the heat exchanger 180 is in communication with the inlet end of the heater 160. The second electric three-way valve 170 is used to change the flow direction and flow rate of the cold carrier. The heat exchanger 180 is used to regulate the temperature of the cold carrier.

[0066] In the specific embodiment of the present application, the heat exchanger 180 can be a partitioned heat exchanger, that is, the cold carrier in the main circulation pipeline 110 is introduced into the heat exchanger 180, and the liquid to be heated is also introduced into the heat exchanger 180, so that the cold carrier and the heated liquid are separated by the wall surface of the heat exchanger 180 and flow in different spaces of the heat exchanger 180, and the heat exchange process between the cold carrier in the main circulation pipeline 110 and the heated liquid is realized through the heat conduction of the wall surface of the heat exchanger 180 and the convection of the liquid on the wall surface, so as to regulate the temperature of the cold carrier in the main circulation pipeline 110. It should be noted that the temperature of the cold carrier in the main circulation pipeline 110 can be lowered by the heat exchanger 180, and the temperature of the cold carrier in the main circulation pipeline 110 can also be raised, which can be realized by changing the temperature of the heated liquid. The specific embodiment of the present application will not be described here.

[0067] In the specific embodiment of the present application, the first valve body assembly 120 comprises a second electric two-way valve 121 and a third electric two-way valve 122, which are both arranged on the main circulation pipeline 110. The second electric two-way valve 121 is arranged on the main circulation pipeline 110 in communication with the inlet end of the water pump 150, and the second branch pipeline 212 is located downstream of the second electric two-way valve 121. The third electric two-way valve 122 is arranged on the main circulation pipeline 110 in communication with the outlet end of the heater 160, and the third electric two-way valve 122 is located downstream of the first branch pipeline 211.

[0068] In the specific embodiment of the present application, the main circulation 100 further comprises a third temperature detection assembly 190 arranged at the inlet end of the heater 160, for detecting the third temperature of the cold carrier entering the heater 160. According to the difference between the third temperature and the temperature threshold of the resin, the heating efficiency of the heater 160 is adjusted, so that the temperature of the cold carrier flowing out of the heater 160 meets the process requirements.

[0069] In the specific embodiments of the present application, the first temperature detecting assembly 130 comprises a first temperature detecting unit 131 and a second temperature detecting unit 132; the first temperature detecting unit 131 is located downstream of the first branch pipe 211 and is used to detect the actual temperature of the refrigerant flowing out of the heater 160; the second temperature detecting unit 132 is arranged downstream of the second branch pipe 212 and is used to detect the actual temperature of the refrigerant flowing into the water pump 150.

[0070] It can be understood that, for the convenience of description, the temperature detected by the first temperature detecting unit 131 is referred to as the first detected temperature, and the temperature detected by the second temperature detecting unit 132 is referred to as the second detected temperature; in the preparation process of the semiconductor, it is required that the difference between the first detected temperature and the second detected temperature is within a certain temperature threshold range.

[0071] In the specific embodiments of the present application, as shown in Figure 3 The present application also provides a semiconductor temperature control method, which is performed by using the semiconductor temperature control system of any of the above embodiments. The semiconductor temperature control method of the present application comprises the following steps:

[0072] S100, collecting the first temperature of the refrigerant in the main circulation pipe 110 and the actual resistivity of the refrigerant;

[0073] S200, in the case that the first temperature is greater than the temperature threshold and the actual resistivity is less than the resistivity threshold, the first valve body assembly 120 is closed to cut off the main circulation pipe 110, the second valve body assembly 240 is opened to make the filter branch 210 conductive, and the branch pipe temperature control assembly 230 starts to work to realize the cooling of the refrigerant entering the filter assembly 220 and the heating of the refrigerant flowing out of the filter assembly 220.

[0074] By using the semiconductor temperature control method of the present application, the first temperature of the refrigerant in the main circulation pipe 110 is compared with the temperature threshold of the resin, and the actual resistivity of the refrigerant in the main circulation pipe 110 is compared with the resistivity threshold; in the case that the first temperature is greater than the temperature threshold and the actual resistivity is less than the resistivity threshold, the first valve body assembly 120 is closed to cut off the main circulation pipe 110, the second valve body assembly 240 is opened to make the filter branch 210 conductive, and the branch pipe temperature control assembly 230 starts to work, so that not only the filtering of the refrigerant can be realized to make the actual resistivity of the refrigerant less than the resistivity threshold, but also the actual temperature of the refrigerant entering the filter assembly 220 can be ensured to be less than the temperature threshold, the temperature of the refrigerant entering the filter assembly is ensured to be lower than the working temperature of the resin, the use time of the resin is improved, the replacement frequency is reduced, and the cost is reduced.

[0075] In the specific embodiments of the present application, the semiconductor temperature control method further comprises:

[0076] In the case that the first temperature is not greater than the temperature threshold and the actual resistivity is less than the resistivity threshold, the first valve body assembly 120 is closed to cut off the main circulating pipeline 110, the second valve body assembly 240 is opened to turn on the filtering branch pipeline 210, and the branch pipeline temperature control assembly 230 does not work, so that the filtering of the cooling medium is realized. In this way, the cooling medium with the first temperature not greater than the temperature threshold can be filtered without being cooled and heated by the branch pipeline temperature control assembly 230, so that the power consumption is reduced, and the temperature of the cooling medium entering the filtering assembly is lower than the working temperature of the resin, so that the service time of the resin is prolonged, the replacement frequency is reduced, and the cost is reduced.

[0077] In the specific embodiments of the present application, the semiconductor temperature control method further comprises:

[0078] collecting a second temperature of the cooling medium in the third branch pipeline 213;

[0079] According to the relationship between the second temperature and the temperature threshold, the actual working power of the branch pipeline temperature control assembly 230 is adjusted in real time, so that the second temperature is not greater than the temperature threshold.

[0080] In the specific embodiments of the present application, by comparing the second temperature with the temperature threshold, and according to the relationship between the second temperature and the temperature threshold, the actual working power of the branch pipeline temperature control assembly 230 is adjusted, so that the actual temperature of the cooling medium entering the filtering assembly 220 is lower than the temperature threshold, the service time of the resin is prolonged, the replacement frequency is reduced, and the cost is reduced.

[0081] In some embodiments, in the case that the second temperature is lower than the temperature threshold, the actual working power of the branch pipeline temperature control assembly 230 does not need to be adjusted; in the case that the second temperature is not lower than the temperature threshold, the actual working power of the branch pipeline temperature control assembly 230 is increased, so that the actual temperature of the cooling medium cooled by the branch pipeline temperature control assembly 230, that is, the second temperature, is lower than the temperature threshold.

[0082] It can be understood that the branch pipeline temperature control assembly 230 comprises a semiconductor refrigeration sheet, so if the actual working power of the semiconductor refrigeration sheet changes, the cooling speed of the cold end of the semiconductor refrigeration sheet to the cooling medium and the heating speed of the hot end of the semiconductor refrigeration sheet to the cooling medium will change synchronously, which not only ensures that the actual temperature of the cooled cooling medium is lower than the temperature threshold, but also ensures that the difference between the temperature of the cooling medium flowing out of the hot end of the semiconductor refrigeration sheet and the process required cooling medium temperature is small.

[0083] In the specific embodiments of the present application, the semiconductor temperature control method further comprises:

[0084] collecting a second temperature of the cooling medium in the third branch pipeline 213;

[0085] When the second temperature is lower than the temperature threshold, the third valve body assembly 270 switches to the first conducting state to make the coolant flow to the filter assembly 220;

[0086] When the second temperature is not lower than the temperature threshold, the third valve body assembly 270 switches to the second conducting state to make the coolant flow to the inlet end of the cooling unit, and further ensure that the actual temperature of the coolant entering the filter assembly 220 is not higher than the temperature threshold.

[0087] In an embodiment of the present application, the semiconductor temperature control method further comprises:

[0088] The first detection temperature of the main circulation pipeline 110 downstream of the filter branch 210 inlet end and the second detection temperature of the main circulation pipeline 110 upstream of the filter branch 210 outlet end are collected;

[0089] According to the relationship between the first detection temperature and the second detection temperature, the actual working power of the heater 160 is adjusted to make the temperature difference between the first detection temperature and the second detection temperature within the temperature threshold range, wherein the temperature threshold range refers to the range of requirements of the semiconductor preparation process on the temperature of the coolant.

[0090] During the flow of the coolant in the main circulation pipeline 110, the temperature of the coolant changes in real time, but the temperature requirement of the semiconductor preparation process on the coolant is relatively strict, and the temperature of the coolant needs to be maintained within the process requirement range, i.e. within the temperature threshold range, during the circulation process. Therefore, in order to ensure that the temperature of the coolant in the main circulation pipeline 110 is always within the process requirement temperature range, the actual working power of the heater 160 is adjusted according to the relationship between the first detection temperature and the second detection temperature, so that the temperature difference between the first detection temperature and the second detection temperature is within the temperature threshold range.

[0091] In an embodiment of the present application, according to the relationship between the first detection temperature and the second detection temperature, the actual working power of the heater 160 is adjusted to make the temperature difference between the first detection temperature and the second detection temperature within the temperature threshold range, comprising:

[0092] If the first detection temperature is greater than the second detection temperature, and the temperature difference between the first detection temperature and the second detection temperature is greater than the maximum value of the process required temperature difference threshold range, the power of the heater 160 is reduced to reduce the first detection temperature, so that the temperature difference is within the process required temperature difference threshold range;

[0093] If the first detection temperature is not greater than the second detection temperature, and the temperature difference between the first detection temperature and the second detection temperature is less than the minimum value of the process required temperature difference threshold range, the power of the heater 160 is increased to increase the first detection temperature, so that the temperature difference is within the process required temperature difference threshold range.

[0094] Figure 4 An example is a schematic diagram of the physical structure of an electronic device, such as... Figure 4 As shown, the electronic device may include: a processor 810, a communication interface 820, a memory 830, and a communication bus 840, wherein the processor 810, the communication interface 820, and the memory 830 communicate with each other through the communication bus 840. The processor 810 can call logic instructions in the memory 830 to execute a semiconductor temperature control method, which includes: S100, acquiring a first temperature of the refrigerant in the main circulation pipeline 110 and the actual resistivity of the refrigerant; S200, when the first temperature is greater than a temperature threshold and the actual resistivity is less than a resistivity threshold, the first valve assembly 120 closes to cut off the main circulation pipeline 110, the second valve assembly 240 opens to conduct the filter branch 210, and the branch pipeline temperature control assembly 230 starts working to cool the refrigerant entering the filter assembly 220 and heat the refrigerant flowing out of the filter assembly 220.

[0095] Furthermore, the logical instructions in the aforementioned memory 830 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0096] In another aspect, the present application also provides a computer program product, which comprises a computer program stored on a non-transitory computer readable storage medium, and the computer program is executable by a processor to cause a computer to perform the semiconductor temperature control method provided by the above-mentioned methods, which comprises: S100, collecting a first temperature of the load coolant in the main circulation pipeline 110 and an actual resistivity of the load coolant; S200, in the case that the first temperature is greater than a temperature threshold value and the actual resistivity is less than a resistivity threshold value, the first valve body assembly 120 is closed to cut off the main circulation pipeline 110, the second valve body assembly 240 is opened to make the filter branch pipeline 210 conductive, and the branch pipeline temperature control assembly 230 starts to work to realize the cooling of the load coolant entering the filter assembly 220 and the heating of the load coolant flowing out of the filter assembly 220.

[0097] In another aspect, the present application also provides a non-transitory computer readable storage medium, which stores a computer program, and the computer program is executable by a processor to cause a computer to perform the semiconductor temperature control method provided by the above-mentioned methods, which comprises: S100, collecting a first temperature of the load coolant in the main circulation pipeline 110 and an actual resistivity of the load coolant; S200, in the case that the first temperature is greater than a temperature threshold value and the actual resistivity is less than a resistivity threshold value, the first valve body assembly 120 is closed to cut off the main circulation pipeline 110, the second valve body assembly 240 is opened to make the filter branch pipeline 210 conductive, and the branch pipeline temperature control assembly 230 starts to work to realize the cooling of the load coolant entering the filter assembly 220 and the heating of the load coolant flowing out of the filter assembly 220.

[0098] The device embodiments described above are only schematic, wherein the units shown as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., can be located in one place or distributed on a plurality of network units. Some or all of the components can be selected according to actual needs to achieve the purpose of the present embodiment scheme. Those skilled in the art can understand and implement without creative labor.

[0099] Those skilled in the art can clearly understand the technical solutions of the various embodiments from the above description of the embodiments, and the various embodiments can be implemented by means of software with the necessary general hardware platforms, and of course, can also be implemented by hardware. Based on such understanding, the above technical solutions, essentially or in other words, the part of the prior art that makes a contribution, can be embodied in the form of a software product, which can be stored in a computer readable storage medium, such as a ROM / RAM, a magnetic disk, an optical disk, and the like, and includes a number of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0100] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for some technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor temperature control system, characterized by, The application relates to a circulating system for a cooling device, which comprises: a main loop, a first valve body assembly (120), a first temperature detection assembly (130) and a resistivity detection assembly (140) arranged on the main loop (110); the first valve body assembly (120) is used for regulating the flow of the coolant in the main loop (110); the first temperature detection assembly (130) is used for detecting the first temperature of the coolant; and the resistivity detection assembly (140) is used for detecting the actual resistivity of the coolant; a branch loop, a filter assembly (220), a branch loop temperature control assembly (230) and a second valve body assembly (240) arranged on a filter branch (210) communicated with the main loop (110); the branch loop temperature control assembly (230) is communicated with the filter assembly (220) and is used for cooling the coolant entering the filter assembly (220) and heating the coolant flowing out of the filter assembly (220); and the second valve body assembly (240) is used for regulating the flow of the coolant flowing into the branch loop temperature control assembly (230) and regulating the flow of the heated coolant flowing into the main loop (110); the filter branch (210) comprises a first branch loop (211), a second branch loop (212), a third branch loop (213) and a fourth branch loop (214); the branch loop temperature control assembly (230) comprises: a cooling unit, an inlet end of the cooling unit being communicated with the main loop (110) through the first branch loop (211); an outlet end of the cooling unit being communicated with an inlet end of the filter assembly (220) through the third branch loop (213); and the fourth branch loop (214) being arranged between the third branch loop (213) and the inlet end of the cooling unit; a heating unit, an inlet end of the heating unit being communicated with an outlet end of the filter assembly (220) and an outlet end of the heating unit being communicated with the main loop (110) through the second branch loop (212); the branch loop further comprises: a second temperature detection assembly (250) arranged on the third branch loop (213) and used for detecting the second temperature of the coolant; the branch loop further comprises: a third valve body assembly (270) arranged on the third branch loop (213) and the fourth branch loop (214) and used for changing the flow direction of the coolant, so that the coolant with the second temperature lower than a temperature threshold value flows into the filter assembly (220) and the coolant with the second temperature not lower than the temperature threshold value flows into the inlet end of the cooling unit; and the second temperature is the temperature of the coolant in the third branch loop (213).

2. The semiconductor temperature control system of claim 1, wherein, The branch loop temperature control assembly (230) is a semiconductor refrigeration sheet.

3. The semiconductor temperature control system of claim 1, wherein, the main loop comprises: a water pump (150) arranged on the main loop (110) and used for providing power for the circulation of the coolant. A heater (160) is arranged in the main circulation pipeline (110), and an outlet end of the heater (160) is communicated with an inlet end of the filter branch (210); an inlet end of the heater (160) is communicated with an outlet end of the water pump (150).

4. The semiconductor temperature control system of claim 3, wherein, The main circulation further comprises: A second electric three-way valve (170), an inlet end of the second electric three-way valve (170) is communicated with an outlet end of the water pump (150), a first outlet end of the second electric three-way valve (170) is communicated with an inlet end of the heater (160); A heat exchanger (180), an inlet end of the heat exchanger (180) is communicated with a second outlet end of the second electric three-way valve (170); an outlet end of the heat exchanger (180) is communicated with an inlet end of the heater (160).

5. A semiconductor temperature control method, characterized by, The semiconductor temperature control system according to any one of claims 1 to 4, comprising: collecting a first temperature of the secondary refrigerant in the main circulation pipeline (110) and an actual resistivity of the secondary refrigerant; when the first temperature is greater than a temperature threshold value and the actual resistivity is less than a resistivity threshold value, the first valve body assembly (120) is closed to cut off the main circulation pipeline (110), the second valve body assembly (240) is opened to make the filter branch (210) conductive, and the branch pipeline temperature control assembly (230) starts to work to realize cooling of the secondary refrigerant entering the filter assembly (220) and heating of the secondary refrigerant flowing out of the filter assembly (220).

6. The method of claim 5, wherein the semiconductor temperature is controlled by: Further comprising: collecting a second temperature of the secondary refrigerant in the third branch pipeline (213); adjusting an actual working power of the branch pipeline temperature control assembly (230) in real time according to a relationship between the second temperature and the temperature threshold value until the second temperature is not greater than the temperature threshold value.

7. The method of claim 5, wherein the semiconductor temperature is controlled by a temperature control device. Further comprising: collecting a second temperature of the secondary refrigerant in the third branch pipeline (213); when the second temperature is less than the temperature threshold value, the third valve body assembly (270) is switched to a first conduction state to make the secondary refrigerant flow to the filter assembly (220); when the second temperature is not less than the temperature threshold value, the third valve body assembly (270) is switched to a second conduction state to make the secondary refrigerant flow to the inlet end of the cooling unit.

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