Cleaning device and wafer grinding device

Abstract

The application discloses a cleaning device for cleaning a wafer grinding workbench and a wafer grinding device. The cleaning device for cleaning the wafer grinding workbench comprises a cam, the outer periphery of which comprises at least two arc segments with different radii; a rotating member, which is used for rotating around the outer periphery of the cam and horizontally moving; and a cleaning brush pressure plate, which is connected with the rotating member through a transmission structure and is used for vertically moving under the driving of the horizontal movement of the rotating member and driving the cleaning brush arranged on the cleaning brush pressure plate to clean the wafer grinding workbench through at least two cleaning forces. The cleaning device provided by the application can better clean the pollutants on the grinding workbench and improve the cleaning effect and the cleaning efficiency.

Description

Technical Field

[0001] This application belongs to the field of wafer grinding technology, and more specifically, relates to a cleaning device for a wafer grinding worktable and a wafer grinding device. Background Technology

[0002] In the manufacturing of integrated circuits / semiconductors (ICs), in order to reduce the wafer's packaging height, decrease the chip package size, improve the chip's thermal diffusion efficiency, electrical performance, mechanical performance, and reduce the amount of chip processing, the wafer needs to be ground before subsequent packaging. The thickness of the ground chip can even be less than 5% of the initial thickness.

[0003] During wafer grinding, contaminants such as grinding debris or particles shed from the grinding wheel remain on the grinding table. As the wafer carrier, these contaminants can severely impact the quality of the grinding process. For example, the grinding table uses porous ceramic vacuum adsorption of the wafer. If contaminants clog the pores of the ceramic, the wafer adsorption will be ineffective. Furthermore, contaminants on the surface of the porous ceramic can scratch or even break the adsorbed wafer. Therefore, cleaning the grinding table is crucial.

[0004] Normally, the grinding table is cleaned by rotating and / or translating a cleaning brush on it. However, those skilled in the art have found that this cleaning method has poor cleaning effect and low cleaning efficiency. Summary of the Invention

[0005] This application provides a cleaning device and a wafer grinding device, which are intended to at least solve one of the technical problems existing in the prior art.

[0006] The first aspect of this application provides a cleaning device for cleaning a wafer grinding table, comprising: a cam having at least two arc-shaped segments with different radii on its outer periphery; a rotating member for rotating around the outer periphery of the cam and performing horizontal movement; and a cleaning brush pressure plate connected to the rotating member via a transmission structure for performing vertical movement under the drive of the horizontal movement of the rotating member, and driving the cleaning brush mounted thereon to clean the wafer grinding table through at least two cleaning forces.

[0007] In one embodiment, the cam includes at least three arc-shaped segments connected in sequence, the radii of the at least three arc-shaped segments increasing in size.

[0008] In one embodiment, the arc length ratio of the at least three arc segments is the same as the application time ratio of the cleaning force corresponding to the at least three arc segments.

[0009] In one embodiment, the rotating component includes n follower components that conform to the outer periphery of the cam and move horizontally, and the plurality of follower components are evenly distributed along the circumference of the rotating component; the cam includes n sets of arc segments that cooperate with the follower components, and each set of arc segments includes at least three arc segments; n is an integer greater than 1.

[0010] In one embodiment, the outer periphery of the cam includes at least a first arc segment and a second arc segment with increasing radius; the cleaning brush is a brush and oilstone combination disk, and the height L1 of the brush bristles on the brush and oilstone combination disk and the height L2 of the oilstone conform to the following relationship: L1=L2+ΔL; when the rotating component is in a first state abutting against the first arc segment, the deformation of the brush bristles is less than ΔL, so as to clean the wafer grinding table by the brush bristles on the cleaning brush; when the rotating component is in a second state abutting against the second arc segment, the deformation of the brush bristles is greater than or equal to ΔL, so as to clean the wafer grinding table by the brush bristles on the cleaning brush and the oilstone simultaneously.

[0011] In one embodiment, the cleaning device further includes: a nozzle fixing member that rotates with the rotating member, used to fix the nozzle, the nozzle fixing member being fixedly connected to the cleaning brush pressure plate and the cleaning brush in the horizontal direction, used to drive the cleaning brush to rotate.

[0012] In one embodiment, a return spring is provided horizontally between the nozzle fixing member and the rotating member.

[0013] In one embodiment, the transmission structure includes a connector disposed on the rotating member and an upper inclined surface of the cleaning brush pressure plate, the connector abutting against the upper inclined surface.

[0014] In one embodiment, the cleaning brush pressure plate is a disc, and the upper inclined surface is a conical surface.

[0015] In one embodiment, the cleaning brush pressure plate and the cleaning brush are connected by a guide post, and a spring is fitted on the guide post at a position between the cleaning brush pressure plate and the cleaning brush sleeve.

[0016] A second aspect of this application provides a wafer grinding apparatus, comprising: a turntable on which a grinding worktable is disposed for adsorbing a wafer to be ground; a grinding assembly disposed above the grinding worktable for grinding the wafer; and a cleaning device as described above for cleaning the grinding worktable.

[0017] The beneficial effects of this application are as follows: By using at least two arc-shaped segments with different radii in the cam of the cleaning device, the rotating part can move horizontally while rotating, and the cleaning brush pressure plate can move vertically under the drive of the horizontal movement through the transmission structure, thereby applying different cleaning forces to the cleaning brush, so that the force of the cleaning brush on the grinding table is constantly changing, thereby better cleaning the contaminants on the grinding table and improving the cleaning effect and cleaning efficiency. Attached Figure Description

[0018] The advantages of this application will become clearer and easier to understand through the detailed description in conjunction with the following accompanying drawings, which are merely illustrative and do not limit the scope of protection of this application, wherein:

[0019] Figure 1 This is a schematic diagram of a wafer grinding apparatus provided in an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of the structure of a cleaning device provided in one embodiment of this application;

[0021] Figure 3 This is a partial cross-sectional view of a cleaning apparatus provided in an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of the structure of a cam provided in one embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the structure of the cam and rotating component provided in one embodiment of this application;

[0024] Figure 6 This is another partial cross-sectional view of a cleaning apparatus provided in one embodiment of this application;

[0025] Figure 7 This is a schematic diagram of the structure of the three cleaning brushes provided in the embodiment.

[0026] 10. Cleaning device; 20. Turntable; 30. Grinding assembly; 40. Chassis turntable; 50. Y-axis drive component;

[0027] 101. Cylinder; 102. Slide plate; 103. Motor; 104. Reducer; 105. Support and transmission components; 106. Connector; 107. Waterproof cover;

[0028] 111, Cam; 1111, First arc segment; 1112, Second arc segment; 1113, Third arc segment;

[0029] 112. Rotating component; 1121. Follower component; 1122. Bearing fixing component; 1123. Guide rail fixing seat; 1124. Guide rail; 1125. Guide rail connecting seat; 1126. Connecting column;

[0030] 113. Clean the brush pressure plate; 114. Clean the brush;

[0031] 115. Transmission structure; 1151. Connecting parts;

[0032] 116. Elastic element; 117. Protective flange; 118. Nozzle fixing element; 119. Nozzle; 120. Return spring; 1201. Guide shaft; 1202. Spring; 122. Guide post; 123. Oil-free bushing. Detailed Implementation

[0033] The technical solutions described in this application will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this application, used to illustrate the concept of this application; these descriptions are illustrative and exemplary, and should not be construed as limiting the implementation methods or the scope of protection of this application. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and description of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0034] The accompanying drawings in this specification are schematic diagrams used to illustrate the concept of this application and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of the embodiments of this application, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0035] In this application, "Chemical Mechanical Polishing (CMP)" is also referred to as "Chemical Mechanical Planarization (CMP)".

[0036] In this application, a wafer (W) is also referred to as a substrate, crystal plate, or wafer, etc., with the same meaning and practical function.

[0037] The embodiments disclosed in this application generally relate to wafer grinding apparatus used in the semiconductor device manufacturing industry, and more particularly to cleaning apparatus for cleaning grinding tables.

[0038] See Figure 1 The diagram illustrates a wafer grinding apparatus comprising:

[0039] Turntable 20, on which a grinding worktable is configured to hold the wafer to be ground;

[0040] Grinding assembly 30, which is disposed above the grinding table, is used to grind the wafer;

[0041] The cleaning device 10 is used to clean the grinding worktable;

[0042] The wafer grinding apparatus also includes a chassis turntable 40, on which three turntables 20 are mounted for rotating the turntables 20 to a position below the grinding assembly 30 or below the cleaning device 10.

[0043] The wafer grinding apparatus also includes a base and a Y-axis drive component 50 disposed on the base for driving the cleaning device 10 to move in the vertical direction.

[0044] When the grinding table configured on the turntable 20 rotates to a position below the cleaning device 10, the cleaning brush of the cleaning device 10 rotates and / or translates on the grinding table to clean it.

[0045] For details, see Figure 2 The cleaning device 10 may include: a cylinder 101, a sliding plate 102, a motor 103, a reducer 104, a support and transmission component 105, a connector 106, and a waterproof cover 107. When cleaning the grinding table, the vertical position of the cleaning brush can be adjusted using the cylinder 101 and the sliding plate 102. Figure 2 As shown by the arrow, the cleaning brush located inside the waterproof cover 107 rotates through the shaft of motor 103, passing through reducer 104 and support transmission component 105, thereby cleaning the grinding table. Reducer 104, connected to the motor, is used to reduce speed and increase torque; support transmission component 105 is connected to 102 for connection and fixation support; support transmission component 105 is also connected to reducer 104, transmitting power and ultimately transferring the motor's rotational motion to the cleaning brush; connector 106 is used for water and air passage.

[0046] However, this cleaning method has poor cleaning effect and low cleaning efficiency.

[0047] To address the aforementioned problems, this application provides a cleaning device for a grinding worktable.

[0048] See Figures 3-7 The cleaning device of this application includes: cam 111, rotating part 112, cleaning brush pressure plate 113, and cleaning brush 114.

[0049] The outer periphery of the cam 111 includes at least two arc-shaped segments with different radii. The rotating member 112 is used to rotate around the outer periphery of the cam 111 and perform horizontal movement. The cleaning brush pressure plate 113 is connected to the rotating member 112 through a transmission structure 115. The cleaning brush pressure plate 113 is used to perform vertical movement under the drive of the horizontal movement of the rotating member 112, and drives the cleaning brush 114 mounted thereon to clean the wafer grinding table through at least two cleaning forces.

[0050] The cam 111 has at least two arc segments with different radii, which allow the rotating member 112 to move horizontally in the radial direction while rotating. The transmission structure 115 causes the cleaning brush pressure plate 113 to move vertically under the drive of this horizontal movement, which drives the cleaning brush 114 mounted on it to clean the wafer grinding table with at least two cleaning forces. The rotation of the rotating member 112 causes the cleaning force of the cleaning brush 114 to change continuously during the cleaning process, thereby improving the cleaning effect and cleaning efficiency.

[0051] Specifically, a protective flange 117 can be fixedly installed above the waterproof cover of the cleaning device 10, and a cam 111 can be fixedly installed on the protective flange 117.

[0052] The shaft of the motor 103 can pass through the support transmission component 105 to the waterproof cover of the cleaning device 10, and the protective flange 117 and cam 111 of the cleaning device can be coaxially arranged according to the shaft. Figure 3 , 4 The vertical dashed line in the center represents the axis of rotation, and the curved line with an arrow is used to indicate the direction of rotation of the shaft.

[0053] Furthermore, such as Figure 5 As shown, the cam 111 includes at least three arc-shaped segments connected in sequence, with the radii of the at least three arc-shaped segments increasing progressively. This allows the force exerted by the cleaning brush 114 during cleaning to change in a progressively increasing manner, and to cyclically change with the rotation of the rotating component 112, further improving the cleaning effect and efficiency.

[0054] like Figure 5 As shown, the cam 111 may include three arc segments, namely the first arc segment, the second arc segment and the third arc segment, with the radii of the three arc segments increasing in sequence.

[0055] Preferably, to ensure the cleaning effect, the radius of the three arc-shaped segments is between 30mm and 45mm.

[0056] Specifically, the arc length ratio of at least three arc segments is the same as the application time ratio of the corresponding cleaning force of at least three arc segments. Therefore, the cleaning effect can be adjusted by changing the arc length of the three arc segments and changing the cleaning time of the cleaning brush 114 with the corresponding force.

[0057] Specifically, the rotating component 112 includes n follower components 1121 that conform to the outer periphery of the cam 111 and move horizontally. The multiple follower components 1121 are evenly distributed along the circumference of the rotating component 112, and n is an integer greater than 1.

[0058] Correspondingly, the cam 111 also includes n sets of arc segments that cooperate with the follower 1121. Each set of arc segments includes at least three arc segments as described above. Thus, when the rotating member 112 rotates, the radius of the arc segment that each follower 1121 is in contact with is the same, which improves the accuracy of the cleaning device.

[0059] Specifically, the rotating component 112 may include a follower 1121 connected to the rotating shaft and a bearing fixing component 1122. The follower 1121 may be disposed on the bearing fixing component 1122. The follower 1121 moves horizontally against the outer periphery of the cam 111, driving the bearing fixing component 1122 to move synchronously.

[0060] See Figure 5 The diagram shows three follower elements 1121 and three sets of arc segments. The included angle between the three follower elements 1121 is 120°. The dotted line from the follower elements 1121 to the center of the circle can divide the circumference of the cam 111 into three sets of arc segments. Figure 5 The cam includes a boss, a central hole for inserting a rotating shaft, and four holes around the central hole for securing the boss to the flange. Of course, Figure 5 For illustrative purposes only, the number of follower 1121 may also be other, all of which are within the scope of protection of this application.

[0061] Optionally, the cleaning device 10 further includes: a nozzle fixing member 118 for fixing the nozzle 119. The nozzle fixing member 118 is fixedly connected to the cleaning brush pressure plate 113 and the cleaning brush 114 in the vertical direction, and is used to drive the cleaning brush 114 to rotate, so that the cleaning brush 114 can rotate and brush. The rotation of the cleaning brush 114 and the change of force of the cleaning brush 114 during the cleaning work can be realized simultaneously through a rotating member 112, which saves costs.

[0062] Furthermore, a return spring 120 is provided horizontally between the nozzle fixing member 118 and the rotating member 112. The return spring 120 abuts between the rotating member 112 and the nozzle fixing member 118, and is used to provide a force for the rotating member 112 to move in the direction of the cam 111.

[0063] The reset spring 120 specifically includes a guide shaft 1201 arranged horizontally between the rotating member 112 and the nozzle fixing member 118, and a spring 1202 sleeved on the guide shaft 1201.

[0064] If the rotating component 112 includes a bearing fixing component 1122 and a follower component 1121 connected to the rotating shaft, then the return spring 120 can be disposed between the bearing fixing component 1122 and the nozzle fixing component 118.

[0065] Furthermore, the bearing fixing member 1122 can also be moved and positioned below the nozzle fixing member 118 via a slide rail component to improve the stability of the horizontal movement of the bearing fixing member 1122.

[0066] The slide rail assembly may include a guide rail mounting base 1123, a guide rail 1124, and a guide rail connecting seat 1125, all fixedly mounted to the nozzle mounting member 118. The guide rail 1124 is fixedly mounted on the guide rail mounting base 1123 and arranged radially along the guide rail mounting base. The guide rail connecting seat 1125 is connected to the bearing mounting member 1122 and cooperates with the guide rail 1124 for horizontal movement. Specifically, the nozzle mounting member 118 and the guide rail mounting base 1123 may be fixedly connected by a connecting post 1126; the guide rail 1124 is preferably an oil-free lubricated guide rail.

[0067] Optionally, the transmission structure 115 includes a connector disposed on the rotating member 112 and an upper inclined surface of the cleaning brush pressure plate 113. The connector abuts against the upper inclined surface, and the horizontal movement of the rotating member 112 drives the cleaning brush pressure plate 113 to perform vertical movement after passing through the inclined surface. In this embodiment, the inclination angle θ of the upper inclined surface is ≤15°.

[0068] Specifically, when the rotating member 112 is positioned below the nozzle fixing member 118 via the guide rail component, the connecting member can be positioned on the guide rail connecting seat 1125 on the side near the cleaning brush pressure plate 113.

[0069] Optionally, the cleaning brush pressure plate 113 is a disc with a conical upper inclined surface to accommodate the circular motion of the rotating member 112. Of course, other shapes of inclined surfaces are also within the scope of protection of this application.

[0070] In this embodiment, the cleaning brush pressure plate 113 and the cleaning brush 114 can be connected by an elastic member 116. The vertical movement of the cleaning brush pressure plate 113 causes the elastic force on the elastic member 116 to change. The elastic force is applied to the cleaning brush 114 as the cleaning force of the cleaning brush 114 to perform the cleaning work.

[0071] Furthermore, the cleaning brush pressure plate 113 and the cleaning brush 114 are fixedly connected by a guide post 122. A spring is sleeved on the guide post 122 at the position between the cleaning brush pressure plate 113 and the cleaning brush 114, so that the elastic force of the spring is changed by the vertical movement of the cleaning brush pressure plate 113, thereby changing the cleaning force applied to the cleaning brush 114.

[0072] See Figure 6When the cleaning device 10 includes a nozzle fixing member 118 and the rotating member 112 is set below the nozzle fixing member 118 through the guide rail component, one end of the guide post 122 can be set inside the nozzle fixing member 118. After the guide post 122 passes through the guide rail fixing seat 1123, the cleaning brush pressure plate 113, and the spring, the other end is fixed on the cleaning brush 114. Figure 4 The vertical dashed line on the left represents the center line of guide post 122.

[0073] In this embodiment, the nozzle fixing member 118 can rotate with the rotating shaft. The connecting column 1126 secures the nozzle fixing member 118, the guide rail fixing seat 1123, the cleaning brush pressure plate, and the cleaning brush together in the vertical direction. Thus, the rotation of the nozzle fixing member drives the rotation of the guide rail fixing seat 1123 and the cleaning brush pressure plate and the cleaning brush below it to rotate. The nozzle fixing member 118 and the connecting member 1151 can be fixedly connected in the horizontal direction through the guide shaft 1201. The connecting member 1151 is reset by the spring 1202 sleeved on the guide shaft 1201, so that the follower 1121 fixedly connected to the connecting member 1151 rotates around the outer periphery of the cam 111 and moves horizontally, driving the cleaning brush pressure plate 113 to move vertically.

[0074] An oil-free bushing 123 can be installed above the cleaning brush pressure plate 113 to ensure smooth vertical movement of the cleaning brush pressure plate 113 and improve the service life of the cleaning brush pressure plate 113 and the guide column 122. Figure 4 The oil-free bushing in the middle is represented by a dashed line.

[0075] Optionally, in this embodiment, the cleaning brush 114 can be a bristle brush disc, see [reference needed]. Figure 7 The cleaning brush 114 can also be a sponge brush disc, an oilstone disc, or a combination of brush and oilstone disc, all of which are within the scope of protection of this application.

[0076] See Figure 6 The nozzle holder 118 is provided with a nozzle 119, and there can be multiple nozzles 119, which are used to provide cleaning fluid. Figure 7 The round hole on the cleaning brush is a nozzle clearance hole, which is used to allow the nozzle to smoothly spray the two fluids onto the grinding table.

[0077] Furthermore, the cleaning brush also includes an oilstone, which is used to remove particulate matter from the surface being cleaned.

[0078] See Figure 7 The cleaning brush shown in (a) includes six sponge brushes distributed circumferentially along the cleaning disc, and three sets of nozzle clearance holes. See also Figure 7 The cleaning brush shown in (b) includes six oilstones distributed circumferentially along the cleaning disc, and three sets of nozzle clearance holes. See also Figure 7The cleaning brush shown in (c) includes three sponge brushes distributed circumferentially along the cleaning disc, three oilstones, and three sets of nozzle clearance holes.

[0079] In this embodiment, if the cleaning brush is a combination of a brush and an oilstone, the outer periphery of the cam includes at least a first arc segment and a second arc segment with increasing radius; the cleaning brush is a combination of a brush and an oilstone, and the height L1 of the brush bristles on the combination of the brush and the height L2 of the oilstone conform to the following relationship: L1=L2+ΔL.

[0080] Specifically, 0.3mm≤ΔL≤2mm; preferably, 0.8mm≤ΔL≤1.5mm.

[0081] The diameter d of a single bristle can be in the following range: 0.1≤d≤0.5mm.

[0082] When the rotating component is in a first state abutting against the first arc segment, the deformation of the bristles is less than ΔL, so that the wafer grinding table is cleaned by the bristles on the cleaning brush. When the rotating component is in a second state abutting against the second arc segment, the deformation of the bristles is greater than or equal to ΔL, so that the wafer grinding table is cleaned simultaneously by the bristles on the cleaning brush and the oilstone. Therefore, when the rotating component is in the first state abutting against the first arc segment, larger particles on the grinding table can be brushed away, and then switching to the second state allows for the cleaning of finer particles on the grinding table through the combination of bristles and oilstone, improving the cleaning effect.

[0083] For example, let the cleaning force corresponding to the first arc segment be F1, the radius of the first arc segment be R1, the radius of the second arc segment be R2, the radius of the third arc segment be R3, and the conversion coefficient of vertical motion to cleaning force be K. Then the cleaning force corresponding to the second arc segment is: F2 = F1 + 6 * K * (R2 - R1) tanθ; the scrubbing force corresponding to the third arc segment is: F3 = F2 + 6 * K * (R3 - R2) tanθ; where 6 is the number of springs set between the cleaning brush pressure plate and the cleaning brush, K is the spring coefficient, and θ is the angle between the upper inclined surface of the cleaning brush pressure plate and the horizontal direction.

[0084] When the cleaning force is F1, the cleaning brush pressure plate lightly presses the cleaning brush, so that the deformation of the brush bristles is less than ΔL; when the cleaning force is F2, the pressure of the cleaning brush pressure plate on the cleaning brush increases, so that the deformation of the brush bristles is greater than or equal to ΔL. At this time, the brush bristles and the oilstone simultaneously clean the grinding table with light pressure; when the cleaning force is F3, the brush bristles and the oilstone simultaneously clean the grinding table with heavy pressure.

[0085] This application also claims protection for a wafer grinding apparatus, the structure of which is similar to... Figure 1 The same applies, so I won't repeat it here.

[0086] The following describes the operation of the cleaning device: The wafer grinding apparatus has three turntables on its chassis turntable, used to rotate the turntables to a position below the grinding assembly 30 or below the cleaning device. When the grinding table on the turntable rotates to a position below the cleaning device, the cleaning brushes of the cleaning device rotate and / or translate on the grinding table, cleaning the wafer grinding table simultaneously with at least two cleaning forces.

[0087] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0088] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A cleaning device for cleaning a wafer grinding worktable, characterized in that, include: The cam has at least two arc-shaped segments with different radii on its outer periphery; A rotating component for rotating around the outer periphery of the cam and performing horizontal movement; A cleaning brush pressure plate, connected to the rotating component via a transmission structure, is used to move vertically under the drive of the horizontal movement of the rotating component, and to drive the cleaning brush mounted thereon to clean the wafer grinding table through at least two cleaning forces; the outer periphery of the cam includes at least a first arc segment and a second arc segment with increasing radius; the cleaning brush is a brush-oilstone combination disc, and the height L1 of the brush bristles on the brush-oilstone combination disc and the height L2 of the oilstone conform to the following relationship: L1=L2+ΔL; when the rotating component is in a first state of contact with the first arc segment, the deformation of the brush bristles is less than ΔL, so that the wafer grinding table is cleaned by the brush bristles on the cleaning brush; when the rotating component is in a second state of contact with the second arc segment, the deformation of the brush bristles is greater than or equal to ΔL, so that the wafer grinding table is cleaned simultaneously by the brush bristles on the cleaning brush and the oilstone; The transmission structure includes a connector disposed on the rotating member and an upper inclined surface of the cleaning brush pressure plate, wherein the connector abuts against the upper inclined surface.

2. The cleaning device as described in claim 1, characterized in that, The cam includes at least three arc-shaped segments connected in sequence, the radii of which increase progressively.

3. The cleaning device as described in claim 2, characterized in that, The arc length ratio of the at least three arc segments is the same as the application time ratio of the cleaning force corresponding to the at least three arc segments.

4. The cleaning device as described in claim 2, characterized in that, The rotating component includes n follower components that conform to the outer periphery of the cam and move horizontally, and the multiple follower components are evenly distributed along the circumference of the rotating component; the cam includes n sets of arc segments that cooperate with the follower components, and each set of arc segments includes at least three arc segments; n is an integer greater than 1.

5. The cleaning apparatus as described in claim 1, characterized in that, The cleaning device further includes: a nozzle fixing component for fixing the nozzle, the nozzle fixing component being fixedly connected to the cleaning brush pressure plate and the cleaning brush in the horizontal direction, for driving the cleaning brush to rotate.

6. The cleaning apparatus as described in claim 5, characterized in that, A return spring is provided horizontally between the nozzle fixing component and the rotating component.

7. The cleaning apparatus as described in claim 1, characterized in that, The cleaning brush pressure plate is a disc, and the upper inclined surface is a conical surface.

8. The cleaning apparatus as described in claim 1, characterized in that, The cleaning brush pressure plate is connected to the cleaning brush via a guide post, and a spring is fitted on the guide post at a position between the cleaning brush pressure plate and the cleaning brush sleeve.

9. A wafer grinding apparatus, characterized in that, include: A rotary table, on which a grinding worktable is configured for adsorbing wafers to be ground; a grinding assembly, disposed above the grinding worktable, for grinding the wafers; and a cleaning device as described in any one of claims 1 to 8, for cleaning the grinding worktable.

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