A precise temperature-controlled semiconductor wafer annealing furnace

Abstract

The present application discloses a precise temperature-controlled semiconductor wafer annealing furnace, comprising a furnace body and a furnace door hinged to the furnace body, wherein a quartz chamber, a heating unit, a wafer carrier and a gas supply unit are installed in the furnace body, and a temperature detection device is installed at the furnace door. The annealing furnace of the present application has a pyrometer, which can detect the temperature inside the furnace body during the wafer annealing process. Each heating lamp can be adjusted individually, so that the uniformity of the internal heating temperature can be better controlled. The temperature detection device uses a thermocouple to measure the temperature, and the temperature detection is more accurate. It can calibrate the heating lamp, adjust the heating lamp, and can also be used to calibrate the pyrometer. The temperature detection device has two working states. The first state can be used as an auxiliary temperature control, and the second state is to effectively monitor the temperature of the entire annealing process through multiple temperature sensors, so as to better adjust the power of the heating lamp when necessary.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and more specifically, to a precise temperature-controlled semiconductor wafer annealing furnace. Background Art

[0002] Semiconductor wafers are silicon wafer carriers used in the production of integrated circuits. In the integrated circuit manufacturing process, rapid annealing of wafers is a common processing technology. High-temperature annealing of wafers using extremely rapid heating and a certain duration at the target temperature can eliminate lattice damage caused by ion implantation and repair defects, effectively increasing the electrical properties of semiconductor wafer materials. Annealing furnaces are equipment used in annealing processes.

[0003] In the prior art, annealing furnaces used for wafer processing usually use high-power heating lamps to irradiate the entire wafer. The heating lamps are usually arranged in the form of concentric circles and are divided into different zones according to different arrangement radii. The lamps in each zone use the same power controller, and a pyrometer is used to measure the temperature during the annealing process. Since the pyrometer is a non-contact sensor, the temperature it detects is difficult to truly and reliably reflect the temperature of the wafer surface. Moreover, when the pyrometer itself fails, the temperature change cannot be responded to and calibrated in time, which will cause the temperature detected by the pyrometer to be inaccurate. Therefore, it is difficult to achieve the ideal temperature control effect. In addition, there are multiple heating lamps in each zone, and the controller cannot control a certain heating lamp alone, that is, it cannot adjust a certain heating lamp. It is easy for local heating points to overheat or overcool, causing the wafer to deform. Therefore, it is still difficult to meet the requirements of temperature control uniformity on the wafer surface. Summary of the invention

[0004] The present invention aims to overcome the defects of the prior art and provide a semiconductor wafer annealing furnace with precise temperature control.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solution: a semiconductor wafer annealing furnace, comprising a furnace body and a furnace door hinged to the furnace body, a quartz chamber, a heating unit, a wafer carrier and a gas supply unit are installed in the furnace body, and a temperature detection device is installed at the furnace door.

[0006] Furthermore, a handle unit, a door lock unit and an observation window are installed at the furnace door.

[0007] Therefore, the handle unit and the door lock unit are convenient for opening and closing the furnace door, and the observation window is convenient for observing the situation in the furnace body.

[0008] Furthermore, the furnace body is provided with a display screen and physical buttons.

[0009] This facilitates better operation of the annealing furnace.

[0010] Furthermore, the heating unit is a heating lamp panel; and a plurality of pyrometers are installed under the wafer carrier.

[0011] The heating lamp panel is used as the annealing heat source, and the pyrometer can detect the temperature inside the furnace during the wafer annealing process.

[0012] Furthermore, the heating lamp panel has a plurality of heating lamps, and the power of each heating lamp can be independently controlled.

[0013] The pyrometer can thus detect the internal temperature during annealing, and each heating lamp can be adjusted individually, allowing for better control of the internal heating temperature uniformity.

[0014] Furthermore, the plurality of heating lamp panels are distributed in a rectangular array or a circular array.

[0015] The heat source is thereby better matched to the wafer to be annealed.

[0016] Further, the temperature detection device includes a first movable unit, a second movable unit, two slide rails installed on the furnace door, and two limit blocks installed on the furnace door; the first movable unit includes a strip slider and a rotating seat hinged to the strip slider, the strip slider has two first slide grooves cooperating with the slide rails, both ends of the strip slider are fixed with convex plates, the convex plates have a first locking bolt for locking the relative position of the strip slider and the furnace door, the bottom end of the strip slider is fixed with a limit plug plate, the rotating seat has a circular mounting groove, a circular mounting seat is installed in the circular mounting groove, the mounting seat has a plurality of temperature sensors, the end of the rotating seat away from the strip slider has a first positioning hole, and the surface of the rotating seat away from the mounting seat has a second positioning hole; the second movable unit includes a sliding plate, the sliding plate has two limit plug holes that can be inserted by the limit plug plate, and each limit plug hole has a The cam is provided with a second locking bolt which locks the position of the slide sleeve and the second locking bolt.

[0017] Therefore, the first state and the second state of the temperature detection device can be switched conveniently, and the rotating seat can be positioned by the positioning unit.

[0018] Furthermore, the rotating seat and the mounting seat are both made of high temperature resistant materials.

[0019] Therefore, during the annealing process, the rotating seat and the mounting seat can withstand higher temperatures in the furnace body.

[0020] Furthermore, the positioning unit includes a positioning block fixedly connected to the sliding plate and a positioning sleeve inserted into the positioning block, the positioning sleeve can be inserted into the first positioning hole and the second positioning hole of the rotating seat, and a spring is connected between the positioning sleeve and the positioning block.

[0021] Therefore, the positioning unit has a certain degree of elasticity and is better matched with the first and second positioning holes.

[0022] Furthermore, the multiple temperature sensors are divided into a central temperature sensor and multiple circumferential temperature sensors, the multiple circumferential temperature sensors are divided into multiple circles, and the multiple temperature sensors in the same circle are distributed in a ring shape with equal intervals.

[0023] Therefore, the setting of multiple-circle temperature sensors can achieve more uniform temperature measurement.

[0024] Furthermore, the temperature sensor is a thermocouple temperature sensor.

[0025] Therefore, the thermocouple temperature sensor can detect temperature more accurately.

[0026] Furthermore, there are two limit plug plates and two limit plug sleeves; a top stopper is installed at the top end of the slide rail, and a bottom stopper is installed at the bottom end of the slide rail.

[0027] Therefore, the rotation seat can be limited by the cooperation of the limiting plug plate and the limiting plug sleeve.

[0028] Furthermore, in the first state, the two sliding sleeves abut against the two bottom end stoppers respectively.

[0029] Thereby, the bottom end stopper limits the sliding plate.

[0030] Furthermore, the top of the mounting seat has a circular step portion, and the circular mounting groove has a circular flange with a notch, and the circular flange is located at the step portion for limiting the mounting seat.

[0031] The mounting seat is limited by the annular flange, so that the mounting seat is installed in the circular mounting groove.

[0032] Furthermore, an L-shaped adjustment unit is hinged at the furnace door, and the L-shaped adjustment unit includes a rotating block and a rotating plate connected to the rotating block, the end of the rotating plate is in the shape of an arc surface, and the rotating seat is provided with a strip-shaped receiving groove, the strip-shaped receiving groove is communicated with the notch of the annular flange, and the mounting seat is connected with an abutment block through a connecting rod, and the end of the abutment block is in the shape of an arc surface; in the first state, the L-shaped adjustment unit is located between the rotating seat and the furnace door, the rotating plate abuts the furnace door, and the rotating block abuts the surface of the rotating seat away from the mounting seat; in the second state, the rotating plate is accommodated in the strip-shaped receiving groove, and the end of the rotating plate abuts the abutment The end of the block; the two slide rails are respectively the first slide rail and the second slide rail. In the second state, the mounting seat has two working positions, namely the first working position and the second working position. In the first working position, the arc surface of the abutment block abuts the arc surface of the rotating plate and the abutment block abuts the side of the strip accommodating groove close to the first slide rail; in the second working position, the arc surface of the abutment block abuts the arc surface of the rotating plate and the abutment block abuts the side of the strip accommodating groove close to the second slide rail; when the mounting seat switches from the first working position to the second working position, the mounting seat rotates at least 5 degrees; the strip sliding block has a groove portion, and when the rotating plate abuts the furnace door, the groove portion can pass through the L-shaped adjustment unit.

[0033] Thus, in the second state, two working positions of the mounting seat can be achieved by the L-shaped adjustment unit.

[0034] Furthermore, the groove portion passes through the upper and lower surfaces of the strip-shaped slider.

[0035] Furthermore, the width of the rotating plate is equal to the width of the strip-shaped accommodating groove.

[0036] The width of the strip-shaped receiving groove matches the width of the rotating plate, so that the rotating plate can be better received in the strip-shaped receiving groove.

[0037] Furthermore, when the mounting seat is switched from the first working position to the second working position, the mounting seat rotates at least 10 degrees.

[0038] Furthermore, among the multiple circumferential temperature sensors, the number of temperature sensors in the outermost circle is 18.

[0039] Therefore, the two adjacent temperature sensors in the outermost circle are spaced 20 degrees apart. When switching between the first and second working positions, the mounting base is rotated 10 degrees, making the temperature measurement position more reasonable.

[0040] Beneficial effects:

[0041] 1. The annealing furnace of the present application is provided with a pyrometer, which can detect the temperature inside the furnace during the wafer annealing process. Each heating lamp can be adjusted individually, thereby achieving better control over the uniformity of the internal heating temperature.

[0042] 2. The temperature detection device provided in the present application uses a thermocouple to measure temperature, so that the temperature detection is more accurate. It can be used to calibrate and adjust the heating lamp, and can also be used to calibrate the pyrometer.

[0043] 3. The temperature detection device has two working states, and the two working states are easy to switch. The first state can be used as an auxiliary temperature control or stored, and the second state is to effectively monitor the temperature of the entire annealing process through multiple temperature sensors, so as to better adjust the power of the heating lamp when necessary. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 Schematic diagram of annealing furnace;

[0045] Figure 2 A schematic diagram of the temperature detection device in a first state;

[0046] Figure 3 exist Figure 2 Schematic diagram of moving toward the top stopper on the basis of;

[0047] Figure 4 exist Figure 3 Schematic diagram of the rotating seat flipped on the basis;

[0048] Figure 5 for Figure 4 A schematic diagram of mutually installing the first and second movable units based on the above;

[0049] Figure 6 It is a schematic diagram of the temperature detection device being in the second state and the mounting base being in the first working position;

[0050] Figure 7 It is a schematic diagram of the temperature detection device being in the second state and the mounting base being in the second working position;

[0051] Figure 8 This is a schematic diagram of closing the furnace door after the second state adjustment is completed;

[0052] Fig. 9 This is a schematic diagram of the mounting seat and the rotating seat being separated;

[0053] Description of reference numerals:

[0054] 1 furnace body; 1.1 quartz chamber; 1.2 wafer stage; 1.3 display screen; 1.4 physical buttons;

[0055] 2 furnace door; 2.1 handle unit; 2.2 observation window; 2.3 slide rail; 2.3.1 top stopper; 2.3.2 bottom stopper; 2.3.3 first slide rail; 2.3.4 second slide rail; 2.4 limit block;

[0056] 3.1 Strip slider; 3.1.1 convex plate; 3.1.2 first locking bolt; 3.2 rotating seat; 3.2.1 circular mounting groove; 3.2.2 first positioning hole; 3.2.3 circular flange; 3.2.4 strip receiving groove; 3.3 mounting seat; 3.3.1 temperature sensor; 3.3.2 step portion; 3.3.3 connecting rod; 3.3.4 abutment block;

[0057] 4 sliding plate; 4.1 limiting socket; 4.2 limiting sleeve; 4.3 sliding sleeve; 4.3.1 second locking bolt; 4.4 positioning block; 4.5 positioning sleeve;

[0058] 5.1 Rotating block; 5.2 Rotating plate. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] The present invention provides Figure 1-9 A precise temperature-controlled semiconductor wafer annealing furnace shown includes a furnace body 1 and a furnace door 2 hinged to the furnace body, wherein a quartz chamber 1.1, a heating unit, a wafer carrier 1.2 and a gas supply unit are installed in the furnace body 1, and a temperature detection device is installed at the furnace door 2.

[0061] The furnace door 2 is equipped with a handle unit 2.1, a door lock unit and an observation window 2.2; the furnace body 1 is provided with a display screen 1.3 and a physical button 1.4; the heating unit is a heating lamp panel; a plurality of pyrometers are also installed under the wafer carrier 1.2; the heating lamp panel has a plurality of heating lamps, and each heating lamp can independently control the power.

[0062] The temperature detection device includes a first movable unit, a second movable unit, two slide rails 2.3 installed at the furnace door 2, and two limit blocks 2.4 installed at the furnace door 2; the first movable unit includes a strip slider 3.1 and a rotating seat 3.2 hinged to the strip slider 3.1, the strip slider 3.1 has two first slide grooves that cooperate with the slide rails 2.3, both ends of the strip slider 3.1 are fixed with convex plates 3.1.1, the convex plates 3.1.1 have first locking bolts 3.1.2 that lock the relative position of the strip slider 3.1 and the furnace door 2, and the bottom of the strip slider 3.1 The end of the rotating seat 3.2 is fixed with a limiting plug plate, the rotating seat 3.2 has a circular mounting groove 3.2.1, a circular mounting seat 3.3 is installed in the circular mounting groove 3.2.1, and the mounting seat 3.3 has a plurality of temperature sensors 3.3.1, the end of the rotating seat 3.2 away from the strip slider 3.1 has a first positioning hole 3.2.2, and the surface of the rotating seat 3.2 away from the mounting seat 3.3 has a second positioning hole; the second movable unit includes a sliding plate 4, the sliding plate 4 has two limiting plug holes 4.1 that can be inserted into the limiting plug plate, and each limiting plug hole 4.1 has a The limit sleeve 4.2 inserted into the plate, the sliding plate 4 has a second slide groove matched with the slide rail 2.3, the second slide groove has a slide sleeve 4.3 fixedly connected to the sliding plate 4 and passed by the slide rail 2.3, the slide sleeve 4.3 has a second locking bolt 4.3.1 that locks the position of the slide sleeve 4.3 and the slide rail 2.3, and a positioning unit that can be inserted into the first positioning hole 3.2.2 is fixed on the sliding plate 4; the sliding plate 4 can abut the bottom end of the limit block 2.4; the temperature detection device can be in a first state and a second state, in the first state, the rotating seat 3.2 is flush with the furnace door 2 In the second state, the sliding plate 4 abuts against the bottom ends of the two limit blocks 2.4, and the two limit plug plates are respectively inserted into the two limit plug sleeves 4.2, the strip slider 3.1 abuts against the sliding plate 4, the rotating seat 3.2 is perpendicular to the furnace door 2, the positioning unit is inserted into the second positioning hole, and the first locking bolt 3.1.2 and the second locking bolt 4.3.1 are both locked.

[0063] The positioning unit comprises a positioning block 4.4 fixedly connected to the sliding plate 4 and a positioning sleeve 4.5 inserted into the positioning block 4.4, the positioning sleeve 4.5 can be inserted into the first positioning hole 3.2.2 and the second positioning hole of the rotating seat 3.2, and a spring is connected between the positioning sleeve 4.5 and the positioning block 4.4; the multiple temperature sensors 3.3.1 are divided into a central temperature sensor and multiple circumferential temperature sensors, the multiple circumferential temperature sensors are divided into multiple circles, and the multiple temperature sensors in the same circle are distributed in a ring with equal spacing; the temperature sensor 3.3.1 is a thermocouple temperature sensor degree sensor; the limit plug plate and the limit plug sleeve 4.2 are each provided with two; the top end of the slide rail 2.3 is provided with a top end block 2.3.1, and the bottom end of the slide rail 2.3 is provided with a bottom end block 2.3.2; in the first state, the two slide sleeves 4.3 respectively abut against the two bottom end blocks 2.3.2; the top end of the mounting seat 3.3 has a circular step portion 3.3.2, and the circular mounting groove 3.2.1 has a circular flange 3.2.3 with a notch, and the circular flange is located at the step portion 3.3.2 for limiting the mounting seat 3.3.

[0064] The furnace door 2 is hinged with an L-shaped adjustment unit, and the L-shaped adjustment unit includes a rotating block 5.1 and a rotating plate 5.2 connected to the rotating block 5.1, the end of the rotating plate 5.2 is in the shape of an arc surface, and the rotating seat 3.2 has a strip accommodating groove 3.2.4, and the strip accommodating groove 3.2.4 is connected to the notch of the annular flange 3.2.3, and the mounting seat 3.3 is connected with an abutment block 3.3.4 through a connecting rod 3.3.3, and the end of the abutment block 3.3.4 is in the shape of an arc surface; in the first state, the L-shaped adjustment unit is located between the rotating seat 3.2 and the furnace door 2, the rotating plate 5.2 abuts the furnace door 2, and the rotating block 5.1 abuts the surface of the rotating seat 3.2 away from the mounting seat 3.3; in the second state, the rotating plate 5.2 is accommodated in the strip accommodating groove 3.2.4, and the end of the rotating plate 5.2 abuts the end of the abutment block 3.3.4; the rotating plate 5. 2 is equal to the width of the strip accommodating groove 3.2.4, the two slide rails are respectively the first slide rail 2.3.3 and the second slide rail 2.3.4, in the second state, the mounting seat 3.3 has two working positions, namely the first working position and the second working position, in the first working position, the arc surface of the abutment block 3.3.4 abuts the arc surface of the rotating plate 5.2 and the abutment block 3.3.4 abuts the side of the strip accommodating groove 3.2.4 close to the first slide rail 2.3.3; in the second working position, the arc surface of the abutment block 3.3.4 abuts the arc surface of the rotating plate 5.2 and the abutment block 3.3.4 abuts the side of the strip accommodating groove 3.2.4 close to the second slide rail 2.3.4; when the mounting seat 3.3 switches from the first working position to the second working position, the mounting seat 3.3 rotates at least 5 degrees; the strip slider 3.1 has a groove portion, and when the rotating plate 5.2 abuts the furnace door 2, the groove portion can pass through the L-shaped adjustment unit.

[0065] Working principle: The annealing furnace of the present application has multiple pyrometers under the wafer carrier. The pyrometers can detect the temperature inside the furnace during the wafer annealing process. Each heating lamp can be adjusted individually, so that better control can be achieved on the uniformity of the internal heating temperature. A temperature detection device is installed at the furnace door, and the temperature is measured by thermocouples, so that the temperature detection is more accurate. It can be used to calibrate and adjust the heating lamps, and can also be used to calibrate the pyrometers.

[0066] The temperature detection device has two working states. Specifically, the sliding plate is moved so that the two sliding sleeves respectively abut against the two bottom end stop blocks and are fixed by the second locking bolt. The rotating seat is flipped so that the rotating seat is parallel to the furnace door. The L-shaped adjustment unit is located between the rotating seat and the furnace door. The rotating plate abuts against the furnace door, and the rotating block abuts against the surface of the rotating seat away from the mounting seat. The strip slider is moved so that the end of the rotating seat away from the strip slider abuts against the sliding plate. At the same time, the positioning sleeve of the positioning unit is inserted into the first positioning hole, and the strip slider is fixed by the first locking bolt, so that the temperature detection device is in the first state.

[0067] Move the sliding plate so that the sliding plate abuts the bottom ends of the two limit blocks and is fixed by the second locking bolt. Flip the rotating seat so that the rotating seat is perpendicular to the furnace door. Move the strip slider to abut the sliding plate. The positioning unit is inserted into the second positioning hole. At the same time, the two limit plug plates at the strip slider are respectively inserted into the two limit plug sleeves. The strip slider is fixed by the first locking bolt. Rotate the L-shaped adjustment unit so that the rotating plate is accommodated in the strip accommodating groove, and the end of the rotating plate abuts the end of the abutting block, so that the temperature detection device is in the second state.

[0068] When in the first state, the wafer can undergo normal annealing operations. At this time, the temperature sensor can be used to measure temperature. Since it is located on the side of the furnace door, it can be used as an auxiliary temperature control. It only needs to compare the temperature with the temperature when the annealing furnace is working normally to determine whether there is an abnormality. The temperature detection device can also be not used, but the temperature detection device can be stored on the side of the furnace door to avoid interfering with the wafer annealing.

[0069] When in the second state, there is no wafer in the furnace body, and the mounting seat is just located below the heating lamp plate and slightly above the wafer carrier, so that the position of the mounting seat is close to the position of the wafer (when the wafer is annealed). The temperature of the entire annealing process can be effectively monitored by multiple temperature sensors, thereby simulating the temperature monitoring during wafer annealing, and then better realizing the adjustment of the heating lamp power when necessary, and the mounting seat has two working positions. In the first working position, the arc surface of the abutment block abuts the arc surface of the rotating plate and the abutment block abuts the side of the strip receiving groove close to the first slide rail; in the second working position, the arc surface of the abutment block abuts the arc surface of the rotating plate and the abutment block abuts the side of the strip receiving groove close to the second slide rail; when the mounting seat switches from the first working position to the second working position, the mounting seat rotates at least 5 degrees, thereby performing two monitoring of the second working state, and the temperature condition of the entire circumferential direction of the wafer can be simulated and monitored.

[0070] Although the present invention has been illustrated and described with respect to the preferred embodiments, it will be appreciated by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A precise temperature-controlled semiconductor wafer annealing furnace, characterized in that: The invention comprises a furnace body and a furnace door hinged to the furnace body, wherein a quartz chamber, a heating unit, a wafer carrier and an air supply unit are installed in the furnace body, and a temperature detection device is installed at the furnace door; the heating unit is a heating lamp panel; a plurality of pyrometers are also installed under the wafer carrier; the heating lamp panel has a plurality of heating lamps, and each heating lamp can independently control the power; the temperature detection device comprises a first movable unit, a second movable unit, two slide rails installed at the furnace door and two limit blocks installed at the furnace door; the first movable unit comprises a strip slide and a plurality of stop blocks connected to the strip slide The invention relates to a rotating seat hinged with a block, the strip slider has two first slide grooves matched with the slide rail, both ends of the strip slider are fixed with convex plates, the convex plates have first locking bolts for locking the relative positions of the strip slider and the furnace door, the bottom end of the strip slider is fixed with a limited insertion plate, the rotating seat has a circular mounting groove, a circular mounting seat is installed in the circular mounting groove, the mounting seat has a plurality of temperature sensors, the end of the rotating seat away from the strip slider has a first positioning hole, and the surface of the rotating seat away from the mounting seat has a second positioning hole; The second movable unit includes a sliding plate, the sliding plate has two limiting plug holes that can be inserted into the limiting plug plate, each limiting plug hole has a limiting plug sleeve that can be inserted into the limiting plug plate, the sliding plate has a second sliding groove that cooperates with the sliding rail, the second sliding groove has a sliding sleeve that is fixedly connected to the sliding plate and passed through by the sliding rail, the sliding sleeve has a second locking bolt that locks the position of the sliding sleeve and the sliding rail, and a positioning unit that can be inserted into the first positioning hole is fixed to the sliding plate; the sliding plate can abut the bottom end of the limiting block; the temperature detection device can The invention can be in a first state and a second state. In the first state, the rotating seat is parallel to the furnace door, the positioning unit is inserted into the first positioning hole, the end of the rotating seat away from the strip slider abuts against the sliding plate, and the first locking bolt and the second locking bolt are both locked; in the second state, the sliding plate abuts against the bottom ends of the two limit blocks, the two limit plug plates are respectively inserted into the two limit plug sleeves, the strip slider abuts against the sliding plate, the rotating seat is perpendicular to the furnace door, the positioning unit is inserted into the second positioning hole, and the first locking bolt and the second locking bolt are both locked.

2. The precise temperature-controlled semiconductor wafer annealing furnace according to claim 1, characterized in that: The furnace door is provided with a handle unit, a door lock unit and an observation window; the furnace body is provided with a display screen and physical buttons.

3. The precise temperature-controlled semiconductor wafer annealing furnace according to claim 1, characterized in that: The positioning unit includes a positioning block fixedly connected to the sliding plate and a positioning sleeve inserted by the positioning block, the positioning sleeve can be inserted into the first positioning hole and the second positioning hole of the rotating seat, and a spring is connected between the positioning sleeve and the positioning block.

4. The precise temperature-controlled semiconductor wafer annealing furnace according to claim 1, characterized in that: The multiple temperature sensors are divided into a central temperature sensor and multiple circumferential temperature sensors. The multiple circumferential temperature sensors are divided into multiple circles. The multiple temperature sensors in the same circle are distributed in a circular shape with equal spacing. The temperature sensors are thermocouple temperature sensors.

5. The precise temperature-controlled semiconductor wafer annealing furnace according to claim 1, characterized in that: There are two limit plug plates and two limit plug sleeves; a top stopper is installed at the top of the slide rail, and a bottom stopper is installed at the bottom of the slide rail; in the first state, the two slide sleeves respectively abut against the two bottom stoppers.

6. The precise temperature-controlled semiconductor wafer annealing furnace according to claim 1, characterized in that: The top of the mounting seat is provided with a circular step portion, and the circular mounting groove is provided with a circular flange with a notch, and the circular flange is located at the step portion and is used to limit the mounting seat.

7. The precise temperature-controlled semiconductor wafer annealing furnace according to claim 6, characterized in that: The furnace door is hinged with an L-shaped adjustment unit, and the L-shaped adjustment unit includes a rotating block and a rotating plate connected to the rotating block, the end of the rotating plate is in the shape of an arc surface, and the rotating seat is provided with a strip-shaped receiving groove, the strip-shaped receiving groove is communicated with the notch of the annular flange, and the mounting seat is connected with an abutment block through a connecting rod, and the end of the abutment block is in the shape of an arc surface; in the first state, the L-shaped adjustment unit is located between the rotating seat and the furnace door, the rotating plate abuts the furnace door, and the rotating block abuts the surface of the rotating seat away from the mounting seat; in the second state, the rotating plate is accommodated in the strip-shaped receiving groove, and the end of the rotating plate abuts the end of the abutment block; the width of the rotating plate The strip receiving groove has a width equal to that of the strip receiving groove, and the two slide rails are respectively the first slide rail and the second slide rail. In the second state, the mounting seat has two working positions, namely the first working position and the second working position. In the first working position, the arc surface of the abutment block abuts the arc surface of the rotating plate and the abutment block abuts the side of the strip receiving groove close to the first slide rail; in the second working position, the arc surface of the abutment block abuts the arc surface of the rotating plate and the abutment block abuts the side of the strip receiving groove close to the second slide rail; when the mounting seat switches from the first working position to the second working position, the mounting seat rotates at least 5 degrees; the strip sliding block has a groove portion, and when the rotating plate abuts the furnace door, the groove portion can pass through the L-shaped adjustment unit.

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