A comprehensive platform and method for reproducing mechanical stress failure of capacitor

Abstract

This invention provides a capacitor mechanical stress fault reproduction platform, including a PCB board. The PCB board has a plurality of circumferential capacitor mounting positions with progressively increasing diameters along its center. Each circumferential capacitor mounting position is used to mount capacitors of different sizes and materials for mechanical stress fault testing. This invention also provides a reproduction method for the capacitor mechanical stress fault reproduction platform described above. By using a plurality of circumferential capacitor mounting positions with progressively increasing diameters along the center of the PCB board and correspondingly mounting capacitors of different sizes and materials for mechanical stress fault testing, this invention allows for the simultaneous observation of mechanical stress fault reproduction for multiple types and package sizes of capacitors, thus solving the problems of limited fault reproduction methods and single testing methods in existing approaches.

Description

Technical Field

[0001] This invention relates to the field of capacitor failure analysis technology, and in particular to a comprehensive platform and method for reproducing capacitor mechanical stress faults. Background Technology

[0002] Failure analysis is a method that, based on failure modes and phenomena, analyzes and verifies them, simulates and reproduces the failure phenomena, identifies the causes of failure, and uncovers the failure mechanism. Microscopic analysis of failed components involves observing their microscopic morphology using metallographic and electron microscopes to analyze the failure type and cause. Mechanical property testing of the failed component materials uses tensile testing machines, bending testing machines, impact testing machines, and hardness testing machines to determine the tensile strength, bending strength, impact toughness, hardness, and other mechanical properties of the materials. The principle of failure reproduction is that for deterministic events, under the same environmental and stress conditions, the failure history may be repeated, and the failure result may be reproduced. The purpose of failure reproduction is to compare the results of failure reproduction tests with the results of field failures, thus verifying the analysis results of field failures.

[0003] Mechanical stress impact failure is currently the most common failure mode for multilayer ceramic chip capacitors. However, there is still room for improvement in the methods for reproducing mechanical stress failures. Summary of the Invention

[0004] To address the aforementioned issues, this invention aims to propose a comprehensive capacitor mechanical stress fault reproduction platform and method. This platform utilizes several circumferential capacitor mounting positions arranged along the center of a PCB board with progressively increasing diameters, along with corresponding capacitors of different sizes and materials, to perform mechanical stress fault testing. This allows for simultaneous observation of mechanical stress fault reproduction for capacitors of various types and package sizes, thus overcoming the limitations of existing methods that rely on singular fault reproduction techniques and testing methods.

[0005] To achieve the above objectives, the technical solution of the present invention is implemented as follows:

[0006] A capacitor mechanical stress failure reproduction platform includes a PCB board. The PCB board has several circumferential capacitor mounting positions with an arithmetically increasing diameter along its center. Each circumferential capacitor mounting position is used to install capacitors of different sizes and materials for mechanical stress failure testing.

[0007] Furthermore, the capacitors include ceramic chip capacitors with package sizes of C0402, C0603, C0805, C1206, C1210, and C2225, and tantalum capacitors with package sizes of A3216, B3528, C1812, C6032, and D7343.

[0008] Furthermore, the circumferential capacitor mounting positions are in five groups, and each group of circumferential capacitor mounting positions has 11 capacitor welding pads spaced apart in the circumferential direction. The capacitors to be welded on the 11 capacitor welding pads are arranged in order of package size from large to small and then back to large, with equal spacing.

[0009] Furthermore, the capacitors on the outermost circular capacitor mounting positions, from the center of the PCB board to the outermost edge, are arranged according to their package size, from largest to smallest and then back to largest.

[0010] Furthermore, the design dimensions of the PCB board are: 200mm*200mm*0.6mm.

[0011] Furthermore, the method for reproducing the impact of the composite table is as follows: when the four corners of the PCB board are supported, the middle of the PCB board is deformed by pressure, and the capacitor in the center of the PCB board is deformed the most. This can be used to simulate the deformation of the chip capacitor by the board, and the physical deformation damage caused by the capacitor body.

[0012] Furthermore, the method for reproducing bending of the integrated table is as follows: bending tests are performed at different positions of the PCB board, and the PCB board is subjected to different ranges of pressure to produce deformation, so that the capacitors at different positions are subjected to different degrees of deformation.

[0013] To achieve the above objectives, the present invention also provides a method for reproducing the capacitor mechanical stress fault reproduction platform as described above, comprising the following steps:

[0014] S1: Observe the appearance of the capacitor to be analyzed and check for mechanical stress damage cracks;

[0015] S2: When the failure is caused by mechanical stress, a good capacitor of the same specification as the failed capacitor is soldered onto the PCB board. Based on the mechanical stress of the capacitor in the fault reproduction, the capacitor is subjected to tensile, bending, and impact conditions determined by the failure analysis to reproduce the capacitor failure situation and further corroborate the failure analysis cause.

[0016] S3: Fold the PCB board once and observe the fault reproduction process under a microscope to corroborate the failure analysis and cause of the fault.

[0017] S4: Next, bend the PCB board so that one end of the capacitor to be analyzed falls off, simulating the failure situation of the capacitor falling off when subjected to external mechanical stress.

[0018] S5: Simulate multiple bends of the PCB board to reproduce capacitor failure;

[0019] S6: The PCB board is subjected to repeated pressing tests using machinery. The capacitor is subjected to mechanical stress multiple times, resulting in multiple cracks, thus reproducing the condition of the capacitor when it is subjected to external impact.

[0020] S7: Reproduce the situation where the board breaks down and burns after bending.

[0021] Beneficial Effects: This invention utilizes a series of circumferentially increasing capacitor mounting positions along the center of a PCB board, along with capacitors of varying sizes and materials, to perform mechanical stress fault testing. This allows for the simultaneous observation of mechanical stress fault reproduction in multiple types and package sizes of capacitors, overcoming the limitations of existing methods that rely on singular fault reproduction techniques and testing methods. The PCB board of this invention possesses a certain degree of toughness, meeting the requirements for impact and bending tests. By impacting or bending the center or other locations of the board, mechanical stress faults in different types and package sizes of capacitors can be simultaneously reproduced, aiding in further analysis of the causes of mechanical stress faults. Its structure is simple and easy to implement. Attached Figure Description

[0022] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0023] Figure 1 This is a schematic diagram of the structure of the capacitor mechanical stress fault reproduction platform according to an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the appearance of mechanical stress damage cracks in the reproduction method of the capacitor mechanical stress fault reproduction platform described in this embodiment of the invention.

[0025] Figure 3 This is a diagram of a single-plate failure in the reproduction method of the capacitor mechanical stress failure reproduction platform described in this embodiment of the invention (approximately magnified 100 times).

[0026] Figure 4 This is a magnified image (approximately 50x) of the end of the plate being disassembled after bending in the reproduction method of the capacitor mechanical stress fault reproduction platform described in this embodiment of the invention.

[0027] Figure 5 This is a diagram of multiple plate damage (approximately magnified 50 times) in the reproduction method of the capacitor mechanical stress fault reproduction platform described in this embodiment of the invention.

[0028] Figure 6 The images show multiple plate bending cracks (approximately magnified 100 times) in the reproduction method of the capacitor mechanical stress fault reproduction platform described in this embodiment of the invention.

[0029] Figure 7This is a diagram (approximately magnified 100 times) of the plate bending breakdown and burning in the reproduction method of the capacitor mechanical stress fault reproduction platform described in this embodiment of the invention. Detailed Implementation

[0030] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0031] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] In practical use, if the bending direction of the PCB board is perpendicular to the length of the capacitor, cracks may appear at the point where the ceramic capacitor is soldered to the PCB. Alternatively, external stress impacts perpendicular to the length of the capacitor can cause these cracks to propagate inwards at a 45-degree angle. Because capacitor mechanical stress failure analysis suffers from limitations such as reliance on single tests and complex operations, this paper proposes a capacitor mechanical stress failure reproduction platform and method. This platform uses a physical circuit board to reproduce the failure, soldering a good capacitor of the same specifications as the failed capacitor. Based on the mechanical stress of the reproduced capacitor, conditions such as tension, bending, and impact, determined by the failure analysis, are applied to reproduce the capacitor failure, further supporting the analysis of the cause of the failure.

[0033] Example 1

[0034] See Figure 1 This embodiment of a capacitor mechanical stress fault reproduction platform includes a PCB board 1. The PCB board 1 has several circumferential capacitor mounting positions 2 with increasing diameters along the center. Each circumferential capacitor mounting position 2 is used to install capacitors 3 of different sizes and materials for mechanical stress fault testing.

[0035] This embodiment uses several circumferential capacitor mounting positions on a PCB board with diameters increasing at equal intervals along the center, and correspondingly installs capacitors of different sizes and materials to perform mechanical stress fault testing. It can simultaneously observe the mechanical stress fault reproduction of capacitors of various types and package sizes, thus solving the problem of single fault reproduction means and single testing in existing methods.

[0036] The PCB board in this embodiment has a certain degree of toughness and can meet the tests of impact and bending. By impacting and bending the center or other positions of the board, the mechanical stress failure of different types and package sizes of capacitors can be reproduced at the same time, which helps to further analyze the causes of mechanical stress failure. Its structure is simple and easy to implement.

[0037] In a specific example, the capacitor 3 includes ceramic chip capacitors with package sizes of C0402, C0603, C0805, C1206, C1210, and C2225, and tantalum capacitors with package sizes of A3216, B3528, C1812, C6032, and D7343.

[0038] In a specific example, the circumferential capacitor mounting positions 2 are in five groups. Each group of circumferential capacitor mounting positions 2 has 11 capacitor welding pads spaced apart in the circumferential direction. The capacitors 3 corresponding to the capacitor welding pads are arranged in order of package size from large to small and then back to large, with equal spacing.

[0039] In this specific implementation, the circumferential diameter of the central circular capacitor mounting position is 30 mm, and the circumferential diameter of the other circular capacitor mounting positions increases at intervals of 30 mm.

[0040] In a specific example, capacitors 3 are arranged from the center of PCB board 1 to the outermost circumferential capacitor mounting position 2 according to the rule of large to small and then large again according to package size.

[0041] In this embodiment, the capacitors on the circumferential capacitor mounting positions from the center to the outermost edge of the PCB board are arranged according to the rule of decreasing size. This facilitates thorough comparison during fault reproduction testing, improving the accuracy and diversity of fault reproduction.

[0042] In a specific example, the design dimensions of the PCB board 1 are: 200mm*200mm*0.6mm.

[0043] The PCB board in this embodiment is relatively thin, which makes it more resistant to deformation under external force, thus facilitating fault reproduction testing of the capacitor.

[0044] In a specific example, the method of reproducing the impact of the reproduction table is as follows: when the four corners of the PCB board 1 are supported, the middle of the PCB board 1 is deformed by pressure, and the capacitor 3 in the center of the PCB board 1 is deformed the most. This can be used to simulate the deformation of the chip capacitor by the board, and the physical deformation damage caused by the capacitor body.

[0045] The impact reproduction method in this embodiment can uniformly subject the capacitors on the circumference to mechanical stress, effectively control the stress on different capacitors, and thus achieve effective fault reproduction.

[0046] In a specific example, the method for reproducing bending of the integrated table is as follows: bending tests are performed at different positions of the PCB board 1, and the PCB board 1 is subjected to different ranges of pressure to produce deformation, so that the capacitors 3 at different positions are deformed to different degrees.

[0047] This embodiment can simulate the deformation of ceramic capacitors by the circuit board to achieve the purpose of failure analysis.

[0048] Example 2

[0049] To achieve the above objectives, this embodiment also provides a reproduction method for the capacitor mechanical stress fault reproduction platform as described above, including the following steps:

[0050] S1: As Figure 2 As shown, observe the appearance of the capacitor to be analyzed to check for mechanical stress damage cracks.

[0051] S2: When the failure is caused by mechanical stress, a good capacitor of the same specification as the failed capacitor is soldered on PCB board 1. Based on the mechanical stress of the capacitor in the fault reproduction, the capacitor is subjected to tensile, bending, and impact conditions determined by the failure analysis to reproduce the capacitor failure situation and further corroborate the failure analysis cause.

[0052] S3: As Figure 3 As shown, PCB board 1 was bent once, and the fault reproduction process was observed under a microscope to corroborate the failure analysis and cause of the fault.

[0053] S4: As Figure 4 As shown, the PCB board is then bent to detach one end of the capacitor to be analyzed, simulating the failure of the capacitor detaching when subjected to external mechanical stress.

[0054] S5: As Figure 5 As shown, the capacitor failure was reproduced by simulating multiple bends of PCB board 1.

[0055] S6: As Figure 6 As shown, the PCB board 1 was subjected to repeated pressing tests using a mechanical device. The capacitor was subjected to mechanical stress multiple times, resulting in multiple cracks, thus reproducing the condition of the capacitor when it was subjected to external impact.

[0056] S7: As Figure 7 As shown, this reproduces the situation where the board is bent and then burned out.

[0057] It should be noted that this embodiment was observed under microscope magnification of 50 to 100 times; this embodiment is not only applicable to the reproduction of capacitor mechanical stress faults at room temperature, but also applicable to the reproduction of faults under high temperature, low temperature, different humidity, and different vibration conditions. Therefore, it is not limited to the scope of this embodiment, and should include the possibility of reproducing capacitor failures under different environments and conditions.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A comprehensive platform for reproducing electrical and mechanical stress faults, characterized by, The PCB board (1) has several circumferential capacitor mounting positions (2) with increasing diameters along its center. Each circumferential capacitor mounting position (2) is used to mount capacitors (3) of different sizes and materials for mechanical stress failure testing. There are five groups of circumferential capacitor mounting positions (2). Each group of circumferential capacitor mounting positions (2) has 11 capacitor soldering pads spaced apart on its circumference. The capacitors (3) soldered on the 11 capacitor soldering pads are arranged with equal spacing according to the rule of package size from large to small and then back to large. The capacitors (3) from the center of the PCB board (1) to the outermost circumferential capacitor mounting position (2) are distributed according to the rule of package size from large to small and then back to large.

2. The capacitor mechanical stress fault reproduction platform according to claim 1, characterized in that, The capacitor (3) includes ceramic chip capacitors with package sizes of C0402, C0603, C0805, C1206, C1210, and C2225, and tantalum capacitors with package sizes of A3216, B3528, C1812, C6032, and D7343.

3. The capacitor mechanical stress fault reproduction platform according to claim 1, characterized in that, The design dimensions of the PCB board (1) are: 200mm*200mm*0.6mm.

4. The capacitor mechanical stress fault reproduction platform according to claim 1, characterized in that, The method of reproducing the impact of the reproduction platform is as follows: when the four corners of the PCB board (1) are supported, the middle of the PCB board (1) is deformed by pressure, and the capacitor (3) in the center of the PCB board (1) is deformed the most. This can be used to simulate the deformation of the chip capacitor by the board and the physical deformation damage caused by the capacitor body.

5. The capacitor mechanical stress fault reproduction platform according to claim 1, characterized in that, The method for reproducing bending of the integrated table is as follows: bending tests are performed on different positions of the PCB board (1), and the PCB board (1) is subjected to different ranges of pressure to produce deformation, so that the capacitors (3) at different positions are subjected to different degrees of deformation.

6. A method for reproducing capacitor mechanical stress faults using a comprehensive platform according to any one of claims 1-5, characterized in that, Includes the following steps: S1: Observe the appearance of the capacitor to be analyzed and check for mechanical stress damage cracks; S2: When failure is caused by mechanical stress, a good capacitor of the same specification as the failed capacitor is soldered onto the PCB board (1). Based on the mechanical stress of the capacitor reproduced by the failure, the capacitor is subjected to tensile, bending and impact conditions determined by the failure analysis to reproduce the capacitor failure situation and further corroborate the failure analysis cause. S3: Fold the PCB board (1) once and observe the fault reproduction process through a microscope to corroborate the failure analysis and cause of the fault; S4: Then fold the PCB board (1) so that one end of the capacitor to be analyzed falls off, simulating the failure of the capacitor falling off when subjected to external mechanical stress; S5: Simulate multiple bends of the PCB board (1) to reproduce the capacitor failure; S6: The PCB board (1) was repeatedly pressed by mechanical force. The capacitor was subjected to mechanical stress multiple times, resulting in multiple cracks. This reproduced the condition of the capacitor when it was subjected to external force. S7: Reproduce the situation where the board breaks down and burns after bending.

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