Display panels and splicing screens

Abstract

The present application discloses a display panel and a spliced ​​screen, wherein the display panel includes a circuit substrate, a base substrate, a display component, a cover chip film, a fan-out portion and connecting lines, wherein the circuit substrate includes a mounting area and a connecting area, the circuit substrate includes a routing through-hole located in the connecting area, the base substrate is located on one side of the circuit substrate, the base substrate is arranged in the mounting area, the display component is located on a side of the base substrate away from the circuit substrate, the display component includes a driving circuit layer and a plurality of light-emitting elements, the cover chip film is located on a side of the circuit substrate away from the base substrate, the fan-out portion is located between the circuit substrate and the cover chip film, the fan-out portion includes a plurality of fan-out routing lines, one end of the fan-out routing line is connected to the cover chip film, the first end of the connecting routing line is connected to the driving circuit layer, and the second end of the connecting routing line passes through the routing through-hole and is connected to the other end of the fan-out routing line, thereby eliminating the need to set signal routing lines on both the front and back sides of the base substrate, thereby reducing the difficulty of the display panel manufacturing process.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a spliced ​​screen. Background Art

[0002] Screen-to-body ratios in current electronic products are increasing, and full-screen displays have become a popular trend. However, existing display panels have circuit designs such as fan-out traces and bonding terminals in the bonding area. To reduce the bezel, a common solution in tiled display products is to fabricate the fan-out traces and bonding terminals on the backside of the display panel's substrate.

[0003] A common splicing technology is to use side lines to guide signals from the front of the substrate to the back of the substrate. The final display product needs to splice individual substrates into a large-size display product, which can achieve a display mode of unlimited size. In actual splicing displays, the above splicing method is found to have the following problems: signal routing needs to be set on the front and back of the substrate of each display panel. This process is cumbersome and relatively costly. Summary of the Invention

[0004] Embodiments of the present invention provide a display panel and a spliced ​​screen to alleviate the deficiencies in the related art.

[0005] To achieve the above functions, the technical solutions provided in the embodiments of the present application are as follows:

[0006] An embodiment of the present application provides a display panel, comprising:

[0007] A circuit substrate, comprising at least one mounting area and at least one connection area, wherein the mounting area and the connection area are spaced apart, and the circuit substrate comprises a wiring through hole located in the connection area;

[0008] At least one base substrate is located on one side of the circuit substrate, and one of the base substrates is disposed in one of the mounting areas;

[0009] At least one display component is located on a side of the base substrate away from the circuit substrate, the display component includes a driving circuit layer and a plurality of light-emitting elements, and the plurality of light-emitting elements are connected to the driving circuit layer;

[0010] At least one chip-on-film is located on a side of the circuit substrate away from the base substrate;

[0011] At least one fan-out portion is located between the circuit substrate and the chip-on-film, the fan-out portion includes a plurality of fan-out traces, and one end of the fan-out trace is connected to the chip-on-film;

[0012] At least one group of connecting wires, wherein a first end of the connecting wire is connected to the driving circuit layer, and a second end of the connecting wire passes through the wiring through hole and is connected to the other end of the fan-out wire.

[0013] In the display panel provided in the embodiment of the present application, the circuit substrate includes a groove located in the mounting area, and the base substrate is disposed in the groove.

[0014] In the display panel provided in the embodiment of the present application, the driving circuit layer includes a first connecting terminal arranged near the connecting area;

[0015] The circuit substrate further includes a second connection terminal located in the connection area, one end of the second connection terminal is connected to the first connection terminal, and the other end of the second connection terminal is connected to the first end of the connection trace.

[0016] In the display panel provided in the embodiment of the present application, the second connection terminal is located on a side of the circuit substrate close to the driving circuit, and a side of the second connection terminal away from the routing through hole is flush with a side of the first connection terminal away from the base substrate.

[0017] In the display panel provided in the embodiment of the present application, the orthographic projection of the second connection terminal on the circuit substrate covers the routing through hole.

[0018] In the display panel provided in the embodiment of the present application, the display panel further includes a connecting portion, which is located on a side of the circuit substrate close to the driving circuit layer, one end of the connecting portion is connected to the first connecting terminal, and the other end of the connecting portion is connected to the second connecting terminal.

[0019] In the display panel provided in the embodiment of the present application, the circuit substrate is a printed circuit board or a flexible circuit board.

[0020] In the display panel provided in the embodiment of the present application, the circuit substrate includes a plurality of the mounting areas and a plurality of the connection areas, and a connection area is located between two adjacent mounting areas;

[0021] The display panel includes multiple base substrates, multiple display components, multiple cover chips, multiple fan-out parts, and multiple groups of connecting wires, wherein one base substrate is set corresponding to one mounting area, one display component is set corresponding to one base substrate, one cover chip is set corresponding to one base substrate, one fan-out part is set corresponding to one cover chip, and one connecting wire is set corresponding to one display component.

[0022] In the display panel provided in the embodiment of the present application, the display panel further includes an encapsulation layer, the encapsulation layer is located on the display component, and the encapsulation layer includes a black glue layer and a protective layer;

[0023] The black glue layer covers the light emitting element, at least one light emitting surface of the light emitting element is exposed on the black glue layer, and the protective layer covers the black glue layer and the light emitting element.

[0024] An embodiment of the present application provides a spliced ​​screen, comprising at least two display panels as described above.

[0025] Beneficial effects of the embodiments of the present application: The embodiments of the present application provide a display panel and a spliced ​​screen, wherein the display panel includes a circuit substrate, at least one substrate, at least one display component, at least one flip chip film, at least one fan-out portion, and at least one group of connecting traces, the circuit substrate includes at least one mounting area and at least one connecting area, the mounting area and the connecting area are spaced apart, the circuit substrate includes a trace through hole located in the connecting area, the substrate substrate is located on one side of the circuit substrate, the substrate substrate is arranged in the mounting area, and the display component is located on the substrate substrate away from the circuit substrate. On one side of the board, the display component includes a driving circuit layer and a plurality of light-emitting elements, the cover chip film is located on the side of the circuit substrate away from the base substrate, the fan-out part is located between the circuit substrate and the cover chip film, the fan-out part includes a plurality of fan-out traces, one end of the fan-out trace is connected to the cover chip film, the driving circuit layer is connected by setting the first end of the connecting trace, and the second end of the connecting trace is connected to the other end of the fan-out trace through the trace through-hole, so that there is no need to set signal traces on both the front and back sides of the base substrate, thereby reducing the difficulty of the display panel manufacturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 A first cross-sectional schematic diagram of a display panel provided in an embodiment of the present application;

[0028] Figure 2 A second cross-sectional schematic diagram of a display panel provided in an embodiment of the present application;

[0029] Figure 3 A first cross-sectional schematic diagram of a circuit substrate provided in an embodiment of the present application;

[0030] Figure 4 A third cross-sectional schematic diagram of a display panel provided in an embodiment of the present application;

[0031] Figure 5 This is a second cross-sectional schematic diagram of the circuit substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0033] The embodiments of the present application provide a display panel and a spliced ​​screen. These are described in detail below. It should be noted that the order in which the following embodiments are described does not limit the preferred order of the embodiments.

[0034] The technical solution of this application is now described in conjunction with specific embodiments.

[0035] Example 1

[0036] See also Figure 1 , a first cross-sectional schematic diagram of a display panel provided in an embodiment of the present application.

[0037] This embodiment provides a display panel 1 , which includes a circuit substrate 10 , at least one base substrate 20 , at least one display component 30 , at least one chip-on-film 50 , at least one fan-out portion 40 , and at least one set of connecting traces 60 .

[0038] The circuit substrate 10 includes at least one mounting area 100 and at least one connection area 200, wherein the mounting area 100 and the connection area 200 are spaced apart from each other, and the circuit substrate 10 includes a wiring through hole 11 located in the connection area 200; the base substrate 20 is located on one side of the circuit substrate 10, and the base substrate 20 is arranged in the mounting area 100; the display component 30 is located on a side of the base substrate 20 away from the circuit substrate 10, and the display component 30 includes a driving circuit layer 31 and a plurality of light-emitting elements 32, wherein the plurality of light-emitting elements 32 are arranged on the side of the base substrate 20 away from the circuit substrate 10. The optical element 32 is connected to the driving circuit layer 31; the chip-on-chip film 50 is located on the side of the circuit substrate 10 away from the base substrate 20; the fan-out portion 40 is located between the circuit substrate 10 and the chip-on-chip film 50, and the fan-out portion 40 includes a plurality of fan-out traces (not marked in the figure), one end of the fan-out trace is connected to the chip-on-chip film 50; wherein, the first end 61 of the connecting trace 60 is connected to the driving circuit layer 31, and the second end 62 of the connecting trace 60 passes through the trace through hole 11 and is connected to the other end of the fan-out trace.

[0039] It should be noted that this embodiment does not impose specific restrictions on the number of the installation areas 100, the number of the connection areas 200, the number of the base substrates 20, the number of the display components 30, the number of the cover chip films 50, the number of the fan-out parts 40 and the number of groups of the connecting traces 60. This embodiment takes the circuit substrate 10 including one installation area 100, one connection area 200, one base substrate 20, one display component 30, one cover chip film, one fan-out part 40 and a group of connecting traces 60 as an example to illustrate the technical solution of the present application.

[0040] Preferably, in this embodiment, the base substrate 20 may include a flexible substrate or a rigid substrate; specifically, when the base substrate 20 includes a flexible substrate, the material of the flexible substrate may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, silicone resin, polyimide resin, and polyamide resin; when the base substrate 20 includes a rigid substrate, the material of the rigid substrate may include one of metal or glass; wherein the material of the substrate can be selected according to actual conditions, and this embodiment does not impose any specific restrictions on this.

[0041] The plurality of light-emitting elements 32 are located on a side of the driving circuit layer 31 away from the base substrate 20. The light-emitting elements 32 may be mini light-emitting diodes (MiniLight Emitting Diode, Mini-LED) or micro light-emitting diodes (MicroLight Emitting Diode, Micro-LED). An array of the plurality of light-emitting elements 32 is arranged on the base substrate 20, and the size of the light-emitting elements 32 and the row and column spacing thereof can be set according to actual needs.

[0042] It can be understood that this embodiment connects the chip-on-chip film to the driving circuit layer by setting the first end of the connecting trace to connect to the driving circuit layer, and the second end of the connecting trace passes through the trace through hole to connect to the other end of the fan-out trace, thereby connecting the chip-on-chip film to the driving circuit layer. This embodiment sets the fan-out part and the chip-on-chip film on the side of the circuit substrate away from the substrate, so that there is no need to set signal traces on both the front and back sides of the base substrate 20, thereby reducing the difficulty of the display panel manufacturing process and reducing the manufacturing cost of the display panel.

[0043] Furthermore, the circuit substrate 10 includes but is not limited to one of printed circuit boards (PCB) or flexible printed circuit boards (FPC), and the thickness of the circuit substrate 10 is greater than or equal to 0.7 mm and less than or equal to 1.2 mm; wherein the thickness of the circuit substrate 10 is preferably one of 0.7 mm, 1 mm and 1.2 mm.

[0044] It can be understood that, compared with the prior art design of punching holes on a glass substrate, this embodiment provides the circuit substrate 10 including but not limited to a printed circuit board or a flexible circuit board, and the circuit substrate 10 includes a wiring through hole 11 located in the connection area 200. Since the circuit substrate 10 can be made of a material that is more convenient to punch than a glass substrate, the yield of the wiring through hole 11 is also improved, thereby improving the yield of the display panel 1; at the same time, by setting the thickness of the circuit substrate 10 to be greater than or equal to 0.7 mm and less than or equal to 1.2 mm, the thickness of the display panel 1 is avoided from being too large.

[0045] Furthermore, in this embodiment, the driving circuit layer 31 includes a first connecting terminal 311 arranged near the connection area 200; the circuit substrate 10 also includes a second connecting terminal 12 located in the connection area 200; wherein, one end of the second connecting terminal 12 is connected to the first connecting terminal 311, and the other end of the second connecting terminal 12 is connected to the first end 61 of the connecting line 60; specifically, the display panel 1 also includes a connecting portion 70, the connecting portion 70 is located on a side of the circuit substrate 10 close to the driving circuit layer 31, one end of the connecting portion 70 is connected to the first connecting terminal 311, and the other end of the connecting portion 70 is connected to the second connecting terminal 12; the connecting portion 70 includes but is not limited to one of silver glue or metal wiring.

[0046] Specifically, the orthographic projection of the second connecting terminal 12 on the circuit substrate 10 overlaps with at least a portion of the wiring through hole 11, or the orthographic projection of the second connecting terminal 12 on the circuit substrate 10 does not overlap with the wiring through hole 11; preferably, the orthographic projection of the second connecting terminal 12 on the circuit substrate 10 overlaps with the wiring through hole 11, thereby reducing the thickness of the connection area 200 of the circuit substrate 10, and further reducing the width of the splicing gap when the display panel 1 is used for a splicing screen.

[0047] In this embodiment, the wiring through hole 11 passes through the circuit substrate 10, the flip chip film 50 is located on the side of the circuit substrate 10 away from the base substrate 20, the fan-out portion 40 is located between the circuit substrate 10 and the flip chip film 50, and the fan-out portion 40 includes a plurality of fan-out wirings, one end of each fan-out wiring is connected to the flip chip film 50, and each connecting wiring 60 corresponds to each fan-out wiring. The second connecting terminal 12 is connected to the first connecting terminal 311 through the connecting portion 70 to transmit the driving signal to the first connecting terminal 311. It enters the driving circuit layer 31, and is then electrically connected to the fan-out wiring through the connecting wiring 60, and the fan-out wiring is connected to the chip-on-chip film 50, so that the chip-on-chip film 50 is electrically connected to the second connecting terminal 12 and the first connecting terminal 311, thereby driving the display panel 1 to work normally and avoiding the voltage drop caused by the circuit being too long; at the same time, when the display panel 1 is used for a splicing screen, it also reduces the phenomenon of excessive splicing seams caused by the presence of the chip-on-chip film 50 during splicing, thereby improving the display effect of the spliced ​​display screen and saving costs.

[0048] Example 2

[0049] Please combine Figure 2 and Figure 3 ;in, Figure 2 A second cross-sectional schematic diagram of a display panel provided in an embodiment of the present application; Figure 3This is a first cross-sectional schematic diagram of the circuit substrate provided in an embodiment of the present application.

[0050] In this embodiment, the structure of the display panel 1 is similar to / the same as the first structure of the display panel provided in the first embodiment. For details, please refer to the description of the display panel in the above embodiment, which will not be repeated here. The only difference between the two is:

[0051] In this embodiment, the circuit substrate 10 includes a groove 13 located in the mounting area 100, and the base substrate 20 is arranged in the groove 13; specifically, the display panel 1 also includes an adhesive layer 80 located between the base and the circuit substrate 10, and the adhesive layer 80 is located in the groove 13, and the base substrate 20 is bonded to the groove 13 through the adhesive layer 80; specifically, the orthographic projection of the adhesive layer 80 on the circuit substrate 10 covers the groove 13, and the orthographic projection of the substrate 10 on the circuit substrate 10 covers the adhesive layer 80.

[0052] It can be understood that, in this embodiment, the circuit substrate 10 is provided with a groove 13 located in the mounting area 100, and the base substrate 20 is provided in the groove 13, so that the base substrate 20 and the circuit substrate 10 will not be relatively displaced or generate friction after being connected, thereby avoiding damage to the base substrate 20; and, the base substrate 20 is bonded to the groove 13 through the adhesive layer 80, which can make the device structure more compact.

[0053] Furthermore, in this embodiment, the second connecting terminal 12 is located on a side of the circuit substrate 10 close to the driving circuit layer 31, and the side of the second connecting terminal 12 away from the wiring through hole 11 is flush with the side of the first connecting terminal 311 away from the base substrate 20; specifically, the second connecting terminal 12 and the first connecting terminal 311 are on the same layer and are arranged at intervals, and the connecting portion 70 is located on a side of the circuit insulation portion away from the chip-on-film 50, thereby maintaining the flat state of the display panel 1 and maintaining the display effect of the display panel 1, and because the side of the second connecting terminal 12 away from the wiring through hole 11 is flush with the side of the first connecting terminal 311 away from the base substrate 20, the connecting portion 70 is a planar portion. When the connecting portion 70 is silver glue, the phenomenon of disconnection and deformation of the connecting portion 70 is effectively reduced, thereby improving the reliability of the connecting portion 70.

[0054] It should be noted that, in this embodiment, the display panel 1 further includes a driver circuit board 10A. The driver circuit board 10A is located on a side of the circuit substrate 10 away from the base substrate 20 , and is connected to the COF 50 .

[0055] Example 3

[0056] Please combine Figure 4 and Figure 5 ;in, Figure 4 A third cross-sectional schematic diagram of a display panel provided in an embodiment of the present application; Figure 5 This is a second cross-sectional schematic diagram of the circuit substrate provided in an embodiment of the present application.

[0057] In this embodiment, the structure of the display panel is similar to / the same as the second structure of the display panel provided in the second embodiment. For details, please refer to the description of the display panel in the above embodiment, which will not be repeated here. The only difference between the two is:

[0058] In this embodiment, the circuit substrate 10 includes a plurality of the mounting areas 100 and a plurality of the connection areas 200, and a connection area 200 is located between two adjacent mounting areas 100; the display panel 1 includes a plurality of the base substrates 20, a plurality of the display components 30, a plurality of the chip-on-chip films 50, a plurality of the fan-out parts 40, and a plurality of groups of the connecting traces 60, wherein a base substrate 20 is arranged corresponding to a mounting area 200, a display component 30 is arranged corresponding to a base substrate 20, a chip-on-chip film 50 is arranged corresponding to a base substrate 20, a fan-out part 40 is arranged corresponding to a chip-on-chip film 50, and a connecting trace 60 is arranged corresponding to a display component 30.

[0059] The circuit substrate 10 includes a plurality of grooves 13 , each groove 13 being provided corresponding to one mounting area 100 . In the mounting area 100 corresponding to one groove 13 , the groove 13 is located within the mounting area 100 , and each base substrate 20 is located within one groove 13 .

[0060] It should be noted that, in this embodiment, the technical solution of the present application is illustrated by taking the circuit substrate 10 including two installation areas 100, one connection area 200, two base substrates 20, two display components 30, two flip-chip films, two fan-out parts 40, two groups of connecting traces 60 and two grooves 13 as an example.

[0061] It can be understood that, in this embodiment, by arranging the base substrate 20 to be located in the groove 13, the connection between the base substrate 20 and the circuit substrate 10 can be made tighter. At the same time, relative displacement between two adjacent base substrates 20 can be avoided, thereby avoiding damage to the base substrate 20 and making the device structure more compact.

[0062] In this embodiment, the wiring through hole 11 passes through the circuit substrate 10, the cover chip film 50 is located on the side of the circuit substrate 10 away from the base substrate 20, and the fan-out portion 40 is located between the circuit substrate 10 and the cover chip film 50. The fan-out portion 40 includes a plurality of fan-out wirings, one end of each fan-out wiring is connected to the cover chip film 50, and one connecting wiring 60 corresponds to one fan-out wiring. The second connecting terminal 12 is connected to the first connecting terminal 311 through the connecting portion 70, and the driving signal is input into the driving circuit layer 31, and then electrically connected to the fan-out wiring through the connecting wiring 60. The fan-out wiring is connected to the cover chip film 50, so that the cover chip film 50 is electrically connected to the second connecting terminal 12 and the first connecting terminal 311, thereby driving the display panel 1 to work normally.

[0063] At the same time, in this embodiment, the circuit substrate 10 includes a plurality of electrical connection areas 1000, and the plurality of electrical connection areas 1000 are arranged along the first direction X. One electrical connection area 1000 includes an installation area 100 and a connection area 200 arranged along the first direction X, so that a plurality of base substrates 20 can be arranged on one circuit substrate 10, thereby saving the production cost of the display panel 1.

[0064] Moreover, in this embodiment, a splicing area 2000 is provided between adjacent electrical connection areas 1000, and an electrical connection area 1000 includes an installation area 100 and a connection area 200 arranged along the first direction X, thereby reducing the distance between two adjacent base substrates 20, that is, reducing the width of the splicing seam, thereby improving the display effect of the display panel 1.

[0065] Furthermore, in this embodiment, the display panel 1 also includes an encapsulation layer 90, which is located on the side of the display panel 1 away from the circuit substrate 10, and the encapsulation layer 90 includes a black glue layer 91 and a protective layer 92; wherein, the black glue layer 91 covers the light-emitting element 32, at least one light-emitting surface of the light-emitting element 32 is exposed to the black glue layer 91, and the protective layer 92 covers the black glue layer 91 and the light-emitting element 32.

[0066] Specifically, the display component 30 includes the driving circuit layer 31 and a plurality of the light-emitting elements 32, wherein the plurality of the light-emitting elements 32 are located on a side of the driving circuit layer 31 away from the base substrate 20, and the plurality of the light-emitting elements 32 are connected to the driving circuit layer 31, wherein the size of the light-emitting element 32 and its row and column spacing can be set according to actual needs.

[0067] The black glue layer 91 is located on a side of the light-emitting element 32 away from the driving circuit layer 31 . The black glue layer 91 covers the circuit substrate 10 and the connecting portion 70 . At least one light-emitting surface of the light-emitting element 32 is exposed to the black glue layer 91 . That is, the gaps between the plurality of light-emitting elements 32 are filled with the black glue layer 91 , and the side of the black glue layer 91 away from the circuit substrate 10 is a flat surface, thereby preventing light from passing between adjacent light-emitting elements 32 .

[0068] It can be understood that in this embodiment, the black glue layer 91 is arranged on the side of the light-emitting element 32 away from the driving circuit layer 31. The black glue layer 91 covers the circuit substrate 10 and the connecting part 70. At least one light-emitting surface of the light-emitting element 32 is exposed to the black glue layer 91, thereby eliminating the problem that the light-emitting element 32 (i.e., the splicing seam) is not arranged in the splicing area 2000, thereby improving the display effect of the display panel 1.

[0069] Furthermore, the protective layer 92 is located on the side of the black glue layer 91 away from the circuit substrate 10. The protective layer 92 covers the black glue layer 91 and the light-emitting element 32, thereby protecting the light-emitting element 32, avoiding damage to the light-emitting element 32, and improving the yield of the light-emitting element 32.

[0070] This embodiment provides a spliced ​​screen, which includes at least two display panels described in any one of the above embodiments.

[0071] It can be understood that the display panel has been described in detail in the above embodiments and will not be repeated here.

[0072] In summary, the present application provides a display panel and a spliced ​​screen, wherein the display panel includes a circuit substrate, at least one base substrate, at least one display component, at least one COF, at least one fan-out portion, and at least one set of connecting traces. The circuit substrate includes at least one mounting area and at least one connection area, the mounting area and the connection area being spaced apart, the circuit substrate including a trace through-hole located in the connection area, the base substrate being located on one side of the circuit substrate and disposed in the mounting area, the display component being located on a side of the base substrate away from the circuit substrate, the display component including a driving circuit layer and a plurality of light-emitting elements, the COF being located on a side of the circuit substrate away from the base substrate, the fan-out portion being located between the circuit substrate and the COF, the fan-out portion including a plurality of fan-out traces, one end of the fan-out trace being connected to the COF, the first end of the connecting trace being connected to the driving circuit layer, and the second end of the connecting trace being connected to the other end of the fan-out trace through the trace through-hole, thereby eliminating the need to provide signal traces on both the front and back sides of the base substrate, thereby reducing the difficulty of the display panel manufacturing process.

[0073] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0074] The above is a detailed introduction to a display panel and spliced ​​screen provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display panel, characterized in that: include: A circuit substrate, comprising at least one mounting area and at least one connection area, wherein the mounting area and the connection area are spaced apart, and the circuit substrate comprises a wiring through hole located in the connection area; At least one base substrate is located on one side of the circuit substrate, and one of the base substrates is disposed in one of the mounting areas; At least one display component is located on a side of the base substrate away from the circuit substrate, the display component includes a driving circuit layer and a plurality of light-emitting elements, and the plurality of light-emitting elements are connected to the driving circuit layer; At least one chip-on-film is located on a side of the circuit substrate away from the base substrate; At least one fan-out portion is located between the circuit substrate and the chip-on-film, the fan-out portion includes a plurality of fan-out traces, and one end of the fan-out trace is connected to the chip-on-film; At least one group of connecting wires, wherein a first end of the connecting wire is connected to the driving circuit layer, and a second end of the connecting wire passes through the wiring through hole and is connected to the other end of the fan-out wire.

2. The display panel according to claim 1, wherein: The circuit substrate includes a groove located in the mounting area, and the base substrate is arranged in the groove.

3. The display panel according to claim 2, wherein: The driving circuit layer includes a first connecting terminal arranged close to the connecting area; The circuit substrate further includes a second connection terminal located in the connection area, one end of the second connection terminal is connected to the first connection terminal, and the other end of the second connection terminal is connected to the first end of the connection trace.

4. The display panel according to claim 3, wherein: The second connection terminal is located on a side of the circuit substrate close to the driving circuit, and a side of the second connection terminal away from the wiring through hole is flush with a side of the first connection terminal away from the base substrate.

5. The display panel according to claim 4, wherein: The orthographic projection of the second connecting terminal on the circuit substrate covers the routing through hole.

6. The display panel according to claim 4, wherein: The display panel further includes a connecting portion located on a side of the circuit substrate close to the driving circuit layer, one end of the connecting portion being connected to the first connecting terminal, and the other end of the connecting portion being connected to the second connecting terminal.

7. The display panel according to claim 1, wherein: The circuit substrate is a printed circuit board or a flexible circuit board.

8. The display panel according to any one of claims 1 to 7, wherein: The circuit substrate includes a plurality of mounting areas and a plurality of connection areas, and a connection area is located between two adjacent mounting areas; The display panel includes multiple base substrates, multiple display components, multiple cover chips, multiple fan-out parts, and multiple groups of connecting wires, wherein one base substrate is set corresponding to one mounting area, one display component is set corresponding to one base substrate, one cover chip is set corresponding to one base substrate, one fan-out part is set corresponding to one cover chip, and one connecting wire is set corresponding to one display component.

9. The display panel according to claim 1, wherein: The display panel further includes an encapsulation layer, which is located on the display component and includes a black glue layer and a protective layer; The black glue layer covers the light emitting element, at least one light emitting surface of the light emitting element is exposed on the black glue layer, and the protective layer covers the black glue layer and the light emitting element.

10. A splicing screen, characterized in that: The display device comprises at least two display panels according to any one of claims 1 to 9.

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