laser

Abstract

A laser (10) belongs to the field of optoelectronic technology, comprising: a base plate (101), an annular side wall (102), a plurality of conductive pins (103) and a plurality of light-emitting chips (104), each type of light-emitting chip (104) comprising a plurality of light-emitting chips (104); the side wall (102) and the plurality of light-emitting chips (104) are fixed on the base plate (101), and the side wall (102) surrounds the plurality of light-emitting chips (104); the side wall (102) has a plurality of openings K, and each conductive pin (103) passes through an opening K and connects to the side wall (104). 2) fixed; the plurality of conductive pins (103) include at least one positive pin and at least one negative pin; the plurality of types of light-emitting chips (104) correspond to the plurality of colors one by one, and each type of light-emitting chip (104) is used to emit laser light of the corresponding color; the plurality of light-emitting chips (104) in each type of light-emitting chip (104) are connected in series, and the two ends of the plurality of light-emitting chips (104) connected in series are respectively connected to a positive pin and a negative pin; and at least two types of light-emitting chips (104) in the plurality of types of light-emitting chips (104) are connected to the same conductive pin (103).

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on June 9, 2021, with application number 202110642663.3, and invention name: Laser. The entire contents of the application are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of optoelectronic technology, and in particular to a laser. Background Art

[0004] With the development of optoelectronic technology, lasers are widely used, and multi-color lasers are favored due to their strong color expression.

[0005] Laser packaging is also developing towards high density and high power as process technology advances. However, in related technologies, the reliability of multi-chip packaged lasers is relatively low. Summary of the Invention

[0006] The present application provides a laser, comprising: a base plate, an annular sidewall, a plurality of conductive pins, and multiple types of light-emitting chips, each type of light-emitting chip comprising a plurality of light-emitting chips;

[0007] The sidewall and the plurality of light-emitting chips are fixed to the bottom plate, and the sidewall surrounds the plurality of light-emitting chips; the sidewall has a plurality of openings, and each of the conductive pins passes through one of the openings and is fixed to the sidewall; the plurality of conductive pins include at least one positive pin and at least one negative pin;

[0008] The multiple types of light-emitting chips correspond one-to-one to multiple colors, and each type of light-emitting chip is used to emit laser light of corresponding color; the multiple light-emitting chips in each type of light-emitting chip are connected in series, and the two ends of the multiple light-emitting chips in series are respectively connected to one of the positive pins and one of the negative pins; there are at least two types of light-emitting chips in the multiple types of light-emitting chips connected to the same conductive pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 It is a structural diagram of a laser provided by related technology;

[0011] Figure 2This is a schematic structural diagram of a laser provided in an embodiment of the present application;

[0012] Figure 3 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0013] Figure 4 1 is a schematic structural diagram of another laser provided in an embodiment of the present application;

[0014] Figure 5 This is a schematic structural diagram of another laser provided in an embodiment of the present application. DETAILED DESCRIPTION

[0015] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0016] With the development of optoelectronic technology, lasers are increasingly used in a wide range of applications. For example, lasers can be used as light sources in laser projectors and laser televisions. Furthermore, the requirements for laser reliability are becoming increasingly stringent. The better the sealing of the space containing the light-emitting chip in the laser, the better the light-emitting chip's illumination, the longer the chip's service life, and the higher the laser's reliability.

[0017] Figure 1 This is a schematic diagram of the structure of a laser provided by the relevant technology. Figure 1 As shown, the laser 00 includes: a base plate 001, an annular side wall 002, a plurality of conductive pins 003 and a plurality of light-emitting chips 004. The side wall 002 and the light-emitting chip 004 are fixed on the base plate 001, and the side wall 002 surrounds the plurality of light-emitting chips 004. The opposite sides of the side wall 002 (such as the first side and the second side) have a plurality of openings K, and each conductive pin 003 passes through an opening K and is fixed to the side wall 002. The conductive pins 003 on the first side are all connected to the positive pole of the power supply, and the conductive pins 003 on the second side are all connected to the negative pole of the power supply. The plurality of light-emitting chips 004 are arranged in multiple rows, and the light-emitting chips 004 in each row are used to emit laser light of the same color. The light-emitting chips 004 in each row are connected in series and the two ends are respectively connected to a conductive pin 003 on the first side and a conductive pin 003 on the second side. For example, Figure 1 As shown, four conductive pins 003 can be provided on each of the first and second sides of the sidewall 002, and the light-emitting chips 004 can be arranged in four rows. However, in the related art, the openings on the sidewall 002 of the laser 00 are prone to poor sealing, resulting in low reliability of the laser.

[0018] The embodiments of the present application provide a laser whose reliability can be improved.

[0019] Figure 2is a schematic structural diagram of a laser provided in an embodiment of the present application, Figure 3 is a schematic diagram of the structure of another laser provided in an embodiment of the present application, Figure 2 Can be Figure 3 A top view of the laser is shown. Figure 3 Can be Figure 2 The schematic diagram of the cross section a-a' of the laser shown. Figure 2 and Figure 3 The laser 10 may include: a base plate 101, an annular side wall 102, a plurality of conductive pins 103 and a plurality of types of light-emitting chips 104, each type of light-emitting chip 104 includes a plurality of light-emitting chips 104, that is, the number of each type of light-emitting chips 104 is greater than or equal to 2.

[0020] The side wall 102 and the multiple types of light-emitting chips 104 are all fixed on the base plate 101, and the side wall 102 surrounds the multiple types of light-emitting chips 104. The side wall 102 may have multiple openings K, and each conductive pin 103 is fixed to the side wall 102 through an opening K. The multiple conductive pins 103 in the laser 10 include at least one positive pin and at least one negative pin. The positive pin is used to electrically connect to the positive pole of an external power supply, and the negative pin is used to electrically connect to the negative pole of an external power supply. The positive pin and the negative pin are used to transmit current to the connected components (such as light-emitting chips). The structure composed of the base plate 101, the side wall 102 and the conductive pins 103 can be called a tube shell or a base assembly. The space surrounded by the side wall 102 obtained by enclosing the side wall 102 and the base plate 101 can be the accommodating space of the tube shell, and the accommodating space is used to arrange the light-emitting chip 104.

[0021] The multiple types of light-emitting chips 104 in the laser 10 can correspond to multiple colors one-to-one, and each type of light-emitting chip 104 is used to emit laser light of the corresponding color. The multiple light-emitting chips 104 in each type of light-emitting chip 104 can be connected in series, and the two ends of the multiple light-emitting chips 104 in series can be connected to a positive pin and a negative pin, respectively. At least two types of light-emitting chips 104 among the multiple types of light-emitting chips 104 are connected to the same conductive pin 103. For example, the at least two types of light-emitting chips 104 can be connected to the same positive pin, or they can also be connected to the same negative pin. It should be noted that different types of light-emitting chips require different currents, so the at least two types of light-emitting chips 104 are connected to different conductive pins other than the same conductive pin.

[0022] In the embodiments of the present application, multiple light-emitting chips within each type of light-emitting chip can be connected in series, allowing a single switch to control the on and off of the multiple light-emitting chips. Furthermore, the current at each point in the series circuit of the multiple light-emitting chips is equal, thus lowering the input current requirement and making it easier to reach the threshold current of each light-emitting chip, thus facilitating the light-emitting chip's emission.

[0023] It should be noted that the sealing effect of the openings K in the side wall 102 is crucial to the reliability of the laser. The more openings K there are on the side wall 102, the more difficult it is to ensure that each opening has a good sealing effect, and the greater the possibility of openings with poor sealing effect. In the related art, each type of light-emitting chip in the laser is arranged in at least one row, and each row of light-emitting chips is connected to a positive pin and a negative pin, and the positive pins and negative pins connected to light-emitting chips in different rows are different. Since each conductive pin needs to be fixed to the side wall of the laser through an opening, the number of openings in the side wall is at least twice the number of types of light-emitting chips. In the embodiment of the present application, there are at least two types of light-emitting chips in the laser connected to the same conductive pin. In this way, there can be fewer openings on the side wall, which makes it easier to ensure that the fewer openings have a good sealing effect, reducing the possibility of openings with poor sealing effect in the side wall, thereby improving the reliability of the laser.

[0024] In summary, in the laser provided by the embodiments of the present application, multiple light-emitting chips within each type of light-emitting chip are connected in series, with the positive and negative pins connected at both ends, respectively. At least two types of light-emitting chips are connected to the same conductive pin. This allows the laser to achieve normal light emission from multiple types of light-emitting chips using only a relatively small number of conductive pins. Fewer openings can be provided on the sidewalls of the laser, thereby reducing the risk of poor sealing of the openings in the laser and improving the reliability of the laser.

[0025] It should be noted that a portion of the conductive pin 103 extends through the corresponding opening K into the inner side of the side wall 102 and is surrounded by the side wall 102, while the other portion is located outside the side wall 102. The portion located outside the side wall 102 can be connected to the positive or negative electrode of the external power supply, and the portion located inside the side wall 102 can be connected to the corresponding electrode of the light-emitting chip 104 via a wire, thereby enabling the external power supply to transmit current to the light-emitting chip 104 through the conductive pin 103.

[0026] Optionally, the laser 10 may further include multiple annular sealing insulators 105, which are used to secure the conductive pins 103 to the corresponding openings K on the sidewall 102. For example, each conductive pin 103 may be capped with an annular sealing insulator 105 before being inserted into the openings K. When the conductive pin 103 is positioned in the openings K, the annular sealing insulator 105 is positioned between the conductive pin 103 and the sidewalls of the openings K. After the conductive pin 103, capped with the annular sealing insulator 105, is inserted into the openings K, the annular sealing insulator 105 may be heated, for example, to 800-900 degrees Celsius, to melt the annular sealing insulator 105, thereby filling the gap between the conductive pin 103 and the sidewalls of the openings K. The melted annular sealing insulator 105 acts as a sealing adhesive, bonding the conductive pin 103 to the sidewalls of the openings K and securing the conductive pin 103 to the sidewalls 102. Then the annular sealing insulator 105 is cooled and solidified. Optionally, the material of the annular sealing insulator 105 may include glass.

[0027] It should be noted that the annular sealing insulator in the opening of the side wall is at risk of falling off after curing. If the annular sealing insulator falls off, the opening cannot be sealed, and the conductive pin at the opening is also difficult to fix to the side wall, which may cause the circuit connection between the conductive pin and the light-emitting chip to malfunction, such as causing the wire between the conductive pin and the light-emitting chip to break, and the reliability of the laser is low. The more openings there are on the side wall of the laser, the more difficult it is to ensure that the annular sealing insulators at each opening are intact, and therefore the more difficult it is to ensure the reliability of the laser. In the embodiment of the present application, the number of openings on the side wall is reduced, which can reduce the possibility of the annular sealing insulator at the opening falling off, thereby improving the reliability of the laser.

[0028] Connecting different types of light-emitting chips to the same conductive pin is also called sharing the same conductive pin by the different types of light-emitting chips. The following is an introduction to the sharing of conductive pins by multiple types of light-emitting chips in a laser:

[0029] In the embodiment of the present application, the at least two types of light-emitting chips 104 connected to the same conductive pin in the laser may be all of the light-emitting chips 104 in the laser, or may be part of the light-emitting chips 104. For example, the number of types of light-emitting chips 104 in the laser may be n, where there may be m types of light-emitting chips 104 connected to the same conductive pin 103, where 2≤m≤n.

[0030] In an optional embodiment, there is only one group of m types of light-emitting chips among the n types of light-emitting chips that share the same conductive pin, where m is equal to any value from 2 to n, and n is any value greater than or equal to 2. For example, m=n, and the n types of light-emitting chips in the laser can all share the same positive electrode pin. If the number of conductive pins in the laser is n+1, the n+1 conductive pins include one positive electrode pin and n negative electrode pins, and the n types of light-emitting chips are all connected to the positive electrode pin and are respectively connected to the n negative electrode pins. Alternatively, the n types of light-emitting chips in the laser can all share the same negative electrode pin. If the n+1 conductive pins include one negative electrode pin and n positive electrode pins, the n types of light-emitting chips are all connected to the negative electrode pin and are respectively connected to the n positive electrode pins. Figure 2 Take m=n=3, that is, the laser includes three types of light-emitting chips and four conductive pins as an example. Optionally, n can also be 2, 4, 5 or other values, which are not limited in the present embodiment.

[0031] For another example, m<n, the number of conductive pins in the laser is m+1+2*(nm)=2n-m+1. If the conductive pins in the laser include n-m+1 positive pins and n negative pins, the m types of light-emitting chips can all be connected to the same positive pin, and are respectively connected to m negative pins. Alternatively, the conductive pins in the laser include n positive pins and n-m+1 negative pins, and the m types of light-emitting chips can be respectively connected to m positive pins, and are all connected to the same negative pin. Each type of light-emitting chip in the remaining nm types of light-emitting chips is connected to the corresponding positive pin and negative pin, and does not share conductive pins with other types of light-emitting chips. For example, n=3, m=2, the laser includes 3 types of light-emitting chips and 5 conductive pins, and there are two types of light-emitting chips in the 3 types of light-emitting chips that are connected to the same conductive pin, and the remaining one type of light-emitting chip does not share conductive pins with other types of light-emitting chips. Optionally, n can also be 4, 5 or other values, which is not limited in the embodiments of the present application.

[0032] In another optional implementation, m≤n / 2, and n is any value greater than or equal to 4. There may be at least two groups of light-emitting chips among the n types of light-emitting chips that share a common conductive pin, wherein each group of light-emitting chips includes at least two types of light-emitting chips, and the light-emitting chips in each group of light-emitting chips share one conductive pin. In a first optional manner, only the positive pin or the negative pin connected to each type of light-emitting chip is shared with other types of light-emitting chips. In a second optional manner, there may also be at least one type of light-emitting chip (such as the target type of light-emitting chip) whose positive and negative pins are shared with other types of light-emitting chips, and the light-emitting chip that shares the positive pin with the target type of light-emitting chip is different from the light-emitting chip that shares the negative pin with the target type of light-emitting chip.

[0033] Assume that n = 4, and the n types of light-emitting chips include a first type of light-emitting chip, a second type of light-emitting chip, a third type of light-emitting chip, and a fourth type of light-emitting chip; and m = 2, and two types of light-emitting chips among the n types of light-emitting chips share the same conductive pin. For example, for the first optional approach described above, the n types of light-emitting chips can be divided into two groups of light-emitting chips, with the first and second types of light-emitting chips forming one group of light-emitting chips, and the third and fourth types of light-emitting chips forming another group of light-emitting chips. The number of conductive pins in the laser can be six, including two positive pins and four negative pins. The first and second types of light-emitting chips can share one positive pin, the third and fourth types of light-emitting chips can share another positive pin, and the four types of light-emitting chips can be connected to the four negative pins respectively. Alternatively, the six conductive pins include two negative pins and four positive pins, with the first and second types of light-emitting chips sharing one negative pin, the third and fourth types of light-emitting chips sharing another negative pin, and the four types of light-emitting chips being connected to the four positive pins respectively.

[0034] As another example, for the second optional method described above, the n types of light-emitting chips can be divided into four groups of light-emitting chips, wherein the first type of light-emitting chip and the second type of light-emitting chip form a group of light-emitting chips, the third type of light-emitting chip and the fourth type of light-emitting chip form a group of light-emitting chips, the first type of light-emitting chip and the third type of light-emitting chip also form a group of light-emitting chips, and the second type of light-emitting chip and the fourth type of light-emitting chip also form a group of light-emitting chips. The number of conductive pins in the laser can be 4, including a first positive pin, a second positive pin, a first negative pin, and a second negative pin. The first type of light-emitting chip and the second type of light-emitting chip can share the first positive pin, the third type of light-emitting chip and the fourth type of light-emitting chip can share the second positive pin, the first type of light-emitting chip and the third type of light-emitting chip can share the first negative pin, and the second type of light-emitting chip and the fourth type of light-emitting chip can share the second negative pin.

[0035] It should be noted that in the embodiments of the present application, light-emitting chips used to emit lasers of different colors can share the same conductive pins. This allows for a greater variety of light-emitting chips to be incorporated into the laser housing, improving the laser's luminous effect. Using a housing with fewer conductive pins also allows for the preparation of lasers that include multiple types of light-emitting chips, increasing the housing's versatility. Furthermore, a housing with fewer conductive pins is also smaller in size, allowing for miniaturization of the laser while enabling the laser to emit multiple colors of laser light.

[0036] The following is an introduction to the setting of the conductive pins in the laser with reference to the accompanying drawings:

[0037] Optionally, the number of the plurality of conductive pins in the laser in the embodiment of the present application may be an even number, and the plurality of conductive pins are fixed on two opposite sides of the side wall, and the number of the conductive pins fixed on the two sides is the same. For example, please continue to refer to Figure 2 and Figure 3 The multiple conductive pins 103 in the laser may include: a first pin 103a, a second pin 103b, a third pin 103c, and a fourth pin 103d. The first pin 103a and the second pin 103b may both be fixed to the target side of the side wall 102, and the third pin 103c and the fourth pin 103d may both be fixed to the side opposite to the target side of the side wall 102. It should be noted that the number of conductive pins in the laser may also be an odd number, and the conductive pins in the laser may also be fixed to the same side of the side wall, or may also be fixed to adjacent sides of the side wall. When the conductive pins are fixed to different sides of the side wall, the number of conductive pins fixed on the different sides may also be different, and this embodiment of the application is not limited to this.

[0038] Optionally, please continue to refer to Figure 2 , the light-emitting chips 104 in the laser can be arranged in an array, and the light-emitting chips 104 can emit light along the column direction. The target side and the opposite side of the conductive pin 103 provided in the side wall 102 can be respectively the two opposite sides of the side wall 102 in the row direction of the light-emitting chip 104. Optionally, in the embodiment of the present application, the laser includes four conductive pins 103 as an example; the first pin 103a of the four conductive pins 103 can be connected to an electrode of a first polarity, and the second pin 103b, the third pin 103c and the fourth pin 103d can all be connected to an electrode of a second polarity. The first polarity can be positive, and the second polarity can be negative; or the first polarity can be negative, and the second polarity can be positive, which is not limited in the embodiment of the present application. Optionally, the number of conductive pins 103 in the laser 10 can also be 5, 6, 7, 8 or other numbers.

[0039] The following is an introduction to the various types of light-emitting chips in lasers:

[0040] Each type of light-emitting chip in the laser can emit a color of laser light, and different types of light-emitting chips emit laser light of different colors. For example, please continue to refer to Figure 2The multiple types of light-emitting chips are three in number and may include: a first type of light-emitting chip 104a, a second type of light-emitting chip 104b, and a third type of light-emitting chip 104c, each emitting laser light of decreasing wavelengths. Optionally, the first type of light-emitting chip 104a is configured to emit red laser light, the second type of light-emitting chip 104b is configured to emit green laser light, and the third type of light-emitting chip 104c is configured to emit blue laser light. Optionally, the multiple types of light-emitting chips may be four, five, or even more. For example, the laser may also include light-emitting chips configured to emit laser light of other colors, such as a light-emitting chip configured to emit violet laser light and a light-emitting chip configured to emit yellow laser light.

[0041] The placement of the various light-emitting chips in the laser on the base plate can be related to the heat dissipation performance of the light-emitting chip itself. For example, the heat dissipation performance of the light-emitting chip is related to the wavelength of the laser light emitted by the light-emitting chip. A light-emitting chip that emits a shorter wavelength laser can have better heat dissipation performance. The distance between the light-emitting chip and the middle area of ​​the base plate can be positively correlated with the wavelength of the laser light emitted by the light-emitting chip. Since the heat dissipation effect of the middle area of ​​the base plate is poorer than that of the edge area, the light-emitting chip with better heat dissipation performance can be placed close to the middle area of ​​the base plate to compensate for the heat dissipation effect of the base plate to a certain extent through the heat dissipation performance of the light-emitting chip. This can ensure that the heat dissipation effect of the various light-emitting chips is more balanced during operation, ensuring the high reliability of the laser.

[0042] For example, please continue to refer to Figure 2 The first-type light-emitting chips 104a, second-type light-emitting chips 104b, and third-type light-emitting chips 104c in the laser can be arranged in two rows and multiple columns, with the row direction being the x-direction and the column direction being the y-direction. One row of light-emitting chips (e.g., the second row of light-emitting chips) includes the first-type light-emitting chips 104a, while the other row of light-emitting chips (e.g., the first row of light-emitting chips) includes the second-type light-emitting chips 104b and the third-type light-emitting chips 104c. Because the wavelength of the laser light emitted by the third-type light-emitting chips 104c is shorter than that of the laser light emitted by the second-type light-emitting chips 104b, the third-type light-emitting chips 104c have better heat dissipation performance. Therefore, the third-type light-emitting chips 104c can be positioned closer to the center area of ​​the base plate 101 relative to the second-type light-emitting chips 104b. For example, in the first row of light-emitting chips, the second-type light-emitting chips 104b can be placed on both sides of the third-type light-emitting chips 104c.

[0043] Optionally, multiple light-emitting chips in each type of light-emitting chip in the laser can be arranged in a ring shape, and can all surround the middle area of ​​the base plate, such as multiple rings formed by different types of light-emitting chips can be concentric rings. The rings closer to the middle area are surrounded by light-emitting chips with shorter wavelengths of laser light emitted. For example, multiple light-emitting chips in each type of light-emitting chip can be distributed in a circular shape around the middle area of ​​the base plate, that is, multiple light-emitting chips in each type of light-emitting chip form a circular ring shape. Optionally, multiple light-emitting chips in each type of light-emitting chip can also be arranged in a square ring shape, or rings of other shapes, which are not limited in the embodiments of the present application.

[0044] It should be noted that in the related art, each type of light-emitting chip is arranged in at least one row, and the relationship between the heat dissipation performance of the light-emitting chip itself and the heat dissipation effect at different positions in the laser is not taken into account. In the related art, light-emitting chips with poor heat dissipation performance will also be set at positions in the laser with poor heat dissipation effect, resulting in more significant heat accumulation of the light-emitting chip, and the heat generated by the light-emitting chip when emitting light is more difficult to dissipate; this will in turn cause the threshold current of the light-emitting chip to change, the light-emitting efficiency of the light-emitting chip to be lower, and the light-emitting chip to be more easily damaged by the heat. In the embodiment of the present application, the setting position of the light-emitting chip is determined based on the heat dissipation performance of the light-emitting chip itself and the heat dissipation effect at different positions in the laser. This can ensure that the heat dissipation effect of each light-emitting chip is good, avoid heat accumulation of light-emitting chips with poor heat dissipation performance, improve the light-emitting efficiency of the light-emitting chip, and reduce the risk of damage to the light-emitting chip.

[0045] Optionally, in the embodiment of the present application, the number of the first type of light-emitting chips 104a can be equal to the sum of the number of the second type of light-emitting chips 104b and the third type of light-emitting chips 104c, and the number of the second type of light-emitting chips 104b can be greater than the number of the third type of light-emitting chips 104c. Optionally, the number of the second type of light-emitting chips 104b can also be equal to the number of the third type of light-emitting chips 104c, and the number of the first type of light-emitting chips 104a can not be equal to the sum of the number of the second type of light-emitting chips 104b and the third type of light-emitting chips 104c. The number of each type of light-emitting chip in the laser can be determined based on the desired ratio of the various colors in the laser light. The embodiment of the present application does not limit the number of each type of light-emitting chip or the relationship between the numbers.

[0046] Optionally, the laser 10 may further include multiple heat sinks 106 and multiple reflective prisms 107. Each light-emitting chip 104 in the laser may correspond to one heat sink 106 and one reflective prism 107. The heat sink 106 may be fixed to the base plate 101, and the light-emitting chip 104 may be fixed to the heat sink 106 to be fixed to the base plate 101. The reflective prism 107 is located on the light-emitting side of the corresponding light-emitting chip 104. The light-emitting chip 104 may emit laser light toward the corresponding reflective prism 107, and the reflective prism 107 may emit the incident laser light in a direction away from the base plate 101 (e.g., the z-direction), thereby achieving light emission of the laser 10.

[0047] Optionally, the heat sink 106 includes a heat dissipation substrate and a conductive layer located on the heat dissipation substrate, and the light-emitting chip can be fixed on the conductive layer of the heat sink 106. Optionally, the heat sink 106 may also include a solder layer provided on the conductive layer, and the solder layer is used to solder the light-emitting chip when melted. It should be noted that the specific structure of the heat sink 106 is not shown in the embodiment of the present application. Optionally, the material of the heat dissipation substrate in the heat sink may include ceramic or copper, and the material of the conductive layer may include gold. When the material of the heat dissipation substrate of the heat sink is a conductive material, an insulating layer is also provided between the heat dissipation substrate and the conductive layer in the heat sink to avoid the situation where the light-emitting chip is conductive to the heat dissipation substrate, resulting in the current being unable to be transmitted to the light-emitting chip.

[0048] The following describes the series connection method of various light-emitting chips in the laser and the connection method between the light-emitting chips and the conductive pins:

[0049] The light-emitting chip 104 includes a first electrode, a second electrode, and a light-emitting structure located between the first and second electrodes. The first and second electrodes are respectively connected to the positive and negative electrodes of a power source to transmit current to the light-emitting structure, thereby stimulating the light-emitting structure to emit laser light, thereby achieving light emission from the light-emitting chip 104. The first electrode, light-emitting structure, and second electrode in the light-emitting chip are not illustrated in the embodiments of this application. For example, the surface of the heat sink 106 away from the base plate 101 is a conductive surface, which is also the surface on which the light-emitting chip 104 is mounted. After the light-emitting chip 104 is secured to the heat sink 106, its first electrode can be electrically connected to the conductive surface of the heat sink 106, and further, can be electrically connected to an electrode (e.g., the positive or negative electrode) of the power source through the conductive surface. For example, a wire connected to an electrode of the power source can be connected to the conductive surface; the wire does not need to be in direct contact with the first electrode of the light-emitting chip 104. Alternatively, the conductive surface of the heat sink can be directly used as the first electrode of the light-emitting chip, without the need for an additional conductive film layer to serve as the first electrode in the light-emitting chip.

[0050] In an embodiment of the present application, multiple light-emitting chips in each type of light-emitting chip in the laser can be connected in series, and the two ends of the multiple light-emitting chips in series are respectively connected to a positive pin and a negative pin. For example, the first electrode of the first light-emitting chip in the multiple light-emitting chips is connected to the positive pin, the second electrode of the previous light-emitting chip in the multiple light-emitting chips is connected to the first electrode of the next light-emitting chip, and the second electrode of the last light-emitting chip is connected to the negative pin, so as to realize the series connection of the multiple light-emitting chips. Optionally, the multiple light-emitting chips in series in each type of light-emitting chip can be all the light-emitting chips in that type of light-emitting chip, or can be only part of the light-emitting chips in that type of light-emitting chip. For example, the laser is provided with a total of 10 light-emitting chips of the first type, and the 10 light-emitting chips can all be connected in series, or 5 of the 10 light-emitting chips can be connected in series, and the other 5 light-emitting chips can be connected in series.

[0051] Alternatively, the components in the laser can be connected by a wire, which can be a gold wire. For example, a wire bonding process can be used to place a wire between the two components to be connected, with the two ends of the wire connecting the two components. For example, the wire can be pressed onto the surface metal layer (such as a gold layer) of the object to be connected using a cutter, and pressure is applied while heating the pad. This softens the contact area between the wire and the gold layer, allowing the molecules of the wire to diffuse into the material it contacts, thereby achieving the purpose of welding. For example, a wire can be used to connect the first electrode of one light-emitting chip to the second electrode of another light-emitting chip. It should be noted that the reliability of a wire is inversely correlated with its length. The longer the wire, the weaker its strength. Therefore, the distance between two components to be connected by the same wire must be less than or equal to a distance threshold to ensure the strength of the wire connecting the two components and ensure the reliability of the connection between the two components. For example, the distance between any two components connected by the same wire is less than or equal to 3 mm, that is, the distance threshold is 3 mm. For example, the distance between the two components can range from 2 mm to 3 mm.

[0052] In an embodiment of the present application, at least two types of light-emitting chips in the laser share the same conductive pin, and the at least two types of light-emitting chips need to be connected to the same conductive pin, which makes it difficult to ensure that each type of light-emitting chip and the two connected conductive pins are arranged regularly. For example, it is difficult to ensure that the two conductive pins connected to each type of light-emitting chip are located on both sides of each type of light-emitting chip, and it is difficult to ensure that each type of light-emitting chip in the laser and the two connected conductive pins are arranged in the same direction. In an embodiment of the present application, the light-emitting chips in the laser are arranged in disorder, and there are two light-emitting chips that need to be connected that are far apart, or the light-emitting chip and the conductive pin to be connected are far apart. Therefore, it is difficult to achieve the series connection of various types of light-emitting chips and the connection with the corresponding conductive pins only through wires. In an embodiment of the present application, the connection between the light-emitting chips and between the light-emitting chips and the conductive pins can be achieved by means of adapter wires. Two optional connection methods are introduced below.

[0053] For an optional connection method, please continue to refer to Figure 2 , the laser 10 also includes a plurality of adapters 108 fixed on the base plate 101. Each type of light-emitting chip in the laser 10 can be connected in series and connected to the corresponding positive pin and negative pin through the adapter 108. When the two components to be connected cannot be directly connected by a wire, a adapter can be set between the two components so that the wire can connect the two components through the connection adapter. For example, when the wire cannot directly connect the electrodes of the two light-emitting chips, a adapter can be set between the two light-emitting chips. When the wire cannot directly connect the light-emitting chip closest to the edge of the multiple light-emitting chips connected in series with the conductive pin, a adapter can be set between the light-emitting chip and the conductive pin. The number of adapters set between two components can be determined according to the distance between the two components and the arrangement of the wires.

[0054] For example, for Figure 2As shown in the arrangement of the light-emitting chips 104 and the configuration of the conductive pins 103, the multiple adapters 108 in the laser 10 may include: multiple first adapters 108a, multiple second adapters 108b, and multiple third adapters 108c. The multiple first adapters 108a may be arranged in a row or approximately in a row along the row direction of the light-emitting chips 104 (e.g., the x-direction) and located between the two rows of light-emitting chips 104 in the laser 10. The multiple second adapters 108b may be located on a side of the first row of light-emitting chips 104 away from the second row of light-emitting chips 104. Optionally, the second type of light-emitting chips 104a are distributed on both sides of the multiple second adapters 108b in the x-direction. The multiple third adapters 108c are located between the first row of light-emitting chips 104 and the multiple first adapters 108a. The first type of light-emitting chip 104a can be connected in series with the first pin 103a and the second pin 103b through the multiple first adapters 108a, the second type of light-emitting chip 104b can be connected in series with the first pin 103a and the third pin 103c through the multiple second adapters 108b, and the third type of light-emitting chip 104c can be connected in series with the first pin 104a and the fourth pin 104d through the multiple third adapters 108c.

[0055] For example, the plurality of first-type light-emitting chips 104a arranged in a row can be connected sequentially along the x-direction, and the plurality of first adapters 108a arranged in a row can be connected sequentially along the x-direction. The first-type light-emitting chip 104a on the target side farthest from the sidewall 102 can be connected to the first adapter 108a on the far-target side, the first-type light-emitting chip 104a closest to the target side can be connected to the first pin 103a, and the first adapter 108a closest to the target side can be connected to the second pin 103b. The second-type light-emitting chip 104b can be connected sequentially along the x-direction to the plurality of second adapters 108b. The second-type light-emitting chip 104b closest to the target side can be connected to the first pin 108a, and the second-type light-emitting chip 104b farthest from the target side can be connected to the third pin 108c. The multiple third adapters 108c can be located on both sides of the third light-emitting chip 104c. The third light-emitting chip 104c and the multiple third adapters 108c can be connected in sequence along the x-direction. The component closest to the target side among the third light-emitting chip 104c and the multiple third adapters 108c can be connected to the first adapter 108a closest to it, and the third adapter 108c farthest from the target side can be connected to the fourth pin 103d.

[0056] Optionally, the third adapter can also be located between the second type of light-emitting chip 104b and the third type of light-emitting chip 104c, but this embodiment of the present application does not illustrate this approach. The third type of light-emitting chip 104c can also be connected to the conductive pin via another adapter other than the third adapter. Optionally, the laser 10 can also include an adapter disposed between the conductive pin and the light-emitting chip closest thereto, so as to connect the conductive pin to the light-emitting chip via the adapter. Optionally, the adapter 108 can include: an adapter body and a conductive layer located on the side of the adapter body away from the base plate 101. The adapter body can be made of an insulating material, such as ceramic, or aluminum nitride or aluminum oxide; the conductive layer can be made of gold or other metals. Connections between the adapter and the light-emitting chip, between the adapter and the conductive pin, between the light-emitting chip and the light-emitting chip, and between the light-emitting chip and the conductive pin can all be achieved through wire bonding technology. For details, please refer to the above-mentioned introduction to wire bonding, which will not be repeated in the embodiments of the present application.

[0057] Optionally, the transfer platform 108 may be in the shape of a cuboid, cube, cylinder, elliptical column, prism, or other cylindrical shape. Accordingly, the surface of the transfer platform 108 away from the base plate may be in the shape of a rectangle, square, circle, ellipse, rectangle, or other polygon. The dimensions of this surface may be designed based on the requirements for the arrangement of the wires and are not limited in this embodiment of the present application.

[0058] In another optional connection method, Figure 4 This is a schematic diagram of the structure of another laser provided in an embodiment of the present application. Figure 3 Can also be Figure 4 Schematic diagram of the cross section a-a' in the laser shown. Figure 4 As shown, a heat sink can be used to replace some of the adapters, and the adapters and heat sinks can be used to connect the various light-emitting chips in the laser in series and connect them to the conductive pins. In this optional connection method, the adapter 108 can be located between the light-emitting chip 104 and the conductive pin 103, and the number of adapters 108 is less than the threshold number. Figure 4 Take the laser 10 as an example, which only includes three adapters 108 .

[0059] The heat sink 106 can have multiple conductive areas, such as the conductive layer in the heat sink 106 can be divided into multiple conductive areas, and the adjacent conductive areas in the multiple conductive areas are insulated. For example, the multiple conductive areas can be arranged in sequence along the light emitting direction (such as the y direction) of the light emitting chip 104. One of the multiple conductive areas is used to set the corresponding light emitting chip 104 and is electrically connected to the light emitting chip 104. For example, the conductive area can be connected to the first electrode of the light emitting chip 104, or serve as the first electrode of the light emitting chip 104. The other conductive areas in the multiple conductive areas act as a transfer station for switching circuits. Each type of light emitting chip in the laser 100 can be connected in series and connected to the corresponding positive pin and negative pin through the transfer station 108 and the conductive areas of each heat sink 106.

[0060] For example, Figure 4 The arrangement of the light emitting chips 104 and the setting of the conductive pins 103 are similar to Figure 2 The same, can refer to the above related introduction, the embodiment of this application will not be repeated. Figure 4 As shown, the heat sink 106 corresponding to the first-type light-emitting chip 104a has a first conductive region Q1 and a second conductive region Q2 arranged sequentially along the y-direction. The first conductive region Q1 is used to accommodate the light-emitting chip 104. The heat sink 106 corresponding to the second-type light-emitting chip 104b and the third-type light-emitting chip 104c each has a third conductive region Q3, a fourth conductive region Q4, and a fifth conductive region Q5 arranged sequentially along the y-direction. The third conductive region Q3 is used to accommodate the light-emitting chip 104. The first-type light-emitting chips 104a are connected in series via the first conductive region Q1. The series-connected first-type light-emitting chips 104a are connected to the first lead 103a and the second lead 103b via the second conductive region Q2 and the adapter 108. The second-type light-emitting chip 104b is connected in series via the third conductive region Q3 to a target conductive region, which can be either the fourth conductive region Q4 or the fifth conductive region Q5. The series-connected second-type light-emitting chip 104b is connected to the first lead 103a and the third lead 103c via the adapter 108. The third type of light-emitting chips 104c are connected in series through the third conductive region Q3. The third type of light-emitting chips 104c connected in series are connected to the first pin 103a and the fourth pin 103d through the auxiliary conductive region and the adapter 108. The auxiliary conductive region is a conductive region other than any conductive region of the fourth conductive region Q4 and the fifth conductive region Q5. Figure 4 Take the target conductive region as the fifth conductive region Q5 and the auxiliary conductive region as the fourth conductive region Q4 as an example.

[0061] For example, the plurality of first-type light-emitting chips 104a arranged in a row can be connected sequentially along the x-direction, and the second conductive regions Q2 of the heat sinks 106 corresponding to the first-type light-emitting chips 104a can be connected sequentially along the x-direction. The first conductive region Q1 and the second conductive region Q2 of the heat sink 106 on the target side farthest from the sidewall 102 are connected. The first-type light-emitting chip 104a closest to the target side is connected to the first lead 103a via the adapter 108, and the second conductive region Q2 of the heat sink 106 closest to the target side is connected to the second lead 103b via the adapter 108. The second-type light-emitting chip 104b and the fifth conductive region Q5 of the heat sink 106 can be connected sequentially along the x-direction. The second-type light-emitting chip 104b closest to the target side can be connected to the first lead 108a, and the second-type light-emitting chip 104b farthest from the target side can be connected to the third lead 108c via the adapter 108. The third type light emitting chip 104c and the fourth conductive region Q4 of the heat sink 106 can be connected sequentially along the x direction. The fourth conductive region Q4 of the heat sink 106 closest to the target side can be connected to the first pin 103a, and the fourth conductive region Q4 of the heat sink 106 farthest from the target side can be connected to the fourth pin 103d.

[0062] Insulating material may be provided between adjacent conductive areas in the heat sink 106. Optionally, when the heat sink 106 is divided into multiple conductive areas, the thickness of the multiple conductive areas may be different. The thickness of the conductive area in the heat sink 106 used to set the light emitting chip may be greater than the thickness of other conductive areas, which can reduce the preparation cost of the heat sink. For example, the thickness of the conductive area in the heat sink used to set the light emitting chip may be 0.5 microns, and the thickness of the other conductive areas may be 0.25 microns. Figure 4 The thickness of the first conductive region Q1 and the third conductive region Q3 of the middle heat sink 106 can be 0.5 microns, and the thickness of the second conductive region Q2, the fourth conductive region Q4, and the fifth conductive region Q5 can each be 0.25 microns. Optionally, a solder layer is required on the conductive region where the light-emitting chip is mounted, while no solder layer is required on the other conductive regions.

[0063] It should be noted that the embodiments of this application are only based on Figure 2 and Figure 4 Two line connection methods are used as examples for illustration. In actual implementation, the specific arrangement of the light-emitting chips and the setting position of the adapter and the line connection method can be adjusted accordingly based on the wiring requirements. The embodiments of this application do not limit this. For the above-mentioned method of setting a heat sink with multiple conductive areas to replace the adapter for circuit switching, it is only necessary to appropriately extend the heat sink, and there is no need to set up a separate adapter. Since the heat sink occupies a small space, it is conducive to the miniaturization of the laser. And the heat sink can be simply pasted on the base plate, without adding the process of pasting the adapter on the base plate, which can simplify the preparation process of the laser.

[0064] Figure 5 This is a schematic diagram of the structure of another laser provided in the embodiment of the present application. Figure 5 As shown, in Figure 3 On the basis of the above, the laser 10 may further include an annular sealing cover plate 109, a light-transmitting sealing layer 110, and a collimating lens group 111. The outer edge of the sealing cover plate 109 can be fixed to the surface of the side wall 102 away from the bottom plate 101, and the inner edge of the sealing cover plate 109 away from the bottom plate 101 is fixed to the light-transmitting sealing layer 110, and the light-transmitting sealing layer 110 covers the opening of the sealing cover plate 109. The collimating lens group 111 is located on the side of the sealing cover plate 109 away from the bottom plate 101. The collimating lens group 111 may include a plurality of collimating lenses T, and the plurality of collimating lenses T correspond one to one to the plurality of light-emitting chips 103. Each light-emitting chip 104 can emit a laser to the corresponding reflective prism 107. After being reflected on the reflective prism 107, the laser passes through the light-transmitting sealing layer 110 and is emitted to the corresponding collimating lens T. The collimating lens T collimates the incident laser light and then emits it, thereby completing the light emission of the laser.

[0065] It should be noted that the structure consisting of the sealing cover plate and the light-transmitting sealing layer can be referred to as an upper cover assembly. The upper cover assembly is used to seal the opening of the tube shell, thereby forming a sealed space within the tube shell. The light-emitting chip located within this sealed space can prevent external water and oxygen from corroding the light-emitting chip, thereby extending the service life of the light-emitting chip and ensuring its luminous effect. In the embodiment of the present application, the tube shell has fewer openings on its sidewalls, which can also reduce the risk of poor sealing of the openings on the sidewalls, further ensuring a good sealing effect within the laser housing space.

[0066] Optionally, the material of the tube shell in the embodiment of the present application may be copper, such as oxygen-free copper, the material of the light-transmitting sealing layer may be glass, and the material of the sealing cover plate may be stainless steel. It should be noted that copper has a large thermal conductivity coefficient. In the embodiment of the present application, the material of the tube shell is copper, which can ensure that the heat generated by the light-emitting chip arranged on the bottom plate of the tube shell during operation can be quickly conducted through the tube shell, and then dissipated more quickly, thereby avoiding damage to the light-emitting chip caused by heat accumulation. Optionally, the material of the tube shell may also be one or more of aluminum, aluminum nitride and silicon carbide. The material of the sealing cover plate in the embodiment of the present application may also be other Kovar materials, such as iron-nickel-cobalt alloy or other alloys. The material of the light-transmitting sealing layer may also be other light-transmitting and highly reliable materials, such as resin materials.

[0067] Optionally, in the embodiment of the present application, when assembling the laser, each annular sealing insulator can be first placed on each conductive pin, and then the conductive pin with the annular sealing insulator is inserted into the opening of the side wall, and the annular sealing insulator is located in the opening. The side wall is then placed on the base plate, and an annular solder (such as silver-copper solder) is placed between the side wall and the base plate. The structure of the base plate, side wall and conductive pin is then placed in a high-temperature furnace for sealing and sintering. After the sealing is sintered and solidified, the base plate, side wall, conductive pin and solder can be a whole (i.e., a base assembly), and the airtightness at the opening of the side wall is achieved. The light-transmitting sealing layer can also be fixed to the sealing cover plate by a sealing material to obtain an upper cover assembly. The heat sink, light-emitting chip and reflective prism can then be welded to corresponding positions on the base plate, and then the upper cover assembly can be welded to the surface of the side wall away from the base plate using a parallel sealing technique. Finally, after aligning the collimator lens assembly, the collimator lens assembly is fixed to the side of the upper cover assembly away from the base plate using epoxy glue, thus completing the assembly of the laser. It should be noted that the above assembly process is only an exemplary process provided in the embodiment of this application. The welding process used in each step can also be replaced by other processes, and the order of each step can also be adjusted accordingly. This embodiment of the application does not limit this.

[0068] It should be noted that the above embodiments of this application are described using the base plate and side walls of the tube shell as two separate structures that need to be assembled. Optionally, the base plate and side walls can also be formed integrally. This can prevent wrinkles on the base plate due to the different thermal expansion coefficients of the base plate and side walls during high-temperature welding, thereby ensuring the flatness of the base plate, ensuring the reliable placement of the light-emitting chip on the base plate, and ensuring that the light emitted by the light-emitting chip is emitted according to the predetermined emission angle, thereby improving the light-emitting effect of the laser.

[0069] In summary, in the laser provided by the embodiments of the present application, multiple light-emitting chips within each type of light-emitting chip are connected in series, with the positive and negative pins connected at both ends, respectively. At least two types of light-emitting chips are connected to the same conductive pin. This allows the laser to achieve normal light emission from multiple types of light-emitting chips using only a relatively small number of conductive pins. Fewer openings can be provided on the sidewalls of the laser, thereby reducing the risk of poor sealing of the openings in the laser and improving the reliability of the laser.

[0070] It should be pointed out that in the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "at least one" refers to one or more. The term "plurality" refers to two or more, unless otherwise expressly defined. "Approximately" and "approximately" mean that within an acceptable error range, those skilled in the art can solve the technical problems to be solved within a certain error range and basically achieve the technical effects to be achieved. In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. Similar reference numerals throughout the text indicate similar elements.

[0071] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A laser, characterized in that: The laser comprises: a bottom plate, an annular side wall, a plurality of conductive pins and a plurality of types of light-emitting chips, each type of light-emitting chip comprising a plurality of light-emitting chips; The sidewall and the plurality of light-emitting chips are fixed to the bottom plate, and the sidewall surrounds the plurality of light-emitting chips; the sidewall has a plurality of openings, and each of the conductive pins passes through one of the openings and is fixed to the sidewall; the plurality of conductive pins include at least one positive pin and at least one negative pin; The multiple types of light-emitting chips correspond to multiple colors one by one, and each type of light-emitting chip is used to emit laser light of a corresponding color; the multiple types of light-emitting chips include: a first type of light-emitting chip, a second type of light-emitting chip, and a third type of light-emitting chip, the wavelengths of which are successively reduced. The multiple types of light-emitting chips are arranged in two rows, one row of light-emitting chips includes the first type of light-emitting chips, and the other row of light-emitting chips includes the second type of light-emitting chips and the third type of light-emitting chips, and the number of the first type of light-emitting chips is not equal to the sum of the number of the second type of light-emitting chips and the third type of light-emitting chips; Multiple light-emitting chips in each type of light-emitting chip are connected in series, and both ends of the multiple light-emitting chips in series are respectively connected to one of the positive pins and one of the negative pins; at least two types of light-emitting chips in the multiple types of light-emitting chips are connected to the same conductive pin.

2. The laser according to claim 1, characterized in that The number of the plurality of types of light-emitting chips is n, the number of the plurality of conductive pins is n+1, and n≥2; The plurality of conductive pins include one positive electrode pin and n negative electrode pins, and the plurality of light-emitting chips are all connected to the positive electrode pin and are respectively connected to n negative electrode pins; Alternatively, the plurality of conductive pins include n positive electrode pins and 1 negative electrode pin, and the plurality of types of light-emitting chips are all connected to the negative electrode pins and are respectively connected to n positive electrode pins.

3. The laser according to claim 2, characterized in that n=3。 4. The laser according to claim 1, characterized in that The distance between the light-emitting chip in the laser and the middle area of ​​the base plate is positively correlated with the wavelength of the laser emitted by the light-emitting chip.

5. The laser according to claim 4, characterized in that The second type of light emitting chips are distributed on both sides of the third type of light emitting chips, and the number of the second type of light emitting chips is greater than or equal to the number of the third type of light emitting chips.

6. The laser according to claim 1, characterized in that The number of the plurality of conductive pins is an even number and they are symmetrically distributed on two opposite sides of the side wall.

7. The laser according to any one of claims 1 to 6, characterized in that The laser further includes a plurality of transfer platforms fixed on the base plate; the plurality of transfer platforms are located between two adjacent rows of the plurality of light-emitting chips and on one side of at least one row of the plurality of light-emitting chips; Each light-emitting chip in each type of light-emitting chip is connected in series to the positive electrode pin and the negative electrode pin through the adapter.

8. The laser according to any one of claims 1 to 6, characterized in that The laser further includes a plurality of transfer platforms fixed to the base plate, the plurality of transfer platforms being located between the conductive pins and the plurality of light-emitting chips; the laser further includes: a plurality of heat sinks fixed to the base plate, the plurality of heat sinks corresponding one to each light-emitting chip in the laser, and each light-emitting chip being fixed to the base plate by being fixed to a corresponding heat sink; The heat sink has multiple conductive areas, and adjacent conductive areas among the multiple conductive areas are insulated; one conductive area among the multiple conductive areas is used to set the corresponding light-emitting chip and is electrically connected to the light-emitting chip, and the other conductive areas are used for circuit switching; each light-emitting chip in each type of light-emitting chip is connected in series and connected to the positive pin and the negative pin through the adapter and the conductive areas of the multiple heat sinks.

9. The laser according to claim 7, characterized in that The multiple types of light-emitting chips are arranged into two rows, wherein one row of light-emitting chips includes the first type of light-emitting chips, and the other row of light-emitting chips includes the second type of light-emitting chips and the third type of light-emitting chips; The plurality of conductive pins include: a first pin connected to an electrode of a first polarity, and a second pin, a third pin, and a fourth pin connected to an electrode of a second polarity; the first pin and the second pin are both fixed to a target side of the side wall, and the third pin and the fourth pin are both fixed to a side of the side wall opposite to the target side; the target side and the opposite side are respectively opposite sides of the side wall in a row direction of the light-emitting chips; The plurality of transfer stations include: a plurality of first transfer stations, a plurality of second transfer stations, and a plurality of third transfer stations; the plurality of first transfer stations are arranged in a row along the row direction and are located between the light-emitting chips in the row and the light-emitting chips in the other row; the plurality of second transfer stations are located on a side of the light-emitting chips in the other row away from the light-emitting chips in the first row, and the second type of light-emitting chips are distributed on both sides of the plurality of second transfer stations in the row direction; the plurality of third transfer stations are located between the light-emitting chips in the other row and the plurality of first transfer stations; The first type of light-emitting chip is connected in series with the first pin and the second pin through the multiple first adapters, the second type of light-emitting chip is connected in series with the first pin and the third pin through the multiple second adapters, and the third type of light-emitting chip is connected in series with the first pin and the fourth pin through the multiple third adapters.

10. The laser according to claim 8, characterized in that The multiple types of light-emitting chips are arranged into two rows, wherein one row of light-emitting chips includes the first type of light-emitting chips, and the other row of light-emitting chips includes the second type of light-emitting chips and the third type of light-emitting chips; The plurality of conductive pins include: a first pin connected to an electrode of a first polarity, and a second pin, a third pin, and a fourth pin connected to an electrode of a second polarity; the first pin and the second pin are both fixed to a target side of the side wall, and the third pin and the fourth pin are both fixed to a side of the side wall opposite to the target side; the target side and the opposite side are respectively opposite sides of the side wall in a row direction of the light-emitting chips; The heat sink corresponding to the first type of light-emitting chip has a first conductive area and a second conductive area sequentially arranged along the column direction of the light-emitting chip, and the first conductive area is used to place the light-emitting chip; the heat sink corresponding to the second type of light-emitting chip and the third type of light-emitting chip both has a third conductive area, a fourth conductive area and a fifth conductive area sequentially arranged along the column direction, and the third conductive area is used to place the light-emitting chip; The first type of light-emitting chips are connected in series through the first conductive area, and the first type of light-emitting chips after series connection are connected to the first pin and the second pin through the second conductive area and the adapter; the second type of light-emitting chips are connected in series through the third conductive area and the target conductive area, and the target conductive area is any one of the fourth conductive area and the fifth conductive area; the second type of light-emitting chips after series connection are connected to the first pin and the third pin through the adapter; the third type of light-emitting chips are connected in series through the third conductive area, and the third type of light-emitting chips after series connection are connected to the first pin and the fourth pin through the auxiliary conductive area and the adapter, and the auxiliary conductive area is a conductive area other than any one of the fourth conductive area and the fifth conductive area.

11. The laser according to claim 8, characterized in that The laser meets at least one of the following requirements: The transfer platform includes a transfer platform body and a conductive layer located on a side of the transfer platform body away from the base plate, and the material of the transfer platform body is ceramic, aluminum nitride or aluminum oxide; Among the multiple conductive areas of the heat sink, the thickness of the conductive area for arranging the light-emitting chip is greater than the thickness of other conductive areas, and a solder layer is further arranged on the conductive area for arranging the light-emitting chip.

12. The laser according to any one of claims 1 to 6, characterized in that: Different components in the laser are connected by wires, and the distance between any two components connected by the same wire is less than or equal to 3 mm.

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