High-temperature-resistant resin diamond chamfer wheel for ceramic chamfering and preparation method thereof

Abstract

The application discloses a high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering and a preparation method thereof, and the preparation method comprises the following steps: (1) preparing alloy powder: Co powder, Cr powder, Ni powder, Cu powder, Fe powder and Al powder are respectively weighed according to formula amount, ball-milled and taken out for use; (2) preparing high-entropy alloy powder-coated diamond powder: the alloy powder and the diamond powder are ball-milled to prepare a cold-pressed green body by cold isostatic pressing; microwave sintering is carried out, and the sintered product is broken by a crusher; (3) mixing the diamond powder and filler powder: the diamond powder and the filler powder are weighed and uniformly mixed; (4) pouring resin abrasive: modified resin liquid, diluent and epoxy curing agent are added, uniformly stirred, poured into a pouring mold, an upper pressing plate is placed, pressing is carried out at normal temperature for 8-24 hours, the product is taken out, and an edge is processed, so that the high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering is obtained. The resin diamond chamfer wheel has higher high-temperature resistance, and the sharpness and service life are significantly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of ceramic processing consumables, and particularly relates to a high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering and a preparation method thereof. BACKGROUND

[0002] In the ceramic processing process, the size of the blank of the ceramic tile is larger than the standard size after firing, and at this time, the ceramic tile needs to be edge polished to meet the size requirement of the ceramic tile. After the ceramic tile is edge polished, the chamfer wheel is used to polish the peripheral edge left in the previous edge polishing process to be flat, smooth and wave-free.

[0003] The existing chamfer wheel is divided into three types, namely silicon carbide chamfer wheel, metal diamond chamfer wheel and resin diamond chamfer wheel. Among them, the chamfer size of the silicon carbide chamfer wheel is small, the cost is low, and the service life is very short. The metal diamond chamfer wheel has high hardness and large cutting force, and is easy to scratch the ceramic tile, has a very narrow application range, and has high cost. The hardness of the resin diamond chamfer wheel is moderate, the application range is wide, and it can meet the chamfering requirements of most ceramic tiles, and the service life is relatively long compared with the silicon carbide chamfer wheel. It is the most widely used chamfer wheel in the chamfering process at present. The existing resin diamond chamfer wheel is prepared by uniformly mixing resin powder and diamond, pouring into a mold, and then heat pressing and sintering.

[0004] However, the existing heat pressing and sintering processing method still has the following disadvantages:

[0005] (1) The resin powder and the diamond exist in the form of mechanical inlaying. In the grinding process, especially in the dry grinding high-temperature grinding working condition, the chamfer wheel is not resistant to high temperature, and the diamond particles are easy to fall off from the resin matrix during the grinding process. Evenly, as shown in FIG. 1, the block-shaped falling off occurs on the peripheral edge of the chamfer wheel, so that the sharpness of the resin diamond chamfer wheel is insufficient and the service life is not long enough. Figure 1

[0006] (2) In addition, the elasticity and toughness of the resin matrix prepared by heat pressing and sintering are poor, and the ceramic tile is easy to be damaged during chamfering, and the wave pattern is generated on the edge of the ceramic tile, thereby increasing the defective rate of the ceramic tile.

[0007] Therefore, it is urgent to develop a resin diamond chamfer wheel which can resist high temperature and improve the holding force of diamond and resin, so as to finally solve the technical problems of short service life of the chamfer wheel, poor sharpness and defective ceramic tile. SUMMARY

[0008] In order to overcome the shortcomings of the prior art, one of the purposes of the present application is to provide a preparation method of a high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering.

[0009] ​The second object of the present application is to provide a high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering prepared by the preparation method of the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering.

[0010] The first object of the present application is achieved by adopting the following technical scheme: a preparation method of a high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, comprising the following steps:

[0011] (1) Preparation of alloy powder:

[0012] Co powder, Cr powder, Ni powder, Cu powder, Fe powder, and Al powder are weighed according to the formula, and then added to a ball mill for ball milling. The alloy powder after ball milling is placed in a box filled with argon, soaked with alcohol, and then dried to obtain the alloy powder.

[0013] (2) Preparation of high-entropy alloy powder coated diamond powder:

[0014] The alloy powder and diamond are weighed according to the formula and added to a ball mill for ball milling. The mixed powder after ball milling is prepared into a cold-pressed green body by cold isostatic pressing. Then the cold-pressed green body is placed into a microwave sintering furnace for sintering. After sintering, the sintered body is cooled to room temperature in the furnace and then taken out. The sintered body is crushed by a crusher to obtain high-entropy alloy powder coated diamond powder.

[0015] (3) Mixing of diamond powder and filler powder:

[0016] The high-entropy alloy powder coated diamond powder and the filler powder are weighed according to the formula and mixed uniformly by a mixer to obtain mixed powder.

[0017] (4) Casting of resin abrasive:

[0018] The modified resin liquid and the diluent are added and stirred uniformly. Finally, the epoxy curing agent is added and stirred uniformly to obtain the abrasive resin liquid. The mixed abrasive resin liquid is poured into a casting mold, and the upper pressing plate is placed. After pressing for 8-24 hours at room temperature, the product is taken out and sharpened to obtain the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering.

[0019] Further, in step (1), the alloy powder is composed of the following components by mass percentage: Co powder 5-25%, Cr powder 10-35%, Ni powder 8-28%, Cu powder 5-30%, Fe powder 10-25%, and Al powder 10-20%, and the sum of the mass percentages of the above components is 100%.

[0020] Further, the preparation method of the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, in step (1), the working parameters of the ball mill are that the ball-to-material ratio is (18-22):1 and the rotation speed is 300-500 rpm.

[0021] Further, the preparation method of the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, in step (2), the weight ratio of the alloy powder to the diamond is (50-70):45, and the particle size of the diamond is 230-270 mesh.

[0022] Further, the preparation method of the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, in step (2), the working parameters of the ball mill are that the ball-to-material ratio is (4-8):1 and the mixing time is 2-4 h.

[0023] Further, the preparation method of the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, in step (2), the microwave sintering conditions are that the temperature is gradually increased from room temperature to 800-900℃ at a rate of 50℃ / min, and the holding time at 800-900℃ is 6-10 min.

[0024] Further, the preparation method of the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, in step (3), the high-entropy alloy powder-coated diamond powder and filler powder include the following components in mass percentage: high-entropy alloy-coated powder 15-20%, green silicon carbide 10-30%, 500# copper powder 5-10%, white corundum 10-20%, zinc oxide 10-20%, aluminum oxide 5-13%, fiber powder 3-15%, PVB 5-10%, nylon powder 1-10%, calcium carbonate 5-10%, and graphene 1-5%, and the sum of the mass percentages of the above components is 100%.

[0025] Further, the preparation method of the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, in step (4), the mass ratio of the mixed powder to the modified resin liquid is 4:(5-7), the addition amount of the diluent is 4-6% of the mass of the modified resin liquid, and the addition amount of the epoxy curing agent is 25-35% of the mass of the modified resin liquid.

[0026] Further, the preparation method of the high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, in step (4), the modified resin liquid is prepared by the following steps: adding modified polysulfone resin to epoxy resin, then adding epoxy resin active toughening agent, catalyst, and defoaming agent, stirring uniformly, and placing in an oven for heating at 120-150℃ for 2-3 h, and taking out;

[0027] The modified polysulfone resin is added in an amount of 15-40% of the mass of the epoxy resin, the epoxy resin active toughening agent is added in an amount of 1-10% of the mass of the epoxy resin, the catalyst is added in an amount of 2-5% of the mass of the epoxy resin, and the defoaming agent is added in an amount of 0.2-0.4% of the mass of the epoxy resin.

[0028] The second object of the present application is achieved by the following technical solution: a high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering, which is prepared by the method for preparing a high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering.

[0029] Compared with the prior art, the present application has the following beneficial effects:

[0030] The present application aims at the shortcomings of the hot-pressing sintering process, and by designing a formula and adjusting the process, a high-temperature-resistant and softening-resistant CoCrNiCuFeAl high-entropy alloy and diamond are selected, after microwave sintering, the obtained wrapped diamond powder after crushing is mixed with fillers, resins and other materials, and a resin diamond chamfer wheel with higher high-temperature resistance than the resin diamond chamfer wheel prepared by the traditional hot-pressing sintering process is obtained by the way of casting forming, and the sharpness and service life are significantly improved.

[0031] Specifically, the microwave sintering of the present process is a low-temperature rapid sintering method, which can reduce the sintering temperature, and the grain of the sintered material is finer and the structure is more uniform, which can well guarantee the solid solution characteristics of high-entropy alloy sintering. In addition, the microwave sintering process has a short sintering time and can greatly reduce energy consumption, which is 70-90% lower than that of conventional hot-pressing sintering. The present application uses the casting resin method instead of the traditional hot-pressing sintering resin method, and the resin diamond chamfer wheel prepared has good toughness and good elasticity, which can effectively prevent damage to the ceramic tile during chamfering, avoid the generation of wave patterns on the edge of the ceramic tile, improve the yield of the ceramic tile, and also protect itself from being broken by the sharp corner of the ceramic tile, and the block-shaped falling off. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 Schematic diagram of the resin metal chamfer wheel prepared by the existing hot-pressing sintering process after the chamfering process;

[0033] Figure 2 Schematic diagram of the product of the resin metal chamfer wheel of the preferred embodiment 2 of the present application after the chamfering process;

[0034] Figure 3 Production scene diagram of the resin metal chamfer wheel of the present application comparative example 6. DETAILED DESCRIPTION

[0035] The application will be further described below in conjunction with the drawings and specific embodiments, and it should be noted that the following described embodiments or technical features can be combined arbitrarily to form new embodiments without conflict.

[0036] In the application, all the parts and percentages are weight units, and the equipment and raw materials used can be purchased from the market or commonly used in the art. The methods in the following examples are conventional methods in the art, unless otherwise specified.

[0037] The application provides a preparation method of a high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering, comprising the following steps:

[0038] (1) Preparation of alloy powder:

[0039] Co powder, Cr powder, Ni powder, Cu powder, Fe powder and Al powder of the formula amount are weighed and added to a ball mill, and ball milling is performed with the ball mill. The alloy powder after ball milling is placed in a box filled with argon, soaked with alcohol, dried, and the alloy powder is obtained.

[0040] (2) Preparation of high-entropy alloy powder coated diamond powder:

[0041] The formula amount of alloy powder and diamond are added to the ball mill for ball milling, and the mixed powder after ball milling is prepared into a cold-pressed green body by cold isostatic pressing. Then the cold-pressed green body is placed into a microwave sintering furnace for sintering, and the sintered body is cooled to room temperature in the furnace and then taken out. The sintered body is crushed by a crusher to obtain high-entropy alloy powder coated diamond powder.

[0042] (3) Mixing of diamond powder and filler powder:

[0043] The formula amount of high-entropy alloy powder coated diamond powder and filler powder is weighed, and the high-entropy alloy powder coated diamond powder and the filler powder are mixed uniformly by a mixer to obtain mixed powder.

[0044] (4) Casting of resin abrasive:

[0045] The modified resin liquid and the diluent are added and stirred uniformly, and finally the epoxy curing agent is added and stirred uniformly to obtain an abrasive resin liquid. The mixed abrasive resin liquid is poured into a casting mold, the upper pressing plate is placed, and pressing is performed at room temperature for 8-24 h. After taking out, the blade is treated, and a high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering is obtained.

[0046] The present application aims at the shortcomings of hot-pressing sintering process, by designing the formula and adjusting the process, selecting high-temperature-resistant and soft-resisting CoCrNiCu FeAl high-entropy alloy and diamond, after microwave sintering, the obtained wrapped diamond powder after crushing, then mixed with filler, resin and other materials, through the way of casting forming, a kind of resin diamond chamfer which is more high-temperature-resistant than the traditional hot-pressing sintering resin diamond chamfer is obtained, and the sharpness and service life are significantly improved.

[0047] Specifically, the microwave sintering of the present process is a kind of low-temperature rapid sintering sintering method, which can reduce the sintering temperature, at the same time, the grain of the sintered material is more refined, the structure is more uniform, which can well guarantee the solid solution characteristics of high-entropy alloy sintering, in addition, the microwave sintering process has short sintering time, which can greatly reduce the energy consumption, reducing 70-90% of the energy consumption compared with the conventional hot-pressing sintering. The present application adopts the casting resin way instead of the traditional hot-pressing sintering resin way, the resin diamond chamfer wheel prepared has good toughness and elasticity, can effectively prevent the damage of ceramic tile in the chamfering process, avoid the wave pattern of ceramic tile extension edge, improve the yield of ceramic tile, at the same time, can also protect itself from being broken by the sharp corner of ceramic tile, and produce block-shaped falling situation.

[0048] As a further embodiment, the preparation method of the high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering, in step (1), the alloy powder is composed of the following components in mass percentage: Co powder 5-25%, Cr powder 10-35%, Ni powder 8-28%, Cu powder 5-30%, Fe powder 10-25%, and Al powder 10-20%, and the sum of the mass percentages of the above components is 100%.

[0049] As a further embodiment, the preparation method of the high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering, in step (1), the working parameters of the ball mill are ball-to-material ratio of (18-22):1 and rotation speed of 300-500 rpm.

[0050] As a further embodiment, the preparation method of the high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering, in step (2), the weight ratio of the alloy powder to diamond is (50-70):45, and the particle size of the diamond is 230-270 mesh.

[0051] As a further embodiment, the preparation method of the high-temperature-resistant resin diamond chamfer wheel for ceramic chamfering, in step (2), the working parameters of the ball mill are ball-to-material ratio of (4-8):1 and mixing time of 2-4 h.

[0052] As a further implementation manner, in step (2), the microwave sintering condition is gradually increasing temperature from room temperature to 800-900 DEG C at a rate of 50 DEG C / min, and the temperature holding time at 800-900 DEG C is 6-10 min.

[0053] As a further implementation manner, in step (3), the high-entropy alloy powder coated diamond powder and filler powder include the following components in mass percentage: high-entropy alloy coated powder 15-20%, green silicon carbide 10-30%, 500# copper powder 5-10%, white corundum 10-20%, zinc oxide 10-20%, aluminum oxide 5-13%, fiber powder 3-15%, PVB 5-10%, nylon powder 1-10%, calcium carbonate 5-10%, and graphene 1-5%, and the sum of the mass percentages of the above components is 100%.

[0054] As a further implementation manner, in step (4), the mass ratio of the mixed powder to the modified resin liquid is 4:5-7, the diluent is added in an amount of 4-6% of the mass of the modified resin liquid, and the epoxy curing agent is added in an amount of 25-35% of the mass of the modified resin liquid.

[0055] As a further implementation manner, in step (4), the modified resin liquid is prepared by the following steps: adding modified polysulfone resin into epoxy resin, and then adding epoxy resin active toughening agent, catalyst, and defoaming agent, stirring uniformly, and placing into an oven for heating at 120-150 DEG C for 2-3 h, and then taking out.

[0056] The adding amount of the modified polysulfone resin is 15-40% of the mass of the epoxy resin, the adding amount of the epoxy resin active toughening agent is 1-10% of the mass of the epoxy resin, the adding amount of the catalyst is 2-5% of the mass of the epoxy resin, and the adding amount of the defoaming agent is 0.2-0.4% of the mass of the epoxy resin.

[0057] The application also provides a high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering, which is prepared by the high-temperature-resistant resin diamond chamfering wheel preparation method for ceramic chamfering.

[0058] The following are specific embodiments of the application, and the raw materials and equipment used in the following embodiments can be obtained by purchase unless otherwise specified.

[0059] Examples 1-3 and Comparative Examples 1-9

[0060] The raw materials were weighed according to the proportions in Table 1, and the resin diamond chamfering wheels were prepared according to the preparation method in Table 1, to obtain resin diamond chamfering wheels of different embodiments, as shown in Table 1 in detail.

[0061] Table 1 alloy powder and diamond ratio table of examples 1-3

[0062] Example 1 Example 2 Example 3 Co powder (5-25%) 23 16 8 Cr powder (10-35%) 11 15 20 Ni powder (8-28%) 13 20 28 Cu powder (5-30%) 25 14 9 Fe powder (10-25%) 12 17 20 Al powder (10-20%) 16 18 15 Diamond (50-70:45) 50：45 60：45 68：45

[0063] In Table 1, the amount of diamond is the weight ratio of total alloy powder and diamond, which is (50-70):45.

[0064] Table 2 abrasive resin liquid ratio table of examples 1-3

[0065]

[0066]

[0067] In Table 2, the amount of modified resin liquid is the mass ratio of mixed powder and modified resin liquid, which is 4:(5-7). The modified resin liquid is prepared by the following steps: adding P-1700 modified polysulfone resin into E51 epoxy resin, then adding DY-040 epoxy resin active toughening agent, catalyst and defoaming agent, stirring uniformly, placing into an oven for heating, heating at 120-150℃ for 2-3h, and taking out; the addition amount of modified polysulfone resin is 15-40% of the mass of E51 epoxy resin, the addition amount of DY-040 epoxy resin active toughening agent is 5% of the mass of epoxy resin, the addition amount of catalyst is 4% of the mass of epoxy resin, and the addition amount of defoaming agent is 0.3% of the mass of epoxy resin. The diluent is SF-601 epoxy active diluent, and the epoxy curing agent is HS-1025B high-temperature resistant epoxy resin curing agent.

[0068] The preparation method of the high-temperature resistant resin diamond chamfering wheel of examples 1-3 comprises the following steps:

[0069] (1) Preparation of alloy powder:

[0070] The Co powder, Cr powder, Ni powder, Cu powder, Fe powder and Al powder were weighed according to the formula amount, added into a ball mill, and ball milled by the ball mill, and the working parameters of the ball mill were as follows: ball-to-material ratio was 20:1, and rotation speed was 400 rpm. The alloy powder after ball milling was placed in a box filled with argon, soaked with alcohol, taken out and dried to obtain the alloy powder;

[0071] (2) Preparation of high-entropy alloy powder coated diamond powder:

[0072] The formula amount of alloy powder is mixed with diamond, the particle size of the diamond is 250 mesh, the weight ratio of the alloy powder to the diamond is (50-70):45; the particle size of the diamond is 230-270 mesh; the mixed powder after ball milling is prepared into a cold-pressed green body by cold isostatic pressing; then the cold-pressed green body is placed into a microwave sintering furnace for sintering, the microwave sintering conditions are: gradually increasing the temperature from room temperature to 850°C at a rate of 50°C / min, and the holding time at 850°C is 8 min; after sintering, the sintered body is cooled to room temperature in the furnace and then taken out; the sintered body is crushed to 150-250 mesh by a crusher to obtain diamond powder wrapped with high-entropy alloy powder;

[0073] (3) mixing diamond powder and filler powder:

[0074] The formula amount of high-entropy alloy powder wrapped diamond powder and filler powder is weighed, and the high-entropy alloy powder wrapped diamond powder and the filler powder are mixed uniformly by using a mixer to obtain mixed powder;

[0075] (4) casting resin abrasive:

[0076] The modified resin liquid and the diluent (see Table 2 for the mass ratio of the mixed powder to the modified resin liquid and the addition amount of the diluent) are added and stirred uniformly, and finally the epoxy curing agent (see Table 2 for the addition amount of the epoxy curing agent) is added and stirred uniformly to obtain an abrasive resin liquid; the mixed abrasive resin liquid is poured into a casting mold, an upper pressing plate is placed, and pressing is performed at room temperature for 18 h, then the product is taken out and sharpened to obtain a high-temperature-resistant resin diamond chamfering wheel for ceramic chamfering.

[0077] Comparative Example 1

[0078] Comparative Example 1 is different from Example 2 in that the alloy powder and the diamond in process step (2) are not subjected to microwave sintering, i.e., after the alloy powder and the diamond prepared in step (1) are mixed by ball milling, the mixed powder is directly subjected to the casting resin abrasive treatment, and the rest of the formula composition, amount, and preparation process are the same as those of Example 2.

[0079] Comparative Example 2

[0080] Comparative Example 2 is different from Example 2 in that the microwave sintering conditions in process step (2) are different, and the specific microwave sintering conditions are: gradually increasing the temperature from room temperature to 750°C at a rate of 50°C / min, and the holding time at 750°C is 8 min.

[0081] Comparative Example 3

[0082] Comparative Example 3 is different from Example 2 in that the microwave sintering conditions in process step (2) are different, and the microwave sintering conditions are as follows: gradually increasing the temperature from room temperature to 950°C at a rate of 50°C / min, and maintaining the temperature at 950°C for 8 min.

[0083] Comparative Example 4

[0084] Comparative Example 4 is different from Example 2 in that the microwave sintering conditions in process step (2) are different, and the microwave sintering conditions are as follows: gradually increasing the temperature from room temperature to 850°C at a rate of 40°C / min, and maintaining the temperature at 850°C for 8 min.

[0085] Comparative Example 5

[0086] Comparative Example 5 is different from Example 2 in that the microwave sintering conditions in process step (2) are different, and the microwave sintering conditions are as follows: gradually increasing the temperature from room temperature to 850°C at a rate of 60°C / min, and maintaining the temperature at 850°C for 8 min.

[0087] Comparative Example 6

[0088] Comparative Example 6 is different from Example 2 in that process step (4) uses hot-press sintering process, and the rest of the formulation composition, amount, and preparation process are the same as Example 2.

[0089] The hot-press sintering process conditions are as follows:

[0090] Phenolic resin powder is added to the mixed powder obtained in step (3) and mixed, and the mass ratio of the mixed powder and the phenolic resin powder is 8:2. The mixed powder is then loaded into a steel mold, and then placed into a hot-press curing machine to increase the temperature to 180°C, pressurized to 18 MPa, and cured for 1.5 hours. After the hot-press curing is completed, demolding is performed. The resin binder after demolding is placed into a secondary curing furnace, the secondary curing temperature is 170°C, the curing time is 10 hours, the temperature is decreased to room temperature, and the chamfered wheel is obtained after being taken out and sharpened.

[0091] Comparative Example 7

[0092] Comparative Example 7 is different from Example 2 in that the alloy powder for wrapping the diamond is different in the process, and the alloy powder in step (1) is composed of the following components in mass percentage: cobalt powder 20%, chromium powder 20%, nickel powder 20%, copper powder 20%, and manganese powder 20%. The rest of the formulation composition, amount, and preparation process are the same as Example 2.

[0093] Comparative Example 8

[0094] Compared with Example 2, the difference in Comparative Example 8 is that in process step (4), an unmodified resin liquid is added, that is, the rest of the resin liquid formulation, dosage and preparation process are the same as in Example 2.

[0095] Comparative Example 9

[0096] Resin-metal chamfering wheels produced by traditional hot pressing and sintering.

[0097] Its formula is as follows: 12% diamond, 30% green silicon carbide, 10% 500# copper powder, 10% zinc oxide, 5% aluminum oxide, 3% fiber powder, 10% hexagonal boron nitride, and 20% phenolic resin.

[0098] The preparation method is as follows: Mix the components in the formula, put the mixed powder into a steel mold, and then put it into a hot press curing machine to heat to 180°C, press to 18MPa, and cure for 1.5 hours. After hot press curing, demold the mold. Put the demolded resin-bonded grinding wheel into a secondary curing oven. The secondary curing temperature is 170°C and the curing time is 10 hours. Cool down to room temperature, take it out, and sharpen it to obtain a chamfered wheel.

[0099] Effect evaluation and performance testing

[0100] In Example 2 and Comparative Examples 1-9, resin diamond chamfering wheels of the same size were fabricated. The performance of the resin diamond chamfering wheels in each example was tested. The test items and results are shown in Tables 3-4.

[0101] (1) Bending strength test method

[0102] The bending strength was tested in accordance with GB / T 232-2010 using a universal electronic testing machine (Zhuhai Sansi Testing Technology Co., Ltd.), and the results were recorded in MPa.

[0103] (2) Impact strength test method

[0104] Impact strength was tested according to the specific provisions of national standard GB / T 229-2020. Bending strength was tested using a universal electronic testing machine (Zhuhai Sansi Testing Technology Co., Ltd.). The results are expressed in J / cm. 2 Record.

[0105] (3) High temperature resistance test method

[0106] High temperature resistance refers to the temperature at which the chamfering wheel softens when placed in an oven or the cracking temperature during hot pressing sintering (gas is released during the curing process of phenolic resin in the oven, making it prone to cracking). The higher the temperature, the better the high temperature resistance of the resin.

[0107] (4) On-site chamfering and grinding test

[0108] The chamfering wheel of each example was used to conduct chamfering and polishing tests on site ceramic tiles.

[0109] On-site working conditions: chamfering treatment was conducted on 800x800x10mm ceramic tiles after edge grinding treatment, the chamfering flatness requirement was 0.1-0.5mm, the speed was 45 pieces / min, i.e. 35m / min. The detection items included service life and corner collapse rate. The service life refers to the longest time limit for continuous use of the chamfering wheel, and the defective product rate refers to the proportion of the number of ceramic tiles with wave patterns or edge defects in 10,000 chamfered ceramic tiles.

[0110] Table 3 is the performance test data of the resin diamond chamfering wheel for ceramic processing of each example

[0111]

[0112]

[0113] Table 4 is the test data of the resin diamond chamfering wheel in use state of each example

[0114]

[0115] As shown in the above table and the accompanying Figures 1-3 As shown in the above table and the accompanying Compared with Example 2, the difference of Comparative Example 1 is that the alloy powder and diamond are not subjected to microwave sintering in process step (2), which reduces the bending strength and impact strength; because Comparative Example 1 is not subjected to the process of microwave sintering and crushing, but only bonded with other materials such as modified resin powder in the form of powder, it cannot well improve the overall strength, while the high-entropy alloy of the embodiment has very high strength, high-temperature resistance and other properties after microwave sintering, and after crushing, it is irregular in shape and has the effect of inlaying combination with other powders, and its physical properties are greatly improved.

[0116]

[0117] The difference between Comparative Example 2 and Example 2 is that the microwave sintering condition in process step (2) is different, that is, the microwave sintering temperature is less than 800 DEG C. Because the high-entropy alloy itself has strong high-temperature resistance, by increasing the sintering temperature, the density of the high-entropy alloy can be improved, and the diffusion of the diamond can be deepened to metallize the surface of the diamond. However, the temperature is too low, on the one hand, the powder sintering density is insufficient, and on the other hand, the temperature is not enough for the powder to metallize the surface of the diamond in the sintering process, which is not conducive to improving the holding force of the diamond.

[0118] The difference between Comparative Example 3 and Example 2 is that the microwave sintering condition in process step (2) is different, that is, the microwave sintering temperature is greater than 900 DEG C. By increasing the sintering temperature, the density of the high-entropy alloy can be improved. However, the temperature is too high, which will reduce the strength of the diamond itself, and will make the sharpness and service life of the diamond decrease in cutting.

[0119] The difference between Comparative Example 4 and Example 2 is that the microwave sintering condition in process step (2) is different, that is, the heating rate in microwave sintering is reduced to 40 DEG C / min, which affects the formation of nanocrystalline composition. When the heating rate is too slow, the grain size and density of the high-entropy alloy powder are irregular, which affects the physical properties. Moreover, the slow heating rate will increase the power consumption and increase the production cost.

[0120] The difference between Comparative Example 5 and Example 2 is that the microwave sintering condition in process step (2) is different, that is, the heating rate in microwave sintering is increased to 60 DEG C / min, which affects the formation of nanocrystalline composition. When the heating rate is too fast, the nanocrystalline composition in the high-entropy alloy powder grows rapidly and orderly, which makes the surface rough and the grain uniformity poor, thereby affecting the density and further affecting the physical properties. Therefore, selecting a suitable heating rate is helpful to the change of the performance.

[0121] The difference between Comparative Example 6 and Example 2 is that hot-pressing sintering process is used in process step (4). Because the temperature is too high and the pressure is too large, the casting liquid splashes and cannot be pressed into shape, which will cause serious mold sticking phenomenon, as shown in FIG. 1. Figure 3

[0122] The difference between Comparative Example 7 and Example 2 is that the alloy powder wrapped around the diamond in the process is different. Generally, adding AL can increase the bending strength and impact strength of the alloy itself, and it can be sintered and densified faster, which is more suitable for the use of ceramic tile chamfering.

[0123] The difference between Comparative Example 8 and Example 2 is that unmodified resin liquid is added in process step (4). The unmodified epoxy resin liquid itself has insufficient high-temperature resistance and strength performance, which makes the diamond holding force poor after the resin softens in the actual use process, and the diamond falls off. The combination between the resin and the filler abrasive is not strong, which leads to poor performance.​

[0124] The difference between Comparative Example 9 and Example 2 is that the resin is prepared by traditional hot pressing, and the difference is that the modified epoxy resin itself has better strength and high temperature resistance than phenolic resin, and is more suitable for the application scenario of the chamfer of the application.

[0125] The above embodiments are only preferred embodiments of the present application, and cannot be used to limit the scope of protection of the present application. Any non-essential changes and substitutions made by those skilled in the art on the basis of the present application shall fall within the scope of protection of the present application.

Claims

1. A method for preparing a high-temperature resistant resin diamond chamfering wheel for ceramic chamfering, characterized in that, Includes the following steps: (1) Preparation of alloy powder: Weigh out the required amounts of Co powder, Cr powder, Ni powder, Cu powder, Fe powder, and Al powder respectively, add them to a ball mill, and ball mill them. Place the ball-milled alloy powder into a box filled with argon gas, wet it with alcohol, remove it and let it dry to obtain alloy powder. (2) Preparation of diamond powder encapsulated in high-entropy alloy powder: The alloy powder and diamond of the formula were added to a ball mill for ball milling. The mixed powder after ball milling was prepared into a cold-pressed green body by cold isostatic pressing. The cold-pressed green body was then placed in a microwave sintering furnace for sintering. After sintering, it was cooled to room temperature with the furnace and then the sintered body was taken out. The sintered body was crushed by a crusher to obtain diamond powder coated with high-entropy alloy powder. (3) Mixing diamond powder with filler powder: Weigh out the diamond powder and filler powder coated with high-entropy alloy powder according to the formula, and use a mixer to mix the diamond powder coated with high-entropy alloy powder and filler powder evenly to obtain a mixed powder. (4) Casting resin abrasive: Add modified resin liquid and diluent, stir evenly, and finally add epoxy curing agent and stir evenly to obtain abrasive resin liquid; pour the mixed abrasive resin liquid into the casting mold, place the upper pressure plate on it, press at room temperature for 8-24 hours, take it out, and sharpen it to obtain a high temperature resistant resin diamond chamfering wheel for ceramic chamfering.

2. The method for preparing the high-temperature resistant resin diamond chamfering wheel for ceramic chamfering as described in claim 1, characterized in that, In step (1), the alloy powder is composed of the following components by mass percentage: 5-25% Co powder, 10-35% Cr powder, 8-28% Ni powder, 5-30% Cu powder, 10-25% Fe powder, and 10-20% Al powder, and the sum of the mass percentages of the above components is 100%.

3. The method for preparing the high-temperature resistant resin diamond chamfering wheel for ceramic chamfering as described in claim 1, characterized in that, In step (1), the operating parameters of the ball mill are a ball-to-material ratio of (18-22):1 and a rotation speed of 300-500 rpm.

4. The method for preparing the high-temperature resistant resin diamond chamfering wheel for ceramic chamfering as described in claim 1, characterized in that, In step (2), the weight ratio of the alloy powder to diamond is (50-70):45; the particle size of the diamond is 230-270 mesh.

5. The method for preparing a high-temperature resistant resin diamond chamfering wheel for ceramic chamfering as described in claim 1, characterized in that, In step (2), the operating parameters of the ball mill are a ball-to-material ratio of (4-8):1 and a mixing time of 2-4 hours.

6. The method for preparing the high-temperature resistant resin diamond chamfering wheel for ceramic chamfering as described in claim 1, characterized in that, In step (2), the microwave sintering conditions are as follows: gradually increase the temperature from room temperature to 800-900℃ at a rate of 50℃ / min, and hold at 800-900℃ for 6-10 minutes.

7. The method for preparing the high-temperature resistant resin diamond chamfering wheel for ceramic chamfering as described in claim 1, characterized in that, In step (3), the diamond powder and filler powder coated with the high-entropy alloy powder comprise the following components by mass percentage: 15-20% high-entropy alloy coated powder, 10-30% green silicon carbide, 5-10% 500# copper powder, 10-20% white corundum, 10-20% zinc oxide, 5-13% aluminum oxide, 3-15% fiber powder, 5-10% PVB, 1-10% nylon powder, 5-10% calcium carbonate, and 1-5% graphene, with the sum of the above components being 100% by mass.

8. The method for preparing the high-temperature resistant resin diamond chamfering wheel for ceramic chamfering as described in claim 1, characterized in that, In step (4), the mass ratio of the mixed powder to the modified resin liquid is 4:(5-7), the amount of the diluent added is 4-6% of the mass of the modified resin liquid, and the amount of the epoxy curing agent added is 25-35% of the mass of the modified resin liquid.

9. The method for preparing a high-temperature resistant resin diamond chamfering wheel for ceramic chamfering as described in claim 1, characterized in that, In step (4), the modified resin liquid is prepared by the following steps: adding modified polysulfone resin to epoxy resin, then adding epoxy resin active toughening agent, catalyst and defoamer, stirring evenly, placing it in an oven and heating at 120-150℃ for 2-3 hours, and then taking it out. The modified polysulfone resin is added at 15-40% of the epoxy resin mass, the epoxy resin active toughening agent is added at 1-10% of the epoxy resin mass, the catalyst is added at 2-5% of the epoxy resin mass, and the defoamer is added at 0.2-0.4% of the epoxy resin mass.

10. A high-temperature resistant resin diamond chamfering wheel for ceramic chamfering, characterized in that, It is prepared by the method for preparing high-temperature resistant resin diamond chamfering wheels for ceramic chamfering as described in any one of claims 1-9.

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