Isolating powder, method for preparing and using the same

Abstract

The application relates to an isolating powder, a preparation method and application of the isolating powder. The isolating powder comprises a first powder, a second powder and a crosslinked powder. The weight parts of the components are as follows: the first powder is 50-200 parts; the second powder is 100-300 parts; and the crosslinked powder is 50-200 parts. The first powder comprises 90-95% of zirconium dioxide in mass fraction; the second powder comprises 95-99% of zirconium dioxide in mass fraction; the particle size of the first powder is 300-1500 mu m; and the particle size of the second powder is 30-150 mu m. The isolating powder of the embodiment of the application comprises two kinds of zirconium dioxide with different purities, can adsorb organic matters with different molecular chain lengths, can sufficiently adsorb volatile organic solvents, and can avoid that the organic solvents cause the patch capacitors to be bonded. The first powder and the second powder are compounded, so that the particle size span of the isolating powder is large, the adsorption rate of the patch capacitor surface to the isolating powder is effectively improved, and the isolating powder can be sufficiently adsorbed on the surface of the patch capacitor.

Description

Technical Field

[0001] This application relates to the field of multilayer ceramic capacitor production, and in particular to an isolation powder, a method for preparing the isolation powder, and a method for applying the isolation powder. Background Technology

[0002] Surface mount capacitors, also known as multilayer ceramic capacitors (MLCCs), are essential components in the electronics industry, often referred to as the "rice of the electronics industry." During MLCC manufacturing, various organic solvents such as toluene, ethanol, dispersants, PVB, and adhesives are added. These solvents evaporate completely during the debinding and sintering processes. However, some organic solvents deposit on the surface of the MLCC product during evaporation, forming a solvent film. This film has a certain degree of viscosity, making the MLCC products prone to sticking together during sintering, ultimately resulting in defective products that are difficult to separate, causing significant economic losses. Summary of the Invention

[0003] The embodiments of this application aim to provide an isolation powder, a method for preparing the isolation powder, and a method for applying the isolation powder, so as to improve the isolation effect of the isolation powder and avoid organic solvents causing adhesion of the chip capacitors.

[0004] In a first aspect, to solve the above-mentioned technical problems, one technical solution adopted in the embodiments of this application is: providing an isolation powder comprising a first powder, a second powder, and a crosslinking powder. The weight parts of each component are: 50-200 parts of the first powder; 100-300 parts of the second powder; and 50-200 parts of the crosslinking powder; wherein, the first powder comprises 90%-95% zirconium dioxide by weight; the second powder comprises 95%-99% zirconium dioxide by weight; the particle size of the first powder is 300μm to 1500μm; and the particle size of the second powder is 30μm to 150μm.

[0005] In some embodiments, the first powder further includes at least one of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide.

[0006] In some embodiments, the second powder further includes at least one of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide.

[0007] In some embodiments, the crosslinked powder comprises starch.

[0008] In some embodiments, the particle size of the first powder is 300 μm to 600 μm.

[0009] In some embodiments, the particle size of the second powder is 30 μm to 80 μm.

[0010] In some embodiments, the crosslinked powder has a particle size of 35 μm to 200 μm.

[0011] Secondly, embodiments of this application provide a method for preparing the isolating powder as described in any of the first aspects, the method comprising: adding 50 to 200 parts by weight of a first powder with a particle size of 300 μm to 1500 μm to a stirrer, adjusting the rotation speed to 50 rpm / min to 200 rpm / min, and stirring for 5 min to 20 min; adding 100 to 300 parts by weight of a second powder with a particle size of 30 μm to 150 μm to the stirrer and mixing it with the first powder, adjusting the rotation speed to 100 rpm / min to 200 rpm / min, and stirring for 40 min to 80 min to obtain a composite powder; and adding 50 to 200 parts by weight of a crosslinked powder to the stirrer and mixing it with the composite powder to obtain the isolating powder.

[0012] Thirdly, embodiments of this application provide a method for applying the insulating powder as described in any of the first aspects in a chip capacitor, comprising: adding 50 to 200 parts by weight of the chip capacitor to a mixing tank, then adding 5 to 20 parts by weight of the insulating powder to the mixing tank, adjusting the rotation speed of the mixing tank to 120 rpm / min to 180 rpm / min, and stirring for 2 min to 10 min to obtain a chip capacitor coated with the insulating powder.

[0013] In some embodiments, the application method further includes: sintering the chip capacitor coated with insulating powder, and then removing the insulating powder by using a vibrator with a vibration frequency of 30Hz to 80Hz to obtain the chip capacitor product.

[0014] Unlike related technologies, this application provides an isolation powder comprising a first powder, a second powder, and a crosslinking powder. The weight percentages of each component are: 50-200 parts of the first powder; 100-300 parts of the second powder; and 50-200 parts of the crosslinking powder. The first powder comprises 90%-95% zirconium dioxide by weight; the second powder comprises 95%-99% zirconium dioxide by weight; the particle size of the first powder is 300 μm to 1500 μm; and the particle size of the second powder is 30 μm to 150 μm. The isolation powder of this application comprises two zirconium dioxides of different purities, which can adsorb organic compounds with different molecular chain lengths to fully adsorb volatilized organic solvents and prevent organic solvents from causing adhesion to the surface-mount capacitor. Furthermore, the combination of the first and second powders results in a large particle size range for the isolation powder, effectively increasing the adsorption rate of the isolation powder on the surface of the surface-mount capacitor, allowing the isolation powder to be fully adsorbed on the surface of the surface-mount capacitor. Attached Figure Description

[0015] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0016] Figure 1 This is a flowchart of some methods for preparing isolation powder provided in the embodiments of this application. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0018] It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, all of which are within the protection scope of this application. Furthermore, although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device schematic diagram or the order in the flowchart.

[0019] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application.

[0020] In a first aspect, embodiments of this application provide an isolating powder, which includes a first powder, a second powder, and a crosslinking powder. The weight parts of each component are: 50-200 parts of the first powder; 100-300 parts of the second powder; and 50-200 parts of the crosslinking powder. The first powder comprises 90%-95% zirconium dioxide by weight; the second powder comprises 95%-99% zirconium dioxide by weight; the particle size of the first powder is 300 μm to 1500 μm, and the particle size of the second powder is 30 μm to 150 μm.

[0021] Furthermore, the proportion of particles with a size distribution of 1000 μm to 1500 μm in the first powder is less than 5%, the proportion of particles with a size distribution of 500 μm to 1500 μm in the first powder is 70% to 75%, the proportion of particles with a size distribution of 400 μm to 1500 μm in the first powder is 80% to 90%, and the proportion of particles with a size distribution of 300 μm to 1500 μm in the first powder is greater than 95%.

[0022] In some embodiments, the particle size distribution of the first powder is 300 μm to 600 μm.

[0023] Furthermore, the content of particles with a diameter of 110 μm to 150 μm in the second powder is less than 5%, the content of particles with a diameter of 80 μm to 150 μm in the second powder is 30% to 60%, the content of particles with a diameter of 50 μm to 150 μm in the second powder is 80% to 90%, and the content of particles with a diameter of 30 μm to 150 μm in the second powder is greater than 95%.

[0024] In some embodiments, the particle size of the second powder is 30 μm to 80 μm.

[0025] It should be noted that the combination of the first powder and the second powder results in a large particle size range for the insulating powder, which effectively improves the adsorption rate of the insulating powder on the surface of the chip capacitor, allowing the insulating powder to be fully adsorbed on the surface of the chip capacitor.

[0026] In this embodiment, the first powder needs to be sintered together with the chip capacitor product. Therefore, the components of the first powder need to withstand high-temperature calcination, and no substances that affect the properties of the chip capacitor product can be introduced. The first powder is a powder with zirconium dioxide as the main component, wherein the mass percentage of zirconium dioxide in the first powder is 90% to 95%. Zirconia, also known as zirconium oxide, is a white crystal or powder with good high-temperature resistance, corrosion resistance, and wear resistance. The most significant characteristic of zirconium dioxide is its high-temperature stability; it can maintain structural stability at high temperatures, and therefore it is widely used in high-temperature materials, refractory materials, ceramic products, electronic devices, and other fields. In this embodiment, the first powder also includes at least one of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide. The mass percentage of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide in the first powder is 5% to 10%.

[0027] The second powder in this embodiment also needs to be sintered together with the chip capacitor product. Therefore, the components of the second powder need to withstand high-temperature calcination, and no substances that affect the properties of the chip capacitor product can be introduced. The second powder is a powder with zirconium dioxide as the main component, wherein the mass percentage of zirconium dioxide in the second powder is 95% to 99%. In this embodiment, the second powder also includes at least one of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide. Calcium oxide, silicon dioxide, iron oxide, and titanium dioxide account for 1% to 5% of the mass percentage of the first powder.

[0028] It should be noted that during the sintering of the surface mount capacitors, organic solvents will evaporate, and the molecular chain lengths in these solvents may vary. While both the first and second powders are primarily composed of zirconium dioxide, their purities differ. This is because zirconium dioxide of different purities exhibits varying adsorption effects on organic compounds with different molecular chain lengths. Generally, higher purity zirconium dioxide shows better adsorption for molecules with shorter molecular chains. This is because higher purity zirconium dioxide has little or no impurities and defects on its surface, resulting in higher surface activity and surface energy, allowing for better adsorption of shorter molecular chains. By adding zirconium dioxide of different purities, organic compounds with varying molecular chain lengths can be adsorbed, ensuring sufficient adsorption of the evaporated organic solvent and preventing the organic solvent from causing adhesion of the surface mount capacitors.

[0029] Crosslinked powder is a powder material that achieves crosslinking between inorganic compounds, thereby improving the performance and stability of the inorganic compounds. Crosslinked powder is widely used in various fields, such as medicine, chemistry, and materials. The crosslinked powder in this application embodiment includes starch. In this application embodiment, starch can achieve crosslinking between the first powder and the second powder, improving the stability and adsorption of the separating powder during use. The particle size of the crosslinked powder is 35 μm to 200 μm. Further, the content of particles with a particle size of 150 μm to 200 μm in the crosslinked powder is less than 5%, the content of particles with a particle size of 120 μm to 200 μm in the crosslinked powder is 20% to 60%, the content of particles with a particle size of 80 μm to 200 μm in the crosslinked powder is 80% to 90%, and the content of particles with a particle size of 35 μm to 200 μm in the crosslinked powder is greater than 95%.

[0030] This application provides an insulating powder, comprising a first powder, a second powder, and a crosslinking powder. The weight percentages of each component are: 50-200 parts of the first powder; 100-300 parts of the second powder; and 50-200 parts of the crosslinking powder. The first powder comprises 90%-95% zirconium dioxide by weight; the second powder comprises 95%-99% zirconium dioxide by weight; the particle size of the first powder is 300 μm to 1500 μm; and the particle size of the second powder is 30 μm to 150 μm. The insulating powder of this application includes two zirconium dioxides of different purities, which can adsorb organic compounds with different molecular chain lengths to fully adsorb volatilized organic solvents, preventing the organic solvents from causing adhesion to the surface-mount capacitor. Furthermore, the combination of the first and second powders results in a large particle size range for the insulating powder, effectively increasing the adsorption rate of the insulating powder on the surface of the surface-mount capacitor, allowing the insulating powder to be fully adsorbed on the surface of the surface-mount capacitor.

[0031] Secondly, embodiments of this application provide a method for preparing the isolation powder as described in the first aspect, please refer to... Figure 1 , Figure 1 This is a flowchart illustrating some methods for preparing isolation powder provided in the embodiments of this application. The methods include the following steps:

[0032] Step S1: Add 50 to 200 parts by weight of the first powder with a particle size of 300 μm to 1500 μm to the stirrer, adjust the speed to 50 rpm / min to 200 rpm / min, and stir for 5 min to 20 min.

[0033] Step S2: Add 100 to 300 parts by weight of the second powder with a particle size of 30 μm to 150 μm to the stirrer and mix it with the first powder. Adjust the speed to 100 rpm / min to 200 rpm / min and the stirring time to 40 min to 80 min to obtain the composite powder.

[0034] Step S3: Add 50 to 200 parts by weight of crosslinked powder to a stirrer and mix with the composite powder to obtain an isolation powder.

[0035] The first powder comprises 90% to 95% zirconium dioxide by mass, the second powder comprises 95% to 99% zirconium dioxide by mass, the cross-linked powder comprises starch, and the particle size of the cross-linked powder is 35 μm to 200 μm.

[0036] In some embodiments, the first powder further includes at least one of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide, and the second powder further includes at least one of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide.

[0037] Thirdly, embodiments of this application provide a method for applying the insulating powder of the first aspect in a chip capacitor. The method includes: adding 50 to 200 parts by weight of the chip capacitor to a mixing tank, then adding 5 to 20 parts by weight of the insulating powder to the mixing tank, adjusting the rotation speed of the mixing tank to 120 rpm / min to 180 rpm / min, and stirring for 2 min to 10 min to obtain a chip capacitor coated with the insulating powder.

[0038] In some embodiments, the application method further includes: sintering the chip capacitor coated with insulating powder, and then removing the insulating powder by using a vibrator with a vibration frequency of 30Hz to 80Hz to obtain the chip capacitor product.

[0039] The following description is based on specific embodiments:

[0040] Example 1

[0041] The specific preparation method of isolation powder A is as follows:

[0042] (1) Add 100 parts by weight of the first powder with a particle size of 300μm to 600μm to the stirrer, wherein the first powder includes zirconium dioxide with a mass ratio of 90% to 95%, adjust the speed to 100 rpm / min, and stir for 10 min.

[0043] (2) 200 parts by weight of the second powder with a particle size of 30μm to 80μm are added to a stirrer and mixed with the first powder. The second powder includes zirconium dioxide with a mass ratio of 95% to 99%. The stirring speed is adjusted to 150 rpm / min and the stirring time is 60 min to obtain the composite powder.

[0044] (3) Add 100 parts by weight of starch with a particle size of 80μm to 120μm to a stirrer and mix with the composite powder to obtain isolation powder A.

[0045] Example 2

[0046] The specific preparation method of isolation powder B is as follows:

[0047] (1) Add 100 parts by weight of the first powder with a particle size of 400μm to 1500μm to the stirrer, wherein the first powder includes zirconium dioxide with a mass ratio of 90% to 95%, adjust the speed to 200 rpm / min, and stir for 20 min.

[0048] (2) Add 300 parts by weight of the second powder with a particle size of 80μm to 150μm to the stirrer and mix it with the first powder. The second powder includes zirconium dioxide with a mass ratio of 95% to 99%. Adjust the speed to 200 rpm / min and the stirring time to 80 min to obtain the composite powder.

[0049] (3) Add 200 parts by weight of starch with a particle size of 120μm to 150μm to a stirrer and mix with the composite powder to obtain isolation powder B.

[0050] Example 3

[0051] The specific preparation method of the isolation powder C is as follows:

[0052] (1) Add 50 parts by weight of the first powder with a particle size of 300μm to 400μm to the stirrer, wherein the first powder includes zirconium dioxide with a mass ratio of 90% to 95%, adjust the speed to 50 rpm / min, and stir for 5 min.

[0053] (2) 100 parts by weight of the second powder with a particle size of 30μm to 50μm are added to a stirrer and mixed with the first powder. The second powder includes zirconium dioxide with a mass ratio of 95% to 99%. The speed is adjusted to 100 rpm / min and the stirring time is 40 min to obtain the composite powder.

[0054] (3) Add 50 parts by weight of starch with a particle size of 35μm to 80μm to a stirrer and mix with the composite powder to obtain isolation powder C.

[0055] Comparative Example 1

[0056] The specific preparation method of the isolation powder D is as follows:

[0057] (1) Add 100 parts by weight of the first powder with a particle size of 300μm to 600μm to the stirrer, wherein the first powder includes zirconium dioxide with a mass ratio of 90% to 95%, adjust the speed to 100 rpm / min, and stir for 10 min.

[0058] (2) Add 100 parts by weight of starch with a particle size of 80 μm to 120 μm to a stirrer and mix with the first powder to obtain isolated powder D.

[0059] Comparative Example 2

[0060] The specific preparation method of the isolation powder E is as follows:

[0061] (1) Add 200 parts by weight of a second powder with a particle size of 30μm to 80μm to a stirrer, wherein the second powder includes zirconium dioxide with a mass ratio of 95% to 99%, adjust the speed to 150 rpm / min, and stir for 60 min.

[0062] (2) Add 100 parts by weight of starch with a particle size of 80 μm to 120 μm to a stirrer and mix with the second powder to obtain isolated powder E.

[0063] The specific steps for applying the aforementioned isolation powders A to E in surface mount capacitors are as follows:

[0064] 100 parts by weight of chip capacitors were added to a mixing tank, and then 10 parts by weight of insulating powder were added to the mixing tank. The speed of the mixing tank was adjusted to 160 rpm / min, and the stirring time was 80 min to obtain chip capacitors coated with insulating powder.

[0065] After sintering the chip capacitor coated with insulating powder, the insulating powder is removed by a vibrator with a vibration frequency of 30Hz to 80Hz to obtain the chip capacitor product.

[0066] The particle distribution of isolation powders A to E was observed using an electron microscope, and the mass percentages of oxygen, zirconium, and zirconium dioxide in the isolation powders were determined by atomic absorption spectrometry.

[0067] The results of the detection of the mass percentages of oxygen, zirconium, and zirconium dioxide, as well as the particle distribution, in isolation powders A to E are shown in Table 1.

[0068] Table 1: Detection results of oxygen mass percentage, zirconium mass percentage, zirconium dioxide mass percentage, and particle distribution of the isolation powder in different embodiments.

[0069]

[0070]

[0071] As shown in Table 1, the particle distribution of the isolation powders prepared in Examples 1 to 3, as well as Comparative Examples 1 and 2, is uniform, and the mass percentage of zirconium dioxide is all above 90%, indicating that the purity of zirconium dioxide in isolation powders A to E all meet the requirements.

[0072] After applying isolation powders A to E to surface mount capacitors, the yield rate of the surface mount capacitors was tested, and the test results are shown in Table 2.

[0073]

[0074] Table 2 shows that the effects of insulating powders A to E on the yield of surface mount capacitors are 87.7%, 70.9%, 65.8%, 50.3%, and 53.8%, respectively. Comparing Example 1 with Comparative Examples 1 and 2, it can be seen that insulating powder A improves the yield by 37.4% and 33.9% compared to insulating powders D and E, respectively. This indicates that combining two powders of different purities and particle size distributions allows insulating powder A to fully adsorb the organic solvents volatilized from the surface mount capacitors, preventing the organic solvents from causing adhesion. Furthermore, the combination of the first and second powders results in a large particle size range for the insulating powder, effectively increasing the adsorption rate of the insulating powder on the surface of the surface mount capacitor, allowing the insulating powder to be fully adsorbed onto the surface of the surface mount capacitor. Since the purity of zirconium dioxide in the first powder is 90%–95% and the purity of zirconium dioxide in the second powder is 95%–99%, the high purity zirconium dioxide has higher surface activity and surface energy, and can better adsorb organic matter with shorter molecular chains.

[0075] Comparing Examples 1 and 2, and Examples 3, it can be seen that the yield of isolation powder A is 16.8% and 18.9% higher than that of isolation powder B and isolation powder C, respectively, indicating that isolation powder A in Example 1 has better adsorption properties for organic solvents volatilized from the surface mount capacitor. More specifically, isolation powder A, formed by combining a first powder with a particle size distribution of 300 μm to 600 μm and a second powder with a particle size distribution of 30 μm to 80 μm, exhibits superior adsorption performance for organic solvents, possibly because the aforementioned particle sizes are more likely to adhere to the surface mount capacitor and have more sufficient contact with the organic solvent.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above, which are not provided in detail for the sake of brevity; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An isolating powder, characterized in that, Includes first powder, second powder, and cross-linked powder; The weight parts of each component are as follows: 50-200 parts of the first powder; The second powder is 100-300 parts; 50-200 parts of cross-linked powder; The first powder comprises zirconium dioxide at a mass ratio of 90% to 95%. The second powder comprises zirconium dioxide at a mass ratio of 95% to 99%; The particle size of the first powder is 300 μm to 1500 μm; The particle size of the second powder is 30 μm to 150 μm; The cross-linked powder includes starch, and the particle size of the cross-linked powder is from 35 μm to 200 μm.

2. The isolating powder according to claim 1, characterized in that, The first powder also includes at least one of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide.

3. The isolating powder according to claim 1, characterized in that, The second powder also includes at least one of calcium oxide, silicon dioxide, iron oxide, and titanium dioxide.

4. The isolating powder according to claim 2, characterized in that, The particle size of the first powder is 300 μm to 600 μm.

5. The isolating powder according to claim 3, characterized in that, The particle size of the second powder is 30 μm to 80 μm.

6. A method for preparing the isolation powder as described in any one of claims 1 to 5, characterized in that, The method includes: Add 50 to 200 parts by weight of the first powder with a particle size of 300 μm to 1500 μm to the stirrer, adjust the speed to 50 rpm / min to 200 rpm / min, and stir for 5 min to 20 min. Add 100 to 300 parts by weight of the second powder with a particle size of 30 μm to 150 μm to a stirrer and mix it with the first powder. Adjust the speed to 100 rpm / min to 200 rpm / min and the stirring time to 40 min to 80 min to obtain the composite powder. Add 50 to 200 parts by weight of crosslinked powder to a stirrer and mix with the composite powder to obtain an isolation powder.

7. A method for applying the insulating powder as described in any one of claims 1 to 5 in a surface mount capacitor, characterized in that, include: Add 50 to 200 parts by weight of the chip capacitor to a mixing tank, and then add 5 to 20 parts by weight of the insulating powder to the mixing tank. Adjust the rotation speed of the mixing tank to 120 rpm / min to 180 rpm / min and the stirring time to 2 min to 10 min to obtain a chip capacitor coated with insulating powder.

8. The application method according to claim 7, characterized in that, The application method also includes: After sintering the chip capacitor coated with insulating powder, the insulating powder is removed by a vibrator with a vibration frequency of 30Hz to 80Hz to obtain the chip capacitor product.

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