A silicon wafer carrier frame

Abstract

The present invention discloses a silicon wafer carrier for containing and transporting silicon wafer units. The silicon wafer units include a crystal carrier and multiple silicon wafers to be separated and pasted on the crystal carrier. The multiple silicon wafers are divided into multiple silicon wafer groups. A clamping assembly is provided on the frame of the carrier. The clamping assembly includes multiple clamping parts arranged in sequence along the length direction of the containing space. The multiple clamping parts correspond to the multiple silicon wafer groups one by one to clamp the corresponding silicon wafer groups. An unlocking device is arranged beside the clamping parts. The multiple clamping parts come into contact with the unlocking device in sequence as the relative movement between the carrier and the unlocking device. The unlocking device is used to apply an external force to the clamping parts to make the clamping parts move away from the corresponding silicon wafer groups. This carrier can achieve independent clamping and release of each silicon wafer group, reduce manual intervention, improve operation efficiency, and avoid damage to the silicon wafers.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic technology, and in particular, to a silicon wafer carrier. Background Art

[0002] In the production process of silicon wafers, first, a silicon rod is cut into silicon wafers by a wire cutting machine. At this time, the silicon wafers are pasted on a crystal carrier through a resin plate. To achieve automatic debonding of the silicon wafers after wire cutting, it is necessary to transport the crystal carrier and the silicon wafers on the crystal carrier to a debonder for debonding so that the silicon wafers are separated from the crystal carrier. Subsequently, the separated silicon wafers are transported into a wafer inserter for wafer slicing and inserting.

[0003] During the transfer process of silicon wafers, a carrier is used, and the carrier carries the crystal carrier and silicon wafers to transfer between different workstations. In the prior art, the carrier clamps and limits the silicon wafers as a whole. When inserting wafers, it is necessary to release the limit of the silicon wafers as a whole, and it is impossible to achieve individual unlocking and loading of each unit silicon wafer. Since all the silicon wafers are released from the limit when inserting wafers, the uninserted silicon wafers are prone to tilt and squeeze, resulting in fragmentation or hidden cracks of the silicon wafers, seriously damaging the quality of the silicon wafers.

[0004] The above information disclosed in this background art is only used to increase the understanding of the background art of the present application. Therefore, it may include prior art that is not known to those of ordinary skill in the art. Summary of the Invention

[0005] In view of the problems pointed out in the background art, the present invention provides a silicon wafer carrier that can independently clamp and release the clamping of each unit silicon wafer, reduce manual intervention, improve operation efficiency, and avoid damage to the silicon wafers.

[0006] To achieve the above-mentioned invention object, the present invention adopts the following technical solutions to be realized:

[0007] The present invention provides a silicon wafer carrier for containing and transporting silicon wafer units. The silicon wafer units include a crystal carrier and multiple silicon wafers to be separated pasted on the crystal carrier. The multiple silicon wafers are divided into multiple silicon wafer groups. The carrier includes:

[0008] A frame, which forms a containing space for placing the silicon wafer units. The top of the containing space is open for the silicon wafer units to be loaded into the containing space from top to bottom. One end of the frame is provided with a discharge port communicating with the containing space;

[0009] A clamping assembly, which is arranged on the frame. The clamping assembly includes multiple clamping parts arranged in sequence along the length direction of the containing space. The multiple clamping parts correspond to the multiple silicon wafer groups one by one to clamp the corresponding silicon wafer groups;

[0010] An unlocking device is provided beside the clamping part. With the relative movement between the material frame and the unlocking device, multiple clamping parts sequentially come into contact with the unlocking device. The unlocking device is used to apply an external force to the clamping part to move the clamping part away from the corresponding silicon wafer group.

[0011] In some embodiments, the clamping part includes a second pin shaft that passes through the frame. An unlocking block is provided at the first end of the second pin shaft, and a clamping block is provided at the second end of the second pin shaft. A spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the frame.

[0012] Under the action of the unlocking device, each unlocking block moves in a direction away from the silicon wafer unit, driving the corresponding clamping block away from the corresponding silicon wafer group.

[0013] The clamping block moves in a direction close to the silicon wafer unit under the restoring force of the spring to clamp the corresponding silicon wafer group.

[0014] In some embodiments, the unlocking block includes a horizontal portion and a vertical portion. The horizontal portion is provided at the first end of the second pin shaft, and the vertical portion is used to interact with the unlocking device.

[0015] There is a certain distance between the vertical portion and the frame. An inclined surface is provided on the side of the vertical portion facing the frame. Along the discharging direction of the silicon wafer unit, the distance between the inclined surface and the frame first decreases and then increases.

[0016] The unlocking device includes a first roller. When relative movement occurs between the material frame and the unlocking device, the first roller moves between the inclined surface and the frame and comes into contact with the inclined surface. Through the relative displacement between the first roller and the inclined surface, the second pin shaft moves in a direction away from the silicon wafer unit.

[0017] In some embodiments, two inclined surfaces are provided on the vertical portion. One inclined surface is located above the horizontal portion, and the other inclined surface is located below the horizontal portion.

[0018] The unlocking device further includes a first mounting bracket in a U-shaped structure. The first rollers are respectively provided on the upper and lower walls of the first mounting bracket, and the first rollers come into contact with the inclined surfaces on the corresponding sides.

[0019] In some embodiments, the clamping assembly further includes a movable plate that extends along the length direction of the containing space, and multiple clamping parts are sequentially arranged along the length direction of the movable plate.

[0020] When the movable plate moves away from the accommodating space under the action of an external force, the movable plate drives all the clamping parts provided thereon to move away from the accommodating space synchronously.

[0021] In some embodiments, the movable plate is located outside the frame, and the second pin shaft passes through the frame and the movable plate;

[0022] When the movable plate moves away from the accommodating space, the movable plate pushes all the unlocking blocks to move away from the accommodating space synchronously, so that all the clamping blocks move away from the accommodating space synchronously.

[0023] In some embodiments, the material frame further includes an unlocking trigger part, the unlocking trigger part includes a first pin shaft, the first pin shaft passes through the frame, the first end of the first pin shaft is fixedly connected to the movable plate, and the second end of the first pin shaft is used to receive an external force to make the first pin shaft move along its penetrating direction in the frame, so as to drive the movable plate to move away from the accommodating space synchronously.

[0024] In some embodiments, the material frame further includes an anti-tipping component, which is arranged at one end far away from the discharge port, and the anti-tipping component is used to abut and support the silicon wafer.

[0025] In some embodiments, the anti-tipping component includes a second mounting frame and a second roller arranged on the second mounting frame, the second mounting frame is arranged on the frame, and the second roller is used to abut against the silicon wafer.

[0026] In some embodiments, the frame includes an upper frame and a lower frame, the upper frame is detachably connected to the lower frame, the clamping component is arranged on the lower frame, and a limiting structure for limiting the crystal carrier is arranged on the upper frame;

[0027] Move the upper frame away from the lower frame to separate the crystal carrier from the silicon wafer, and the silicon wafer remains in the lower frame.

[0028] Compared with the prior art, the advantages and positive effects of the present invention are:

[0029] The wafer cassette disclosed in the present application clamps the corresponding wafer group simultaneously through a plurality of clamping parts on the clamping assembly to achieve the clamping of all wafers. On the one hand, it ensures the reliability of the placement of the wafers in the cassette. On the other hand, it also facilitates the subsequent smooth debonding and separation of the crystal carrier and the wafers. At the same time, the unlocking of each clamping part for the wafer group is independent of each other. The unlocking device is used to unlock each clamping part in sequence, that is, the unlocking of each wafer group is independent of each other. In this way, when it is necessary to load the wafer units piece by piece in units of wafer groups, the clamping of the corresponding wafer group is released by the clamping part. When the unlocked wafer group is loaded piece by piece, the remaining wafer groups are still clamped by the corresponding clamping parts. In this way, the placement stability of the remaining unloaded wafer groups in the cassette can be ensured, preventing the wafers from tipping over or squeezing each other, avoiding wafer breakage, and ensuring the wafer quality.

[0030] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become clearer. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0032] Figure 1 FIG. 1 is a schematic structural diagram of a wafer cassette and a transfer cart according to an embodiment;

[0033] Figure 2 FIG. 2 is a second schematic structural diagram of a wafer cassette and a transfer cart according to an embodiment;

[0034] Figure 3 FIG. 3 is Figure 2 an enlarged view of part A in FIG. 1;

[0035] Figure 4 FIG. 4 is a schematic structural diagram of a wafer cassette and a wafer unit according to an embodiment;

[0036] Figure 5 FIG. 5 is a schematic structural diagram of an upper frame according to an embodiment;

[0037] Figure 6 FIG. 6 is a schematic structural diagram of a lower frame according to an embodiment;

[0038] Figure 7 FIG. 7 is a schematic structural diagram of a clamping assembly and a lower frame according to an embodiment;

[0039] Figure 8 FIG. 8 is a schematic structural diagram of a clamping assembly according to an embodiment;

[0040] Figure 9 is Figure 8 Cross-sectional view taken along line A-A in

[0041] Figure 10 is Figure 8 Cross-sectional view taken along line B-B in

[0042] Figure 11 Schematic structural view of the clamping part according to the embodiment;

[0043] Figure 12 is Figure 4 Enlarged view of part B in

[0044] Figure 13 Schematic structural view of the unlocking device according to the embodiment;

[0045] Figure 14 Schematic structural view of the anti-tipping assembly according to the embodiment;

[0046] Figure 15 Schematic structural view of the transfer trolley according to the embodiment;

[0047] Figure 16 Cross-sectional view of the transfer trolley according to the embodiment;

[0048] Figure 17 Schematic structural view of the silicon wafer unit according to the embodiment;

[0049] Reference numerals:

[0050] 100, silicon wafer unit; 110, crystal carrier; 111, extension part; 120, silicon wafer; 121, silicon wafer group;

[0051] 200, material frame;

[0052] 210, frame; 211, upper frame; 2111, first upper frame bracket; 2112, second upper frame bracket; 2113, opening; 2114, support frame; 2115, convex part; 2116, upper limit block; 2117, upper grasping part; 212, lower frame; 2121, first lower frame bracket; 2122, second lower frame bracket; 2123, lower frame horizontal frame; 2124, lower frame vertical frame; 2125, horizontal frame; 2126, lower limit block; 2127, lower grasping part; 213, containing space; 214, discharge port; 215, support roller;

[0053] 220, clamping assembly; 221, movable plate; 222, clamping part; 2221, second pin shaft; 2222, clamping block; 2223, unlocking block; 2224, second long slot; 2225, horizontal part; 2226, vertical part; 2227, inclined surface; 2228, step part; 2229, spring; 223, second limit shaft;

[0054] 230. Unlocking trigger part; 231. First pin shaft; 232. Third roller; 233. First limiting shaft; 234. First long through hole

[0055] 240. Anti-tipping component; 241. Second mounting bracket; 2411. Fixed bracket; 2412. Movable bracket; 2413. Torsion spring; 242. Second roller

[0056] 300. Unlocking device; 310. First mounting bracket; 320. First roller

[0057] 400. Transfer trolley; 410. Unlocking part; 411. Guiding contact surface; 4111. First section of the contact surface; 4112. Second section of the contact surface; 4113. Third section of the contact surface; 420. Limiting part; 430. Liquid collecting tank; 440. Drainage port; 450. Drainage valve; 460. Positioning part

[0058] L. Length direction of the material frame

[0059] W. Width direction of the material frame Detailed implementation mode

[0060] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0061] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0062] The terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0063] In the description of the present application, it should be noted that unless otherwise clearly specified or limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0064] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely means that the horizontal height of the first feature is lower than that of the second feature.

[0065] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0066] This embodiment discloses a silicon wafer carrier 200 for containing and transporting silicon wafer units 100 and transporting the silicon wafer units 100 between different working stations.

[0067] The silicon wafer unit 100 is as Figure 17 shown, and includes a crystal carrier 110 and multiple silicon wafers 120 to be separated and pasted on the crystal carrier 110. The multiple silicon wafers 120 are divided into multiple silicon wafer groups 121. Figure 17 In the figure, adjacent two silicon wafer groups 121 are separated by a dashed line.

[0068] When producing and processing silicon wafers, first, a silicon rod is cut into silicon wafers 120 by a cutting device. At this time, the silicon wafers 120 are pasted on a crystal carrier 110 through a resin plate. After cutting, the crystal carrier 110 together with the silicon wafers 120 is loaded into a material frame 200. The material frame 200 transports the silicon wafer unit 100 to a degumming station to separate the crystal carrier 110 from the silicon wafers 120, and then the separated silicon wafers 120 are transported to an inserting station by the material frame 200 for inserting. After inserting, the silicon wafers 120 are cleaned.

[0069] Referring to Figures 4 to 8 , the material frame 200 in this embodiment includes a frame 210, a clamping assembly 220, an unlocking device 300, etc. The material frame 200 has functions such as storing, clamping, unlocking and clamping, and protecting the silicon wafers 120 for the silicon wafer unit 100.

[0070] A containing space 213 for containing the silicon wafer unit 100 is formed inside the frame 210. The top of the containing space 213 is open for the silicon wafer unit 100 to be loaded into the containing space 213 from top to bottom. An outlet 214 communicating with the containing space 213 is provided at one end of the frame 210. In subsequent operation processes, the degummed silicon wafers 120 go out from the outlet 214.

[0071] The frame 210 serves as an installation carrier for the clamping assembly 220, and at the same time, the frame 210 encloses the containing space 213 for containing the silicon wafer unit 100.

[0072] The clamping assembly 220 is used to clamp the silicon wafer unit 100. On the one hand, the clamping assembly 220 can clamp the entire silicon wafer unit 100 at the same time; on the other hand, the clamping assembly 220 can independently unlock each silicon wafer group 121.

[0073] There are two clamping assemblies 220, located on opposite sides of the containing space 213 to clamp opposite sides of the silicon wafer unit 100.

[0074] The clamping assembly 220 includes a plurality of clamping parts 222 arranged in sequence along the length direction of the containing space 213 (i.e., the length direction L of the material frame 200). The plurality of clamping parts 222 correspond to the plurality of silicon wafer groups 121 one by one to clamp the corresponding silicon wafer groups 121. Each clamping part 222 moves in a direction away from the silicon wafers 120 to release the clamping of the corresponding silicon wafer group 121.

[0075] That is to say, each wafer group 121 is clamped by the corresponding clamping part 222. When all the clamping parts 222 clamp the corresponding wafer groups 121, the entire wafer unit 100 is clamped. When it is necessary to load the wafer unit 100 in pieces with the wafer group 121 as the unit, the clamping part 222 releases the clamping of the corresponding wafer group 121. When the unlocked wafer group 121 is loaded in pieces, the remaining wafer groups 121 are still clamped by the corresponding clamping parts 222. In this way, the placement stability of the remaining unloaded wafer groups 121 in the cassette 200 can be ensured, preventing the wafers 120 from toppling or squeezing each other, avoiding breakage of the wafers 120, and ensuring the quality of the wafers 120.

[0076] The unlocking of the clamping part 222 on the wafer group 121 is achieved through the interaction between the unlocking device 300 and the clamping part 222. Specifically, the unlocking device 300 is arranged beside the clamping part 222. A plurality of clamping parts 222 come into contact with the unlocking device 300 in sequence as the cassette 200 and the unlocking device 300 move relative to each other. The unlocking device 300 is used to apply an external force to the clamping part 222 so that the clamping part 222 moves away from the corresponding wafer group 121, that is, releases the clamping of the wafer group 121.

[0077] In the cassette 200 of this embodiment, a plurality of clamping parts 222 on the clamping assembly 220 clamp the corresponding wafer groups 121 at the same time to achieve the clamping of all the wafers. On the one hand, it ensures the reliable placement of the wafers 120 in the cassette 200. On the other hand, it also facilitates the subsequent smooth debonding and separation of the crystal carrier 110 and the wafers 120. At the same time, the unlocking of each clamping part 222 on the wafer group 121 is independent of each other. The unlocking device 300 unlocks each clamping part 222 in sequence, that is, the unlocking of each wafer group 121 is independent of each other. In this way, when it is necessary to load the wafer unit 100 in pieces with the wafer group 121 as the unit, the clamping part 222 releases the clamping of the corresponding wafer group 121. When the unlocked wafer group 121 is loaded in pieces, the remaining wafer groups 121 are still clamped by the corresponding clamping parts 222. In this way, the placement stability of the remaining unloaded wafer groups 121 in the cassette 200 can be ensured, preventing the wafers 120 from toppling or squeezing each other, avoiding breakage of the wafers 120, and ensuring the quality of the wafers 120.

[0078] In some embodiments, referring to Figure 9 , the clamping part 222 includes a second pin shaft 2221. The second pin shaft 2221 passes through the frame 210. The second pin shaft 2221 can move along the direction passing through the frame 210. An unlocking block 2223 is provided at the first end of the second pin shaft 2221, and a clamping block 2222 is provided at the second end of the second pin shaft 2221. A spring 2229 is sleeved on the second pin shaft 2221, and the spring 2229 is located between the clamping block 2222 and the frame 210.

[0079] Each unlocking block 2223 moves away from the silicon wafer unit 100 under the action of the unlocking device 300, driving the corresponding clamping block 2222 away from the corresponding silicon wafer group 121 to unlock the corresponding silicon wafer group 121.

[0080] The clamping block 2222 moves towards the silicon wafer unit 100 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121.

[0081] In some embodiments, the cooperation structure between the unlocking device 300 and the clamping part 222 is as follows. Refer to Figures 10 to 13 :

[0082] The unlocking block 2223 includes a transverse part 2225 and a vertical part 2226 of an integral structure. The transverse part 2225 is used to abut against the movable plate 221, and the vertical part 2226 is used to act with the unlocking device 300. Specifically, one end of the transverse part 2225 is connected to the second pin shaft 2221, a step part 2228 is formed between the transverse part 2225 and the second pin shaft 2221, and the other end of the transverse part 2225 is connected to the vertical part 2226.

[0083] There is a certain distance between the vertical part 2226 and the movable plate 221. An inclined surface 2227 is provided on the side of the vertical part 2226 facing the frame 210. Along the discharging direction of the silicon wafer 120, the distance between the inclined surface 2227 and the movable plate 221 first decreases and then increases.

[0084] The unlocking device 300 includes a first roller 320. When a relative movement occurs between the material frame 200 and the unlocking device 300, the first roller 320 moves between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves away from the silicon wafer 120.

[0085] Specifically, the unlocking device 300 is fixedly installed beside the material frame 200. There is no connection relationship between the unlocking device 300 and the material frame 200. The unlocking device 300 can be fixedly installed on other installation carriers outside the material frame 200. Two clamping components 220 are provided corresponding to the material frame 200, and two unlocking devices 300 are also provided. Each unlocking device 300 is used to act on the clamping component 220 on the corresponding side. When the silicon wafers 120 in the material frame 200 need to be sliced in units of the silicon wafer group 121, the material frame 200 moves horizontally under the action of an external force, and a relative movement is generated between the material frame 200 and the unlocking device 300. Along the movement direction of the material frame 200, each clamping part 222 contacts the unlocking device 300 one by one in sequence. The first roller 320 moves between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120, driving the clamping block 2222 away from the silicon wafer 120, that is, releasing the clamping of the corresponding silicon wafer group 121, thereby facilitating the slicing operation of the unlocked silicon wafer group 121 by the device at the subsequent station.

[0086] Further, two inclined surfaces 2227 are provided on the vertical portion 2226. One inclined surface 2227 is located above the horizontal portion 2225, and the other inclined surface 2227 is located below the horizontal portion 2225. The unlocking device 300 further includes a first mounting bracket 310 with a U-shaped structure. First rollers 320 are respectively provided on the upper and lower walls of the first mounting bracket 310, and the first rollers 320 contact the inclined surfaces 2227 on the corresponding side. In this way, the unlocking effect of the unlocking device 300 on the clamping part 222 is improved, and the unlocking reliability is improved.

[0087] In some embodiments, the clamping component 220 further includes a movable plate 221. The movable plate 221 extends along the length direction of the accommodation space 213, and a plurality of clamping parts 222 are arranged in sequence along the length direction of the movable plate 221.

[0088] When the movable plate 221 moves in a direction away from the accommodation space 213 under the action of an external force, the movable plate 221 drives all the clamping parts 222 provided thereon to move synchronously in a direction away from the accommodation space 213, realizing an increase in the distance between the two opposite clamping components 220, which facilitates the silicon wafers to be loaded into the accommodation space 213 from top to bottom.

[0089] Further, the movable plate 221 is located outside the frame 210. Specifically, refer to Figure 6 and Figure 9, the material frame 200 includes two relatively arranged transverse frames 2125 that extend along the length direction of the loading space 213. The movable plate 221 is located outside the transverse frame 2125, and the second pin shaft 2221 passes through the transverse frame 2125 and the movable plate 221. When the movable plate 221 moves away from the loading space 213 under an external force, the movable plate 221 pushes all the unlocking blocks 2223 to move synchronously away from the loading space 213, causing all the clamping blocks 2222 to move away from the loading space 213. Specifically, a step portion 2228 is formed between the unlocking block 2223 and the second pin shaft 2221. When the movable plate 221 moves away from the loading space 213, the movable plate 221 abuts against the step portion 2228 to push the unlocking block 2223 to move synchronously. The unlocking block 2223 drives the second pin shaft 2221 and the clamping block 2222 to move synchronously away from the loading space 213, and the spring 2229 is compressed.

[0090] After the external force acting on the movable plate 221 disappears, the clamping block 2222 moves towards the silicon wafer 120 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121.

[0091] Further, a second limiting shaft 223 is provided on the transverse frame 2125, and a second long through hole 2224 is provided on the second pin shaft 2221. The second limiting shaft 223 is inserted into the second long through hole 2224 to prevent the second pin shaft 2221 from rotating.

[0092] In some embodiments, referring to Figure 4 and Figure 14 , the material frame 200 further includes an anti-tipping component 240 which is used to abut and support the silicon wafer 120. The anti-tipping component 240 is provided at one end away from the discharge port 214. When the transfer trolley 400 pushes the material frame 200 to move forward, the silicon wafer 120 has a tendency to tip backward (i.e., the side opposite to the moving direction of the material frame 200). By the abutment of the anti-tipping component 240 and the silicon wafer 120, the silicon wafer 120 is prevented from tipping.

[0093] The anti-tipping component 240 includes a second mounting frame 241 and second rollers 242 provided on the second mounting frame 241. The second mounting frame 241 is provided on the frame 210, and the second rollers 242 are used to abut against the silicon wafer 120. A plurality of second rollers 242 are arranged at intervals in the vertical direction, such as two, which have multiple contacts with the silicon wafer 120 in the vertical height direction, improving the anti-tipping reliability.

[0094] Further, the second mounting bracket 241 includes a fixed bracket 2411 and a movable bracket 2412. The fixed bracket 2411 is fixedly arranged on the frame 210. The movable bracket 2412 is rotatably connected to the fixed bracket 2411. A torsion spring 2413 is arranged between the movable bracket 2412 and the fixed bracket 2411. The second roller 242 is arranged on the movable bracket 2412. By rotating the movable bracket 2412 relative to the fixed bracket 2411, it can adapt to the bumps generated during the transportation of the material box 200 and avoid the second roller 242 from hard squeezing the silicon wafer 120.

[0095] In some embodiments, referring to Figures 4 to 7 , the frame 210 includes an upper frame 211 and a lower frame 212. The upper frame 211 and the lower frame 212 are detachably connected. Figure 5 As shown in the upper frame 211, Figure 6 As shown in the lower frame 212, Figure 7 As shown in the structure where the clamping assembly 220 and the anti-tipping assembly 240 are arranged on the lower frame 212.

[0096] A containing space 213 for containing the silicon wafers 120 is formed inside the lower frame 212. The top of the containing space 213 is open. An outlet 214 communicating with the containing space 213 is arranged at one end of the lower frame 212.

[0097] The upper frame 211 is detachably arranged on the top of the lower frame 212. An opening 2113 vertically aligned and communicating with the containing space 213 is arranged on the upper frame 211. The silicon wafer unit 100 is loaded into the lower containing space 213 through the opening 2113. A limiting structure for limiting the crystal carrier 110 is arranged on the upper frame 211 to ensure the stable placement of the silicon wafer unit 100 in the material box 200.

[0098] Move the upper frame 211 away from the lower frame 212 to separate the crystal carrier 110 from the silicon wafer 120. The silicon wafer 120 remains in the lower frame 212. Specifically, move the upper frame 211 away from the lower frame 212 through equipment such as a manipulator. Since there is a limiting connection relationship between the upper frame 211 and the crystal carrier 110, and the lower silicon wafer 120 is clamped by the clamping assembly 220, when the upper frame 211 is moved away from the lower frame 212, the upper frame 211 drives the crystal carrier 110 to separate from the silicon wafer 120 together, realizing the degumming separation of the crystal carrier 110 and the silicon wafer 120.

[0099] In this embodiment, through the upper and lower split structure of the material box 200, combined with the clamping of the silicon wafer 120 by the clamping assembly 220 in the lower frame 212 and the limiting fixation of the crystal carrier 110 by the upper frame 211, by separating the upper frame 211 from the lower frame 212, the separation of the crystal carrier 110 and the silicon wafer 120 can be realized, and no special degumming equipment is required.

[0100] Further, referring toFigure 4 , Figure 5 and Figure 17 , the front and rear ends of the crystal carrier 110 unit are respectively provided with extension parts 111, and two spaced convex parts 2115 are arranged on the corresponding side of the upper frame 211. The extension parts 111 are clamped between the two convex parts 2115 to realize the limit fixation of the crystal carrier 110.

[0101] Further, the upper frame 211 includes two relatively arranged upper frame first brackets 2111 and two relatively arranged upper frame second brackets 2112. The upper frame first brackets 2111 extend along the length direction L of the material frame 200, and the upper frame second brackets 2112 extend along the width direction W of the material frame 200. Two spaced support frames 2114 are arranged between the two upper frame first brackets 2111, and there is a certain distance between the support frames 2114 and the corresponding side upper frame second brackets 2112. The convex part 2115 is arranged on the support frame 2114.

[0102] Further, the lower frame 212 includes two relatively arranged lower frame first brackets 2121 and two relatively arranged lower frame second brackets 2122. The lower frame second brackets 2122 include lower frame transverse frames 2123, and lower frame vertical frames 2124 are respectively arranged at the opposite ends of the lower frame transverse frames 2123. The lower frame first brackets 2121 extend along the length direction K of the material frame 200, the lower frame transverse frames 2123 extend along the width direction W of the material frame 200, and the lower frame vertical frames 2124 extend along the height direction of the material frame 200.

[0103] The bottom of the upper frame 211 is detachably connected to the top of the lower frame vertical frame 2124 to realize the detachable connection between the upper frame 211 and the lower frame 212.

[0104] Further, referring to Figures 4 to 6 , the bottom of the upper frame 211 is provided with an upper limit block 2116, and the top of the lower frame vertical frame 2124 is provided with a lower limit block 2126. The upper limit block 2116 and the lower limit block 2126 are adapted through a concave-convex structure to realize the cooperation between the upper frame 211 and the lower frame 212. For example, the upper limit block 2116 is provided with a concave shape, and the lower limit block 2126 is provided with a convex shape, and the concave shape and the convex shape are adapted.

[0105] In some other embodiments, the upper frame 211 and the lower frame 212 can be detachably connected by means of bolts, pins, etc.

[0106] Further, referring to Figure 5 , the outer side of the upper frame 211 is provided with an upper grasping part 2117, and the upper grasping part 2117 is for external force to grasp to separate the upper frame 211 from the lower frame 212.

[0107] Referring to Figure 6, a lower gripping portion 2127 is provided on the outer side of the lower frame 212. The lower gripping portion 2127 is for being gripped by an external force to transport the material frame 200.

[0108] Furthermore, support rollers 215 are provided at the bottom of the lower frame 212. The support rollers 215 are arranged at intervals along the width direction W of the material frame 200, and the support rollers 215 are in abutting contact with the bottom of the silicon wafer 120.

[0109] The gap between two adjacent support rollers 215 facilitates the water on the silicon wafer 120 to fall into the lower transfer cart 400.

[0110] In some embodiments, the material frame 200 further includes an unlocking trigger portion 230. The unlocking trigger portion 230 includes a first pin shaft 231. The first pin shaft 231 passes through the transverse frame 2125. The first end of the first pin shaft 231 is fixedly connected to the movable plate 221. The second end of the first pin shaft 231 is for receiving an external force so that the first pin shaft 231 moves along its penetrating direction in the transverse frame 2125 to drive the movable plate 221 to move synchronously away from the containing space 213. The movable plate 221 then drives all the clamping portions 222 to move synchronously away from the containing space 213. In this way, the distance between two relatively arranged clamping assemblies 220 increases, facilitating the silicon wafer unit 100 to be placed into the material frame 200 from top to bottom.

[0111] In some embodiments, the material frame 200 is transported between the cutting station and the degumming station by a transfer cart 400. Refer to Figure 1 and Figure 2 , first place the material frame 200 on the transfer cart 400, then place the cut silicon wafer unit 100 into the material frame 200, and the transfer cart 400 transports the material frame 200 to the next station.

[0112] The structure of the transfer cart 400 refers to Figure 15 and Figure 16 , and the transfer cart 400 has functions such as storing, limiting, and transporting the material frame 200.

[0113] An unlocking portion 410 is provided on the transfer cart 400. The unlocking portion 410 is used to interact with the unlocking trigger portion 230 on the material frame 200 to provide an external force to the unlocking trigger portion 230. Specifically, after the material frame 200 is placed on the transfer cart 400, the unlocking portion 410 contacts the unlocking trigger portion 230, and the unlocking portion 410 triggers the unlocking trigger portion 230 to act. The movable plate 221 moves away from the containing space 213 under the action of the unlocking trigger portion 230, and the movable plate 221 drives a plurality of clamping portions 222 provided thereon to move synchronously away from the containing space 213.

[0114] During application, before placing the silicon wafer unit 100 into the cassette 200, the cassette 200 is first placed on the transfer trolley 400. At this time, the unlocking part 410 contacts the unlocking trigger part 230, and the effect is that the movable plate 221 moves away from the accommodating space 213 under the action of the unlocking trigger part 230. The movable plate 221 drives a plurality of clamping parts 222 provided thereon to synchronously move away from the accommodating space 213, that is, the distance between two opposite clamping assemblies 220 increases. In this way, it is convenient for the silicon wafer unit 100 to be loaded into the accommodating space 213 from top to bottom.

[0115] The cassette 200 is provided with a limiting structure for limiting the crystal carrier 110. By limiting the crystal carrier 110 through the cassette 200, the placement stability of the silicon wafer unit 100 in the cassette 200 is ensured, and the silicon wafers 120 are prevented from tipping or shifting.

[0116] After the silicon wafer unit 100 is placed into the cassette 200, the transfer trolley 400 transports the cassette 200 to the next working station, specifically the debonding station. After arriving at the debonding station, the cassette 200 is taken off the transfer trolley 400 by means of a manipulator or other equipment. At this time, the unlocking part 410 is separated from the unlocking trigger part 230, and the clamping assembly 220 automatically moves towards the silicon wafer unit 100 under the restoring force of the restoring part, clamping the silicon wafer unit 100. After the silicon wafer unit 100 is clamped, it is convenient for the silicon wafer unit 100 to be debonded at the debonding station. At this time, the silicon wafers 120 are clamped by the clamping assembly 220, which is convenient for the smooth separation of the crystal carrier 110 and the silicon wafers 120.

[0117] After the silicon wafer unit 100 is debonded, it is then transported by the cassette 200 to the next working station, specifically the wafer splitting and loading station, that is, the silicon wafers 120 are split in units of wafer groups 121. The split silicon wafers 120 are convenient for subsequent wafer inserting operations. When the silicon wafers 120 are split in units of wafer groups 121, the clamping parts 222 release the clamping of the corresponding wafer groups 121. When the unlocked wafer groups 121 are split and loaded, the remaining wafer groups 121 are still clamped by the corresponding clamping parts 222. During this process, through the interaction between the unlocking device 300 and the clamping parts 222, the unlocking of the clamping parts 222 for the wafer groups 121 is realized.

[0118] According to the silicon wafer production process, the usage method of the silicon wafer transfer device composed of the cassette and the transfer trolley is as follows:

[0119] When transporting the cut silicon wafer unit 100, first place the material frame 200 on the transfer trolley 400. The unlocking part 410 contacts the unlocking trigger part 230, and the unlocking part 410 triggers the unlocking trigger part 230 to act. All the clamping parts 222 move synchronously away from the containing space 213 under the drive of the movable plate 221, facilitating the silicon wafer unit 100 to be loaded into the containing space 213 from top to bottom. At this time, the clamping assembly 220 does not clamp the silicon wafer 120.

[0120] The material frame 200 is provided with a limiting structure for limiting the crystal carrier 110 to ensure the stable placement of the silicon wafer unit 100 in the material frame 200.

[0121] After the transfer trolley 400 transports the material frame 200 to the next working station, the material frame 200 is removed from the transfer trolley 400. The unlocking part 410 is separated from the unlocking trigger part 230, and all the clamping parts 222 move towards the silicon wafer unit 100 under the action of the reset part to clamp the silicon wafer 120, facilitating the de-bonding separation of the crystal carrier 110 and the silicon wafer 120.

[0122] The material frame 200 transfers the silicon wafer 120 to the next working station, and the silicon wafers 120 in the material frame 200 are sliced in units of silicon wafer groups 121. At this time, a relative movement occurs between the material frame 200 and the unlocking device 300, and multiple clamping parts 222 sequentially contact the unlocking device 300 along with the relative movement between the material frame 200 and the unlocking device 300. The unlocking device 300 applies an external force to the clamping parts 222 to make the clamping parts 222 move away from the corresponding silicon wafer group 121 and release the clamping of the silicon wafer group 121.

[0123] In this embodiment, through the cooperation structure between the transfer trolley 400 and the material frame 200, the clamping mechanism on the material frame 200 is triggered. On the one hand, when the material frame 200 cooperates with the transfer trolley 400, the clamping mechanism is in an unlocked state to facilitate the placement of the silicon wafer 120 into the material frame 200. On the other hand, when the material frame 200 is separated from the transfer trolley 400, the clamping mechanism automatically clamps the whole silicon wafer 120, improving the placement reliability of the silicon wafer 120 during transportation and also facilitating the subsequent de-bonding separation of the crystal carrier 110 and the silicon wafer 120. When the silicon wafers 120 are sliced and loaded, through the unlocking device 300, the material frame 200 can also independently release the clamping of each silicon wafer group 121, thereby avoiding damage to the silicon wafers 120, reducing manual intervention, and improving the operation efficiency.

[0124] In some embodiments, a roller (denoted as the third roller 232) is provided at the second end of the first pin shaft 231. Referring again to Figure 3 、 Figure 15 and Figure 16, the unlocking part 410 is a column provided on the transfer trolley 400. A guiding contact surface 411 is provided at the upper end of the column on the side facing the third roller 232. When the material frame 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 moves from top to bottom along the guiding contact surface 411, so as to drive the first pin shaft 231 to move away from the containing space 213. Since the first pin shaft 231 is fixedly connected to the movable plate 221, the movable plate 221 is also driven to move away from the containing space 213 synchronously.

[0125] Further, referring to Figure 16 , the guiding contact surface 411 includes a first contact surface section 4111, a second contact surface section 4112, and a third contact surface section 4113 from top to bottom. The second contact surface section 4112 extends in the vertical direction. The first contact surface section 4111 extends obliquely away from the third roller 232 from the top of the second contact surface section 4112. The third contact surface section 4113 extends obliquely towards the third roller 232 from the bottom of the second contact surface section 4112.

[0126] When the material frame 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 first contacts the first contact surface section 4111. The inclined first contact surface section 4111 plays a preliminary positioning role for the placement of the material frame 200. As the material frame 200 continues to be lowered, during the movement of the third roller 232 along the inclined first contact surface section 4111, the first pin shaft 231 is gradually pushed away from the containing space 213. After the third roller 232 moves onto the second contact surface section 4112, the outward movement of the first pin shaft 231 stops. As the material frame 200 continues to be lowered, when the third roller 232 moves to the lower end of the second contact surface section 4112, the third contact surface section 4113 stops the movement of the third roller 232, and the material frame 200 is placed in place.

[0127] Further, each movable plate 221 is provided with two unlocking trigger parts 230. The two unlocking trigger parts 230 are provided at opposite ends of the movable plate 221. That is, each material frame 200 is provided with four unlocking trigger parts 230. Correspondingly, four unlocking parts 410 are provided on the transfer trolley 400, as Figure 15 shown. The four unlocking parts 410 are used, on the one hand, to contact the corresponding unlocking trigger parts 230, and on the other hand, to play a guiding and pre-positioning role for the placement of the material frame 200.

[0128] Further, a first limiting shaft 233 is provided on the transverse frame 2125. A first long through hole 234 is provided on the first pin shaft 231. The first limiting shaft 233 passes through the first long through hole 234 to prevent the first pin shaft 231 from rotating.

[0129] In some embodiments, referring to Figure 15 and Figure 16, a limiting portion 420 is provided on the vehicle body of the transfer trolley 400. The limiting portion 420 is a limiting protrusion arranged on the peripheral side of the material box 200. The limiting portion 420 is used to limit the material box 200 to ensure the stable placement of the material box 200 on the transfer trolley 400.

[0130] Furthermore, a liquid collecting tank 430 is provided on the transfer trolley 400. The liquid collecting tank 430 is located below the material box 200. The liquid collecting tank 430 is used to collect the liquid dripping from the silicon wafer 120. A liquid discharge port 440 and a liquid discharge valve 450 are provided at the lower position of the liquid collecting tank 430 for easy liquid discharge.

[0131] Furthermore, a positioning portion 460 is provided at the moving front end of the transfer trolley 400. The positioning portion 460 is used for positioning when the transfer trolley 400 moves to a specified position.

[0132] In the description of the above embodiments, the specific features, structures, materials or characteristics can be combined in a suitable manner in any one or more embodiments or examples.

[0133] The above is only the specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A silicon wafer frame for containing and transporting silicon wafer units. The silicon wafer units include a crystal carrier and multiple silicon wafers to be separated and pasted on the crystal carrier. The multiple silicon wafers are divided into multiple silicon wafer groups. It is characterized in that: The frame includes: A frame, inside which a containing space for placing the silicon wafer units is formed. The top of the containing space is open for the silicon wafer units to be loaded into the containing space from top to bottom. One end of the frame is provided with a discharge port communicating with the containing space; A clamping assembly, which is arranged on the frame. The clamping assembly includes multiple clamping parts arranged in sequence along the length direction of the containing space. The multiple clamping parts correspond to the multiple silicon wafer groups one by one to clamp the corresponding silicon wafer groups; An unlocking device, which is arranged beside the clamping part. The multiple clamping parts sequentially contact the unlocking device as the relative movement between the frame and the unlocking device occurs. The unlocking device is used to apply an external force to the clamping part to make the clamping part move away from the corresponding silicon wafer group; The clamping part includes a second pin shaft, which passes through the frame. An unlocking block is provided at the first end of the second pin shaft, and a clamping block is provided at the second end of the second pin shaft. A spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the frame; Each unlocking block moves in a direction away from the silicon wafer unit under the action of the unlocking device, driving the corresponding clamping block away from the corresponding silicon wafer group; The clamping block moves in a direction close to the silicon wafer unit under the restoring force of the spring to clamp the corresponding silicon wafer group.

2. The silicon wafer frame according to claim 1, It is characterized in that, The unlocking block includes a horizontal part and a vertical part. The horizontal part is arranged at the first end of the second pin shaft, and the vertical part is used to act with the unlocking device; There is a certain distance between the vertical part and the frame. An inclined surface is provided on the side of the vertical part facing the frame. Along the discharge direction of the silicon wafer unit, the distance between the inclined surface and the frame first decreases and then increases; The unlocking device includes a first roller. When relative movement occurs between the frame and the unlocking device, the first roller moves between the inclined surface and the frame and contacts the inclined surface. Through the relative displacement between the first roller and the inclined surface, the second pin shaft is made to move in a direction away from the silicon wafer unit.

3. The silicon wafer frame according to claim 2, It is characterized in that, Two inclined surfaces are provided on the vertical part. One inclined surface is located above the horizontal part, and the other inclined surface is located below the horizontal part; The unlocking device further includes a first mounting bracket with a U-shaped structure. The first rollers are respectively provided on the upper and lower walls of the first mounting bracket, and the first rollers contact the inclined surfaces on the corresponding sides.

4. The silicon wafer frame according to claim 1, It is characterized in that, The clamping assembly further includes a movable plate, which extends along the length direction of the containing space. The multiple clamping parts are arranged in sequence along the length direction of the movable plate; When the movable plate moves away from the accommodating space under the action of an external force, the movable plate drives all the clamping parts arranged thereon to move away from the accommodating space synchronously.

5. The silicon wafer cassette according to claim 4, wherein, the movable plate is located outside the frame, and the second pin shaft passes through the frame and the movable plate; when the movable plate moves away from the accommodating space, the movable plate pushes all the unlocking blocks to move away from the accommodating space synchronously, so that all the clamping blocks move away from the accommodating space synchronously.

6. The silicon wafer cassette according to claim 5, wherein, the cassette further includes an unlocking trigger part, the unlocking trigger part includes a first pin shaft, the first pin shaft passes through the frame, a first end of the first pin shaft is fixedly connected to the movable plate, and a second end of the first pin shaft is used to receive an external force to enable the first pin shaft to move along its penetrating direction in the frame, so as to drive the movable plate to move away from the accommodating space synchronously.

7. The silicon wafer cassette according to any one of claims 1 to 6, wherein, the cassette further includes an anti-tipping component, which is arranged at one end far away from the discharge port, and the anti-tipping component is used to abut and support the silicon wafer.

8. The silicon wafer cassette according to claim 7, wherein, the anti-tipping component includes a second mounting bracket and a second roller arranged on the second mounting bracket, the second mounting bracket is arranged on the frame, and the second roller is used to abut against the silicon wafer.

9. The silicon wafer cassette according to any one of claims 1 to 6, wherein, the frame includes an upper frame and a lower frame, the upper frame is detachably connected to the lower frame, the clamping assembly is arranged on the lower frame, and a limiting structure for limiting the crystal carrier is arranged on the upper frame; The upper frame is moved away from the lower frame to separate the crystal carrier from the silicon wafer, and the silicon wafer remains in the lower frame.

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