Component mounting machine and control method of correction process

Abstract

A component mounting machine includes: a mounting head to which a suction nozzle capable of picking up a component is attached and detachable with respect to the component mounting machine; and a control device. The control device includes: a storage section that stores mounting head information related to a mounting state of the mounting head at a previous use; a determination section that, in a case where a specific mounting head is mounted to the component mounting machine for use, determines whether a state of the specific mounting head for use corresponds to the mounting head information stored in the storage section when the mounting head information of the specific mounting head is stored in the storage section; and a process control section that performs a correction process of a coordinate position of the mounting head. The process control section performs the correction process in a case where the determination section determines that the state of the mounted specific mounting head does not correspond to the mounting head information, and does not perform the correction process in a case where the determination section determines that the state of the mounted specific mounting head corresponds to the mounting head information.

Description

Technical Field

[0001] The technology disclosed in this specification relates to control methods for component mounting machines and calibration processes. Background Technology

[0002] Japanese Patent Application Publication No. 2004-179636 discloses a component mounting machine that corrects the coordinate position of a mounting head installed on a component mounting machine for mounting components onto a substrate. In this component mounting machine, when the mounting head is changed, the positional relationship between the optical axis of the component recognition camera, the optical axis of the substrate recognition camera, and the centerline of the suction nozzle that picks up the component is corrected, thereby accurately mounting the component at a predetermined position on the substrate. Summary of the Invention

[0003] The problem that the invention aims to solve

[0004] In Japanese Patent Application Publication No. 2004-179636, calibration is performed whenever the mounting head is changed. However, for example, in cases where the mounting head is frequently changed, depending on the condition of the changing mounting head, there may be situations where accurate calibration is unnecessary. Therefore, in the technology of Japanese Patent Application Publication No. 2004-179636, unnecessary calibration can sometimes reduce production efficiency. This specification provides a technology that can determine whether calibration is necessary based on the condition of the mounting head being used.

[0005] Technical solutions for solving the problem

[0006] This specification discloses a component mounting machine for mounting components onto a substrate. The component mounting machine includes: a mounting head, a suction nozzle capable of being attached to and detached from the component mounting machine, and the mounting head being detachable from the component mounting machine; and a control device. The control device includes: a storage unit storing mounting head information related to the state of the mounting head during previous use; a determination unit, when using the component mounting machine to mount a specific mounting head, determining whether the state of the specific mounting head used this time corresponds to the mounting head information stored in the storage unit, if the specific mounting head information is stored in the storage unit; and a processing control unit performing coordinate position correction processing of the mounting head. If the determination unit determines that the state of the installed specific mounting head does not correspond to the mounting head information, the processing control unit performs the correction processing; if the determination unit determines that the state of the installed specific mounting head corresponds to the mounting head information, the processing control unit does not perform the correction processing.

[0007] In the aforementioned component mounting machine, a correction process is performed if the state of the specific mounting head being used does not correspond to the mounting head information stored in the storage unit; otherwise, no correction process is performed. Therefore, it is possible to determine whether to perform correction processing based on the state of the mounting head being used. In other words, when the state of a specific mounting head corresponds to the mounting head information, the correction process is omitted, thereby suppressing a decrease in production efficiency.

[0008] Furthermore, this specification discloses a control method for correcting the coordinate position of a specific mounting head when using a component mounting machine to install a specific mounting head. The component mounting machine includes a suction nozzle capable of attaching and detaching components and a mounting head capable of being attached and detached relative to the component mounting machine. The control method includes: an acquisition step, acquiring mounting head information related to the state of the specific mounting head during the previous use; a judgment step, determining whether the state of the installed specific mounting head corresponds to the mounting head information acquired in the acquisition step; and a processing control step, performing coordinate position correction processing on the mounting head. In the processing control step, if the judgment step determines that the state of the installed specific mounting head does not correspond to the mounting head information, the correction processing is performed; if the judgment step determines that the state of the installed specific mounting head corresponds to the mounting head information, the correction processing is not performed. Attached Figure Description

[0009] Figure 1 This is a diagram showing the schematic structure of the component mounting machine involved in Embodiments 1 and 2.

[0010] Figure 2 It is a block diagram showing the structure of the control system of the component mounting machine.

[0011] Figure 3 This is a magnified 3D diagram illustrating the method for correcting coordinate positions.

[0012] Figure 4 This is a diagram used to illustrate the method for correcting coordinate positions.

[0013] Figure 5 This is a flowchart illustrating the process of Example 1.

[0014] Figure 6 This is a flowchart illustrating the process of Example 2. Detailed Implementation

[0015] In one embodiment of this technology, the mounting head information may include the date and time when the previously used specific mounting head stopped operating. Alternatively, if the usage date and time of the installed specific mounting head exceeds a predetermined period relative to the stop date and time, the determination unit may determine that the state of the installed specific mounting head does not correspond to the mounting head information. Conversely, if the usage date and time are within the predetermined period relative to the stop date and time, the determination unit may determine that the state of the installed specific mounting head corresponds to the mounting head information.

[0016] For a mounting head that is reused within a predetermined period relative to the previous stop date, there is a high probability that its coordinate position will not change (i.e., the coordinate position of the substrate mounting element can be determined with the required accuracy). Therefore, for a mounting head that is reused within a predetermined period relative to the previous stop date, there is little need to perform a calibration process, and a structure that does not perform a calibration process can be designed to improve production efficiency.

[0017] In one embodiment of this technology, the mounting head information may include measurement data, which includes the coordinate position after correction processing for the previously used specific mounting head. Alternatively, the control device may measure sample data corresponding to at least a portion of the measurement data for the installed specific mounting head. Alternatively, if the difference between the at least portion of the measurement data and the measured sample data exceeds a predetermined threshold, the determination unit may determine that the state of the installed specific mounting head does not correspond to the mounting head information; alternatively, if the difference between the at least portion of the measurement data and the measured sample data is within the predetermined threshold, the determination unit may determine that the state of the installed specific mounting head corresponds to the mounting head information.

[0018] When the difference between the sample data and its corresponding measurement data is within a predetermined threshold, the coordinate position of the mounting head corresponding to other measurement data is also likely to be within a predetermined threshold (i.e., the coordinate position of the substrate mounting element can be determined with the required accuracy). Therefore, when the measured sample data is within the predetermined threshold relative to the corresponding measurement data, the necessity of performing correction processing is low, and a structure that does not perform correction processing can be configured to improve production efficiency.

[0019] In one embodiment of this technology, the component mounting machine may also include an imaging device that captures images of the component adsorbed onto the suction nozzle. Alternatively, a measuring suction nozzle may be mounted onto the mounting head, and the correction processing may be performed based on images obtained by the imaging device of the mounting head and the measuring suction nozzle.

[0020] The calibration process using the measuring nozzle allows for highly accurate calibration; however, it requires detaching and reassembling the measuring nozzle relative to the mounting head, thus taking a relatively long time. In contrast, the component mounting machine disclosed in this specification does not perform calibration when the state of the specific mounting head used corresponds to the mounting head information. Therefore, the technology disclosed in this specification is more useful when performing calibration processes that require a longer time.

[0021] (Example 1)

[0022] Hereinafter, the component mounting machine 10 of Embodiment 1 will be described with reference to the accompanying drawings. The component mounting machine 10 is a device for mounting components 4 onto a substrate 2. The component mounting machine 10 is also referred to as a component assembly device or a pick-and-place machine. Typically, the component mounting machine 10 is arranged side by side with other substrate processing machines such as solder printers and substrate inspection machines to form a series of mounting lines.

[0023] like Figure 1 As shown, the component mounting machine 10 includes: multiple component feeders 12, feeder holding part 14, mounting head 16, moving device 18, substrate conveyor 20, upper surface imaging camera 22, side imaging camera 23, lower surface imaging camera 24, control device 40 and touch panel 42.

[0024] Each component feeder 12 houses multiple components 4. The component feeder 12 is detachably mounted to the feeder holder 14 and supplies components 4 to the mounting head 16. The specific structure of the component feeder 12 is not particularly limited. Each component feeder 12 can also be, for example, a belt feeder housing multiple components 4 on a tape, a tray feeder housing multiple components 4 on a tray, or a bulk feeder randomly housing multiple components 4 within a container.

[0025] The feeder holding part 14 has multiple slots, in which the component feeder 12 is detachably mounted. The feeder holding part 14 can be fixed to the component mounting machine 10, or it can be detached from the component mounting machine 10.

[0026] The mounting head 16 has a suction nozzle 6 for adsorbing the element 4. The suction nozzle 6 is detachably mounted to the mounting head 16. The mounting head 16 allows the suction nozzle 6 to move along the Z direction, allowing the suction nozzle 6 to approach and move away from the component feeder 12 and the substrate 2. The mounting head 16 can adsorb the element 4 from the component feeder 12 through the suction nozzle 6 and mount the element 4 adsorbed on the suction nozzle 6 onto the substrate 2.

[0027] The moving device 18 moves the mounting head 16 and the upper surface imaging camera 22 between the component feeder 12 and the substrate 2. As an example, the moving device 18 in this embodiment is an XY robot that moves the moving base 18a in the X and Y directions, and the mounting head 16 and the upper surface imaging camera 22 are mounted relative to the moving base 18a. The mounting head 16 is detachably mounted to the moving base 18a.

[0028] The upper surface imaging camera 22 is fixed to the movable base 18a and moves integrally with the movable base 18a. The upper surface imaging camera 22 is configured with its shooting direction facing downwards (Z direction) to capture images of the upper surface of the substrate 2. For example, a CCD camera is used. The image data of the image captured by the upper surface imaging camera 22 is sent to the control device 40.

[0029] The side-viewing camera 23 is fixed to the movable base 18a and moves integrally with the movable base 18a. The side-viewing camera 23 is configured to face sideways, capturing images of the front end portion of the suction nozzle 6 from the side. That is, when the suction nozzle 6 has the element 4 attached to it, the side-viewing camera 23 captures images of the side of the element 4 attached to the suction nozzle 6 and the side of the front end portion of the suction nozzle 6. For example, a CCD camera is used. The image data captured by the side-viewing camera 23 is sent to the control device 40.

[0030] The substrate conveyor 20 is a device for loading, positioning, and unloading the substrate 2. As an example, the substrate conveyor 20 in this embodiment has a pair of conveyor belts and a support device for supporting the substrate 2 from below (not shown).

[0031] A lower surface imaging camera 24 is positioned between the component feeder 12 and the substrate conveyor 20 (specifically, the conveyor belt on the component feeder 12 side of a pair of conveyor belts). The imaging camera 34 is configured with its shooting direction facing upwards (Z-direction) to capture images from below of the nozzle 6 with the component 4 attached to it. That is, the lower surface imaging camera 24 captures images of the lower surface of the component 4 attached to the nozzle 6 when the nozzle 6 has the component 4 attached to it. The lower surface imaging camera 24 is, for example, a CCD camera. The image data captured by the lower surface imaging camera 24 is sent to the control device 40.

[0032] The touch panel 42 is a display device that provides various information to the operator and is a user interface for receiving instructions and information from the operator.

[0033] The control unit 40 is configured using a computer that includes a memory 50 and a CPU 60. For example... Figure 2As shown, the control device 40 is communicatively connected to the component feeder 12, mounting head 16, moving device 18, substrate conveyor 20, upper surface imaging camera 22, side imaging camera 23, lower surface imaging camera 24, and touch panel 42. By controlling the above-mentioned components, the control device 40 performs the mounting process of component 4 onto substrate 2 and the calibration process of mounting head 16.

[0034] A mounting head information storage unit 52 is provided in the memory 50. The mounting head information storage unit 52 stores mounting head information related to the state of the mounting head 16. The mounting head information includes the date and time when the mounting head 16 stopped operating during its last use (i.e., the time of last use). As described above, the mounting head 16 is configured to be detachable from the movable base 18a, and there are multiple types of mounting heads 16. The mounting head information storage unit 52 stores the stop date and time for each mounting head 16. In addition, the mounting head information also includes measurement data indicating the coordinate position after the correction processing performed on the mounting head 16 during past use. The mounting head information storage unit 52 stores the measurement data for each mounting head 16. The measurement data will be described later. The mounting head information storage unit 52 is an example of a "storage unit".

[0035] In addition, an arithmetic program (not shown) is stored in the memory 50, and the CPU 60 executes the arithmetic program. The CPU 60 functions as the judgment unit 62 and the processing control unit 64.

[0036] The determination unit 62 determines whether the state of the mounting head 16 used in the mounting process of component 4 to substrate 2 corresponds to the mounting head information stored in the mounting head information storage unit 52. Specifically, in this embodiment, it determines whether the usage date and time of the mounting head 16 used this time is within a predetermined period relative to the stop date and time of the mounting head 16 stored in the mounting head information storage unit 52.

[0037] The processing control unit 64 performs coordinate position correction processing for the mounting head 16. Additionally, the processing control unit 64 controls whether or not coordinate position correction processing for the mounting head 16 is performed.

[0038] Here, refer to Figure 3 and Figure 4 The correction process for the coordinate position of the mounting head 16 performed by the processing control unit 64 will be explained. Additionally, Figure 3 In order to facilitate observation of the accompanying drawings, the illustration of the side-view camera 23 is omitted, and the structure of each component is shown in a simplified manner. Figure 3 and Figure 4As shown, firstly, a standard gauge G, on which the reference mark Gm is provided, is placed on a support member (not shown) so that the reference mark Gm is included in the field of view of the lower surface imaging camera 24. Then, the processing control unit 64 positions the movable base 18a at a predetermined position so that the reference mark Gm is included in the field of view of the upper surface imaging camera 22 and the tip of the suction nozzle 6 is included in the field of view of the lower surface imaging camera 24. The processing control unit 64 stores the positional relationship (distance X2 and distance Y2) between the optical axis O1 of the upper surface imaging camera 22 and the coordinate origin of the component mounting machine 10 in the memory 50.

[0039] Next, the processing control unit 64 measures the positional relationship (distance Xa and distance Ya) between the optical axis O1 at a predetermined position and the reference mark Gm using the lower surface imaging camera 24. Additionally, the processing control unit 64 measures the positional relationship (distance Xc and distance Yc) between the optical axis O2 of the lower surface imaging camera 24 at a predetermined position and the center line O3 of the nozzle 6 using the upper surface imaging camera 22, and also measures the positional relationship (distance Xb and distance Yb) between the optical axis O2 and the reference mark Gm.

[0040] Based on the measured values, the processing control unit 64 calculates the correction values ​​for the positional relationship between the optical axis O1 of the upper surface imaging camera 22 and the center line O3 of the nozzle 6 (distance X3 (=Xa+Xb+Xc) and distance Y3 (=Ya+Yb+Yc)), the correction values ​​for the positional relationship between the optical axis O1 of the upper surface imaging camera 22 and the optical axis O2 of the lower surface imaging camera 24 (distance X4 (=Xa+Xb) and distance Y4 (=Ya+Yb)), and the positional relationship between the optical axis O2 of the lower surface imaging camera 24 and the origin of the coordinate system (distance X1 (=X2+X4) and distance Y1 (=Y2+Y4)). Therefore, when the element 4 adsorbed on the nozzle 6 is photographed by the lower surface imaging camera 24, the processing control unit 64 can calculate the position of the center line of the element 4 from the origin of the coordinate system based on the positional relationship between the optical axis O2 of the lower surface imaging camera 24 and the origin of the coordinate system, and can calculate the deviation of the element 4 from the center line O3 of the nozzle 6.

[0041] When mounting component 4 onto substrate 2, control device 40 captures images of component 4 adsorbed onto nozzle 6 at a predetermined position using lower surface imaging camera 24. Based on correction values ​​pre-calculated by processing control unit 64, it corrects the adsorption deviation of component 4 relative to nozzle 6 and the positioning deviation of substrate 2. This allows component 4 to be accurately mounted onto the substrate 2 at the designated position. Furthermore, mounting head information storage unit 52 of memory 50 stores the correction values ​​after correction processing of mounting head 16 as measurement data (i.e., mounting head information). Additionally, the above-described correction processing method is just one example; other correction processing methods may also be employed as described later.

[0042] Next, the process for determining whether to perform the coordinate position correction process of the mounting head 16 (hereinafter referred to as the correction control process) will be explained. Figure 5 This is a flowchart representing the correction control process. Figure 5 The process shown is performed when the mounting head 16 is replaced.

[0043] First, in S10, CPU 60 determines whether the installation header information of the installed installation header 16 is stored in the installation header information storage unit 52. Specifically, in this embodiment, CPU 60 determines whether the stop date and time of the installation header 16 from the last use is stored. If the stop date and time are stored (yes in S10), CPU 60 proceeds to S12; if the stop date and time are not stored (no in S10), it proceeds to S14.

[0044] In S12, CPU 60 determines whether the usage date and time (i.e., the current time) of the mounting head 16 used this time has exceeded a first period relative to the stop date and time. The first period is not particularly limited, but can be, for example, set as the time between two consecutive periodic maintenance periods performed on the component mounting machine 10. If the usage date and time has exceeded the first period relative to the stop date and time (yes in S12), CPU 60 proceeds to S14; if it is within the first period (no in S12), a series of processes ends. The first period is an example of a "predetermined period".

[0045] In S14, CPU 60 performs the aforementioned correction process. In S14, correction process is performed if the stop date / time is not stored in S10, or if it is determined in S12 that the usage date / time has exceeded a first period relative to the stop date / time. Here, the situation where the stop date / time is not stored can occur, for example, when the mounting head 16 is used for the first time in the component mounting machine 10. Furthermore, the situation where the usage date / time has exceeded a first period relative to the stop date / time occurs when a certain amount of time has elapsed since the last use, and the coordinate position of the mounting head 16 may deviate. Therefore, in these situations, CPU 60 performs a correction process for the coordinate position of the mounting head 16. When CPU 60 executes S14, it terminates the series of processes. When it executes... Figure 5 During the process, the mounting process of component 4 onto substrate 2 begins. Additionally, if the determination in S12 is negative, the measurement data stored in the mounting head information storage unit 52 is used as a correction value to perform the mounting process.

[0046] In the component mounting machine 10 of Embodiment 1, when the mounting head information of the used mounting head 16 (i.e., the stop date and time of the mounting head 16) is stored in the mounting head information storage unit 52 (yes in S10), if the current usage date and time of the mounting head 16 exceeds a first period relative to the stop date and time (yes in S12), a correction process is performed. Conversely, if the current usage date and time of the mounting head 16 is within the first period relative to the stop date and time (no in S12), no correction process is performed. When the mounting head 16, which is reused within the first period relative to the previous stop date and time, is mounted on the component mounting machine 10, its coordinate position is more likely to remain unchanged (i.e., the coordinate position of the component 4 can be mounted on the substrate 2 with the required accuracy). Therefore, for the mounting head 16, which is reused within the first period relative to the previous stop date and time, the necessity of performing a correction process is lower, and by setting a structure that does not perform a correction process, production efficiency can be improved.

[0047] Furthermore, even if the determination in S12 is negative, correction processing can still be performed when such situations occur continuously. That is, if a certain mounting head 16 is continuously used within a first period when the difference between the stop date and the usage date is within that first period, and the current usage date exceeds a second period relative to the previous correction processing performed on that mounting head 16, correction processing can still be performed. In this case, the mounting head information storage unit 52 can also store the latest time (called the correction time) of the past correction processing for each mounting head 16. Specifically, if the current usage date of the mounting head 16 is within the first period relative to the stop date (negative in S12), processing can be performed to determine whether the usage date exceeds a second period relative to the correction time. By performing such processing, situations where correction processing is not performed on the mounting head 16 for a long period can be avoided.

[0048] (Example 2)

[0049] Next, Example 2 will be described. In Example 2, instead of the stop date and time in Example 1, measurement data representing the coordinate position of the mounting head 16 after calibration is used as the mounting head information. This measurement data includes each calibration value (distance X1 to X4, distance Y1 to Y4, etc.) calculated based on each measurement value during the calibration process. Hereinafter, the process for determining whether to perform the calibration process for the coordinate position of the mounting head 16 in Example 2 will be described. Figure 6 This is a flowchart illustrating the correction control process of Example 2.

[0050] First, in S30, CPU 60 determines whether the mounting head information of the mounted mounting head 16 is stored in the mounting head information storage unit 52. Specifically, in this embodiment, CPU 60 determines whether measurement data of the mounting head 16 is stored. If measurement data is stored (yes in S30), CPU 60 proceeds to S32; if measurement data is not stored (no in S30), it proceeds to S38.

[0051] In step S32, CPU 60 measures sample data corresponding to a portion of the measurement data relative to the mounting head 16 used this time. As described above, the measurement data includes multiple correction values. Therefore, CPU 60 measures sample data of the positional relationship (e.g., the distance between the optical axis O2 and the center line O3 at a predetermined position) corresponding to a portion of the measurement data (e.g., distances X3 and Y3) relative to the mounting head 16 used this time.

[0052] In step S34, CPU 60 compares the measured sample data with its corresponding measurement data and determines whether the difference between them exceeds a predetermined threshold. The predetermined threshold is not specifically limited, but can be appropriately set, for example, depending on the type of mounting head 16 used. If the difference between the sample data and the corresponding measurement data exceeds the predetermined threshold (yes in S34), CPU 60 proceeds to step S38; if the difference is within the predetermined threshold (no in S34), it proceeds to step S36.

[0053] If the difference between the sample data and the corresponding measurement data is within a predetermined threshold (not in S34), the CPU 60 sets the correction value used in the installation process that follows the correction control process in S36. For example, the CPU 60 sets the measurement data stored in the installation head information storage unit 52 as the correction value used in the installation process. When the CPU 60 executes S36, it terminates the series of processes. Alternatively, if the difference between the sample data and the corresponding measurement data is within a predetermined threshold, but the values ​​of the sample data and the corresponding measurement data are different, values ​​with the same difference can be reflected in all other correction values.

[0054] On the other hand, CPU 60 performs a calibration process in S38. In S38, calibration is performed if no measurement data is stored in S30, or if it is determined in S34 that the difference between the sample data and its corresponding measurement data exceeds a predetermined threshold. Here, the situation where no measurement data is stored can occur, for example, when the mounting head 16 is used for the first time in the component mounting machine 10. Furthermore, the situation where the difference between the sample data and its corresponding measurement data exceeds the predetermined threshold indicates a deviation in the coordinate position of the mounting head 16. Therefore, in these situations, CPU 60 performs a calibration process for the coordinate position of the mounting head 16. When CPU 60 executes S38, it terminates the series of processes. When it executes... Figure 6 During the process, the mounting process of component 4 onto substrate 2 begins.

[0055] In the component mounting machine 10 of Embodiment 2, when the mounting head information (i.e., measurement data) of the mounting head 16 is stored in the mounting head information storage unit 52 (yes in S30), if the difference between the sample data and its corresponding measurement data exceeds a predetermined threshold (yes in S34), a correction process is performed. Conversely, if the difference between the sample data and its corresponding measurement data is within the predetermined threshold (no in S34), no correction process is performed. When the difference between the sample data and its corresponding measurement data is within the predetermined threshold, the coordinate position of the mounting head 16 corresponding to other measurement data is also within the predetermined threshold (i.e., the coordinate position of the component 4 on the substrate 2 can be mounted with the required accuracy). Therefore, when the measured sample data is within the predetermined threshold relative to the corresponding measurement data, the necessity of performing a correction process is low, and by having a structure that does not perform a correction process, production efficiency can be improved.

[0056] The above description provides detailed examples of the technology disclosed in this specification, but these are merely illustrative and not intended to limit the scope of the claims. The technology described in the claims includes technologies obtained by various modifications and alterations to the above-described examples. The following are variations of the above embodiments.

[0057] The above-described embodiment 1 Figure 5 The processing and Example 2 Figure 6 The processing can also be performed at the same time. For example, it could also be done in... Figure 5 If the condition in S10 is yes, proceed to S12; if the condition in S12 is no, proceed to... Figure 6 S30. Alternatively, if the condition in S10 is negative, S30 can also be entered.

[0058] Furthermore, the mounting head 16 is not limited to a structure having a single nozzle 6, but may also have multiple nozzles 6. In this case, in Embodiment 2, sample data may be measured for several (e.g., two) of the multiple nozzles 6, and they may be compared with the measurement data stored in the mounting head information storage unit 52.

[0059] Furthermore, as described above, the correction process is not limited to the method illustrated in the embodiments. For example, a process for correcting the positional deviation of the mounting head 16 in the Z direction (i.e., the positional deviation of the side-viewing camera 23 in the Z direction) can also be performed. In this correction process, firstly, the lower end position of the suction nozzle 6 is detected by driving the side-viewing camera 23 to capture an image of the suction nozzle 6. Then, it is determined whether the lower end position of the suction nozzle 6 is within a predetermined threshold relative to the measurement data. By using the height of the lower end position of the suction nozzle 6 as a reference, the positional deviation of the side-viewing camera 23 in the Z direction can be corrected.

[0060] Alternatively, for example, a measuring nozzle can be used to perform the calibration process instead of the mounting nozzle 6. The measuring nozzle is a tool with highly precise dimensions, thus enabling the performance of high-precision calibration processes. On the other hand, calibration processes using the measuring nozzle require attaching and removing the measuring nozzle from the mounting head 16, which takes a relatively long time. Regarding this, in the above embodiments, where the necessity of performing the calibration process is determined to be low (in... Figure 5 No in S12, in Figure 6 If the value in S34 is "No", then no correction process is performed. Thus, the technique disclosed in this specification is more useful in determining whether to perform a correction process that requires a relatively long time.

[0061] Furthermore, in the above embodiments, Figure 5 and Figure 6 The processing is performed when the mounting head 16 is replaced, but it can also be performed, for example, at a predetermined interval on the mounting head 16 that is currently mounted on the component mounting machine 10.

[0062] Furthermore, the technical elements described in this specification or drawings exert their usefulness individually or in various combinations, and are not limited to the combinations recited in the claims at the time of application. Additionally, the technology illustrated in this specification or drawings simultaneously achieves multiple objectives, and achieving one of these objectives is itself a useful technical achievement.

Claims

1. A component mounting machine for mounting components onto a substrate, the component mounting machine comprising: The mounting head is detachable from the suction nozzle for adsorbing the component, and the mounting head is detachable from the component mounting machine; and Control device, The control device includes: The storage unit stores mounting head information related to the state of the mounting head during the previous use; The determination unit, when used to install a specific mounting head on the component mounting machine, determines whether the status of the specific mounting head used this time corresponds to the mounting head information stored in the storage unit when the storage unit contains mounting head information for that specific mounting head; and The processing control unit performs coordinate position correction processing on the mounting head. If the determination unit determines that the state of the specific mounting head does not correspond to the mounting head information, the processing control unit performs the correction process. If the determination unit determines that the state of the specific mounting head corresponds to the mounting head information, the processing control unit does not perform the correction process.

2. The component mounting machine according to claim 1, wherein, The mounting head information includes the date and time when the specific mounting head last stopped operating. If the usage date of the specific mounting head exceeds a predetermined period relative to the stop date, the determination unit determines that the status of the specific mounting head does not correspond to the mounting head information. If the usage date and time are within the predetermined period relative to the stop date and time, the determination unit determines that the status of the specific mounting head installed corresponds to the mounting head information.

3. The component mounting machine according to claim 1, wherein, The mounting head information includes measurement data, which includes the coordinate position after calibration for the specific mounting head used previously. The control device measures sample data corresponding to at least a portion of the measured data for the specific mounting head that has been installed. If the difference between at least a portion of the measured data and the measured sample data exceeds a predetermined threshold, the determination unit determines that the state of the specific mounting head does not correspond to the mounting head information. If the difference between at least a portion of the measured data and the measured sample data is within the predetermined threshold, the determination unit determines that the state of the specific mounting head corresponds to the mounting head information.

4. The component mounting machine according to claim 2, wherein, The mounting head information includes measurement data, which includes the coordinate position after calibration for the specific mounting head used previously. The control device measures sample data corresponding to at least a portion of the measured data for the specific mounting head that has been installed. If the difference between at least a portion of the measured data and the measured sample data exceeds a predetermined threshold, the determination unit determines that the state of the specific mounting head does not correspond to the mounting head information. If the difference between at least a portion of the measured data and the measured sample data is within the predetermined threshold, the determination unit determines that the state of the specific mounting head corresponds to the mounting head information.

5. The component mounting machine according to any one of claims 1 to 4, wherein, The component mounting machine also includes a photographing device, which photographs the component adsorbed onto the suction nozzle. A measuring nozzle is installed on the mounting head, and the correction process is performed based on an image obtained by the imaging device of the mounting head and the measuring nozzle.

6. A control method for correcting the coordinate position of a specific mounting head when using a component mounting machine to mount a specific mounting head, wherein the component mounting machine includes a suction nozzle capable of adsorbing and removing components and a mounting head capable of being attached to and removed relative to the component mounting machine. The control method comprises the following steps: The acquisition process involves acquiring mounting head information related to the state of the specific mounting head during the previous use; The judgment process determines whether the state of the specific mounting head being installed corresponds to the mounting head information obtained in the acquisition process; and The processing control step involves performing coordinate position correction processing on the mounting head. In the processing control step, If the judgment process determines that the state of the specific mounting head installed does not correspond to the mounting head information, the correction process is performed. If the judgment process determines that the state of the specific mounting head corresponds to the mounting head information, the correction process is not performed.

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