Engraving unit, forming device, forming system, management system and engraving method

Abstract

The present invention relates to an engraving unit, a forming apparatus, a forming system, a management system, and an engraving method. The problem to be solved by the present invention is to provide an engraving unit mounted on a forming mold and capable of resetting the engraved engraving information with a simple structure. Furthermore, a forming apparatus, a forming system, and a management system equipped with the engraving unit are provided, as well as an engraving method using the engraving unit. According to an embodiment, the engraving unit includes an engraving substrate, a plurality of engraving pins, and a reset pin. The engraving substrate is disposed on a movable mold. The plurality of engraving pins are each movable relative to the engraving substrate along the opening and closing direction of the movable mold, and can move towards an engraving position and a non-engraving position, the non-engraving position being a position that moves from the engraving position to the side opposite to the side where the fixed mold is located. The reset pin moves along the opening and closing direction in conjunction with the movement of a push plate, and the plurality of engraving pins are pressed towards the engraving position by pressing the engraving substrate from the side opposite to the side where the fixed mold is located.

Description

Technical Field

[0001] The embodiments of the present invention relate to an engraving unit, a forming apparatus, a forming system, a management system, and an engraving method. Background Technology

[0002] In injection molding using a molding die, a molded article is formed in a cavity formed between a fixed mold and a movable mold. Furthermore, on the molded article formed as described above, sometimes it is necessary to imprint one of the following as engraving information: manufacturing date, part information including a part ID, or product information including a product ID. When engraving is required, an engraving unit capable of engraving the engraving information onto the molding die is provided.

[0003] Here, the engraved information typically varies depending on each part and product. When the engraving information includes date information, the nested structure is modified to rewrite the information whenever the date or time changes. From the perspective of ensuring part traceability, the engraving information of the engraving unit needs to be reset and updated to the new information each time a molded article is formed through injection molding. When the engraving unit is mounted on the molding die, it is required that the engraving information of the engraving unit be reset with a simple structure. For example, it is required that the engraving information of the engraving unit be easily reset without making significant changes to the structure of a molding die that does not have an engraving unit. Summary of the Invention

[0004] The problem to be solved by the present invention is to provide an engraving unit mounted on a molding die that can reset the engraved information with a simple structure. Furthermore, a molding apparatus, a molding system, and a management system equipped with the engraving unit are provided, as well as an engraving method using the engraving unit.

[0005] According to one embodiment, the etching unit includes an etching substrate, a plurality of etching pins, and a reset pin. The etching substrate is disposed in a movable mold on a surface opposite to a fixed mold. The plurality of etching pins are respectively mounted on the etching substrate in a state that allows them to move relative to the etching substrate along the opening and closing direction of the movable mold, and can move towards an etching position and a non-etching position. The etching position is the position where etching is possible, and the non-etching position is the position that moves from the etching position to the side opposite to the side where the fixed mold is located. The reset pin moves along the opening and closing direction of the movable mold in conjunction with the movement of a push plate, and the reset pin presses the plurality of etching pins toward the etching position by pressing the etching substrate from the side opposite to the side where the fixed mold is located.

[0006] The aforementioned engraving unit is mounted on a molding die and can reset the engraved information with a simple structure. Furthermore, the aforementioned molding apparatus, molding system, and management system include this engraving unit, and the aforementioned engraving method uses this engraving unit. Attached Figure Description

[0007] Figure 1 This is a schematic diagram illustrating an example of a forming system for an implementation method.

[0008] Figure 2 An example of a forming apparatus according to an embodiment is shown with the movable mold in a closed state relative to the fixed mold in the forming mold. It is a cross-sectional view that schematically represents the forming mold through a section parallel or substantially parallel to the opening and closing direction of the movable mold.

[0009] Figure 3 Is Figure 2 A cross-sectional view that roughly represents the lithography substrate of the lithography unit and its surrounding structure through a section parallel or approximately parallel to the opening and closing direction of the movable mold in the state of the lithography unit.

[0010] Figure 4 Yes Figure 3 A sectional view that provides a rough representation of section A1-A1.

[0011] Figure 5 This is a perspective view that schematically represents an example of the structure of the etched substrate and multiple etched pins in the forming apparatus of the embodiment.

[0012] Figure 6 This illustrates how the movable mold and the ejector plate move from the molding die in the embodiment of the mold. Figure 2 The state in which the movable mold has moved toward the side away from the fixed mold is a cross-sectional view that roughly represents a section parallel or approximately parallel to the opening and closing direction of the movable mold.

[0013] Figure 7 Is Figure 6 A cross-sectional view that schematically represents the lithography substrate of the lithography unit and its surrounding structure in a section parallel or approximately parallel to the opening and closing direction of the movable mold.

[0014] Figure 8 Yes Figure 7 A schematic sectional view of section A2-A2.

[0015] Figure 9 This illustrates how a movable mold is moved from a molding die in an embodiment of the mold. Figure 6 The state in which the movable mold has moved toward the side away from the fixed mold is a cross-sectional view that roughly represents a section parallel or approximately parallel to the opening and closing direction of the movable mold.

[0016] Figure 10 Is Figure 9 A cross-sectional view that schematically represents the lithography substrate of the lithography unit and its surrounding structure in a section parallel or approximately parallel to the opening and closing direction of the movable mold.

[0017] Figure 11 This illustrates how the ejector plate is moved from the molding die in an embodiment of the process. Figure 9 The state in which the movable mold has moved toward the side away from the fixed mold is a cross-sectional view that roughly represents a section parallel or approximately parallel to the opening and closing direction of the movable mold.

[0018] Figure 12 This is a cross-sectional view that schematically represents an example of a state in which the marking information is set in a section parallel or substantially parallel to the opening and closing direction of the movable mold in the marking unit of the embodiment.

[0019] Figure 13 In the engraving unit of the implementation method, the state on which the engraving information is set is compared with the state on a cross section parallel or approximately parallel to the opening and closing direction of the movable mold. Figure 12 A cross-sectional view representing a different example in a simplified manner.

[0020] Figure 14 This is a schematic diagram illustrating an example of a management system implementation. Detailed Implementation

[0021] Hereinafter, the embodiments will be described with reference to the accompanying drawings.

[0022] Figure 1 An example of the molding system 1 shown in the embodiment. For example... Figure 1 As shown, the molding system 1 includes a molding device 2 and a removal device 3. In the molding device 2, as described later, a molded article M is formed. The molded article M can be either a part or a product. Alternatively, a part formed by injection molding as the molded article M can be used to assemble a product in a process following injection molding. The removal device 3, for example, is a robotic arm, which removes the molded article M formed in the molding device 2 from the molding device 2.

[0023] Figure 2 An example of the forming apparatus 2 according to the embodiment is shown. For example... Figure 2 As shown, the forming apparatus 2 includes a forming mold 5. The forming mold 5 includes a fixed mold 6, a movable mold 7, and a push plate 8. In the forming mold 5, the movable mold 7 is movable relative to the fixed mold 6 and can open and close relative to the fixed mold 6. Furthermore, in the forming mold 5, the opening and closing directions of the movable mold 7 are defined as the direction of movement of the movable mold 7 (indicated by arrows Y1 and Y2). One side of the opening and closing direction (arrow Y1 side) is the side where the movable mold 7 is closed relative to the fixed mold 6, and the other side of the opening and closing direction (arrow Y2 side) is the side where the movable mold 7 is open relative to the fixed mold 6. Figure 2 In the diagram, the forming mold 5 is represented by a cross-section parallel or approximately parallel to the opening and closing direction of the movable mold 7. Additionally, Figure 2This indicates that the movable mold 7 is closed relative to the fixed mold 6.

[0024] By closing the movable mold 7 relative to the fixed mold 6, the movable mold 7 abuts against the fixed mold 6. Furthermore, by closing the movable mold relative to the fixed mold 6, a mold cavity 10 is formed between the movable mold 7 and the fixed mold 6. In injection molding, with the movable mold closed relative to the fixed mold 6, resin is injected into the mold cavity 10 through an injection port (not shown) formed in the fixed mold 6. Then, the resin injected into the mold cavity 10 is used to mold a molded article. The ejector plate 8 is disposed on the side opposite to the side where the fixed mold 6 is located relative to the movable mold 7. The ejector plate 8 is movable along the opening and closing direction of the movable mold 7.

[0025] The molding apparatus 2 includes a drive source 11, a power switching unit 12, and a controller 13. The drive source 11 is driven by electricity or hydraulic pressure, such as an electric motor or a hydraulic motor. In the molding apparatus 2, the power generated by the drive source 11 can be transmitted to the movable mold 7 and the ejector plate 8 via the power switching unit 12. The controller 13 includes a processor or integrated circuit and a storage medium such as a memory. The processor or integrated circuit includes any one of a CPU (Central Processing Unit), an ASIC (Application Specific Integrated Circuit), a microcomputer, a FPGA (Field Programmable Gate Array), and a DSP (Digital Signal Processor). The controller 13 may have only one processor or multiple processors. The controller 13 controls the driving of the drive source 11 and the operation of the power switching unit 12.

[0026] The controller 13, by controlling the operation of the power switching unit 12, can switch between three states: the driving force from the drive source 11 is transmitted only to the movable mold 7; the driving force from the drive source 11 is transmitted only to the push plate 8; and the driving force from the drive source 11 is transmitted to both the movable mold 7 and the push plate 8. In the state where the driving force is transmitted only to the movable mold 7, only the movable mold 7 moves along the opening and closing direction. Similarly, in the state where the driving force is transmitted only to the push plate 8, only the push plate 8 moves along the opening and closing direction. Furthermore, in the state where the driving force is transmitted to both the movable mold 7 and the push plate 8, the movable mold 7 and the push plate 8 move together along the opening and closing direction.

[0027] A through hole 15 is formed in the movable mold 7, extending through the movable mold 7 in the opening and closing direction. Additionally, a push pin 16 is connected to the push plate 8 from the side where the fixed mold 6 is located. By moving the push plate 8, the push pin 16 moves together with the push plate 8 in the opening and closing direction of the movable mold 7. Furthermore, the push pin 16 is connected to the push plate 8 in a state of being inserted into the through hole 15. Through the movement of at least one of the movable mold 7 and the push plate 8, the movable mold 7 and the push plate 8 approach each other, thereby causing the push pin 16 to protrude from the through hole 15 toward the side where the fixed mold 6 is located.

[0028] In injection molding, after the molded article is formed in the mold cavity 10, the movable mold 7 is opened relative to the fixed mold 6. Even when the movable mold 7 is open, the molded article may sometimes adhere to the surface 17 of the movable mold 7 opposite to the fixed mold 6. In this case, by moving at least one of the movable mold 7 and the ejector plate 8, the movable mold 7 and the ejector plate 8 approach each other, thereby pressing the molded article attached to the surface 17 from the side opposite to the fixed mold 6 using the ejector pin 16. Thus, the molded article attached to the surface 17 is removed from the movable mold 7.

[0029] In this embodiment, the engraving unit 20 is mounted on the forming mold 5. The engraving unit 20 includes an engraving substrate 21 and a reset pin 22. The engraving substrate 21 is disposed on the surface 17 of the movable mold 7 opposite to the fixed mold 6. Therefore, when the movable mold 7 is closed relative to the fixed mold 6, the engraving substrate 21 abuts against the mold cavity 10 from the side where the movable mold 7 is located. Furthermore, in... Figure 2 In one example, a through hole 18 is formed in the movable mold 7, extending through the movable mold 7 in the opening and closing direction. Furthermore, a printing substrate 21 is disposed in the opening of the through hole 18 toward the fixed mold 6. In addition, the printing substrate 21 is disposed such that the thickness direction of the printing substrate 21 is consistent with or substantially consistent with the opening and closing direction of the movable mold 7.

[0030] exist Figure 2 In one example, the reset pin 22 is connected to the ejector plate 8 from the side where the fixed mold 6 is located. By moving the ejector plate 8, the reset pin 22 moves together with the ejector plate 8 along the opening and closing direction of the movable mold 7. That is, the reset pin 22 moves in conjunction with the movement of the ejector plate 8 along the opening and closing direction of the movable mold 7. Furthermore, the reset pin 22 is connected to the ejector plate 8 in a state of being inserted into the through hole 18. By moving at least one of the movable mold 7 and the ejector plate 8, the movable mold 7 and the ejector plate 8 approach each other, thereby pressing the printing substrate 21 from the side opposite to the side where the fixed mold 6 is located. Furthermore, in Figure 2 In one example, the reset pin 22 is directly connected to the push plate 8, but it is not limited to this. The reset pin 22 only needs to move in conjunction with the movement of the push plate 8 along the opening and closing direction of the movable mold 7.

[0031] Figure 3 exist Figure 2 The state shown illustrates the lithography substrate 21 of the lithography unit 20 and its surrounding structure. Here, Figure 3 and Figure 2 Similarly, a cross-section parallel or approximately parallel to the opening and closing direction of the movable mold 7 is shown. Additionally, Figure 4 It shows Figure 3 Section A1-A1 shows a section that is orthogonal or approximately orthogonal to the opening and closing direction of the movable mold 7. For example... Figure 3 and Figure 4 As shown, a plurality of through holes 23 are formed on the printing substrate 21, and the plurality of through holes 23 penetrate the printing substrate 21 in the opening and closing direction (thickness direction of the printing substrate 21) of the movable mold 7. In addition, the printing unit 20 includes a plurality of printing pins 25, and the number of printing pins 25 is the same as the number of through holes 23. The printing pins 25 are respectively mounted on the printing substrate 21. The printing pins 25 are respectively mounted on the printing substrate 21 with their axial direction aligned with or substantially aligned with the opening and closing direction of the movable mold 7. Furthermore, one printing pin 25 is inserted into each of the plurality of through holes 23. The printing pins 25 are movable relative to the printing substrate 21 along the opening and closing direction (axial direction of the printing pin 25) of the movable mold 7.

[0032] The etch pins 25 are movable between etched and non-etched positions. When the movable mold 7 is closed relative to the fixed mold 6, the etch pins 25 in the etched position can etch the molded article formed by the mold cavity 10. Furthermore, the plurality of etch pins 25 move from the etched position to the non-etched position by moving from the etched position to the side opposite to the fixed mold. Even when the movable mold 7 is closed relative to the fixed mold 6, the etch pins 25 in the non-etched position cannot etch the molded article formed by the mold cavity 10. Figure 3 In this state, engraving pin 25B is in the engraving position, while engraving pins 25A and 25C are in the non-engraving position. Additionally, in Figure 3 In one example, the etch pin 25 located at the etch position protrudes toward the side where the fixed mold 6 is located relative to the etch substrate 21, while the etch pin 25 located at the non-etch position does not protrude toward the side where the fixed mold 6 is located relative to the etch substrate 21.

[0033] By using the etch pins 25 to etch the molded article, the cross-sectional shape of the end of the etch pin 25 located on the side of the fixed mold 6 is transferred onto the molded article. The cross-sectional shape of each etch pin 25 located on the side of the fixed mold 6, orthogonal or approximately orthogonal to the axial direction (opening and closing direction of the movable mold 7) of the etch pin 25, can be formed into a circular shape, a triangular shape, a quadrilateral shape, or a polygonal shape, or any shape of alphanumeric characters or any shape of pattern. Therefore, on the molded article, circular and triangular shapes, as well as alphanumeric characters and patterns, can be transferred using each etch pin 25.

[0034] Figure 5 This illustrates an example of the structure of the etched substrate 21 and the plurality of etched pins 25. Here, a first direction (indicated by arrows X1 and X2) and a second direction are defined, wherein the first direction intersects (orthogonally or substantially orthogonally) the opening and closing direction of the movable mold 7 (indicated by arrows Y1 and Y2), and the second direction intersects (orthogonally or substantially orthogonally) both the opening and closing direction of the movable mold 7 (the axial direction of each etched pin 25) and the first direction. Figure 5 In one example, multiple embossed pins 25 are arranged along a first direction, and multiple embossed pins 25 are arranged along a second direction. Furthermore, in a projection from the opening / closing direction of the movable mold 7, the imaginary frame surrounding the assembly of multiple embossed pins 25 becomes a rectangular shape with a pair of sides along the first direction and a pair of sides along the second direction. Figure 5 In one example, multiple engraving pins 25 are used to engrave a QR code (registered trademark) on a molded article. Therefore, the multiple engraving pins 25 are arranged to cooperate with other engraving pins 25 to engrave a QR code on the molded article.

[0035] On the molded article formed in the mold cavity 10, etched information is transferred by etching using etch pins 25 located at the etching positions as described above. In one example, as etched information, either part information such as part ID and part manufacturing number, or product information such as product ID and product manufacturing number, is transferred onto the molded article. In this case, alphanumeric characters, etc., are etched onto the molded article as part of the part information or product information. In another example, such as... Figure 5 One example is transferring QR codes or other two-dimensional codes onto molded products as engraving information.

[0036] The engraving unit 20 includes pin locking portions 26 capable of engaging with a plurality of engraving pins 25 respectively. The pin locking portions 26 restrict the movement of each engraving pin 25 along the opening and closing direction (axial direction of the engraving pin 25) of the movable mold 7 by engaging with each engraving pin 25 respectively. The pin locking portions 26 are slidable relative to the engraving substrate 21 and the engraving pins 25 in a direction intersecting the opening and closing direction of the movable mold 7. Figures 2-4 In one example, the sliding direction of the locking part 26 is consistent with or approximately consistent with the directions indicated by arrows X1 and X2. Figure 5 In one example, the sliding direction of the pin locking part 26 is consistent with or approximately consistent with the first direction (the direction indicated by arrows X1 and X2).

[0037] The locking part 26 switches between an engaged state, where it engages with each of the engraving pins 25, and a non-engaged state, where it does not engage with any of the engraving pins 25, by sliding along the sliding direction. Figure 3 and Figure 4 In this state, the locking part 26 engages with the engraving pins 25A to 25C respectively, forming an engaged state. Therefore, the movement of the engraving pins 25A to 25C along the opening and closing direction of the movable mold 7 is restricted.

[0038] In addition, Figure 3 and Figure 4 In one example, notches 31 and 32 are formed on the embossing pins 25. In each embossing pin 25, notches 31 and 32 are recessed in a direction that intersects (orthogonally or substantially orthogonally) both the opening / closing direction of the movable mold 7 and the sliding direction of the pin locking portion 26. In each embossing pin 25, the notch (first notch) 31 and the notch (second notch) 32 are formed separately from each other in the opening / closing direction of the movable mold 7 (the axial direction of the embossing pin 25). Figure 3 and Figure 4 In one example, in each engraving dowel 25, the notch 32 is set apart from the notch 31 in such a way that it is separated from the side where the fixed mold 6 is located.

[0039] The locking part 26 can engage with notches 31 and 32 on each engraving pin 25. On each engraving pin 25, by engaging the locking part 26 with the notch (first notch) 31, the engraving pin 25 is restricted to the engraving position. Furthermore, on each engraving pin 25, by engaging the locking part 26 with the notch (second notch) 32, the engraving pin 25 is restricted to a non-engraving position. Figure 3 and Figure 4 In this state, the engraving pins 25A and 25C are restricted to the non-engraving position, and the engraving pin 25B is restricted to the engraving position.

[0040] Furthermore, a plurality of grooves 33 are formed in the locking part 26. The grooves 33 are recessed in directions that intersect (orthogonal or substantially orthogonal) both the opening / closing direction of the movable mold 7 and the sliding direction of the locking part 26. Additionally, the grooves 33 are recessed in directions opposite to the recessed sides of the notches 31 and 32. Figure 3 and Figure 4 In a state where the movement of the engraving pins 25 is restricted, the grooves 33 are respectively set to be offset from the engraving pins 25 along the sliding direction of the pin locking part 26.

[0041] From Figure 3 and Figure 4 When the restriction on the movement of the etched pin 25 is lifted, the pin locking part 26 slides, and the grooves 33 are respectively in a state where they are not misaligned with the corresponding etched pin 25 in the sliding direction of the pin locking part 26. Thus, the restriction on the movement of the etched pin 25 is lifted, and the etched pin 25 can move along the opening and closing directions of the movable mold 7. Furthermore, by... Figure 3 and Figure 4 The state causes the locking part 26 to slide towards the arrow X2 side, releasing the restriction on the movement of the engraving pin 25.

[0042] In addition, such as Figure 2 As shown, the engraving unit 20 includes a sliding piece 27. A locking pin 26 is connected to the sliding piece 27. The sliding piece 27 can slide relative to the engraving substrate 21 and the engraving pin 25 together with the locking pin 26. Therefore, the sliding piece 27 can slide along a direction intersecting the opening and closing direction of the movable mold 7 (indicated by arrows X1 and X2). In addition, the sliding piece 27 is mounted on the movable mold 7 and can move together with the movable mold 7 along the opening and closing direction of the movable mold 7. Furthermore, the engraving substrate 21, the engraving pin 25, and the locking pin 26 can also move together with the movable mold 7 along the opening and closing direction. Therefore, by opening or closing the movable mold 7 relative to the fixed mold 6, the engraving substrate 21, the engraving pin 25, the locking pin 26, and the sliding piece 27 move relative to the fixed mold 6 along the opening and closing direction of the movable mold 7.

[0043] Additionally, a locking piece 28 is formed on the fixed mold 6, which can engage with the sliding piece 27. In the forming mold 5, by closing the movable mold 7 relative to the fixed mold 6, the sliding piece 27 engages with the locking piece 28 of the fixed mold 6. In the state where the sliding piece 27 and the locking piece 28 are engaged, as... Figure 3 and Figure 4 As shown, the movement of each of the engraving pins 25 is restricted. Therefore, with the movable mold 7 closed relative to the fixed mold 6, the movement of each of the engraving pins 25 is restricted, utilizing the predetermined engraving pins (in) that are restricted to the engraving position within the engraving pins 25. Figure 3 and Figure 4One example is the engraving pin 25B, which engraves information on the molded product.

[0044] Figure 6 This illustrates how the movable mold 7 and the ejector plate 8 are moved from the molding die 5 in the embodiment. Figure 2 The state is that it has moved away from the fixed mold 6. Figure 7 exist Figure 6 The state shown is the etch substrate 21 of the etch unit 20 and the structure around it. Figure 6 and Figure 7 and Figure 2 Similarly, a cross-section parallel or approximately parallel to the opening and closing direction of the movable mold 7 is shown. Additionally, Figure 8 It shows Figure 7 The A2-A2 section shows a section that is orthogonal or approximately orthogonal to the opening and closing direction of the movable mold 7.

[0045] like Figure 6 As shown, if the movable module 7 is made to move from... Figure 2 When the sliding piece 27 moves away from the fixed mold 6, it moves together with the movable mold 7 to the side away from the fixed mold 6. Therefore, the engagement between the sliding piece 27 and the engaging piece 28 of the fixed mold 6 is released. In the engaging piece 28, the portion closer to the movable mold 7 is further away from the etch substrate 21 and the etch pin 25 in the direction intersecting the opening and closing direction of the movable mold 7 (indicated by arrows X1 and X2).

[0046] During the period when the sliding piece 27 moves together with the movable mold 7 from the state of being engaged with the engaging piece 28 until the engagement with the engaging piece 28 is released, the sliding piece 27 slides relative to the etch substrate 21 and the etch pin 25 in a direction intersecting the opening and closing direction of the movable mold 7. At this time, the pin locking part 26 slides together with the sliding piece 27 relative to the etch substrate 21 and the etch pin 25, and the pin locking part 26 and the sliding piece 27 slide away from the etch substrate 21 (arrow X2 side) in a direction intersecting the opening and closing direction. Therefore, while the sliding piece 27 moves together with the movable mold 7 between the state of being engaged with the fixed mold 6 and the state of being released from the engagement with the fixed mold 6, the sliding piece 27 slides together with the pin locking part 26 in a direction intersecting the opening and closing direction of the movable mold 7.

[0047] By sliding the locking part 26 and the sliding piece 27 relative to the etch substrate 21 and the etch pin 25 as described above, until the engagement between the sliding piece 27 and the engaging piece 28 is released, as follows: Figure 7 and Figure 8 As shown, the locking part 26 is no longer engaged with the engraving pin 25. Therefore, the restriction imposed by the locking part 26 on each engraving pin 25 is released. Thus, in Figures 6-8In this state, the etch pins 25 can move relative to the etch substrate 21 along the opening and closing direction of the movable mold 7. In injection molding or the like using the molding die 5, if the engagement of the sliding piece 27 with the fixed mold 6 is released as described above and the restriction on the movement of each of the etch pins 25 is released, the movement of the push plate 8 is stopped, and the movable mold 7 is moved further away from the fixed mold 6.

[0048] Figure 9 This illustrates how the movable mold 7 is moved from the forming mold 5 in the embodiment. Figure 6 The state has moved further toward the side away from the fixed mold 6. Figure 10 exist Figure 9 The state shown is the etch substrate 21 of the etch unit 20 and the structure around it. Figure 9 and Figure 10 and Figure 2 Similarly, a cross-section parallel or approximately parallel to the opening and closing direction of the movable mold 7 is shown. For example... Figure 9 As shown, if the movable module 7 is made to move from... Figure 6 As the state moves further away from the fixed mold 6, the movable mold 7 approaches the ejector plate 8. Consequently, the ejector pin 16 protrudes from the through hole 15 toward the side where the fixed mold 6 is located. Therefore, even if the molded article is attached to the surface 17, the molded article attached to the surface 17 will be removed from the movable mold 7 by the ejector pin 16.

[0049] Furthermore, by bringing the movable mold 7 close to the push plate 8, the reset pin 22 presses down on the etching substrate 21 and the etching pin 25 from the side opposite to where the fixed mold 6 is located. As a result, the etching pins 25 are pressed towards the etching position. Figure 9 and Figure 10 In the state of, with Figures 6-8 With the same state, the locking part 26 releases the restriction on each of the engraving pins 25, allowing each of the engraving pins 25 to move relative to the engraving substrate 21 along the opening and closing direction of the movable mold 7. Therefore, by pressing the reset pin 22, all the engraving pins 25 are in the engraving position, and the engraving information for the molded article is reset in the engraving unit 20. In injection molding using the molding die 5, if the engraving information is reset as described above, new engraving information is set in the engraving unit 20 to update the engraving information.

[0050] Figure 11 This illustrates how the ejector plate 8 is moved from the forming mold 5 in the embodiment. Figure 9 The state has moved further toward the side away from the fixed mold 6. Figure 11 and Figure 2 Similarly, a cross-section parallel or substantially parallel to the opening and closing direction of the movable mold 7 is shown. Furthermore, from... Figure 9 The state to Figure 11 During the period of this state, the movable module 7 did not move. For example... Figure 11 As shown, if the push plate 8 is made to move from... Figure 9 If the state moves further away from the fixed mold 6, the reset pin 22 will become a state where it is not in contact with the etch substrate 21 and the etch pin 25. Furthermore, in the case of... Figure 11 In a state where the movable mold 7 is open relative to the fixed mold 6 and the reset pin 22 is not in contact with the engraving substrate 21 and the engraving pin 25, the engraving information to be engraved on the molded article is set and updated in the engraving unit 20. The setting and updating of the engraving information is performed in the state where the engraving information is reset, that is, when all the engraving pins 25 are in the engraving position.

[0051] like Figure 11 As shown, the setting and updating of the engraving information are performed using the transfer unit 40. At this time, the transfer unit 40 abuts against the engraving substrate 21 from the side where the fixing mold 6 is located. Furthermore, the transfer unit 40 presses down on a predetermined engraving pin 25α among the plurality of engraving pins 25 from the side where the fixing mold 6 is located. Figure 11 In the state of, with Figure 9 and Figure 10 With the same state, the locking part 26 releases the restriction on each of the engraving pins 25, allowing each of the engraving pins 25 to move relative to the engraving substrate 21 along the opening and closing direction of the movable mold 7. Therefore, by pressing from the transfer part 40, the designated engraving pin 25α moves from the engraving position to the non-engraving position. Furthermore, the engraving pins 25β other than the designated engraving pin 25α are in the engraving position. Thus, by pressing from the transfer part 40, new engraving information is transferred to the multiple engraving pins 25. With the engraving information transferred to the multiple engraving pins 25 by the transfer part 40, the molded article can be engraved using only the engraving pins 25β other than the designated engraving pin 25α pressed by the transfer part 40.

[0052] Figure 12 This represents an example of a state where the engraving information has been set (updated) in the engraving unit 20. Additionally, Figure 13 This indicates the state in which the engraving information has been set (updated) in the engraving unit 20. Figure 12 A different example. In Figure 12 and Figure 13 The image shows the lithography substrate 21 of the lithography unit 20 and its surrounding structure. Additionally, Figure 12 and Figure 13 and Figure 11 Similarly, a cross section parallel or approximately parallel to the opening and closing direction of the movable module 7 is shown.

[0053] exist Figure 12In one example, the engraving pins 25A and 25C are contained within a predetermined engraving pin 25α, and the engraving pins 25A and 25C are pressed by the transfer part 40A from the side where the fixed mold 6 is located. As a result, the engraving pins 25A and 25C move from the engraving position to the non-engraving position, respectively. Furthermore, in Figure 12 In one example, the engraving pin 25B is included in the engraving pin 25β, which is separate from the designated engraving pin 25α, and is located at the engraving position. Therefore, when the engraving information is set (updated) by the transfer unit 40A, the engraving pin 25B can be engraved for the molded article, but the engraving pins 25A and 25C cannot be engraved.

[0054] In addition, Figure 13 In one example, a setting is made in the engraving unit 20 that is similar to... Figure 12 One example of different engraving information. Figure 13 The state is equivalent to, for example, in the case of Figure 12 In one example, after the engraving information is engraved onto the molded product, the state of the engraving information is updated in the engraving unit 20. Figure 13 In one example, the engraving pin 25C is contained within a predetermined engraving pin 25α, and the engraving pin 25C is pressed by the transfer part 40B from the side where the fixed mold 6 is located. As a result, the engraving pin 25C moves from the engraving position to the non-engraving position. Furthermore, in Figure 13 In one example, the engraving pins 25A and 25B are included in the engraving pin 25β, which is separate from the designated engraving pin 25α, and are located at the engraving position. Therefore, when the engraving information is set (updated) by the transfer unit 40B, the engraving pins 25A and 25B can be engraved for the molded article, but the engraving pin 25C cannot be engraved.

[0055] The transfer units 40, such as 40A and 40B, can be provided as part of the engraving unit 20 in the forming apparatus 2, or they can be provided outside the forming apparatus 2. When the transfer units 40 are provided outside the forming apparatus 2, they are, for example, mounted on the removal device 3. In this case, the removal device 3 is used to move the transfer units 40 into the interior of the forming apparatus 2. Then, in the forming mold 5, the transfer units 40 abut against the engraving substrate 21 from the side where the fixing mold 6 is located.

[0056] If the engraving information is set (updated) using the transfer unit 40 in the engraving unit 20 as described above, then the transfer unit 40 is removed from the forming device 2, and the transfer unit 40 is not positioned between the fixed mold 6 and the movable mold 7. Then, by moving the movable mold 7 and the push plate 8 toward the fixed mold 6, the movable mold 7 is closed relative to the fixed mold 6, thereby becoming Figure 2The state is as follows. Then, a molded article is formed in the mold cavity 10 between the fixed mold 6 and the movable mold 7, and the set engraving information is engraved on the molded article using the engraving pin 25 located at the engraving position.

[0057] As described above, in this embodiment, the reset pin 22 moves in conjunction with the movement of the push plate 8 along the opening and closing direction of the movable mold 7. Furthermore, the reset pin 22 presses the etched substrate 21 from the side opposite to where the fixed mold 6 is located, pressing the plurality of etched pins 25 toward the etched position. Therefore, the etched information etched by the etched unit 20 can be reset with a simple structure. In addition, in this embodiment, by configuring the etched substrate 21 and the etched pins 25 on the surface 17 and moving the reset pin 22 in conjunction with the push plate 8, the etched information etched by the etched unit 20 can be reset, as described above. Therefore, the etched information etched by the etched unit 20 can be easily reset without making significant changes to the structure of the forming mold 5 when the etched unit 20 is not mounted.

[0058] Furthermore, in this embodiment, the locking part 26 restricts the movement of each of the multiple embossing pins 25 along the opening and closing direction of the movable mold 7 by engaging with each of the multiple embossing pins 25. Moreover, the multiple embossing pins 25 can be respectively restricted by the locking part 26 to each of the embossing and non-embossing positions. Therefore, when embossing the molded article using the embossing pins 25 located at the embossing position as described above, embossing information can be appropriately embossed onto the molded article.

[0059] Furthermore, the locking pin 26 can slide along a direction intersecting the opening and closing direction of the movable mold 7. Moreover, the locking pin 26 can switch between an engaged state (engaged with the plurality of etched pins 25) and a non-engaged state (not engaged with the plurality of etched pins 25) by sliding. Therefore, it is possible to switch between a state where the movement of the etched pins 25 is restricted and a state where the etched pins 25 can move with a simple structure.

[0060] Furthermore, in this embodiment, the sliding piece 27 is connected to the locking pin 26, and the sliding piece 27 can move together with the movable mold 7 in the opening and closing direction. Moreover, while the sliding piece 27 moves together with the movable mold 7 between a state where it is engaged with the fixed mold 6 and a state where the engagement with the fixed mold 6 is released, the sliding piece 27 also slides together with the locking pin 26 in a direction intersecting the opening and closing direction of the movable mold 7. Therefore, the locking pin 26 slides in conjunction with the movable mold 7 relative to the opening or closing of the fixed mold 6, and appropriately switches between a state where the movement of the engraving pin 25 is restricted and a state where the engraving pin 25 can move, corresponding to the opening or closing of the movable mold 7 relative to the fixed mold 6.

[0061] Furthermore, in the embodiments, by using the transfer unit 40 to press a designated engraving pin 25α among the plurality of engraving pins 25 from the side where the fixed mold 6 is located, only the designated engraving pins 25β other than the designated engraving pins 25α can be engraved. Therefore, by opening the movable mold 7 relative to the fixed mold 6, the engraving information engraved by the engraving unit 20 can be easily set and updated using the transfer unit 40. In addition, by arranging the transfer unit 40 in a structure that is mounted on the removal device 3, the engraving information engraved by the engraving unit 20 can be set and updated more easily.

[0062] Furthermore, in the aforementioned embodiments, the locking pin 26 slides in a direction intersecting the opening and closing direction in conjunction with the opening or closing of the movable mold 7 relative to the fixed mold 6, but this is not a limitation. In a certain variation, a drive source is provided to generate the power to slide the locking pin 26. In this case, the drive source may be, for example, an electric motor, a hydraulic motor, or a piezoelectric element. In this variation, the reset pin 22 presses the plurality of etch pins 25 toward the etch position by pressing the etch substrate 21 from the side opposite to where the fixed mold 6 is located. Therefore, in this variation, the etch information etched by the etch unit 20 can be reset with a simple structure, achieving the same function and effect as in the aforementioned embodiments.

[0063] Furthermore, in this embodiment, a management system equipped with the aforementioned molding apparatus 2 is provided. The management system manages manufacturing information regarding the molded articles formed by the molding apparatus 2. Figure 14 An example of a management system 50 illustrating an implementation method. For example... Figure 14 As shown, in the management system 50, in the injection molding process S101, the molded article is formed as described above. That is, in the molding die 5 of the molding apparatus 2, in the mold cavity 10 formed between the fixed die 6 and the movable die 7, the molded article is formed by injection molding. In addition, in the injection molding process S101, the engraving unit 20 provided in the molding die 5 engraves engraving information containing either product information or part information on the molded product as described above. As mentioned earlier, the engraving information engraved on the molded article is transferred to the plurality of engraving pins 25 of the engraving unit 20 by the transfer unit 40.

[0064] Then, for the molded article with the engraved information, the subsequent process S102, following the injection molding process S101, is performed. Examples of the subsequent process S102 include inspection of the molded article. Furthermore, if the molded parts are used as molded articles and products assembled from these molded articles are to be shipped, the products to be shipped can also be assembled from the molded articles in the subsequent process S102. Then, after the processes in the subsequent process S102, the products containing the molded articles are shipped to the market in process S103. The shipped products can be either the molded articles themselves or products assembled from the molded articles as parts.

[0065] The management system 50 includes a management server 51, which in turn includes an information management unit 52 and a data storage unit 53. In one example, the management server 51 is composed of a computer or similar device. In this case, the management server 51 is similar to the aforementioned controller 13, possessing a processor or integrated circuit and a storage medium such as a memory. Furthermore, the processor or similar device performs processing in the information management unit 52, and the storage medium functions as the data storage unit 53. In another example, the management server 51 is composed of a server in a cloud environment. The infrastructure of the cloud environment consists of virtual processors such as virtual CPUs and cloud storage. In this example, the virtual processor or similar device performs processing in the information management unit 52, and the cloud storage functions as the data storage unit 53.

[0066] In the data storage unit 53, data representing manufacturing information is stored for each molded product. The manufacturing information of the molded product includes either the aforementioned product information or part information as engraving information. Additionally, the manufacturing information of the molded product includes information related to the manufacturing conditions (molding conditions) during injection molding. Furthermore, during the molding of the molded product in injection molding process S101, data related to molding is detected by sensors installed on the molding apparatus 2. Detection information representing the sensor data detection results is sent from the molding apparatus 2 to the information management unit 52 of the management server 51. The manufacturing information of the molded product stored in the data storage unit 53 includes detection information representing the detection results of the sensors on the molding apparatus 2 during the manufacturing of the molded product. In the data stored in the data storage unit 53, for each molded product, engraving information is represented in a state associated with information about the manufacturing conditions and the detection information. The information management unit 52 sends the engraving information to a controller (not shown) or similar device that controls the operation of the transfer unit 40. The controller then controls the operation of the transfer unit 40 to transfer the received engraving information to multiple engraving pins 25 via the transfer unit 40. As a result, the engraving information sent from the Information Management Department 52 is engraved onto the finished product.

[0067] Furthermore, the information management unit 52 sends information about manufacturing conditions to the controller 13 of the molding apparatus 2. The controller 13 then controls the operation of the molding apparatus 2, which includes the molding die 5, to perform injection molding under the manufacturing conditions indicated by the information about manufacturing conditions. Among the manufacturing conditions, for example, the manufacturer and ID of the molding apparatus 2 used in injection molding, the ID and temperature of the molding die 5 used in injection molding, the temperature and injection speed of the injected resin, the holding pressure and holding time for holding the injected resin in the mold cavity 10, and the ID of the molding conditions, etc.

[0068] Furthermore, the management system 50 includes reading devices 55 and 56. In the subsequent process S102, if a defective molded product occurs, the reading device 55 reads the marking information of the defective molded product. Additionally, if a defective molded product occurs on the market S103, such as when it is used by a user, the reading device 56 reads the marking information of the defective molded product. In one example, a QR code or other two-dimensional code is marked on the molded product as marking information, and the reading devices 55 and 56 are QR code readers or other two-dimensional code readers. The information management unit 52 of the management server 51 can receive the marking information read by each of the reading devices 55 and 56.

[0069] If the information management unit 52 receives engraving information from either the reading devices 55 or 56, it uses the data stored in the data storage unit 53 to compare the received engraving information with information regarding manufacturing conditions. Then, the information management unit 52 obtains information regarding manufacturing conditions for the molded product containing the received engraving information. Furthermore, if the molded product is identical to the molded product containing the received engraving information, the information management unit 52 corrects the information regarding manufacturing conditions to optimize them. As described above, the management server 51 manages manufacturing information, including engraving information and information regarding manufacturing conditions, for the molded product formed in the mold cavity 10. In this embodiment, since the management server 51 manages the manufacturing information regarding the molded product as described above, the manufacturing information can be appropriately managed for the molded product with engraved information.

[0070] According to at least one of these embodiments, multiple etch pins can be moved to an etch position and a non-etch position, respectively, that can be moved from the etch position to a side opposite to the fixed mold. Furthermore, a reset pin moves in conjunction with the movement of the push plate along the opening and closing direction of the movable mold, and the reset pin presses the multiple etch pins toward the etch position by pressing the etch substrate from the side opposite to the fixed mold. Thus, an etch unit mounted on a molding die and capable of resetting the etched information with a simple structure can be provided. In addition, a molding apparatus, a molding system, and a management system equipped with this etch unit, as well as an etch method using this etch unit, can be provided.

[0071] Some embodiments of the present invention have been described, but these embodiments are given by way of example and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, and are included within the scope of the invention as set forth in the claims and its equivalents.

Claims

1. An engraving unit, characterized in that, have: A printing substrate is disposed in a movable mold on the side opposite to the fixed mold; Multiple etch pins are mounted on the etch substrate in a state where they are movable relative to the etch substrate along the opening and closing direction of the movable mold. These pins are movable to etch positions and non-etch positions, respectively. The etch position is a position where etching is possible, and the non-etch position is a position that moves from the etch position to the side opposite to the side where the fixed mold is located. The reset pins, which move in conjunction with the movement of the push plate along the opening and closing direction of the movable mold, press the plurality of etch pins toward the etch position by pressing the etch substrate from the side opposite to the side where the fixed mold is located.

2. The engraving unit according to claim 1, characterized in that, The engraving unit also includes a pin locking part, which restricts the movement of the plurality of engraving pins along the opening and closing direction of the movable mold by engaging with the plurality of engraving pins respectively.

3. The engraving unit according to claim 2, characterized in that, The locking pin can slide relative to the etched substrate and the plurality of etched pins along a direction that intersects the opening and closing direction of the movable mold, switching between an engaged state that engages with the plurality of etched pins and a non-engaged state that does not engage with the plurality of etched pins.

4. The engraving unit according to claim 3, characterized in that, The engraving unit also includes a sliding piece, which is connected to the pin locking part in a state where it can move together with the movable mold along the opening and closing direction of the movable mold, and can engage with the fixed mold. While the sliding piece moves together with the movable mold between a state in which it is engaged with the fixed mold and a state in which it is disengaged from the fixed mold, the sliding piece slides together with the pin locking part along the direction that intersects the opening and closing direction of the movable mold.

5. The engraving unit according to claim 2, characterized in that, A first notch is formed on each of the plurality of engraved pins, and a second notch is formed separately from the first notch in the opening and closing direction of the movable mold. The locking part restricts the plurality of engraved pins to the engraved position by engaging with the first notch in the plurality of engraved pins respectively, and restricts the plurality of engraved pins to the non-engraved position by engaging with the second notch in the plurality of engraved pins respectively.

6. The engraving unit according to claim 1, characterized in that, The engraving unit also includes a transfer section, which can perform engraving using only the engraving pins other than the specified engraving pins among the plurality of engraving pins by pressing a specified engraving pin among the plurality of engraving pins from the side where the fixed mold is located.

7. A forming apparatus, characterized in that, have: The engraving unit according to any one of claims 1 to 6; The fixed mold; The movable mold has the etch substrate of the etch unit disposed on the surface opposite to the fixed mold, and is movable relative to the fixed mold along the opening and closing direction, forming a mold cavity with the fixed mold by closing relative to the fixed mold; as well as The push plate is positioned on the opposite side of the fixed mold relative to the movable mold, and its movement causes the reset pin of the engraving unit to move along the opening and closing direction of the movable mold. The plurality of engraving pins of the engraving unit engrave engraving information on the molded article formed in the mold cavity.

8. A forming system, characterized in that, have: The forming apparatus according to claim 7; and A removal device that removes the molded article formed in the mold cavity of the molding device from the molding device.

9. The forming system according to claim 8, characterized in that, The forming system also includes a transfer unit that, by pressing a predetermined engraving pin from one side of the fixed mold, can perform engraving using only the engraving pins other than the predetermined engraving pins. The transfer section is installed on the extraction device.

10. A management system, characterized in that, have: The forming apparatus according to claim 7; A reading device capable of reading the engraving information engraved by the plurality of engraving pins from the molded article formed in the mold cavity; as well as A management server is capable of receiving the engraving information read by the reading device and managing manufacturing information, including the engraving information and information about manufacturing conditions, for the molded article formed in the mold cavity.

11. An engraving method, characterized in that, Using the engraving unit according to any one of claims 1 to 6, engraving information is applied to the molded article formed in the mold cavity between the movable mold and the fixed mold. The engraving method comprises: The molded article is engraved using an engraving pin located at an engraving position from among the plurality of engraving pins; and By using the reset pins to press the engraving substrate from the side opposite to the side where the fixed mold is located, the plurality of engraving pins are positioned at the engraving position, and the engraving information is reset.

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