Display module, manufacturing method thereof and spliced screen

Abstract

The application provides a display module, a manufacturing method thereof and a spliced screen. The display module comprises a substrate, a connecting part and a connecting line. The connecting part comprises a first connecting terminal arranged on a first surface of the substrate and a second connecting terminal arranged on a second surface of the substrate. The connecting line is electrically connected with the first connecting terminal and the second connecting terminal. The connecting line comprises a first sub-connecting line, a second sub-connecting line and a third sub-connecting line. The first sub-connecting line is arranged on at least one side surface of the substrate. The second sub-connecting line is arranged on at least one first surface of the substrate and connected with the first connecting terminal. The third sub-connecting line is arranged on at least one second surface of the substrate and connected with the second connecting terminal. The adhesion between the second sub-connecting line and the substrate is greater than the adhesion between the first sub-connecting line and the substrate, thereby avoiding the risk of disconnection of the existing connecting line at the corner of the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and its manufacturing method, and a splicing screen. Background Technology

[0002] Currently, the screen ratio of electronic products is getting larger and larger, and full-screen displays have become a popular trend. However, existing display modules have circuit designs such as fan-out traces in the fan-out area and bonding terminals in the connection area. In order to reduce the bezel, a common solution in splicing display products is to fabricate the fan-out traces and bonding terminals on the back of the display module substrate.

[0003] Common splicing techniques utilize side traces to guide signals from the front of the substrate to the back. The final display product requires splicing individual substrates into a large-size display, enabling display methods with no size limit. Currently, the "silver paste transfer" process is commonly used to lead the traces to the back of the substrate. However, in practice, the adhesion between the side traces prepared by "silver paste transfer" and the substrate is relatively weak. Uneven force is applied at the corners of the substrate, which can easily lead to broken traces, resulting in short circuits or open circuits. Summary of the Invention

[0004] This application provides a display module and its manufacturing method, as well as a splicing screen, to alleviate the shortcomings of related technologies.

[0005] To achieve the above functions, the technical solutions provided in this application are as follows:

[0006] This application provides a display module, including a display area and a connection area located on one side of the display area. The display module includes at least:

[0007] The substrate has opposing first and second surfaces and a side surface connecting the first and second surfaces;

[0008] A connecting portion is located within the connecting area, and the connecting portion includes a first connecting terminal disposed on the first surface and a second connecting terminal disposed on the second surface;

[0009] A connecting wire electrically connected to both the first connecting terminal and the second connecting terminal, the connecting wire including a first sub-connecting wire, a second sub-connecting wire, and a third sub-connecting wire, wherein the first sub-connecting wire is located at least on the side surface; the second sub-connecting wire is located at least on the first surface and connected to the first connecting terminal; and the third sub-connecting wire is located at least on the second surface and connected to the second connecting terminal.

[0010] The adhesion between the second sub-connecting line and the substrate is greater than the adhesion between the first sub-connecting line and the substrate.

[0011] In one embodiment, the side surface includes a first inclined surface, a second inclined surface, and a vertical surface, wherein the first inclined surface is located between the first surface and the vertical surface, the second inclined surface is located between the second surface and the vertical surface, and the vertical surface is perpendicular to the first surface;

[0012] Wherein, the first sub-connecting line is located at least on the vertical plane, the second sub-connecting line extends from the first surface to the first inclined surface and contacts the first sub-connecting line; the third sub-connecting line extends from the second surface to the second inclined surface and contacts the first sub-connecting line.

[0013] In one embodiment, the first sub-connecting line is located on the first inclined plane, the vertical plane, and the second inclined plane;

[0014] One end of the second sub-connecting line covers the first connecting terminal and is in contact with the first connecting terminal, and the other end of the second sub-connecting line is connected to one end of the first sub-connecting line;

[0015] One end of the third sub-connecting line covers and contacts the second connecting terminal, and the other end of the third sub-connecting line is connected to the other end of the first sub-connecting line;

[0016] Wherein, the orthographic projection of the first sub-connecting line on the first inclined plane at least covers a portion of the second sub-connecting line, and the orthographic projection of the first sub-connecting line on the second inclined plane at least covers a portion of the third sub-connecting line.

[0017] In one embodiment, the first sub-connecting line is located on the connecting area, the first inclined surface, the vertical surface, and the second inclined surface;

[0018] One end of the first sub-connecting line is connected to the first connecting terminal, and the other end of the first sub-connecting line is connected to the second connecting terminal;

[0019] The second sub-connecting line is located on the side of the first sub-connecting line away from the substrate, and the orthographic projection of the second sub-connecting line on the first surface and the first inclined surface covers the first sub-connecting line;

[0020] The third sub-connecting line is located on the side of the first sub-connecting line away from the substrate, and the orthographic projection of the third sub-connecting line on the second surface and the second inclined surface covers the first sub-connecting line.

[0021] In one embodiment, the display module further includes:

[0022] An array driving layer is disposed on a first surface of the substrate, and the array driving layer is located in the display area;

[0023] A fan-out portion is disposed on the second surface of the substrate;

[0024] Multiple light-emitting elements are spaced apart on the side of the array driving layer away from the substrate;

[0025] A bonding pad is located on the second surface, and the bonding pad is connected to the fan-out line of the fan-out portion;

[0026] A flip-chip film is disposed on the side of the bonding pad away from the substrate;

[0027] A circuit board is disposed on the side of the flip-chip film away from the bonding pads, and the circuit board is connected to the flip-chip film.

[0028] In one embodiment, the material of the first sub-connecting line is different from the material of the second sub-connecting line, and the material of the second sub-connecting line is the same as the material of the third sub-connecting line.

[0029] In one embodiment, the material of the first sub-connector is conductive silver paste, and the materials of the second and third sub-connectors are one or more metals selected from copper, molybdenum, and aluminum.

[0030] This application embodiment also provides a method for manufacturing a display module, the display module including a display area and a connection area located on one side of the display area, the manufacturing method including the following steps:

[0031] A substrate is provided, the substrate having opposing first and second surfaces, and a side surface connecting the first and second surfaces;

[0032] A first connection terminal is formed on the first surface, and a second connection terminal is formed on the second surface, wherein both the first connection terminal and the second connection terminal are located within the connection area;

[0033] A first sub-connecting line is formed on the side using a first process, and a second sub-connecting line is formed on the first surface and a third sub-connecting line is formed on the second surface using a second process, wherein the first sub-connecting line is at least located on the side, the second sub-connecting line is at least located on the first surface, and the third sub-connecting line is at least located on the second surface;

[0034] The adhesion between the second sub-connecting line and the substrate is greater than the adhesion between the first sub-connecting line and the substrate.

[0035] In one embodiment, the first process is a silver paste transfer process, and the second process is a physical vapor deposition process.

[0036] This application also provides a video wall, which includes at least two display modules as described above.

[0037] The beneficial effects of the embodiments of this application are as follows: The embodiments of this application provide a display module and its manufacturing method, and a splicing screen. By setting the connecting line to include a first sub-connecting line, a second sub-connecting line and a third sub-connecting line, the first sub-connecting line is located at least on the side, the second sub-connecting line is located at least on the first surface and connected to the first connecting terminal, and the third sub-connecting line is located at least on the second surface and connected to the second connecting terminal. The adhesion between the second sub-connecting line and the substrate is greater than the adhesion between the first sub-connecting line and the substrate, thereby avoiding the risk of wire breakage at the corner of the substrate in existing connecting lines. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of a first structure of the display module provided in an embodiment of this application.

[0040] Figure 2 A flowchart illustrating the manufacturing method of the display module provided in this application embodiment;

[0041] Figures 3A to 3C for Figure 2 The first structural process flow diagram for the manufacturing of the display module;

[0042] Figure 4 This is a schematic diagram of a second structure of the display module provided in the embodiments of this application;

[0043] Figures 5A to 5C for Figure 2 The diagram shows the process flow chart for the second structure of the display module. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0045] This application provides a display module and its manufacturing method, as well as a video wall. These will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0046] Example 1

[0047] Please see Figure 1 This is a schematic diagram of the first structure of the display module provided in the embodiments of this application.

[0048] In this embodiment, the display module 10 includes a display area 100 and a connection area 200 located on one side of the display area 100. The display module 10 includes at least a substrate 11, a connection portion 14, and a connection line 15. The substrate 11 has a first surface 11A and a second surface 11B facing each other, and side surfaces 11C of the first surface 11A and the second surface 11B. The connection portion 14 is located within the connection area 200, and the connection portion 14 includes a first connection terminal 14A disposed on the first surface 11A and a first connection terminal 14A disposed on the second surface 11B. The second connecting terminal 14B; the connecting line 15 is electrically connected to both the first connecting terminal 14A and the second connecting terminal 14B. The connecting line 15 includes a first sub-connecting line 151, a second sub-connecting line 152 and a third sub-connecting line 153. The first sub-connecting line 151 is located at least on the side surface 11C, the second sub-connecting line 152 is located at least on the first surface 11A and is connected to the first connecting terminal 14A, and the third sub-connecting line 153 is located at least on the second surface 11B and is connected to the second connecting terminal 14B.

[0049] Wherein, the adhesion between the second sub-connecting line 152 and the substrate 11 is greater than the adhesion between the first sub-connecting line 151 and the substrate 11, and the adhesion between the third sub-connecting line 153 and the substrate 11 is greater than the adhesion between the first sub-connecting line 151 and the substrate 11.

[0050] It is understood that this embodiment, by setting the connecting line to include a first sub-connecting line, a second sub-connecting line, and a third sub-connecting line, wherein the first sub-connecting line is at least located on the side surface, the second sub-connecting line is at least located on the first surface and connected to the first connecting terminal, and the third sub-connecting line is at least located on the second surface and connected to the second connecting terminal, and the adhesion between the second sub-connecting line and the substrate is greater than that between the first sub-connecting line and the substrate, and the adhesion between the third sub-connecting line and the substrate is greater than that between the first sub-connecting line and the substrate, thereby avoiding the risk of line breakage at the corners of the first surface and the side surface, and at the corners of the second surface and the side surface, after the side traces are formed on the side surface of the substrate using the silver paste transfer process in the prior art.

[0051] The material of the first sub-connecting line 151 is different from that of the second sub-connecting line 152, and the material of the second sub-connecting line 152 is the same as that of the third sub-connecting line 153; preferably, the material of the first sub-connecting line 151 is conductive silver paste, and the materials of the second sub-connecting line 152 and the third sub-connecting line 153 are one or more metal materials selected from copper, molybdenum and aluminum.

[0052] Further, in this embodiment, the side surface 11C includes a first inclined surface 11C1, a second inclined surface 11C2, and a vertical surface 11C3. The first inclined surface 11C1 is located between the first surface 11A and the vertical surface 11C3, and the second inclined surface 11C2 is located between the second surface 11B and the vertical surface 11C3. The first sub-connecting line 151 is located at least on the vertical surface 11C3, the second sub-connecting line 152 extends from the first surface 11A to the first inclined surface 11C1, and the second sub-connecting line 152 contacts the first sub-connecting line 151. The third sub-connecting line 153 extends from the second surface 11B to the second inclined surface 11C2, and the third sub-connecting line 153 contacts the first sub-connecting line 151.

[0053] Specifically, in this embodiment, the first inclined surface 11C1 and the second inclined surface 11C2 can be either arc surfaces or planes. The first surface 11A and the first inclined surface 11C1 form a first preset angle, and the second surface 11B and the second inclined surface 11C2 form a second preset angle. Both the first preset angle and the second preset angle are obtuse angles. Preferably, the first surface 11A, the first inclined surface 11C1, the second inclined surface 11C2, the vertical surface 11C3, and the second surface 11B are all planes, and the first preset angle and the second preset angle are equal.

[0054] It is understood that in this embodiment, by setting the second sub-connecting line 152 to extend from the first surface 11A to the first inclined surface 11C1, where both the first surface 11A and the first inclined surface 11C1 are planes and form a first preset angle between them (the first preset angle being obtuse), the second sub-connecting line 152 transitions smoothly between the first surface 11A and the first inclined surface 11C1, thereby avoiding the problem of the second sub-connecting line 152 breaking. Simultaneously, the third sub-connecting line 153 extends from the second surface 11B to the second inclined surface 11C2, where both the second inclined surface 11C2 and the second surface 11B are planes and form a second preset angle between them (the second preset angle being obtuse), thereby also allowing the third sub-connecting line 153 to transition smoothly between the second surface 11B and the second inclined surface 11C2, thereby avoiding the problem of the third sub-connecting line 153 breaking.

[0055] Further, in this embodiment, the first sub-connecting line 151 is located on the connection area 200, the first inclined surface 11C1, the vertical surface 11C3, and the second inclined surface 11C2; one end of the second sub-connecting line 152 covers and contacts the first connecting terminal 14A, and the other end of the second sub-connecting line 152 is connected to one end of the first sub-connecting line 151; one end of the third sub-connecting line 153 covers and contacts the second connecting terminal 14B, and the other end of the third sub-connecting line 153 is connected to the other end of the first sub-connecting line 151; wherein, the orthographic projection of the first sub-connecting line 151 on the first inclined surface 11C1 at least covers a portion of the second sub-connecting line 152, and the orthographic projection of the first sub-connecting line 151 on the second inclined surface 11C2 at least covers a portion of the third sub-connecting line 153.

[0056] Specifically, in this embodiment, one end of the second sub-connecting line 152 is connected to the first connecting terminal 14A, the other end of the second sub-connecting line 152 is connected to one end of the first sub-connecting line 151, one end of the third sub-connecting line 153 is connected to the second connecting terminal 14B, and the other end of the third sub-connecting line 153 is connected to the other end of the first sub-connecting line 151, thereby coupling the first connecting terminal 14A and the second connecting terminal 14B. The fact that one end of the second sub-connecting line 152 covers the first connecting terminal 14A increases the contact area between the second sub-connecting line 152 and the first connecting terminal 14A, and that one end of the third sub-connecting line 153 covers the second connecting terminal 14B increases the contact area between the third sub-connecting line 153 and the second connecting terminal 14B, thereby ensuring the reliability and stability of the connection.

[0057] Further, in this embodiment, the display module 10 also includes an array driving layer 12, a fan-out portion 13, a plurality of light-emitting devices 16, bonding pads 21, a flip-chip film 22, and a circuit board 23. The array driving layer 12 is disposed on the first surface 11A of the substrate 11 and is located in the display area 100. The fan-out portion 13 is disposed on the second surface 11B of the substrate 11 and includes a plurality of fan-out traces. The plurality of light-emitting devices 16 are spaced apart on the side of the array driving layer 12 away from the substrate 11. The bonding pads 21 are located on the second surface 11B and are connected to the fan-out traces of the fan-out portion 13. The flip-chip film 22 is disposed on the side of the bonding pads 21 away from the substrate 11. The circuit board 23 is disposed on the side of the flip-chip film 22 away from the bonding pads 21 and is connected to the flip-chip film 22.

[0058] Specifically, the array driving layer 12 is a thin film transistor (TFT) circuit corresponding to each of the light-emitting devices 16; the light-emitting device 16 can be a mini light-emitting diode (Mini-LED) or a micro light-emitting diode (Micro-LED), and multiple light-emitting devices 16 are arrayed on the substrate 11, and the size of the light-emitting devices 16 and their row and column spacing can be set according to actual needs; the circuit board 23 includes, but is not limited to, a printed circuit board (PCB) or a flexible printed circuit (FPC).

[0059] Furthermore, the display module 10 also includes a protective layer 17, a transparent adhesive layer 18, a black matrix layer 19, and a cover plate 20; wherein, the protective layer 17 covers the first connection terminal 14A, the second connection terminal 14B, and the connection line 15, thereby protecting the first connection terminal 14A, the connection line 15, and the second connection terminal 14B from external water and oxygen corrosion. The material of the protective layer 17 includes, but is not limited to, ultraviolet light curable adhesive. The transparent adhesive layer 18 is located on the first surface 11A, and the orthographic projection of the transparent adhesive layer 18 on the substrate 11 covers the array driving layer 12 and the plurality of light-emitting devices 16. The black matrix layer 19 includes a plurality of black matrices 191, one black matrix 191 is disposed corresponding to two light-emitting devices 16, and one black matrix 191 is located between the two corresponding light-emitting devices 16, that is, the orthographic projection of the black matrix 191 on the substrate 11 is located between two adjacent light-emitting devices 16. The cover plate 20 is located on the side of the black matrix layer 19 away from the substrate 11.

[0060] It is understood that the array driving layer 12, the fan-out portion 13, the light-emitting device 16, the protective layer 17, the transparent adhesive layer 18, the black matrix layer 19, the cover plate 20, the bonding pad 21, the flip-chip film 22, and the circuit board 23 described in this embodiment are all conventional film layer structures, and will not be described in detail in this embodiment.

[0061] Please combine Figure 1 , Figure 2 ,as well as Figures 3A to 3C ;in, Figure 2 A flowchart illustrating the manufacturing method of the display module provided in this application embodiment; Figures 3A to 3C for Figure 2 The first process flow diagram of the display module manufacturing method is shown in the figure.

[0062] This embodiment provides a method for manufacturing a display module. The display module 10 includes a display area 100 and a connection area 200 located on one side of the display area 100. The method for manufacturing the display module includes the following steps:

[0063] Step S10: Provide a substrate 11, the substrate 11 having opposing first surfaces 11A and second surfaces 11B, and a side surface 11C connecting the first surface 11A and the second surface 11B.

[0064] Specifically, step S10 further includes edge grinding of the substrate 11, forming a first inclined surface 11C1 on the side of the side 11C near the first surface 11A, and forming a second inclined surface 11C2 on the side of the side 11C near the second surface 11B; wherein, the side 11C also includes a vertical surface 11C3 located between the first inclined surface 11C1 and the second inclined surface 11C2; as shown Figure 3A As shown.

[0065] The substrate 11 may include a flexible substrate or a rigid substrate; specifically, when the substrate 11 is a flexible substrate, the material of the flexible substrate 11 may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane-based resin, cellulose resin, siloxane resin, polyimide-based resin, and polyamide-based resin; when the substrate 11 is a rigid substrate, the material of the rigid substrate may include one of metal or glass; wherein, the material of the substrate 11 may be selected according to the actual situation, and this embodiment does not impose specific limitations on it.

[0066] Furthermore, the first inclined surface 11C1 and the second inclined surface 11C2 can be either arc surfaces or planes; preferably, the first surface 11A, the first inclined surface 11C1, the vertical surface 11C3, the second inclined surface 11C2, and the second surface 11B are all planes, thereby improving the quality of the second sub-connecting line 152 and the third sub-connecting line 153 in the subsequent manufacturing process, making them less prone to breakage.

[0067] Specifically, the first surface 11A and the first inclined surface 11C1 form a first preset angle, and the second surface 11B and the second inclined surface 11C2 form a second preset angle, both of which are obtuse angles; preferably, the first preset angle and the second preset angle are equal; it can be understood that by setting the preset angles to obtuse angles in this embodiment, the second sub-connecting line 152 in the subsequent manufacturing method transitions smoothly on the first surface 11A and the first inclined surface 11C1, and the third sub-connecting line 153 transitions smoothly on the second surface 11B and the second inclined surface 11C2, thus avoiding the problem of broken wires in the second sub-connecting line 152 and the third sub-connecting line 153.

[0068] Step S20: A first connection terminal 14A is formed on the first surface 11A, and a second connection terminal 14B is formed on the second surface 11B. Both the first connection terminal 14A and the second connection terminal 14B are located within the connection area 200.

[0069] Specifically, step S20 further includes forming an array driving layer 12 on the first surface 11A and forming a fan-out portion 13 on the second surface 11B. The array driving layer 12 is located within the display area 100, and the fan-out portion 13 is not located within the connection area 200. Figure 3B As shown.

[0070] Step S30: A first sub-connection line 151 is formed on the side surface 11C using a first process, and a second sub-connection line 152 is formed on the first surface 11A and a third sub-connection line 153 is formed on the second surface 11B using a second process. The first sub-connection line 151 is located at least on the side surface 11C, the second sub-connection line 152 is located at least on the first surface 11A and is connected to the first connection terminal 14A, and the third sub-connection line 153 is located at least on the second surface 11B and is connected to the second connection terminal 14B. The adhesion between the second sub-connection line 152 and the substrate 11 is greater than the adhesion between the first sub-connection line 151 and the substrate 11.

[0071] Furthermore, in step S30, the first process is a silver paste transfer process, and the second process is a physical vapor deposition process.

[0072] Specifically, step S30 includes the following steps:

[0073] Step S31: A second sub-connector 152 is formed by physical vapor deposition. One end of the second sub-connector 152 covers and contacts the first connection terminal 14A, and the other end of the second sub-connector 152 extends from the first surface 11A to the first inclined surface 11C1.

[0074] Step S32: A third sub-connector 153 is formed by physical vapor deposition. One end of the third sub-connector 153 covers and contacts the second connection terminal 14B, and the other end of the third sub-connector 153 extends from the second surface 11B to the second inclined surface 11C2.

[0075] Step S33: A first sub-connecting line 151 is formed using silver paste transfer printing. The first sub-connecting line 151 is located on the first inclined surface 11C1, the vertical surface 11C3, and the second inclined surface 11C2. The first sub-connecting line 151 contacts the second sub-connecting line 152 on the first inclined surface 11C1, and the first sub-connecting line 151 contacts the third sub-connecting line 153 on the second inclined surface 11C2. Figure 3C As shown.

[0076] The first sub-connecting line 151, the second sub-connecting line 152, and the third sub-connecting line 153 form a connecting line 15. The connecting line 15 is located on the first surface 11A, the first inclined surface 11C1, the vertical surface 11C3, the second inclined surface 11C2, and the second surface 11B of the substrate. One end of the connecting line 15 is connected to the first connecting terminal 14A, and the other end of the connecting line 15 is connected to the second connecting terminal 14B, thereby coupling the first connecting terminal 14A and the second connecting terminal 14B.

[0077] It is understood that in this embodiment, a first sub-connection line 151 is formed on the side surface 11C of the substrate 11 using a silver paste transfer process, and a second sub-connection line 152 and a third sub-connection line 153 are formed using a physical vapor deposition method. The first sub-connection line 151, the second sub-connection line 152, and the third sub-connection line 153 form a connection line 15. Compared to the silver paste transfer process which coats conductive silver paste on the side surface of the substrate, the physical vapor deposition process, through sputtering, produces connection lines with better adhesion to the substrate. Therefore, the... The adhesion between the second sub-connecting line 152 and the substrate 11 is greater than the adhesion between the first sub-connecting line 151 and the substrate 11, and the adhesion between the third sub-connecting line 153 and the substrate 11 is greater than the adhesion between the first sub-connecting line 151 and the substrate 11. This avoids the risk of breakage at the corner of the first surface 11A and the first inclined surface 11C1 after the side 11C trace is formed on the side 11C of the substrate 11 using the silver paste transfer process in the prior art.

[0078] Meanwhile, the second sub-connection line 152 extends from the first surface 11A toward the direction close to the first inclined surface 11C1, and the third sub-connection line 153 extends from the second surface 11B toward the direction close to the second inclined surface 11C2. The first surface 11A, the first inclined surface 11C1, the second inclined surface 11C2, and the second surface 11B are all planar. Compared with the prior art, which rotates the substrate 11 and uses physical vapor deposition to form side connection traces on the side surface 11C of the substrate 11 (i.e., rotational coating), this embodiment uses a planar coating method to form the second sub-connection line 152 on the first surface 11A and the first inclined surface 11C1 of the substrate 11, and the third sub-connection line 153 on the second surface 11B and the second inclined surface 11C2 of the substrate 11. This avoids the problem of metal film easily accumulating at the edge of the substrate 11, thereby improving the yield of the connection traces.

[0079] It should be noted that, in this embodiment, the material of the first sub-connecting line 151 is different from the material of the second sub-connecting line 152, and the material of the second sub-connecting line 152 is the same as the material of the third sub-connecting line 153; preferably, the material of the first sub-connecting line 151 is conductive silver paste, and the materials of the second sub-connecting line 152 and the third sub-connecting line 153 are one or more metal materials selected from copper, molybdenum and aluminum.

[0080] Furthermore, the method for manufacturing the display module also includes the following steps:

[0081] Step S40: A plurality of light-emitting devices 16 are formed on the side of the array driving layer 12 away from the substrate 11.

[0082] Step S50: Form a protective layer 17, which covers the first connecting terminal 14A, the second connecting terminal 14B, and the connecting line 15.

[0083] Step S60: A transparent adhesive layer 18, a black matrix layer 19, and a cover plate 20 are sequentially formed on the side of the light-emitting device 16 away from the array driving layer 12.

[0084] Step S70: A bonding pad 21 is formed on the second surface 11B of the substrate. A flip-chip film 22 is formed on the side of the bonding pad 21 away from the substrate. A circuit board 23 is soldered on the side of the flip-chip film 22 away from the bonding pad 21, wherein the bonding pad 21 is connected to the fan-out line of the fan-out portion 13; Figure 1 As shown.

[0085] Example 2

[0086] Please see Figure 4 This is a schematic diagram of a second structure of the display module provided in the embodiments of this application.

[0087] In this embodiment, the structure of the display module is similar to / the same as that of the display module provided in Embodiment 1 above. Please refer to the description of the display module in the above embodiment for details, which will not be repeated here.

[0088] In this embodiment, the first sub-connecting line 151 is located on the connecting area 200, the first inclined surface 11C1, the vertical surface 11C3, and the second inclined surface 11C2. One end of the first sub-connecting line 151 is connected to the first connecting terminal 14A, and the other end of the first sub-connecting line 151 is connected to the second connecting terminal 14B. The second sub-connecting line 152 is located on the side of the first sub-connecting line 151 away from the substrate 11, and the orthographic projection of the second sub-connecting line 152 on the first surface 11A and the first inclined surface 11C1 covers the first sub-connecting line 151. The third sub-connecting line 153 is located on the side of the first sub-connecting line 151 away from the substrate 11, and the orthographic projection of the third sub-connecting line 153 on the second surface 11B and the second inclined surface 11C2 covers the first sub-connecting line 151.

[0089] It is understood that in this embodiment, one end of the first sub-connecting line 151 is connected to the first connecting terminal 14A, and the other end of the first sub-connecting line 151 is connected to the second connecting terminal 14B, thereby connecting the first connecting terminal 14A and the second connecting terminal 14B. Wherein, one end of the first sub-connecting line 151 covers the first connecting terminal 14A, and the other end of the first sub-connecting line 151 covers the second connecting terminal 14B, thereby increasing the contact area between the connecting line 15 and the first connecting terminal 14A and the second connecting terminal 14B, thus ensuring the reliability and stability of the connection.

[0090] Specifically, on the first surface 11A, the orthographic projection of the second sub-connecting line 152 covers the first connecting terminal 14A, the orthographic projection of the second sub-connecting line 152 on the first surface 11A covers the orthographic projection of the first sub-connecting line 151 on the first surface 11A; the orthographic projection of the second sub-connecting line 152 on the first inclined surface 11C1 covers the orthographic projection of the first sub-connecting line 151 on the first inclined surface 11C1.

[0091] It is understood that this embodiment solves the technical problem of display defects caused by broken signal lines in existing display modules by setting the orthographic projection of the second sub-connecting line 152 on the first surface 11A and the first inclined surface 11C1 to cover the first sub-connecting line 151, and the second sub-connecting line 152 connected to the first sub-connecting line 151. The third sub-connecting line 153 is also connected to the first sub-connecting line 151, so that when the first sub-connecting line 151 breaks at the corner of the first surface 11A and the first inclined surface 11C1, the signal can be transmitted from the second sub-connecting line 152; and when the first sub-connecting line 151 breaks at the corner of the second surface 11B and the second inclined surface 11C2, the signal can be transmitted from the third sub-connecting line 153.

[0092] Furthermore, in this embodiment, by stacking the first sub-connecting line 151 and the second sub-connecting line 152 on the first surface 11A and the first inclined surface 11C1, and stacking the first sub-connecting line 151 and the third sub-connecting line 153 on the second surface 11B and the second inclined surface 11C2, the on-resistance of the connecting line 15 can be effectively reduced, and the stability of the device can be improved.

[0093] Furthermore, please combine Figure 2 , Figure 4 as well as Figures 5A to 5C ;in, Figures 5A to 5C for Figure 2 The diagram shows the second process flow for the module manufacturing method.

[0094] In this embodiment, the display module 10 includes a display area 100 and a connection area 200 adjacent to the display area 100. The method for manufacturing the display module includes the following steps:

[0095] Step S10: Provide a substrate 11, the substrate 11 having opposing first surfaces 11A and second surfaces 11B, and a side surface 11C connecting the first surface 11A and the second surface 11B.

[0096] Specifically, step S10 further includes edge grinding of the substrate 11, forming a first inclined surface 11C1 on the side of the side 11C near the first surface 11A, and forming a second inclined surface 11C2 on the side of the side 11C near the second surface 11B; wherein, the side 11C also includes a vertical surface 11C3 located between the first inclined surface 11C1 and the second inclined surface 11C2; as shown Figure 5A As shown.

[0097] Step S20: A first connection terminal 14A is formed on the first surface 11A, and a second connection terminal 14B is formed on the second surface 11B. Both the first connection terminal 14A and the second connection terminal 14B are located within the connection area 200.

[0098] Specifically, step S20 further includes forming an array driving layer 12 on the first surface 11A and forming a fan-out portion 13 on the second surface 11B. The array driving layer 12 is located within the display area 100, and the fan-out portion 13 is not located within the connection area 200. Figure 5B As shown.

[0099] Step S30: A first sub-connection line 151 is formed on the side surface 11C using a first process, and a second sub-connection line 152 is formed on the first surface 11A and a third sub-connection line 153 is formed on the second surface 11B using a second process. The first sub-connection line 151 is located at least on the side surface 11C, the second sub-connection line 152 is located at least on the first surface 11A and is connected to the first connection terminal 14A, and the third sub-connection line 153 is located at least on the second surface 11B and is connected to the second connection terminal 14B. The adhesion between the second sub-connection line 152 and the substrate 11 is greater than the adhesion between the first sub-connection line 151 and the substrate 11.

[0100] Furthermore, in step S30, the first process is a silver paste transfer process, and the second process is a physical vapor deposition process.

[0101] Specifically, step S30 includes the following steps:

[0102] Step S31: A first sub-connecting line 151 is formed using a silver paste transfer process. The first sub-connecting line 151 is located on the connecting area 200, the first inclined surface 11C1, the vertical surface 11C3, and the second inclined surface 11C2. One end of the first sub-connecting line 151 is connected to the first connecting terminal 14A, and the other end of the first sub-connecting line 151 is connected to the second connecting terminal 14B.

[0103] Step S32: A second sub-connection line 152 is formed using a physical vapor deposition process. The second sub-connection line 152 is located on the side of the first sub-connection line 151 away from the substrate 11, and the orthographic projection of the second sub-connection line 152 on the first surface 11A and the first inclined surface 11C1 covers the first sub-connection line 151.

[0104] Step S33: A third sub-connector 153 is formed using a physical vapor deposition process. The third sub-connector 153 is located on the side of the first sub-connector 151 away from the substrate 11, and the orthographic projection of the third sub-connector 153 on the second surface 11B and the second inclined surface 11C2 covers the first sub-connector 151. Figure 5C As shown.

[0105] Specifically, on the first surface 11A, the orthographic projection of the second sub-connecting line 152 covers the first connecting terminal 14A, the orthographic projection of the second sub-connecting line 152 on the first surface 11A covers the orthographic projection of the first sub-connecting line 151 on the first surface 11A, and the orthographic projection of the second sub-connecting line 152 on the first inclined surface 11C1 covers the orthographic projection of the first sub-connecting line 151 on the first inclined surface 11C1.

[0106] It is understood that in this embodiment, a first sub-connection line 151 is formed on the side surface 11C of the substrate 11 using a silver paste transfer process, and a second sub-connection line 152 and a third sub-connection line 153 are formed using a physical vapor deposition method. The first sub-connection line 151 serves as a connection line 15, and the first connection terminal 14A and the second connection terminal 14B are coupled together. The orthographic projection of the second sub-connection line 152 at the junction of the first surface 11A and the first inclined surface 11C1 covers the first sub-connection line 151, and the orthographic projection of the third sub-connection line 153 at the junction of the second surface 11B and the second inclined surface 11C2 covers the first sub-connection line 151. Thus, the physical vapor deposition method compensates for the uneven stress on the connection lines at the corners of the substrate after forming the connection lines on the side surface of the substrate using the silver paste transfer process in the prior art, which easily leads to the phenomenon of line breakage and the risk of short circuit or open circuit.

[0107] Continuing from the above, specifically, when the first sub-connection line 151 breaks at the corner of the first surface 11A and the first inclined surface 11C1, the second sub-connection line 152 can compensate for the breakage of the first sub-connection line 151, thereby maintaining signal transmission. When the first sub-connection line 151 breaks at the corner of the second surface 11B and the second inclined surface 11C2, the third sub-connection line 153 can compensate for the breakage of the first sub-connection line 151, thereby maintaining signal transmission. Furthermore, in this embodiment, by stacking the first sub-connection line 151 and the second sub-connection line 152 on the first surface 11A and the first inclined surface 11C1, and stacking the first sub-connection line 151 and the third sub-connection line 153 on the second surface 11B and the second inclined surface 11C2, the on-resistance of the connection line 15 can be effectively reduced, and the stability of the device can be improved.

[0108] Furthermore, in this embodiment, the method for manufacturing the display module further includes the following steps:

[0109] Step S40: A plurality of light-emitting devices 16 are formed on the side of the array driving layer 12 away from the substrate 11.

[0110] Step S50: Form a protective layer 17, which covers the first connecting terminal 14A, the second connecting terminal 14B, and the connecting line 15.

[0111] Step S60: A transparent adhesive layer 18, a black matrix layer 19, and a cover plate 20 are sequentially formed on the side of the light-emitting device 16 away from the array driving layer 12.

[0112] Step S70: A bonding pad 21 is formed on the second surface 11B of the substrate. A flip-chip film 22 is formed on the side of the bonding pad 21 away from the substrate. A circuit board 23 is soldered on the side of the flip-chip film 22 away from the bonding pad 21, wherein the bonding pad 21 is connected to the fan-out line of the fan-out portion 13; Figure 4 As shown.

[0113] This embodiment provides a video wall, which includes at least two display modules as described in any of the above embodiments.

[0114] It is understood that the display module has been described in detail in the above embodiments, and will not be repeated here.

[0115] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0116] The above provides a detailed description of a display module and its manufacturing method, as well as a splicing screen, provided by the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display module, characterized in that, The display module includes a display area and a connection area located on one side of the display area, and includes at least: The substrate has opposing first and second surfaces and a side surface connecting the first and second surfaces; A connecting portion is located within the connecting area, and the connecting portion includes a first connecting terminal disposed on the first surface and a second connecting terminal disposed on the second surface; A connecting wire electrically connected to both the first connecting terminal and the second connecting terminal, the connecting wire including a first sub-connecting wire, a second sub-connecting wire, and a third sub-connecting wire, wherein the first sub-connecting wire is located at least on the side surface; the second sub-connecting wire is located on the first surface and a portion of the side surface and is connected to the first connecting terminal; and the third sub-connecting wire is located on the second surface and a portion of the side surface and is connected to the second connecting terminal. The first sub-connecting line and the second sub-connecting line are stacked, and the first sub-connecting line and the third sub-connecting line are stacked. The adhesion between the second sub-connecting line and the substrate is greater than the adhesion between the first sub-connecting line and the substrate.

2. The display module according to claim 1, characterized in that, The side surface includes a first inclined surface, a second inclined surface, and a vertical surface. The first inclined surface is located between the first surface and the vertical surface, the second inclined surface is located between the second surface and the vertical surface, and the vertical surface is perpendicular to the first surface. Wherein, the first sub-connecting line is located at least on the vertical plane, the second sub-connecting line extends from the first surface to the first inclined surface, and the second sub-connecting line is stacked with the first sub-connecting line; the third sub-connecting line extends from the second surface to the second inclined surface, and the third sub-connecting line is stacked with the first sub-connecting line.

3. The display module according to claim 2, characterized in that, The first sub-connecting line is located on the first inclined plane, the vertical plane, and the second inclined plane; One end of the second sub-connecting line covers the first connecting terminal and is in contact with the first connecting terminal, and the other end of the second sub-connecting line is connected to one end of the first sub-connecting line; One end of the third sub-connecting line covers and contacts the second connecting terminal, and the other end of the third sub-connecting line is connected to the other end of the first sub-connecting line. Wherein, the orthographic projection of the first sub-connecting line on the first inclined plane at least covers a portion of the second sub-connecting line, and the orthographic projection of the first sub-connecting line on the second inclined plane at least covers a portion of the third sub-connecting line.

4. The display module according to claim 2, characterized in that, The first sub-connecting line is located on the connecting area, the first inclined surface, the vertical surface, and the second inclined surface; One end of the first sub-connecting line is connected to the first connecting terminal, and the other end of the first sub-connecting line is connected to the second connecting terminal; The second sub-connecting line is located on the side of the first sub-connecting line away from the substrate, and the orthographic projection of the second sub-connecting line on the first surface and the first inclined surface covers the first sub-connecting line; The third sub-connecting line is located on the side of the first sub-connecting line away from the substrate, and the orthographic projection of the third sub-connecting line on the second surface and the second inclined surface covers the first sub-connecting line.

5. The display module according to claim 1, characterized in that, The display module also includes: An array driving layer is disposed on a first surface of the substrate, and the array driving layer is located in the display area; A fan-out portion is disposed on the second surface of the substrate; Multiple light-emitting elements are spaced apart on the side of the array driving layer away from the substrate; A bonding pad is located on the second surface, and the bonding pad is connected to the fan-out line of the fan-out portion; A flip-chip film is disposed on the side of the bonding pad away from the substrate; A circuit board is disposed on the side of the flip-chip film away from the bonding pads, and the circuit board is connected to the flip-chip film.

6. The display module according to claim 1, characterized in that, The material of the first sub-connector is different from that of the second sub-connector, and the material of the second sub-connector is the same as that of the third sub-connector.

7. The display module according to claim 6, characterized in that, The first sub-connector is made of conductive silver paste, and the second and third sub-connectors are made of one or more metals selected from copper, molybdenum, and aluminum, or alloys of two or more of them.

8. A method for manufacturing a display module, characterized in that, The manufacturing method includes a display area and a connection area located on one side of the display area, comprising the following steps: A substrate is provided, the substrate having opposing first and second surfaces, and a side surface connecting the first and second surfaces; A first connection terminal is formed on the first surface, and a second connection terminal is formed on the second surface, wherein both the first connection terminal and the second connection terminal are located within the connection area; A first sub-connecting line is formed on the side using a first process, and a second sub-connecting line is formed on the first surface and a third sub-connecting line is formed on the second surface using a second process. The first sub-connecting line is located at least on the side, the second sub-connecting line is located on the first surface and a portion of the side and is connected to the first connecting terminal, and the third sub-connecting line is located on the second surface and a portion of the side and is connected to the second connecting terminal. The first sub-connecting line and the second sub-connecting line are stacked, and the first sub-connecting line and the third sub-connecting line are stacked. The adhesion between the second sub-connecting line and the substrate is greater than the adhesion between the first sub-connecting line and the substrate.

9. The method for manufacturing a display module according to claim 8, characterized in that, The first process is a silver paste transfer process, and the second process is a physical vapor deposition process.

10. A video wall, characterized in that, The splicing screen includes at least two display modules as described in any one of claims 1-7.

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