A multi-layer environmentally friendly high-density board and its preparation method

Abstract

The present application discloses a multi-layer environmentally friendly high-density board and a preparation method thereof, and relates to the technical field of high-density boards. The present application includes: a center board, which is made of polyethylene, acrylic adhesive and wood chips, and the weight proportions of polyethylene, acrylic adhesive and wood chips are respectively: 146 parts of polyethylene, 154 parts of wood chips, and 90 parts of acrylic adhesive; an outer frame board, which is bonded to the center board by glue, and the outer frame board is used to enclose the four sides of the center board; an outer panel board, which is bonded to the outer frame board by glue, and the outer panel board is connected to the center board by glue. The present application mixes the center board with polyethylene and wood chips, and after the center board is made, the center board is protected by the outer frame board and the outer panel board. When the high-density board encounters water during use, the water flow is absorbed by the center board, and the water is absorbed by the polyethylene, and the water absorption deformation rate of the polyethylene is small, which reduces the possibility of the high-density board being greatly deformed after being damp, and increases the practicality of the device.

Description

Technical Field

[0001] The present application relates to the technical field of high-density boards, and in particular to a multi-layer environmentally friendly high-density board and a preparation method thereof. Background Art

[0002] High-density fiberboard is a type of artificial fiberboard. Its main component is wood fiber. It is an environmentally friendly furniture and building material substitute for logs after hot grinding, drying, gluing, paving, hot pressing, post-processing and sanding.

[0003] Existing high-density boards are mostly made by soaking, crushing and gluing sawdust after wood processing. However, since existing high-density boards are made of sawdust, they have poor moisture resistance during use and are prone to swelling when wet, resulting in poor performance of the high-density boards.

[0004] Moreover, when processing high-density boards, since it is necessary to press multiple prefabricated boards formed by wood chips together with glue, glue is applied between multiple wooden boards during processing, and then pressed together by a pressing machine. However, when the glue between the wooden boards is pressurized, it will be pressed to the edge of the board body, so that after the board body is formed, there will be excess glue remaining around it, affecting the appearance of the high-density board.

[0005] To this end, the present application provides a multi-layer environmentally friendly high-density board and a preparation method thereof to improve this problem. Summary of the Invention

[0006] The purpose of this application is to solve the problems in the above-mentioned background technology. This application provides a multi-layer environmentally friendly high-density board and a preparation method thereof.

[0007] In order to achieve the above-mentioned purpose, this application specifically adopts the following technical solutions:

[0008] A multi-layer environmentally friendly high-density board, comprising:

[0009] A center board made of polyethylene, an acrylic adhesive, and wood chips, wherein the weight ratios of the polyethylene, the acrylic adhesive, and the wood chips are as follows: 146 parts polyethylene, 154 parts wood chips, and 90 parts acrylic adhesive;

[0010] The outer frame plate is bonded to the center plate with glue and is used to enclose the four sides of the center plate;

[0011] The outer panel is bonded to the outer frame panel by glue, and the outer panel is connected to the center panel by glue.

[0012] Furthermore, the outer frame plate is made of acrylic adhesive and wood chips, and the weight proportions of the wood chips and the acrylic adhesive are respectively: 160 parts of wood chips and 102 parts of acrylic adhesive.

[0013] Furthermore, the outer panel is made of sawdust, paraffin wax and acrylic adhesive, and the weight proportions of sawdust, paraffin wax and acrylic adhesive are respectively: sawdust is 103 parts, paraffin wax is 40 parts, and acrylic adhesive is 76 parts.

[0014] The present application also provides a method for preparing a multi-layer environmentally friendly high-density board, which is used to prepare any of the multi-layer environmentally friendly high-density boards described above, comprising the following steps:

[0015] S1, prefabricate the center board, soak wood chips and polyethylene in water and dry them, then mix them with acrylic adhesive, and place the mixed materials into a mold to cool and shape;

[0016] S2, prefabricating the outer frame board, mixing wood chips with acrylic adhesive, placing the mixed material into a mold, cooling and shaping it, forming a first prefabricated board, and opening a frame in the middle of the first prefabricated board to accommodate the center board;

[0017] S3, prefabricating the outer panel, mixing sawdust with acrylic adhesive, placing the mixed material into a mold to cool and shape it to form a second prefabricated panel, and polishing one side of the second prefabricated panel and applying paraffin wax;

[0018] S4, pre-assembly, apply acrylic adhesive to the periphery of the center panel and place it inside the outer frame panel to connect the two;

[0019] S5. Pressing: Apply acrylic adhesive on both sides of the center plate and the outer frame plate, and press the side of the outer panel not coated with acrylic adhesive with the center plate. After pressing, scrape off the acrylic adhesive on the peripheral side of the formed high-density board.

[0020] Furthermore, in step S2, the center board is first placed on the first prefabricated board, the area of the frame is determined, and then the first prefabricated board is cut by a reciprocating saw to form a frame thereon.

[0021] Furthermore, in step S3, after the second prefabricated board is manufactured, the thickness of the second prefabricated board is cut by a planer or an electric planer, and then the second prefabricated board is ground and polished and coated with paraffin.

[0022] Furthermore, according to the above-mentioned method for preparing a multi-layer environmentally friendly high-density board, a multi-layer high-density board pressing device is used in step S5, which includes a mounting shell, a hydraulic rod and a pressing plate mounted on the mounting shell, and the pressing plate is mounted on the telescopic end of the hydraulic rod, and is characterized in that it also includes:

[0023] A bearing member, which is used to bear the center plate, the outer frame plate and the outer panel, and the bearing member is in sliding cooperation with the mounting shell;

[0024] A limiting member is installed on the bearing member, and is used to limit the position of the outer panel on the bearing member;

[0025] The scraper is installed between the limiting member and the bearing member, and is used to scrape the acrylic adhesive on the peripheral side of the high-density board.

[0026] Furthermore, a guide rail is installed on the mounting shell, and the bearing member includes:

[0027] A bearing platform is provided with a slider which is slidably mounted in a guide rail. The bearing platform is used to carry the center plate, outer frame plate and outer panel.

[0028] The threaded rod is movably mounted on the slider, and the threaded rod is matched with the thread of the mounting shell.

[0029] Furthermore, the limiting member includes:

[0030] A limiting hole group is provided on the bearing platform, the limiting hole group includes a plurality of holes, there are multiple limiting hole groups, and the limiting hole groups are linearly arrayed on the bearing platform along the width direction of the bearing platform;

[0031] A limiting cylinder is used to be inserted into the hole. The number of limiting cylinders is the same as the number of holes. A limiting rod is installed in the limiting cylinder through a connecting spring;

[0032] The connecting rod is connected to the limiting rod, and the connecting rod is used to connect adjacent limiting rods. The bearing platform is provided with a groove for accommodating the connecting rod.

[0033] Furthermore, the scraper comprises:

[0034] A scraping block is mounted on a limiting rod close to the outside of the mounting shell, wherein the side of the scraping block close to the high-density board is a rough surface, and the scraping block is used to scrape the side wall of the high-density board;

[0035] A shovel plate is slidably mounted on the bearing platform, with a resisting spring installed between the shovel plate and the bearing platform, and the shovel plate is used to scrape the side wall of the high-density board;

[0036] The hook plate is mounted on the shovel plate, and an arc rod is movably mounted on the bearing platform. When the arc rod is rotated to connect with the hook plate, the sliding of the shovel plate is restricted;

[0037] The receiving groove is provided on the supporting platform, an insert block is installed in the receiving groove, the arc rod is movably matched with the receiving groove, and a notch connected to the insert block is provided on the arc rod. When the notch is connected to the insert block, the rotation of the arc rod is restricted.

[0038] The beneficial effects of this application are as follows:

[0039] 1. In this application, the center board is mixed with polyethylene and wood chips to form the center board, and then the center board is protected by the outer frame board and the outer panel board. When the high-density board encounters water during use, the water flow is absorbed by the center board and the water is absorbed by the polyethylene. The water absorption deformation rate of polyethylene is small, which reduces the possibility of large deformation of the high-density board after being damp and increases the practicality of the device.

[0040] 2. After the center board, outer frame board and outer panel board are manufactured, the three are pressed together to form a high-density board. After the pressing is completed, when the high-density board is cut, the excess acrylic adhesive on the side of the high-density board is scraped off, thereby reducing the impact of the excess acrylic adhesive on the appearance of the high-density board, thereby increasing the practicality of the high-density board. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 It is a schematic diagram of the high-density board structure of this application;

[0042] Figure 2 This is an exploded view of the high-density board structure of this application;

[0043] Figure 3 This is a schematic structural diagram of the multi-layer high-density board pressing device of the present application;

[0044] Figure 4 This is an exploded diagram of the structure of the multi-layer high-density board pressing device of the present application;

[0045] Figure 5 It is a schematic diagram of the structure of the carrier platform of this application;

[0046] Figure 6 This application Figure 5 Exploded view of the structure;

[0047] Figure 7 This application Figure 5 Stereoscopic cross-section of Chinese structures;

[0048] Figure 8 This application Figure 4 Enlarged view of point A in the middle;

[0049] Figure 9 It is a flow chart of the application method;

[0050] 1. Center plate; 2. Outer frame plate; 3. Outer panel; 4. Mounting shell; 401. Hydraulic rod; 402. Pressure plate; 403. Guide rail; 5. Supporting member; 501. Supporting platform; 502. Slider; 503. Threaded rod; 6. Limiting member; 601. Limiting hole group; 6011. Channel; 602. Limiting cylinder; 603. Connecting spring; 604. Limiting rod; 605. Connecting rod; 606. Groove; 7. Scraper; 701. Scraping block; 702. Shovel plate; 703. Hook plate; 704. Arc rod; 705. Accommodating groove; 706. Insert block; 707. Notch; 708. Resistance spring. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0052] like Figure 1 As shown, an embodiment of the present application provides a multi-layer environmentally friendly high-density board, comprising:

[0053] The center board 1 is made of polyethylene, acrylic adhesive, and wood chips. The weight proportions of the polyethylene, acrylic adhesive, and wood chips are as follows: 146 parts polyethylene, 154 parts wood chips, and 90 parts acrylic adhesive. Although the polyethylene material has low water absorption during use, it undergoes less deformation after absorbing water, thereby reducing the deformation of the high-density board when exposed to moisture, reducing the possibility of damage to the high-density board during use, and increasing the practicality of the high-density board.

[0054] The outer frame plate 2 is bonded to the center plate 1 by glue. The outer frame plate 2 is used to enclose the four sides of the center plate 1. When in use, the center plate 1 is wrapped by the outer frame plate 2. When in use, the outer frame plate 2 increases the stability of the high-density board. The possibility of deformation of the center plate 1 is further reduced by the restriction of the outer frame plate 2;

[0055] The outer panel 3 is bonded to the outer frame panel 2 by glue, and the outer panel 3 is connected to the center panel 1 by glue. The outer panel 3 is the outermost surface of the high-density board when in use, protecting the center panel 1 and increasing the practicality of the high-density board;

[0056] Compared with the existing technology, the center board 1 is mixed with polyethylene and wood chips to make the center board 1, and then the center board 1 is protected by the outer frame board 2 and the outer panel board 3. When the high-density board encounters water during use, the water flow is absorbed by the center board 1 and the water is absorbed by the polyethylene. The water absorption deformation rate of polyethylene is small, which reduces the possibility of the high-density board being deformed significantly after being damp and increases the practicality of the device.

[0057] like Figure 1 As shown, in some embodiments, the outer frame plate 2 is made of acrylic adhesive and wood chips, and the weight proportions of the wood chips and the acrylic adhesive are respectively: 160 parts of wood chips and 102 parts of acrylic adhesive. The acrylic adhesive is used as glue to mix the wood chips. When used, it increases the strength of the outer frame plate 2, and also makes the outermost side of the high-density board made of wood after it is formed, thereby improving the practicality and aesthetics of the high-density board.

[0058] like Figure 1 As shown, in some embodiments, the outer panel 3 is made of sawdust, paraffin wax and acrylic adhesive, and the weight proportions of sawdust, paraffin wax and acrylic adhesive are respectively: 103 parts sawdust, 40 parts paraffin wax and 76 parts acrylic adhesive. Paraffin wax is added to the outer panel 3 so that the paraffin forms an oil film on its surface, which reduces the possibility of water entering the center panel 1, further increases the waterproofness of the high-density board, and thereby reduces the possibility of deformation of the high-density board.

[0059] like Figure 9 As shown, the present application also provides a method for preparing a multi-layer environmentally friendly high-density board. In some embodiments, the method is used to prepare any of the multi-layer environmentally friendly high-density boards described above, comprising the following steps:

[0060] S1, prefabricating the center panel 1, soaking sawdust and polyethylene in water and drying them, then mixing them with an acrylic adhesive, and placing the mixed material into a mold to cool and shape;

[0061] S2, prefabricating the outer frame board 2, mixing wood chips with acrylic adhesive, placing the mixed material into a mold, cooling and shaping it, forming a first prefabricated board, and opening a frame in the middle of the first prefabricated board to accommodate the center board 1;

[0062] S3, prefabricating outer panel 3, mixing sawdust with acrylic adhesive, placing the mixed material into a mold to cool and shape, forming a second prefabricated panel, and polishing one side of the second prefabricated panel and applying paraffin wax;

[0063] S4, pre-assembly, apply acrylic adhesive around the center plate 1 and place it inside the outer frame plate 2 to connect the two;

[0064] S5. Lamination: Apply acrylic adhesive to both sides of the center panel 1 and the outer frame panel 2, and press the side of the outer panel 3 not coated with acrylic adhesive to the center panel 1. After lamination, scrape off the acrylic adhesive on the peripheral side of the formed high-density board;

[0065] Compared with the prior art, after the high-density board is processed, the excess acrylic adhesive squeezed out from the peripheral side of the high-density board is scraped off, thereby reducing the influence of the excess acrylic adhesive on the aesthetics of the high-density board.

[0066] like Figure 9 As shown, in some embodiments, in step S2, the center panel 1 is first placed on the first prefabricated panel, the position of the center panel 1 is marked on the first prefabricated panel with a pencil or other marking pen, the area of the frame to be opened is determined, and then the first prefabricated panel is cut with a reciprocating saw to form a frame thereon, so that the center panel 1 can be placed in the outer frame panel 2 during subsequent installation to connect the two.

[0067] like Figure 9 As shown, in some embodiments, in step S3, after the second prefabricated board is manufactured, the thickness of the second prefabricated board is cut by a planer or an electric planer, and then the second prefabricated board is polished and coated with paraffin. After the second prefabricated board is ground to a thinner thickness, the outer skin of the high-density board is formed. When in use, it serves as the outer skin of the appearance. Before coating the paraffin, anti-corrosion paint can also be coated to increase the practicality of the high-density board.

[0068] like Figure 3 As shown, in some embodiments, according to the above-mentioned method for preparing a multi-layer environmentally friendly high-density board, a multi-layer high-density board pressing device is used in step S5, which includes a mounting shell 4, on which a hydraulic rod 401 and a pressing plate 402 are mounted, and the pressing plate 402 is mounted on the telescopic end of the hydraulic rod 401. The hydraulic rod 401 pushes the pressing plate 402 to force the pressing plate 402 to press the center board 1, the outer frame board 2 and the outer panel 3, and further includes:

[0069] The bearing member 5 is used to support the center plate 1, the outer frame plate 2 and the outer panel 3. The bearing member 5 is slidably matched with the mounting shell 4. When the sub-assembly is in use, the center plate 1, the outer frame plate 2 and the outer panel 3 are supported by the bearing member 5. When the pressing plate 402 presses the three, the bearing member 5 provides support for the three.

[0070] The limiting member 6 is installed on the bearing member 5. The limiting member 6 is used to limit the position of the outer panel 3 on the bearing member 5. When in use, the center panel 1, the outer frame panel 2 and the outer panel 3 are placed on the limiting member 6 so that the three can be aligned when placed, thereby reducing the neatness of the side wall after the high-density board is pressed and formed, thereby increasing the aesthetics of the high-density board after forming;

[0071] The scraper 7 is installed between the limit member 6 and the supporting member 5. The scraper 7 is used to scrape the acrylic adhesive on the peripheral side of the high-density board. After the high-density board is pressed and formed, when the high-density board is cut, the scraper 7 cooperates with the scraper 7 to scrape off the excess acrylic adhesive, thereby increasing the aesthetics of the high-density board after forming.

[0072] like Figure 3 、 Figure 4and Figure 5 As shown, in some embodiments, a guide rail 403 is installed on the mounting shell 4, and the carrier 5 includes:

[0073] The carrying platform 501 is provided with a slider 502, which is slidably mounted in the guide rail 403. The carrying platform 501 is used to carry the center panel 1, the outer frame panel 2 and the outer panel 3. When the center panel 1, the outer frame panel 2 and the outer panel 3 need to be loaded, the carrying platform 501 is first pulled out of the mounting shell 4, the three are placed on the carrying platform 501, and the positions of the three are determined by the cooperation of the limiter 6. Then, the carrying platform 501 is slid back into the mounting shell 4 to facilitate the pressing plate 402 to press the three together to form a high-density board.

[0074] The threaded rod 503 is movably mounted on the slider 502, and the threaded rod 503 is threadedly matched with the mounting shell 4. When the supporting platform 501 is slid back into the mounting shell 4, the threaded rod 503 is connected and fixed to the mounting shell 4 by resisting and rotating the threaded rod 503, so that the supporting platform 501 is stable when the device is pressed, thereby improving the pressing effect of the high-density board.

[0075] like Figure 4 and Figure 6 As shown, in some embodiments, the limiting member 6 includes:

[0076] The limiting hole group 601 is provided on the carrier 501. The limiting hole group 601 includes a plurality of channels 6011. There are multiple limiting hole groups 601. The limiting hole groups 601 are arranged linearly along the width direction of the carrier 501 on the carrier 501. Each limiting hole group 601 includes at least four channels 6011, which are provided on the carrier 501 along the length direction of the carrier 501. The limiting hole group 601 and the channel 6011 are shaped as follows: Figure 5 As shown;

[0077] The limiting cylinder 602 is used to be inserted into the channel 6011. The number of limiting cylinders 602 is consistent with the number of channels 6011. The limiting rod 604 is installed in the limiting cylinder 602 through the connecting spring 603. When in use, the limiting rod 604 is used to contact the side wall of the high-density board. When the center board 1, the outer frame board 2 and the outer panel 3 are placed on the supporting platform 501, the multiple limiting rods 604 are divided into two groups and located on both sides of the high-density board to limit the position of the center board 1, the outer frame board 2 and the outer panel 3, increasing In order to ensure the neatness of the high-density board when being pressed, when the pressing plate 402 is pressed and held, the pressing plate 402 is pressed to the outer panel 3 and contacts, the positions of the three are restricted. At this time, there is no need to limit the high-density board by the limiting rod 604. The pressing plate 402 will press the limiting rod 604 into the limiting cylinder 602 to increase the activity of the pressing plate 402. When the pressing is completed, when the pressing plate 402 is reset, the connecting spring 603 is also reset, pushing the limiting rod 604 to reset, which is convenient for the next reset.

[0078] The connecting rod 605 is connected to the limiting rod 604. The connecting rod 605 is used to connect adjacent limiting rods 604. A groove 606 for accommodating the connecting rod 605 is provided on the supporting platform 501. The connecting rod 605 connects all the limiting rods 604, the connecting spring 603 and the limiting cylinder 602. When positioning is required, the connecting rod 605 can be used for unified insertion, which increases the convenience of the device.

[0079] Among them, the position of the limiting cylinder 602 can be changed through multiple limiting hole groups 601, and the distance between the limiting rods 604 can be changed, so that the device can limit high-density boards of different widths, thereby increasing the practicality of the device.

[0080] like Figure 6 、 Figure 7 and Figure 8 As shown, in some embodiments, the scraper 7 includes:

[0081] The scraping block 701 is mounted on the limiting rod 604 near the outside of the mounting shell 4. The side of the scraping block 701 near the high-density board is a rough surface. The scraping block 701 is used to scrape the side wall of the high-density board. When the high-density board is unloaded, the scraping block 701 is pulled. When the high-density board passes through the scraping block 701, the rough surface of the scraping block 701 scrapes the side wall of the high-density board to remove excess acrylic adhesive, thereby reducing the possibility of acrylic adhesive residue on the high-density board.

[0082] The scraper plate 702 is slidably mounted on the carrier 501. A resistance spring 708 is installed between the scraper plate 702 and the carrier 501. The scraper plate 702 is used to scrape the side wall of the high-density board. The position of the scraper plate 702 is perpendicular to the position of the scraper block 701, so that when the scraper plate 702 slides, the other two sides of the high-density board are scraped. When in use, when the pressing plate 402 is pressed, the pressing plate 402 presses the scraper plate 702, so that the resistance spring 708 is compressed. When the pressing plate 402 is reset, the pressure on the scraper plate 702 is released, and the resistance spring 708 pushes the scraper plate 702 to reset, so that the scraper plate 702 scrapes the side wall of the high-density board, further reducing the residual acrylic adhesive on the side wall of the high-density board and increasing the practicality of the device.

[0083] The hook plate 703 is mounted on the shovel plate 702. The supporting platform 501 is provided with an arc rod 704. When the arc rod 704 is rotated to connect with the hook plate 703, the sliding of the shovel plate 702 is restricted. Figure 6 As shown, when unloading, the shovel plate 702 is pressed down. When the hook plate 703 falls to the arc rod 704, the arc rod 704 is rotated so that it is stuck in the hook plate 703, so that the sliding of the shovel plate 702 is restricted, which facilitates unloading of high-density boards and increases the practicality of the device.

[0084] The receiving groove 705 is provided on the supporting platform 501. The receiving groove 705 is provided with an insert 706. The arc rod 704 is movably matched with the receiving groove 705. The arc rod 704 can slide and rotate in the receiving groove 705. The arc rod 704 is provided with a notch 707 connected to the insert 706. When the notch 707 is connected to the insert 706, the rotation of the arc rod 704 is restricted. In normal state, the arc rod 704 is rotated so that the end of the arc rod 704 in contact with the hook plate 703 is away from the hook plate 70 3. When the shovel plate 702 slides down, the hook plate 703 will not be blocked by the arc rod 704. When it is necessary to unload the material, the hook plate 703 is pressed down. First, the arc rod 704 is rotated to connect the arc rod 704 with the hook plate 703. Then, the arc rod 704 is slid into the receiving groove 705 to connect the notch 707 on the arc rod 704 with the insert block 706. This limits the rotation of the arc rod 704, increases the stability of the arc rod 704 during use, and improves the practicality of the device.

[0085] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present application. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application is not limited to the embodiments shown herein, but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for preparing a multi-layer environmentally friendly high-density board, the multi-layer environmentally friendly high-density board comprising: A center board made of polyethylene, an acrylic adhesive, and wood chips, wherein the weight ratios of the polyethylene, the acrylic adhesive, and the wood chips are as follows: 146 parts polyethylene, 154 parts wood chips, and 90 parts acrylic adhesive; The outer frame plate is bonded to the center plate with glue and is used to enclose the four sides of the center plate; The outer panel is bonded to the outer frame panel by glue, and the outer panel is connected to the center panel by glue; It is characterized in that it includes the following steps: S1, prefabricate the center board, soak wood chips and polyethylene in water and dry them, then mix them with acrylic adhesive, and place the mixed materials into a mold to cool and shape; S2, prefabricating the outer frame board, mixing wood chips with acrylic adhesive, placing the mixed material into a mold, cooling and shaping it, forming a first prefabricated board, and opening a frame in the middle of the first prefabricated board to accommodate the center board; S3, prefabricating the outer panel, mixing sawdust with acrylic adhesive, placing the mixed material into a mold to cool and shape it to form a second prefabricated panel, and polishing one side of the second prefabricated panel and applying paraffin wax; S4, pre-assembly, apply acrylic adhesive to the periphery of the center panel and place it inside the outer frame panel to connect the two; S5. Lamination: Apply acrylic adhesive to both sides of the center panel and the outer frame panel, and press the side of the outer panel not coated with acrylic adhesive to the center panel. After lamination, scrape off the acrylic adhesive on the peripheral side of the formed high-density board; In step S5, a multi-layer high-density board pressing device is used, which includes a mounting shell, a hydraulic rod and a pressing plate mounted on the mounting shell, and the pressing plate is mounted on the telescopic end of the hydraulic rod, and further includes: A bearing member, which is used to bear the center plate, the outer frame plate and the outer panel, and the bearing member is in sliding cooperation with the mounting shell; A limiting member is installed on the bearing member, and is used to limit the position of the outer panel on the bearing member; A scraper is installed between the limiting member and the bearing member, and is used to scrape the acrylic adhesive on the peripheral side of the high-density board; The scraper includes: The scraper block is mounted on the limiting rod near the outside of the mounting shell. The side of the scraper block close to the high-density board is a rough surface. The scraper block is used to scrape the side wall of the high-density board. When the high-density board is unloaded, the scraper block is pulled. When the high-density board passes the scraper block, the rough surface of the scraper block scrapes the side wall of the high-density board to remove excess acrylic adhesive. The shovel plate is slidably mounted on the supporting platform, and a resistance spring is installed between the shovel plate and the supporting platform. The shovel plate is used to scrape the side wall of the high-density board. The position of the shovel plate is perpendicular to the position of the scraping block, so that when the shovel plate slides, the other two sides of the high-density board are scraped. During use, when the pressure plate is pressed, the pressure plate presses the shovel plate, so that the resistance spring is compressed. When the pressure plate is reset, the pressure on the shovel plate is released, and the resistance spring pushes the shovel plate to reset, so that the shovel plate scrapes the side wall of the high-density board.

2. The method for preparing a multi-layer environmentally friendly high-density board according to claim 1, characterized in that: The outer frame plate is made of acrylic adhesive and wood chips, and the weight proportions of the wood chips and the acrylic adhesive are respectively: 160 parts of wood chips and 102 parts of acrylic adhesive.

3. The method for preparing a multi-layer environmentally friendly high-density board according to claim 1, characterized in that: The outer panel is made of sawdust, paraffin wax and acrylic adhesive, and the weight proportions of sawdust, paraffin wax and acrylic adhesive are respectively: sawdust is 103 parts, paraffin wax is 40 parts and acrylic adhesive is 76 parts.

4. The method for preparing a multi-layer environmentally friendly high-density board according to claim 1, characterized in that: In step S2, the center board is first placed on the first prefabricated board, the area for opening the frame is determined, and then the first prefabricated board is cut by a reciprocating saw to form a frame thereon.

5. The method for preparing a multi-layer environmentally friendly high-density board according to claim 4, characterized in that: In step S3, after the second prefabricated board is manufactured, the thickness of the second prefabricated board is cut by a planer or an electric planer, and then the second prefabricated board is polished and coated with paraffin.

6. The method for preparing a multi-layer environmentally friendly high-density board according to claim 1, characterized in that: A guide rail is installed on the mounting shell, and the bearing member includes: A bearing platform is provided with a slider which is slidably mounted in a guide rail. The bearing platform is used to carry the center plate, outer frame plate and outer panel. The threaded rod is movably mounted on the slider, and the threaded rod is matched with the thread of the mounting shell.

7. The method for preparing a multi-layer environmentally friendly high-density board according to claim 6, characterized in that: The limiting member includes: A limiting hole group is provided on the bearing platform, the limiting hole group includes a plurality of holes, there are multiple limiting hole groups, and the limiting hole groups are linearly arrayed on the bearing platform along the width direction of the bearing platform; A limiting cylinder is used to be inserted into the hole. The number of limiting cylinders is the same as the number of holes. A limiting rod is installed in the limiting cylinder through a connecting spring; The connecting rod is connected to the limiting rod, and the connecting rod is used to connect adjacent limiting rods. The bearing platform is provided with a groove for accommodating the connecting rod.

8. The method for preparing a multi-layer environmentally friendly high-density board according to claim 7, characterized in that: The scraping member comprises: A scraping block is mounted on a limiting rod close to the outside of the mounting shell, wherein the side of the scraping block close to the high-density board is a rough surface, and the scraping block is used to scrape the side wall of the high-density board; A shovel plate is slidably mounted on the bearing platform, with a resisting spring installed between the shovel plate and the bearing platform, and the shovel plate is used to scrape the side wall of the high-density board; The hook plate is mounted on the shovel plate, and an arc rod is movably mounted on the bearing platform. When the arc rod is rotated to connect with the hook plate, the sliding of the shovel plate is restricted; The receiving groove is provided on the supporting platform, an insert block is installed in the receiving groove, the arc rod is movably matched with the receiving groove, and a notch connected to the insert block is provided on the arc rod. When the notch is connected to the insert block, the rotation of the arc rod is restricted.

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